A tiled reinforcement device for a flexible circuit board

Abstract

The utility model discloses a kind of laying reinforcement devices of flexible circuit board, comprising: machine table is with sequentially adjacent feeding station, laying station and laminating station;Move and carry component includes move and carry positioning module, move and carry support, move and carry lifting mechanism, move and carry lifting plate, vacuum adsorption module, elastic connecting piece and unfolding presser, move and carry positioning module is used to drive move and carry support to and fro in feeding station and laying station, vacuum adsorption module is connected in move and carry lifting plate, unfolding presser is connected in move and carry lifting plate below by elastic connecting piece, the top of unfolding presser is equipped with magnetic positioning block, the bottom of move and carry lifting plate is equipped with electromagnet;Laying component includes vacuum adsorption plate and laying positioning module;Laminating component is used to laminating reinforcement material and is equipped in laminating station.The utility model reinforcing processing efficiency is high, reinforcing processing consistency is high, the accuracy of move and carry positioning is high, move and carry action is stable and reliable, and the reliability of continuous operation is high.

Description

Technical Field

[0001] This utility model relates to the field of circuit board reinforcement, and in particular to a planar reinforcement device for flexible circuit boards. Background Technology

[0002] Flexible circuit boards, also known as FPCs, are circuit designs embedded in thin, flexible plastic sheets. This allows for the stacking of a large number of precision components in narrow and limited spaces, thus forming flexible circuits. They are highly favored for their excellent characteristics such as light weight, thinness, and the ability to be freely bent and folded.

[0003] Due to the soft and easily deformable nature of flexible circuit boards, they are prone to unnecessary bending during use. To improve their strength, reinforcing materials are often added to the characteristic areas of the flexible circuit board to improve the stability of the overall structure. In traditional technology, due to the soft structure of the flexible circuit board, the flexible circuit board is often manually loaded, positioned and reinforced. The reinforcement process is inefficient and has low consistency. Utility Model Content

[0004] This invention aims to solve at least one of the technical problems existing in the prior art. To this end, this invention proposes a planar reinforcement device for flexible circuit boards, which offers accurate and reliable transfer and positioning, high reinforcement processing efficiency, and high consistency in reinforcement processing.

[0005] A planar reinforcement device for a flexible circuit board according to an embodiment of the present invention includes:

[0006] The machine is equipped with a feeding station, a laying station and a bonding station that are arranged in sequence. The feeding station is equipped with a storage box.

[0007] The transfer assembly includes a transfer positioning module, a transfer bracket, a transfer lifting mechanism, a transfer lifting plate, a vacuum adsorption module, an elastic connector, and an unfolding pressure plate. The transfer bracket is connected to the transfer positioning module, which drives the transfer bracket to move back and forth between the loading station and the flattening station. The transfer lifting mechanism is connected to the transfer bracket, the transfer lifting plate is connected to the transfer lifting mechanism, the vacuum adsorption module is connected to the transfer lifting plate, and the unfolding pressure plate is connected to the underside of the transfer lifting plate via the elastic connector. The top of the unfolding pressure plate is provided with a magnetic positioning block, and the bottom of the transfer lifting plate is provided with an electromagnet facing the magnetic positioning block.

[0008] The tiling assembly includes a vacuum adsorption plate and a tiling positioning module. The vacuum adsorption plate is connected to the tiling positioning module, which is used to drive the vacuum adsorption plate back and forth between the tiling station and the bonding station.

[0009] The bonding assembly is used to bond reinforcing materials and is located at the bonding station.

[0010] In this embodiment, the unfolding pressure plate is cross-shaped, and there are four vacuum adsorption modules located at the four corners of the unfolding pressure plate.

[0011] In this embodiment, the elastic connector is a spring, the transfer lifting plate is provided with multiple guide holes, and the unfolding pressure plate is connected with multiple guide posts that match the guide holes. Each guide post passes through the corresponding guide hole, and each guide post has a limiting block located above the transfer lifting plate at its top.

[0012] In this embodiment, the storage box includes a bottom plate and several side plates, each side plate is connected to the bottom plate, and there is a gap between each pair of adjacent side plates.

[0013] In this embodiment, the tiling positioning module includes a first linear positioning mechanism and a second linear positioning mechanism. The first linear positioning mechanism is connected to the machine base, and the second linear positioning mechanism is connected to the first linear positioning mechanism. The positioning directions of the first linear positioning mechanism and the second linear positioning mechanism are perpendicular to the horizontal plane, and the vacuum adsorption plate is connected to the second linear positioning mechanism.

[0014] In this embodiment, the bonding assembly includes a bonding bracket, a bonding lifting mechanism, a reinforcing pressure block, and a reinforcing tensioning wheel assembly. The reinforcing tensioning wheel assembly and the bonding lifting mechanism are both connected to the bonding bracket, and the reinforcing pressure block is connected to the bonding lifting mechanism.

[0015] In this embodiment, the bottom of the reinforcing block is provided with a convex module, and the fitting bracket is provided with a lower template located below the reinforcing block. The lower template is provided with a lower die hole that matches the convex module.

[0016] In this embodiment, the reinforcing tensioning wheel assembly includes a reinforcing feed wheel, a first tensioning wheel, a second tensioning wheel, and a take-up wheel, all rotatably connected to the bonding bracket. The first tensioning wheel and the second tensioning wheel are located on opposite sides of the lower template, with the reinforcing feed wheel located on the side of the first tensioning wheel away from the lower template and the take-up wheel located on the side of the second tensioning wheel away from the lower template.

[0017] In this embodiment, the reinforcing block is equipped with a heating module.

[0018] The embodiments of this utility model have at least the following beneficial effects:

[0019] By arranging corresponding processing components at adjacent loading, flattening, and bonding stations, continuous leveling, transfer, flattening positioning, and reinforcement bonding operations can be achieved. Reinforcement processing is highly efficient and consistent. Through the unfolding pressure plate and elastic connectors, the flexible circuit board sheets in the storage box can be compressed and flattened before transfer, ensuring the flatness of the flexible circuit board sheets adsorbed and positioned by the vacuum adsorption module. Transfer positioning accuracy is high, ensuring that the flexible circuit board sheets transferred to the vacuum adsorption plate are fully unfolded and flattened. The adhesion effect of the flexible circuit board sheets on the vacuum adsorption plate is flat and reliable, providing a smooth surface for bonding components. The reinforcing bonding action provides an accurate and stable processing foundation, thereby improving the tightness and reliability of the reinforcing bonding effect. It has high reinforcement accuracy and good reinforcement processing effect. In addition, through the cooperation of magnetic positioning blocks and electromagnets, after the vacuum adsorption module adsorbs and positions the flexible circuit board sheet, the electromagnet adsorbs and positions the magnetic positioning blocks. This can keep the unfolding pressure plate and the transfer lifting plate relatively stationary during the transfer process, thereby avoiding the elastic restoring force of the elastic connector from acting on the flexible circuit board sheet through the unfolding pressure block. The transfer action is stable and reliable with high transfer accuracy. Moreover, the electromagnet can quickly reset after power failure, which is convenient for the next cycle of transfer operation and has high reliability for continuous operation. Attached Figure Description

[0020] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0021] Figure 1 This is a three-dimensional structural diagram of the flexible circuit board flat reinforcement device according to an embodiment of the present utility model;

[0022] Figure 2 This is a three-dimensional structural diagram of the flexible circuit board flat reinforcement device according to another perspective of an embodiment of the present utility model.

[0023] Figure 3 for Figure 1 A magnified structural diagram of A in the middle;

[0024] Figure 4 This is a top view of the planar reinforcement device for a flexible circuit board according to an embodiment of the present invention.

[0025] Figure 5 For along Figure 4 A schematic diagram of the cross-sectional structure of B-B';

[0026] Figure 6 for Figure 5 A schematic diagram of the structure in another working state.

[0027] Figure label:

[0028] Machine 100, loading station 110, laying station 120, bonding station 130, storage box 140, base plate 141, side plate 142;

[0029] Transfer assembly 200, transfer positioning module 210, transfer bracket 220, transfer lifting mechanism 230, transfer lifting plate 240, electromagnet 241, guide hole 242, vacuum adsorption module 250, elastic connector 260, unfolding pressure plate 270, magnetic positioning block 271, guide post 272, limit block 273;

[0030] Flat tiling component 300, vacuum adsorption plate 310, first linear positioning mechanism 320, second linear positioning mechanism 330;

[0031] The bonding component 400, bonding bracket 410, bonding lifting mechanism 420, reinforcing pressure block 430, protruding module 431, heating module 432, lower template 440, lower die cutter hole 441, reinforcing feeding roller 451, first tensioning roller 452, second tensioning roller 453, and winding roller 454. Detailed Implementation

[0032] The embodiments of this utility model are described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0033] In the description of this utility model, it should be understood that the orientation descriptions, such as up, down, left, right, front, and back, are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0034] In the description of this utility model, if the wire sleeve or bracket is mentioned, it is only for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated or the order of the technical features indicated.

[0035] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.

[0036] Flexible printed circuit boards (FPCs) are circuit designs embedded in thin, bendable plastic sheets. This allows for the packing of numerous precision components within narrow and limited spaces, creating flexible circuits that are highly favored for their lightweight, thinness, and ability to be freely bent and folded. Due to their soft and easily deformable nature, FPCs are prone to unnecessary bending during use. To improve their strength, reinforcing materials are often added to key areas of the FPC to enhance the overall structural stability. These reinforcing materials can include glass fiber epoxy resin, polyimide, polyester film, or metal sheets.

[0037] In traditional technologies, due to the flexible structure of flexible circuit boards (PCBs), manual loading, positioning, and reinforcement bonding are often performed. This method is inefficient, inconsistent, and results in fluctuating yield rates, making it difficult to control the mass production quality of PCBs. While some related technologies employ mechanical bonding of reinforcement materials, manual loading of the PCBs is prone to wrinkles or misalignment during transport, affecting both the accuracy and reliability of the reinforcement bonding process, ultimately leading to a decrease in the overall reinforcement bonding effect. Some technologies use mechanical clamping to load the PCBs, but this method is also susceptible to wrinkles or misalignment.

[0038] The following is for reference only. Figure 1 To be continued Figure 6 This invention describes a flexible circuit board flattening reinforcement device according to an embodiment of the present invention, which has accurate and reliable transfer positioning, high reinforcement processing efficiency, and high reinforcement processing consistency.

[0039] Reference Figures 1 to 6 A planar reinforcement device for a flexible circuit board according to an embodiment of the present invention includes:

[0040] The machine 100 is provided with a loading station 110, a laying station 120 and a bonding station 130 that are sequentially adjacent in the horizontal two-dimensional direction. The loading station 110 is provided with a storage box 140 for stacking flexible circuit board sheets. The storage box 140 is connected to the machine 100.

[0041] The transfer assembly 200 includes a transfer positioning module 210, a transfer bracket 220, a transfer lifting mechanism 230, a transfer lifting plate 240, a vacuum adsorption module 250, an elastic connector 260, and an unfolding pressure plate 270. The transfer positioning module 210 is connected to the machine base 100, and the transfer bracket 220 is connected to the transfer positioning module 210. The transfer positioning module 210 drives the transfer bracket 220 to move back and forth between the loading station 110 and the flattening station 120. The transfer lifting mechanism 230 is connected to the transfer bracket 220, and the transfer lifting plate 240 is connected to the transfer lifting mechanism 230. The vacuum adsorption module 250 is connected to the transfer lifting plate 240. The adsorption part of the vacuum adsorption module 250 is located below the transfer lifting plate 240. The unfolding pressure plate 270 is located below the lifting transfer plate. Multiple vacuum adsorption modules 250 are provided and surround the unfolding pressure plate 270. The two ends of the elastic connector 260 are respectively connected to the transfer lifting plate 240 and the unfolding pressure plate 270, so that the unfolding pressure plate 270 forms a tendency to move away from the transfer lifting plate 240, thereby causing the unfolding pressure plate 270 to move downwards from the adsorption part of the vacuum adsorption module 250, so that during the lifting process... The unfolding pressure plate 270 contacts the flexible circuit board sheet before the suction part of the vacuum suction module 250. After the unfolding pressure plate 270 lays out and flattens the flexible circuit board sheet, the suction part of the vacuum suction module 250 contacts the flexible circuit board sheet and suctions and positions it, effectively maintaining the flatness of the flexible circuit board sheet. The top of the unfolding pressure plate 270 is provided with a magnetic positioning block 271, and the bottom of the transfer lifting plate 240 is provided with an electromagnet 241 facing the magnetic positioning block 271. The electromagnet 241 is used to magnetically position the magnetic positioning block 271. During the transfer process, the electromagnet 241... The magnetic positioning block 271 achieves reliable magnetic positioning, effectively maintaining the relative stillness between the transfer lifting plate 240 and the unfolding pressure plate 270. It can prevent the unfolding pressure plate 270 from pushing the flexible circuit board sheet due to the elastic restoring force of the elastic connector 260, effectively improving the stability of the position of the flexible circuit board sheet when it is adsorbed and positioned by the vacuum adsorption module 250, effectively improving the accuracy of the alignment effect, and effectively ensuring the flatness of the flexible circuit board sheet. After the electromagnet 241 is de-energized, it can release the magnetic positioning block 271 to achieve reset, thus preparing for the next transfer action.

[0042] The flattening assembly 300 includes a vacuum adsorption plate 310 and a flattening positioning module. The flattening positioning module is connected to the machine base 100, and the vacuum adsorption plate 310 is connected to the flattening positioning module. The flattening positioning module is used to drive the vacuum adsorption plate 310 back and forth between the flattening station 120 and the bonding station 130. The vacuum adsorption plate 310 is used to adsorb and position the flexible circuit board sheet laid flat on it.

[0043] The bonding component 400 is used to bond reinforcing material onto a flexible circuit board and is located at the bonding station 130. The bonding component of the bonding component 400 is located above the horizontal plane of the vacuum adsorption plate 310.

[0044] During operation, flexible circuit board sheets are stacked in storage box 140, with the initial structure referenced. Figures 1 to 5 As shown, in the natural state of the elastic connector 260, the transfer lifting plate 240 is located below the adsorption section of the vacuum adsorption module 250; Reference Figure 6 As shown, the transfer lifting mechanism 230 drives the transfer lifting plate 240 to descend, and the unfolding pressure plate 270 contacts the uppermost flexible circuit board sheet in the storage box 140 and flattens it. As the transfer lifting plate 240 descends, the elastic connector 260 is continuously compressed until the vacuum adsorption module 250 contacts the flexible circuit board sheet. At the same time, the electromagnet 241 contacts the magnetic positioning block 271. The vacuum adsorption module 250 adsorbs and positions the flexible circuit board sheet, and the electromagnet 241 is energized to form a magnetic force to achieve magnetic adsorption and positioning of the magnetic adsorption component. The relative position of the unfolding pressure plate 270 and the transfer lifting plate 240 remains unchanged. The transfer lifting mechanism 230 drives the transfer lifting plate 240 to rise, and the transfer positioning module 210 drives the transfer bracket 220 to move, so that the transfer lifting plate 240 is transferred from above the loading station 110 to above the flattening station 120. The transfer lifting mechanism 230 drives the transfer lifting plate 240 to descend, so that the flexible circuit board sheet reaches the top surface of the vacuum adsorption plate 310. The electromagnet 241 is de-energized and releases the magnetic positioning block 271. Under the elastic restoring force of the elastic connector 260, the pressure plate 270 unfolds and cooperates with the vacuum adsorption plate 310 to clamp the flexible circuit board sheet, thereby achieving temporary positioning of the flexible circuit board sheet. The vacuum adsorption module 250 releases the flexible circuit board sheet, and the vacuum adsorption plate 310 adsorbs and positions the flexible circuit board sheet. The transfer lifting mechanism 230 drives the transfer lifting plate 240 to rise and reset, and the transfer positioning module 210 drives the transfer frame to reset. The flat positioning module drives the vacuum adsorption plate 310 to move to below the bonding component of the bonding assembly 400. The bonding assembly 400 presses the reinforcing strip onto the flexible circuit board sheet, thereby achieving reinforcing bonding and positioning.

[0045] By arranging corresponding processing components in adjacent loading stations 110, laying stations 120, and bonding stations 130, continuous leveling, transfer, laying, positioning, and reinforcement bonding operations can be achieved, resulting in high reinforcement processing efficiency and consistency. Through the unfolding pressure plate 270 and elastic connector 260, the flexible circuit board sheets in the storage box 140 can be compressed and flattened before transfer, ensuring the flatness of the flexible circuit board sheets adsorbed and positioned by the vacuum adsorption module 250. This ensures high transfer and positioning accuracy, guaranteeing that the flexible circuit board sheets transferred to the vacuum adsorption plate 310 are fully unfolded and flattened, preventing wrinkles or warping. The adhesion of the flexible circuit board sheets to the vacuum adsorption plate 310 is flat and reliable, providing a smooth surface for subsequent bonding components. The 400-degree reinforcement bonding action provides an accurate and stable processing foundation, thereby improving the tightness and reliability of the reinforcement bonding effect, avoiding offset or air bubbles, and achieving high reinforcement accuracy and good reinforcement processing effect. In addition, through the cooperation of magnetic positioning block 271 and electromagnet 241, after the vacuum adsorption module 250 adsorbs and positions the unfolded flexible circuit board sheet, the electromagnet 241 adsorbs and positions the magnetic positioning block 271, which can keep the unfolding pressure plate 270 and the transfer lifting plate 240 relatively stationary during the transfer process. This avoids the elastic restoring force of the elastic connector 260 acting on the flexible circuit board sheet through the unfolding pressure block. The transfer action is stable and reliable with high transfer accuracy. Moreover, the electromagnet 241 can quickly reset after power failure, which facilitates the next cycle of transfer operation and ensures high reliability of continuous operation.

[0046] It is understandable that the unfolding pressure plate 270 is cross-shaped, and its four extended parts can evenly cover the edge area of ​​the flexible circuit board sheet, thereby ensuring uniform force distribution during the leveling process. There are four vacuum adsorption modules 250, which are located at the four corners of the unfolding pressure plate 270. Through the symmetrical layout of the four vacuum adsorption modules 250 and the geometric complementarity of the cross-shaped unfolding pressure plate 270, the reliability of the adsorption and positioning action after pre-press unfolding can be effectively improved.

[0047] Specifically, the vacuum adsorption module 250 is a vacuum suction cup with a flexible sealing ring on its contact surface. This allows it to adapt to sheets of different thicknesses and ensures airtight adsorption. After the electromagnet 241 releases the magnetic positioning block 271, the unfolded pressure plate 270, under the elastic restoring force of the elastic connector 260, ensures the separation effect of the vacuum suction cup from the flexible circuit board sheet, thereby improving the reliability of the positioning effect of the vacuum adsorption plate 310 on the flexible circuit board sheet during transfer. Furthermore, the adsorption end face of the vacuum suction cup is provided with a micropore array to increase the adsorption area and reduce local stress concentration.

[0048] It is understood that the elastic connector 260 is a spring, which is a compression spring and is connected to the transfer lifting plate 240 and the unfolding pressure plate 270 at opposite ends to form an elastic preload. The transfer lifting plate 240 is provided with multiple guide holes 242, and the unfolding pressure plate 270 is connected with multiple guide posts 272 that match the guide holes 242. Each guide post 272 passes through the corresponding guide hole 242, and there is a clearance fit between the guide hole 242 and the guide post 272. Each guide post 272 is provided with a limiting block 273 located above the transfer lifting plate 240. The diameter of the limiting block 273 is larger than the diameter of the guide hole 242, which can effectively prevent the guide post 272 from completely disengaging from the guide hole 242, thereby effectively improving the reliability of the overall structure.

[0049] Specifically, the number of springs is the same as the number of guide posts 272. Each spring is sleeved on the corresponding guide post 272, which can simultaneously prevent the spring from swaying. The surface of the guide post 272 can be covered with polytetrafluoroethylene to reduce wear caused by the extension and contraction of the spring.

[0050] It is understood that the storage box 140 includes a base plate 141 and several side plates 142. Each side plate 142 is connected to the base plate 141, and there is a gap between each pair of adjacent side plates 142. The gap can effectively adjust the dynamic balance of air pressure between the internal and external environments of the storage box 140, thereby improving the smoothness of the material handling operation and the leveling effect on the flexible circuit board material. Preferably, the base plate 141 and the side plates 142 are connected by a detachable structure such as screws and screw holes, and the number and position of the side plates 142 can be adjusted according to different flexible circuit board materials.

[0051] It is understood that the flat positioning module includes a first linear positioning mechanism 320 and a second linear positioning mechanism 330. The first linear positioning mechanism 320 is connected to the machine base 100, and the second linear positioning mechanism 330 is connected to the first linear positioning mechanism 320. The positioning direction of the first linear positioning mechanism 320 and the positioning direction of the second linear positioning mechanism 330 are perpendicular to the horizontal plane. The vacuum suction plate 310 is connected to the second linear positioning mechanism 330. The first linear positioning mechanism 320 is used to drive the second linear positioning mechanism 330 to move back and forth linearly, so that the vacuum suction plate moves back and forth between the flat position 120 and the bonding position 130.

[0052] Specifically, the transfer positioning module 210, the first linear positioning mechanism 320, and the second linear positioning mechanism 330 are all mechanical drive structures that can achieve linear positioning, such as lead screw positioning mechanisms or rodless cylinders. Furthermore, based on the actual application design, they can work with guide rails to achieve more stable and reliable positioning.

[0053] It is understood that the bonding assembly 400 includes a bonding bracket 410, a bonding lifting mechanism 420, a reinforcing pressure block 430, and a reinforcing tensioning wheel assembly. The bonding bracket 410 is connected to the machine base 100. The reinforcing tensioning wheel assembly and the bonding lifting mechanism 420 are both connected to the bonding bracket 410. The reinforcing tensioning wheel assembly is used to tighten the reinforcing material strip. The reinforcing pressure block 430 is connected to the bonding lifting mechanism 420. The bonding lifting mechanism 420 is used to drive the reinforcing pressure block 430 to rise and fall at the bonding station 130. The reinforcing pressure block 430 is located above the horizontal plane of the vacuum suction plate. Both the transfer lifting mechanism 230 and the bonding lifting mechanism 420 are cylinders.

[0054] During the bonding process, the flat positioning module drives the vacuum adsorption plate 310 to move below the reinforcing pressure block 430. The reinforcing material strip is wrapped around the reinforcing tensioning wheel group and passes below the reinforcing pressure block 430. The bonding lifting mechanism 420 drives the reinforcing pressure block 430 to descend and press the reinforcing material strip onto the flexible circuit board sheet, thereby achieving reinforcing bonding and positioning.

[0055] It is understood that the bottom of the reinforcing block 430 is provided with a protruding module 431, and the fitting bracket 410 is provided with a lower template 440 located below the reinforcing block 430. The lower template 440 is provided with a lower die cutter hole 441 that matches the protruding module 431. The thickness of the protruding module 431 is greater than the thickness of the lower template 440. Preferably, the protrusion height of the protruding module 431 is 1.2 to 2 times the thickness of the lower template 440, so that the preset pressing stroke is retained after the punching is completed, thereby achieving seamless connection between the cutting and pressing processes.

[0056] During operation, the reinforcing strip is inserted between the reinforcing block 430 and the lower template 440. When the convex module 431 descends, it pushes the reinforcing strip into the lower die hole 441. The shearing force formed between the hole wall of the lower die hole 441 and the convex module 431 can punch the reinforcing strip to form a specified shape. The convex module 431 presses the cut reinforcing material onto the surface of the flexible circuit board sheet.

[0057] It is understood that the reinforcing tensioning wheel assembly includes a reinforcing feed wheel 451, a first tensioning wheel 452, a second tensioning wheel 453, and a take-up wheel 454, all rotatably connected to the bonding bracket 410. The first tensioning wheel 452 and the second tensioning wheel 453 are located on opposite sides of the lower template 440, respectively. The reinforcing feed wheel 451 is located on the side of the first tensioning wheel 452 away from the lower template 440, and the take-up wheel 454 is located on the side of the second tensioning wheel 453 away from the lower template 440. Under the guiding tensioning action of the first tensioning wheel 452 and the second tensioning wheel 453, the reinforcing strip is tensioned and passes between the reinforcing pressure plate and the lower template 440. Depending on different application requirements, the reinforcing tensioning wheel assembly can be configured with different combinations.

[0058] It is understood that the reinforcing block 430 is equipped with a heating module 432, which can heat the reinforcing block 430 to achieve thermal bonding of the reinforcing material. The heating module 432 can be a ceramic heating element. To improve the temperature control effect, a temperature sensor is set in the reinforcing block 430 to detect the temperature value, so as to ensure the reliability and safety of the reinforcing process.

[0059] Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A planar reinforcement device for flexible circuit boards, characterized in that, include: The machine (100) is provided with a feeding station (110), a laying station (120) and a bonding station (130) that are adjacent to each other in sequence. The feeding station (110) is provided with a storage box (140). The transfer assembly (200) includes a transfer positioning module (210), a transfer bracket (220), a transfer lifting mechanism (230), a transfer lifting plate (240), a vacuum adsorption module (250), an elastic connector (260), and an unfolding pressure plate (270). The transfer bracket (220) is connected to the transfer positioning module (210). The transfer positioning module (210) is used to drive the transfer bracket (220) to move back and forth between the loading station (110) and the laying station (120). The transfer lifting mechanism (230)... 0) Connected to the transfer bracket (220), the transfer lifting plate (240) is connected to the transfer lifting mechanism (230), the vacuum adsorption module (250) is connected to the transfer lifting plate (240), the unfolding pressure plate (270) is connected to the transfer lifting plate (240) through the elastic connector (260), the top of the unfolding pressure plate (270) is provided with a magnetic positioning block (271), and the bottom of the transfer lifting plate (240) is provided with an electromagnet (241) facing the magnetic positioning block (271). The tiling assembly (300) includes a vacuum adsorption plate (310) and a tiling positioning module, wherein the vacuum adsorption plate (310) is connected to the tiling positioning module, and the tiling positioning module is used to drive the vacuum adsorption plate (310) to move back and forth between the tiling station (120) and the bonding station (130). A bonding component (400) is used to bond the reinforcing material and is located at the bonding station (130).

2. The flexible circuit board flat reinforcement device according to claim 1, characterized in that, The unfolding pressure plate (270) is cross-shaped, and the vacuum adsorption module (250) has four units, which are located at the four corners of the unfolding pressure plate (270).

3. The flexible circuit board flat reinforcement device according to claim 1, characterized in that, The elastic connector (260) is a spring. The transfer lifting plate (240) is provided with a plurality of guide holes (242). The unfolding pressure plate (270) is connected with a plurality of guide posts (272) that match the guide holes (242). Each guide post (272) passes through the corresponding guide hole (242). Each guide post (272) has a limiting block (273) located above the transfer lifting plate (240) at its top.

4. The flexible circuit board flat reinforcement device according to claim 1, characterized in that, The storage box (140) includes a base plate (141) and several side plates (142), each of the side plates (142) being connected to the base plate (141), and a gap being provided between each two adjacent side plates (142).

5. The flexible circuit board flat reinforcement device according to claim 1, characterized in that, The tiling positioning module includes a first linear positioning mechanism (320) and a second linear positioning mechanism (330). The first linear positioning mechanism (320) is connected to the machine base (100), and the second linear positioning mechanism (330) is connected to the first linear positioning mechanism (320). The positioning directions of the first linear positioning mechanism (320) and the second linear positioning mechanism (330) are perpendicular to the horizontal plane. The vacuum adsorption plate (310) is connected to the second linear positioning mechanism (330).

6. The flexible circuit board flat reinforcement device according to claim 1, characterized in that, The bonding assembly (400) includes a bonding bracket (410), a bonding lifting mechanism (420), a reinforcing pressure block (430), and a reinforcing tensioning wheel assembly. The reinforcing tensioning wheel assembly and the bonding lifting mechanism (420) are both connected to the bonding bracket (410), and the reinforcing pressure block (430) is connected to the bonding lifting mechanism (420).

7. The flexible circuit board flat reinforcement device according to claim 6, characterized in that, The bottom of the reinforcing block (430) is provided with a protruding module (431), and the fitting bracket (410) is provided with a lower template (440) located below the reinforcing block (430). The lower template (440) is provided with a lower die hole (441) that matches the protruding module (431).

8. The flexible circuit board flat reinforcement device according to claim 7, characterized in that, The reinforcing tensioning wheel assembly includes a reinforcing feed wheel (451), a first tensioning wheel (452), a second tensioning wheel (453), and a take-up wheel (454), all rotatably connected to the bonding bracket (410). The first tensioning wheel (452) and the second tensioning wheel (453) are located on opposite sides of the lower template (440). The reinforcing feed wheel (451) is located on the side of the first tensioning wheel (452) away from the lower template (440), and the take-up wheel (454) is located on the side of the second tensioning wheel (453) away from the lower template (440).

9. The flexible circuit board flat reinforcement device according to claim 8, characterized in that, The reinforcing block (430) is equipped with a heating module (432).

Images