Liquid spray head

By forming a multi-layer electrode structure on the surface and back of the substrate of the liquid nozzle, the problems of high common electrode resistance and electrode corrosion are solved, realizing a low-resistance and corrosion-resistant electrode design, and improving the reliability and lifespan of the liquid nozzle.

CN117445552BActive Publication Date: 2026-05-26IDEAL SCI & TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
IDEAL SCI & TECH CO LTD
Filing Date
2023-04-20
Publication Date
2026-05-26

AI Technical Summary

Technical Problem

In liquid nozzles with independent drive structures, the common electrode has a high resistance, which may cause the driver IC to lock up and be damaged. In addition, the head substrate generates a lot of heat, and the electrode may corrode when the temperature regulation channel is required.

Method used

A multilayer electrode structure, including individual electrodes and a common electrode, is formed on the surface and back of the substrate. By forming low-resistance multilayer electrode films on the surface and back of the substrate respectively, electrode corrosion is avoided and the resistance of the common electrode is reduced.

Benefits of technology

This effectively reduces the resistance of the common electrode, prevents damage to the driver IC, reduces heat generation on the head substrate, avoids electrode corrosion, and improves the reliability and lifespan of the liquid spray head.

✦ Generated by Eureka AI based on patent content.

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Abstract

This invention provides a liquid nozzle capable of reducing the resistance of a common electrode. The liquid nozzle of this embodiment includes a substrate, a manifold, an actuator, and an electrode portion. An opening for liquid to pass through is formed on the substrate. The manifold has a first flow channel for fluid used for temperature regulation to flow through. The actuator is disposed on a main surface of one side of the substrate and has multiple pressure chambers. The electrode portion is disposed on the other side of the substrate and is formed on the surface of the actuator, the main surface of one side of the substrate, the inner wall of the opening, and the main surface of the other side of the substrate in a region different from the first flow channel.
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Description

Technical Field

[0001] Embodiments of the present invention relate to a liquid spray head. Background Technology

[0002] As a liquid ejection head, there is a known liquid ejection head equipped with an actuator that forms multiple partitions at predetermined intervals and a pressure chamber between each partition. Also known as a liquid ejection head is a liquid ejection head that uses an independent drive structure having a pressure chamber from which liquid is ejected from the nozzle and an air chamber from which liquid is not ejected, in order to increase the ejection velocity of the liquid.

[0003] In liquid nozzles with independent drive structures, some nozzles lead the electrodes of the pressure chamber to the driver IC side, and bundle the electrodes of the air chamber in the center of the substrate to form a common electrode.

[0004] In such a liquid ejection head, if the common electrode resistance is high, the driver IC may be damaged due to lock-up. Therefore, it is preferable to have a low resistance common electrode. In addition, the head substrate heats up significantly when the ink ejection speed is increased. Therefore, it is sometimes necessary to provide a flow channel for temperature regulation. However, if an electrode film is formed on the back of the substrate to reduce the resistance of the common electrode, and the electrode on the back of the substrate is energized with the flow channel for temperature regulation in a liquid-contact state, the electrode will be corroded by electrolysis. Summary of the Invention

[0005] The problem this invention aims to solve is to provide a liquid spray head that can reduce the resistance of the common electrode.

[0006] The liquid nozzle of this embodiment includes a substrate, a manifold, an actuator, and an electrode section. An opening for liquid to pass through is formed on the substrate. The manifold has a first flow channel for fluid used for temperature regulation. The actuator is disposed on a main surface of one side of the substrate and has multiple pressure chambers. The electrode section is disposed on the other side of the substrate and is formed on the surface of the actuator, the main surface of one side of the substrate, the inner wall of the opening, and the main surface of the other side of the substrate in a region different from the first flow channel. Attached Figure Description

[0007] Figure 1 This is a perspective view showing the configuration of the liquid spray head according to the first embodiment.

[0008] Figure 2 This is a bottom view showing the configuration of the liquid spray head according to the first embodiment.

[0009] Figure 3 This is an exploded perspective view showing the configuration of the liquid spray head according to the first embodiment.

[0010] Figure 4This is a cross-sectional view showing the structure of the head body according to the first embodiment.

[0011] Figure 5 This is a front view showing the configuration of the head body according to the first embodiment.

[0012] Figure 6 This is a cross-sectional view showing the partial configuration of the head body according to the first embodiment.

[0013] Figure 7 This is a front view showing the partial configuration of the head body according to the first embodiment.

[0014] Figure 8 This is a bottom view showing the partial configuration of the head body according to the first embodiment.

[0015] Figure 9 A cross-sectional view showing a portion of the head body according to the first embodiment is shown.

[0016] Figure 10 This is a cross-sectional view showing the partial configuration of the head body according to the first embodiment.

[0017] Figure 11 This is a cross-sectional view showing the partial configuration of the head body according to the first embodiment.

[0018] Figure 12 This is an explanatory diagram showing a method for manufacturing a liquid spray head according to the first embodiment.

[0019] Figure 13 This is an explanatory diagram showing the configuration of the liquid spraying device according to the embodiment.

[0020] Symbol Explanation

[0021] 1…Liquid printhead (inkjet head), 2…Liquid print assembly (inkjet recording device), 11…Head body, 12…Manifold unit, 13…Cooling channel unit, 14…Circuit board, 15…Cover, 111…Board, 112…Frame, 113…Actuator, 114…Printhead plate, 115…Surface, 116…Common liquid chamber, 117…Back side, 118…Individual electrode, 1181…First electrode section, 1182…Second electrode section, 1183…Third electrode section, 119…Common electrode, 1191… First electrode section, 1192…Second electrode section, 1193…Third electrode section, 1194…Fourth electrode section, 1195…Fifth electrode section, 121…Manifold, 1213…First cooling channel, 122…Top plate, 123…Ink supply pipe, 124…Ink discharge pipe, 125…Cooling water supply pipe, 126…Cooling water discharge pipe, 142…Driver IC, 143…Printed circuit board, 151…Outer contour, 1111…Inlet, 1112…Outlet, 1131…Pressure chamber, 1132… …Air chamber, 1133…Piezoelectric element (driving element), 1134…Sloping surface, 1135…Liquid-proof wall, 1141…Nozzle, 1142…Nozzle array, 1161…First common liquid chamber, 1162…Second common liquid chamber, 1211…Supply channel, 1312…Second cooling channel, 133…Second cooling water supply pipe, 134…Second cooling water discharge pipe, 2001…Transport path, 2111…Housing, 2112…Media supply section, 2113…Image forming section, 2114…Media discharge section, 2 115… Conveying device, 2116… Cooling device, 2117… Maintenance device, 2118… Control unit, 2120… Support unit, 2130… Head unit, 2132… Supply trough, 2134… Pump, 2135… Connecting flow channel, 21121… Paper tray, 21141… Paper discharge tray, 21181… CPU, 21201… Conveyor belt, 21202… Support plate, 21203… Belt roller, 21211~21218… Guide plate pair, 21221~21228… Conveyor roller, P… Paper. Detailed Implementation

[0022] The following is for reference. Figures 1 to 11 The liquid ejection head 1 and the liquid ejection device 2 using the liquid ejection head 1 according to the first embodiment will be described. Figure 1 This is a perspective view showing the configuration of the liquid spray head 1 according to the first embodiment. Figure 2 This is a bottom view showing the configuration of the liquid nozzle 1. Figure 3 This is an exploded perspective view of liquid nozzle 1. Figure 4 This is a cross-sectional view showing the structure of the head body 11. Figure 5 This is a bottom view of the liquid spray nozzle. Figure 6 It is a cross-sectional view showing a portion of the head body. Figure 7 This is a bottom view showing the configuration of the liquid spray head 1 with the nozzle plate 114 omitted. Figure 8 This is a front view showing the configuration of the back side of the substrate. Figures 9 to 11 This is a cross-sectional view showing a portion of the head body 11 of the liquid nozzle 1. In the figure, X, Y, and Z represent three mutually orthogonal directions. It should be noted that in each figure, for illustrative purposes, the configuration will be appropriately enlarged, reduced, or omitted.

[0023] Liquid nozzle 1 is, for example, located at Figure 13 The inkjet head shown is a shared type of inkjet head for liquid ejection devices 2, such as inkjet recording devices. The liquid ejection head 1 is, for example, an independently driven structure that alternately includes a pressure chamber 1131 and an air chamber 1132. The liquid ejection head 1 is provided in a head unit 2130, which includes a supply tank 2132 as a liquid receiving section provided in the liquid ejection device 2.

[0024] Ink, which is stored as liquid in the supply tank 2132, is supplied to the liquid nozzle 1. It should be noted that the liquid nozzle 1 can be a non-circulating nozzle that does not circulate the ink, or it can be a circulating nozzle that circulates the ink. In this embodiment, an example using a non-circulating nozzle 1 will be described. Furthermore, the liquid nozzle 1 is connected to a cooling device 2116 provided in the liquid dispensing apparatus 2, and a cooling liquid (cooling water) is supplied to the liquid nozzle 1 to control the temperature of the heating element and the ink. The liquid nozzle 1 and the cooling device 2116 together constitute a water-cooled circulation structure.

[0025] like Figures 1 to 11 As shown, the liquid nozzle 1 includes a head body 11, a manifold unit 12, a cooling channel unit 13, a circuit board 14, and a cover 15. For example, the liquid nozzle 1 is a side-spraying type four-row integrated structure head, which has two sets of head bodies 11 each with a pair of actuators 113.

[0026] The head body 11 sprays liquid. The head body 11 includes a base plate 111, a frame 112, an actuator 113 having multiple pressure chambers 1131 and multiple air chambers 1132, and a nozzle plate 114.

[0027] The head body 11 has a common liquid chamber 116 that communicates with the plurality of pressure chambers 1131 of the actuator 113. The primary side of the plurality of pressure chambers 1131 refers to the upstream side of the plurality of pressure chambers 1131 in the liquid flow direction. The secondary side of the plurality of pressure chambers 1131 refers to the downstream side of the plurality of pressure chambers 1131 in the liquid flow direction.

[0028] In addition, the head body 11 has an electrode portion consisting of an electrode film formed on the substrate 111 and the actuator 113. Specifically, as the electrode portion, the head body 11 has a plurality of individual electrodes 118 that drive a plurality of pressure chambers 1131 of the actuator 113 respectively, and a single or a plurality of common electrodes 119 that drive a plurality of pressure chambers 1131 simultaneously.

[0029] In this embodiment, an example is described using a head body 11 having two actuators 113, and a common liquid chamber 116 having one first common liquid chamber 1161 and two second common liquid chambers 1162. The common liquid chamber 116, for example, has a first common liquid chamber 1161 communicating with an opening on the primary side (inlet of the pressure chamber 1131) of the plurality of pressure chambers 1131 of the actuator 113, and a second common liquid chamber 1162 communicating with an opening on the secondary side (outlet of the pressure chamber 1131) of the plurality of pressure chambers 1131 of the actuator 113.

[0030] The substrate 111 is formed into a rectangular plate shape from a ceramic material such as alumina. The substrate 111 has a surface 115 that forms a grinding surface as one main surface and a back surface 117 that forms another main surface. The substrate 111 is formed as a rectangle that is elongated in one direction (X direction). On the surface 115, which is one side of the substrate 111 and forms the grinding surface, a third electrode portion 1183 is formed as part of a plurality of individual electrodes 118, and a third electrode portion 1193 is formed as part of a single common electrode 119. On the surface 115 of the substrate 111, a pair of actuators 113 are arranged side-by-side along the width direction (Y direction) of the substrate 111. The substrate 111 has a single supply port 1111 that serves as an opening for liquid to pass through and a plurality of discharge ports 1112. The supply port 1111 and the discharge ports 1112 are through holes penetrating between the two main surfaces of the substrate 111.

[0031] It should be noted that the back side of the substrate 111 faces the manifold 121 and covers the groove formed on the opposing surface of the manifold 121, which constitutes the first cooling channel 1213 for cooling water to flow through. That is, the substrate 111 and the manifold 121 together form the first cooling channel 1213. Therefore, a portion of the back side of the substrate 111 forms a liquid-contacting region RA that comes into contact with the cooling water. The liquid-contacting region RA refers to, for example, the region along the length direction of the actuator 113 in the outer side of the side opposite to the central side where the supply port 1111 is formed.

[0032] The supply port 1111 is the inlet for supplying ink to the first common liquid chamber 1161. The supply port 1111 is a through-hole formed at the center of the width direction of the substrate 111. The supply port 1111 extends along the length direction of the substrate 111. In other words, the supply port 1111 is, for example, an elongated hole that is longer in one direction along both the length direction of the actuator 113 and the length direction of the first common liquid chamber 1161. The supply port 1111 is located between a pair of actuators 113 and opens to a position opposite to the first common liquid chamber 1161.

[0033] A fourth electrode portion 1194, which is part of the common electrode 119, is formed on the inner wall surface of the supply port 1111.

[0034] The discharge port 1112 is an outlet for discharging ink from the first common liquid chamber 1161, the pressure chamber 1131, and the second common liquid chamber 1162. Multiple discharge ports 1112 are provided, for example, four. Each discharge port 1112 is located, for example, between the first common liquid chamber 1161 and each of the second common liquid chambers 1162, and is adjacent to two ends in the longitudinal direction of a pair of actuators 113. It should be noted that multiple discharge ports 1112 may also be provided in the second common liquid chamber 1162.

[0035] An actuator 113 and a frame 112 are disposed on a substrate 111. The inner side of the frame 112 on the substrate 111 forms a liquid receiving area for applying ink, and the outer side of the frame 112 forms a mounting area for connecting various electronic components.

[0036] The frame 112 is fixed to a main surface of the substrate 111 by an adhesive or the like. The frame 112 includes a supply port 1111, a plurality of discharge ports 1112 and an actuator 113 provided on the substrate 111.

[0037] For example, by forming the frame 112 into a rectangular frame shape, an opening that is longer in one direction is formed along the length of the frame 112. The frame 112 may have a stepped structure with a portion of its surface recessed. A pair of actuators 113, a supply port 1111, and four discharge ports 1112 are disposed on the opening of the frame 112. The frame 112 surrounds the actuators 113 between the nozzle plate 114 and the base plate 111 and is configured to retain liquid inside.

[0038] A pair of actuators 113 are bonded to the surface 115 of the substrate 111. The pair of actuators 113 are arranged in two rows on the substrate 111, sandwiching the supply port 1111. The actuators 113 are formed as plates that are longer in one direction. The actuators 113 are disposed in the opening of the frame 112 and bonded to the surface 115 of the substrate 111.

[0039] The actuator 113 has a plurality of pressure chambers 1131 arranged at equal intervals along the length direction on its central side, and air chambers 1132 arranged at equal intervals along the length direction and disposed between adjacent pressure chambers 1131. In other words, the actuator 113 has a plurality of pressure chambers 1131 and air chambers 1132 alternately arranged along the length direction. The plurality of pressure chambers 1131 and the plurality of air chambers 1132 extend in a direction intersecting the arrangement direction, for example, along the width direction of the actuator 113.

[0040] The top surface of the actuator 113, opposite to the substrate 111, is bonded to the nozzle plate 114. Multiple grooves are formed on the actuator 113, arranged at equal intervals along the length direction and perpendicular to the length direction. These grooves form multiple pressure chambers 1131 and multiple air chambers 1132. In other words, the actuator 113 has multiple piezoelectric elements 1133 arranged at equal intervals along the length direction, which serve as driving elements, and these piezoelectric elements 1133 form walls between the grooves. Multiple pressure chambers 1131 and multiple air chambers 1132 are formed between adjacent piezoelectric elements 1133, and the volume of the pressure chambers 1131 is changed by applying a driving voltage.

[0041] In actuator 113, for example, the width in the width direction gradually increases from the top side toward the substrate 111 side. The cross-sectional shape of actuator 113 in the direction orthogonal to the length direction (width direction) is formed as a trapezoid. That is, actuator 113 has a slope 1134 that is inclined toward the side portion in the width direction. The side portion (slope 1134) is disposed opposite to the first common liquid chamber 1161 and the second common liquid chamber 1162. On the slope 1134, a second electrode portion 1182 as part of a plurality of individual electrodes 118 and a second electrode portion 1192 as part of a single or multiple common electrodes 119 are formed.

[0042] As a specific example, the actuator 113 is formed by a stacked piezoelectric component, which is formed by bonding two rectangular piezoelectric materials that are longer in one direction to each other in opposite polarization directions. The piezoelectric material is, for example, PZT (lead zirconate titanate). The actuator 113 is bonded to the surface 115 of the substrate 111 using, for example, a thermosetting epoxy adhesive. Furthermore, the actuator 113 has a bevel 1134 formed by, for example, machining. In addition, in the substrate 111 and the actuator 113, for example, the surface 115 for patterning multiple individual electrodes 118 and a common electrode 119 is ground to form a polished surface by grinding. Furthermore, in the actuator 113, for example, multiple grooves for forming multiple pressure chambers 1131 and multiple air chambers 1132 are formed by machining, and a piezoelectric element (driving element) 1133 is formed as a sidewall separating adjacent grooves from each other.

[0043] Additionally, the actuator 113 forms a first electrode portion 1181 and a second electrode portion 1182 as part of a plurality of individual electrodes 118, and a first electrode portion 1191 and a second electrode portion 1192 as part of a single or a plurality of common electrodes 119.

[0044] The pressure chamber 1131 deforms during printing or other operations of the liquid ejector head 1, causing ink to be ejected from the printhead 1141. The inlet of the pressure chamber 1131 opens into the first common liquid chamber 1161, and the outlet opens into the second common liquid chamber 1162. In the pressure chamber 1131, ink flows in from the inlet and out from the outlet. It should be noted that the pressure chamber 1131 can also be configured such that ink flows in from both openings described as the inlet and outlet. Within the recesses constituting the pressure chamber 1131, first electrode portions 1181 are formed as part of a plurality of individual electrodes 118.

[0045] like Figure 9 As shown, the inlet and outlet sides of the air chamber 1132 are sealed by a liquid-proof wall 1135 formed of photosensitive resin or the like, thereby separating the air chamber 1132 from the first common liquid chamber 1161 and the second common liquid chamber 1162. A first electrode portion 1191, as part of one or more common electrodes 119, is formed within the air chamber 1132. Specifically, the liquid-proof wall 1135 of the air chamber 1132 is formed by pouring ultraviolet-curable resin into the groove forming the air chamber 1132 onto the first electrode portion 1191, and then irradiating the exposed area, such as the inlet and outlet sides of the groove, with ultraviolet light. This liquid-proof wall 1135 prevents ink from entering the air chamber 1132. Furthermore, the air chamber 1132 is sealed by the printhead plate 114, and no printhead 1141 is provided. Therefore, ink will not flow into the air chamber 1132.

[0046] The nozzle plate 114 is formed in a plate shape. The nozzle plate 114 is fixed to the main surface of the frame 112 on the side opposite to the base plate 111 by adhesive or the like. The nozzle plate 114 has a plurality of nozzles 1141 formed at positions opposite to the plurality of pressure chambers 1131. In this embodiment, the nozzle plate 114 has two rows of nozzles 1142, wherein the plurality of nozzles 1141 are arranged in one direction.

[0047] A first common liquid chamber 1161 is formed between the central sides of a pair of actuators 113, excluding the two ends, and constitutes an ink flow channel from the supply port 1111 to the primary side of the plurality of pressure chambers 1131 of each actuator 113. The first common liquid chamber 1161 extends along the length direction of the actuator 113. The first common liquid chamber 1161 constitutes part of the ink flow channel as a second flow channel.

[0048] Second common liquid chambers 1162 are formed between each actuator 113 and the frame 112. The second common liquid chambers 1162 form ink flow channels from the secondary side openings (outlets) of the plurality of pressure chambers 1131 to the discharge outlet 1112. The second common liquid chambers 1162 extend along the length of the actuator 113. The second common liquid chambers 1162 constitute part of the ink flow channel, which is a second flow channel.

[0049] Multiple individual electrodes 118 individually apply a driving voltage to multiple piezoelectric elements 1133, which are piezoelectric elements. Each individual electrode 118 individually deforms a pressure chamber 1131. The individual electrodes 118 are formed by wiring patterns formed on a substrate 111 and wiring patterns formed on an actuator 113. The multiple individual electrodes 118 extend from the multiple pressure chambers 1131 along the width direction of the actuator 113 and are led to regions outside a pair of actuators 113.

[0050] As a specific example, such as Figures 7 to 11 As shown, multiple individual electrodes 118 are formed on the inner surface of each pressure chamber 1131, the inclined surface 1134 of the actuator 113, and the substrate 111. Specifically, the individual electrodes 118 are formed on the inner surface of the piezoelectric body 1133 forming the pressure chamber 1131 and the bottom surface of the pressure chamber 1131. In addition, the individual electrodes 118 are formed on, for example, a portion of the inclined surface 1134 and the surface 115 of the substrate 111. The individual electrodes 118 extend from the pressure chamber 1131 toward the end in the width direction of the substrate 111, and are disposed on the connection portion 1116 for connection to the circuit board 14 of the substrate 111. That is, each individual electrode 118 has a first electrode portion 1181 formed in the groove of the pressure chamber 1131 constituting the actuator 113, a second electrode portion 1182 formed on the inclined surface 1134 of the actuator 113, and a third electrode portion 1183 formed on the surface 115 of the substrate 111. Individual electrode 118 is attached to the bottom of pressure chamber 1131 and the surface of the piezoelectric component forming piezoelectric body 1133. Individual electrode 118 is formed by laminating, for example, a Ni sputtered film 191, a chemically plated Ni film 192, and an electroplated Au film 193. The thickness of individual electrode 118 is, for example, 0.5 μm to 5 μm.

[0051] Specifically, the first electrode portion 1181, the second electrode portion 1182, and the third electrode portion 1183 are composed of a three-layer stacked structure consisting of a Ni sputtered film 191, a chemically plated Ni film 192, and an electroplated Au film 193. It should be noted that individual electrodes 118 may also be partially without an electroplated Au film 193. For example, the first electrode portion 1181 inside the groove forming the pressure chamber 1131 of the actuator 113 can be a two-layer structure consisting of a Ni sputtered film 191 and a chemically plated Ni film 192.

[0052] The common electrode 119 applies the same driving voltage to all of the multiple piezoelectric elements 1133. The common electrode 119 causes the multiple pressure chambers 1131 to deform simultaneously. The common electrode 119 is formed by wiring patterns formed on the substrate 111 and the actuator 113. The common electrode 119 is a wiring pattern provided on the entire area from the inner peripheral surface of the supply port 1111 of the substrate 111 to the piezoelectric elements 1133 forming the multiple air chambers 1132. The common electrode 119 is connected to the circuit board 14. The common electrode 119 extends from the air chambers 1132 to the central region between the pair of actuators 113. That is, the electrodes of the multiple air chambers 1132 are connected as a whole on the central side of the substrate, thereby forming the common electrode 119.

[0053] As a specific example, the common electrode 119 is formed on the inner surface of each air chamber 1132, the inclined surface 1134 of the actuator 113, the area of ​​the surface 115 on the substrate 111 that avoids the individual electrode 118, the back surface of the substrate 111, and the inner surface of the supply port 1111. That is, the common electrode 119 is formed on the side surface of the piezoelectric body 1133 forming each air chamber 1132, and as part of the piezoelectric member constituting the bottom of the air chamber 1132. As a specific example, the common electrode 119 is disposed on the inclined surface 1134 from inside each air chamber 1132 toward the center of the substrate 111, and is also formed on the surface 115 of the substrate 111 between the pair of actuators 113 and the inner peripheral surface of the supply port 1111. In addition, the common electrode 119 is also formed on the back surface 117 of the main surface of the substrate 111, which is the side opposite to the surface 115. For example, the common electrode 119 extends to the end in the width direction of the substrate 111, and the end is disposed on the connection portion 1116 for connecting the circuit board 14 of the substrate 111.

[0054] In other words, the common electrode 119 extends from the connection portion 1116 formed at the end of the substrate 111 in the width direction to the central side of the substrate 111 in the width direction, which is the portion between the pair of actuators 113. Furthermore, a portion of the common electrode 119, located at the central side of the substrate 111 in the width direction, extends along the thickness direction of the substrate 111 from the inner peripheral surface of the supply port 1111 at the central side of the substrate 111 in the width direction. Additionally, a portion of the common electrode 119 extends from the central side of the substrate 111 in the width direction to the surface of the piezoelectric member forming each air chamber 1132. Furthermore, a portion of the common electrode 119 is located on the back surface 117 of the substrate 111.

[0055] That is, the common electrode 119 has a first electrode portion 1191 formed in a groove in the air chamber 1132 constituting the actuator 113, a second electrode portion 1192 formed in the inclined surface 1134 of the actuator 113, a third electrode portion 1193 formed in the surface 115 of the substrate 111, a fourth electrode portion 1194 formed in the inner peripheral surface of the supply port 1111, and a fifth electrode portion 1195 formed in the back surface 117 of the substrate 111. Each electrode portion 1191 to 1195 of the common electrode 119 is formed away from the individual electrode 118. Each electrode portion 1191 to 1195 of the common electrode 119 may be partially formed on the surface of the substrate 111 and the actuator 113.

[0056] For example, the fifth electrode portion 1195 is formed at a different position on the back side of the substrate 111 than the first cooling channel 1213 through which cooling water, used as a fluid for temperature regulation, flows. That is, the fifth electrode portion 1195 is formed on the back side of the substrate 111, avoiding the liquid-receiving region RA that opposes the groove forming the first cooling channel 1213. For example, the fifth electrode portion 1195 is formed between a pair of actuators 113, comprising only a supply port 1111 and extending along the length of the actuator 113, and a pair of end regions RC connected to the two ends of the central region RB, closer to the two ends of the substrate 111 in the length direction than the supply port 1111, and including a discharge port 1112. The fifth electrode portion 1195 is positioned at a predetermined distance closer to the central side than the two rows of liquid-receiving regions RA formed between the supply ports 1111.

[0057] In the common electrode 119, the third electrode portion 1193 on the surface 115 of the substrate 111 and the fifth electrode portion 1195 on the back surface 117 are connected by a fourth electrode portion 1194 within the supply port 1111. It should be noted that the common electrode 119 may also extend along the length direction of the surface 115 of the substrate 111 and penetrate the end face of the substrate 111 in the length direction to connect with the back surface.

[0058] A common electrode 119 is tightly disposed at the bottom of the air chamber 1132 and on the surface of the piezoelectric component forming the piezoelectric body 1133. The common electrode 119 is a multilayer structure formed by, for example, stacking a Ni sputtered film 191, a chemically plated Ni film 192, and an electroplated Au film 193. For example, the surface of the electrode film constituting the common electrode 119 is a three-layer stacked structure of Ni sputtered film 191, chemically plated Ni film 192, and electroplated Au film 193, while the back side is a two-layer stacked structure of Ni sputtered film 191 and electroplated Au film 193.

[0059] Specifically, the first electrode portion 1191, the second electrode portion 1192, and the third electrode portion 1193 are a three-layer stacked structure consisting of a Ni sputtered film 191, a chemically plated Ni film 192, and an electroplated Au film 193. It should be noted that in the common electrode 119, for example, the first electrode portion 1191 inside the groove can also be a two-layer structure consisting of a Ni sputtered film 191 and a chemically plated Ni film 192.

[0060] On the other hand, the fourth electrode portion 1194 and the fifth electrode portion 1195 are a double-layer stacked structure of Ni sputtered film 191 and electroplated Au film 193.

[0061] The thickness of the common electrode 119 is, for example, 0.5 μm to 5 μm. It should be noted that the thickness of the common electrode 119 is configured to be greater than the thickness of the individual electrode 118. Furthermore, the common electrode 119 is configured to have a lower resistance than the individual electrode 118. In other words, the thickness of the individual electrode 118 is configured to be less than the thickness of the common electrode 119. Additionally, the resistance of the individual electrode 118 is higher than that of the common electrode 119.

[0062] like Figure 1 , Figure 3 and Figure 4 As shown, the manifold unit 12 includes a manifold 121, a top plate 122, an ink supply pipe 123, an ink discharge pipe 124, a first cooling water supply pipe 125, and a first cooling water discharge pipe 126. It should be noted that the number of ink supply pipes 123, ink discharge pipes 124, first cooling water supply pipes 125, and first cooling water discharge pipes 126 can be appropriately set.

[0063] The manifold 121 is formed in the shape of a plate or a block. The manifold 121 includes a supply channel 1211 that is continuous with the supply port 1111 of the substrate 111 and forms a liquid supply channel as part of a second channel; a discharge channel that is continuous with the discharge port 1112 of the substrate 111 and forms a liquid discharge channel as part of a second channel; and a first cooling channel 1213 that forms a channel for fluid used for temperature regulation. It should be noted that the manifold 121 is connected to a pair of head bodies 11, and therefore has a pair of supply paths 1211 and a pair of discharge paths.

[0064] Manifold 121 is formed, for example, by assembling multiple manifold components into a whole, forming a supply path 1211, an exhaust path, and a first cooling channel 1213.

[0065] One main surface of the manifold 121 is fixed to the back surface 117, which is the other main surface of the substrate 111. Additionally, in the manifold 121, the top plate 122 is fixed to the main surface opposite to the main surface to which the substrate 111 is fixed. Furthermore, for example, the ink supply pipe 123, the ink discharge pipe 124, the first cooling water supply pipe 125, and the first cooling water discharge pipe 126 are fixed to the manifold 121 via the top plate 122.

[0066] The supply channel 1211 is a channel formed in the manifold 121 through holes and grooves. For example, the supply path 1211 is a cubic liquid chamber extending along the length direction of the actuator 113 and the supply port 1111. The supply channel 1211 fluidly connects the ink supply tube 123 and the supply port 1111 of the substrate 111.

[0067] The discharge channel is a channel formed in the manifold 121 through holes and grooves. The discharge channel fluidly connects the ink discharge pipe 124 and the discharge port 1112 of the substrate 111.

[0068] The first cooling channel 1213 is a channel formed in the manifold 121 through holes and grooves. The first cooling channel 1213 has a groove formed on the main surface of the manifold 121 opposite to the back side of the substrate 111. The opening of the groove is covered by the substrate 111, thereby forming a defined channel. As an example, one first cooling channel 1213 is formed for each actuator 113. For example, the first cooling channel 1213 is disposed on the discharge side of the pressure chamber 1131 of the actuator 113 and extends along the length direction of the actuator 113. For example, the first cooling channel 1213 is formed in opposite positions on the outer side of the substrate 111 opposite to the central side for forming the supply port 1111. The first cooling channel 1213 fluidly connects the cooling water supply pipe 125 and the cooling water discharge pipe 126.

[0069] The first cooling channel 1213 has openings at both ends that connect to a cooling water supply pipe 125 and a cooling water discharge pipe 126 located on one main surface of the manifold 121. In addition, the first cooling channel 1213 is configured to exchange heat with the substrate 111 fixed to the manifold 121.

[0070] The top plate 122 is located on the side opposite to the side of the manifold 121 on which the base plate 111 is located. In addition, the top plate 122 connects the pipes 123, 124, and 125, and has an opening that connects the pipes 123, 124, and 125 and the flow channels 1211 and 1213.

[0071] Ink supply pipe 123 is connected to supply channel 1211. Ink discharge pipe 124 is connected to discharge channel. Cooling water supply pipe 125 and cooling water discharge pipe 126 are connected to the primary and secondary sides of the first cooling channel 1213, respectively.

[0072] In this embodiment, along the length of the manifold 121, a pair of ink supply pipes 123 and a first cooling water discharge pipe 126 are arranged at one end, and a pair of ink discharge pipes 124 and a first cooling water supply pipe 125 are arranged at the other end.

[0073] The cooling channel unit 13 has a plurality of second cooling channels 1312, a second cooling water supply pipe 133, and a second cooling water discharge pipe 134. In the cooling channel unit 13, a plurality of openings 1314 are formed between the plurality of second cooling channels 1312. The cooling channel unit 13 is connected to the cooling device 2116 of the liquid injection device 2. The second cooling channels 1312 are longer in one direction (first direction X) and are arranged side-by-side in a direction orthogonal to the length direction of the second cooling channels 1312 (second direction Y).

[0074] As a specific example, in this embodiment, since a pair of head bodies 11 are provided, four rows of nozzles 1142 are provided, four actuators 113 are provided (four rows), and four driver ICs 142 are provided (four rows). Therefore, the cooling channel unit 13 has three second cooling channels 1312, and two openings 1314 are formed between the second cooling channels 1312.

[0075] Multiple second cooling channels 1312 are connected to the second cooling water supply pipe 133 and the second cooling water discharge pipe 134.

[0076] In the cooling channel unit 13, a portion of the driver IC 142 (described later) and the printed circuit board 143 of the circuit board 14 are arranged at a plurality of openings 1314, and a plurality of second cooling channels 1312 are arranged opposite to the driver IC 142, which serves as a heat source, thereby cooling the driver IC 142.

[0077] like Figure 3 and Figure 4 As shown, the circuit board 14 includes a driver IC 142 with one end connected to a connection portion 1116 on the substrate 111 and a printed circuit board 143.

[0078] The circuit board 14 drives the actuator 113 by applying a driving voltage to the wiring pattern of the actuator 113 using the driver IC 142, thereby increasing or decreasing the volume of the pressure chamber 1131 to eject droplets from the nozzle 1141.

[0079] The driver IC 142 is connected to multiple individual electrodes 118 and a common electrode 119 via a connection portion ACF (anisotropic conductive film) that is fixed to the substrate 111 by thermoforming. The driver IC 142 is a heat-generating component. It should be noted that the driver IC 142 can also be connected to multiple individual electrodes 118 and a common electrode 119 via other methods such as ACP (anisotropic conductive paste), NCF (non-conductive film), and NCP (non-conductive paste). Multiple driver ICs 142 are, for example, disposed on a head body 11. In this embodiment, two driver ICs 142 are connected to an actuator 113. The driver IC 142 is, for example, a chip-on-film (COF) formed by mounting a driver IC chip on a film. The surface of the driver IC 142 contacts the outer surface of the second cooling channel 1312.

[0080] Printed circuit board 143 is a PWA (Printing Wiring Assembly) that carries various electronic components and connectors.

[0081] The cover 15, for example, has an outer contour 151 covering the sides of the pair of head bodies 11, the manifold unit 12 and the circuit board 14, and a mask plate covering a portion of the nozzle plate 114 side of the pair of head bodies 11.

[0082] The outer contour 151 exposes, for example, the ends of the ink supply pipe 123, ink discharge pipe 124, cooling water supply pipe 125, cooling water discharge pipe, and circuit board 14 in the manifold unit 12 to the outside.

[0083] The mask plate covers the portion of the head body 11 except for the area around the multiple nozzles 1141 and the multiple nozzles 1141 of the nozzle plate 114.

[0084] The liquid ejector head 1 configured as described above has multiple individual electrodes 118 on the head body 11, each capable of applying a driving voltage to a piezoelectric element 1133 individually, and a common electrode 119 capable of applying a driving voltage to all piezoelectric elements 1133.

[0085] Therefore, the liquid ejector head 1 can selectively, individually, or jointly drive multiple pressure chambers 1131. Furthermore, after the pressure chambers 1131 are driven, they undergo a shared-mode deformation, pressurizing the ink supplied to them. Thus, the liquid ejector head 1 can selectively eject pressurized ink from the printhead 1141 opposite the pressure chambers 1131.

[0086] In addition, the common electrode 119 is formed not only on the surface 115 of the actuator 113, the inclined surface 1134 of the actuator 113 and the inner surface of the air chamber 1132 of the substrate 111, but also on the inner peripheral surface of the supply port 1111 formed on the substrate 111.

[0087] The liquid nozzle 1 has a first cooling channel 1213 that cools the head body 11, which serves as the liquid spraying part, and a second cooling channel 1312 that cools the driver IC 142, which serves as the heat-generating part, through a manifold unit 12 and a cooling channel unit 13. Cooling water supplied by the second cooling water supply pipe 133 passes through the first cooling channel 1213 and the second cooling channel 1312 and is discharged from the second cooling water discharge pipe 134. Furthermore, the cooling water flowing through the first cooling channel 1213 cools the head body 11, and the cooling water flowing through the second cooling channel 1312 cools the driver IC 142.

[0088] Next, as an example of a method for manufacturing the liquid spray head 1, refer to Figure 12 The process of electrode formation is explained. Figure 12 This is a flowchart illustrating the electrode formation process in the manufacturing method of the liquid nozzle 1.

[0089] First, as Act 1, a Ni sputtering film 191 (surface Ni sputtering) is formed on a predetermined area of ​​the substrate 111 and the actuator 113 on the surface side of the substrate 111. Specifically, the Ni sputtering film 191 is formed on the surface 115 of the substrate 111, including the polished surface, the inner surface of the inclined surface 1134 of the actuator 113 and the grooves constituting the plurality of pressure chambers 1131 and the plurality of air chambers 1132 of the actuator 113, and the inner wall of the supply port 1111.

[0090] Next, as Act 2, a chemically plated Ni film 192 (surface-plated Ni) is formed on the surface side of the substrate 111 using a chemical plating method on the Ni sputtered film 191. For example, the Ni sputtered film 191 is used as a catalyst to form the chemically plated Ni film 192. Through Act 2, the chemically plated Ni film 192 is formed on the surface 115 of the substrate 111 including the polished surface, the inclined surface 1134 of the actuator 113, the inner surface of the grooves constituting the plurality of pressure chambers 1131 and the plurality of air chambers 1132 of the actuator 113, and the inner wall of the supply port 1111.

[0091] Next, as Act3, the electrode films of the Ni sputtered film 191 and the chemically plated Ni film 192 formed in Act1 and Act2 are patterned (PEP) by means of, for example, PEP (Photoengraving process).

[0092] Additionally, as Act 4, on the back side of the substrate 111, the non-forming area containing the liquid-contacting region RA is masked, and sputtering is performed to form a Ni sputtering film 191 (back side Ni sputtering). Thus, a Ni sputtering film 191 is formed at a predetermined location to be formed, which includes a region different from the liquid-contacting region RA, namely the central region RB and the end region RC.

[0093] Next, as Act 5, an electroplated Au film 193 is formed on the electrode films on the surface and back sides patterned in Act 3 and Act 4 using an electroplating method. By employing this method, electrodes can be formed on the back side of the substrate, avoiding the cooling water area. It should be noted that the electroplated Au film 193 may or may not be formed inside the pressure chamber 1131 and the air chamber 1132.

[0094] The following is for reference only. Figure 13 The following describes a liquid ejection device 2 having a liquid ejection head 1. The liquid ejection device 2 includes a housing 2111, a media supply unit 2112, an image forming unit 2113, a media discharge unit 2114, a transport device 2115 serving as a support device, a maintenance device 2117, and a control unit 2118. Furthermore, the liquid ejection device 2 includes a cooling device for adjusting the temperature of the ink supplied to the liquid ejection head 1.

[0095] The liquid ejection device 2 is an inkjet printer that performs image forming processing on paper P by ejecting liquid such as ink while conveying a recording medium, such as paper P, as the object to be ejected along a predetermined conveying path 2001. The conveying path 2001 is from the media supply unit 2112 through the image forming unit 2113 to the media discharge unit 2114.

[0096] The media supply unit 2112 includes multiple paper trays 21121. The image forming unit 2113 includes a support unit 2120 for supporting paper and multiple head units 2130 disposed opposite each other above the support unit 2120. The media discharge unit 2114 includes a paper discharge tray 21141.

[0097] The support 2120 includes a conveyor belt 21201 arranged in a ring within a predetermined area for image formation, a support plate 21202 supporting the conveyor belt 21201 from the back side, and a plurality of belt rollers 21203 on the back side of the conveyor belt 21201.

[0098] The head unit 2130 includes multiple liquid ejector heads 1 that serve as inkjet heads, multiple supply tanks 2132 that serve as liquid tanks mounted on each liquid ejector head 1, a pump 2134 for supplying ink, and a connecting channel 2135 that connects the liquid ejector head 1 and the supply tanks 2132.

[0099] In this embodiment, the liquid nozzle 1 includes four colors: cyan, magenta, yellow, and black, and four color supply tanks 2132 for each color of ink. The supply tanks 2132 are connected to the liquid nozzle 1 via connecting channels 2135.

[0100] Pump 2134 is, for example, a liquid delivery pump composed of a piezoelectric pump. Pump 2134 is connected to control unit 2118 and is controlled and driven by control unit 2118.

[0101] The connecting channel 2135 includes a supply channel connected to the ink supply pipe 123 of the liquid nozzle 1. Additionally, the connecting channel 2135 includes a recovery channel connected to the ink discharge pipe 124 of the liquid nozzle 1. For example, in the case where the liquid nozzle 1 is non-circulating, the recovery loop is connected to the maintenance device 2117; in the case where the liquid nozzle 1 is circulating, the recovery channel is connected to the supply tank 2132.

[0102] The conveying device 2115 conveys paper P along a conveying path 2001, which is from the paper feed tray 21121 of the media supply unit 2112 through the image forming unit 2113 to the paper discharge tray 21141 of the media discharge unit 2114. The conveying device 2115 includes a plurality of guide plates 21211 to 21218 and a plurality of conveying rollers 21221 to 21228 arranged along the conveying path 2001. The conveying device 2115 movably supports the paper P on the liquid ejector head 1.

[0103] The cooling device 2116 includes a cooling water tank 21161, a cooling loop 21162 including piping and conduits for supplying cooling water, a pump for supplying cooling water, and a cooler for regulating the temperature of the cooling water. The cooling device 2116 pumps cooling water from the cooling water tank 21161, which has been regulated to a predetermined temperature by the cooler, to the second cooling water supply pipe 133 via the cooling loop 21162. Additionally, the cooling device 2116 recovers water discharged from the first cooling channel 1213 and the second cooling channel 1312 and from the second cooling water discharge pipe 134 back to the cooling water tank 21161 via the cooling loop 21162. It should be noted that the cooler is, for example, a refrigerator.

[0104] The maintenance device 2117 absorbs and recovers residual ink on the outer surface of the printhead plate 114 during maintenance, for example. Additionally, in the case where the liquid nozzle 1 is non-circulating, the maintenance device 2117 recovers ink within the head body 11 during maintenance. Such a maintenance device 2117 includes a tray and trough for storing the recovered ink.

[0105] The control unit 2118 includes a CPU 21181, which serves as a processor, a ROM (ReadOnly Memory) for storing various programs, a RAM (Random Access Memory) for temporarily storing various variable data and image data, and an interface unit for inputting data from the outside and outputting data to the outside.

[0106] According to the liquid ejector head 1 and liquid ejector device 2 configured as described above, a first cooling channel 1213, which is supplied as a temperature-regulating fluid, is formed on the back side of the substrate 111 at a different position from the cooling channel 1213 through which the cooling water is supplied. This prevents contact with the temperature-regulating fluid, ensuring the area of ​​the common electrode 119 while maintaining cooling performance. Therefore, it is possible to prevent electrode electrolytic corrosion caused by energizing while in contact with the temperature-regulating fluid, and also to reduce the resistance of the common electrode. Thus, it is possible to prevent damage to the driver IC due to locking or other reasons. In addition, after ejecting the liquid, it is possible to prevent differences in the drive waveform between the ends and the center of the column, ensuring good printing quality such as dot diameter and straightness. Furthermore, in the above embodiment, the electrode film thickness in the pressure chamber 1131 can be reduced to ensure the adhesion of the electrode film. On the other hand, even if the electrode film thickness in the air chamber 1132 is large and the electrode film adhesion is low, electrode peeling can be prevented by forming a liquid-resistant wall 1135 of resin wall material.

[0107] It should be noted that the embodiments of the present invention are not limited to the above-described configuration. Examples of several embodiments will be shown below. Furthermore, in the embodiments described below, configurations identical to those in the first embodiment described above are given the same reference numerals, and detailed descriptions thereof are omitted.

[0108] Although the example shown above illustrates an example in which a supply port 1111, which is configured as an elongated orifice, is arranged between a pair of actuators 113 and an outlet port 1112 is arranged at both ends of the pair of actuators 113 in the longitudinal direction, it is not limited thereto, and the shape, number and arrangement of the supply port 1111 and the outlet port 1112 can be appropriately set.

[0109] For example, in addition to the supply port 1111, an electrode film constituting the common electrode 119 may also be formed on the inner wall of the discharge port 1112. Alternatively, an electrode film constituting the common electrode 119 may also be formed on the end face of the substrate 111. Furthermore, a via may be formed on the substrate 111, and an electrode film constituting part of the common electrode 119 may be formed on the inner surface of the via. For example, by forming these electrode films on the discharge port 1112, the end face, or the via, the area of ​​the common electrode 119 can be ensured, and the resistance value can be further reduced.

[0110] Although the example shown above illustrates an example where a separate electrode 118 is formed in pressure chamber 1131 and a common electrode 119 is formed in air chamber 1132, it is not limited to this. It is also possible, for example, that the common electrode 119 is formed in pressure chamber 1131 and the separate electrode 118 is formed in air chamber 1132.

[0111] Although the example described above shows that the liquid spray head 1 has a pair of head bodies 11, it is not limited to this configuration, and a configuration with only one head body 11 may also be used. Similarly, although the configuration of the head body 11 having a pair of actuators 113 is described, it is not limited to this configuration. For example, a configuration where the head body 11 has only one actuator 113 may also be used.

[0112] Furthermore, although the example above describes a non-circulating liquid nozzle 1, it can also be a circulating nozzle.

[0113] Furthermore, although the above embodiment exemplifies an inkjet head where one side of the pressure chamber 1131 is the supply side and the other side is the discharge side, with ink flowing in from one side and out from the other, it is not limited to this configuration. For example, it could be configured such that a common chamber on both sides of the pressure chamber 1131 serves as the supply side, with ink flowing in from both sides. Additionally, the supply side and discharge side could be opposite, or they could be configured to be switchable.

[0114] Furthermore, although the above embodiment exemplifies a side-firing inkjet head, it is not limited to this and can also be an end-firing type.

[0115] In addition, for example, the liquid sprayed is not limited to ink used for printing, but can also be a device that sprays liquid containing conductive particles, for example, for forming wiring patterns on printed circuit boards.

[0116] Furthermore, although the above embodiments show an example of an inkjet head used in a liquid ejection device such as an inkjet printer, it is not limited thereto. It can also be used in applications such as 3D printers, industrial manufacturing machinery, and medical applications, achieving miniaturization, lightweighting, and cost reduction.

[0117] According to at least one embodiment described above, since a common electrode is formed on the end face of the substrate, high printing quality can be ensured.

[0118] While several embodiments have been described, these embodiments are merely illustrative and not intended to limit the scope of the invention. These embodiments can be implemented in various other ways, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their variations are included within the scope and spirit of the invention, and likewise within the scope of the invention as described in the claims and its equivalents.

Claims

1. A liquid spray nozzle, characterized in that, have: The substrate has openings for liquid to pass through; An actuator is disposed on the main surface of one side of the substrate and has multiple pressure chambers; A manifold, disposed on the other side of the substrate, has a first flow channel through which fluid for temperature regulation flows; The electrode portion is formed on the surface of the actuator, the main surface of one side of the substrate, the inner wall of the opening, and the main surface of the other side of the substrate in a region different from the first flow channel. The actuator has alternating pressure chambers and air chambers formed between the pressure chambers in one direction. The liquid ejector head includes a nozzle plate disposed on one side of the actuator, and also has a nozzle communicating with the pressure chamber. The manifold is disposed opposite to each other on the other side of the substrate, forming the first flow channel between itself and the main surface of the other side, and communicating with the opening to form a second flow channel for liquid to flow through. At least one part of the electrode portion has a common electrode composed of a Ni sputtered film, a chemically plated Ni film, and an electroplated Au film stacked together.

2. The liquid spray head according to claim 1, characterized in that, Further features include: A separate electrode is formed on the surface of the actuator and on one side of the substrate, with a film thickness smaller than that of the common electrode and a higher resistance value than that of the common electrode.

3. The liquid spray head according to claim 2, characterized in that, The substrate is provided with a pair of actuators. The plurality of pressure chambers and the plurality of air chambers are arranged alternately in one direction, and extend outwards in directions intersecting the arrangement direction. The opening is provided in the region between the pair of actuators on the substrate. The common electrode extends from the pressure chamber or air chamber of the pair of actuators to the region between the pair of actuators. The individual electrode is led out from the air chamber or the pressure chamber of the pair of actuators to a region outside the pair of actuators.