Optical module

Abstract

The optical module provided by the application comprises a circuit board, an optical transceiver assembly and a fiber adapter, the front surface of the circuit board is provided with a first data processor, one end of the circuit board is provided with a protruding plate and a notch; the optical transceiver assembly comprises a tube shell, first and second cover plates, optical transmitting and receiving devices, the tube shell comprises first, second, third and fourth cavities, the first and third cavities are arranged in layers, the first and second cavities and the third and fourth cavities are arranged side by side, and the first and third cavities are hard connected with the fiber adapter through an optical port; the circuit board at the notch is inserted into the first cavity, the protruding plate is inserted into the second cavity, the first cover plate is covered on the first cavity, the optical transmitting device is arranged in the first cavity and is electrically connected with the first data processor; the second cover plate is covered on the third cavity, the optical receiving device is arranged in the third cavity and is electrically connected with the first data processor. The application optimizes the layout of the circuit and the optical engine inside the optical module, so that the optical transmitting device and the optical receiving device share one tube shell and are arranged back to back.

Description

Technical Field

[0001] This application relates to the field of optical communication technology, and in particular to an optical module. Background Technology

[0002] With the development of new business and application models such as cloud computing, mobile internet, and video, the advancement of optical communication technology has become increasingly important. In optical communication technology, optical modules are the tools for converting between photoelectric signals and signals, and are one of the key components in optical communication equipment. Furthermore, with the evolving needs of optical communication technology, the transmission rates of optical modules are continuously increasing, such as to 1.6T / 3.2T.

[0003] To improve the transmission rate of optical modules, the number of transmission channels in the optical module can be increased. For example, a traditional optical module consisting of one set of optical transmitting components and one set of optical receiving components can be improved to include multiple sets of optical transmitting components and multiple sets of optical receiving components. However, this will continuously increase the volume occupied by the optical transmitting components and optical receiving components in the optical module, which is not conducive to the miniaturization of optical modules. Summary of the Invention

[0004] This application provides an optical module to optimize the internal circuitry and optical engine layout, facilitating the miniaturization of the optical module.

[0005] This application provides an optical module, including:

[0006] The circuit board has a first data processor on the front and a protruding plate and a notch on one end.

[0007] An optical transceiver assembly, electrically connected to the circuit board, is used to transmit and receive multiple optical signals.

[0008] An optical fiber adapter, rigidly connected to the optical transceiver assembly, is used for transmitting light;

[0009] The optical transceiver component includes:

[0010] The housing includes a first cavity, a second cavity, a third cavity, and a fourth cavity. The first cavity and the third cavity are stacked, the first cavity and the second cavity are arranged side by side, and the third cavity and the fourth cavity are arranged side by side. The circuit board at the notch is inserted into the first cavity, the protruding plate is inserted into the second cavity, and the third cavity is located below the back of the circuit board. The first cavity and the third cavity are rigidly connected to the fiber optic adapter through an optical port.

[0011] A first cover plate is fitted onto the first cavity, forming an emission cavity with the first cavity;

[0012] A light emitting device is disposed within the emitting cavity and electrically connected to the first data processor; it is used to emit multiple beams.

[0013] The second cover plate is fitted into the third cavity, forming a receiving cavity with the third cavity;

[0014] An optical receiver is disposed within the receiving cavity and electrically connected to the first data processor for receiving multiple optical signals.

[0015] As can be seen from the above embodiments, the optical module provided in this application includes a circuit board, an optical transceiver assembly, and an optical fiber adapter. A first data processor is disposed on the front side of the circuit board, and a protruding plate and a notch are disposed at one end of the circuit board. The optical transceiver assembly is electrically connected to the first data processor for transmitting and receiving multiple optical signals. The optical fiber adapter is rigidly connected to the optical transceiver assembly for transmitting light. The optical transceiver assembly includes a housing, a first cover plate, an optical emitting device, a second cover plate, and an optical receiving device. The housing includes a first cavity, a second cavity, a third cavity, and a fourth cavity. The first and third cavities are stacked, the first and second cavities are arranged side-by-side, and the third and fourth cavities are arranged side-by-side. The first and third cavities are rigidly connected to the optical fiber adapter through an optical port. The circuit board at the notch is inserted into the first cavity, and the protruding plate is inserted into the second cavity to achieve assembly of the housing and the circuit board. The optical emitting device is... The optical transceiver is placed in the first cavity, and the optical emitting device is electrically connected to the first data processor on the front side of the circuit board to emit multiple beams of light. A first cover plate is placed on the first cavity to house the optical emitting device within the emitting cavity formed by the first cover plate and the first cavity. The third cavity is located below the back side of the circuit board, and the optical receiving device is placed in the third cavity. The optical receiving device is electrically connected to the first data processor to receive multiple beams of light. A second cover plate is placed on the third cavity to house the optical receiving device within the receiving cavity formed by the second cover plate and the third cavity. In the optical transceiver assembly, the optical emitting device and the optical receiving device share a single housing and are stacked back to back to integrate the optical emitting device and the optical receiving device into a single optical transceiver assembly. The optical port of the optical transceiver assembly is rigidly connected to the fiber optic adapter, which enables an optimized layout of the optical emitting device and the optical receiving device connected to the first data processor. To improve the transmission rate of optical modules, this application includes multiple sets of optical transmitting components and multiple sets of optical receiving components within the optical module. By optimizing the circuit and optical engine layout of the optical module, the optical transmitting and receiving devices are stacked back-to-back in a single housing, which reduces the volume occupied by the multiple sets of optical transmitting and receiving components within the optical module, thereby facilitating the miniaturization of the optical module. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in this disclosure, the accompanying drawings used in some embodiments of this disclosure will be briefly described below. Obviously, the drawings described below are only drawings of some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams and are not intended to limit the actual size of the product, the actual flow of the method, the actual timing of the signals, etc. involved in the embodiments of this disclosure.

[0017] Figure 1 This is a connection diagram of an optical communication system according to some embodiments;

[0018] Figure 2 This is a structural diagram of an optical network terminal according to some embodiments;

[0019] Figure 3 This is a structural diagram of an optical module according to some embodiments;

[0020] Figure 4 An exploded view of an optical module according to some embodiments;

[0021] Figure 5 This application provides an embodiment of an assembly diagram of a circuit board, an optical emitting component, and an optical receiving component in an optical module. Figure 1 ;

[0022] Figure 6 This application provides an embodiment of an assembly diagram of a circuit board, an optical emitting component, and an optical receiving component in an optical module. Figure 2 ;

[0023] Figure 7 A partially exploded view of a circuit board, optical transmitting component, optical receiving component, and optical fiber adapter in an optical module provided in an embodiment of this application;

[0024] Figure 8 This is a schematic diagram of the circuit board structure in an optical module provided in an embodiment of this application;

[0025] Figure 9 This is a schematic diagram of the structure of an optical transceiver component in an optical module provided in an embodiment of this application;

[0026] Figure 10 A partial exploded view of an optical transceiver component in an optical module provided in this application embodiment. Figure 1 ;

[0027] Figure 11 A partial exploded view of an optical transceiver component in an optical module provided in this application embodiment. Figure 2 ;

[0028] Figure 12A schematic diagram of the structure of the housing in an optical module provided in this application embodiment. Figure 1 ;

[0029] Figure 13 A schematic diagram of the structure of an optical transceiver component in an optical module provided in this application embodiment. Figure 1 ;

[0030] Figure 14 A schematic diagram of the structure of the housing in an optical module provided in this application embodiment. Figure 2 ;

[0031] Figure 15 A schematic diagram of the structure of an optical transceiver component in an optical module provided in this application embodiment. Figure 2 ;

[0032] Figure 16 A partial sectional view of the optical transceiver assembly and circuit board in an optical module provided in an embodiment of this application;

[0033] Figure 17 This is a schematic diagram of the structure of an optical emitting component in an optical module provided in an embodiment of this application;

[0034] Figure 18 A partially exploded view of the optical emitting component and circuit board in an optical module provided in an embodiment of this application;

[0035] Figure 19 This is a schematic diagram of the structure of a second transmitting cover in an optical module provided in an embodiment of this application;

[0036] Figure 20 A partial structural diagram of an optical emitting component in an optical module provided in an embodiment of this application;

[0037] Figure 21 A partial sectional view of the assembly of an optical emitting component and a circuit board in an optical module provided in this application embodiment;

[0038] Figure 22 This is a schematic diagram of the structure of an optical receiving component in an optical module provided in an embodiment of this application;

[0039] Figure 23 This is a partially exploded view of the optical receiving component and circuit board in an optical module provided in an embodiment of this application;

[0040] Figure 24 A partial structural diagram of an optical receiving component in an optical module provided in an embodiment of this application;

[0041] Figure 25 This is a partial assembly cross-sectional view of an optical module and its circuit board provided in an embodiment of this application. Detailed Implementation

[0042] The technical solutions in some embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments provided in this disclosure are within the scope of protection of this disclosure.

[0043] In optical communication systems, optical signals carry the information to be transmitted and are transmitted through information transmission equipment such as optical fibers or waveguides to information processing equipment such as computers to complete the information transmission. Because light has passive transmission characteristics when transmitted through optical fibers or waveguides, low-cost, low-loss information transmission can be achieved. However, the signals transmitted by information transmission equipment such as optical fibers or waveguides are optical signals, while the signals that information processing equipment such as computers can recognize and process are electrical signals. Therefore, in order to establish an information connection between information transmission equipment such as optical fibers or waveguides and information processing equipment such as computers, it is necessary to achieve mutual conversion between electrical and optical signals.

[0044] In the field of optical communication technology, optical modules realize the mutual conversion function between optical signals and electrical signals. An optical module includes an optical port and an electrical port. The optical port enables optical communication with information transmission devices such as optical fibers or optical waveguides, while the electrical port enables electrical connection with optical network terminals (e.g., optical modems). The electrical connection is mainly used for power supply, I2C signal transmission, data transmission, and grounding. The optical network terminal transmits electrical signals to information processing devices such as computers via network cables or Wi-Fi.

[0045] Figure 1 This is a diagram showing the connection relationships within an optical communication system. (Example:) Figure 1 As shown, the optical communication system includes a remote server 1000, a local information processing device 2000, an optical network terminal 100, an optical module 200, an optical fiber 101, and a network cable 103.

[0046] One end of optical fiber 101 is connected to the remote server 1000, and the other end is connected to the optical network terminal 100 via optical module 200. Optical fiber itself can support long-distance signal transmission, such as signal transmission over several kilometers (6 to 8 kilometers). Theoretically, unlimited distance transmission can be achieved by using repeaters. Therefore, in typical optical communication systems, the distance between the remote server 1000 and the optical network terminal 100 can typically reach several kilometers, tens of kilometers, or hundreds of kilometers.

[0047] One end of the network cable 103 is connected to the local information processing device 2000, and the other end is connected to the optical network terminal 100. The local information processing device 2000 can be any one or more of the following devices: router, switch, computer, mobile phone, tablet computer, television, etc.

[0048] The physical distance between the remote server 1000 and the optical network terminal 100 is greater than the physical distance between the local information processing device 2000 and the optical network terminal 100. The connection between the local information processing device 2000 and the remote server 1000 is completed by optical fiber 101 and network cable 103; while the connection between optical fiber 101 and network cable 103 is completed by optical module 200 and optical network terminal 100.

[0049] The optical module 200 includes an optical port and an electrical port. The optical port is configured to connect to the optical fiber 101, thereby establishing a bidirectional optical signal connection between the optical module 200 and the optical fiber 101. The electrical port is configured to connect to the optical network terminal 100, thereby establishing a bidirectional electrical signal connection between the optical module 200 and the optical network terminal 100. The optical module 200 performs mutual conversion between optical and electrical signals, thereby establishing an information connection between the optical fiber 101 and the optical network terminal 100. For example, the optical signal from the optical fiber 101 is converted into an electrical signal by the optical module 200 and then input to the optical network terminal 100, and the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module 200 and then input to the optical fiber 101. Since the optical module 200 is a tool for mutual conversion between optical and electrical signals and does not have the function of data processing, the information does not change during the above photoelectric conversion process.

[0050] The optical network terminal 100 includes a generally cuboid housing, and an optical module interface 102 and a network cable interface 104 disposed on the housing. The optical module interface 102 is configured to connect to an optical module 200, thereby establishing a bidirectional electrical signal connection between the optical network terminal 100 and the optical module 200; the network cable interface 104 is configured to connect to a network cable 103, thereby establishing a bidirectional electrical signal connection between the optical network terminal 100 and the network cable 103. The optical module 200 and the network cable 103 are connected through the optical network terminal 100. For example, the optical network terminal 100 transmits electrical signals from the optical module 200 to the network cable 103, and vice versa, thus the optical network terminal 100 acts as a host computer for the optical module 200, monitoring its operation. Besides the optical network terminal 100, the host computer for the optical module 200 may also include an optical line terminal (OLT), etc.

[0051] The remote server 1000 establishes a bidirectional signal transmission channel with the local information processing equipment 2000 through optical fiber 101, optical module 200, optical network terminal 100 and network cable 103.

[0052] Figure 2 This is a structural diagram of an optical network terminal. To clearly show the connection relationship between the optical module 200 and the optical network terminal 100... Figure 2 Only the structure of the optical network terminal 100 related to the optical module 200 is shown. For example... Figure 2 As shown, the optical network terminal 100 also includes a circuit board 105 disposed within a housing, a cage 106 disposed on the surface of the circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector disposed inside the cage 106. The electrical connector is configured to connect to the electrical port of the optical module 200; the heat sink 107 has protrusions such as fins to increase the heat dissipation area.

[0053] The optical module 200 is inserted into the cage 106 of the optical network terminal 100, where it is secured. Heat generated by the optical module 200 is conducted to the cage 106 and then dissipated through the heat sink 107. After insertion into the cage 106, the optical module 200's electrical port connects to an electrical connector inside the cage 106, establishing a bidirectional electrical signal connection between the optical module 200 and the optical network terminal 100. Furthermore, the optical port of the optical module 200 connects to the optical fiber 101, establishing a bidirectional optical signal connection between the optical module 200 and the optical fiber 101.

[0054] Figure 3 This is a structural diagram of an optical module according to some embodiments. Figure 4 This is an exploded view of an optical module according to some embodiments. Figure 3 , Figure 4 As shown, the optical module 200 includes a shell, a circuit board 300 disposed inside the shell, and an optical transceiver assembly.

[0055] The housing includes an upper housing 201 and a lower housing 202, with the upper housing 201 covering the lower housing 202 to form the aforementioned housing with two openings; the outer contour of the housing is generally square.

[0056] In some embodiments of this disclosure, the lower housing 202 includes a base plate and two lower side plates located on both sides of the base plate and disposed perpendicular to the base plate; the upper housing 201 includes a cover plate, which covers the two lower side plates of the lower housing 202 to form the aforementioned housing.

[0057] In some embodiments, the lower housing 202 includes a bottom plate and two lower side plates located on both sides of the bottom plate and arranged perpendicularly to the bottom plate; the upper housing 201 includes a cover plate and two upper side plates located on both sides of the cover plate and arranged perpendicularly to the cover plate, wherein the two upper side plates are combined with the two lower side plates to realize that the upper housing 201 covers the lower housing 202.

[0058] The direction of the line connecting the two openings 204 and 205 can be consistent with or inconsistent with the length direction of the optical module 200. For example, opening 204 is located at the end of the optical module 200. Figure 3 The opening 205 is also located at the end of the optical module 200 (right end). Figure 3 (Left end). Alternatively, opening 204 is located at the end of optical module 200, while opening 205 is located on the side of optical module 200. Opening 204 is an electrical port, from which the gold fingers 301 of circuit board 300 extend and are inserted into a host computer (e.g., optical network terminal 100); opening 205 is an optical port, configured to connect to external optical fiber 101 so that external optical fiber 101 can connect to the optical transceiver assembly inside optical module 200.

[0059] The assembly method using an upper housing 201 and a lower housing 202 facilitates the installation of components such as the circuit board 300 and optical transceiver assemblies into the housing, with the upper housing 201 and lower housing 202 providing encapsulation and protection for these components. Furthermore, the assembly of the circuit board 300 and optical transceiver assemblies facilitates the deployment of positioning components, heat dissipation components, and electromagnetic shielding components, which is beneficial for automated production.

[0060] In some embodiments, the upper housing 201 and the lower housing 202 are generally made of metal materials, which facilitates electromagnetic shielding and heat dissipation.

[0061] In some embodiments, the optical module 200 further includes an unlocking component 203 located outside its housing, the unlocking component 203 being configured to establish a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0062] For example, the unlocking component 203 is located on the outer wall of the two lower side plates of the lower housing 202, and has a locking component that matches the host computer cage (e.g., the cage 106 of the optical network terminal 100). When the optical module 200 is inserted into the host computer cage, the locking component of the unlocking component 203 fixes the optical module 200 in the host computer cage; when the unlocking component 203 is pulled, the locking component of the unlocking component 203 moves accordingly, thereby changing the connection relationship between the locking component and the host computer, so as to release the locking relationship between the optical module 200 and the host computer, thereby allowing the optical module 200 to be pulled out of the host computer cage.

[0063] Circuit board 300 includes circuit traces, electronic components, and chips. The circuit traces connect the electronic components and chips according to the circuit design to achieve functions such as power supply, electrical signal transmission, and grounding. Electronic components include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips include, for example, microcontroller units (MCUs), laser driver chips, limiting amplifiers, clock and data recovery (CDR) chips, power management chips, and digital signal processing (DSP) chips.

[0064] Circuit board 300 is generally a rigid circuit board. Due to its relatively rigid material, the rigid circuit board can also perform a load-bearing function. For example, the rigid circuit board can stably support the aforementioned electronic components and chips. When the optical transceiver assembly is located on the circuit board, the rigid circuit board can also provide stable support. The rigid circuit board can also be inserted into the electrical connector in the host computer cage.

[0065] The circuit board 300 also includes gold fingers 301 formed on its end surface, the gold fingers 301 consisting of a plurality of independent pins. The circuit board 300 is inserted into the cage 106 and is electrically connected to an electrical connector within the cage 106 by the gold fingers 301. The gold fingers 301 may be provided only on one side of the surface of the circuit board 300 (e.g., Figure 4 The gold fingers 301 (shown on the upper surface) can also be placed on the upper and lower surfaces of the circuit board 300 to accommodate applications with a large number of pins. The gold fingers 301 are configured to establish an electrical connection with the host computer to enable power supply, grounding, I2C signal transmission, and data signal transmission.

[0066] Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards as a supplement to rigid circuit boards. For example, flexible circuit boards can be used to connect rigid circuit boards to optical transceiver components.

[0067] The DSP chip on the circuit board 300 receives the electrical signal transmitted by the gold finger 301, and then transmits the electrical signal to the laser driver chip on the circuit board 300 via the signal line. The laser driver chip converts the electrical signal into a drive signal, which is used to drive the optical transmitter in the optical transceiver assembly to emit optical signals. The external optical signal is converted into an electrical signal by the optical receiver in the optical transceiver assembly, and then the electrical signal is transmitted to the DSP chip via the signal line for processing. After being processed by the DSP chip, the signal is transmitted to the host computer via the gold finger 301.

[0068] With the development of optical communication technology, the transmission rate of optical modules is constantly increasing, such as 1.6T / 3.2T. For a transmission rate of 1.6T, an 8-channel 200Gb / s optical module or a 16-channel 100Gb / s optical module can be used. Among them, the 100G optical module plays a crucial role in building a high-speed network system. Therefore, this application can use a 16-channel 100Gb / s optical module.

[0069] However, due to industry limitations, at present only 8-channel 800G DSP chips are available. This means that the DSP chip can only provide 8-channel 100G PAM4 data transmission or 16-channel 50G PAM4 data transmission, which cannot meet the 1.6T capacity transmission requirement and therefore cannot meet the 2km application scenario of data centers.

[0070] To address the aforementioned issues, this application is developed based on current 800G DSP technology. The internal circuitry and optical engine layout of the optical module are optimized to enable both the optical and electrical ports to use 16-channel 100G PAM4 data transmission, thereby achieving 1.6T data transmission across 16 channels.

[0071] Figure 5 This is a schematic diagram of the assembly of the circuit board, optical emitting component, and optical receiving component in the optical module provided in the embodiments of this application. Figure 1 , Figure 6 This is a schematic diagram of the assembly of the circuit board, optical emitting component, and optical receiving component in the optical module provided in the embodiments of this application. Figure 2 .like Figure 5 , Figure 6 As shown, the optical module provided in this embodiment includes an optical transceiver component 400, an optical transmitter component 500, and an optical receiver component 600. The optical transceiver component 400 is disposed at the end of the circuit board 300 and is connected to the fiber optic adapter 700 via a hard connection to achieve the transmission of 8 channels of transmitted light and the reception of 8 channels of received light. The optical transmitter component 500 is disposed on the front side of the circuit board 300 and is connected to the fiber optic adapter 700 via a pigtail connection to achieve the transmission of 8 channels of transmitted light. The optical receiver component 600 is disposed on the back side of the circuit board 300 and is connected to the fiber optic adapter 700 via a pigtail connection to achieve the reception of 8 channels of received light.

[0072] 16-channel 100G data transmission was achieved through the 8-channel transmit light in optical transceiver component 400 and the 8-channel transmit light in optical transmitter component 500, and 16-channel 100G data transmission was achieved through the 8-channel receive light in optical transceiver component 400 and the 8-channel receive light in optical receiver component 600.

[0073] Figure 7This is a partially exploded view of the circuit board, optical transmitting component, optical receiving component, and fiber optic adapter in the optical module provided in the embodiments of this application. Figure 8 This is a schematic diagram of the circuit board structure in the optical module provided in an embodiment of this application. Figure 7 , Figure 8 As shown, a first DSP chip 310 and a second DSP chip 320 are disposed on the front side of the circuit board 300. The first DSP chip 310 and the second DSP chip 320 are respectively connected to the gold finger 301 via signal lines. The first DSP chip 310 and the second DSP chip 320 can be disposed on the surface of the circuit board 300 in a left-right direction, with the first DSP chip 310 close to the optical fiber adapter 700 and the second DSP chip 320 located to the right of the first DSP chip 310.

[0074] In some embodiments, the first DSP chip 310 and the second DSP chip 320 may be located on the same side of the circuit board 300, such as the first DSP chip 310 and the second DSP chip 320 being located on the front or back of the circuit board 300; the first DSP chip 310 and the second DSP chip 320 may also be located on different sides of the circuit board 300, such as the first DSP chip 310 being located on the front or back of the circuit board 300, and the second DSP chip 320 being located on the back or front of the circuit board 300.

[0075] Since the system fan mainly blows air from the upper shell of the optical module, the part closer to the upper shell 201 will have better heat dissipation. Therefore, for heat dissipation considerations, the first DSP chip 310 and the second DSP chip 320 are located on the same side, on the front of the circuit board 300.

[0076] A protruding plate 303 is provided on one end of the circuit board 300 opposite to the gold finger 301. The protruding plate 303 extends from the left end of the circuit board 300 toward the fiber optic adapter 700. The rear side of the protruding plate 303 is flush with the rear side of the circuit board 300. A notch 304 is provided between the front side of the protruding plate 303 and the front side of the circuit board 300, so that the left side of the circuit board 300 is L-shaped.

[0077] The protruding plate 303 of the circuit board 300 is inserted into the optical transceiver assembly 400, so that the optical emitting device in the optical transceiver assembly 400 is positioned opposite to the notch 304 of the circuit board 300, and the optical receiving device in the optical transceiver assembly 400 is located on the back of the circuit board 300. Thus, the front of the circuit board 300 is flush with the optical emitting device, and the back of the circuit board 300 is flush with the optical receiving device, so as to facilitate the electrical connection of the first DSP chip 310 to the optical transceiver assembly 400.

[0078] In some embodiments, a through mounting hole 302 is provided on the circuit board 300, the light emitting component 500 is embedded in the mounting hole 302, and the second DSP chip 320 is electrically connected to the light emitting component 500 through a signal line to drive the light emitting component 500 to emit signal light; the light receiving component 600 is electrically connected to the second DSP chip 320 through a signal line to transmit the electrical signal output by the light receiving component 600 to the second DSP chip 320.

[0079] Figure 9 This is a schematic diagram of the structure of the optical transceiver component in the optical module provided in the embodiments of this application. Figure 10 Partial exploded view of the optical transceiver component in the optical module provided in the embodiments of this application. Figure 1 , Figure 11 Partial exploded view of the optical transceiver component in the optical module provided in the embodiments of this application. Figure 2 .like Figure 9 , Figure 10 , Figure 11 As shown, the optical transceiver assembly 400 includes a housing 401, which includes a first cavity 402, a second cavity 403, a third cavity 404, and a fourth cavity 405. The first cavity 402 and the second cavity 403 are located above the front side of the circuit board 300, and the third cavity 404 and the fourth cavity 405 are located below the back side of the circuit board 300. The first cavity 402 and the third cavity 404 are arranged opposite to each other, and the second cavity 403 and the fourth cavity 405 are arranged opposite to each other. The first cavity 402 and the third cavity 404, and the second cavity 403 and the fourth cavity 405 are separated by a partition.

[0080] In some embodiments, the first cavity 402 and the third cavity 404 are stacked vertically, and the first cavity 402 and the third cavity 404 are located in the notch 304 of the circuit board 300, and the circuit board 300 is inserted into the first cavity 402; the second cavity 403 and the fourth cavity 405 are stacked vertically, and the second cavity 403 and the fourth cavity 405 are opposite to the protruding plate 303, and the protruding plate 303 is inserted into the second cavity 403.

[0081] The optical transceiver assembly 400 also includes a first cover plate 4101, which covers the first cavity 402. The first cavity 402 is provided with light emitting devices such as lasers and lenses. The first cavity 402 and the first cover plate 4101 form a sealed cavity, and the light emitting devices such as lasers and lenses are located in the sealed cavity.

[0082] The optical transceiver assembly 400 also includes a second cover plate 4201, which covers the third cavity 404. The third cavity 404 is provided with optical receiving devices such as lenses and reflecting prisms. The third cavity 404 and the second cover plate 4201 form a sealed cavity, and the optical receiving devices such as lenses and reflecting prisms are located in the sealed cavity.

[0083] In some embodiments, since the protocol sets the transmitting port on the top layer and the receiving port on the bottom layer, the optical transmitting device and the optical receiving device are arranged back to back through the first cavity 402 and the third cavity 404, and the optical transmitting device is located on the front side of the circuit board 300, and the optical receiving device is located on the back side of the circuit board 300.

[0084] Figure 12 A schematic diagram of the housing structure in the optical module provided in this application embodiment. Figure 1 , Figure 13 Schematic diagram of the structure of the optical transceiver component in the optical module provided in the embodiments of this application. Figure 1 .like Figure 12 , Figure 13 As shown, the shell 401 includes a first side plate 4013, a second side plate 4011 and a third side plate 4012. The second side plate 4011 and the third side plate 4012 are arranged opposite to each other. The second side plate 4011 and the third side plate 4012 are respectively connected to the first side plate 4013, and the first side plate 4013, the second side plate 4011 and the third side plate 4012 form a first cavity 402.

[0085] In some embodiments, the first side plate 4013 is located on the left side of the first cavity 402, the second side plate 4011 is located on the front side of the first cavity 402, the third side plate 4012 is located on the rear side of the first cavity 402, and the first cavity 402 is open on the right side, so that the first cavity 402 is a U-shaped cavity with an opening on the right side.

[0086] The first side plate 4013 extends rearward from the third side plate 4012, causing the first side plate 4013 to protrude beyond the third side plate 4012. The first side plate 4013 and the third side plate 4012 form a second cavity 403. The first side plate 4013 is located on the left side of the second cavity 403, and the third side plate 4012 is located on the front side of the second cavity 403. Openings are provided on the rear and right sides of the second cavity 403, thus separating the second cavity 403 from the first cavity 402 through the third side plate 4012.

[0087] The first cavity 402 includes a first mounting surface 4021, a second mounting surface 4022, a third mounting surface 4023, and a fourth mounting surface 4024. The first mounting surface 4021 faces the circuit board 300. The second mounting surface 4022 is connected to the first mounting surface 4021. The fourth mounting surface 4024 is connected to the first side plate 4013. The third mounting surface 4023 is connected to the second mounting surface 4022 and the fourth mounting surface 4024 respectively.

[0088] In some embodiments, the second mounting surface 4022 is recessed in the first mounting surface 4021, the fourth mounting surface 4024 is recessed in the third mounting surface 4023, one end of the circuit board 300 containing the notch 304 is inserted into the first cavity 402 through the opening of the first cavity 402, and the back side of the circuit board 300 is in contact with the first mounting surface 4021.

[0089] A first semiconductor cooler 4102 is provided on the second mounting surface 4022. A first laser group 4103 and a second laser group 4104 are provided on the cooling surface of the first semiconductor cooler 4102. The first laser group 4103 and the second laser group 4104 are arranged side by side on the first semiconductor cooler 4102 in the front-back direction.

[0090] In some embodiments, the first laser group 4103 may include four lasers arranged side by side in a front-to-back direction; the second laser group 4104 may include four lasers arranged side by side in a front-to-back direction. Thus, eight lasers are arranged side by side in a front-to-back direction on the cooling surface of the first semiconductor cooler 4102.

[0091] In some embodiments, the first DSP chip 310 on the front side of the circuit board 300 is an 8-channel 800G DSP, such that each channel of the first DSP chip 310 can transmit 100Gb / s electrical signals, and the 100Gb / s electrical signals can drive 100Gb / s lasers, so that each laser in the first cavity 402 is a 100Gb / s laser.

[0092] With the support of the first semiconductor cooler 4102, the wire bonding height of the first laser group 4103 and the second laser group 4104 is on the same plane as the front of the circuit board 300. In this way, the wire bonding distance between the first laser group 4103, the second laser group 4104 and the front of the circuit board 300 is the shortest, which can reduce losses.

[0093] In some embodiments, a first laser driver chip is also disposed on the front side of the circuit board 300. The first laser driver chip is located between the first DSP chip 310 and the optical transceiver assembly 400. The first DSP chip 310 transmits electrical signals to the first laser driver chip via signal lines. The first laser driver chip converts the electrical signals into driving electrical signals. The driving electrical signals are transmitted to the first laser group 4103 and the second laser group 4104 to drive the first laser group 4103 and the second laser group 4104 to generate four emission beams respectively.

[0094] The cooling surface of the first semiconductor cooler 4102 is also provided with a first collimating lens group 4105 and a second collimating lens group 4106. The first collimating lens group 4105 is located in the light output direction of the first laser group 4103, and the second collimating lens group 4106 is located in the light output direction of the second laser group 4104. The collimating lenses are arranged in a one-to-one correspondence with the lasers, so that the emitted light emitted by each laser is converted into collimated light by the collimating lens.

[0095] The third mounting surface 4023 is equipped with a first wavelength division multiplexer 4107 and a second wavelength division multiplexer 4108. The first wavelength division multiplexer 4107 includes four input terminals and one output terminal. The four input terminals are configured one-to-one with the first collimating lens group 4105. Thus, the four collimated beams output from the first collimating lens group 4105 are all injected into the first wavelength division multiplexer 4107. The first wavelength division multiplexer 4107 multiplexes the four collimated beams into one composite beam, which is then emitted through the output terminal. The second wavelength division multiplexer 4108 includes four input terminals and one output terminal. The four input terminals are configured one-to-one with the second collimating lens group 4106. Thus, the four collimated beams output from the second collimating lens group 4106 are all injected into the second wavelength division multiplexer 4108. The second wavelength division multiplexer 4108 multiplexes the four collimated beams into one composite beam, which is then emitted through the output terminal.

[0096] A first converging lens 4109 and a second converging lens 4110 are provided on the fourth mounting surface 4024. The first converging lens 4109 is correspondingly provided with the output end of the first wavelength division multiplexer 4107 to convert one channel of composite light output by the first wavelength division multiplexer 4107 into a converging light. The second converging lens 4110 is correspondingly provided with the second wavelength division multiplexer 4108 to convert one channel of composite light output by the second wavelength division multiplexer 4108 into a converging light.

[0097] The first side plate 4013 is provided with a first light-emitting port 4025 and a second light-emitting port 4026. Both the first light-emitting port 4025 and the second light-emitting port 4026 are connected to the first cavity 402. Thus, the first cavity 402 is rigidly connected to the fiber optic adapter 700 through the first light-emitting port 4025 and the second light-emitting port 4026, so that the focused light emitted from the first converging lens 4109 passes through the first light-emitting port 4025 and enters the fiber optic adapter 700, and the focused light emitted from the second converging lens 4110 passes through the second light-emitting port 4026 and enters the fiber optic adapter 700, realizing the emission of 2-way composite light (8-way emission light).

[0098] In some embodiments, the first optical output port 4025 and the second optical output port 4026 are hard-connected to the fiber optic adapter 700 via MDC optical ports, thereby realizing the hard-connection assembly of the first cavity 402 and the fiber optic adapter 700.

[0099] In some embodiments, the first cover plate 4101 may include a first top surface, a first side surface, a second side surface, and a third side surface. The first side surface and the second side surface are disposed opposite to each other, and the first side surface and the second side surface are connected to the opposite sides of the first top surface. The third side surface is disposed opposite to the first side plate 4013, and the third side surface is connected to the first top surface, the first side surface, and the third side surface respectively. The length of the first side surface and the second side surface in the left-right direction is smaller than the length of the first top surface in the left-right direction.

[0100] The left side of the first top surface abuts against the first side plate 4013, and the inner wall of the first top surface abuts against the top of the second side plate 4011 and the third side plate 4012, so that the first cover plate 4101 covers the first side plate 4013, the second side plate 4011 and the third side plate 4012. The first side of the first cover plate 4101 abuts against the right side of the second side plate 4011, the second side abuts against the right side of the third side plate 4012, and the bottom side of the third side abuts against the front of the circuit board inserted into the first cavity 402. Thus, the first cover plate 4101 and the first cavity 402 form a sealed cavity, so that the first laser group 4103, the second laser group 4104, the first collimating lens group 4105, the second collimating lens group 4106, the first wavelength division multiplexer 4107, the second wavelength division multiplexer 4108, the first converging lens 4109 and the second converging lens 4110 are all disposed in the sealed cavity.

[0101] In some embodiments, the second cavity 403 includes a fifth mounting surface 4031, which extends from the first side plate 4013 toward the circuit board 300. The fifth mounting surface 4031 is arranged side by side with the mounting surface in the first cavity 402, and the length of the fifth mounting surface 4031 in the left-right direction is smaller than the length of the third side plate 4012 in the left-right direction. The protruding plate 303 of the circuit board 300 is inserted into the second cavity 403, and the back side of the protruding plate 303 contacts and connects with the fifth mounting surface 4031.

[0102] The first side plate 4013 is also provided with a third light output port 4032 and a fourth light output port 4033. Both the third light output port 4032 and the fourth light output port 4033 are connected to the second cavity 403. Thus, the second cavity 403 is connected to the fiber optic adapter 700 through the third light output port 4032 and the fourth light output port 4033.

[0103] Figure 14 A schematic diagram of the housing structure in the optical module provided in this application embodiment. Figure 2 , Figure 15 Schematic diagram of the structure of the optical transceiver component in the optical module provided in the embodiments of this application. Figure 2 .like Figure 14 , Figure 15 As shown, the shell 401 also includes a fourth side plate 4014 and a fifth side plate 4015. The fourth side plate 4014 and the fifth side plate 4015 are arranged opposite to each other. The fourth side plate 4014 and the fifth side plate 4015 are respectively connected to the first side plate 4013, and the first side plate 4013, the fourth side plate 4014, and the fifth side plate 4015 form a third cavity 404.

[0104] In some embodiments, the first side plate 4013 is located on the left side of the third cavity 404, the fourth side plate 4014 is located on the rear side of the third cavity 404, and the fifth side plate 4015 is located on the front side of the third cavity 404. The third cavity 404 is open on the right side, thus the third cavity 404 is a U-shaped cavity with an open right side. The second side plate 4011 may be flush with the fourth side plate 4014, and the third side plate 4012 may be flush with the fifth side plate 4015.

[0105] The first side plate 4013 extends forward from the fifth side plate 4015, so that the first side plate 4013 protrudes beyond the fifth side plate 4015. The first side plate 4013 and the fifth side plate 4015 form a fourth cavity 405. The first side plate 4013 is located on the left side of the fourth cavity 405, and the fifth side plate 4015 is located on the rear side of the fourth cavity 405. Openings are provided on both the front and rear sides of the fourth cavity 405, so that the fourth cavity 405 is separated from the third cavity 404 by the fifth side plate 4015.

[0106] The third cavity 404 includes a sixth mounting surface 4041, a seventh mounting surface 4045 and an eighth mounting surface 4046. The sixth mounting surface 4041 is connected to the first side plate 4013. The eighth mounting surface 4046 faces the circuit board 300. The seventh mounting surface 4045 is located between the sixth mounting surface 4041 and the eighth mounting surface 4046, and the eighth mounting surface 4046 is recessed in the seventh mounting surface 4045.

[0107] A stop 4042 is provided at one end of the seventh mounting surface 4045 facing the sixth mounting surface 4041. The stop 4042 divides the seventh mounting surface 4045 into a first channel 4043 and a second channel 4044. The sixth mounting surface 4041 is connected to the seventh mounting surface 4045 through the first channel 4043 and the second channel 4044.

[0108] The first side plate 4013 is provided with a first light inlet 4047 and a second light inlet 4048. Both the first light inlet 4047 and the second light inlet are connected to the third cavity 404. That is, the two composite received light transmitted by the fiber optic adapter 700 are injected into the third cavity 404 through the first light inlet 4047 and the second light inlet 4048 respectively.

[0109] In some embodiments, the first optical port 4047 and the second optical port 4048 are connected to the fiber optic adapter 700 via an MDC optical port, thereby realizing the hard connection assembly between the third cavity 404 and the fiber optic adapter 700.

[0110] A first collimating lens 4202 and a second collimating lens 4203 are disposed on the sixth mounting surface 4041, and the first collimating lens 4202 and the second collimating lens 4203 are disposed side by side on the sixth mounting surface 4041. The first collimating lens 4202 is disposed corresponding to the first light entrance port 4047, so that a composite light entering through the first light entrance port 4047 is converted into collimated light by the first collimating lens 4202; the second collimating lens 4203 is disposed corresponding to the second light entrance port 4048, so that another composite light entering through the second light entrance port 4048 is converted into collimated light by the second collimating lens 4203.

[0111] A first wave demultiplexer 4204 and a second wave demultiplexer 4205 are provided on the seventh mounting surface 4045. The first wave demultiplexer 4204 has one input terminal and four output terminals. The input terminal of the first wave demultiplexer 4204 is correspondingly set with the first collimating lens 4202. Thus, the collimated light emitted from the first collimating lens 4202 enters the first wave demultiplexer 4204, and the first wave demultiplexer 4204 demultiplexes one composite light into four received light, and the four received light are emitted through the four output terminals respectively.

[0112] The second-wave demultiplexer 4205 has one input terminal and four output terminals. The input terminal of the second-wave demultiplexer 4205 is correspondingly set with the second collimating lens 4203. Thus, the collimated light emitted from the second collimating lens 4203 enters the second-wave demultiplexer 4205, which demultiplexes one composite light into four received light, and the four received light are emitted through the four output terminals respectively.

[0113] The eighth mounting surface 4046 is provided with a first converging lens group 4206 and a second converging lens group 4207. The first converging lens group 4206 includes four converging lenses, each of which is configured to correspond to each output end of the first wave demultiplexer 4204. Thus, the four received light outputs from the first wave demultiplexer 4204 are converted into converged light by the first converging lens group 4206.

[0114] The second converging lens group 4207 includes four converging lenses, each of which is configured to correspond to each output of the second wave demultiplexer 4205. Thus, the four received beams output by the second wave demultiplexer 4205 are converted into converged beams by the second converging lens group 4207.

[0115] In some embodiments, since a first detector group 305 and a second detector group 306 are disposed on the back side of the circuit board 300, and there is a height difference between the first detector group 305, the second detector group 306 and the eighth mounting surface 4046; and the receiving direction of the first detector group 305 and the second detector group 306 is perpendicular to the back side of the circuit board 300, while the transmission direction of the received light emitted from the first converging lens group 4206 and the second converging lens group 4207 is parallel to the back side of the circuit board 300, a reflector needs to be disposed between the first converging lens group 4206 and the second converging lens group 4207 and the first detector group 305 and the second detector group 306 to change the transmission direction of the received light emitted from the first converging lens group 4206 and the second converging lens group 4207, so that the received light enters the first detector group 305 and the second detector group 306.

[0116] The eighth mounting surface 4046 is also provided with a first reflecting prism 4208 and a second reflecting prism 4209. One end of the first reflecting prism 4208 is correspondingly positioned with the first converging lens group 4206, and the other end of the first reflecting prism 4208 is provided with a reflecting surface, which is located above the first detector group 305. In this way, the reflecting surface of the first reflecting prism 4208 reflects the four received light rays emitted from the first converging lens group 4206, and the four received light rays after reflection are respectively injected into the corresponding detectors of the first detector group 305.

[0117] One end of the second reflecting prism 4209 is correspondingly disposed with the second converging lens group 4207, and the other end of the second reflecting prism 4209 is provided with a reflecting surface, which is located above the second detector group 306. In this way, the reflecting surface of the second reflecting prism 4209 reflects the four received light rays emitted from the second converging lens group 4207, and the four received light rays after reflection are respectively injected into the corresponding detectors of the second detector group 306.

[0118] In some embodiments, the second cover plate 4201 may include a second top surface, an inclined surface, a fourth side surface, and a fifth side surface. The fourth side surface and the fifth side surface are disposed opposite to each other, and the fourth side surface and the fifth side surface are connected to the side surface opposite to the second top surface. The inclined surface is disposed opposite to the first side plate 4013. From left to right, the distance between the inclined surface and the front surface of the circuit board 300 gradually decreases, and the inclined surface is connected to the second top surface, the fourth side surface, and the fifth side surface respectively.

[0119] The left side of the second top surface abuts against the first side plate 4013, the fourth side surface abuts against the right side of the fourth side plate 4014, and the fifth side surface abuts against the right side of the fifth side plate 4015. The inclined surface is located above the first reflecting prism 4208 and the second reflecting prism 4209, and the bottom side of the inclined surface abuts against the back of the circuit board 300. In this way, the second cover plate 4201 and the third cavity 404 form a sealed cavity, so that the first collimating lens 4202, the second collimating lens 4203, the first wave demultiplexer 4204, the second wave demultiplexer 4205, the first converging lens group 4206, the second converging lens group 4207, the first reflecting prism 4208, the second reflecting prism 4209, the first detector group 305, and the second detector group 306 are all disposed in the sealed cavity.

[0120] In some embodiments, the fourth cavity 405 includes a ninth mounting surface 4051, which is vertically opposite to the fifth mounting surface 4031. The ninth mounting surface 4051 extends from the first side plate 4013 toward the circuit board 300. The ninth mounting surface 4051 is arranged side by side with the mounting surface in the third cavity 404. The length of the ninth mounting surface 4051 in the left-right direction is smaller than the length of the fifth side plate 4015 in the left-right direction. The protruding plate 303 of the circuit board 300 is inserted into the second cavity 403, and the ninth mounting surface 4051 is located below the back surface of the circuit board 300.

[0121] The first side plate 4013 is also provided with a third optical inlet port 4052 and a fourth optical inlet port 4053. Both the third optical inlet port 4052 and the fourth optical inlet port 4053 are connected to the fourth cavity 405. Thus, the fourth cavity 405 is connected to the fiber optic adapter 700 through the third optical inlet port 4052 and the fourth optical inlet port 4053.

[0122] Figure 16 This is a partial sectional view showing the optical transceiver assembly and circuit board in an optical module provided in an embodiment of this application. Figure 16 As shown, the first cavity 402 and the third cavity 404 are stacked vertically. After the first laser group 4103, the second laser group 4104, the first collimating lens group 4105, the second collimating lens group 4106, the first wavelength division multiplexer 4107, the second wavelength division multiplexer 4108, the first converging lens 4109, and the second converging lens 4110 are respectively installed in the first cavity 402, the Tx pad of the first DSP chip 310 is connected to the first laser driver chip through a high-speed signal line. The first laser driver chip is connected to the first laser group 4103 and the second laser group 4104 through signal lines, so that the electrical signal output by the first DSP chip 310 is transmitted to the first laser driver chip. The first laser driver chip outputs a driving electrical signal according to the electrical signal to drive the first laser group 4103 and the second laser group 4104 to generate multiple emitted light.

[0123] The four emitted beams from the second laser group 4104 are converted into four collimated beams by the second collimating lens group 4106. The four collimated beams are multiplexed into one composite beam by the second wavelength division multiplexer 4108. The composite beam is converted into a focused beam by the second converging lens 4110. The focused beam is coupled to the fiber optic adapter 700 through the second output port 4026.

[0124] In some embodiments, when the focused light is coupled to the fiber optic adapter 700 through the second output port 4026, part of the focused light may be reflected at the fiber end face within the fiber optic adapter 700. The reflected light returns to the laser via the original path, affecting the laser's light emission performance. To prevent reflected light from returning to the laser, a first isolator and a second isolator 4111 can be provided on the fourth mounting surface 4024. The first isolator is located between the first wavelength division multiplexer 4107 and the first focusing lens 4109. The first isolator is used to isolate the reflected light occurring at the fiber end face to prevent the reflected light from returning to the first laser group 4103.

[0125] The second isolator 4111 is disposed between the second wavelength division multiplexer 4108 and the second converging lens 4110. The second isolator 4111 is used to isolate the reflected light that occurs at the end face of the optical fiber to prevent the reflected light from returning to the second laser group 4104.

[0126] After the first collimating lens 4202, the second collimating lens 4203, the first wave demultiplexer 4204, the second wave demultiplexer 4205, the first converging lens group 4206, the second converging lens group 4207, the first reflecting prism 4208, and the second reflecting prism 4209 are respectively installed into the third cavity 404, the two composite lights transmitted by the fiber optic adapter 700 are injected into the third cavity 404 through the first light inlet port 4047 and the second light inlet port 4048 respectively.

[0127] One composite light entering the second cavity 403 is converted into collimated light by the second collimating lens 4203. The collimated light is demultiplexed into four receiving lights by the second wave demultiplexer 4205. The four receiving lights are converted into four converging lights by the second converging lens group 4207. The four converging lights are reflected by the second reflecting prism 4209 and then enter the second detector group 306.

[0128] The second detector group 306 is electrically connected to the Rx pad of the first DSP chip 310 via a high-speed signal line. In this way, after the second detector group 306 converts the optical signal into an electrical signal, the electrical signal is transmitted to the first DSP chip 310 via the high-speed signal line. The first DSP chip 310 then transmits the processed electrical signal to the host computer via the gold finger 301.

[0129] In some embodiments, since the detector is disposed on the back of the circuit board 300 and the first DSP chip 310 is disposed on the front of the circuit board 300, vias can be provided on the circuit board 300. The Rx pad of the first DSP chip 310 is connected to one end of the via. High-speed signal lines are provided on the back of the circuit board 300. One end of the high-speed signal lines is connected to the other end of the vias, and the other end of the high-speed signal lines is connected to the detector, thereby realizing the electrical connection between the detector and the first DSP chip 310.

[0130] This application integrates two sets of optical transmitting devices and two sets of optical receiving devices into a single structure. The optical transmitting devices and optical receiving devices share a single housing and are arranged back to back. The optical transmitting devices are located on the upper layer of the housing, and the optical receiving devices are located on the lower layer of the housing, thereby realizing 8-channel 800G transmission data transmission and 8-channel 800G reception data transmission.

[0131] Figure 17 This is a schematic diagram of the structure of the optical emitting component in the optical module provided in the embodiments of this application. Figure 18 This is a partially exploded view of the optical emitting component and circuit board in the optical module provided in an embodiment of this application. Figure 17 , Figure 18 As shown, the optical module provided in this application embodiment also includes an optical emitting component 500. The optical emitting component 500 includes a first emitting cover plate 501, a second emitting cover plate 502, and a support plate 504. The support plate 504 is disposed on the front side of the circuit board 300. A lens and other optical emitting devices are disposed on the support plate 504. The first emitting cover plate 501 covers the support plate 504 to house the lens and other optical emitting devices in the cavity formed by the first emitting cover plate 501 and the support plate 504.

[0132] The circuit board 300 is provided with a mounting hole 302, in which a laser is embedded and fixed in the second emitting cover plate 502. The top surface of the second emitting cover plate 502 is in contact with the back of the circuit board 300, so that the laser located in the mounting hole 302 is placed in the cavity formed by the second emitting cover plate 502 and the circuit board 300.

[0133] Figure 19 This is a schematic diagram of the structure of the second transmitting cover in the optical module provided in the embodiments of this application. Figure 20 This is a partial structural diagram of the optical emitting component in the optical module provided in an embodiment of this application. Figure 19 , Figure 20As shown, the second emitting cover plate 502 includes a mounting groove 5021 and a support block 5022. The mounting bottom surface of the mounting groove 5021 is recessed into the top surface of the second emitting cover plate 502. A second semiconductor cooler 503 is disposed in the mounting groove 5021. A first laser array 505 and a second laser array 511 are disposed on the cooling surface of the second semiconductor cooler 503. The first laser array 505 and the second laser array 511 are arranged side by side on the cooling surface of the second semiconductor cooler 503 in the front-back direction.

[0134] The first laser array 505 may include four lasers arranged side-by-side in a front-to-back direction; the second laser array 511 may include four lasers arranged side-by-side in a front-to-back direction. Thus, on the cooling surface of the second semiconductor cooler 503, eight lasers are arranged side-by-side in a front-to-back direction.

[0135] The second DSP chip 320 on the front side of the circuit board 300 is an 8-channel 800G DSP. Thus, each channel of the second DSP chip 320 can transmit 100Gb / s electrical signals, and the 100Gb / s electrical signals can drive 100Gb / s lasers. In this way, each laser in the first laser array 505 and the second laser array 511 is a 100Gb / s laser.

[0136] With the support of the second semiconductor cooler 503, the wire bonding height of the first laser array 505 and the second laser array 511 is on the same plane as the front of the circuit board 300. In this way, the wire bonding distance between the first laser array 505, the second laser array 511 and the front of the circuit board 300 is the shortest, which can reduce losses.

[0137] In some embodiments, a second laser driver chip is also disposed on the front side of the circuit board 300. The second laser driver chip is located between the second DSP chip 320 and the light emitting component 500. The second DSP chip 320 transmits electrical signals to the second laser driver chip via signal lines. The second laser driver chip converts the electrical signals into driving electrical signals. The driving electrical signals are transmitted to the first laser array 505 and the second laser array 511 to drive the first laser array 505 and the second laser array 511 to generate four emission beams respectively.

[0138] The cooling surface of the second semiconductor cooler 503 is also provided with a first collimating lens array 506 and a second collimating lens array 512. The first collimating lens array 506 is located in the light output direction of the first laser array 505, and the second collimating lens array 512 is located in the light output direction of the second laser array 511. The collimating lenses are arranged one-to-one with the lasers, so that the emitted light emitted by each laser is converted into collimated light by the collimating lens.

[0139] Since the laser wire bonding heights of the lasers in the first laser array 505 and the second laser array 511 are on the same plane as the front surface of the circuit board 300, and the support plate 504 is disposed on the front surface of the circuit board 300, there is a height difference between the laser wire bonding height and the mounting surface on the support plate 504. Therefore, a translation prism 507 can be disposed between the first collimating lens array 506, the second collimating lens array 512 and the support plate 504 to change the propagation direction of the emitted light.

[0140] Specifically, one end of the translation prism 507 passes through the mounting hole 302 and is mounted on the support block 5022, while the other end of the translation prism 507 is located above the front of the circuit board 300, so as to reflect and translate the emitted light that is flush with the front of the circuit board 300 to the top of the front of the circuit board 300.

[0141] The support plate 504 is provided with a first mounting surface 5041, a second mounting surface 5042 and a third mounting surface 5043. The first mounting surface 5041 is recessed in the second mounting surface 5042, the second mounting surface 5042 is recessed in the third mounting surface 5043, and the third mounting surface 5043 faces the translation prism 507. The first mounting surface 5041 faces the fiber optic adapter 700, and the second mounting surface 5042 is located between the first mounting surface 5041 and the third mounting surface 5043.

[0142] A third wavelength division multiplexer 508 and a fourth wavelength division multiplexer 513 are arranged side by side on the third assembly surface 5043. The third wavelength division multiplexer 508 includes four input terminals and one output terminal. The four input terminals are arranged corresponding to the output terminal of the translation prism 507. Thus, the four collimated beams emitted from the first collimating lens array 506 are translated by the translation prism 507 and then enter the third wavelength division multiplexer 508. The third wavelength division multiplexer 508 multiplexes the four emitted beams into one composite beam, and the composite beam is emitted through one output terminal.

[0143] The fourth wavelength division multiplexer 513 includes four input terminals and one output terminal. The four input terminals are set to correspond to the output terminal of the translation prism 507. Thus, the four collimated beams emitted from the second collimating lens array 512 are translated by the translation prism 507 and then enter the fourth wavelength division multiplexer 513. The fourth wavelength division multiplexer 513 multiplexes the four emitted beams into one composite beam, and the composite beam is emitted through one output terminal.

[0144] A third converging lens 509 and a fourth converging lens 514 are arranged side by side on the second mounting surface 5042. The third converging lens 509 is correspondingly positioned to the output end of the third wavelength division multiplexer 508, and the composite light output from the third wavelength division multiplexer 508 is converted into focused light by the third converging lens 509. The fourth converging lens 514 is correspondingly positioned to the output end of the fourth wavelength division multiplexer 513, and the composite light output from the fourth wavelength division multiplexer 513 is converted into focused light by the fourth converging lens 514.

[0145] A first optical coupler 510 and a second optical coupler 515 are arranged side by side on the first assembly surface 5041. One end of the first optical coupler 510 is correspondingly arranged with the third converging lens 509, so that the converging light emitted from the third converging lens 509 is coupled to the first optical coupler 510. The other end of the first optical coupler 510 is connected to the fiber optic adapter 700 through an internal optical fiber to transmit a composite light to the fiber optic adapter 700.

[0146] One end of the second optical coupler 515 is correspondingly set with the fourth converging lens 514, so that the converging light emitted from the fourth converging lens 514 is coupled to the second optical coupler 515; the other end of the second optical coupler 515 is connected to the fiber optic adapter 700 through an internal optical fiber to transmit a composite light to the fiber optic adapter 700.

[0147] An internal optical fiber connected to the first optical coupler 510 passes through the third output port 4032 and connects to the optical fiber adapter 700. Another internal optical fiber connected to the second optical coupler 515 passes through the fourth output port 4033 and connects to the optical fiber adapter 700. Thus, the optical transmitting component 500 is connected to the optical fiber adapter 700 using a pigtail connection method.

[0148] Figure 21 This is a partial sectional view showing the assembly of the optical emitting component and the circuit board in an optical module provided in an embodiment of this application. Figure 21As shown, the second semiconductor cooler 503 is installed into the mounting groove 5021 of the second emitting cover plate 502. The first laser array 505 and the second laser array 511 are arranged side by side on the cooling surface of the second semiconductor cooler 503. Then, the first collimating lens array 506 and the second collimating lens array 512 are arranged side by side on the cooling surface of the second semiconductor cooler 503, with the first collimating lens array 506 located in the light emission direction of the first laser array 505 and the second collimating lens array 512 located in the light emission direction of the second laser array 511. Then, the translation prism 507 is installed onto the support block 5022 of the second emitting cover plate 502. Then, the assembly... The top surface of the second emission cover 502 is fixed to the back of the circuit board 300, and the first laser array 505, the second laser array 511, the first collimating lens array 506, the second collimating lens array 512, and the translation prism 507 in the second emission cover 502 are located in the mounting hole 302; then the third wavelength division multiplexer 508 and the fourth wavelength division multiplexer 513 are installed on the third mounting surface 5043 of the support plate 504, the third converging lens 509 and the fourth converging lens 514 are installed on the second mounting surface 5042 of the support plate 504, and the first optical coupler 510 and the second optical coupler 515 are installed on the first mounting surface 5041 of the support plate 504.

[0149] In some embodiments, when the focused light is focused into the internal optical fiber by the first optical coupler 510, part of the focused light may be reflected at the fiber end face of the internal optical fiber. The reflected light returns to the laser via the original path, affecting the laser's light emission performance. To prevent the reflected light from returning to the laser, a third isolator can be provided in the first optical coupler 510. The third isolator is used to isolate the reflected light occurring at the fiber end face, thus preventing the reflected light from returning to the first laser array 505. A fourth isolator 516 is provided in the second optical coupler 515. The fourth isolator 516 is used to isolate the reflected light occurring at the fiber end face, thus preventing the reflected light from returning to the second laser array 511.

[0150] After the optical emitting component 500 is assembled, the Tx pad of the second DSP chip 320 is connected to the second laser driver chip through a high-speed signal line. The second laser driver chip is connected to the first laser array 505 and the second laser array 511 through signal lines respectively. The second laser driver chip outputs a driving electrical signal to drive the first laser array 505 to generate four emitted beams. The four emitted beams are converted into four collimated beams by the first collimating lens array 506. The four collimated beams are reflected and translated by the translation prism 507 and then enter the third wavelength division multiplexer 508. The third wavelength division multiplexer 508 multiplexes the four reflected beams into one composite beam. The composite beam is converged to the first optical coupler 510 by the third converging lens 509. The composite beam output by the first optical coupler 510 is transmitted to the optical fiber adapter 700 through the internal optical fiber, thus realizing the emission of four emitted beams.

[0151] The second laser driver chip outputs a driving electrical signal to drive the second laser array 511 to generate four emitted beams. The four emitted beams are converted into four collimated beams by the second collimating lens array 512. The four collimated beams are reflected and translated by the translation prism 507 and then enter the fourth wavelength division multiplexer 513. The fourth wavelength division multiplexer 513 multiplexes the four reflected beams into one composite beam. The composite beam is converged by the fourth converging lens 514 to the second optical coupler 515. The composite beam output by the second optical coupler 515 is transmitted to the optical fiber adapter 700 through the internal optical fiber, thus realizing the emission of four emitted beams.

[0152] Figure 22 This is a schematic diagram of the structure of the optical receiving component in the optical module provided in the embodiments of this application. Figure 23 This is a partially exploded view of the optical receiving component and circuit board in the optical module provided in an embodiment of this application. Figure 24 This is a partial structural diagram of the optical receiving component in the optical module provided in an embodiment of this application. Figure 22 , Figure 23 , Figure 24 As shown, the optical module provided in this application embodiment also includes an optical receiving component 600. The optical receiving component 600 includes a receiving cover plate 601 and a first fixing plate 602 and a second fixing plate 603 disposed on the receiving cover plate 601. The first fixing plate 602 and the second fixing plate 603 are provided with optical receiving devices such as wave demultiplexers, lenses, and reflecting prisms. The optical receiving devices are located in the cavity between the first fixing plate 602, the second fixing plate 603 and the receiving cover plate 601.

[0153] Specifically, the first fixing plate 602 is arranged in the left-right direction and is fixed to the back of the circuit board 300. A first optical collimator 604 is arranged on the left side of the first fixing plate 602. One end of the first optical collimator 604 is connected to the optical fiber adapter 700 through an internal optical fiber. One composite light transmitted by the optical fiber adapter 700 is transmitted to the first optical collimator 604 through the internal optical fiber, and the first optical collimator 604 collimates the composite light. A third wave demultiplexer 606 is arranged on the right side of the first optical collimator 604. The third wave demultiplexer 606 demultiplexes the collimated light output by the first optical collimator 604 into four received lights. A first converging lens array 608 is arranged on the right side of the third wave demultiplexer 606. The four received lights are converted into four converged lights by the first converging lens array 608.

[0154] In some embodiments, one end of the internal optical fiber is connected to the first optical collimator 604, and the other end passes through the third optical inlet 4052 and is connected to the optical fiber adapter 700, so that the external light transmitted by the optical fiber adapter 700 is transmitted to the first optical collimator 604 of the optical receiving component 600 via the internal optical fiber.

[0155] A first detector array 307 is disposed on the back of the circuit board 300, and a first converging lens array 608 is disposed on the first fixing plate 602. Thus, there is a height difference between the first detector array 307 and the first converging lens array 608, and the receiving direction of the first detector array 307 is perpendicular to the back of the circuit board 300, while the transmission direction of the received light emitted from the first converging lens array 608 is parallel to the back of the circuit board 300. Therefore, a third reflector 610 needs to be disposed between the first converging lens array 608 and the first detector array 307. The third reflector 610 changes the transmission direction of the received light emitted from the first converging lens array 608, so that the reflected received light enters the first detector array 307.

[0156] The second fixing plate 603 is arranged side by side with the first fixing plate 602, and the second fixing plate 603 is fixed to the back of the circuit board 300. A second optical collimator 605 is arranged on the left side of the second fixing plate 603. One end of the second optical collimator 605 is connected to the optical fiber adapter 700 through an internal optical fiber. Another composite light transmitted by the optical fiber adapter 700 is transmitted to the second optical collimator 605 through the internal optical fiber. The second optical collimator 605 collimates the composite light. A fourth wave demultiplexer 607 is arranged on the right side of the second optical collimator 605. The fourth wave demultiplexer 607 demultiplexes the collimated light output by the second optical collimator 605 into four received lights. A second converging lens array 609 is arranged on the right side of the fourth wave demultiplexer 607. The four received lights are converted into four converged lights by the second converging lens array 609.

[0157] In some embodiments, one end of the internal optical fiber is connected to the second optical collimator 605, and the other end passes through the fourth optical inlet 4053 and is connected to the optical fiber adapter 700, so that the external light transmitted by the optical fiber adapter 700 is transmitted to the second optical collimator 605 of the optical receiving component 600 via the internal optical fiber.

[0158] A second detector array 308 is provided on the back of the circuit board 300. A fourth reflector 611 is provided between the second converging lens array 609 and the second detector array 308. The fourth reflector 611 changes the transmission direction of the received light emitted from the second converging lens array 609, so that the reflected received light enters the second detector array 308.

[0159] In some embodiments, the internal optical fiber connected to the first optical collimator 604 passes through the third optical output port 4032 and is connected to the optical fiber adapter 700, and the internal optical fiber connected to the second optical collimator 605 passes through the fourth optical output port 4033 and is connected to the optical fiber adapter 700, so that the optical receiving component 600 is connected to the optical fiber adapter 700 using a pigtail connection method.

[0160] Figure 25 This is a partial sectional view showing the assembly of the optical receiving component and the circuit board in an optical module provided in an embodiment of this application. Figure 25 As shown, the first fixing plate 602 is fixed on the back of the circuit board 300. The first optical collimator 604, the third wave demultiplexer 606, the first converging lens array 608, and the third reflector 610 are sequentially arranged on the first fixing plate 602 in the left-right direction. Thus, one composite light transmitted by the fiber optic adapter 700 is transmitted to the first optical collimator 604 through the internal optical fiber. The first optical collimator 604 converts the composite light into collimated light. The collimated light is demultiplexed into four receiving lights by the third wave demultiplexer 606. The four receiving lights are converted into four converging lights by the first converging lens array 608. The four converging lights are reflected by the third reflector 610 and then enter the first detector array 307.

[0161] The second fixing plate 603 is fixed on the back of the circuit board 300. The second optical collimator 605, the fourth wave demultiplexer 607, the second converging lens array 609, and the fourth reflector 611 are arranged sequentially on the second fixing plate 603 in the left-right direction. Thus, the other composite light transmitted by the fiber optic adapter 700 is transmitted to the second optical collimator 605 through the internal optical fiber. The second optical collimator 605 converts the composite light into collimated light. The collimated light is demultiplexed into four receiving lights by the fourth wave demultiplexer 607. The four receiving lights are converted into four converging lights by the second converging lens array 609. The four converging lights are reflected by the fourth reflector 611 and then enter the second detector array 308.

[0162] After assembling the first optical collimator 604, the third wave demultiplexer 606, the first converging lens array 608, the third reflector 610, the second optical collimator 605, the fourth wave demultiplexer 607, the second converging lens array 609, and the fourth reflector 611, the top surface of the receiving cover 601 is fixed to the back of the circuit board 300. In this way, the optical receiving devices, the first detector array 307, and the second detector array 308 are placed in the cavity formed by the receiving cover 601 and the back of the circuit board 300.

[0163] The first detector array 307 and the second detector array 308 are electrically connected to the Rx pad of the second DSP chip 320 via a high-speed signal line. In this way, after the first detector array 307 and the second detector array 308 convert the optical signal into an electrical signal, the electrical signal is transmitted to the second DSP chip 320 via the high-speed signal line. The second DSP chip 320 then transmits the processed electrical signal to the host computer via the gold finger 301.

[0164] In some embodiments, since the first detector array 307 and the second detector array 308 are disposed on the back side of the circuit board 300 and the second DSP chip 320 is disposed on the front side of the circuit board 300, vias can be provided on the circuit board 300. The Rx pads of the second DSP chip 320 are connected to one end of the vias. High-speed signal lines are provided on the back side of the circuit board 300. One end of the high-speed signal lines is connected to the other end of the vias, and the other end of the high-speed signal lines is connected to the first detector array 307 and the second detector array 308, thereby realizing the electrical connection between the first detector array 307, the second detector array 308 and the second DSP chip 320.

[0165] In this application, the optical emitting component 500 is disposed on the front side of the circuit board 300, the laser of the optical emitting component 500 is embedded in the mounting hole 302 of the circuit board 300, the optical receiving component 600 is disposed on the back side of the circuit board 300, and the optical emitting component 500 and the optical receiving component 600 are electrically connected to the second DSP chip 320 respectively, thereby realizing 8-channel 800G transmission data transmission and 8-channel 800G reception data transmission.

[0166] In some embodiments, due to the structural size of the optical module, the optical transceiver component 400, the optical transmitter component 500, and the optical receiver component 600 cannot all be connected to the fiber optic adapter 700 using a pigtail connection method, nor can they all be connected to the fiber optic adapter 700 using a hard connection method.

[0167] The optical module provided in this embodiment includes four sets of optical transmitters and four sets of optical receivers. Two sets of optical transmitters and two sets of optical receivers are integrated into a single structure, sharing a single housing and arranged back-to-back. The two sets of optical transmitters and two sets of optical receivers are electrically connected to a first DSP chip and are rigidly connected to a fiber optic adapter via an MDC optical port. The two sets of optical transmitters form an optical transmitter assembly, which is located on the front of the circuit board, with part of its structure embedded in the mounting holes of the circuit board. The two sets of optical receivers form an optical receiver assembly, which is located on the back of the circuit board. The optical transmitter and optical receiver assemblies are electrically connected to a second DSP chip and are connected to a fiber optic adapter via a pigtail connection.

[0168] Thus, based on current 800G DSP chip technology, two 800G DSP chips are placed on the circuit board, enabling 16-channel 100G PAM4 data transmission through the electrical ports within the optical module. The optical transceiver, optical transmitter, and optical receiver components are arranged on the circuit board to optimize the optical engine layout, further enabling 16-channel 100G PAM4 data transmission through the optical ports within the optical module. This achieves a 1.6T capacity transmission across 16 channels, meeting the needs of 2km data center applications.

[0169] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. An optical module, characterized in that, include: The circuit board has a first data processor on the front and a protruding plate and a notch on one end; the circuit board has through mounting holes. An optical transceiver assembly, electrically connected to the circuit board, is used to transmit and receive multiple optical signals. A light emitting component, disposed on the front side of the circuit board, is used to generate multiple emitted light beams; The optical emitting component includes a laser, which is embedded in the mounting hole; An optical receiving component, disposed on the back side of the circuit board, is used to receive multiple sources of received light; the optical receiving component includes a detector array disposed on the back side of the circuit board; An optical fiber adapter, rigidly connected to the optical transceiver assembly, is used for transmitting light; The optical transceiver component includes: The housing includes a first cavity, a second cavity, a third cavity, and a fourth cavity. The first cavity and the third cavity are stacked, the first cavity and the second cavity are arranged side by side, and the third cavity and the fourth cavity are arranged side by side. A circuit board at the notch is inserted into the first cavity, a protruding plate is inserted into the second cavity, and the third cavity is located below the back of the circuit board. The first cavity and the third cavity are rigidly connected to the fiber optic adapter through an optical port. A first cover plate is fitted onto the first cavity, forming a transmitting cavity with the first cavity. An internal optical fiber connecting the optical transmitting component is located on the front of the circuit board, passes through the optical port, and connects to the fiber optic adapter. An internal optical fiber connecting the optical receiving component is located on the back of the circuit board, passes through the optical port, and connects to the fiber optic adapter. A light emitting device is disposed within the emitting cavity and electrically connected to the first data processor; it is used to emit multiple beams. The second cover plate is fitted into the third cavity, forming a receiving cavity with the third cavity; An optical receiver is disposed within the receiving cavity and electrically connected to the first data processor for receiving multiple optical signals.

2. The optical module according to claim 1, characterized in that, The shell includes a first side plate, a second side plate, and a third side plate. The second side plate and the third side plate are disposed opposite to each other. The second side plate and the third side plate are both connected to the first side plate. The first side plate, the second side plate, and the third side plate form the first cavity. An opening is provided at one end of the tube shell opposite to the first side plate, and the circuit board is inserted into the first cavity through the opening; The first side plate is provided with a light output port, and the light emission port of the optical fiber adapter is inserted into the light output port. The emitted light generated by the optical emitting device enters the optical fiber adapter through the light output port.

3. The optical module according to claim 2, characterized in that, The first cavity includes a first mounting surface, a second mounting surface, a third mounting surface, and a fourth mounting surface. The back of the circuit board inserted into the first cavity is in contact with the first mounting surface. The second mounting surface is recessed in the first mounting surface. The fourth mounting surface is connected to the first side plate. The third mounting surface is connected to both the second mounting surface and the fourth mounting surface, and the fourth mounting surface is recessed in the third mounting surface.

4. The optical module according to claim 3, characterized in that, A semiconductor cooler is provided on the second mounting surface, and a laser group and a collimating lens group are provided on the cooling surface of the semiconductor cooler. The collimating lens group is located in the light output direction of the laser group. A wavelength division multiplexer is provided on the third mounting surface. The wavelength division multiplexer is used to combine the multiple emitted light emitted by the laser group into a single composite light. A converging lens is provided on the fourth mounting surface, which is used to converge and couple the composite light to the fiber optic adapter.

5. The optical module according to claim 4, characterized in that, An isolator is also provided on the third mounting surface. The isolator is located between the wavelength division multiplexer and the converging lens. The isolator is used to isolate the reflected light of the composite light reflected from the fiber end face in the fiber adapter.

6. The optical module according to claim 2, characterized in that, The shell also includes a fourth side plate and a fifth side plate, which are disposed opposite to each other. Both the fourth side plate and the fifth side plate are connected to the first side plate, and the first side plate, the fourth side plate and the fifth side plate form the third cavity. The first side plate is provided with an inlet port, and the optical receiving port of the optical fiber adapter is inserted into the inlet port; a detector is provided on the back of the circuit board, and the received light that enters the third cavity through the inlet port is transmitted to the detector via the optical receiving device.

7. The optical module according to claim 6, characterized in that, The third cavity includes a sixth mounting surface, a seventh mounting surface, and an eighth mounting surface. The sixth mounting surface is connected to the first side plate, the seventh mounting surface is located between the sixth mounting surface and the eighth mounting surface, and the eighth mounting surface is recessed into the seventh mounting surface. The eighth mounting surface is located below the back of the circuit board, on which a detector array is disposed.

8. The optical module according to claim 7, characterized in that, A light inlet is provided on the first side plate, and a collimating lens is provided on the sixth mounting surface. The collimating lens is used to convert the received light entering the third cavity through the light inlet into collimated light. A wave demultiplexer is provided on the seventh mounting surface, and the wave demultiplexer is used to demultiplex the collimated light into multiple receiving lights. A reflecting prism is provided on the eighth mounting surface. The reflecting surface of the reflecting prism is located directly below the detector group. The reflecting prism is used to reflect multiple received light sources to the detector group.

9. The optical module according to claim 8, characterized in that, A stop is provided at one end of the seventh mounting surface facing the sixth mounting surface. The stop divides the seventh mounting surface into a first channel and a second channel. The collimated light enters the wave demultiplexer through the first channel and the second channel.

10. The optical module according to claim 7, characterized in that, The circuit board is provided with vias, and the receiving pad of the first data processor is electrically connected to one end of the via; Signal lines are laid on the back of the circuit board. One end of the signal line is electrically connected to the detector group, and the other end of the signal line is electrically connected to the other end of the via.

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