An easy-to-clean photothermal conversion material, a preparation method therefor and an application thereof

Abstract

This invention provides an easy-to-clean photothermal conversion material, its preparation method, and its application. The easy-to-clean photothermal conversion material comprises a specific proportion of a main resin, a light-absorbing filler, a supporting filler, a dispersant, and a solvent. Before bonding the wafer to be thinned and the glass carrier, the easy-to-clean photothermal conversion material is coated on the bonding surfaces of the glass carrier and the wafer to be thinned. Then, conventional adhesives are used to bond the wafer to be thinned for thinning and debonding. After the thinning and debonding process, the thinned wafer can be easily separated from the glass carrier, and all conventional adhesives remain on the thinned wafer. Only a portion of the un-ablated main resin and filler remains on the surface of the separated glass carrier, which can then be removed by soaking in ordinary solvents and two-fluid purging. This method is highly efficient and does not damage the glass carrier, achieving efficient and low-damage recycling of the glass carrier.

Description

Technical Field

[0001] This invention belongs to the field of chip packaging technology, specifically relating to an easy-to-clean photothermal conversion material, its preparation method, and its application. Background Technology

[0002] In the semiconductor technology field, to improve the electrical performance of chips while maintaining sufficient heat dissipation efficiency, back grinding is typically performed on the wafer before packaging to reduce its thickness. Successful back grinding relies on temporary bonding technology to reliably adhere the wafer to a glass substrate with sufficient mechanical strength. After thinning, the wafer is separated from the glass substrate using a specific method. Adhesive residue usually remains on the separated glass substrate. If this residue cannot be thoroughly cleaned, the glass substrate cannot be recycled and reused. Alternatively, if a complex cleaning process is required, it may introduce additional mechanical or chemical damage to the glass substrate, thus affecting its reusability. For packaging plants, the volume of glass substrates used is enormous; therefore, efficient and low-damage recycling of glass substrates is crucial.

[0003] CN102420114A discloses a laminated structure and a method for manufacturing ultrathin wafers using the laminated structure. The laminated structure includes a substrate to be ground and a carrier. The substrate is ground to a very small thickness and can be separated from the carrier without damaging the substrate. This method can obtain ultrathin wafers with a thickness of less than 50 μm. However, the glass carrier after separation from the ultrathin wafer needs to be recycled by using a specific cleaning agent and a scraping action. The scraping action will inevitably produce a large number of tiny scratches on the surface of the glass carrier. When the scratches are so numerous that they seriously affect the mechanical and optical properties of the glass carrier, it can no longer be recycled.

[0004] Therefore, to solve the above-mentioned technical problems, it is urgent to develop an easy-to-clean photothermal conversion material that can achieve efficient and low-damage recycling of glass carriers. Summary of the Invention

[0005] To address the shortcomings of existing technologies, the present invention aims to provide an easy-to-clean photothermal conversion material, its preparation method, and its application. The easy-to-clean photothermal conversion material is coated on the surface of a glass substrate, and then a wafer is bonded. After the thinning and debonding processes are completed, the glass substrate separated from the thinned wafer can be recycled by soaking in a common solvent and purging with two fluids. This method is highly efficient and does not damage the glass substrate.

[0006] To achieve this objective, the present invention adopts the following technical solution:

[0007] In a first aspect, the present invention provides an easy-to-clean photothermal conversion material, wherein the easy-to-clean photothermal conversion material comprises the following components by weight:

[0008]

[0009] The easy-to-clean photothermal conversion material provided by this invention comprises a specific proportion of main resin, light-absorbing filler, supporting filler, dispersant, and solvent. Before bonding the wafer to be thinned and the glass carrier, the easy-to-clean photothermal conversion material is coated on the bonding surface of the glass carrier, and then the wafer to be thinned is bonded with a conventional adhesive (e.g., 3M adhesive). After the thinning and debonding process, the thinned wafer and the glass carrier can be easily separated, and all the conventional adhesive remains on the thinned wafer. Only a portion of the un-ablated main resin and filler remains on the surface of the separated glass carrier. It can then be recycled by soaking in a common solvent (e.g., ammonia, isopropanol, and deionized water) and two-fluid purging. This method is highly efficient and does not damage the glass carrier, achieving efficient and low-damage recycling of the glass carrier.

[0010] Specifically, the light-absorbing filler in the easy-to-clean photothermal conversion material is opaque to light of a specific wavelength and can absorb light energy and convert it into heat energy. After laser irradiation, the temperature can rise to 1000-2000℃ in a short time, which is sufficient to ablate the surrounding main resin, thereby achieving complete separation of the thinned wafer and the glass carrier. The supporting filler is an inorganic filler with a high melting point and good transparency. Its main function is to isolate and support the main resin after it is ablated, preventing the heat-softened adhesive material from bonding to the glass carrier again. The dispersant promotes the uniform dispersion of the fillers (including the light-absorbing filler and the supporting filler) and also prevents the fillers from settling and agglomerating. The solvent is used to achieve better dispersion of the various components.

[0011] The main resin may be 4 parts by weight, 6 parts by weight, 8 parts by weight, 10 parts by weight, 12 parts by weight, 14 parts by weight, 16 parts by weight, or 18 parts by weight, etc.

[0012] The light-absorbing filler can be 1 part by weight, 2 parts by weight, 3 parts by weight, 4 parts by weight, 5 parts by weight, or 6 parts by weight, etc.

[0013] The supporting filler can be 1 part by weight, 2 parts by weight, 3 parts by weight, 4 parts by weight, 5 parts by weight, 6 parts by weight, or 7 parts by weight, etc.

[0014] The dispersant can be 0.5 parts by weight, 1 part by weight, 1.5 parts by weight, 2 parts by weight, 2.5 parts by weight, 3 parts by weight, 3.5 parts by weight, 4 parts by weight, or 4.5 parts by weight, etc.

[0015] The solvent can be 70 parts by weight, 75 parts by weight, 80 parts by weight, 85 parts by weight, or 90 parts by weight, etc.

[0016] The dispersant is preferably any one or a combination of at least two of the following BYK chemical products: BYK-111, BYK-161, BYK-163, BYK-2002, BYK-2015, BYK-2152, or BYK-9076.

[0017] It should be noted that the term "main resin" as used above includes both modified and unmodified main resins, and similar expressions used below all have the same meaning.

[0018] Preferably, the content of the main resin in the easy-to-clean photothermal conversion material is 5 to 15 parts by weight.

[0019] Preferably, the host resin is a modified host resin.

[0020] Preferably, the raw materials for preparing the modified host resin include unmodified host resin, polyhydroxy compounds, and ethanolamine compounds.

[0021] As a preferred technical solution of the present invention, crosslinking modification of the unmodified host resin by selecting polyhydroxy compounds and ethanolamine compounds can make the obtained modified host resin have hydroxyl and amine groups, thereby having better water solubility, alcohol solubility and alkali solubility.

[0022] Preferably, the unmodified host resin includes any one or a combination of at least two of polyacrylic acid resin, polymethacrylic acid resin, polyester resin, polyurethane resin, or polyvinyl alcohol resin.

[0023] Preferably, the polyhydroxy compound includes ethylene glycol and / or glycerol.

[0024] Preferably, the ethanolamine compound includes any one or a combination of at least two of monoethanolamine, diethanolamine, or triethanolamine.

[0025] Preferably, the mass ratio of the unmodified main resin, the polyhydroxy compound, and the ethanolamine compound is 1:(0.1-0.5):(0.1-0.3).

[0026] The mass ratio of the unmodified main resin to the polyhydroxy compound can be 1:0.15, 1:0.2, 1:0.25, 1:0.3, 1:0.35, 1:0.4, or 1:0.45, etc.

[0027] The mass ratio of the unmodified main resin to the ethanolamine compound can be 1:0.12, 1:0.14, 1:0.16, 1:0.18, 1:0.2, 1:0.22, 1:0.24, 1:0.26, or 1:0.28, etc.

[0028] Preferably, the modified host resin is prepared by the following method, the method comprising: reacting an unmodified host resin with a polyhydroxy compound, and then adding an ethanolamine compound to react, thereby obtaining the modified resin.

[0029] Preferably, the light-absorbing filler content in the easy-to-clean photothermal conversion material is 2.5 to 5 parts by weight.

[0030] Preferably, the light-absorbing filler comprises any one or a combination of at least two of carbon black, carbon nanotubes, dark metal powder, or dark metal oxide powder.

[0031] Preferably, the dark metal powder includes iron powder.

[0032] Preferably, the dark metal oxide powder includes copper oxide powder.

[0033] Preferably, the content of the support filler in the easy-to-clean photothermal conversion material is 2.5 to 5 parts by weight;

[0034] Preferably, the support filler comprises any one or a combination of at least two of silicon oxide, zinc oxide, aluminum oxide, and glass powder.

[0035] Preferably, the silica includes hydrophilic silica and / or hydrophobic silica, and more preferably hydrophobic silica. Selecting a support filler with excellent hydrophobicity will help simplify the cleaning and recycling process of the glass carrier, and the separated glass carrier can be cleaned without scraping.

[0036] Preferably, the content of dispersant in the easy-to-clean photothermal conversion material is 0.5 to 3 parts by weight.

[0037] Preferably, the solvent content in the easy-to-clean photothermal conversion material is 70-90 parts by weight.

[0038] Preferably, the solvent comprises any one or a combination of at least two of ethanol, isopropanol, ethyl acetate, butyl acetate, propylene glycol methyl ether, propylene glycol methyl ether acetate, ethyl 3-ethoxypropionate, ethylene glycol monobutyl ether, ethylene glycol tert-butyl ether, N,N-dimethylformamide, or N,N-dimethylacetamide, and more preferably any one or a combination of at least two of ethanol, isopropanol, propylene glycol methyl ether acetate, ethylene glycol monobutyl ether, or ethylene glycol tert-butyl ether.

[0039] As a preferred technical solution of the present invention, any one or a combination of at least two of ethanol, isopropanol, propylene glycol methyl ether acetate, ethylene glycol monobutyl ether or ethylene glycol tert-butyl ether is selected as a solvent. The above solvents can enable the filler to be better dispersed through weak hydrogen bond interactions, thereby improving the uniformity and stability of the easy-to-clean photothermal conversion material.

[0040] Preferably, the easy-to-clean photothermal conversion material further includes other additives, such as any one or a combination of at least two of HD540, HD792, HD602 or HD530, which can further improve the adhesion between the easy-to-clean photothermal conversion material and the glass carrier.

[0041] Preferably, the content of other additives in the easy-to-clean photothermal conversion material is 0.1 to 0.6 parts by weight, such as 0.15 parts by weight, 0.2 parts by weight, 0.25 parts by weight, 0.3 parts by weight, 0.35 parts by weight, 0.4 parts by weight, 0.45 parts by weight, 0.5 parts by weight or 0.55 parts by weight, and more preferably 0.2 to 0.5 parts by weight.

[0042] In a second aspect, the present invention provides a method for preparing an easy-to-clean photothermal conversion material as described in the first aspect, the method comprising: mixing a main resin, a light-absorbing filler, a supporting filler, a dispersant, a solvent and optional other additives to obtain the easy-to-clean photothermal conversion material.

[0043] Preferably, the mixing process further includes grinding and filtering steps, wherein the grinding can give the filler a suitable particle size.

[0044] Thirdly, the present invention provides a wafer thinning method, the thinning method comprising: coating an easy-to-clean photothermal conversion material as described in the first aspect onto the surface of a glass carrier, then bonding the wafer to be thinned with an adhesive, performing back-side thinning and laser debonding on the wafer to be thinned, separating the thinned wafer and the glass carrier, and completing the wafer thinning.

[0045] Preferably, the coating method is spin coating.

[0046] Preferably, the coating thickness is 400–1500 nm, such as 500 nm, 600 nm, 700 nm, 800 nm, 900 nm, 1000 nm, 1100 nm, 1200 nm, 1300 nm, or 1400 nm.

[0047] Preferably, the separation force between the thinned wafer and the glass substrate is no higher than 5 N / 314 cm. 2 For example, 4.8N / 314cm 2 4.6N / 314cm 2 4.4N / 314cm 24N / 314cm 2 3.8N / 314cm 2 3.6N / 314cm 2 3.4N / 314cm 2 3.2N / 314cm 2 2.8N / 314cm 2 2.5N / 314cm 2 2.1N / 314cm 2 1.8N / 314cm 2 1.5N / 314cm 2 Or 1N / 314cm 2 wait.

[0048] Fourthly, the present invention provides an application of the easy-to-clean photothermal conversion material as described in the first aspect in wafer thinning.

[0049] Compared with the prior art, the present invention has the following beneficial effects:

[0050] (1) The easy-to-clean photothermal conversion material provided by the present invention includes a specific number of main resin, light-absorbing filler, supporting filler, dispersant and solvent. The above components are combined to make the obtained easy-to-clean photothermal conversion material have excellent bonding performance with the wafer, and can absorb light energy and convert it into heat energy, thereby achieving the separation of thinned wafer and glass carrier. The photothermal conversion material remaining on the separated glass carrier has the characteristic of being easy to clean.

[0051] (2) The present invention also provides a method for wafer thinning. Before bonding the wafer to be thinned and the glass carrier, an easy-to-clean photothermal conversion material is coated on the bonding surfaces of the two, and then a conventional adhesive (e.g., 3M adhesive) is used to bond the wafer to be thinned. After the thinning and debonding process is completed, a thickness of no more than 5N / 314cm can be achieved. 2 The low-force material easily separates the thinned wafer and the glass substrate, leaving all conventional adhesive residue on the wafer. Only easy-to-clean photothermal conversion material remains on the surface of the separated glass substrate. The glass substrate can then be recycled by ordinary solvent immersion and two-fluid purging, which is highly efficient and does not damage the glass substrate, thus achieving efficient and low-damage recycling of the glass substrate. Detailed Implementation

[0052] The technical solution of the present invention will be further illustrated below through specific embodiments. Those skilled in the art should understand that the embodiments described are merely illustrative of the present invention and should not be construed as limiting the invention in any way.

[0053] The following is some information about the raw materials involved in the specific embodiments of the present invention:

[0054] (1) Polyacrylic acid resin: sourced from Mitsubishi Chemical, brand name BR-116;

[0055] (2) Polymethyl methacrylate resin: sourced from LG Chem in South Korea, brand name H1334;

[0056] (3) Polyester resin: sourced from Anhui Shenjian New Material Co., Ltd., brand name SJ4588-18;

[0057] (4) Light-absorbing filler: specifically carbon black, sourced from Cabot, grade BP2000;

[0058] (5) Supporting filler: Specifically, it is hydrophilic fumed silica, sourced from Cabot, grade EH5; or hydrophobic fumed silica, sourced from Cabot, grade TS610;

[0059] (6) Dispersant: specifically BYK-111;

[0060] (7) Other additives: Specifically, silane coupling agent HD602.

[0061] Preparation Example 1

[0062] A modified host resin is prepared by means of: dissolving 1 part by weight of polyacrylic acid resin in 2 parts by weight of N,N-dimethylacetamide, heating to 80°C and slowly adding 0.38 parts by weight of ethylene glycol, maintaining the temperature for 30 min, then raising the temperature to 100°C and slowly adding 0.16 parts by weight of monoethanolamine, maintaining the temperature for 10 min to obtain the modified host resin.

[0063] Preparation Example 2

[0064] A modified host resin is prepared by means of: dissolving 1 part by weight of polymethacrylic acid resin in 1.8 parts by weight of N,N-dimethylacetamide, heating to 80°C and slowly adding 0.23 parts by weight of glycerol, keeping the temperature for 30 min, then raising the temperature to 100°C and slowly adding 0.14 parts by weight of diethanolamine, keeping the temperature for 10 min to obtain the modified host resin.

[0065] Preparation Example 3

[0066] A modified host resin is prepared by means of: dissolving 1 part by weight of polyester resin in 2.5 parts by weight of N,N-dimethylacetamide, heating to 80°C and slowly adding 0.15 parts by weight of glycerol, keeping the temperature for 30 min, then raising the temperature to 100°C and slowly adding 0.12 parts by weight of triethanolamine, keeping the temperature for 10 min to obtain the modified host resin.

[0067] Preparation Example 4

[0068] A modified host resin is prepared by means of: dissolving 1 part by weight of polyacrylic acid resin in 2 parts by weight of N,N-dimethylacetamide, heating to 80°C and slowly adding 0.38 parts by weight of ethylene glycol, and keeping the reaction at the temperature for 30 min to obtain the modified host resin.

[0069] Preparation Example 5

[0070] A modified host resin is prepared by means of: dissolving 1 part by weight of polyacrylic acid resin in 2 parts by weight of N,N-dimethylacetamide, heating to 100°C, slowly adding 0.16 parts by weight of monoethanolamine, and maintaining the temperature for 10 min to obtain the modified host resin.

[0071] Preparation Example 6

[0072] An unmodified host resin is an unmodified polyacrylic acid resin.

[0073] Example 1

[0074] An easy-to-clean photothermal conversion material, the raw materials for which are prepared include the following components in parts by weight:

[0075]

[0076] The preparation method of the easy-to-clean photothermal conversion material provided in this embodiment includes: adding propylene glycol methyl ether, modified main resin (preparation example 1), dispersant BYK-111, carbon black, hydrophobic fumed silica and silane coupling agent HD602 sequentially into a high-speed disperser, mixing and dispersing at a stirring speed of 500 rpm for 10 min, then dispersing at a high speed of 2000 rpm for 30 min after adding all components, and then continuously ball milling at a stirring speed of 2800 rpm for 2 h, and finally filtering with a 0.45 μm PTFE filter to obtain the easy-to-clean photothermal conversion material.

[0077] Example 2

[0078] An easy-to-clean photothermal conversion material is different from Example 1 only in that hydrophilic fumed silica is used instead of hydrophobic fumed silica, while the other substances, amounts and preparation methods are the same as in Example 1.

[0079] Example 3

[0080] An easy-to-clean photothermal conversion material is different from Example 1 only in that N,N-dimethylacetamide is used instead of propylene glycol methyl ether, while the other substances, amounts and preparation methods are the same as in Example 1.

[0081] Example 4

[0082] An easy-to-clean photothermal conversion material, the raw materials for which are prepared include the following components in parts by weight:

[0083]

[0084] The easy-to-clean photothermal conversion material provided in this embodiment refers to Embodiment 1.

[0085] Example 5

[0086] An easy-to-clean photothermal conversion material, the raw materials for which are prepared include the following components in parts by weight:

[0087]

[0088] The easy-to-clean photothermal conversion material provided in this embodiment refers to Embodiment 1.

[0089] Examples 6-8

[0090] An easy-to-clean photothermal conversion material is different from Example 1 only in that the modified main resin provided in Preparation Example 1 is replaced by the modified main resin provided in Preparation Example 4 (Example 6), the modified main resin provided in Preparation Example 5 (Example 7), and the unmodified main resin provided in Preparation Example 6 (Example 8). The other components, dosages, and preparation methods are the same as in Example 1.

[0091] Example 9

[0092] An easy-to-clean photothermal conversion material is different from Example 1 only in that the silane coupling agent HD602 is not added, while the other components, dosages and preparation methods are the same as in Example 1.

[0093] Comparative Example 1

[0094] An easy-to-clean photothermal conversion material is different from Example 1 only in that no carbon black is added, while the other components, dosages and preparation methods are the same as in Example 1.

[0095] Comparative Example 2

[0096] An easy-to-clean photothermal conversion material is different from Example 1 only in that hydrophobic fumed silica is not added, while the other components, dosages and preparation methods are the same as in Example 1.

[0097] Comparative Example 3

[0098] An easy-to-clean photothermal conversion material is different from Example 1 only in that the dispersant BYK-111 is not added, while the other components, dosages and preparation methods are the same as in Example 1.

[0099] Application Example 1

[0100] A wafer thinning method specifically includes: coating the easy-to-clean photothermal conversion material obtained in Example 1 onto an 8-inch glass substrate by spin coating to a thickness of 800 nm; then placing it on a baking plate and baking it at 140°C for 5 minutes to remove the solvent in the material; subsequently, using 3M LC3200 adhesive and an 8-inch wafer, simulating temporary bonding and back-side thinning (reducing to a thickness of 50 μm) are performed; then, debonding is performed under an infrared 1064 nm laser; finally, a coating of less than 5 N / 314 cm⁻¹ is applied. 2 The low force separates the thinned wafer from the glass substrate, resulting in a thinned wafer and a glass substrate.

[0101] Application Examples 2-9

[0102] A wafer thinning method differs from Application Example 1 only in that the easy-to-clean photothermal conversion material provided in Examples 2-9 is used to replace the easy-to-clean photothermal conversion material obtained in Example 1, while other substances and steps are the same as in Application Example 1.

[0103] Comparative Application Examples 1-3

[0104] A wafer thinning method differs from Application Example 1 only in that the easy-to-clean photothermal conversion material provided in Comparative Examples 1 to 3 is used to replace the easy-to-clean photothermal conversion material obtained in Example 1, while other substances and steps are the same as in Application Example 1.

[0105] Comparative Application Example 4

[0106] A wafer thinning method specifically includes: directly simulating temporary bonding between a glass carrier and an 8-inch wafer using 3M LC3200 bonding, thinning the back side (to a thickness of 50μm), then debonding under infrared 1064nm laser, and finally separating the thinned wafer from the glass carrier to obtain the thinned wafer and glass carrier.

[0107] Performance testing:

[0108] The glass supports obtained from the final separation in the application example and the comparative application example were immersed in glass dishes containing 2% ammonia, isopropanol and deionized water for 2 minutes in turn. Then, the surface of the glass supports was swept with two fluids and dried at 50°C. Then, the glass supports were lightly scraped with a small blade. If scraped material was found, it indicated that the glass supports were not cleaned properly. For glass supports that did not have scraped material, the elemental composition of the surface was analyzed by EDS energy dispersive spectroscopy to determine whether the glass supports were clean.

[0109] The tests were conducted according to the above test methods, corresponding to test cases 1-9 and comparative application examples 1-4. The test results are shown in Table 1.

[0110] Table 1

[0111]

[0112]

[0113] According to the data in Table 1:

[0114] (1) After the thinning method provided in Application Examples 1 and 3 to 5 is completed, a separation force of 1.2 to 3.8 N can be used to separate the glass carrier and the thinned wafer phase. After the glass carrier is separated, it is cleaned and scraped with a blade without any scraping material. Furthermore, the EDS energy dispersive spectroscopy analysis of the separated glass carrier shows that there is no difference in elemental composition with the clean glass surface. This indicates that the use of the easy-to-clean photothermal conversion material provided in Examples 1 and 3 to 5 helps to achieve efficient and low-damage recycling of the glass carrier.

[0115] (2) Compared with Application Example 1, after the thinning method provided in Application Example 1 was completed, less than 5N / 314cm 2 The low force is simply insufficient to separate the glass carrier and the thinned wafer, indicating that the easy-to-clean photothermal conversion material without added light-absorbing filler (carbon black) does not help to achieve efficient and low-damage recycling of the glass carrier. This is because the light transmittance of the easy-to-clean photothermal conversion material without added carbon black is very high, which makes it impossible to effectively convert laser energy into heat, and thus makes it difficult to ablate the resin to achieve debonding.

[0116] (3) Compared with Application Example 1, the separation force between the glass carrier and the thinned wafer after the thinning method provided in Comparative Application Example 2 is as high as 4.8N. After the glass carrier is separated and cleaned, a layer of 3MLC3200 adhesive remains on the surface. This indicates that the easy-to-clean photothermal conversion material without hydrophobic fumed silica provided in Comparative Example 2 also cannot achieve efficient and low-damage recycling of the glass carrier. This is because when hydrophobic fumed silica is not added to the easy-to-clean photothermal conversion material, the glass carrier and the adhesive will have partial adhesion due to the lack of an intermediate support with a sufficiently high melting point during the debonding process.

[0117] (4) Compared with Application Example 1, the glass carrier obtained after the thinning method provided in Application Example 3 has local powdery scraping material after cleaning. This indicates that the addition of dispersant is also very important for the efficient and low-damage recycling of glass carriers in easy-to-clean photothermal conversion materials. This is because if no dispersant is added to the easy-to-clean photothermal conversion materials, the light-absorbing filler and supporting filler contained therein will not be well dispersed, and thus the filler will still exist in some areas of the separated glass carrier after cleaning.

[0118] (5) Compared with Application Example 1, after the thinning method provided in Application Example 4 was completed, less than 5N / 314cm 2The low force is also unable to separate the glass carrier and the thinned wafer. This means that in the process of preparing the bond pair, using only 3MLC3200 adhesive to bond the thinned wafer and the glass carrier will also result in the bond pair being unable to be debonded and separated. This is because 3MLC3200 adhesive does not absorb the debonding laser and cannot generate enough heat to ablate the resin.

[0119] (6) Compared with Application Example 1, after the glass carrier obtained by the thinning method provided in Application Example 2 was cleaned, a small amount of powdery scraped material also appeared on the surface. This indicates that the effect of using hydrophobic fumed silica as a support filler is better. Replacing hydrophobic fumed silica with hydrophilic fumed silica will make it difficult to clean the glass carrier because the glass substrate is also hydrophilic.

[0120] (7) Compared with Application Example 1, the glass substrates obtained after the thinning method provided in Application Examples 6 to 8 also showed more or less resinous scrapings on their surfaces after cleaning. This indicates that the main resin modified with polyhydroxy compounds and ethanolamine compounds can more easily achieve the cleaning of the glass substrate.

[0121] (8) Compared with Application Example 1, the glass carrier obtained after the thinning method provided in Application Example 9 has no scraped material after cleaning. However, since no silane coupling agent is added to the photothermal conversion material used, the bonding force between the photothermal conversion material and the glass carrier will decrease. As a result, the bonding pair will experience edge peeling due to the strong external mechanical force during the subsequent thinning process. This is an undesirable phenomenon in the process.

[0122] The applicant declares that this invention illustrates an easy-to-clean photothermal conversion material, its preparation method, and its application through the above embodiments. However, this invention is not limited to the above embodiments, meaning that this invention does not necessarily rely on the above embodiments for implementation. Those skilled in the art should understand that any improvements to this invention, equivalent substitutions of raw materials, additions of auxiliary components, and selection of specific methods, etc., all fall within the protection and disclosure scope of this invention.

Claims

1. An easy-to-clean photothermal conversion material, characterized in that, The easy-to-clean photothermal conversion material comprises the following components by weight: 3-20 parts by weight of modified main resin Light-absorbing filler 0.5~7 parts by weight Supporting filler 0.5~8 parts by weight Dispersant 0.1~5 parts by weight Solvent: 65-95 parts by weight; The raw materials for preparing the modified host resin include unmodified host resin, polyhydroxy compounds, and ethanolamine compounds; The modified host resin is prepared by the following method, which includes: reacting an unmodified host resin with a polyhydroxy compound, and then adding an ethanolamine compound to react, thereby obtaining the modified host resin; The unmodified host resin includes any one or a combination of at least two of the following: polyacrylic acid resin, polymethacrylic acid resin, polyester resin, polyurethane resin, or polyvinyl alcohol resin. The polyhydroxy compound includes ethylene glycol and / or glycerol; The ethanolamine compounds include any one or a combination of at least two of monoethanolamine, diethanolamine, or triethanolamine; The mass ratio of the unmodified main resin, the polyhydroxy compound, and the ethanolamine compound is 1:(0.1~0.5):(0.1~0.3). The supporting filler is silicon dioxide; The silicon dioxide is hydrophobic.

2. The easy-to-clean photothermal conversion material according to claim 1, characterized in that, The modified main resin content in the easy-to-clean photothermal conversion material is 5-15 parts by weight.

3. The easy-to-clean photothermal conversion material according to claim 1, characterized in that, The light-absorbing filler content in the easy-to-clean photothermal conversion material is 2.5 to 5 parts by weight.

4. The easy-to-clean photothermal conversion material according to claim 1, characterized in that, The light-absorbing filler includes any one or a combination of at least two of carbon black, carbon nanotubes, iron powder, or copper oxide powder.

5. The easy-to-clean photothermal conversion material according to claim 1, characterized in that, The content of the support filler in the easy-to-clean photothermal conversion material is 2.5 to 5 parts by weight.

6. The easy-to-clean photothermal conversion material according to claim 1, characterized in that, The dispersant content in the easy-to-clean photothermal conversion material is 0.5 to 3 parts by weight.

7. The easy-to-clean photothermal conversion material according to claim 1, characterized in that, The solvent content in the easy-to-clean photothermal conversion material is 70-90 parts by weight.

8. The easy-to-clean photothermal conversion material according to claim 1, characterized in that, The solvent includes any one or a combination of at least two of the following: ethanol, isopropanol, ethyl acetate, butyl acetate, propylene glycol methyl ether, propylene glycol methyl ether acetate, ethyl 3-ethoxypropionate, ethylene glycol monobutyl ether, ethylene glycol tert-butyl ether, N,N-dimethylformamide, or N,N-dimethylacetamide.

9. The easy-to-clean photothermal conversion material according to claim 8, characterized in that, The solvent is any one or a combination of at least two of ethanol, isopropanol, propylene glycol methyl ether acetate, ethylene glycol monobutyl ether, or ethylene glycol tert-butyl ether.

10. The easy-to-clean photothermal conversion material according to claim 1, characterized in that, The easy-to-clean photothermal conversion material also includes other additives.

11. The easy-to-clean photothermal conversion material according to claim 10, characterized in that, The content of other additives in the easy-to-clean photothermal conversion material is 0.1~0.6 parts by weight.

12. The easy-to-clean photothermal conversion material according to claim 10, characterized in that, The content of other additives in the easy-to-clean photothermal conversion material is 0.2~0.5 parts by weight.

13. A method for preparing the easy-to-clean photothermal conversion material as described in any one of claims 1 to 12, characterized in that, The preparation method includes: mixing a main resin, a light-absorbing filler, a supporting filler, a dispersant, a solvent, and optionally other additives to obtain the easy-to-clean photothermal conversion material.

14. A method for thinning a wafer, characterized in that, The thinning method includes: coating the easy-to-clean photothermal conversion material as described in any one of claims 1 to 12 onto the surface of a glass carrier, then bonding the wafer to be thinned with an adhesive, performing back-side thinning and laser debonding on the wafer to be thinned, and finally separating the thinned wafer and the glass carrier to complete the thinning of the wafer.

15. The thinning method according to claim 14, characterized in that, The coating method is spin coating.

16. The thinning method according to claim 14, characterized in that, The coating thickness is 400~1500 nm.

17. The thinning method according to claim 14, characterized in that, The separation force of the separated thinned wafer and the glass carrier plate is not higher than 5 N / 314 cm 2 .

18. The application of the easy-to-clean photothermal conversion material as described in any one of claims 1 to 12 in wafer thinning.

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