Machining apparatus and method for a slow wave structure
By using a pressure head machining combined with an adjustment and testing mechanism, the problems of strict diameter requirements for micro-milling cutters and high cost of high-precision equipment have been solved, enabling the manufacturing of slow-wave structures with high precision and low cost.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- AEROSPACE INFORMATION RES INST CAS
- Filing Date
- 2023-11-02
- Publication Date
- 2026-07-03
Smart Images
Figure CN117506490B_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to the field of vacuum electronic device technology, and more specifically, to a fabrication apparatus and method for slow-wave structures. Background Technology
[0002] Terahertz technology has huge demand in broadband communication, medical imaging, and non-destructive testing. However, the current problem limiting the development of terahertz technology is the lack of terahertz radiation sources. In recent years, the proposal of slow wave structures such as folded waveguides and interlaced double grids has led to the rapid development of terahertz traveling wave tubes.
[0003] Currently, the main practical methods for manufacturing slow-wave structures in traveling-wave tube slow-wave circuit components include micro-milling technology, ultra-precision micro-electrical discharge machining technology, LIGA (Laser Interference Grooving and Ablation) technology, UV-LIGA (Ultraviolet-LIGA) technology, and DRIE (Deep Reactive Ion Etching) technology.
[0004] As the operating frequency of traveling wave tubes enters the terahertz band, the feature size of their slow-wave structure becomes smaller and smaller. When using micro-milling technology for machining, the diameter requirements for micro-milling cutters become more stringent. The diameter of the micro-milling cutter for a 1THz slow-wave structure is no more than 50nm. Due to the reduction in cutter diameter, the service life is significantly shortened. While ultra-precision micro-electrical discharge machining technology and LIGA (Laser Interference Grooving and Ablation) technology have excellent machining performance, the equipment is expensive and the machining efficiency is low, making it difficult to promote and use on a large scale. Summary of the Invention
[0005] In view of the above problems, this disclosure provides a machining apparatus and method for slow-wave structures, which uses a pressure head to replace the traditional milling cutter machining, thereby improving machining accuracy, reducing cost, and making it suitable for large-scale promotion and use.
[0006] To achieve the above objectives, this disclosure provides a processing apparatus for a slow-wave structure, comprising: a machine base; an adjustment mechanism mounted on the machine base for carrying a part and adjusting the orientation of the part; a processing mechanism mounted on the machine base and located above the adjustment mechanism; the processing mechanism includes a pressure head configured to move vertically to form an indentation on the surface of the part; the adjustment mechanism is configured to adjust the position of the part along a preset direction after the pressure head forms an indentation on the surface of the part, so that the surface of the part has multiple indentations spaced apart along the preset direction, forming a multi-period slow-wave structure.
[0007] In one exemplary embodiment, the cross-sectional shape of the pressure head in the horizontal direction is configured to be the same as at least half a cycle shape of the multi-cycle structure.
[0008] In one exemplary embodiment, the adjustment mechanism includes a first adjustment unit and a second adjustment unit, with the part placed on the second adjustment unit; the second adjustment unit is configured to adjust the orientation of the surface of the part; the second adjustment unit is mounted on the first adjustment unit, and the first adjustment unit is configured to drive the second adjustment unit to move, thereby adjusting the vertical height of the part and its position in a plane perpendicular to the vertical direction.
[0009] In one exemplary embodiment, the first adjustment unit includes a first platform, a second platform, and a third platform; the first platform is fixed to the machine tool and extends along a first direction, the second platform is configured to slide in cooperation with the first platform along the first direction; the second platform extends along a second direction, the third platform is configured to slide in cooperation with the second platform along the second direction; the third platform extends along a vertical direction, and the second adjustment unit is configured to slide in cooperation with the third platform along the vertical direction; the second adjustment unit includes a first leveling component and a second leveling component, the first leveling component being rotatable about the first direction as an axis, and the second leveling component being rotatable about the second direction as an axis; the first direction, the second direction, and the vertical direction are perpendicular to each other.
[0010] In an exemplary embodiment, the adjustment mechanism further includes a support unit mounted on the second adjustment unit. The support unit includes: a base with a receiving groove for placing the part; and a limiting member located on the base, with at least a portion suspended above the receiving groove to restrict the movement of the part in the vertical direction.
[0011] In one exemplary embodiment, an auxiliary mechanism is also included, which is suitable for smoothing the surface of the aforementioned parts.
[0012] In one exemplary embodiment, a detection mechanism is also included, suitable for detecting the geometric parameters of multi-period structural parts.
[0013] This disclosure also provides a method for processing a slow-wave structure, comprising: placing the part on the adjustment mechanism and adjusting its posture by the adjustment mechanism;
[0014] The pressure head of the aforementioned processing mechanism presses the part vertically downward to form an indentation; after the previous indentation is formed, the adjustment mechanism adjusts the position of the part accordingly to facilitate the formation of the next indentation and obtain a multi-period slow wave structure.
[0015] In an exemplary embodiment, placing the part on the adjustment mechanism and having its posture adjusted by the adjustment mechanism includes: placing the part in the receiving groove of the base and fixing it using the limiting member; sequentially controlling the first platform, the second platform, and the third platform to adjust the position of the part; and sequentially controlling the first leveling component and the second leveling component to adjust the surface orientation of the part.
[0016] In one exemplary embodiment, after a multi-period structure is formed on the surface of the part, a protective layer is injected into the indentation. The melting point of the protective layer is lower than that of the part. After the protective layer is formed, the auxiliary mechanism smooths the surface of the part. After smoothing, the protective layer is removed and the indentation surface is cleaned. The multi-period structure part is inspected by the inspection mechanism. If it does not meet the usage requirements, the formed indentation is removed and returned to the adjustment mechanism. After adjusting its posture, the indentation is re-processed.
[0017] According to the above-described embodiments of the present disclosure, the processing apparatus and method for slow-wave structures are as follows: before processing, the part is placed on the adjustment mechanism, and the spatial position and surface orientation of the part are adjusted by the adjustment mechanism; the pressure head of the processing mechanism moves back and forth in the vertical direction while cooperating with the adjustment mechanism to form indentations arranged in a preset direction on the surface of the part, so as to form a multi-period structure part; the processed surfaces of two multi-period structure parts that are mirror images of each other are joined together to form a slow-wave structure element. Attached Figure Description
[0018] The foregoing contents, as well as other objects, features, and advantages of this disclosure, will become clearer from the following description of embodiments with reference to the accompanying drawings, in which:
[0019] Figure 1 This is a three-dimensional schematic diagram of the processing apparatus for slow-wave structures provided in this disclosure;
[0020] Figure 2 This is a three-dimensional schematic diagram of the adjustment mechanism in an embodiment of this disclosure;
[0021] Figure 3 This is a three-dimensional schematic diagram of the carrier unit in an embodiment of this disclosure;
[0022] Figure 4 This is a schematic diagram of the rectangular cross-section processing in an embodiment of this disclosure;
[0023] Figure 5 This is a three-dimensional structural view of the rectangular interlaced double grid component in an embodiment of this disclosure;
[0024] Figure 6 This is a three-dimensional view of the rectangular cross-section indenter in an embodiment of this disclosure;
[0025] Figure 7 This is a schematic diagram of the elliptical cross-section processing in an embodiment of this disclosure;
[0026] Figure 8 This is a schematic diagram of the S-shaped cross-section processing in an embodiment of this disclosure;
[0027] Figure 9 This is a flowchart of the slow-wave structure processing method provided in this disclosure.
[0028] The meanings of the reference numerals in the above figures are as follows:
[0029] 1. Machine tool;
[0030] 2. Adjust the organizational structure;
[0031] 21. First adjustment unit;
[0032] 211. The First Platform;
[0033] 212. Second platform;
[0034] 213. The third platform;
[0035] 22. Second adjustment unit;
[0036] 221. First leveling component;
[0037] 222. Second leveling component;
[0038] 23. Bearing unit;
[0039] 231. Base;
[0040] 232. Limiting components;
[0041] 3. Processing mechanism;
[0042] 31. Pressure head. Detailed Implementation
[0043] To make the objectives, technical solutions, and advantages of this disclosure clearer, the following detailed description is provided in conjunction with specific embodiments and the accompanying drawings. The terminology used herein is merely for describing the specific embodiments and is not intended to limit the scope of this disclosure.
[0044] The terms “comprising,” “including,” etc., as used herein indicate the presence of the described features, steps, operations, and / or components, but do not preclude the presence or addition of one or more other features, steps, operations, or components. All terms used herein, including technical and scientific terms, have the meanings commonly understood by those skilled in the art, unless otherwise defined. It should be noted that the terms used herein are to be interpreted in a manner consistent with the context of this specification and not in an idealized or overly rigid way.
[0045] In this document, unless otherwise specified, directional terms such as “up,” “down,” “left,” “right,” “inner,” and “outer” are used to indicate orientation or positional relationships based on the accompanying drawings, and are used only for the convenience of describing this disclosure, and are not intended to indicate or imply that the device, element, or assembly referred to must have a specific orientation, or be constructed or operated in a specific orientation. It should be understood that when the absolute position of the described object changes, the relative positional relationships they represent may also change accordingly. Therefore, these directional terms should not be construed as limitations on this disclosure.
[0046] When using expressions such as "at least one of A, B, and C," the meaning should generally be interpreted according to the understanding of someone skilled in the art. For example, "a system having at least one of A, B, and C" should include, but is not limited to, systems having A alone, having B alone, having C alone, having A and B, having A and C, having B and C, and / or having A, B, and C. Similarly, when using expressions such as "at least one of A, B, or C," the meaning should generally be interpreted according to the understanding of someone skilled in the art. For example, "a system having at least one of A, B, or C" should include, but is not limited to, systems having A alone, having B alone, having C alone, having A and B, having A and C, having B and C, and / or having A, B, and C.
[0047] Figure 1 This is a three-dimensional structural diagram of the processing apparatus for slow-wave structures provided in this disclosure.
[0048] An exemplary embodiment of this disclosure provides a processing apparatus for slow-wave structures, such as Figure 1 As shown, the system includes a machine base 1, an adjustment mechanism 2, and a processing mechanism 3. The adjustment mechanism 2 is mounted on the machine base 1 and is used to support the part and adjust its orientation. The processing mechanism 3 is mounted on the machine base 1 and located above the adjustment mechanism. The processing mechanism 3 includes a pressure head 31, which is configured to move vertically to form indentations on the surface of the part. The adjustment mechanism 2 is configured to adjust the position of the part along a preset direction each time the pressure head 31 forms an indentation on the surface of the part, so that the surface of the part has multiple indentations spaced apart along the preset direction, forming a multi-period slow-wave structure.
[0049] In this implementation, the part is placed on the adjustment mechanism 2 before processing, and the adjustment mechanism 2 adjusts the spatial position and surface orientation of the part. The pressure head 31 of the processing mechanism 3 moves back and forth in the vertical direction while cooperating with the adjustment mechanism 2 to form indentations on the surface of the part arranged at intervals along a preset direction, so as to form a multi-period slow-wave structure part. The processed surfaces of two multi-period structure parts are joined together to form a slow-wave structure element. Based on the processing method of this processing device, compared with the traditional high-speed milling of slow-wave structures, it is not affected by the milling cutter diameter on the milling cutter stiffness, and can achieve higher processing accuracy. Compared with existing EDM, DRIE (Deep Reactive Ion Etching), LIGA (Laser Interference Grooving and Ablation), UV-LIGA (Ultraviolet-LIGA) and other processing technologies, it effectively reduces processing costs and improves processing efficiency, making it suitable for large-scale promotion and use.
[0050] In some embodiments, the processing mechanism 3 further includes a pressure actuation unit and an ultrasonic generator. The pressure actuation unit is adapted to drive the pressure head 31 to press down and lift up, and the ultrasonic generator assists the pressure head 31 in squeezing the part, thereby improving the efficiency of the indentation process.
[0051] In one exemplary embodiment, the cross-sectional shape of the pressure head 31 in the horizontal direction is configured to be the same as the shape of at least half a cycle of the multi-cycle structure.
[0052] Specifically, with Figure 5 Taking the rectangular cross-section of the staggered double-grid structure shown as an example, the horizontal cross-section of the pressure head 31 is also rectangular, according to... Figure 4 The rectangular cross-section machining diagram shown is used for indentation machining, wherein the structure of the indenter 31 is as follows: Figure 6 The three-dimensional structure of the rectangular cross-section indenter is shown in the figure. The length and width of the rectangle in the horizontal cross-section are both a, a = 0.18 mm. The length of the indenter 31 in the vertical direction is b, b = 0.6 mm. The diameter of the milling cutter used in traditional high-speed milling is generally no more than 50 nm. Therefore, when using the indenter 31 to process the staggered double grid structure, the indenter 31 has higher rigidity and longer service life while meeting the processing requirements. On the other hand, when it is necessary to further improve the processing accuracy, the indenter 31 has more room for volume reduction.
[0053] Figure 7 This is a schematic diagram of the elliptical cross-section processing in an embodiment of this disclosure.
[0054] Figure 8 This is a schematic diagram of the S-shaped cross-section processing in an embodiment of this disclosure.
[0055] It should be noted that the horizontal cross-sectional shape of the pressure head 31 is, but is not limited to, a rectangle, to meet the requirements of a multi-period structure. For example... Figure 7 and Figure 8 As shown, the corresponding horizontal cross-sections are elliptical and S-shaped.
[0056] In some other embodiments, the horizontal cross-section of the pressure head 31 near the part is larger than the horizontal cross-section of the other end of the pressure head 31 body. This arrangement makes it easier for the pressure head 31 to come out of the indentation after the indentation is formed.
[0057] Figure 2 This is a three-dimensional schematic diagram of the adjustment mechanism in an embodiment of this disclosure.
[0058] In one exemplary embodiment, such as Figure 2 As shown, the adjustment mechanism 2 includes a first adjustment unit 21 and a second adjustment unit 22, with the part placed on the second adjustment unit 22. The second adjustment unit 22 is configured to adjust the orientation of the part's surface; the second adjustment unit 22 is mounted on the first adjustment unit 21, and the first adjustment unit 21 is configured to drive the second adjustment unit 22 to move, thereby adjusting the part's vertical height and its position in a plane perpendicular to the vertical direction.
[0059] In this implementation, the adjustment mechanism 2 is divided into two parts. The first adjustment unit 21 is used to adjust the vertical height of the part and its position in a plane perpendicular to the vertical direction. In other words, the first adjustment unit 21 can move the part along the x-axis, y-axis, and z-axis of the spatial coordinate system. The second adjustment unit 22 is used to adjust the surface orientation of the part. In other words, the second adjustment unit 22 can make the part rotate around the x-axis or y-axis. The independent adjustment of multiple angles and directions can make the positioning of the part more accurate and improve the machining accuracy to a certain extent.
[0060] According to embodiments of this disclosure, the first adjustment unit 21 includes a first platform 211, a second platform 212, and a third platform 213. The first platform 211 is fixedly mounted on the machine base 1 and extends along a first direction. The second platform 212 is configured to slide in conjunction with the first platform 211 along the first direction. The second platform 212 extends along a second direction, and the third platform 213 is configured to slide in conjunction with the second platform 212 along the second direction. The third platform 213 extends vertically, and the second adjustment unit 22 is configured to slide in conjunction with the third platform 213 along the vertical direction. The second adjustment unit 22 includes a first leveling component 221 and a second leveling component 222. The first leveling component 221 is rotatable about the first direction, and the second leveling component 222 is rotatable about the second direction. It should be noted that the first direction, the second direction, and the vertical direction are perpendicular to each other.
[0061] In this embodiment, the first platform 211 is fixed on the machine base 1, and the position of the part is adjusted by sliding the second platform 212, the third platform 213 and the second adjustment unit 22; the orientation of the surface of the part is adjusted by rotating the first leveling component 221 and the second leveling component 222.
[0062] In some other embodiments, a control system is also included, which can coordinate the control of the adjustment mechanism 2 and the processing mechanism 3. For example, when the pressure head 31 of the processing mechanism 3 is raised, the adjustment mechanism 2 is driven to change the position of the part, and then the pressure head 31 is driven to press down, so as to ultimately form a multi-periodic structure on the surface of the part.
[0063] Figure 3 This is a three-dimensional schematic diagram of the carrier unit in an embodiment of this disclosure.
[0064] In one exemplary embodiment, such as Figure 3 As shown, the adjustment mechanism 2 also includes a support unit 23 mounted on the second adjustment unit 22. The support unit 23 includes a base 231 and a limiting member 232. The base 231 is provided with a receiving groove for placing parts; the limiting member 232 is located on the base 231 and is configured such that at least a portion of it is suspended above the receiving groove to restrict the movement of the parts in the vertical direction.
[0065] More specifically, the limiting member 232 includes a pressure strip and a fastening screw. A portion of the pressure strip is located outside the receiving groove of the base 231, and the other portion is suspended above the receiving groove. The pressure strip is fixed to the base 231 by the fastening screw. In use, the part is first placed in the receiving groove, and then the pressure strip is fixed by the fastening screw.
[0066] In some embodiments, to facilitate the placement and removal of parts, the receiving groove is constructed as a long strip that extends through the surface of the base 231. To prevent the parts from moving in the extending direction of the receiving groove, the stress between the fastening screw and the pressure strip can be appropriately increased to increase the friction between the parts and the bottom wall of the receiving groove, thereby preventing movement.
[0067] In one exemplary embodiment, the processing apparatus for the slow-wave structure further includes an auxiliary mechanism suitable for smoothing the surface of the part.
[0068] For example, auxiliary mechanisms include, but are not limited to, high-speed milling machines or slow wire EDM machines, which are suitable for fine-tuning the surface of parts and the sidewalls of multi-period structures formed by machining, in order to meet usage requirements.
[0069] In one exemplary embodiment, a detection mechanism is also included, suitable for detecting the geometric parameters of multi-period structural parts.
[0070] In such an implementation, the inspection mechanism includes an image measuring instrument suitable for measuring the geometric parameters of multi-cycle structural parts, wherein the geometric parameters include, but are not limited to, slow wave linewidth, slow wave lineheight, and other related parameters.
[0071] Figure 9 This is a flowchart of the slow-wave structure processing method provided in this disclosure.
[0072] This disclosure also provides a method for fabricating slow-wave structures, such as Figure 9 As shown, processing is performed based on the processing apparatus in any of the above embodiments, and the method includes the following steps S1-S6.
[0073] Step S1: Place the part on the adjustment mechanism 2 and adjust its posture by the adjustment mechanism 2.
[0074] Step S2: Control the pressure head 31 of the processing mechanism 3 to press the part vertically downward and form an indentation on its surface; after the previous indentation is formed, the adjustment mechanism 2 adjusts the position of the part along the preset direction so as to form the next indentation and obtain a multi-cycle slow wave structure.
[0075] Step S3: Inject a protective layer into the indentation. The melting point of this protective layer is lower than that of the part.
[0076] Step S4: After the protective layer is formed, the surface of the part is smoothed by an auxiliary mechanism.
[0077] Step S5: After smoothing, remove the protective layer and clean the surface of the indentation.
[0078] Step S6: Use the inspection mechanism to inspect the geometric parameters of the processed multi-cycle structural parts. If they do not meet the requirements, remove the formed indentations and put them back into the adjustment mechanism 2. Then, execute steps S1-S6 in sequence.
[0079] In this implementation, the purpose of injecting a protective layer into the indentation is to protect the indentation structure and prevent damage during the leveling process. To facilitate subsequent removal, the melting point of the protective layer should preferably be lower than that of the part. The material of the protective layer is preferably an alloy or an organic material, which can protect the part body to the greatest extent.
[0080] According to embodiments of this disclosure, placing the part on the adjustment mechanism 2 and adjusting its posture by the adjustment mechanism 2 specifically includes S11-S13.
[0081] Step S11: Place the part in the receiving groove of the base 231 and fix it with the limiting member 232.
[0082] Step S12: Adjust the position of the part by sliding the second platform 212, the third platform 213 and the second adjustment unit 22 in sequence.
[0083] Step S13: Rotate the first leveling component 221 and the second leveling component 222 in sequence to adjust the surface orientation of the part.
[0084] Those skilled in the art will understand that the features described in the various embodiments and / or claims of this disclosure can be combined or combined in various ways, even if such combinations or combinations are not explicitly described in this disclosure. In particular, the features described in the various embodiments and / or claims of this disclosure can be combined or combined in various ways without departing from the spirit and teachings of this disclosure. All such combinations and / or combinations fall within the scope of this disclosure.
[0085] The embodiments of this disclosure have been described above. However, these embodiments are for illustrative purposes only and are not intended to limit the scope of this disclosure. Although various embodiments have been described above, this does not mean that the measures in the various embodiments cannot be used advantageously in combination. The scope of this disclosure is defined by the appended claims and their equivalents. Various substitutions and modifications can be made by those skilled in the art without departing from the scope of this disclosure, and all such substitutions and modifications should fall within the scope of this disclosure.
Claims
1. A method for fabricating slow-wave structures, characterized in that, Based on a processing apparatus for slow-wave structures, the processing apparatus includes: Machine (1); Adjustment mechanism (2), installed on the machine base (1), is used to carry the parts and adjust the posture of the parts; The processing mechanism (3) is installed on the machine base (1) and located above the adjustment mechanism; The processing mechanism (3) includes a pressure head (31) configured to move vertically to form an indentation on the surface of the part; The adjustment mechanism (2) is configured to adjust the position of the part in a preset direction whenever the pressure head (31) forms an indentation on the surface of the part, so that the surface of the part has multiple indentations spaced apart along the preset direction, forming a multi-period slow wave structure; The slow-wave structure processing method includes: The part is placed on the adjustment mechanism (2) and its posture is adjusted by the adjustment mechanism (2); The pressure head (31) of the processing mechanism (3) is controlled to press the part vertically downward to form an indentation; after the previous indentation is formed, the adjustment mechanism (2) adjusts the position of the part accordingly so as to form the next indentation and obtain a multi-period slow wave structure.
2. The slow-wave structure processing method according to claim 1, characterized in that, The cross-sectional shape of the pressure head (31) in the horizontal direction is configured to be the same as at least half a cycle shape of the multi-cycle slow wave structure.
3. The slow-wave structure processing method according to claim 1, characterized in that, The adjustment mechanism (2) includes a first adjustment unit (21) and a second adjustment unit (22), and the part is placed on the second adjustment unit (22); The second adjustment unit (22) is configured to adjust the orientation of the surface of the part; The second adjustment unit (22) is mounted on the first adjustment unit (21), and the first adjustment unit (21) is configured to drive the second adjustment unit (22) to move in order to adjust the position height of the part in the vertical direction and its position in a plane perpendicular to the vertical direction.
4. The slow-wave structure processing method according to claim 3, characterized in that, The first adjustment unit (21) includes a first platform (211), a second platform (212) and a third platform (213); The first platform (211) is fixed to the machine base (1) and extends along a first direction, and the second platform (212) is configured to slide in cooperation with the first platform (211) along the first direction; The second platform (212) extends along a second direction, and the third platform (213) is configured to slide in conjunction with the second platform (212) along the second direction; The third platform (213) extends vertically, and the second adjustment unit (22) is configured to slide in conjunction with the third platform (213) in the vertical direction. The second adjustment unit (22) includes a first leveling component (221) and a second leveling component (222). The first leveling component (221) is rotatable about a first direction, and the second leveling component (222) is rotatable about a second direction. The first direction, the second direction, and the vertical direction are perpendicular to each other.
5. The slow-wave structure processing method according to claim 4, characterized in that, The adjustment mechanism (2) further includes a support unit (23) mounted on the second adjustment unit (22), the support unit (23) comprising: A base (231) is provided with a receiving groove for placing the part; A limiting member (232) is located on the base (231) and at least a portion of it is suspended above the receiving groove to restrict the movement of the part in the vertical direction.
6. The slow-wave structure processing method according to claim 1, characterized in that, It also includes auxiliary mechanisms suitable for smoothing the surface of the parts.
7. The slow-wave structure processing method according to claim 6, characterized in that, It also includes a testing facility suitable for testing the geometric parameters of multi-cycle structural parts.
8. The slow-wave structure processing method according to claim 5, characterized in that, Placing the part on the adjustment mechanism (2) and having its posture adjusted by the adjustment mechanism (2) includes: The part is placed in the receiving groove of the base (231) and fixed using the limiting member (232); The first platform (211), the second platform (212), and the third platform (213) are controlled sequentially to adjust the position of the part; The first leveling component (221) and the second leveling component (222) are controlled in sequence to adjust the surface orientation of the part.
9. The slow-wave structure processing method according to claim 7, characterized in that, After forming a multi-periodic structure on the surface of the part A protective layer is injected into the indentation, the melting point of which is lower than that of the part; After the protective layer is formed, the auxiliary mechanism smooths the surface of the part. After smoothing, remove the protective layer and clean the indented surface; The inspection mechanism is used to inspect the processed multi-cycle structural parts. If they do not meet the requirements, the indentations are removed and the parts are returned to the adjustment mechanism (2) to adjust their posture and then reprocess to form indentations.