Display module and display device

Abstract

This application provides a display module and display device. The display module includes a display panel, a backplate, an integrated circuit, and a fixing adhesive layer. The non-bending area of ​​the display panel is bent to the non-light-emitting side of the display panel via the bending area. The backplate is located on the non-light-emitting side of the display panel, and a second backplate is located in the non-bending area. The fixing adhesive layer is located on the side of the second backplate away from the non-bending area. The fixing adhesive layer defines a first sub-region and a second sub-region. The first sub-region is aligned with the integrated circuit. By setting the thickness of the first sub-region and the second sub-region to be different, the integrated circuit cracking and peeling between the integrated circuit and the display panel caused by bending stress during module production are avoided, thereby improving the reliability of the display module.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display module and display device. Background Technology

[0002] As flexible display technology matures, flexible display devices (such as foldable phones, foldable tablets, or foldable computers) will be a major future trend. Flexible display devices consist of a flexible display module and an integrated circuit (IC) used to drive the flexible display module to display content. The flexible display module typically has a flexible structure, while the IC usually has a rigid structure.

[0003] Flexible structures are prone to deformation. When producing modules with large curvature, the deformation of the flexible structure in the flexible display device can pull and deform the chip, which can easily lead to IC cracking and IC-display panel peeling problems, resulting in display abnormalities.

[0004] In summary, in view of the IC cracking and IC-panel peeling problems existing in the existing large curvature flexible display modules, this application provides a display module and display device to improve this problem from the source. Summary of the Invention

[0005] This application provides a display module that can solve the ICCrack and IC-panel peeling problems of large curvature flexible display modules from the source.

[0006] This application provides a display module, including...

[0007] The display panel includes a display area and a non-display area. The non-display area is divided into a bending area and a non-bending area. The non-bending area is bent to the non-light-emitting side of the display panel through the bending area.

[0008] The back panel, located on the non-light-emitting side of the display panel, includes a first back panel and a second back panel disposed opposite to each other, the first back panel being located in the display area and the second back panel being located in the non-bending area;

[0009] The integrated circuit is located on the side of the non-bending area away from the second backplate;

[0010] A fixing adhesive layer is located on the side of the second backplate away from the non-bending area. The fixing adhesive layer defines a first sub-region and a second sub-region, and the first sub-region is aligned with the integrated circuit.

[0011] The thicknesses of the first sub-region and the second sub-region of the fixed adhesive layer are different.

[0012] According to one embodiment of this application, the width of the first sub-region is at least greater than the width of the integrated circuit in both the bending direction of the display module and the bending direction perpendicular to the display module.

[0013] According to one embodiment of this application, the first sub-region is a hollow structure, that is, the thickness of the first sub-region is 0.

[0014] According to one embodiment of this application, in the bending direction of the display module, the first sub-region is designed with variable thickness and is at least greater than the thickness of the second sub-region. The central region of the first sub-region has the maximum thickness, and the thickness gradient decreases from the central region of the first sub-region to both sides.

[0015] According to one embodiment of this application, the integrated circuit includes an integrated circuit body and encapsulants located on both sides of the integrated circuit body.

[0016] According to one embodiment of this application, the display module further includes a composite support layer located between the fixed adhesive layer and the first back plate.

[0017] According to one embodiment of this application, the composite support layer includes a first functional layer, a second functional layer, and a first adhesive layer stacked together, wherein the first functional layer is bonded to a fixing adhesive layer, the first adhesive layer is bonded to a first back plate, and the second functional layer is located between the first functional layer and the first adhesive layer.

[0018] According to one embodiment of this application, the display module further includes a flexible circuit board located on the side of the integrated circuit away from the bending area, the flexible circuit board being at least partially attached to the non-bending area.

[0019] According to one embodiment of this application, the display module further includes a first protective layer, which at least covers the flexible circuit board and the integrated circuit.

[0020] A display device comprising the display module described in any of the above embodiments.

[0021] The beneficial effects of this application's embodiments: This application provides a display module and display device. The display module includes a display panel, a back plate, an integrated circuit, and a fixing adhesive layer. The non-bending area of ​​the display panel is bent to the non-light-emitting side of the display panel through the bending area. The back plate is located on the non-light-emitting side of the display panel, and a second back plate is located in the non-bending area. The fixing adhesive layer is located on the side of the second back plate away from the non-bending area. The fixing adhesive layer defines a first sub-region and a second sub-region. The first sub-region is aligned with the integrated circuit. By setting the thickness of the first sub-region and the second sub-region to be different, the integrated circuit cracking and peeling between the integrated circuit and the display panel caused by bending stress during module production are avoided, thereby improving the reliability of the display module. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1a A schematic diagram of the bending structure of a hyperbolic or quadrature module;

[0024] Figure 1b A schematic diagram of the bending structure of a high curvature module;

[0025] Figure 2 This is a rear view of a display module provided in an embodiment of this application;

[0026] Figure 3 This is a schematic diagram of the cross-sectional structure of a display module provided in one embodiment of this application;

[0027] Figure 4 This is a rear view of a display module provided in another embodiment of this application;

[0028] Figure 5 This is a cross-sectional view of the thickness of a partial film layer according to another embodiment of this application;

[0029] Figure 6 This is a schematic diagram of the II-II cross-sectional structure of a display module provided in another embodiment of this application;

[0030] Figure 7 A schematic diagram of the III-III cross-sectional structure of a display module provided in another embodiment. Detailed Implementation

[0031] The following descriptions of the embodiments are based on the accompanying illustrations and are used to illustrate specific embodiments in which this application can be implemented. Directional terms used in this application, such as [up], [down], [front], [back], [left], [right], [inner], [outer], [side], etc., are only for reference to the accompanying drawings. Therefore, the directional terms used are for illustrative and understanding purposes and not for limiting the application. In the figures, structurally similar units are represented by the same reference numerals.

[0032] The present application will be further described below with reference to the accompanying drawings and specific embodiments.

[0033] Figure 1a This is a schematic diagram of the bending structure of a hyperbolic or quadrature module. Figure 1b This is a schematic diagram of the bending structure of a high-curvature module. (Example) Figure 1a As shown, the hyperbolic module includes a cover plate 11', a display panel 12', and an IC 13' located on the side of the display panel 12' away from the cover plate 11'. When the hyperbolic or quad-curved module is bent, the IC 13' remains flat. Figure 1b As shown, the large curvature module includes a cover plate 21', a display panel 22', and an IC 23' located on the side of the display panel 22' away from the cover plate 21'. Since the large curvature module bends from the middle position, the IC 23' deforms due to the force caused by the deformation of the cover plate 21', resulting in IC Crack and IC Peeling with the display panel.

[0034] This application provides a display module and display device that solves the problems of IC cracking and IC-display panel peeling from the source.

[0035] like Figure 2 and Figure 3 As shown, Figure 2 This is a rear view of a display module provided in one embodiment of this application. Figure 3 for Figure 2 A schematic diagram of the II cross-section structure is provided. The display module includes a display panel 14, which includes a display area AA and a non-display area. The non-display area is divided into a bending area PB and a non-bending area NB. The bending area PB is located between the display area AA and the non-bending area NB. The non-bending area NB is bent through the bending area PB to the non-light-emitting side of the display panel 14 to reduce the bezel width of the display module, achieving a narrow bezel or no bezel. The non-light-emitting side of the display panel 14 refers to the side opposite to the light-emitting side of the display panel 14, while the light-emitting side of the display panel 14 refers to the side where the display image is displayed.

[0036] It should be noted that the display area AA refers to the part of the display panel 14 that has the display function, and the non-display area refers to the part of the display panel 14 used for designing various external traces, driving circuits, etc. The bending area PB of the non-display area is designed with traces for connecting with the signal lines in the display area AA; the non-bending area NB of the non-display area is provided with IC 22 and a flexible printed circuit board (FPC) 30 located on the side of IC 22 away from the bending area PB, and the FPC 30 is at least partially attached to the non-bending area NB.

[0037] It should be noted that the IC 22 includes an IC body 221 and an IC encapsulant 222 surrounding the IC body 221. The material of the IC encapsulant 222 includes, but is not limited to, UV adhesive.

[0038] It should be noted that, as Figure 2 As shown, the FPC 30 includes an FPC connector 31, an FPC neck 32, and an FPC component area 33. The FPC neck 32 connects the FPC connector 31 and the FPC component area 33. The FPC component area 33 includes a first sub-component area 331 and a second sub-component area 332 that are spaced apart.

[0039] The display module also includes a back plate 15 located on the non-light-emitting side of the display panel 14 for supporting the display panel 14. The back plate 15 is interrupted in the region corresponding to the bending area PB to form a first back plate 151 and a second back plate 152 disposed opposite to each other. The first back plate 151 is located in the display area AA, and the second back plate 152 is located in the non-bending area NB. When the non-bending area NB bends to the non-light-emitting side of the display panel 14, the first back plate 151 and the second back plate 152 face each other, and the first back plate 151 and the second back plate 152 are flush with the ends facing the bending area PB. It should be noted that the material of the back plate 15 includes, but is not limited to, polyethylene terephthalate (PET).

[0040] The display panel 14 further includes a fixing adhesive layer 21 located on the side of the second back plate 152 away from the non-bending area NB. In a preferred embodiment, the fixing adhesive layer 21 is a fixing support tape (Stiffener). In other embodiments, the fixing adhesive layer 21 may also be other double-sided adhesive tapes. The fixing adhesive layer 21 includes a first sub-region 211 aligned with the IC 22 and a second sub-region 212 located around the first sub-region 211. Further, the bending direction perpendicular to the display module is defined as a first direction X, and the bending direction of the display module is defined as a second direction Y. In both the first direction X and the second direction Y, the width of the first sub-region 211 is at least greater than the width of the IC 22.

[0041] like Figure 3 As shown, in this embodiment, the first sub-region 211 of the fixing adhesive layer 21 has a hollow structure, meaning the thickness of the first sub-region 211 is 0. In other words, the fixing adhesive layer 21 avoids the position of the IC 22, increasing the movement space of the display panel 14 around the IC body 221 and reducing the bending stress on the IC 22. At the same time, the IC body 221 is fixed by the IC encapsulant 222, improving the bonding strength of the IC 22 and avoiding IC cracking and display abnormalities caused by peeling with the display panel during module production and RA.

[0042] The non-display area also includes a bending transition area BB, which connects the bending area PB and the display area AA. This allows the display panel 14 to smoothly transition from the display area AA to the bending area PB, reducing the risk of film cracking on the display panel 14 due to the bending area PB being too close to the display area AA.

[0043] Furthermore, the display module also includes a first protective layer 19. The first protective layer 19 covers at least the FPC 30 and IC 22. Specifically, the first protective layer 19 covers the FPC component area 33 of the FPC 30 and the IC 22. The first protective layer 19 includes a protective tape conductive layer 191 and a protective tape insulating layer 192 stacked together, wherein the protective tape conductive layer 191 is bonded to the FPC 30 and IC 22. The first protective layer 19 provides electromagnetic shielding for the FPC 30 and IC 22 while also making them less susceptible to damage.

[0044] Furthermore, the display module also includes a second protective layer 17, which covers the bending area PB of the display panel 14 and extends towards both ends of the bending area PB to protect the wiring in the bending area PB and prevent the wiring from breaking when the bending area PB is bent. The second protective layer 17 includes, but is not limited to, UV adhesive. Optionally, one end of the second protective layer 17 contacts the first protective layer 19, and the other end of the second protective layer 17 extends to and covers the bending transition area BB.

[0045] In this embodiment, the display module further includes a composite support layer (super clean foam, SCF) 16, which is located between the fixing and adhesive layer 21 and the first backplate 151. The composite support layer 16 can buffer external forces acting on the display module, thereby relieving internal stress. At the same time, the composite support layer 16 can dissipate the heat generated by the display module during operation, providing a certain degree of protection for the display module. The composite support layer 16 includes a first functional layer 163, a second functional layer 162, and a first adhesive layer 161 stacked together. The first functional layer 163 is bonded to the fixing and adhesive layer 21, the first adhesive layer 161 is bonded to the first backplate 151, and the second functional layer 162 is located between the first functional layer 163 and the first adhesive layer 161. It should be noted that the first functional layer 163 includes metallic copper; the second functional layer 162 includes foam materials such as foam; and the first adhesive layer 161 includes adhesive materials with bonding properties such as mesh adhesive. Mesh adhesive has advantages such as easy bonding and air release. Using mesh adhesive for bonding can avoid defects such as bubbles and bulges during bonding.

[0046] Furthermore, the display module also includes an FPC fixing adhesive 18, which is disposed between the FPC 30 and the first functional layer 163 of the composite support layer 16 to fix the FPC 30.

[0047] Furthermore, the display module also includes a polarizer 13 disposed on the light-emitting side of the display panel 14, and a cover plate 11 located above the polarizer 13. The polarizer 13 and the cover plate 11 are bonded together by an optical adhesive layer 12. The material of the optical adhesive layer 12 includes, but is not limited to, OCA optical adhesive.

[0048] like Figures 4-7 As shown, Figure 4 This is a rear view of a display module provided in another embodiment of this application. Figure 5 This is a cross-sectional view showing the thickness of the fixed adhesive layer 21 in this embodiment. Figure 6 for Figure 4 Schematic diagram of section II-II. Figure 7 for Figure 4 A schematic diagram of section III-III. (See diagram.) Figure 4 As shown, in the second direction Y, the area where IC 22 is located is defined as the IC flat area 40, and the areas on both sides of the IC flat area 40 are defined as the module bending area 50. Figure 5 As shown, in the second direction Y, the first sub-region 211 of the fixing adhesive layer 21 is located in the IC flat area 40, and the second sub-region 212 is located in the module bending area 50. The first sub-region 211 of the fixing adhesive layer 21 is of variable thickness, and in the second direction Y, the thickness of the first sub-region 211 is at least greater than the thickness of the second sub-region 212. Specifically, the central region of the first sub-region 211 has the maximum thickness, and the thickness gradually decreases from the central region of the first sub-region 211 towards both sides. By using the variable-thickness fixing adhesive layer 21, the IC 22 is kept in a flat position during the curved deformation of the display module, avoiding damage to the IC 22 and peeling between the IC and the display panel caused by IC 22 deformation.

[0049] It should be noted that, as Figure 5 As shown in this embodiment, different thicknesses of the fixed adhesive layer 21 are achieved by stacking adhesive layers of different thicknesses and lengths.

[0050] Furthermore, Figure 6 and Figure 7 These are cross-sectional views of the central and edge regions of IC 22 in this embodiment. Figure 6 The thickness of the fixed adhesive layer 21 located in the central region is significantly greater than that of the fixed adhesive layer 21. Figure 7 The thickness of the adhesive layer 21 located in the edge region is specified. However, in the first direction X of the display module, the thickness of the adhesive layer 21 is uniformly distributed.

[0051] This invention also provides a display device, which includes the display module described in any of the foregoing embodiments.

[0052] The beneficial effects of this application's embodiments: This application provides a display module and display device. The display module includes a display panel, a back plate, an integrated circuit, and a fixing adhesive layer. The non-bending area of ​​the display panel is bent to the non-light-emitting side of the display panel through the bending area. The back plate is located on the non-light-emitting side of the display panel, and a second back plate is located in the non-bending area. The fixing adhesive layer is located on the side of the second back plate away from the non-bending area. The fixing adhesive layer defines a first sub-region and a second sub-region. The first sub-region is aligned with the integrated circuit. By setting the thickness of the first sub-region and the second sub-region to be different, IC cracking and IC peeling with the display panel caused by bending stress during module production are avoided, thereby improving the reliability of the display module.

[0053] In summary, although the present application discloses the preferred embodiments as described above, the above preferred embodiments are not intended to limit the present application. Those skilled in the art can make various modifications and refinements without departing from the spirit and scope of the present application. Therefore, the scope of protection of the present application is based on the scope defined by the claims.

Claims

1. A display module, characterized by include: The display panel includes a display area and a non-display area. The non-display area is divided into a bending area and a non-bending area. The non-bending area is bent to the non-light-emitting side of the display panel through the bending area. The back panel, located on the non-light-emitting side of the display panel, includes a first back panel and a second back panel disposed opposite to each other, the first back panel being located in the display area and the second back panel being located in the non-bending area; The integrated circuit is located on the side of the non-bending area away from the second backplate; A fixing adhesive layer is located on the side of the second backplate away from the non-bending area. The fixing adhesive layer defines a first sub-region and a second sub-region, and the first sub-region is aligned with the integrated circuit. The first sub-region and the second sub-region of the fixed adhesive layer have different thicknesses. In the bending direction of the display module, the first sub-region has a variable thickness design, and the thickness of the first sub-region is at least greater than the thickness of the second sub-region. The central region of the first sub-region has the maximum thickness, and the thickness gradient decreases from the central region of the first sub-region to both sides.

2. The display module as described in claim 1, characterized in that, In the bending direction of the display module and in the bending direction perpendicular to the display module, the width of the first sub-region is at least greater than the width of the integrated circuit.

3. The display module as described in claim 1, characterized in that, The integrated circuit includes an integrated circuit body and an encapsulant surrounding the integrated circuit body.

4. The display module as described in claim 1, characterized in that, The display module also includes a composite support layer located between the fixing adhesive layer and the first back plate.

5. The display module as described in claim 4, characterized in that, The composite support layer includes a first functional layer, a second functional layer, and a first adhesive layer stacked together, wherein the first functional layer is bonded to the fixing adhesive layer, the first adhesive layer is bonded to the first back plate, and the second functional layer is located between the first functional layer and the first adhesive layer.

6. The display module as described in claim 1, characterized in that, The display module also includes a flexible circuit board located on the side of the integrated circuit away from the bending area, the flexible circuit board being at least partially attached to the non-bending area.

7. The display module as described in claim 6, characterized in that, The display module further includes a first protective layer, which covers at least the flexible circuit board and the integrated circuit.

8. A display device, characterized in that, The display device includes the display module as described in any one of claims 1 to 7.

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