Display module and display device

Abstract

This disclosure provides a display module and display device. The display module includes: a display panel comprising a display surface and a non-display surface disposed opposite to each other, at least one side of the display panel being a bonding side; a heat dissipation film adhered to the non-display surface; and a flexible circuit board comprising a bonding portion, a bending portion, and a bonding portion connected in sequence, wherein the bonding portion is bonded to the bonding side of the display panel, the bending portion is bent to fold the bonding portion back and adhere it to the non-display surface; wherein the heat dissipation film includes a first region and a second region, the resilience of the first region is less than the resilience of the second region, and the bonding portion at least partially overlaps with the orthographic projection of the first region on the non-display surface. The display module and display device provided by this disclosure can improve the molding problem of the display module caused by the flexible circuit board, and also improve the impact resistance of the display module.

Description

Technical Field

[0001] This invention relates to the field of display technology, and more particularly to a display module and display device. Background Technology

[0002] In related technologies, flexible circuit boards can be bonded to one side of a display screen and then bent back to the back of the display screen. Because the surface of the flexible circuit board is uneven and it contains components, it can leave imprints on the display screen, thus affecting the appearance of the front of the display. Summary of the Invention

[0003] This disclosure provides a display module and display device that can improve the printing problems of display modules caused by flexible circuit boards, and also enhance the impact resistance of the display module.

[0004] The technical solutions provided in this disclosure are as follows:

[0005] According to a first aspect of this disclosure, a display module is provided, comprising:

[0006] A display panel includes a display surface and a non-display surface disposed opposite to each other, and at least one side of the display panel is a bonding side;

[0007] A heat dissipation film, which is adhered to the non-display surface; and

[0008] A flexible circuit board includes a bonding portion, a bending portion, and a bonding portion connected in sequence, wherein the bonding portion is bonded to the bonding side of the display panel, and the bending portion is bent to fold the bonding portion back and bond it to the non-display surface;

[0009] The heat dissipation film includes a first region and a second region. The resilience of the first region is less than that of the second region. The bonding portion at least partially overlaps with the orthographic projection of the first region onto the non-display surface.

[0010] For example, the heat dissipation film includes a buffer layer, wherein the ratio between the 25% CFD value of the buffer layer in the second region and the 25% CFD value of the buffer layer in the first region is greater than or equal to 2.5 and less than or equal to 7.

[0011] For example, the 25% CFD value of the buffer layer in the first region is less than or equal to 0.2 kgf / cm². 2 And greater than or equal to 0.1 kgf / cm 2 The 25% CFD value of the buffer layer in the second region is greater than or equal to 0.5 kgf / cm². 2 And less than or equal to 0.7 kgf / cm 2 .

[0012] For example, in a predetermined direction, the first region is located on one side of the second region; a splicing line is formed at the junction of the first region and the second region; wherein, in the predetermined direction, the edge of the adhesive portion closest to the second region is kept at a predetermined distance from the splicing line, so that the adhesive portion and the orthographic projection of the second region on the non-display surface do not overlap.

[0013] For example, the predetermined distance is greater than or equal to 0.3 mm and less than or equal to 5 mm.

[0014] For example, in a predetermined direction, the first region is located on one side of the second region, and the first region has a first boundary on the side closer to the second region for joining with the second region, and the second region has a second boundary on the side closer to the first region for joining with the first region; wherein,

[0015] Both the first boundary and the second boundary are straight lines, so that a straight splicing line is formed at the junction between the first region and the second region;

[0016] Alternatively, both the first boundary and the second boundary are non-linear, and the shapes of the first boundary and the second boundary are adapted to each other, so that a non-linear splicing line is formed at the junction between the first region and the second region.

[0017] For example, when both the first boundary and the second boundary are non-linear, both the first boundary and the second boundary are constructed to have a plurality of protruding portions and a plurality of recessed portions. The protruding portions and the recessed portions on either the first boundary or the second boundary are arranged alternately, and the protruding portions on one of the first boundary and the second boundary extend into the corresponding recessed portions of the other boundary, and the shapes of the protruding portions and the corresponding recessed portions are adapted to each other.

[0018] For example, the orthographic projection of the protruding portion and the recessed portion on the non-display surface is V-shaped, rectangular, arc-shaped, or trapezoidal.

[0019] For example, when both the first boundary and the second boundary are non-linear, the area formed by the splicing of the first boundary and the second boundary is a transition zone, and the width of the transition zone in the predetermined direction is greater than or equal to 5 mm.

[0020] According to a second aspect of this disclosure, a display device is provided, which includes the display module as described above.

[0021] The beneficial effects of the embodiments disclosed herein are as follows:

[0022] In the display module and display device provided in the embodiments of this disclosure, the display module includes a display panel, a heat dissipation film and a flexible circuit board. The flexible circuit board includes a bonding portion, a bending portion and a bonding portion. The bending portion can be bonded to the bonding side of the display panel. The bending portion can be bent to fold the bonding portion back to the non-display surface of the flexible circuit board. The heat dissipation film is constructed to include a first region and a second region, and the elasticity of the first region is less than the elasticity of the second region. The first region and the orthographic projection of the bonding portion on the non-display surface at least partially overlap.

[0023] In this way, the heat dissipation film is divided into a first region with relatively low resilience and a second region with relatively high resilience. The first region corresponds to the bonding part where the flexible circuit board is folded back to the non-display surface. That is, at the position where the flexible circuit board is bonded to the non-display surface, the heat dissipation film is configured with low resilience, which can improve the molding problem caused by the bonding part of the flexible circuit board. The second region has high resilience, which can ensure that the area of ​​the heat dissipation film other than the first region has good resistance to point impact, so as to improve the molding problem while ensuring the resistance to point impact of the display module. Attached Figure Description

[0024] Figure 1 This diagram illustrates the structure of a flexible circuit board that is bent back and attached to the non-display surface of a display screen in the related technology. (a) shows a side view of the display screen before the flexible circuit board is bent, and (b) shows a rear view of the display screen after the flexible circuit board is bent.

[0025] Figure 2 This diagram illustrates the principle of how the impact force is transmitted to the display panel during a ball drop test using a relatively soft heat dissipation film.

[0026] Figure 3 This diagram illustrates the principle by which a buffer layer disperses the impact force when a relatively rigid heat dissipation film is used in a drop ball test.

[0027] Figure 4 This is a schematic diagram showing the structure of the display module provided in this embodiment before the flexible circuit board is bent.

[0028] Figure 5 This is a schematic diagram showing the structure of the display module provided in this embodiment after the flexible circuit board is bent.

[0029] Figure 6 This is a front view of the buffer layer structure of the heat dissipation film in the display module provided in some embodiments of this disclosure;

[0030] Figure 7 This diagram illustrates the rolling rollers passing over the splicing line when the heat dissipation film of the display module provided in this embodiment is attached to the display panel.

[0031] Figure 8 This is a rear view showing the flexible circuit board folded back and attached to the non-display surface in a display module provided in some embodiments of this disclosure;

[0032] Figure 9 This is a rear view showing the flexible circuit board folded back and attached to the non-display surface in a display module provided in some other embodiments of this disclosure;

[0033] Figures 10 to 13 This presents a schematic diagram illustrating the structure of the heat dissipation film in several embodiments provided in this disclosure;

[0034] Figure 14 This diagram illustrates the manufacturing process of the heat dissipation film in the display module provided in this embodiment. Detailed Implementation

[0035] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the described embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0036] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms “an,” “a,” or “the,” and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms “including,” “comprising,” or “containing,” and similar terms mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. The terms “connected,” “linked,” or similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms “upper,” “lower,” “left,” and “right,” etc., are used only to indicate relative positional relationships, and these relative positional relationships may change accordingly when the absolute position of the described objects changes.

[0037] Before providing a detailed description of the display module and display device provided in the embodiments of this disclosure, the following description of the related technologies is provided:

[0038] Figure 1 Image (a) shows a side view of the display screen before the flexible circuit board is bent. Figure 1Image (b) shows a rear view of the display screen after the flexible circuit board has been bent. In related technologies, OLED (Organic Light-Emitting Diode) displays are used as an example, such as... Figure 1 and Figure 2 As shown, the flexible printed circuit board (FPC) 10 is bonded to the bonding side of the display screen 20 and folded back and attached to the back of the display screen 20. Because the surface of the flexible printed circuit board 10 is uneven and there are some components 11 with a certain height, the flexible printed circuit board 10 will press a molded imprint on the back of the display screen 20, thereby affecting the display appearance of the front of the display screen 20.

[0039] A heat dissipation film is also attached to the back of the display screen. This film includes a buffer layer. To improve molding issues, a softer buffer layer can be used in the heat dissipation film on the back of the display screen to cushion the force of the flexible circuit board pressing against the back of the display screen, thereby improving molding performance. However, the buffer layer of the heat dissipation film also serves to resist impact and protect the display screen. If the buffer layer is too soft, it will reduce the impact resistance of the display screen.

[0040] The inventors of this disclosure have discovered through research that when performing a drop ball test on the back of a display screen, if the buffer layer in the heat dissipation film on the back of the display screen is too soft and the rebound force is too small, such as... Figure 2 As shown, the impact of the falling ball 30 will break through the buffer layer 41 in the heat dissipation film 40, concentrating the impact force onto the display screen 20, thus causing broken bright spots; as Figure 3 As shown, if a harder buffer layer 41 is used in the heat dissipation film 40, the point impact force of the falling ball is less likely to break through the buffer layer, and the impact force will be dispersed over a larger area. Therefore, a harder buffer layer has better resistance to point impacts.

[0041] Based on the above, the present disclosure provides a display module and display device that can both improve the molding problem caused by flexible circuit boards and ensure that the display module has good impact resistance.

[0042] like Figure 4 and Figure 5 As shown, the display module provided in this embodiment includes:

[0043] The display panel 100 includes a display surface 100a and a non-display surface 100b disposed opposite to each other, and at least one of the four sides of the display panel 100 is a bonding side D;

[0044] A heat dissipation film 200 is attached to the non-display surface 100b; and

[0045] The flexible circuit board 300 includes a bonding portion 320, a bending portion 330 and a bonding portion 310 connected in sequence. The bonding portion 320 is bonded to the bonding side D of the display panel 100. The bending portion 330 is bent and is used to fold the bonding portion back and bond it to the non-display surface 100b.

[0046] The heat dissipation film 200 includes a first region 200A and a second region 200B. The resilience of the first region 200A is less than that of the second region 200B. The bonding portion 310 at least partially overlaps with the orthographic projection of the first region 200A on the non-display surface 100b.

[0047] In the above scheme, the display module includes a display panel 100, a heat dissipation film 200, and a flexible circuit board 300. The bonding portion 320 of the flexible circuit board 300 is bonded to the bonding side D of the display panel 100. The bending portion 330 is bendable and folds back the bonding portion 310 and bonds it to the non-display surface 100b of the flexible circuit board 300. The heat dissipation film 200 is constructed to include a first region 200A and a second region 200B. The elasticity of the first region 200A is less than that of the second region 200B. The first region 200A and the orthographic projection of the bonding portion 310 on the non-display surface 100b at least partially overlap.

[0048] It should be noted that the heat dissipation film 200 is constructed to be resilient. The resilience force here, also known as CFD (Compression Force Deflection), refers to the force by which the heat dissipation film 200 responds to an applied object after being compressed to a certain proportion and reaching mechanical equilibrium. The greater the compression proportion, the greater the resilience force. In this application, the term "CFD value" can refer to the compressive force required to cause deformation and can be categorized as 25%, 40%, 50%, and 60% based on ASTM D 3574 testing. For example, a 25% CFD value can refer to the force required to cause a 25% deformation in any sample material. For instance, when a sample material with a diameter of 100 mm is pressed down to 75 mm (i.e., a compression of 25% of the initial height of the sample), the pressing force can be considered a 25% CFD value.

[0049] In the above solution, the heat dissipation film 200 is divided into a first region 200A with relatively low resilience and a second region 200B with relatively high resilience. The first region 200A corresponds to the bonding portion 310 where the flexible circuit board 300 is folded back to the non-display surface 100b. That is, at the position where the flexible circuit board 300 is bonded to the non-display surface 100b, the heat dissipation film 200 is configured to have low resilience, which can improve the molding problem caused by the bonding portion 310 of the flexible circuit board 300. The second region 200B has high resilience, which can ensure that the second region 200B of the heat dissipation film 200 has good resistance to point impact, so as to improve the molding problem while ensuring the resistance to point impact of the display module.

[0050] In some exemplary embodiments of this disclosure, the heat dissipation film 200 may be formed by splicing the first region 200A and the second region 200B, wherein the second region 200B may be a region of the heat dissipation film 200 other than the first region 200A.

[0051] In some exemplary embodiments of this disclosure, the first region 200A is located on one side of the second region 200B in a predetermined direction. Specifically, the display panel 100 includes a bonding side D, and the first region 200A is located on the side of the second region 200B closer to the bonding side D.

[0052] It should be noted that, for different display module models, the number and distribution of the first region 200A correspond to the number and distribution of the flexible circuit board 300. For example, in Figure 4 and Figure 5 In the illustrated embodiment, a flexible circuit board 300 is bonded to only one side of a display panel 100. Therefore, there is only one corresponding first region 200A, and its position corresponds to the bonding portion 310 of the flexible circuit board 300. In other embodiments, the flexible circuit board 300 may also be bonded to both sides of the display panel 100, and correspondingly, the first region 200A may be located on both sides corresponding to the second region 200B.

[0053] In some exemplary embodiments of this disclosure, such as Figure 4 and Figure 5 As shown, the display module also includes a polarizer 400, an optical adhesive layer 500, and a cover plate 600, which are sequentially stacked on the display surface 100a of the display panel 100. The polarizer 400 has a thickness of 0.05–0.15 mm; the optical adhesive layer 500 has a thickness of 0.05–0.3 mm; and the cover plate 600 has a thickness of 0.35–1 mm.

[0054] In some exemplary embodiments of this disclosure, such as Figure 4 and Figure 5 As shown, the heat dissipation film 200 may include an adhesive layer 210, a buffer layer 220 and a thermally conductive layer 230, wherein the adhesive layer 210 is used to bond the heat dissipation film 200 to the display panel 100 and conduct heat from the display panel.

[0055] Specifically, the adhesive layer 210 can be made of thermally conductive silicone, double-sided mesh adhesive, or any material that can achieve both thermal conductivity and adhesion.

[0056] The buffer layer 220 is used to buffer the external pressure on the display panel 100. Specifically, the material of the buffer layer 220 can be foam, rubber, or any flexible material with a buffering effect.

[0057] The thermally conductive layer 230 may be rigid, ductile, and thermally conductive, and can be used to protect the display panel 100 and conduct heat from the display panel 100 and assist in heat dissipation. The thermally conductive layer 230 is made of metal and can also prevent electrostatic discharge (ESD) from occurring in the display module. For example, the thermally conductive layer 230 may be made of copper, aluminum, silver, or an alloy of at least two of these materials. Furthermore, the thermally conductive layer 230 may also be made of graphene, or a composite material of graphene and metal.

[0058] In one embodiment, such as Figure 6 As shown, the heat dissipation film 200 is divided into a first region 200A and a second region 200B. The adhesive layer 210 and the thermally conductive layer 230 can be constructed as a continuous and uninterrupted whole-layer structure. The buffer layer 220 may include a first part 221 corresponding to the first region 200A and a second part 222 corresponding to the second region 200B. The buffer layer 220 is formed by splicing the first part 221 and the second part 222.

[0059] It is understood that in other embodiments, the adhesive layer 210 and the thermally conductive layer 230 may also be divided into at least two parts corresponding to the first region 200A and the second region 200B, respectively.

[0060] In some exemplary embodiments of this disclosure, the 25% CFD value of the buffer layer 220 in the second region 200B is greater than or equal to 2.5 and less than or equal to 7 compared to the 25% CFD value of the buffer layer 220 in the first region 200A. If the ratio of the resilience of the buffer layers 220 in the first region 200A to that in the second region 200B is too small or too large, it may be impossible to achieve the respective effects of improving molding problems and ensuring resistance to point impacts.

[0061] The inventors of this publication have discovered that when the ratio between the 25% CFD value of the buffer layer 220 of the second region 200B and the first region 200A is greater than or equal to 2.5 and less than or equal to 7, it has a better effect on improving the molding and enhancing the resistance to point impact.

[0062] It is understandable that, in practical applications, the appropriate resilience ratio of the buffer layer 220 in the first region 200A and the second region 200B can be selected according to the specific requirements for the display and impact resistance performance of the display module.

[0063] In some exemplary embodiments of this disclosure, the 25% CFD value of the buffer layer 220 of the first region 200A is less than or equal to 0.2 kgf / cm². 2 And greater than or equal to 0.1 kgf / cm 2 The 25% CFD value of the buffer layer 220 in the second region 200B is greater than or equal to 0.5 kgf / cm². 2 And less than or equal to 0.7 kgf / cm 2 This improves the molding process of the display module while enhancing its resistance to falling ball impacts.

[0064] It is understandable that the resilience parameters of the buffer layer 220 in the first region 200A and the second region 200B are not limited to these.

[0065] Furthermore, it should be noted that the elastic performance parameters such as resilience of the heat dissipation film 200 mainly depend on the material properties of the buffer layer 220. In addition to the aforementioned resilience (CFD), other performance parameters affecting the buffer layer 220 include density and hardness.

[0066] The term "hardness" refers to the degree of flexibility of the buffer layer 220. Different levels of hardness result in different compressive strengths of the buffer layer 220. Hardness can be expressed using a hardness value or a percentage of compression deformation. A higher hardness value indicates a harder material, while a lower hardness value indicates a softer material.

[0067] In some embodiments of this disclosure, the hardness value of the second region 220B may be greater than the hardness value of the first region 220A, so that the second region 220B has higher compressive strength, while the first region 220A is softer to reduce molding phenomena.

[0068] In some exemplary embodiments of this disclosure, such as Figure 6As shown, in a predetermined direction, the first region 200A is located on one side of the second region 200B; the junction between the first region 200A and the second region 200B forms a splicing line S.

[0069] In some exemplary embodiments, the splicing line S can be formed by splicing together the first portion 221 and the second portion 222 of the buffer layer 220. For example, Figure 8 and Figure 9 As shown, in the predetermined direction, the edge of the bonding portion 310 closest to the second region 200B maintains a predetermined distance a between it and the splicing line S, so that the orthographic projection of the bonding portion 310 and the second region 200B on the non-display surface 100b does not overlap at all.

[0070] In this way, by leaving a certain space between the edge of the flexible circuit board 300 closest to the second region 200B and the splicing line S, it can be ensured that when the bonding part 310 of the flexible circuit board 300 is folded back onto the non-display surface 100b, it will not exceed the splicing line S and enter the second region 200B, thereby ensuring that the flexible circuit board 300 is completely outside the second region 200B.

[0071] In some exemplary embodiments of this disclosure, considering assembly tolerances such as when the flexible circuit board 300 of the display module is folded back and attached to the non-display surface 100b, such as Figure 8 and Figure 9 As shown, the predetermined distance 'a' is greater than or equal to 0.3 mm and less than or equal to 5 mm. It is understood, of course, that the specific value of the predetermined distance 'a' is not limited to this.

[0072] In some exemplary embodiments of this disclosure, such as Figure 6 As shown, in a predetermined direction, the first region 200A is located on one side of the second region 200B, and the first region 200A has a first boundary 201 for splicing with the second region 200B on the side near the second region 200B, and the second region 200B has a second boundary 202 for splicing with the first region 200A on the side near the first region 200A; wherein, the first boundary 201 and the second boundary 202 are both straight, so that a straight splicing line S (i.e., splicing seam) is formed at the junction between the first region 200A and the second region 200B.

[0073] The display module provided in this disclosure, wherein the heat dissipation film 200 is bonded to the non-display surface 100b of the display panel 100 can be manufactured using a roll forming process, such as... Figure 7As shown, when the bonding roller 50 rolls along the predetermined direction past the splicing line S, the rolling force exerted on the display panel 100 will change. If the difference in resilience between the first region 200A and the second region 200B is large, it will cause a sudden change in the rolling force exerted on the display panel 100 when the bonding roller passes the splicing line S. This may result in the formation of a molded mark corresponding to the splicing line S on the display surface 100a of the display panel 100.

[0074] To improve the molding problem caused by the presence of splicing lines S, in some other exemplary embodiments of this disclosure, such as Figures 10 to 13 As shown, both the first boundary 201 and the second boundary 202 are non-linear, and the shapes of the first boundary 201 and the second boundary 202 are adapted to each other so that a non-linear splicing line S is formed at the junction between the first region 200A and the second region 200B.

[0075] In this way, by forming a non-linear splicing line S at the junction of the first region 200A and the second region 200B, a soft-hard bonding area is formed between the first region 200A and the second region 200B. This soft-hard bonding area is the transition area D. When the bonding roller rolls onto the transition area D, the rolling force transmitted to the display panel 100 will not change abruptly, thereby improving the problem of horizontal stripe printing caused by the presence of the splicing line S.

[0076] It should be noted that, in the above scheme, the shape of the first boundary 201 and the second boundary 202 are mutually adapted, meaning that the first boundary 201 extends along the shape of the second boundary 202, and the width of the splicing seam formed between the two is relatively uniform.

[0077] Specifically, in some exemplary embodiments of this disclosure, when both the first boundary 201 and the second boundary 202 are non-linear, both the first boundary 201 and the second boundary 202 are constructed to have a plurality of protruding portions 203 and a plurality of recessed portions 204. The protruding portions 203 and the recessed portions 204 on either the first boundary 201 or the second boundary 202 are arranged alternately, and the protruding portions 203 on one of the first boundary 201 and the second boundary 202 extend into the corresponding recessed portion 204 of the other, and the shape of the protruding portion 203 is adapted to the shape of the corresponding recessed portion 204.

[0078] In this way, by designing both the first boundary 201 and the second boundary 202 to have sequentially staggered protrusions 203 and recesses 204, and with the protrusions 203 and recesses 204 on the first boundary 201 and the second boundary 202 interlocking with each other, the transition area D formed by the splicing position of the first region 200A and the second region 200B can effectively transition the rolling pressure borne by the display panel 100, so as to further improve the problem of horizontal stripe printing caused by the splicing line S.

[0079] In some exemplary embodiments, such as Figure 10 As shown, the orthographic projection of the protruding portion 203 and the recessed portion 204 on the non-display surface 100b is V-shaped, and the splicing line S can be in the shape of a broken line.

[0080] In other exemplary embodiments, such as Figure 11 As shown, the orthographic projection of the protruding portion 203 and the recessed portion 204 on the non-display surface 100b is rectangular, and the splicing line S can be serrated.

[0081] In other exemplary embodiments, such as Figure 13 As shown, the orthographic projection of the protruding portion 203 and the recessed portion 204 on the non-display surface 100b is trapezoidal.

[0082] In the above exemplary embodiments, the splicing line S can all be non-linear, forming a soft-hard bonding area between the first region 200A and the second region 200B, thus improving the problem of horizontal stripe printing caused by the presence of the splicing line S. In practical applications, the shape and size of the protruding portion 203 and the recessed portion 204 can be reasonably selected according to actual product requirements.

[0083] It should be noted that in the above exemplary embodiments, when the protrusion 203 is V-shaped, rectangular, or trapezoidal, there may be sharp corners on the protrusion 203. These sharp corners may lift up, resulting in larger splicing gaps and affecting the rolling bonding effect and splicing tightness. The smaller the angle of the sharp corner, the greater the probability of lifting up.

[0084] To mitigate the issue of the protruding portion 203 lifting up, in other exemplary embodiments, such as... Figure 12 As shown, the orthographic projection of the protruding portion 203 and the recessed portion 204 on the non-display surface 100b is arc-shaped, and the splicing line S can be wavy.

[0085] It is understandable that, in order to improve the phenomenon of the protruding portion 203 lifting up when it is constructed into a V-shape, rectangle, or trapezoid, the sharp corners of the protruding portion 203 can be rounded, that is, the corners of the protruding portion 203 are rounded. In this way, the lifting up of the protruding portion 203 can also be reduced.

[0086] It is understood that the above is only an example. In practical applications, the specific shapes of the first boundary 201 and the second boundary 202 are not limited to this. For example, the protruding portion 203 and the recessed portion 204 can also be constructed as other regular or irregular shapes besides V-shape, arc, rectangle and trapezoid.

[0087] In some exemplary embodiments of this disclosure, the buffer layer 220 may be a single layer or a multi-layer structure consisting of at least two stacked membrane layers.

[0088] In some exemplary embodiments of this disclosure, when the buffer layer 220 is a multi-film structure, the buffer layer 220 may include at least two sub-buffer layers, wherein one sub-buffer layer is constructed as a continuous and uninterrupted film layer, and the other sub-buffer layer is constructed as a first part 221 corresponding to the first region 200A and a second part 222 corresponding to the second region 200B, wherein the first part 221 and the second part 222 are spliced ​​together.

[0089] In some other exemplary embodiments of this disclosure, when the buffer layer 220 is a multi-layer structure, the buffer layer 220 may include at least two sub-buffer layers, each of which is constructed to be divided into a first sub-part corresponding to the first region 200A and a second sub-part corresponding to the second region 200B, and the first sub-part and the second sub-part in each sub-buffer layer are spliced ​​together.

[0090] The first sub-parts of each sub-buffer layer can be made of the same material, and the second sub-parts of each sub-buffer layer can also be made of the same material. It is understood that the first sub-parts of sub-buffer layers in different layers can also be made of different materials, and the second sub-parts of sub-buffer layers in different layers can also be made of different materials.

[0091] Furthermore, the splicing lines formed by splicing the first and second sub-parts of the sub-buffer layers of different layers can coincide or not coincide on the orthographic projection of the non-display surface. When the splicing lines on the sub-buffer layers of different layers do not coincide, the presence of seams in each sub-buffer layer can be weakened, thus reducing the step difference caused by the seams in the entire buffer layer. In addition, in some exemplary embodiments of this disclosure, when both the first boundary 201 and the second boundary 202 are non-linear, the area formed by the splicing of the first boundary 201 and the second boundary 202 is a transition zone D. Since the transition zone D needs to effectively transition the rolling pressure exerted on the display panel 100 by the rolling roller 50 when it passes the boundary between the first region 200A and the second region 200B, the width b of the transition zone D cannot be too small. The width b of the transition zone D in the predetermined direction can be greater than or equal to 5 mm. In addition, the width b of the transition zone D should not be too large. If it is too large, too much softer buffer layer 220 will enter the area other than the bonding position of the flexible circuit board 300, thus affecting the impact resistance of the heat dissipation film 200.

[0092] In addition, such as Figure 14 As shown, in the display module provided in this embodiment, the manufacturing process of the heat dissipation film 200 can be as follows:

[0093] Step S01, as follows Figure 14 As shown in (a), two types of foam with different resilience are selected and die-cut to form the first buffer layer 220C and the second buffer layer 220D, respectively.

[0094] Step S02, as follows Figure 14 As shown in (b), the first buffer layer 220C and the second buffer layer 220D, which are die-cut out, are respectively transferred to the adhesive layer 210 to form a spliced ​​buffer layer 220.

[0095] Step S03, as follows Figure 14 As shown in (c), a thermally conductive layer 230 is attached to a buffer layer 220 that is transferred to an adhesive layer 210 to obtain a heat dissipation film 200 to be cut.

[0096] Step S04, as Figure 14 As shown in (d), the heat dissipation film 200 to be cut is die-cut according to the size of the display module product to obtain a single heat dissipation film 200 corresponding to the size of the display module product.

[0097] According to a second aspect of this disclosure, a display device is provided, which includes the display module provided in the embodiments of this disclosure. Obviously, the display device provided in the embodiments of this disclosure can also achieve the technical effects provided by the display module provided in the embodiments of this disclosure, and will not be elaborated further here.

[0098] The following points need to be explained:

[0099] (1) The accompanying drawings of the embodiments of this disclosure only involve the structures involved in the embodiments of this disclosure. Other structures can be referred to the general design.

[0100] (2) For clarity, the thickness of layers or regions is enlarged or reduced in the drawings used to describe embodiments of the present disclosure, i.e., these drawings are not drawn to actual scale. It will be understood that when an element such as a layer, film, region or substrate is referred to as being “above” or “below” another element, the element may be “directly” located “above” or “below” the other element or there may be intermediate elements.

[0101] (3) Where there is no conflict, the embodiments of this disclosure and the features in the embodiments can be combined with each other to obtain new embodiments.

[0102] The above are merely specific embodiments of this disclosure, but the scope of protection of this disclosure is not limited thereto. The scope of protection of this disclosure shall be determined by the scope of the claims.

Claims

1. A display module, characterized in that, include: A display panel includes a display surface and a non-display surface disposed opposite to each other, and at least one side of the display panel is a bonding side; A heat dissipation film is attached to the non-display surface; and A flexible circuit board includes a bonding portion, a bending portion, and a bonding portion connected in sequence, wherein the bonding portion is bonded to the bonding side of the display panel, and the bending portion is bent to fold the bonding portion back and bond it to the non-display surface; The heat dissipation film includes a first region and a second region, wherein the resilience of the first region is less than that of the second region, and the bonding portion at least partially overlaps with the orthographic projection of the first region on the non-display surface; the heat dissipation film includes a buffer layer, wherein the ratio between the 25% CFD value of the buffer layer in the second region and the 25% CFD value of the buffer layer in the first region is greater than or equal to 2.5 and less than or equal to 7. The 25% CFD value of the buffer layer in the first region is less than or equal to 0.2 kgf / cm². 2 And greater than or equal to 0.1 Kgf / cm 2 The 25% CFD value of the buffer layer in the second region is greater than or equal to 0.5 kgf / cm². 2 And less than or equal to 0.7 Kgf / cm 2 ; In a predetermined direction, the first region is located on one side of the second region, and the first region has a first boundary on the side closer to the second region for splicing with the second region, and the second region has a second boundary on the side closer to the first region for splicing with the first region; Wherein, both the first boundary and the second boundary are straight lines, so that a straight splicing line is formed at the junction between the first region and the second region; Alternatively, both the first boundary and the second boundary are non-linear, and the shapes of the first boundary and the second boundary are adapted to each other, so that a non-linear splicing line is formed at the junction between the first region and the second region.

2. The display module according to claim 1, characterized in that, In a predetermined direction, the first region is located on one side of the second region; a splicing line is formed at the junction of the first region and the second region; wherein, in the predetermined direction, the edge of the adhesive portion closest to the second region is kept at a predetermined distance from the splicing line, so that the orthographic projection of the adhesive portion and the second region on the non-display surface does not overlap.

3. The display module according to claim 2, characterized in that, The predetermined distance is greater than or equal to 0.3 mm and less than or equal to 5 mm.

4. The display module according to claim 1, characterized in that, When both the first boundary and the second boundary are non-linear, both the first boundary and the second boundary are constructed to have multiple protruding portions and multiple recessed portions. The protruding portions and recessed portions on either the first boundary or the second boundary are arranged alternately, and the protruding portions on one of the first boundary and the second boundary extend into the corresponding recessed portions of the other boundary, and the shapes of the protruding portions and the corresponding recessed portions are adapted to each other.

5. The display module according to claim 4, characterized in that, The protruding portion and the recessed portion project onto the non-display surface in the form of a V-shape, rectangle, arc, or trapezoid.

6. The display module according to claim 1, characterized in that, When both the first boundary and the second boundary are non-linear, the area formed by the splicing of the first boundary and the second boundary is a transition zone, and the width of the transition zone in the predetermined direction is greater than or equal to 5 mm.

7. A display device, characterized in that, Includes the display module as described in any one of claims 1 to 6.

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