Optical circuit board assembly and method of manufacturing the same

Abstract

An optical circuit board assembly and its manufacturing method are disclosed. The optical circuit board includes a first circuit board, electronic components, a flexible circuit board, multiple conductive pins, an optical communication module, and an encapsulation body. The electronic components are electrically connected to the first circuit board. The flexible circuit board encapsulates the electronic components and is electrically connected to the first circuit board. The conductive pins are disposed on the electronic components and penetrate the flexible circuit board to electrically connect them. The optical communication module is disposed on the flexible circuit board and the electronic components. The encapsulation body covers the electronic components and the flexible circuit board and is located on the first circuit board. The optical circuit board uses conductive pins to connect the optical communication module, the flexible circuit board, and the electronic components, which helps to improve signal transmission quality.

Description

Technical Field

[0001] This invention relates to a circuit board assembly and its manufacturing method, and more particularly to an optical circuit board assembly and its manufacturing method. Background Technology

[0002] With the development of big data and artificial intelligence, the demands for data transmission volume and processing speed are increasing. To meet these demands, in addition to improving fiber optic transmission speed, it is also necessary to improve the signal transmission quality between optical modules and printed circuit boards (PCBs). Currently, there are some problems and potential risks in the industry's connection methods between optical modules and PCBs, especially when the distance between the optical module and the PCB is large, which can easily lead to poor signal transmission quality. In addition, if one optical module fails, the entire PCB may become unusable, resulting in serious resource waste and maintenance costs. Summary of the Invention

[0003] At least one embodiment of the present invention provides an optical circuit board assembly and a method for manufacturing the same, which helps to improve signal transmission quality.

[0004] At least one embodiment of the present invention provides an optical circuit board assembly, including a first circuit board, electronic components, a flexible circuit board, a plurality of conductive pins, an optical communication module, and an encapsulation body. The electronic components are electrically connected to the first circuit board. The flexible circuit board covers the electronic components and is electrically connected to the first circuit board. The conductive pins are disposed on the electronic components and penetrate the flexible circuit board to electrically connect to the electronic components. The optical communication module is disposed on the flexible circuit board and the electronic components. The encapsulation body covers the electronic components and the flexible circuit board and is located on the first circuit board.

[0005] In at least one embodiment of the present invention, the electronic component has an upper surface, a lower surface, and a side surface located between the upper and lower surfaces, and the flexible circuit board further includes a first sub-board, a second sub-board, and a third sub-board. The first sub-board covers the upper surface and has a plurality of first holes, wherein conductive pins are respectively inserted into the first holes, and the first sub-board is electrically connected to the electronic component. The second sub-board covers the side surface and is connected to the first sub-board. The third sub-board covers the lower surface and is connected to the second sub-board, wherein the second sub-board is connected between the first sub-board and the third sub-board.

[0006] At least one embodiment of the present invention further includes a second circuit board, wherein a first circuit board is disposed on the second circuit board and the first circuit board is located between the second circuit board and the electronic components.

[0007] In at least one embodiment of the present invention, the optical communication module includes an optoelectronic element and an optical fiber. The optoelectronic element is electrically connected to an electronic element. The optical fiber is disposed on the optoelectronic element.

[0008] In at least one embodiment of the present invention, the optical communication module further includes a support plate. The support plate has a plurality of second holes and is disposed on a flexible circuit board, wherein the conductive pins are respectively inserted into the second holes and connected to the first sub-board, and the optoelectronic components are disposed on the support plate.

[0009] At least one embodiment of the present invention provides a method for manufacturing an optical circuit board assembly, comprising: providing a first circuit board; electrically connecting the first circuit board and a flexible circuit board; mounting electronic components on the first circuit board; covering the electronic components with the flexible circuit board; disposing a plurality of conductive pins on the flexible circuit board; connecting the conductive pins to the electronic components; after the conductive pins are connected to the electronic components, disposing an optical communication module on the flexible circuit board and the electronic components; and disposing an encapsulation on the first circuit board, wherein the encapsulation covers the electronic components, the flexible circuit board and the plurality of conductive pins.

[0010] At least one embodiment of the present invention provides a method for manufacturing an optical circuit board assembly, which further includes, after setting an encapsulator on a first circuit board, setting the first circuit board on a second circuit board.

[0011] At least one embodiment of the present invention provides a method for manufacturing an optical circuit board assembly, wherein the steps prior to the optical communication module being disposed on a flexible circuit board and the electronic components include forming a plurality of second holes on a support plate; and inserting conductive pins into the second holes, wherein the conductive pins are connected to the flexible circuit board.

[0012] At least one embodiment of the present invention provides a method for manufacturing an optical circuit board assembly, wherein the steps prior to the optical communication module being disposed on the flexible circuit board and electronic components further include disposing optical fibers on optoelectronic components.

[0013] At least one embodiment of the present invention provides a method for manufacturing an optical circuit board assembly, further comprising electrically connecting an optical communication module to an electronic component.

[0014] Based on the above, the optical circuit board assembly uses conductive pins to connect the optical communication module, flexible circuit board, and electronic components, thereby increasing the stability and reliability of the connection between the optical communication module and the flexible circuit board, which helps to improve signal transmission quality. Furthermore, if the optical communication module malfunctions, it can be repaired or replaced directly on this optical circuit board assembly without scrapping the entire assembly, thus helping to reduce resource waste and maintenance costs. Attached Figure Description

[0015] To make the above and other features, advantages and embodiments of the present invention more apparent and understandable, the accompanying drawings are described in detail below:

[0016] Figure 1A This is a top view schematic diagram of an optical circuit board assembly according to at least one embodiment of the present invention.

[0017] Figure 1B for Figure 1A A magnified schematic diagram of the conductive nail in the diagram.

[0018] Figure 1C for Figure 1A A cross-sectional schematic diagram of an optical circuit board assembly drawn along section line AA.

[0019] Figures 2A to 2C for Figure 1A A top view schematic diagram of the manufacturing method of flexible circuit boards.

[0020] Figures 3A to 3C for Figures 2A to 2C A cross-sectional schematic diagram of the manufacturing method of flexible circuit boards.

[0021] Figures 4A to 4E for Figure 1A A cross-sectional schematic diagram of the manufacturing method of the optical circuit board assembly. Detailed Implementation

[0022] In the following text, to clearly present the technical features of this application, the dimensions (e.g., length, width, thickness, and depth) of the elements (e.g., layers, films, substrates, and regions) in the accompanying drawings will be enlarged proportionally, and the number of some elements may be reduced. Therefore, the description and explanation of the embodiments below are not limited to the number of elements in the drawings or the dimensions and shapes presented by the elements, but should cover dimensions, shapes, and deviations from both due to actual manufacturing processes and / or tolerances. For example, a flat surface shown in the drawings may have rough and / or non-linear characteristics, and an acute angle shown in the drawings may be rounded. Therefore, the elements presented in the accompanying drawings are primarily for illustrative purposes and are not intended to precisely depict the actual shape of the elements, nor are they intended to limit the claims of this application.

[0023] Secondly, the terms "approximately," "approximately," or "substantially" used in this case not only cover explicitly stated numerical values ​​and ranges, but also the permissible deviation range understood by those skilled in the art. This deviation range can be determined by errors that arise during measurement, such as those caused by limitations of the measurement system or process conditions. Furthermore, "approximately" can mean within one or more standard deviations of the aforementioned numerical values, such as ±30%, ±20%, ±10%, or ±5%. The terms "approximately," "approximately," or "substantially" used in this case can be chosen based on optical, etching, mechanical, or other properties to select an acceptable deviation range or standard deviation, and do not simply apply a single standard deviation to all optical, etching, mechanical, and other properties.

[0024] Figure 1A This is a top view schematic diagram of an optical circuit board assembly 100 according to at least one embodiment of the present invention. Figure 1B for Figure 1A Enlarged schematic diagram of conductive nail 140 in the diagram. Figure 1C for Figure 1A A cross-sectional view of the optical circuit board assembly 100 drawn along section line AA. See also... Figures 1A to 1C The optical circuit board assembly 100 includes a first circuit board 110, electronic components 120, a flexible circuit board 130, multiple conductive pins 140, an optical communication module 170, and an encapsulation body 180. Electronic components 120 are electrically connected to the first circuit board 110. The flexible circuit board 130 encapsulates the electronic components 120 and is electrically connected to the first circuit board 110.

[0025] The flexible circuit board 130 is flexible and can be bent. For example, the flexible circuit board 130 can be bent into a U-shape to cover the electronic component 120, that is, the flexible circuit board 130 can be a board material with elasticity and flexibility. In addition, the flexible circuit board 130 is a flexible printed circuit (hereinafter referred to as FPC), wherein the insulating material of the FPC can be polyimide (PI), thermoplastic polyimide (TPI), polyethylene terephthalate (PET), or polyethylene (PE), but is not limited to these.

[0026] These conductive pins 140 are disposed on the electronic component 120 and pass through the flexible circuit board 130 to electrically connect the electronic component 120. The conductive pins 140 may be made of copper, titanium, silver, or gold, or other conductive materials, and are not limited thereto. Figure 1B In this embodiment, the width W1 of the head of the conductive nail 140 (i.e., the nut 144 described below) is 100 to 150 micrometers. The height H1 of the conductive nail 140 is 150 to 200 micrometers. The width W2 of the conductive nail 140 is 50 to 100 micrometers.

[0027] exist Figure 1C In one embodiment, the electronic component 120 has an upper surface (not shown), a lower surface (not shown), and a side surface (not shown) located between the upper and lower surfaces. The flexible circuit board 130 further includes a first sub-board 132, a second sub-board 134, and a third sub-board 135. The first sub-board 132 covers the upper surface and has a plurality of first holes (not shown, see accompanying reference). Figure 3AThe first hole 115), wherein the conductive pins 140 are respectively inserted into the first hole, and the first sub-board 132 is electrically connected to the electronic component 120.

[0028] The second sub-board 134 covers the side surface (not shown) and is connected to the first sub-board 132. The third sub-board 135 covers the lower surface (not shown) and is connected to the second sub-board 134, wherein the second sub-board 134 is connected between the first sub-board 132 and the third sub-board 135. The optical circuit board assembly 100 further includes a second circuit board 150, wherein the first circuit board 110 is disposed on the second circuit board 150, and the first circuit board 110 is located between the second circuit board 150 and the electronic component 120.

[0029] The optical circuit board assembly 100 includes at least one optical communication module 170, wherein the optical communication module 170 is disposed on the flexible circuit board 130 and the electronic components 120. Figure 1C In one embodiment, the optical circuit board assembly 100 includes a plurality (e.g., four) of optical communication modules 170, wherein each optical communication module 170 includes an optoelectronic element 172 and an optical fiber 174. The optoelectronic element 172 is electrically connected to the electronic element 120. The optical fiber 174 is disposed on the optoelectronic element 172. The optical communication module 170 includes a support plate 160.

[0030] The support plate 160 has multiple second holes 165 (e.g. Figure 4D As shown in the figure, the optical circuit board assembly 100 is mounted on a flexible circuit board 130, wherein the conductive pins 140 are respectively inserted into the second holes 165 and connected to the first sub-board 132, and the photoelectric element 172 is mounted on the support plate 160. Furthermore, it should be noted that the optical circuit board assembly 100 in other embodiments may include only one optical communication module 170, so the number of optical communication modules 170 included in the optical circuit board assembly 100 is not limited to only one.

[0031] exist Figure 1C In this embodiment, the encapsulation 180 covers the electronic component 120 and the flexible circuit board 130, and is located on the first circuit board 110. The material forming the encapsulation 180 may be polyimide (PI), dry film, epoxy resin, or molding compound. The method of forming the encapsulation 180 may be liquid compound, lamination, or compression molding, and is not limited to these methods.

[0032] Figures 2A to 2C for Figure 1A A top view schematic diagram of the manufacturing method of the flexible circuit board 130. Figures 3A to 3Cfor Figures 2A to 2C A cross-sectional view of the manufacturing method of the flexible circuit board 130, drawn along section line BB. Please refer to... Figure 2A and Figure 3A First, multiple first holes 115 are formed on the flexible circuit board 130. (See also...) Figure 2B and Figure 3B Then, these conductive pins 141 are inserted into these first holes 115, wherein these conductive pins 141 are connected to the flexible circuit board 130. See also... Figure 2C and Figure 3C Next, a connector 142 is placed on the conductive pin 141 for subsequent connection to the electronic component 120 (e.g., ...). Figure 4B (As shown).

[0033] It should be noted that in this embodiment, the width of the connector 142 is close to the width of the conductive nail 141, that is, the difference between the width of the connector 142 and the width W2 of the conductive nail 140 is not significant. Figure 1B It is drawn by magnifying the conductive pin 140. Therefore, Figure 1C , Figure 3B , Figure 3C as well as Figures 4A to 4C The width of connector 142 is depicted as being approximately equal to the width of conductive nail 141 and close to the width W2 of conductive nail 140.

[0034] Figures 4A to 4E for Figure 1A A cross-sectional schematic diagram of a method for manufacturing the optical circuit board assembly 100. The method for manufacturing the optical circuit board assembly 100 includes the following steps. Please refer to... Figure 4A A first circuit board 110 is provided. Then, the first circuit board 110 is electrically connected to the flexible circuit board 130. Then, an electronic component 120 is mounted on the flexible circuit board 130 and the first circuit board 110, wherein a portion of the flexible circuit board 130 is located between the electronic component 120 and the first circuit board 110.

[0035] Please see Figure 4B The flexible circuit board 130 is then wrapped around the electronic component 120. Next, multiple conductive pins 141 are attached to the flexible circuit board 130. Then, the connectors 142 on these conductive pins 141 are connected to the electronic component 120. (See also...) Figure 4C After the connector 142 on the conductive pin 141 is connected to the electronic component 120, an encapsulation body 180 is placed on the first circuit board 110, wherein the encapsulation body 180 covers the electronic component 120, the flexible circuit board 130, the connector 142, and the plurality of conductive pins 141. After the encapsulation body 180 is placed on the first circuit board 110, the first circuit board 110 is placed on the second circuit board 150.

[0036] Please see Figures 4D to 4E ,exist Figure 4D and Figure 4E In this embodiment, after the connectors 142 on these conductive pins 141 are connected to the electronic component 120, and after the encapsulation 180 covers the electronic component 120, the flexible circuit board 130, the connectors 142, and the plurality of conductive pins 141, the optical communication module 170 is disposed on the flexible circuit board 130 and the electronic component 120, and the optical communication module 170 is electrically connected to the electronic component 120. The steps prior to disposing the optical communication module 170 on the flexible circuit board 130 and the electronic component 120 include forming a plurality of second holes 165 in the support plate 160. Next, the conductive pins 141 are inserted into these second holes 165, wherein these conductive pins 141 are connected to the connectors 142 to the flexible circuit board 130, and each conductive pin 141 on the connectors 142 is secured with a nut 144 to become a conductive pin 140, thereby fixing the connection between the support plate 160 and the flexible circuit board 130. In other words, conductive pins 140 are inserted into the second holes 165, wherein the conductive pins 140 are connected to the first sub-board 132 of the flexible circuit board 130 to fix the support plate 160 and the first sub-board 132. Furthermore, before the optical communication module 170 is disposed on the flexible circuit board 130 and the electronic components 120, an optical fiber 174 can be disposed on the optoelectronic component 172.

[0037] In summary, in the optical circuit board assembly 100 of at least one embodiment of the present invention, the use of the conductive pin 140 to connect the optical communication module 170, the flexible circuit board 130, and the electronic components 120 not only increases the stability and reliability of the connection between the optical communication module 170 and the flexible circuit board 130, but also helps to improve signal transmission quality. Furthermore, if one of the optical communication modules 170 fails, the faulty optical communication module 170 can be removed from the conductive pin 140 for direct repair or replacement on the optical circuit board assembly 100, thereby helping to reduce resource waste and maintenance costs.

[0038] While the present invention has been disclosed above with reference to various embodiments, it is not intended to limit the invention. The components of several embodiments are outlined above to facilitate a better understanding of the inventive concepts by those skilled in the art. Those skilled in the art should understand that they can design or modify other processes and structures based on the embodiments of the present invention to achieve the same purpose and / or advantages as the embodiments described herein. Those skilled in the art should also understand that such equivalent processes and structures do not depart from the spirit and scope of the present invention, and that various changes, substitutions, and replacements can be made without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

[0039] [Symbol Explanation]

[0040] 100: Optical circuit board assembly

[0041] 110: First circuit board

[0042] 115: First Hole

[0043] 120: Electronic components

[0044] 130: Flexible Circuit Board

[0045] 132: First Sub-board

[0046] 134: Second Sub-board

[0047] 135: Third Sub-board

[0048] 140, 141: Conductive nails

[0049] 142: Connector

[0050] 144: Nut

[0051] 150: Second circuit board

[0052] 160: Support plate

[0053] 165: Second hole

[0054] 170: Optical communication module

[0055] 172: Optoelectronic components

[0056] 174: Fiber optic

[0057] 180: Encapsulation

[0058] W1, W2: Width

[0059] H1: Height

[0060] AA, BB: Section lines.

Claims

1. An optical circuit board assembly, characterized in that, include: First circuit board; Electronic components are electrically connected to the first circuit board; A flexible circuit board is used to cover the electronic components and is electrically connected to the first circuit board. Multiple conductive pins are disposed on the electronic component and pass through the flexible circuit board to electrically connect the electronic component; An optical communication module is disposed on the flexible circuit board and the electronic components; as well as An encapsulation body covers the electronic components and the flexible circuit board, and is located on the first circuit board.

2. The optical circuit board assembly according to claim 1, characterized in that, The electronic component has an upper surface, a lower surface, and a side surface located between the upper surface and the lower surface, and the flexible circuit board further includes: A first sub-board covers the upper surface and has a plurality of first holes, wherein the plurality of conductive pins are respectively inserted into the plurality of first holes and electrically connect the first sub-board to the electronic component; The second sub-board covers the side surface and connects to the first sub-board; A third sub-board covers the lower surface and connects to the second sub-board, wherein the second sub-board is connected between the first sub-board and the third sub-board.

3. The optical circuit board assembly according to claim 1, characterized in that, Further includes: The second circuit board, wherein the first circuit board is disposed on the second circuit board, and the first circuit board is located between the second circuit board and the electronic component.

4. The optical circuit board assembly according to claim 2, characterized in that, The optical communication module includes: Optoelectronic components, electrically connected to the electronic components; and An optical fiber is disposed in the optoelectronic element.

5. The optical circuit board assembly according to claim 2 or 4, characterized in that, The optical communication module further includes: A support plate having multiple second holes is disposed on the flexible circuit board, wherein multiple conductive pins are respectively inserted into the multiple second holes and connected to the first sub-board, and the photoelectric element is disposed on the support plate.

6. A method for manufacturing an optical circuit board assembly, characterized in that, include: Provide the first circuit board; Electrically connect the first circuit board to the flexible circuit board; Electronic components are mounted on the first circuit board; The flexible circuit board is wrapped around the electronic component; Multiple conductive pins are installed on the flexible circuit board; Connect the plurality of conductive pins to the electronic component; After the plurality of conductive pins are connected to the electronic component, the optical communication module is disposed on the flexible circuit board and the electronic component; as well as An encapsulation is disposed on the first circuit board, wherein the encapsulation covers the electronic components, the flexible circuit board, and the plurality of conductive pins.

7. The method for manufacturing an optical circuit board assembly according to claim 6, characterized in that, Further includes: After the encapsulation is placed on the first circuit board, the first circuit board is placed on the second circuit board.

8. The method for manufacturing an optical circuit board assembly according to claim 6, characterized in that, The steps prior to the optical communication module being mounted on the flexible circuit board and the electronic components include: Multiple second holes are formed on the support plate; and The plurality of conductive pins are inserted into the plurality of second holes, wherein the plurality of conductive pins are connected to the flexible circuit board.

9. The method for manufacturing an optical circuit board assembly according to claim 8, characterized in that, The steps prior to the optical communication module being disposed on the flexible circuit board and the electronic component further include: Optical fibers are placed in optoelectronic components.

10. The method for manufacturing an optical circuit board assembly according to claim 6, characterized in that, Further includes: The optical communication module is electrically connected to the electronic component.

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