DCI certified LED module and display with through channel

Abstract

The application relates to the technical field of LED display, and discloses an LED module with through channels and a display screen meeting the DCI authentication standard, wherein the LED module comprises a printed board, a plurality of first through channels are formed in the printed board, a first conductive layer is arranged on the inner circumferential side wall of the first through channel, a conductive edge corresponding to the first through channel is arranged on each side of the printed board, the conductive edge is arranged around the first through channel and is connected with the first conductive layer, and the first conductive layer is grounded; a support structure is arranged opposite to the printed board and is tightly connected with the printed board, has a plurality of second through channels, has a second conductive layer, and the second conductive layer is grounded and abuts against the conductive edge. The application solves the problems of reducing the sound blocking of the LED screen and the data leakage risk.

Description

Technical Field

[0001] This invention relates to the field of LED display technology, and more specifically to an LED module and display screen with a through channel that conforms to DCI certification standards. Background Technology

[0002] In the traditional commercial cinema industry, cinemas typically use projection equipment and screens to display images. With technological advancements, LED screen technology has gradually entered the market due to its higher brightness, better clarity, and lower requirements for ambient light. Equipment used for playing commercial films needs to meet the stringent reliability testing (CTP) requirements of the Digital Cinema Initiatives (DCI) standards to protect digital cinema copyrights and ensure a superior cinematic experience. Furthermore, cinema playback equipment must comply with the relevant clauses of the Federal Information Processing Standards (FIPS) within the DCI framework to prevent signal leakage and ensure data security.

[0003] The playback of a video involves the reproduction of both video and audio. To ensure a good audiovisual experience, the audio in the video needs to be reproduced through a center speaker behind the screen. This requires the screen to minimize the loss of volume and sound quality as the sound passes through. Current technology typically involves making holes in the LED screen to reduce the obstruction of sound, thereby reducing the loss of sound quality and volume.

[0004] The aforementioned prior art method of creating openings in the LED screen to reduce sound obstruction does not meet the relevant requirements of FIPS and carries the risk of data leakage.

[0005] Therefore, the applicant proposed a solution involving creating a through-channel on the LED circuit printed circuit board (PCB) and placing a metallized conductive layer inside the through-channel. Simultaneously, a corresponding conductive layer is placed on the support structure mounting the LED PCB. With the support structure and LED PCB tightly installed, the conductive layer of the support structure and the metallized conductive layer inside the through-channel form an electrical connection, creating an equipotential body and preventing signal leakage, thus reducing the risk of data leakage. However, in practice, the applicant discovered that due to factors such as specific installation conditions, poor contact may occur between the conductive layer of some through-channels and the conductive layer of the support structure. This means that signals may still be detected in some through-channels, still posing a risk of data leakage. Summary of the Invention

[0006] In view of this, the present invention provides an LED module and display screen with a through channel that conforms to the DCI certification standard, in order to solve the problems of LED screen blocking sound and the risk of data leakage, while also avoiding the risk of data leakage caused by poor contact.

[0007] In a first aspect, the present invention provides an LED module, comprising: a printed circuit board, wherein a plurality of LED light-emitting diodes are disposed on one side of the printed circuit board, a plurality of first through channels are formed on the printed circuit board, a first conductive layer is provided on the inner peripheral sidewall of the first through channel, and conductive edges corresponding to the first through channels are respectively provided on both sides of the printed circuit board, the conductive edges being laid out from the periphery towards the first through channel and extending to the first conductive layer and electrically connected to the first conductive layer, and the first conductive layer being grounded; and a support structure adapted to support the printed circuit board, having a plurality of second through channels corresponding to the first through channels, the support structure having a second conductive layer, the second conductive layer being grounded and abutting against the conductive edges.

[0008] Beneficial effects: By setting opposing first and second through channels on the LED module, sound can pass through the through channels, reducing the loss of sound quality and volume. By setting a first conductive layer on the inner peripheral sidewall of the first through channel and connecting it to the second conductive layer of the supporting structure and grounding it, the first and second conductive layers form an equipotential body. When a signal probe is inserted into the first and second through channels, no matter how the probe position and depth are changed, the signal cannot be detected, thus effectively avoiding the risk of data leakage and enabling the module to meet the relevant requirements of FIPS. At the same time, by setting conductive edges connected to the first conductive layer at the opening of the first through channel on both sides of the printed circuit board, the electrical connection between the first and second conductive layers is maintained when the supporting structure is tightly connected to the printed circuit board. This greatly reduces the possibility of poor contact causing local first and second conductive layers on the printed circuit board to fail to form an equipotential body, and also avoids the failure of the first conductive layer grounding, providing reliable protection for data security. In addition, because the LED module is equipped with a first through channel and a second through channel, the LED module has good heat dissipation and ventilation functions, which solves the fire smoke exhaust problem when the LED module is installed on a large area of ​​the building's interior wall.

[0009] In one alternative embodiment, the support structure is made of a conductive material to form the second conductive layer, or the surface of the support structure is metallized to form the second conductive layer.

[0010] Beneficial effects: The second conductive layer of the support structure can be formed by the support structure itself being made of conductive material and thus having conductive properties, or it can be formed by electroplating, deposition, film lamination and other methods to make a conductive film on the surface of the support structure made of non-conductive material. This gives the module components more options and makes it easier to adapt to different working environments and meet different equipment requirements.

[0011] In one alternative embodiment, the LED module further includes a masking layer, which is integrally disposed with the printed circuit board and located on the side of the printed circuit board away from the support structure. The first through channel extends through the masking layer, the masking layer is made of a conductive material and is electrically connected to the first conductive layer, and the LED light-emitting tube passes through the masking layer.

[0012] Beneficial effects: By setting a masking layer to shield and protect the surface of the printed circuit board with LED light-emitting tubes, and because the masking layer is integrated with the printed circuit board, the LED module can have a smaller thickness, thereby further reducing the obstruction of sound and improving the sound quality passing through the LED module.

[0013] In one optional embodiment, the LED module further includes a masking layer located on the side of the printed circuit board away from the support structure and tightly connected to the printed circuit board. The masking layer has a plurality of third through channels that are one-to-one opposite to the first through channel. The masking layer has a third conductive layer that is grounded and abuts against the conductive edge. The masking layer has a clearance groove for the LED light-emitting tube to pass through.

[0014] Beneficial effects: By setting a masking layer to shield and protect the surface of the printed circuit board containing LED light-emitting diodes, the separate design of the masking layer and the printed circuit board allows for greater flexibility in component selection for the LED module and facilitates the maintenance of the printed circuit board. The alignment of the third through-channel with the first and second through-channels ensures the quality of sound transmission. Simultaneously, by setting a third conductive layer and electrically connecting it to the first conductive layer and grounding it, a complete equipotential body is formed, including the first, second, and third conductive layers. This gives the LED module excellent signal shielding capabilities, further ensuring data security. The conductive edge also improves the contact between the third and first conductive layers, further ensuring the grounding stability of the first conductive layer.

[0015] In one alternative embodiment, the masking layer is made of a metallic material to form the third conductive layer, or the surface of the masking layer is metallized to form the third conductive layer.

[0016] Beneficial effects: The third conductive layer of the masking layer can be formed by the masking layer itself being made of conductive material and thus having conductive properties, or it can be formed by a conductive thin film made on the surface of the masking layer through electroplating, deposition, film lamination and other methods, so that the module components have more options and can be adapted to different working environments and meet different equipment requirements.

[0017] In one optional embodiment, the printed circuit board is provided with a plurality of connecting contacts, which are distributed on one side of the printed circuit board or on both sides of the printed circuit board. The connecting contacts are adapted to abut against the second conductive layer or the third conductive layer.

[0018] Beneficial effects: By setting connecting contacts on the surface of the printed circuit board to abut against the adjacent second or third conductive layer, an electrical connection is formed between the printed circuit board and the masking layer or support structure, or between the printed circuit board, the masking layer, and the support structure. Depending on the specific structure and distribution of the connecting contacts, the electrical connection can be single-point, multi-point, or local. This creates an equipotential body between the printed circuit board and the masking layer or support structure, making the equipotential body structure capable of shielding electrical signals within the LED module more three-dimensional, significantly improving signal shielding capability and enhancing data security.

[0019] In one alternative embodiment, the cross-sectional shape of the first through channel is a combination of one or more shapes selected from circles, polygons, ellipses, and waist shapes.

[0020] Beneficial effects: By using a combination of one or more shapes such as circles, polygons, ellipses, and waist shapes for the cross-sectional shape of the first through channel, the placement of the first through channel on the printed circuit board is more flexible. This allows for flexible arrangement of the position and shape of the first through channel according to the differences in LED light-emitting tubes, drivers, and circuits on different printed circuit boards, thereby maximizing the total area ratio of the first through channel on the printed circuit board and ensuring sound transmission and sound quality.

[0021] In one alternative implementation, the total area of ​​the plurality of first through channels is 1%-30% of the area of ​​the printed circuit board.

[0022] Beneficial effects: By ensuring that the total area of ​​the first through channel on the printed circuit board is between 1% and 30%, excessive obstruction of the center speaker's sound is avoided, thereby ensuring the overall image quality while guaranteeing the total amount and quality of sound transmission.

[0023] In one optional embodiment, a driving element for the LED is provided on the side of the printed circuit board away from the LED, and a receiving groove is provided on the support structure opposite to the driving element, the receiving groove and the printed circuit board forming an isolation space surrounding the driving element.

[0024] Beneficial effects: By setting a receiving groove on the support structure to accommodate the driving element, a covering structure is formed between the printed circuit board and the support structure to surround the driving element, thereby avoiding the possibility of signal leakage caused by the external exposure of the driving element. At the same time, it also avoids the possibility of signal probes directly stealing signals by contacting the driving element from the support structure side.

[0025] In one alternative embodiment, a first trigger switch is provided between the support structure and the printed circuit board.

[0026] Beneficial effects: By setting a first trigger switch between the printed circuit board and the support structure, when the LED module is assembled, the first trigger switch is in a state of being triggered and pressed by the printed circuit board and the support structure. When the printed circuit board is illegally removed, the first trigger switch is triggered because it loses its pressing state, thereby avoiding data leakage caused by structural damage by forcibly interrupting signal transmission or issuing an alarm through methods such as forcibly interrupting signal transmission by the control system.

[0027] Secondly, the present invention also provides an LED display screen, comprising: multiple frame-type cabinets, the frame-type cabinets being metal frames and grounded, the multiple frame-type cabinets being arranged in an array to form a display screen frame, the long side of the display screen frame being greater than or equal to 3 meters; a system electrical control box, installed inside the frame-type cabinets; multiple LED modules, each connected to the frame-type cabinets, the supporting structure having a compressible conductive medium electrically connected to the second conductive layer, the compressible conductive medium abutting against the frame-type cabinets.

[0028] Beneficial effects: The frame-type enclosure provides a mounting base for the LED modules. Because the frame-type enclosure uses a metal frame, when the first, second, and third conductive layers of the LED module are electrically connected to the frame-type enclosure, the LED module and the frame-type enclosure form an integral equipotential structure, thus providing overall signal leakage prevention. The compressible conductive medium, due to its compressibility, greatly reduces the installation precision requirements of the LED module and improves the compatibility between the LED module and the frame-type enclosure. Furthermore, by opening a first through-channel on the printed circuit board, the sound obstruction effect is reduced, allowing the sound from the center speaker behind the screen to be transmitted through the LED display for audio playback. Compared to using sound reflectors and channel synthesis to simulate a center speaker, this technology is less expensive and more adaptable because it eliminates the need for engineers to design speaker and channel layouts specifically for the viewing venue. This is especially beneficial when the viewing venue is large and channel synthesis cannot be used to simulate a center speaker, but this technology is applicable to viewing venues of various sizes.

[0029] In one optional embodiment, the system control box includes a cover and a body that are hinged together, and a safety anti-pry lock and a second trigger switch are provided between the cover and the body.

[0030] Beneficial effects: The hinged design of the cover and body facilitates the later maintenance and repair of the system's electrical control box. The anti-pry lock reduces the possibility of the system's electrical control box being illegally opened. The second trigger switch causes the control system to issue an alarm or send an interrupt signal when the system's electrical control box is illegally opened, thereby further improving the data security performance of the LED screen.

[0031] In one alternative embodiment, sound-absorbing material is laid on the inner periphery of the frame-type enclosure and the periphery of the system electrical control box.

[0032] Beneficial effects: By laying sound-absorbing materials inside the frame-type enclosure, the reflection of sound within the enclosure can be effectively reduced, thereby reducing the distortion caused by the reflection and improving sound quality.

[0033] In one optional embodiment, a connector kit is provided between adjacent frame-type enclosures. The connector kit penetrates the sidewalls of the two adjacent frame-type enclosures and has a through hole inside the connector kit that passes through the two adjacent frame-type enclosures. The connector kit is made of conductive material and is electrically connected to the frame-type enclosures.

[0034] Beneficial effects: By setting up connector kits, the wiring between adjacent frame-type enclosures is wrapped and protected. The connector kits pass through one frame-type enclosure into another and form an electrical connection structure with the frame-type enclosures, thereby forming an equipotential body with the frame-type enclosures, further preventing signal leakage at the cable connection points, and further ensuring data security.

[0035] Thirdly, the present invention also provides an LED dome screen, comprising multiple frame-type cabinets, wherein the frame plane of the frame-type cabinets is hyperboloidal, and the multiple frame-type cabinets are arranged in an array to form a spherical display screen frame, wherein the diameter of the LED dome screen is greater than or equal to 3 meters; multiple LED modules are provided and respectively connected to the frame-type cabinets, and the supporting structure has a compressible conductive medium electrically connected to the second conductive layer, wherein the compressible conductive medium abuts against the frame-type cabinets.

[0036] Beneficial effects: A dome screen, also known as a spherical screen, is a large curved display screen. The audio playback of a dome screen cannot use channel synthesis to simulate the center speaker on the back or inside of the screen. This LED dome screen technology uses a first through channel to ensure the audio quality of the center speaker playback, thereby meeting the audio reproduction requirements of the dome screen usage scenario and improving the adaptability of the dome screen playback device to the venue.

[0037] Fourthly, the present invention also provides an LED curved screen, including a mounting frame; a plurality of the above-mentioned LED modules, wherein the plurality of LED modules are mounted on the mounting frame and arranged in a curved shape.

[0038] Beneficial effects: The curved arrangement of LED modules to form a curved screen further enhances the diversity of screen usage scenarios and applicable venues, and improves the practicality of the product. Attached Figure Description

[0039] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0040] Figure 1 This is a cross-sectional view of a partial structure of an LED module according to an embodiment of the present invention;

[0041] Figure 2 This is a partial structural diagram of an LED module according to an embodiment of the present invention, used to illustrate the positional relationship and structure between the printed circuit board, the mask layer, and the support structure.

[0042] Figure 3 This is a partial structural diagram of an LED module according to another embodiment of the present invention, used to illustrate the positional relationship and structure between the printed circuit board, the mask layer and the support structure;

[0043] Figure 4 This is a schematic diagram of the cross-sectional structure of an LED module according to an embodiment of the present invention;

[0044] Figure 5 This is a schematic diagram of an LED module detecting signals within a through-channel using a probe, according to an embodiment of the present invention.

[0045] Figure 6 This is a schematic diagram of the overall structure of an LED screen according to an embodiment of the present invention;

[0046] Figure 7 This is a schematic diagram of the structure of the electrical control box of an LED screen according to an embodiment of the present invention.

[0047] Figure 8 This is a schematic diagram of an LED screen used to display a splicing structure of multiple frame-type cabinets according to an embodiment of the present invention;

[0048] Figure 9 This is a cross-sectional structural diagram of an LED screen used to display the connector kit structure at the end of the system electrical control box, according to an embodiment of the present invention.

[0049] Figure 10 This is a schematic diagram of an LED screen used to illustrate the structure of a conduit end connector kit according to an embodiment of the present invention.

[0050] Explanation of reference numerals in the attached figures:

[0051] 100. Printed circuit board; 101. LED light-emitting diode; 102. Driving element; 103. First through channel; 104. First conductive layer; 105. Conductive edge; 106. Connecting contact; 200. Support structure; 201. Second through channel; 202. Second conductive layer; 203. Receiving groove; 300. Shielding layer; 301. Third through channel; 302. Third conductive layer; 303. Relief groove; 400. Frame-type enclosure; 500. System electrical control box; 501. Security anti-pry lock; 502. Box body; 503. Box cover; 600. Sound-absorbing material; 700. Probe; 800. Second trigger switch; 900. Conduit; 901. Connector kit. Detailed Implementation

[0052] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0053] With the development of technology, LED screens are gradually replacing projectors and projection screens as video playback devices in commercial cinemas. Since the playback of movie videos is usually accompanied by audio playback, the audio playback process relies on the cooperation of a center speaker and other speakers to achieve high sound reproduction and meet the audiovisual effects.

[0054] However, unlike projection screens, LED screens significantly obstruct sound, usually affecting the playback performance of the center speaker. Some commercial cinemas use multi-channel synthesis to simulate the main channel of the center speaker, such as using screen reflections to synthesize the surrounding channels into the main channel. However, screen reflections result in significant sound loss and poor performance. Furthermore, sound synthesis requires custom-designed solutions based on the theater and screen size, leading to high costs. This method also fails to meet the DCI (Display Acceptance Control) requirements for ensuring a superior cinematic experience when used on screens larger than 16 meters.

[0055] Another type of commercial cinema uses perforated LED screens as playback devices, allowing the sound from the center speaker to pass through the perforations in the LED screen. However, this method can lead to signal leakage from the LED screen, seriously affecting data security and thus failing to meet the signal leakage clause requirements of FIPS in DCI.

[0056] Based on the above, this application proposes an LED module and LED display screen that have a wide range of applications, few restrictions, and can meet DCI requirements.

[0057] The following is combined Figures 1 to 10 The following describes embodiments of the present invention.

[0058] According to an embodiment of the present invention, an LED module is provided, please refer to... Figures 1 to 3The system includes a printed circuit board 100 and a support structure 200. The printed circuit board 100 has multiple LED light-emitting tubes 101 on one side and multiple first through channels 103 on the printed circuit board 100. The inner peripheral sidewall of the first through channel 103 has a first conductive layer 104. The two sides of the printed circuit board 100 are respectively provided with conductive edges 105 corresponding to the first through channels 103. The conductive edges 105 are laid from the periphery towards the first through channels 103 to the first conductive layer 104 and are electrically connected to the first conductive layer 104. The first conductive layer 104 is grounded. The support structure 200 is adapted to support the printed circuit board 100 and has multiple second through channels 201 that are one-to-one with the first through channels 103. The support structure 200 has a second conductive layer 202, which is grounded and abuts against the conductive edges 105.

[0059] Specifically, the LED light-emitting diodes 101 are arranged in an array and mounted on the surface of the printed circuit board 100. Conductive edges 105 surround and completely enclose the opening of the first through channel 103. The conductive edges 105 at the same first through channel 103 extend along the circumferential trajectory of the first through channel 103 and connect with the first conductive layer 104 to form a conductive whole. The shape and structure of the support structure 200 are the same as those of the printed circuit board 100. The second through channel 201 has the same shape and size as the first through channel 103 and is positioned directly opposite to the first through channel 103.

[0060] It should be noted that this embodiment does not limit the shape and size of the first through channel 103. The cross-section of the first through channel 103 can be slit-shaped. In some embodiments not shown, the shape of the first through channel 103 can also be one or a combination of circles, polygons, ellipses, and waist shapes, or other irregular shapes. The first through channel 103 is arranged as many times as possible while satisfying the strength of the printed circuit board 100 and the arrangement of the circuit, LED light-emitting tubes 101 and driving elements 102, so that the proportion of the total area of ​​the first through channel 103 to the area of ​​the printed circuit board 100 is maximized, thereby improving the amount and quality of sound passing through the LED module.

[0061] It should be further noted that the shapes of the different first through channels 103 can be different or the same.

[0062] In this embodiment, by setting opposing first through-channels 103 and second through-channels 201 on the LED module, sound can pass through the through-channels, reducing the loss of sound quality and volume. By setting a first conductive layer 104 on the inner peripheral sidewall of the first through-channel 103 and connecting it to the second conductive layer 202 of the support structure 200 and grounding it, each first conductive layer 104 and the second conductive layer 202 form an equipotential body. When the signal probe 700 is inserted into the first through-channel 103 and the second through-channel 201, no matter how the position and depth of the probe 700 are changed, the signal cannot be detected, thereby effectively avoiding the risk of data leakage and enabling the module to meet the relevant requirements of FIPS. Meanwhile, by providing conductive edges 105 connected to the first conductive layer 104 at the openings of the first through-channel 103 on both sides of the printed circuit board 100, the electrical connection between the first conductive layer 104 and the second conductive layer 202 is maintained when the support structure 200 is tightly connected to the printed circuit board 100. This greatly reduces the possibility of poor contact causing a failure to form an equipotential body between the first conductive layer 104 and the second conductive layer 202 on the printed circuit board 100, and also avoids the grounding failure of the first conductive layer 104, providing reliable protection for data security. In addition, because the LED module is provided with the first through-channel 103 and the second through-channel 201, the LED module has good heat dissipation and ventilation functions, solving the fire smoke exhaust problem when the LED module is installed over a large area on the interior wall of a building.

[0063] In one embodiment, the support structure 200 is made of a conductive material to form a second conductive layer 202, or the surface of the support structure 200 is metallized to form a second conductive layer 202.

[0064] In this embodiment, the second conductive layer 202 of the support structure 200 can be formed by the support structure 200 itself being made of a conductive material and thus having conductive properties, or it can be formed by a conductive thin film made on the surface of the support structure 200 through electroplating, deposition, film lamination and other methods, so that the module components have more options and can be adapted to different working environments and meet different equipment requirements.

[0065] Please see Figure 2 In one embodiment, the LED module further includes a masking layer 300, which is integrally disposed with the printed circuit board 100 and located on the side of the printed circuit board 100 away from the support structure 200. A first through channel 103 extends through the masking layer 300. The masking layer 300 is made of conductive material and is electrically connected to the first conductive layer 104. The LED light-emitting tube 101 passes through the masking layer 300.

[0066] Specifically, the masking layer 300 is made of a metallic material and is integrally formed on the surface of the printed circuit board 100 through methods such as plating or coating, thereby tightly connecting with the conductive edge 105 and forming an equipotential body. For example, the masking layer 300 is formed on the surface of the printed circuit board 100 by copper plating. Furthermore, the side of the masking layer 300 away from the printed circuit board 100 undergoes a uniform treatment to ensure that the surface color and light absorption of the masking layer 300 meet the requirements of an LED screen.

[0067] In this embodiment, a masking layer 300 is provided to shield and protect the surface of the printed circuit board 100 with LED light-emitting tubes 101. Since the masking layer 300 and the printed circuit board 100 are integrally set, the LED module can have a smaller thickness, thereby further reducing the obstruction of sound and improving the sound quality passing through the LED module.

[0068] Please see Figure 3 In one embodiment, the LED module further includes a masking layer 300, which is located on the side of the printed circuit board 100 away from the support structure 200 and is tightly connected to the printed circuit board 100. The masking layer 300 has a plurality of third through channels 301 that are one-to-one with the first through channel 103. The masking layer 300 has a third conductive layer 302, which is grounded and abuts against the conductive edge 105. The masking layer 300 has a clearance groove 303 for the LED light-emitting tube 101 to pass through.

[0069] In this embodiment, a shielding layer 300 is provided to shield and protect the surface of the printed circuit board 100 with the LED light-emitting tube 101. The separate design of the shielding layer 300 and the printed circuit board 100 provides greater flexibility in the selection of LED module components and facilitates the maintenance of the printed circuit board 100. The third through-channel 301 is aligned with the first through-channel 103 and the second through-channel 201, ensuring the quality of sound transmission. Simultaneously, by providing a third conductive layer 302 and electrically connecting and grounding it to the first conductive layer 104, a complete equipotential body is formed, including the first conductive layer 104, the second conductive layer 202, and the third conductive layer 302. This gives the LED module excellent signal shielding capabilities, further ensuring data security. The conductive edge 105 also improves the contact between the third conductive layer 302 and the first conductive layer 104, further ensuring the grounding stability of the first conductive layer 104.

[0070] In some of the above embodiments, the masking layer 300, the printed circuit board 100 and the support structure 200 are closely integrated, so that the overall thickness of the LED module is less than or equal to 5 mm, thereby making the LED module thinner and lighter and having good sound transmission performance.

[0071] In one embodiment, the masking layer 300 is made of a metallic material to form a third conductive layer 302, or the surface of the masking layer 300 is metallized to form a third conductive layer 302.

[0072] In this embodiment, the third conductive layer 302 of the masking layer 300 can be formed by the masking layer 300 itself being made of conductive material and thus having conductive properties, or it can be formed by a conductive film made on the surface of the masking layer 300 by electroplating, pasting or coating, etc., so that the module components have more options and can be adapted to different working environments and meet different equipment requirements.

[0073] In one embodiment, a plurality of connecting contacts 106 are provided on the printed circuit board 100. The plurality of connecting contacts 106 are distributed on one side of the printed circuit board 100 or on both sides of the printed circuit board 100. The connecting contacts 106 are adapted to abut against the second conductive layer 202 or the third conductive layer 302.

[0074] Specifically, the connecting contacts 106 can be distributed on one side of the printed circuit board 100 facing the mask layer 300, or on one side of the printed circuit board 100 facing the support structure 200, or on both sides of the printed circuit board 100. Each connecting contact 106 abuts against the second conductive layer 202 or the third conductive layer 302 directly opposite the surface of the printed circuit board 100.

[0075] It should be noted that this embodiment does not limit the specific shape of the connecting contact 106. The cross-section of the connecting contact 106 can be disc-shaped, and in some embodiments not shown, it can also be polygonal, elliptical, irregular, etc. In addition, this embodiment does not limit the specific distribution of the connecting contact 106. The connecting contact 106 can be freely set according to the specific position of the LED light-emitting tube 101 and the specific position of the driving element 102.

[0076] In this embodiment, by providing connecting contacts 106 on the surface of the printed circuit board 100 to abut against the adjacent second conductive layer 202 or third conductive layer 302, an electrical connection is formed between the printed circuit board 100 and the shielding layer 300 or the support structure 200, or between the printed circuit board 100, the shielding layer 300 and the support structure 200. Depending on the specific structure and distribution of the connecting contacts 106, the electrical connection can be a single-point, multi-point or local electrical connection, thereby forming an equipotential body between the printed circuit board 100 and the shielding layer 300 or the support structure 200. This makes the equipotential body structure that can shield electrical signals in the LED module more three-dimensional, greatly improving the signal shielding capability and enhancing data security.

[0077] In one embodiment, the cross-sectional shape of the first through channel 103 is a combination of one or more shapes selected from circles, polygons, ellipses, and waist shapes.

[0078] Specifically, the total area of ​​all first through channels 103 on the surface of the printed circuit board 100 is between 1% and 60%. Furthermore, by using a combination of one or more shapes such as circles, polygons, ellipses, and oblong shapes for the cross-sectional shape of the first through channels 103, the placement of the first through channels 103 on the printed circuit board 100 becomes more flexible. This allows for flexible arrangement of the position and shape of the first through channels 103 according to the differences in LED light-emitting tubes 101, drivers, and circuits on different printed circuit boards 100, thereby maximizing the total area of ​​the first through channels 103 on the printed circuit board 100 and ensuring both sound throughput and sound quality. For example, the total area of ​​all first through channels 103 on the surface of the printed circuit board 100 is between 1% and 30%, avoiding excessive obstruction of the center speaker's sound, thus ensuring both overall image quality and the total amount and quality of sound throughput.

[0079] Please see Figure 4 and Figure 5 In one embodiment, a driving element 102 of the LED light-emitting tube 101 is provided on the side of the printed circuit board 100 away from the LED light-emitting tube 101, and a receiving groove 203 is provided on the support structure 200 opposite to the driving element 102. The receiving groove 203 and the printed circuit board 100 form an isolation space surrounding the driving element 102.

[0080] In this embodiment, by providing a receiving groove 203 for accommodating the driving element 102 on the support structure 200, a covering structure is formed between the printed circuit board 100 and the support structure 200 to surround the driving element 102, thereby avoiding the possibility of signal leakage caused by the external exposure of the driving element 102, and also avoiding the possibility of the signal probe 700 directly stealing the signal by contacting the driving element 102 from the support structure 200 side.

[0081] In one embodiment, a first trigger switch is provided between the support structure 200 and the printed circuit board 100.

[0082] Specifically, the first trigger switch can be a micro switch or an electrical contact switch. The first trigger switch is electrically connected to the screen control system, thereby sending a signal to the screen control system. The first trigger switch can be installed on the support structure 200 or on the printed circuit board 100. The specific installation position of the first trigger switch on the support structure 200 or on the printed circuit board 100 is not limited.

[0083] In this embodiment, a first trigger switch is provided between the printed circuit board 100 and the support structure 200. When the LED module is assembled, the first trigger switch is in a state of being triggered and pressed by the printed circuit board 100 and the support structure 200. When the printed circuit board 100 is illegally removed, the first trigger switch is triggered because it loses its pressing state. This avoids data leakage caused by structural damage by means of forcibly interrupting signal transmission or issuing an alarm in the control system.

[0084] In some of the above embodiments, the conductive material can be copper, other metallic materials, or other non-metallic materials that can form an electrostatic shielding layer. For example, the non-metallic material can be graphene.

[0085] According to an embodiment of the present invention, an LED display screen is also provided, please refer to [link / reference]. Figure 6 and Figure 7 The system includes: multiple frame-type cabinets 400, each frame-type cabinet 400 being a metal frame and grounded; multiple frame-type cabinets 400 being arranged in an array to form a display screen frame, the long side of which is greater than or equal to 3 meters; a system electrical control box 500, installed inside the frame-type cabinets 400; multiple LED modules, each connected to a frame-type cabinet 400; and a compressible conductive medium on the support structure 200 that is electrically connected to the second conductive layer 202, the compressible conductive medium being in contact with the frame-type cabinets 400.

[0086] Specifically, the frame-type enclosure 400 is a metal enclosure, which can be made of profiles or sheet metal. The frame-type enclosure 400 is grounded and has multiple grilles (not shown in the figure) on the inside for mounting LED modules. The grilles provide a mounting base for the LED modules and also facilitate the grounding of the LED modules through electrical connection with the frame-type enclosure 400.

[0087] It should be noted that the compressible conductive medium can be an elastic conductive sheet or other elastic conductive parts.

[0088] In addition, the length of the LED display screen can be selected according to the actual site requirements. For example, the length of the LED display screen is 10 meters, 16 meters or 20 meters. The aspect ratio of the LED display screen can be set according to the site or industry standards. For example, the aspect ratio is 1.85:1 or 2.35:1.

[0089] In this embodiment, the frame-type housing 400 provides an installation base for the LED module. Since the frame-type housing 400 uses a metal frame, when the first conductive layer 104, the second conductive layer 202, and the third conductive layer 302 of the LED module are electrically connected to the frame-type housing 400, the LED module and the frame-type housing 400 form an integral equipotential body structure, thereby having an overall function of preventing signal leakage. Due to its compressibility, the compressible conductive medium can greatly reduce the installation accuracy requirements of the LED module and improve the compatibility between the LED module and the frame-type housing 400. In addition, by opening a first through channel 103 on the printed circuit board 100, the sound obstruction effect is reduced, allowing the sound of the center speaker behind the screen to be played through the LED display screen. Compared with the method of using sound reflectors and channel synthesis to simulate a center speaker, this technology is cheaper and more adaptable because it does not require engineers to design the speaker and channel layout separately according to the viewing venue. Especially when the viewing venue is large, it is not possible to use channel synthesis to simulate a center speaker, but this technology can be applied to viewing venues of various sizes.

[0090] In one embodiment, the system control box 500 includes a cover 503 and a body 502 that are hinged to each other. A safety anti-pry lock 501 is provided between the cover 503 and the body 502, and a second trigger switch 800 is provided.

[0091] Specifically, the second trigger switch 800 can be a micro switch or an electric contact switch, and it is electrically connected to the screen control system. The second trigger switch 800 is located at the anti-pry lock 501, and it starts to work when the anti-pry lock 501 disengages from the lock on the cover.

[0092] In this embodiment, the hinged design of the cover 503 and the body 502 facilitates the later maintenance and repair of the system control box 500. The safety anti-pry lock 501 can reduce the possibility of the system control box 500 being illegally opened. The second trigger switch 800 causes the control system to issue an alarm or send an interrupt signal when the system control box 500 is illegally opened, thereby further improving the data security performance of the LED screen.

[0093] In one embodiment, sound-absorbing material 600 is laid on the inner periphery of the frame enclosure 400 and the periphery of the system control box 500.

[0094] Specifically, the sound-absorbing material 600 can be sound-absorbing cotton or other materials with sound-absorbing effects.

[0095] Additionally, it should be noted that when LED displays are used in cinemas, a movie server needs to be installed behind the LED display to enable movie playback.

[0096] In this embodiment, by laying sound-absorbing material 600 inside the frame enclosure 400, the reflection of sound inside the frame enclosure 400 can be effectively reduced, thereby reducing the distortion effect of reflection on sound and improving sound quality.

[0097] In one embodiment, see Figures 8 to 10 A connector kit 901 is provided between adjacent frame-type boxes 400. The connector kit 901 penetrates the side walls of the two adjacent frame-type boxes 400, and the connector kit 901 has a through hole that passes through the two adjacent frame-type boxes 400. The connector kit 901 is made of conductive material and is electrically connected to the frame-type box 400.

[0098] Specifically, this embodiment does not limit the specific form of the connector kit 901. Any connector kit 901 capable of surrounding the cables between adjacent frame-type enclosures 400 and preventing signal leakage should be within the protection scope of this embodiment. For example, the connector kit 901 is located in a system control box along the length or width of the LED screen. Several conduits 900 perpendicular to the system control box are connected to the system control box. The connector kit 901 is located at the end of the system control box and the end of the conduits 900. The connector kits 901 located at the end of the system control box are respectively inserted into the system control boxes within adjacent frame-type enclosures 400, thereby preventing cable exposure. The connector kit 901 located at the end of the conduit 900 is part of the conduit 900, extending from the end of the conduit 900 and into the conduit 900 of the adjacent frame-type enclosure 400, achieving complete cable enclosure and thus preventing signal leakage.

[0099] In this embodiment, by setting a connector kit 901, the wiring between adjacent frame-type enclosures 400 is wrapped and protected. The connector kit 901 passes from one frame-type enclosure 400 into another frame-type enclosure 400 and forms an electrical connection structure with the frame-type enclosure 400, thereby forming an equipotential body with the frame-type enclosure 400, further preventing signal leakage at the cable connection point, and further ensuring data security.

[0100] According to an embodiment of the present invention, another aspect provides an LED dome screen, including a plurality of frame-type cabinets 400, the frame plane of the frame-type cabinets 400 being arc-shaped, the plurality of frame-type cabinets 400 being arranged in an array to form an arc-shaped display screen frame, the long side of the display screen frame being greater than or equal to 3 meters.

[0101] The aforementioned LED module is provided in multiple parts and is connected to the frame-type housing 400 respectively. The support structure 200 has a compressible conductive medium that is electrically connected to the second conductive layer 202. The compressible conductive medium abuts against the frame-type housing 400.

[0102] According to an embodiment of the present invention, in another aspect, an LED curved screen, a mounting frame, and a plurality of the above-described LED modules are also provided, wherein the plurality of LED modules are mounted on the mounting frame and arranged in a curved shape.

[0103] In this embodiment, the curved arrangement of LED modules forms a curved screen, which further enhances the diversity of screen usage scenarios and applicable venues, and improves the practicality of the product.

[0104] Although embodiments of the invention have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the invention, and such modifications and variations all fall within the scope defined by the appended claims.

Claims

1. An LED module, characterized in that, include: A printed circuit board (100) is provided with a plurality of LED light-emitting tubes (101) on one side. A plurality of first through channels (103) are provided on the printed circuit board (100). A first conductive layer (104) is provided on the inner peripheral sidewall of the first through channel (103). Conductive edges (105) corresponding to the first through channels (103) are provided on both sides of the printed circuit board (100). The conductive edges (105) are laid from the periphery towards the first through channel (103) and extend to the first conductive layer (104) and are electrically connected to the first conductive layer (104). The first conductive layer (104) is grounded. A support structure (200) is adapted to support the printed circuit board (100) and has a plurality of second through channels (201) that are one-to-one opposite to the first through channel (103). The support structure (200) has a second conductive layer (202) that is grounded and abuts against the conductive edge (105). The support structure (200) is made of a conductive material to form the second conductive layer (202), or the surface of the support structure (200) is metallized to form the second conductive layer (202). The printed circuit board (100) is provided with a plurality of connecting contacts (106), which are distributed on one side of the printed circuit board (100) or on both sides of the printed circuit board (100). The connecting contacts (106) are adapted to abut against the second conductive layer (202).

2. The LED module according to claim 1, characterized in that, The LED module also includes a masking layer (300), which is integrally disposed with the printed circuit board (100) and located on the side of the printed circuit board (100) away from the support structure (200). The first through channel (103) extends through the masking layer (300). The masking layer (300) is made of conductive material and is electrically connected to the first conductive layer (104). The LED light-emitting tube (101) passes through the masking layer (300).

3. The LED module according to claim 1, characterized in that, The LED module also includes a masking layer (300), which is located on the side of the printed circuit board (100) away from the support structure (200) and is tightly connected to the printed circuit board (100). The masking layer (300) has a plurality of third through channels (301) that are one-to-one with the first through channel (103). The masking layer (300) has a third conductive layer (302), which is grounded and abuts against the conductive edge (105). The masking layer (300) has a clearance groove (303) for the LED light-emitting tube (101) to pass through.

4. The LED module according to claim 3, characterized in that, The masking layer (300) is made of a metallic material to form the third conductive layer (302), or the masking layer (300) is surface-metallized to form the third conductive layer (302).

5. The LED module according to any one of claims 1 to 4, characterized in that, The cross-sectional shape of the first through channel (103) is a combination of one or more shapes among the following: circle, polygon, ellipse and waist.

6. The LED module according to claim 5, characterized in that, The ratio of the total area of ​​the plurality of first through channels (103) to the area of ​​the printed circuit board (100) is 1%-30%.

7. The LED module according to claim 1, characterized in that, The printed circuit board (100) has a driving element (102) of the LED light-emitting tube (101) on the side opposite to the LED light-emitting tube (101). The support structure (200) has a receiving groove (203) at the position opposite to the driving element (102). The receiving groove (203) and the printed circuit board (100) form an isolation space surrounding the driving element (102).

8. The LED module according to claim 7, characterized in that, A first trigger switch is provided between the support structure (200) and the printed circuit board (100).

9. An LED display screen, characterized in that, include: Multiple frame-type cabinets (400), the frame-type cabinets (400) are metal frames and grounded, the multiple frame-type cabinets (400) are spliced ​​together in an array to form a display screen frame, the long side of the display screen frame is greater than or equal to 3 meters. The system electrical control box (500) is installed inside the frame-type enclosure (400); The LED module according to any one of claims 1 to 8 is provided with a plurality of components and is respectively connected to the frame-type housing (400), the support structure (200) has a compressible conductive medium electrically connected to the second conductive layer (202), and the compressible conductive medium abuts against the frame-type housing (400).

10. The LED display screen according to claim 9, characterized in that, The system control box (500) includes a cover (503) and a body (502) that are hinged to each other. A safety anti-pry lock (501) is provided between the cover (503) and the body (502) and a second trigger switch (800).

11. The LED display screen according to claim 9, characterized in that, The inner periphery of the frame-type enclosure (400) and the periphery of the system electrical control box (500) are both covered with sound-absorbing material (600).

12. The LED display screen according to claim 9, characterized in that, A connector kit (901) is provided between adjacent frame-type boxes (400). The connector kit (901) penetrates the side walls of the two adjacent frame-type boxes (400), and the connector kit (901) has a through hole that passes through the two adjacent frame-type boxes (400). The connector kit (901) is made of conductive material and is electrically connected to the frame-type boxes (400).

13. An LED dome screen, characterized in that, include Multiple frame-type cabinets (400), the frame plane of the frame-type cabinets (400) is hyperboloid, and the multiple frame-type cabinets (400) are spliced ​​together in an array to form a spherical display screen frame, and the diameter of the LED dome is greater than or equal to 3 meters. The LED module according to any one of claims 1 to 8 is provided with a plurality of components and is respectively connected to the frame-type housing (400), the support structure (200) has a compressible conductive medium electrically connected to the second conductive layer (202), and the compressible conductive medium abuts against the frame-type housing (400).

14. An LED curved screen, characterized in that, include Mounting rack; The LED modules according to any one of claims 1 to 8, wherein the LED modules are all mounted on the mounting bracket and arranged in an arc shape.

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