An equidistant stick device and method

Abstract

The present application relates to a kind of equidistance stick device and method, device includes two equidistance module, for forming several equidistance distribution lower receiving site;Frame assembly, including outer frame, one side in its inside is equipped with several first upper slide block by longitudinal guide rail, the other side in outer frame is equipped with transverse movable plate, and several second upper slide block are equipped on the movable plate by longitudinal guide rail, each upper slide block is equipped with first upper positioning member and side receiving surface, and one side of side receiving surface is equipped with upper spacer;First upper slide block and second upper slide block side receiving surface correspond to form several side receiving sites, and it is one-to-one with the lower receiving site;Frame assembly can be docked with equidistance module, so that side receiving site and lower receiving site are one-to-one and are connected to form several bearing parts;Longitudinal close mechanism is used to move silicon block, so that the side of silicon block in each bearing part is closely attached to the upper spacer and lower spacer of the bearing part.The present application makes the silicon block to be sticked realize automatic equidistance distribution, facilitate subsequent automatic stick operation, and reduce subsequent cutting loss.

Description

Technical Field

[0001] This invention relates to the field of single-crystal silicon rod bonding technology, and in particular to an equidistant rod bonding device and method. Background Technology

[0002] In the field of solar cell processing, monocrystalline silicon rods are typically first squared into square rods, and then the square rods are processed into monocrystalline silicon wafers. Squaring monocrystalline silicon rods produces a large number of thin or short silicon blocks. Currently, to reduce costs and increase efficiency, these thin or short silicon blocks are spliced ​​together to form silicon block assemblies, then bonded together, and finally sliced, achieving secondary utilization of the scraps from the squaring process. In the process of forming silicon block assemblies, small silicon blocks need to be spliced ​​together, and a certain gap needs to be maintained between adjacent silicon blocks to facilitate subsequent slicing operations. Furthermore, to reduce manual wire mesh adjustments during subsequent slicing, the spacing between silicon blocks needs to be controlled to be as equal as possible during bonding, thereby reducing waste of thick wafers during slicing. For this purpose, equidistant tooling, such as a pressure block with equidistant spacers, can be used to manually arrange the silicon blocks at equal intervals. However, this method is inefficient and cannot meet the requirements of large-scale production. Summary of the Invention

[0003] To address the shortcomings of existing technologies, this invention provides an equidistant rod-sticking device and method, which aims to enable the silicon blocks to be glued to be automatically and equidistantly distributed, facilitating subsequent automatic rod-sticking operations and reducing cutting losses in the subsequent slicing process.

[0004] The technical solution adopted in this invention is as follows:

[0005] An equidistant sticking device includes a frame, a base plate on the frame, and two equidistant modules on the base plate. Each equidistant module includes several equally spaced lower sliders. Each lower slider has a first lower positioning part and a lower receiving surface. A lower partition is provided on one side of the lower receiving surface. The lower sliders of the two equidistant modules correspond one-to-one and form several lower receiving positions through the lower receiving surface.

[0006] It also includes a frame assembly, which includes an outer frame. On one side of the outer frame, a plurality of first upper sliders are provided via longitudinal guide rails. On the other side of the outer frame, a transverse movable plate is provided, on which a plurality of second upper sliders are provided via longitudinal guide rails. Each upper slider is provided with a first upper positioning element and a side bearing surface. An upper partition is provided on one side of the side bearing surface. The first upper sliders and the second upper sliders correspond one-to-one and form a plurality of side bearing positions through the side bearing surfaces, which correspond one-to-one with the lower bearing positions.

[0007] A pressure plate is mounted on the second upper slider via a mounting surface. The outer surface of the pressure plate forms the side bearing surface of the second upper slider and can move towards or away from the mounting surface.

[0008] The frame is equipped with a drive assembly for driving the transverse movable plate to move toward or away from the first upper slider.

[0009] The bottom of the outer frame is provided with a second upper positioning member, and the top of the equidistant module is provided with a second lower positioning part for cooperating with the second upper positioning member to dock the equidistant module with the frame assembly. During docking, the first lower positioning part cooperates with the first upper positioning member to make the side receiving position dock with the lower receiving position one by one, forming a number of bearing parts. Each bearing part is used to support a silicon block to be glued. The frame assembly can be separated from the equidistant module and transferred.

[0010] The substrate is also provided with a longitudinal clamping mechanism between the two equidistant modules, which is used to move the silicon block so that the side of the silicon block in each carrier part is in close contact with the upper and lower partitions of the carrier part.

[0011] The further technical solution is as follows:

[0012] The longitudinal clamping mechanism comprises a telescopic cylinder, a first lead screw support, a first slide rail, a rotating shaft, a lever, a second lead screw support, a second slide rail, and a rotary cylinder, wherein:

[0013] The output end of the telescopic cylinder is fixedly connected to the first lead screw support, and the first lead screw support is slidably mounted on the first slide rail.

[0014] One end of the rotating shaft is engaged with the first lead screw support, and the other end is connected to the output end of the rotary cylinder through the second lead screw support to transmit torque. The second lead screw support is slidably mounted on the second slide rail.

[0015] The paddles are evenly spaced on the rotating shaft and can be rotated to a horizontal or vertical position as the shaft rotates. In the vertical position, the paddles can extend into the gap between two adjacent bearing parts.

[0016] The pressure plate moves toward or away from the second upper slider mounting surface under the drive of an active or passive drive mechanism.

[0017] The passive drive mechanism includes a spring element, one end of which is connected to the pressure plate, and the other end of which is connected to the mounting surface of the second upper slider.

[0018] The drive assembly includes a thin cylinder and a motor. The motor is slidably mounted on a slide block. The slide block is connected to the output end of the thin cylinder. The output end of the motor is connected to the first end of a disconnect coupling.

[0019] The outer side of the frame assembly is provided with a belt drive mechanism, which includes at least two pulleys. The pulley axles are connected to a drive screw, which passes through the outer frame. A screw nut screwed onto the drive screw is connected to the transverse movable plate.

[0020] The axle of the pulley at the input end of the belt drive mechanism is connected to the second end of the disconnect coupling. By engaging and disengaging the second end of the disconnect coupling with the first end of the disconnect coupling, the motor and the belt drive mechanism of the frame assembly are connected or disconnected.

[0021] The two ends of the outer frame of the frame component are respectively provided with transverse sliding plates via transverse guide rails, and the two ends of the transverse movable plate are respectively connected to the two transverse sliding plates.

[0022] The frame is also equipped with two push rod cylinders, and the output end of the push rod cylinder is equipped with a push plate. The two push plates are arranged symmetrically.

[0023] The first lower positioning part is a positioning groove, and the first upper positioning member is a first positioning pin that cooperates with the positioning groove; the second upper positioning member is a second positioning pin, and the second lower positioning part is a positioning seat that cooperates with the second positioning pin.

[0024] The present invention also provides a method for attaching rods using the equidistant rod-attaching device, comprising arranging silicon blocks such that the distance between two adjacent silicon blocks is equal, wherein the distance between two adjacent silicon blocks is the distance between the same reference planes on the two silicon blocks, and includes the following steps:

[0025] Activate the equidistant module to distribute the lower support positions equidistantly according to the first longitudinal spacing;

[0026] Place a silicon block to be glued on each of the lower receiving positions, so that the lower receiving surfaces of the two sliding blocks in the lower receiving positions are in contact with the two sides of the bottom surface of the silicon block respectively.

[0027] Move the first upper slider and the second upper slider so that the side bearing positions are evenly distributed according to the first longitudinal spacing. Then move the frame assembly to the equidistant module and dock with it. Through the cooperation of the first lower positioning part and the first upper positioning part, the side bearing positions and the lower bearing positions are docked one by one to form a number of bearing parts.

[0028] Drive the horizontal movable plate to move, causing the second upper slider to move towards the first upper slider. Use the outer surface of the pressure plate to pre-press the end face of each silicon block onto the side bearing surface of the corresponding first upper slider, and make the upper partition extend into the spacer between two adjacent silicon blocks to separate them.

[0029] Activate the longitudinal clamping mechanism to make the sides of each silicon block adhere tightly to the upper and lower spacers of its support portion;

[0030] The horizontal movable plate is driven to move again, causing the second upper slider to continue moving towards the first upper slider. The outer surface of the pressure plate presses the end face of each silicon block onto the side bearing surface of the corresponding first upper slider for a second time. At this time, the two side bearing surfaces of the side bearing position clamp the silicon block from both ends.

[0031] The equidistant module is activated so that the lower receiving positions are equidistantly distributed according to the second longitudinal spacing, which is smaller than the first longitudinal spacing, thus completing the equidistant arrangement of the silicon blocks.

[0032] It also includes an automatic sticky stick:

[0033] Remove the frame components from the equidistant modules, transfer the equidistantly arranged silicon blocks to the crystal holder with adhesive on the top surface, bond the bottom surface of each silicon block to the adhesive layer, and then hold the pressure for a period of time to complete the bonding process.

[0034] The further technical solution is as follows:

[0035] The longitudinal clamping mechanism includes several levers that can rotate synchronously and move linearly.

[0036] The lever first rotates to a vertical position and extends between two adjacent silicon blocks; then it moves in a straight line, pushing the silicon blocks so that their sides are pressed against the upper and lower spacers of the support; finally, it rotates to a horizontal position and exits between two adjacent silicon blocks.

[0037] The beneficial effects of this invention are as follows:

[0038] This invention utilizes equidistant modules to achieve equidistant distribution of the support components, thus achieving "preliminary equidism" of the silicon blocks. Then, a longitudinal clamping mechanism presses the sides of the silicon blocks against spacers, achieving "secondary equidism." After "secondary equidism," the reference surfaces (sides) of each silicon block are pressed against the spacers, and the spacers are then equidistantly arranged with the sliders, thereby achieving true equidistant arrangement of the silicon blocks and improving equidistant accuracy. The moving frame assembly directly attaches the equidistantly distributed silicon block groups to the wafers. During subsequent slicing, the equidistant distribution of the silicon blocks significantly reduces manual wireline adjustment operations, saving time and effectively reducing waste of thick wafers and lowering cutting losses.

[0039] The longitudinal clamping mechanism of this invention has a reasonable structural design and is easy to operate. The lever rotates with the shaft and is in a vertical state when in use, and in a horizontal state when not in use. It does not occupy space and does not affect the arrangement of silicon blocks.

[0040] The side bearing surface of the second upper slider of the present invention is set on a movable pressure plate. During the equidistant arrangement process, the action of the pressure plate can perform pre-pressing and clamping actions in sequence, which facilitates longitudinal approach by using the longitudinal clamping mechanism in the middle, and improves the precision and flexibility of silicon block clamping operation.

[0041] The frame assembly of the present invention can be docked with or separated from the equidistant module. After the silicon blocks are arranged at equal intervals, the end faces at both ends are clamped by the first upper slider and the second upper slider, respectively. Then, the frame assembly can be moved away as a whole to achieve automatic sticking. The equidistant state is maintained during the sticking process. No additional positioning fixtures or manual operation are required, which is highly efficient.

[0042] Other features and advantages of the invention will be set forth in the following description or may be learned by practicing the invention. Attached Figure Description

[0043] Figure 1 This is a three-dimensional structural diagram of the device according to an embodiment of the present invention.

[0044] Figure 2 This is a schematic diagram of the frame assembly of the device according to an embodiment of the present invention.

[0045] Figure 3 This is a schematic diagram of the installation structure of the equidistant module of the device according to an embodiment of the present invention.

[0046] Figure 4 This is a schematic diagram of the installation structure of the longitudinal clamping mechanism of the device according to an embodiment of the present invention.

[0047] Figure 5 This is a schematic diagram of the structure of the frame component and the equidistant module in the pre-dock state during step (3) of the method in an embodiment of the present invention.

[0048] Figure 6 This is a schematic diagram of the state of the device after the silicon blocks are arranged at equal intervals in step (7) of the method of this embodiment of the invention.

[0049] Figure 7 This is a schematic diagram illustrating the principle of equidistant arrangement of silicon blocks using the method of this embodiment of the invention.

[0050] In the diagram: 1. Substrate; 2. Equidistant module; 3. Frame assembly; 4. Longitudinal clamping mechanism; 5. Frame; 6. Push plate; 7. Push rod cylinder; 8. Thin cylinder; 9. Motor; 10. Second lower positioning part; 11. Lower slider; 12. First end of the broken coupling; 13. Silicon block; 14. Slide block; 31. Pressure plate; 32. Second upper slider; 33. Transverse movable plate; 34. Second end of the broken coupling; 35. First upper slider; 36. Upper partition; 37. Pulley; 38. 39. Lead screw; 40. Lead screw nut; 41. Rotary cylinder; 42. Second lead screw support; 43. Rotating shaft; 44. Second slide rail; 45. Paddle; 46. First lead screw support; 47. First slide rail; 49. Telescopic cylinder; 111. First lower positioning part; 112. Lower bearing surface; 113. Lower partition; 310. Outer frame; 311. Longitudinal guide rail; 312. Transverse guide rail; 313. Transverse sliding plate; 314. Second upper positioning component; 315. First upper positioning component. Detailed Implementation

[0051] The specific embodiments of the present invention are described below with reference to the accompanying drawings.

[0052] like Figures 1 to 3 As shown, the equidistant sticking device of this embodiment includes a frame 5, a base plate 1 on the frame 5, and two equidistant modules 2 on the base plate 1. Each equidistant module 2 includes several equally spaced lower sliders 11. The lower sliders 11 are provided with a first lower positioning part 111 and a lower receiving surface 112. A lower partition 113 is provided on one side of the lower receiving surface 112. The lower sliders 11 of the two equidistant modules 2 correspond one-to-one and form several lower receiving positions through the lower receiving surface 112.

[0053] It also includes a frame assembly 3, which includes an outer frame 310. On one side of the outer frame 310, a plurality of first upper sliders 35 are provided via a longitudinal guide rail 311. On the other side of the outer frame 310, a transverse movable plate 33 is provided, on which a plurality of second upper sliders 32 are provided via a longitudinal guide rail 311. Each upper slider is provided with a first upper positioning member 315 and a side bearing surface. An upper partition 36 is provided on one side of the side bearing surface. The first upper sliders 35 and the second upper sliders 32 correspond one-to-one and form a plurality of side bearing positions through the side bearing surfaces. The side bearing positions correspond one-to-one with the lower bearing positions.

[0054] A pressure plate 31 is mounted on the second upper slider 32 via a mounting surface. The outer surface of the pressure plate 31 forms the side bearing surface of the second upper slider 32 and can move towards or away from the mounting surface.

[0055] The frame 5 is equipped with a drive assembly for driving the transverse movable plate 33 to move toward or away from the first upper slider 35;

[0056] The bottom of the outer frame 310 is provided with a second upper positioning member 314, and the top of the equidistant module 2 is provided with a second lower positioning part 10 for cooperating with the second upper positioning member 314 to dock the equidistant module 2 with the frame assembly 3. After docking, the first lower positioning part 111 cooperates with the first upper positioning member 315 to make the side receiving position and the lower receiving position dock one by one to form a number of bearing parts. Each bearing part is used to carry a silicon block to be bonded. The frame assembly 3 can be separated from the equidistant module 2 and transferred.

[0057] A longitudinal clamping mechanism 4 is also provided on the substrate 1 between the two equidistant modules 2, which is used to move the silicon block so that the side of the silicon block in each carrier part is in close contact with the upper partition 36 and the lower partition 113 of the carrier part.

[0058] The equidistant rod-bonding device in this embodiment utilizes equidistant modules to achieve equidistant distribution of the support components, thereby achieving initial equidistance among the silicon blocks. Then, a longitudinal clamping mechanism presses the sides of the silicon blocks against the spacers, achieving secondary equidistance. After secondary equidistance, the reference surfaces (sides) of each silicon block are pressed against the spacers, and the spacers are then equidistantly arranged with the sliders, thus achieving true equidistant arrangement of the silicon blocks and improving equidistant accuracy. The moving frame assembly directly bonds the equidistantly distributed silicon block group. During subsequent slicing, the equal spacing between the silicon blocks significantly reduces manual wire mesh adjustments and effectively minimizes waste of thick wafers, reducing cutting losses.

[0059] See Figure 2 The pressure plate 31 moves towards or away from the mounting surface of the second upper slider 32 under the drive of either an active or passive drive mechanism. The passive drive mechanism includes a spring, one end of which is connected to the pressure plate 31, and the other end is connected to the mounting surface of the second upper slider 32. It can be understood that the active drive mechanism can specifically employ a linear drive component such as a cylinder, capable of driving the pressure plate 31 to move linearly relative to the mounting surface.

[0060] See Figure 2 The outer frame 310 of the frame component 3 has two transverse slide plates 313 set at both ends through transverse guide rails 312, and the two ends of the transverse movable plate 33 are respectively connected to the two transverse slide plates 313.

[0061] See Figure 2 and Figure 3 The first lower positioning part 111 is specifically a positioning groove, the first upper positioning part 315 is specifically a first positioning pin that cooperates with the positioning groove; the second upper positioning part 314 is specifically a second positioning pin, and the second lower positioning part 10 is specifically a positioning seat that cooperates with the second positioning pin.

[0062] See Figure 4 The longitudinal clamping mechanism 4 includes a telescopic cylinder 49, a first lead screw support 46, a first slide rail 47, a rotating shaft 43, a lever 45, a second lead screw support 42, a second slide rail 44, and a rotary cylinder 41, wherein:

[0063] The output end of the telescopic cylinder 49 is fixedly connected to the first lead screw support 46, and the first lead screw support 46 is slidably mounted on the first slide rail 47.

[0064] One end of the rotating shaft 43 is engaged with the first lead screw support 46, and the other end is connected to the output end of the rotary cylinder 41 through the second lead screw support 42 to transmit torque. The second lead screw support 42 is slidably mounted on the second slide rail 44.

[0065] The paddles 45 are evenly spaced on the rotating shaft 43 and can be rotated to a horizontal or vertical state as the rotating shaft 43 rotates. In the vertical state, the paddles 45 can be inserted into the gap between two adjacent bearing parts.

[0066] Figure 4 The paddle 45 shown is in a horizontal position. Rotating the pivot 43 90° clockwise will turn the paddle 45 to a vertical position.

[0067] See Figure 1 and Figure 5 The drive assembly includes a thin cylinder 8 and a motor 9. The motor 9 is slidably mounted on a slide block 14. The slide block 14 is connected to the output end of the thin cylinder 8. The output end of the motor 9 is connected to the first end 12 of the disconnected coupling.

[0068] The outer side of the frame 310 of the frame assembly 3 is provided with a belt drive mechanism. The belt drive mechanism includes at least two pulleys 37, which are connected by belt drive. The axle of each pulley 37 is connected to the drive screw 38. The drive screw 38 passes through the outer frame 310. The screw nut 39 screwed on the drive screw 38 is connected to the transverse movable plate 33.

[0069] The pulley 37, which serves as the input end of the belt drive mechanism, is connected to the second end 34 of the disconnect coupling. Figure 2 As shown, the thin cylinder 8 drives the motor 9 to move with the slide 14, and the second end 34 of the disconnect coupling engages or disengages with the first end 12 of the disconnect coupling, thereby connecting or disconnecting the motor 9 from the belt drive mechanism of the frame assembly 3.

[0070] This embodiment also provides a method for sticking the rod using the equidistant sticking device, including:

[0071] I. Silicon Block Layout: Silicon block layout is used to ensure that the distance between two adjacent silicon blocks is equal. The distance between two adjacent silicon blocks is the distance between the same reference planes on the two silicon blocks, and includes the following process:

[0072] (1) Start the equidistant module 2 so that the lower bearing positions formed by the corresponding lower sliders 11 on the two equidistant modules 2 are distributed at equal intervals according to the first longitudinal spacing.

[0073] (2) Place a silicon block to be glued on each of the lower receiving positions, so that the lower receiving surfaces 112 of the two lower sliding blocks 11 in the lower receiving positions contact the two sides of the bottom surface of the silicon block 13 respectively.

[0074] (3) Move the first upper slider 35 and the second upper slider 32 so that the side bearing positions are evenly distributed according to the first longitudinal spacing. Then move the frame assembly 3 to the equidistant module 2 and dock with it. For the direction of movement of the frame assembly 3 during docking, please refer to [link to relevant documentation]. Figure 5As shown by the middle arrow, the first lower positioning part 111 cooperates with the first upper positioning part 315 to make the side bearing position and the lower bearing position connect one by one to form a number of bearing parts.

[0075] (4) Drive the horizontal movable plate 33 to move, drive the second upper slider 32 to move towards the first upper slider 35, use the outer surface of the pressure plate 31 to pre-press the end face of each silicon block 13 onto the side bearing surface of the corresponding first upper slider 35, and make the upper partition 36 extend into the space between two adjacent silicon blocks to separate them.

[0076] (5) Activate the longitudinal clamping mechanism 4 to make the sides of each silicon block 13 adhere to the upper partition 36 and lower partition 113 of its bearing part.

[0077] (6) Drive the horizontal movable plate 33 to move again, and drive the second upper slider 32 to continue moving towards the first upper slider 35. Use the outer surface of the pressure plate 31 to press the end face of each silicon block onto the side bearing surface of the corresponding first upper slider 35 for a second time. At this time, the two side bearing surfaces of the side bearing position clamp the silicon block from both ends.

[0078] (7) Activate the equidistant module 2 so that the lower receiving positions formed by the corresponding lower sliders 11 on the two equidistant modules 2 are distributed at equal intervals according to the second longitudinal spacing, which is smaller than the first longitudinal spacing, thus completing the equidistant arrangement of the silicon blocks 13. The completed state is as follows: Figure 6 As shown;

[0079] 2. Automatic stick bonding, which includes: removing the frame assembly 3 from the equidistant module 2, transferring the equidistantly arranged silicon blocks to the crystal holder with adhesive on the top surface, bonding the bottom surface of each silicon block to the adhesive layer, and then holding the pressure for a period of time to complete the stick bonding.

[0080] The positions of the sides, ends, and bottom of silicon block 13 are shown in the figure. Figure 5 .

[0081] Specifically, step (5) includes: the rotary cylinder 41 is activated, driving the rotating shaft 43 to rotate, and the paddle 45 is flipped to a vertical position and inserted between two adjacent silicon blocks 13; then the telescopic cylinder 49 is activated, driving the rotating shaft 43 to move linearly, and the paddle 45 pushes the silicon block 13 so that its side is pressed against the upper partition 36 and lower partition 113 of the bearing part; finally, the rotary cylinder 41 is activated again, and the paddle 45 is flipped to a horizontal position and withdrawn between two adjacent silicon blocks 13.

[0082] In steps (4) and (6), pre-compression and clamping are performed respectively. During pre-compression, the outer surface of the pressure plate 31 is attached to the end face of the silicon block, and the spring between the pressure plate 31 and the mounting surface of the second upper slider 32 is not compressed or is compressed but not shortened to its shortest state. During clamping, the outer surface of the pressure plate 31 is tightly attached to the end face of the silicon block, and the other end face of the silicon block is tightly attached to the side bearing surface of the first upper slider 35, and the spring between the pressure plate 31 and the mounting surface of the second upper slider 32 is compressed to its shortest state.

[0083] like Figure 1 As shown, the frame 5 is also equipped with two push rod cylinders 7, and the output end of the push rod cylinder 7 is provided with a push plate 6. The two push plates 6 are symmetrically arranged. The push rod cylinder 7 can be specifically used in step (3) to drive the first upper slider 35 and the second upper slider 32 to move, so that the side bearing positions are evenly distributed according to the first longitudinal spacing.

[0084] See Figure 7 In this embodiment, after step (4), the silicon blocks 13 achieve preliminary equidistant spacing, and the arrangement of the silicon blocks 13 is as follows: Figure 4 As shown in (a), the actual spacing M and N between two adjacent silicon blocks are not equal. That is, although the spacing is achieved by using an equidistant mold, the silicon blocks are not in a truly equidistant state because their positions on their bearing positions are not consistent. If the sticking and slicing are performed in this state, uniform slicing cannot be guaranteed, resulting in waste of thick wafers and increased cutting losses. In this embodiment, step (5) uses a longitudinal clamping mechanism to press the sides of the silicon blocks against the spacers (including the lower spacer 113 and the upper spacer 36) to achieve secondary equidistancy. After secondary equidistancy, the reference surface (side) of each silicon block is pressed against the spacer, as shown in (a). Figure 4 As shown in (b), the spacing between each silicon block is L, which enables the silicon block group to achieve true equidistant arrangement, improves the dimensional accuracy of equidistant arrangement, and can greatly reduce manual wire mesh adjustment during subsequent slicing, effectively reduce waste of thick wafers, and reduce cutting losses.

[0085] It will be understood by those skilled in the art that the above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An equidistant adhesive rod device, characterized in that, The system includes a frame (5), on which a base plate (1) is provided. On the base plate (1) are two equidistant modules (2). Each equidistant module (2) includes several equally spaced sliding blocks (11). Each sliding block (11) has a first lower positioning part (111) and a lower receiving surface (112). A lower partition (113) is provided on one side of the lower receiving surface (112). The sliding blocks (11) of the two equidistant modules (2) correspond one-to-one and form several lower receiving positions through the lower receiving surface (112). It also includes a frame assembly (3), which includes an outer frame (310). On one side of the outer frame (310), a plurality of first upper sliders (35) are provided via a longitudinal guide rail (311). On the other side of the outer frame (310), a transverse movable plate (33) is provided, on which a plurality of second upper sliders (32) are provided via a longitudinal guide rail (311). Each upper slider is provided with a first upper positioning element (315) and a side bearing surface. On one side of the side bearing surface, an upper partition (36) is provided. The first upper sliders (35) and the second upper sliders (32) correspond one-to-one and form a plurality of side bearing positions through the side bearing surface, which correspond one-to-one with the lower bearing positions. A pressure plate (31) is mounted on the second upper slider (32) via a mounting surface. The outer surface of the pressure plate (31) forms the side bearing surface of the second upper slider (32) and can move towards or away from the mounting surface. The frame (5) is provided with a drive assembly for driving the transverse movable plate (33) to move toward or away from the first upper slider (35); The bottom of the outer frame (310) is provided with a second upper positioning member (314), and the top of the equidistant module (2) is provided with a second lower positioning part (10) for cooperating with the second upper positioning member (314) to dock the equidistant module (2) with the frame assembly (3). After docking, through the cooperation of the first lower positioning part (111) and the first upper positioning member (315), the side receiving position and the lower receiving position are docked one by one to form a number of bearing parts. Each bearing part is used to carry a silicon block to be glued. The frame assembly (3) can be separated from the equidistant module (2) and transferred. The substrate (1) is also provided with a longitudinal pressing mechanism (4) between two equidistant modules (2), which is used to move the silicon block so that the side of the silicon block in each carrier part is in close contact with the upper partition (36) and lower partition (113) of the carrier part. The longitudinal clamping mechanism (4) comprises a telescopic cylinder (49), a first lead screw support (46), a first slide rail (47), a rotating shaft (43), a lever (45), a second lead screw support (42), a second slide rail (44), and a rotary cylinder (41), wherein: The output end of the telescopic cylinder (49) is fixedly connected to the first lead screw support (46), and the first lead screw support (46) is slidably mounted on the first slide rail (47). One end of the rotating shaft (43) is engaged with the first lead screw support (46), and the other end is connected to the output end of the rotary cylinder (41) through the second lead screw support (42) for torque transmission. The second lead screw support (42) is slidably mounted on the second slide rail (44). The paddles (45) are evenly spaced on the rotating shaft (43) and can be rotated to a horizontal or vertical state as the rotating shaft (43) rotates. In the vertical state, the paddles (45) can extend into the gap between two adjacent bearing parts.

2. The equidistant adhesive rod device according to claim 1, characterized in that, The pressure plate (31) moves toward or away from the mounting surface of the second upper slider (32) under the drive of the active drive mechanism or the passive drive mechanism.

3. The equidistant adhesive rod device according to claim 2, characterized in that, The passive drive mechanism includes a spring element, one end of which is connected to the pressure plate (31), and the other end is connected to the mounting surface of the second upper slider (32).

4. The equidistant adhesive rod device according to claim 1, characterized in that, The drive assembly includes a thin cylinder (8) and a motor (9). The motor (9) is slidably mounted on a slide (14). The slide (14) is connected to the output end of the thin cylinder (8). The output end of the motor (9) is connected to the first end (12) of the disconnected coupling. The outer frame (310) of the frame assembly (3) is provided with a belt drive mechanism. The belt drive mechanism includes at least two pulleys (37). The axle of the pulley (37) is connected to the transmission screw (38). The transmission screw (38) passes through the outer frame (310). The screw nut (39) screwed on the transmission screw (38) is connected to the transverse movable plate (33). The axle of the pulley (37) at the input end of the belt drive mechanism is connected to the second end (34) of the disconnect coupling. Through the engagement and disengagement of the second end (34) of the disconnect coupling with the first end (12) of the disconnect coupling, the motor (9) is connected or disconnected from the belt drive mechanism of the frame assembly (3).

5. The equidistant adhesive rod device according to claim 1, characterized in that, The two ends of the outer frame (310) of the frame component (3) are respectively provided with transverse sliding plates (313) via transverse guide rails (312), and the two ends of the transverse movable plate (33) are respectively connected to the two transverse sliding plates (313).

6. The equidistant adhesive rod device according to claim 1, characterized in that, The frame (5) is also equipped with two push rod cylinders (7), and the output end of the push rod cylinder (7) is provided with a push plate (6), and the two push plates (6) are symmetrically arranged.

7. The equidistant adhesive rod device according to claim 1, characterized in that, The first lower positioning part (111) is a positioning groove, and the first upper positioning member (315) is a first positioning pin that cooperates with the positioning groove; the second upper positioning member (314) is a second positioning pin, and the second lower positioning part (10) is a positioning seat that cooperates with the second positioning pin.

8. A method for sticking a rod using an equidistant sticking device as described in any one of claims 1-7, characterized in that, This includes silicon block arrangement, wherein the silicon block arrangement is used to ensure that the distance between two adjacent silicon blocks is equal, and the distance between two adjacent silicon blocks is the distance between the same reference plane on the two silicon blocks, including the following process: Activate the equidistant module (2) to make the lower bearing positions equidistantly distributed according to the first longitudinal spacing; Place a silicon block to be glued on each of the lower receiving positions, so that the lower receiving surfaces (112) of the two sliding blocks (11) in the lower receiving positions are in contact with the two sides of the bottom surface of the silicon block respectively. Move the first upper slider (35) and the second upper slider (32) so that the side bearing positions are evenly distributed according to the first longitudinal spacing. Then move the frame assembly (3) to the equidistant module (2) and dock with it. Through the cooperation of the first lower positioning part (111) and the first upper positioning part (315), the side bearing positions and the lower bearing positions are docked one by one to form a number of bearing parts. Drive the horizontal movable plate (33) to move, causing the second upper slider (32) to move towards the first upper slider (35). Use the outer surface of the pressure plate (31) to pre-press the end face of each silicon block onto the side bearing surface of the corresponding first upper slider (35), and make the upper partition (36) extend into the space between two adjacent silicon blocks to separate them. Activate the longitudinal clamping mechanism (4) to make the sides of each silicon block adhere to the upper partition (36) and lower partition (113) of its carrier; Drive the horizontal movable plate (33) to move again, causing the second upper slider (32) to continue moving towards the first upper slider (35). Use the outer surface of the pressure plate (31) to press the end face of each silicon block onto the side bearing surface of the corresponding first upper slider (35) for a second time. At this time, the two side bearing surfaces of the side bearing position clamp the silicon block from both ends. Start the equidistant module (2) to make the lower receiving positions equally distributed according to the second longitudinal spacing, the second longitudinal spacing being smaller than the first longitudinal spacing, thus completing the equidistant arrangement of the silicon blocks; It also includes an automatic sticky stick: Remove the frame assembly (3) from the equidistant module (2), transfer the equidistantly arranged silicon blocks to the crystal holder with adhesive on the top surface, bond the bottom surface of each silicon block to the adhesive layer, and then hold the pressure for a period of time to complete the sticking.

9. The sticking method of the equidistant sticking device according to claim 8, characterized in that, The longitudinal clamping mechanism (4) includes several paddles (45) that can rotate synchronously and move linearly. The lever (45) first rotates to a vertical position and extends between two adjacent silicon blocks; then it moves in a straight line to push the silicon blocks so that their sides are pressed against the upper partition (36) and lower partition (113) of the support part; finally, it rotates to a horizontal position and exits between two adjacent silicon blocks.

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