A chip packaging system of a photon counting CT detector

By using the same substrate to set up the ASIC chip and sensor in the photon counting CT detector, and making direct contact with the support and heat dissipation structure, the problem of poor heat dissipation in traditional chip packaging systems is solved, achieving larger area coverage and higher radiation utilization.

CN224419203UActive Publication Date: 2026-06-26BEIJING PHOTON COUNTING TECHNOLOGY LTD
View PDF 0 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
BEIJING PHOTON COUNTING TECHNOLOGY LTD
Filing Date
2025-07-24
Publication Date
2026-06-26

AI Technical Summary

Technical Problem

In the chip packaging system of photon counting CT detectors, traditional chip packaging methods result in poor heat conduction, affecting the detector's heat dissipation effect, and making it difficult to achieve large-area coverage and effective radiation utilization.

Method used

The ASIC chip and sensor are set on the same substrate. The ASIC chip is located on the other side of the substrate and is in direct contact with the support and heat dissipation structure. It is connected to the data acquisition system through a flexible circuit board. The bottom of the substrate is equipped with support and heat dissipation components, which enables modules to be spliced ​​on four sides.

Benefits of technology

This improved the detector's heat dissipation efficiency, expanded its coverage area, ensured full utilization of X-rays, and reduced manufacturing difficulty and cost.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN224419203U_ABST
    Figure CN224419203U_ABST
Patent Text Reader

Abstract

The utility model relates to the field of detector chip packaging technology, specifically disclose a kind of chip packaging system of photon counting CT detector, including substrate, substrate is the middle layer of photon counting CT detector, the top of substrate is equipped with top layer sensor by connecting structure, top layer sensor is the top layer (sensor layer) of photon counting CT detector, the bottom of substrate is arranged with multiple ASIC chips by connecting structure, ASIC chip is the bottom layer of photon counting CT detector, the substrate of ASIC chip bottom (upper surface) is simultaneously as the substrate of photon counting CT detector, ASIC chip and photon counting CT detector adopt the same substrate setting, the bottom of substrate is equipped with flexible circuit board. The utility model is provided with a series of structures, quickly export the heat generated by ASIC and transfer to heat sink, realize the accurate temperature control of sensor, to low cost and process difficulty realize four sides can be spliced The photon counting detector that can realize relatively wide z direction coverage.
Need to check novelty before this filing date? Find Prior Art