A chip core side printing mold, a chip core side printing fixture, a preparation method and a method of use

Abstract

This invention discloses a chip core side printing mold, a chip core side printing fixture, a preparation method, and a usage method, comprising: a fixture substrate, the surface of which is provided with multiple fixture through slots, a rubber layer provided on both the front and back sides of the fixture substrate and within the fixture through slots, and a screen printing alignment mark provided on the fixture substrate. The fixture substrate is made of stainless steel. The rubber layer is made of silicone. The chip core side printing mold, chip core side printing fixture, preparation method, and usage method provided by this invention, the side printing fixture is made of a composite of stainless steel and silicone, which can be used to fix the chip core, facilitate chip core loading and unloading, and has a high reusability. It is used for fixing the side lead-out end and the surface lead-out end of the chip core for electrical connection. The fixture has a simple manufacturing process, is reusable, suitable for mass production, and improves efficiency.

Description

Technical Field

[0001] This invention relates to a chip side printing mold, a chip side printing fixture, a preparation method, and a usage method, belonging to the field of integrated circuit chip production technology. Background Technology

[0002] The lead-out ends of the chip core typically include through-holes leading to the surface or leads to the surface from the side. However, through-hole processing is complex, requires multiple printing passes, is difficult to process, and is hard to control. Therefore, many chip cores adopt a side lead-out structure. However, for large-size chip cores, existing side printing processes are relatively complex and unsuitable for side printing manufacturing of large-size chip cores.

[0003] Taking a nitrogen oxide sensor as an example, nitrogen oxide sensors are mainly used to detect nitrogen oxides (NOx) in automobile exhaust. X When the nitrogen oxide content is high, the engine control system receives a feedback signal and injects an appropriate amount of urea to mix with the exhaust gas, reducing nitrogen oxides into harmless N2 and reducing the emission of nitrogen oxide pollutants in the exhaust gas.

[0004] like Figure 1 As shown, the side leads of the nitrogen-oxygen sensor include: auxiliary pump electrode side lead 01, main pump electrode side lead 02, measuring pump electrode side lead 03, reference electrode side lead 04, and temperature sensing wire side lead 05. If existing side-printing methods for small-size chip devices are used to manufacture the side leads of the nitrogen-oxygen sensor, the manufacturing process is complex and inefficient.

[0005] Therefore, how to improve the side printing technology for large-size wafer cores such as nitrogen and oxygen sensors is a technical problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0006] Objective: To overcome the shortcomings of existing technologies, this invention provides a chip core side printing mold, a chip core side printing fixture, a preparation method, and a usage method. For large-size chip cores (nitrogen and oxygen sensors) with electrical connections on the side and surface leads, the chip core side printing fixture is used to fix the chip core, and screen printing technology is used to achieve electrical connections on the surface and sides of the chip core.

[0007] Technical solution: To solve the above technical problems, the technical solution adopted by the present invention is as follows:

[0008] Firstly, a chip core side printing mold includes: a base, a clamping base, and a cover plate.

[0009] The base includes: a base substrate, the surface of which is provided with a base groove, a plurality of protrusions are provided in the base groove, and a fixing pin is also provided on the base substrate.

[0010] The fixture base includes: a fixture base plate, the surface of which is provided with a fixture through groove corresponding to the position of the protrusion, and the surface of which is provided with a fixture through hole corresponding to the position of the fixing pin. A screen-printed alignment mark is also provided on the fixture base plate. The protrusion can pass through the fixture through groove.

[0011] The cover plate includes: a cover plate base plate, the surface of which is provided with a cover plate groove, and a protrusion groove corresponding to the position of the protrusion is provided in the cover plate groove. The cover plate base plate also has a fixing hole corresponding to the position of the fixing pin. The protrusion can be inserted into the protrusion groove.

[0012] As a preferred embodiment, the base, clamp base, and cover plate are all made of stainless steel.

[0013] As a preferred embodiment, the edge of the base substrate is also provided with a first groove handle.

[0014] As a preferred embodiment, the edge of the cover plate substrate is also provided with a second groove handle.

[0015] Secondly, a wafer core side printing fixture includes: a fixture substrate, the surface of which is provided with a plurality of fixture through slots, a rubber layer is provided on both the front and back sides of the fixture substrate and in the fixture through slots, and a screen printing alignment mark is also provided on the fixture substrate.

[0016] As a preferred embodiment, the fixture base plate is made of stainless steel.

[0017] As a preferred embodiment, the rubber layer is made of silicone.

[0018] Thirdly, a method for preparing a wafer core side printing fixture includes the following steps:

[0019] Step 1: Clean the base, fixture base, and cover plate with alcohol and set aside.

[0020] Step 2: Mix the rubber and curing agent evenly in a certain proportion to obtain a rubber mixture.

[0021] Step 3: Place the fixture base on the base through the fixture through hole and the fixing pin, pass the protrusion through the fixture through groove, inject an appropriate amount of rubber mixture, cover with the cover plate, insert the protrusion into the protrusion groove, and press it firmly.

[0022] Step 4: Place the film core side printing mold in an oven at 60-80℃ and dry for 1-2 hours. Remove the base and cover plate to obtain the fixture base and rubber curing composite, i.e., the film core side printing fixture.

[0023] As a preferred option, the rubber is made of silicone.

[0024] Fourthly, a method for using a film core side printing fixture includes the following steps:

[0025] Step 1: After installing the film core into the clamping slot of the side printing fixture, level it to ensure that the film core is at the same height.

[0026] Step 2: Place the side printing fixture containing the film core on the printing table of the screen printing machine, apply platinum paste, adjust the printing parameters, and complete the platinum paste printing on the side surface of the film core.

[0027] Step 3: Place the side printing fixture containing the film core in an oven and dry it at 60-80℃ for 10-20 minutes before removing it.

[0028] Step 4: Place the reverse side of the side printing fixture containing the film core on the printing table of the screen printing machine, apply platinum paste, adjust the printing parameters, and complete the platinum paste printing on the side surface of the film core.

[0029] Step 5: Place the side printing fixture containing the film core in an oven and dry it at 60-80℃ for 10-20 minutes. Then remove the film core from the side printing fixture.

[0030] Step 6: Place the removed core sheet in a sintering furnace and sinter at 800-1000℃ for 1-3 hours to complete the side connection of the core sheet.

[0031] Beneficial effects: This invention provides a chip core side printing mold, a chip core side printing fixture, a preparation method, and a usage method. The side printing fixture is made of stainless steel and silicone composite material, which can be used to fix the chip core, facilitate chip core loading and unloading, and has a high reusability. It is used to fix the electrical connection between the side lead-out end and the surface lead-out end of the chip core. The fixture has a simple manufacturing process, is reusable, suitable for mass production, and improves efficiency.

[0032] The present invention has the following advantages: 1) It is simple and practical to operate and has low cost; 2) It has high reusability and high production efficiency; 3) The product quality is reliable, it can be mass-produced, and it is suitable for industrial production. Attached Figure Description

[0033] Figure 1 This is a schematic diagram of the front and back structures of the nitrogen and oxygen sensor chip.

[0034] Figure 2 This is a schematic diagram of the base structure of the die for printing on the core.

[0035] Figure 3 This is a schematic diagram of the fixture base structure for the side printing mold of the chip core.

[0036] Figure 4 This is a schematic diagram of the cover plate structure of the die for printing on the core.

[0037] Figure 5 This is a schematic diagram of the structure of the film core side printing fixture.

[0038] Figure 6 This is a schematic diagram of a wafer core side printing fixture structure. Detailed Implementation

[0039] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present invention.

[0040] The present invention will be further described below with reference to specific embodiments.

[0041] In a first aspect, the present invention introduces a core side printing mold, comprising: a base 10, a clamping base 11, and a cover plate 12.

[0042] like Figure 2 As shown, the base 10 includes: a base substrate 101, a base groove 102 is provided on the surface of the base substrate 101, a plurality of protrusions 103 are provided in the base groove 102, and a fixing pin 104 is also provided on the base substrate 101.

[0043] In one embodiment, the protrusions 103 within the base groove 102 are arranged in an array.

[0044] In one embodiment, the fixing pins 104 on the base substrate 101 are evenly arranged on the edge of the base substrate 101.

[0045] Furthermore, the edge of the base substrate 101 is also provided with a first groove handle 105.

[0046] Furthermore, the base 10 is made of stainless steel.

[0047] like Figure 3 As shown, the clamp base 11 includes: a clamp base plate 111, the surface of which is provided with a clamp through groove 112 corresponding to the position of the protrusion 103, and a clamp through hole 113 corresponding to the position of the fixing pin 104. A screen-printed alignment symbol 114 is also provided on the clamp base plate 111. The protrusion 103 can pass through the clamp through groove 112.

[0048] In one embodiment, the screen-printed alignment marks 114 on the fixture substrate 111 are evenly arranged on the edge of the fixture substrate 111.

[0049] Furthermore, the fixture base 11 is made of stainless steel.

[0050] like Figure 4As shown, the cover plate 12 includes: a cover plate base plate 121, the surface of which is provided with a cover plate groove 122, and a protrusion groove 123 corresponding to the position of the protrusion 103 is provided in the cover plate groove 122. The cover plate base plate 121 is also provided with a fixing hole 124 corresponding to the position of the fixing pin 104. The protrusion 103 can be inserted into the protrusion groove 123.

[0051] Furthermore, a second groove handle 125 is provided on the edge of the cover plate substrate 121.

[0052] Furthermore, the cover plate 12 is made of stainless steel.

[0053] Secondly, this invention introduces a wafer core side printing fixture, such as... Figure 5 As shown, it includes: a clamping base plate 111, the surface of which is provided with a plurality of clamping through grooves 112, and rubber layers 115 are provided on both the front and back sides of the clamping base plate 111 and in the clamping through grooves 112. A screen printing alignment symbol 114 is also provided on the clamping base plate 111.

[0054] In one embodiment, the screen-printed alignment marks 114 on the fixture substrate 111 are evenly arranged on the edge of the fixture substrate 111.

[0055] In one embodiment, the clamping slots 112 on the surface of the clamping substrate 111 are arranged in an array.

[0056] In one embodiment, the rubber layer 115 is made of silicone.

[0057] Furthermore, the surface of the fixture substrate 111 is also provided with a fixture through hole 113.

[0058] Furthermore, the fixture base plate 111 is made of stainless steel.

[0059] Furthermore, the thickness of the fixture substrate 111 is 0.5-1.5mm, which is mainly determined according to the width of the core.

[0060] The core side-printing fixture can avoid damage to the core ceramic parts during processing, and has the advantages of simple processing, easy disassembly, and high utilization rate.

[0061] The through hole 113 of the fixture is used to ensure that the side printing fixture after lamination is formed into a composite part with silicone covering the through groove 112 of the fixture. The through groove 112 of the fixture is used to fix the core. The screen printing alignment mark ensures the accuracy of the side printing.

[0062] Silicone has certain elasticity and wear resistance. This fixture is made of stainless steel and silicone composite molding, which can ensure that the ceramic core is undamaged, easy to disassemble, and reusable, making it suitable for mass production.

[0063] Thirdly, this invention introduces a method for preparing a wafer core side printing fixture, comprising the following steps:

[0064] Step 1: Clean the base 10, clamp base 11, and cover plate 12 with alcohol and set aside.

[0065] Step 2: Mix the rubber and curing agent evenly in a certain proportion to obtain a rubber mixture.

[0066] Step 3: Place the fixture base 11 on the base 10 through the fixture through hole 113 and the fixing pin 104. The protrusion 103 passes through the fixture through groove 112 and an appropriate amount of rubber mixture is injected (the amount is adjusted according to the rubber height on the side-printed fixture surface). Cover the cover plate 12, insert the protrusion 103 into the protrusion groove 123 and press it firmly.

[0067] Step 4: Place the film core side printing mold in an oven at 60-80℃ and dry for 1-2 hours. Remove the base 10 and cover plate 12 to obtain the fixture base 11 and the rubber curing molding composite, which is the film core side printing fixture.

[0068] Furthermore, the rubber is made of silicone.

[0069] Fourthly, this invention introduces a method for using a wafer core side printing fixture, comprising the following steps:

[0070] Step 1, as follows Figure 6 As shown, after the core 20 (e.g., a nitrogen-oxygen sensor) is installed into the clamping slot 112 of the side printing fixture, it is leveled to ensure that the cores are at the same height, thus ensuring the screen printing effect and protecting the printing screen.

[0071] Step 2: Using screen printing technology, place the side printing fixture containing the film core on the printing table of the screen printing machine, apply platinum paste, adjust the printing parameters, and complete the printing of platinum paste on the side surface of the film core.

[0072] Step 3: Place the side printing fixture containing the film core in an oven and dry it at 60-80℃ for 10-20 minutes before removing it.

[0073] Step 4: Place the reverse side of the side printing fixture containing the film core on the printing table of the screen printing machine, apply platinum paste, adjust the printing parameters, and complete the platinum paste printing on the side surface of the film core.

[0074] Step 5: Place the side printing fixture containing the film core in an oven and dry it at 60-80℃ for 10-20 minutes. Then remove the film core from the side printing fixture.

[0075] Step 6: Place the removed core sheet in a sintering furnace and sinter at 800-1000℃ for 1-3 hours to complete the side connection of the core sheet.

[0076] Furthermore, it also includes:

[0077] Step 7: Use a multimeter to check the side connection effect of the chip core that has completed the electrical connection between the surface lead and the side lead.

[0078] Furthermore, a leveling machine is used to level the film core on the side printing fixture.

[0079] The above description is only a preferred embodiment of the present invention. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A method for preparing a wafer core side printing fixture, characterized in that: Includes the following steps: Step 1: Clean the base (10), clamp base (11), and cover plate (12) with alcohol and set aside. Step 2: Mix the rubber and curing agent evenly in a certain proportion to obtain a rubber mixture; Step 3: Place the fixture base (11) on the base (10) through the fixture through hole (113) and the fixing pin (104) to cooperate with each other. The protrusion (103) passes through the fixture through groove (112) and injects an appropriate amount of rubber mixture. Cover the cover plate (12), insert the protrusion (103) into the protrusion groove (123) and press it firmly. Step 4: Place the core side printing mold in an oven at 60-80℃ and dry for 1-2 hours. Remove the base (10) and cover plate (12) to obtain the fixture base (11) and rubber curing molding composite, i.e., the core side printing fixture. The core side printing mold includes: a base (10), a clamp base (11), and a cover plate (12). The base (10) includes: a base substrate (101), a base groove (102) is provided on the surface of the base substrate (101), a plurality of protrusions (103) are provided in the base groove (102), and a fixing pin (104) is also provided on the base substrate (101). The clamp base (11) includes: a clamp base plate (111), the surface of the clamp base plate (111) is provided with a clamp through groove (112) corresponding to the position of the protrusion (103), the surface of the clamp base plate (111) is provided with a clamp through hole (113) corresponding to the position of the fixing pin (104), and a screen printing alignment symbol (114) is also provided on the clamp base plate (111); the protrusion (103) can pass through the clamp through groove (112). The cover plate (12) includes: a cover plate base plate (121), the surface of the cover plate base plate (121) is provided with a cover plate groove (122), the cover plate groove (122) is provided with a protrusion groove (123) corresponding to the position of the protrusion (103), and the cover plate base plate (121) is also provided with a fixing hole (124) corresponding to the position of the fixing pin (104); the protrusion (103) can be inserted into the protrusion groove (123).

2. The method for preparing a wafer core side printing fixture according to claim 1, characterized in that: The rubber is made of silicone.

3. The method for preparing a wafer core side printing fixture according to claim 1, characterized in that: The base (10), clamp base (11) and cover plate (12) are all made of stainless steel.

4. The method for preparing a wafer core side printing fixture according to claim 1, characterized in that: The base plate (101) is also provided with a first groove handle (105) on its edge.

5. The method for preparing a wafer core side printing fixture according to claim 1, characterized in that: The edge of the cover plate substrate (121) is also provided with a second groove handle (125).

Images