Ultra-fine enameled wire of micrometer level and its manufacturing method

Abstract

The present application relates to the technical field of enameled wires, and in particular to an ultra-fine enameled wire of the millimeter level and a method for making the same, comprising the following steps: laying out the wire, adding plastic film, preheating, primary wire drawing, secondary heating, secondary wire drawing, removing plastic film, annealing and painting, and baking and cooling. The ultra-fine enameled wire of the millimeter level and the method for making the same in the present application, during the production process, use a variety of means to improve the tensile strength of the soft copper rod, greatly reduce the wire breakage phenomenon during the wire drawing process, and finally, after the wire drawing process is completed, effectively remove the plastic film on the surface of the copper wire, so as to facilitate subsequent annealing, painting and drying processes, so as to obtain an ultra-fine enameled wire of the millimeter level with a uniform and firm structure and a wire diameter of 0.02-0.07mm.

Description

Technical Field

[0001] The present application relates to the technical field of enameled wires, and in particular to a micrometer-level ultra-fine enameled wire and a manufacturing method thereof. Background Art

[0002] Enameled wire is a main type of winding wire, which consists of a conductor and an insulating layer. The bare wire is annealed and softened, then painted and baked for many times. However, it is not easy to produce products that meet both standard requirements and customer requirements. It is affected by factors such as raw material quality, process parameters, production equipment, and environment. Therefore, the quality characteristics of various enameled wires are different, but they all have four major properties: mechanical properties, chemical properties, electrical properties, and thermal properties.

[0003] For example, a Chinese patent with application number 201810676663.3 discloses a method for producing ultra-fine enameled wire, which includes: a. wire-paying, selecting a 1.33MM soft copper rod that is rolled up and placed on a wire-paying device; b. wire drawing, drawing the copper rod into a 0.020MM semi-finished wire; c. cleaning, cleaning the semi-finished wire; d. annealing, continuously annealing the semi-finished wire by a non-contact annealing method; e. painting, coating the semi-finished wire with wire lacquer by a felt painting method; f. baking, evaporating and curing the semi-finished wire in a baking furnace; g. cooling, countercurrent cooling the semi-finished wire; h. oiling, applying lubricating grease to the surface of the semi-finished wire; i. wire-winding, winding the enameled wire continuously, tightly and evenly on a reel through a wire-winding device.

[0004] With respect to the above-mentioned related technologies, the inventor believes that there are the following defects:

[0005] Common copper enameled wires are generally made of copper rods through drawing. With the development of miniaturization technology of electronic products, higher requirements are put forward for the fine diameter of fine electromagnetic wires. Not only must they be light in weight and small in diameter, but they must also have increased power. However, as the diameter of the enameled wire becomes smaller, the ultra-fine enameled wire is more likely to break during the drawing and winding process. Therefore, the diameter of the common ultra-fine enameled wires on the market is generally between 0.1-0.8 mm, which cannot meet the special needs of enameled wires with smaller diameters. Summary of the invention

[0006] The present application provides a micrometer-level ultra-fine enameled wire and a manufacturing method thereof to improve the following technical problems:

[0007] The diameter of the common ultra-fine enameled wires on the market is generally between 0.1-0.8 mm, which cannot meet the special needs of enameled wires with smaller wire diameters.

[0008] In the first aspect, the present application provides a method for manufacturing ultra-fine enameled wire at the micrometer level, using the following technical solution:

[0009] A method for producing a micrometer-level ultra-fine enameled wire comprises the following steps:

[0010] a. Paying off the wire: Use a reeled soft copper rod and place it on the pay-off device. The diameter of the soft copper rod should be between 1-2mm.

[0011] b. Adding plastic film: Wrapping a layer of elastic plastic film on the surface of the soft copper rod to form a first wire, wherein the plastic film is made of high temperature resistant plastic with a thermal deformation temperature above 170 degrees Celsius;

[0012] c. Preheating, heating the first wire to 70-90 degrees Celsius to form a second wire;

[0013] d. Initial wire drawing: drawing the second wire into a third wire with a wire diameter between 0.5 and 0.8 mm at 90-100 degrees Celsius;

[0014] e. secondary heating, heating the third wire to 110-120 degrees Celsius to form a fourth wire;

[0015] f. secondary wire drawing, drawing the fourth wire into a fifth wire with a wire diameter between 0.01 and 0.1 mm at 130-150 degrees Celsius;

[0016] g. removing the plastic film, heating the fifth wire in an ultra-high temperature environment to liquefy the plastic film on the surface of the fifth wire, then removing the high temperature resistant plastic of the fifth wire by wiping, and forming a sixth wire with a wire diameter between 0.01-0.05 mm, wherein the ultra-high temperature environment temperature is greater than the melting point of the high temperature resistant plastic;

[0017] h. Annealing and painting: continuously annealing the sixth wire and then painting it to form a seventh wire;

[0018] i. Baking and cooling: the seventh wire is evaporated and solidified in a baking furnace, and then countercurrent cooled by water cooling / air cooling to obtain ultra-fine enameled wires with a wire diameter of 0.02-0.07mm.

[0019] In an achievable technical solution of the present application, the high temperature resistant plastic used in step a is a photocurable polyurethane material, which contacts the surface of the soft copper rod by means of atomized spraying of the coating, and then is photocured by an ultraviolet lamp to form a plastic film, wherein the melting point of the photocurable polyurethane material is 170-190 degrees Celsius.

[0020] In an achievable technical solution of the present application, the time for the preheating treatment in step c is 3-5 minutes, and the time for the secondary heating treatment in step e is 6-10 minutes.

[0021] In an achievable technical solution of the present application, the first wire drawing machine used for the initial wire drawing process in step d has a first electromagnetic induction heater and a second electromagnetic induction heater, the first electromagnetic induction heater is used to heat the first wire to 70-90 degrees Celsius, and the second electromagnetic induction heater is used to heat the heating environment of the initial wire drawing to 90-100 degrees Celsius.

[0022] In an achievable technical solution of the present application, the second wire drawing machine used for the secondary wire drawing process in step f has a third electromagnetic induction heater and a fourth electromagnetic induction heater, the third electromagnetic induction heater is used to heat the third wire to 110-120 degrees Celsius, and the fourth electromagnetic induction heater is used to heat the heating environment of the secondary wire drawing to 130-150 degrees Celsius.

[0023] In an achievable technical solution of the present application, in step f, a plurality of metal wiping plates are customized, and the plurality of metal wiping plates are arranged vertically and in parallel at intervals, and each metal wiping plate is provided with holes, and a wiping sponge block is detachably bonded to the hole, and the wiping sponge block is used for allowing the fifth wire to pass through and cleaning and removing the high temperature resistant plastic of the fifth wire.

[0024] In an achievable technical solution of the present application, in step h, the continuous annealing method is: a non-contact annealing method, and the continuous annealing adopts an annealing furnace with a multi-stage temperature control function, wherein the first stage annealing temperature of the annealing furnace is 280-300 degrees Celsius, the second stage annealing temperature of the annealing furnace is 300-330 degrees Celsius, and the third stage annealing temperature of the annealing furnace is 330-350 degrees Celsius.

[0025] In an achievable technical solution of the present application, in step h, the painting treatment method is: felt painting method, wherein the distance between the felt and the paint tank is 30-40 mm, the distance between the felt and the baking oven is 150-180 mm, and the density of the felt is 0.18-0.24 g / cubic centimeter.

[0026] In an achievable technical solution of the present application, the following steps are also included:

[0027] j. Oil-coating and wire-winding: Apply lubricating grease to the surface of the ultra-fine enameled wire to enable it to be unwound at high speed during the winding process. Then wind the ultra-fine enameled wire on the reel continuously, tightly and evenly to form an enameled wire roll.

[0028] In the second aspect, the present application provides a micrometer-level ultra-fine enameled wire, which adopts the following technical solution:

[0029] A micrometer-level ultra-fine enameled wire is produced by the above-mentioned micrometer-level ultra-fine enameled wire production method.

[0030] In summary, the present application includes at least one of the following beneficial technical effects:

[0031] In the early stage of wire drawing of soft copper rod, it is first covered with plastic film. The plastic film not only has good elasticity to adapt to the subsequent multiple wire drawing processes, but also has good high temperature resistance to adapt to the high temperature environment in the subsequent wire drawing process, so that the plastic film can significantly improve the tensile strength of the soft copper rod. Further, the soft copper rod is gradually heated by the step-by-step heating method of preheating and secondary heating to fully soften the soft copper rod, and further improve the tensile strength of the soft copper rod. At the same time, the initial wire drawing and secondary wire drawing are carried out under different temperature conditions to greatly reduce the wire breaking phenomenon during the wire drawing process. Finally, after the wire drawing process is completed, the plastic film on the surface of the copper wire is effectively removed for subsequent annealing, painting and drying. In particular, it can prevent the excess plastic film from affecting the connection firmness between the spray paint and the copper wire, and thus obtain a micrometer-level ultra-fine enameled wire with a uniform and firm structure and a wire diameter of 0.02-0.07mm. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0033] Figure 1 It is a process flow chart of the ultra-fine enameled wire of the micrometer level and its manufacturing method according to the embodiment of the present application.

[0034] Figure 2 It is a schematic diagram of the structure of the metal wiping plate and the wiping sponge block in the embodiment of the present application.

[0035] Description of reference numerals:

[0036] 100. Metal wiping plate; 11. Holes; 200. Wiping sponge block; 300. Telescopic cylinder. DETAILED DESCRIPTION

[0037] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0038] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0039] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0040] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0041] The following is combined with Figure 1-2 This application is described in further detail.

[0042] The present application discloses a micrometer-level ultra-fine enameled wire and a method for making the same. Figure 1 The method for making ultra-fine enameled wire of micrometer level comprises the following steps:

[0043] a. Paying off the wire: Use a reeled soft copper rod and place it on the pay-off device. The diameter of the soft copper rod should be between 1-2mm.

[0044] b. Plastic film: a layer of elastic plastic film is wrapped on the surface of the soft copper rod to form a first wire, the plastic film is made of high-temperature resistant plastic with a thermal deformation temperature above 170 degrees Celsius, wherein the high-temperature resistant plastic used is a light-curing polyurethane material, the light-curing polyurethane material is contacted with the surface of the soft copper rod by a coating atomization spray, and then light-cured by an ultraviolet lamp to form a plastic film, wherein the melting point of the light-curing polyurethane material is 170-190 degrees Celsius;

[0045] c. Preheating: heating the first wire to 70-90 degrees Celsius to form a second wire. In order to make the first wire fully and evenly heated, the preheating time is 3-5 minutes;

[0046] d. Initial wire drawing, drawing the second wire into a third wire with a wire diameter between 0.5 and 0.8 mm at a temperature of 90 to 100 degrees Celsius, wherein the first wire drawing machine used in the initial wire drawing process comprises a first electromagnetic induction heater and a second electromagnetic induction heater, wherein the first electromagnetic induction heater is used to heat the first wire to 70 to 90 degrees Celsius, and the second electromagnetic induction heater is used to heat the heating environment of the initial wire drawing to 90 to 100 degrees Celsius;

[0047] e. Secondary heating: heating the third wire to 110-120 degrees Celsius to form a fourth wire. In order to make the third wire fully and evenly heated, the secondary heating treatment time is 6-10 minutes;

[0048] f. secondary wire drawing, drawing the fourth wire into a fifth wire with a wire diameter between 0.01 and 0.1 mm at 130-150 degrees Celsius, the second wire drawing machine used in the secondary wire drawing process has a third electromagnetic induction heater and a fourth electromagnetic induction heater, the third electromagnetic induction heater is used to heat the third wire to 110-120 degrees Celsius, and the fourth electromagnetic induction heater is used to heat the heating environment of the secondary wire drawing to 130-150 degrees Celsius;

[0049] g. Remove the plastic film, heat the fifth wire in an ultra-high temperature environment, and liquefy the plastic film on the surface of the fifth wire, then remove the high-temperature resistant plastic of the fifth wire by wiping, and form a sixth wire with a wire diameter between 0.01-0.05mm, wherein the ultra-high temperature environment temperature is greater than the melting point of the high-temperature resistant plastic. In this step, please refer to Figure 2 , it is necessary to customize four metal wiping plates 100 in advance (the number of metal wiping plates 100 can be between 3 and 8), the four metal wiping plates 100 are arranged vertically and spaced in parallel, each metal wiping plate 100 is provided with a hole 11, and a wiping sponge block 200 is detachably bonded to the hole, and the wiping sponge block 200 is used for allowing the fifth wire to pass through and clean and remove the high-temperature resistant plastic of the fifth wire. In the process of gradually horizontally conveying the fifth wire, a telescopic cylinder 300 can also be added to drive the metal wiping plate 100 to rise and fall at a high frequency to form a slight shaking effect, so that the wiping sponge block 200 has a better cleaning effect on the surface of the fifth wire;

[0050] h. Annealing and painting. The sixth wire is subjected to continuous annealing. The continuous annealing method is: non-contact annealing method, and the continuous annealing adopts an annealing furnace with a multi-stage temperature control function, wherein the first stage annealing temperature of the annealing furnace is 280-300 degrees Celsius, the second stage annealing temperature of the annealing furnace is 300-330 degrees Celsius, and the third stage annealing temperature of the annealing furnace is 330-350 degrees Celsius; then the sixth wire is subjected to annealing. The annealing method is: felt painting method, wherein the distance between the felt and the paint tank is 30-40 mm, the distance between the felt and the baking furnace is 150-180 mm, and the density of the felt is 0.18-0.24 g / cm3, thereby forming the seventh wire;

[0051] i. Baking and cooling: the seventh wire is evaporated and solidified in a baking furnace, and then countercurrent cooled by water cooling / air cooling to obtain ultra-fine enameled wires with a wire diameter of 0.02-0.07 mm;

[0052] j. Oil-coating and wire-winding: Apply lubricating grease to the surface of the ultra-fine enameled wire to enable it to be unwound at high speed during the winding process. Then wind the ultra-fine enameled wire on the reel continuously, tightly and evenly to form an enameled wire roll.

[0053] The beneficial technical effects of the method for manufacturing the micrometer-level ultra-fine enameled wire in the embodiment of the present application are roughly as follows:

[0054] In the early stage of wire drawing of soft copper rod, it is first covered with plastic film. The plastic film not only has good elasticity to adapt to the subsequent multiple wire drawing processes, but also has good high temperature resistance to adapt to the high temperature environment in the subsequent wire drawing process, so that the plastic film can significantly improve the tensile strength of the soft copper rod. Further, the soft copper rod is gradually heated by the step-by-step heating method of preheating and secondary heating to fully soften the soft copper rod, and further improve the tensile strength of the soft copper rod. At the same time, the initial wire drawing and secondary wire drawing are carried out under different temperature conditions to greatly reduce the wire breaking phenomenon during the wire drawing process. Finally, after the wire drawing process is completed, the plastic film on the surface of the copper wire is effectively removed for subsequent annealing, painting and drying. In particular, it can prevent the excess plastic film from affecting the connection firmness between the spray paint and the copper wire, and thus obtain a micrometer-level ultra-fine enameled wire with a uniform and firm structure and a wire diameter of 0.02-0.07mm.

[0055] The embodiment of the present application also provides a micrometer-level ultra-fine enameled wire, which is produced by the above-mentioned micrometer-level ultra-fine enameled wire production method, wherein the wire diameter of the micrometer-level ultra-fine enameled wire is between 0.02-0.07mm, and is widely used in high-tech electronic products.

[0056] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the application should be included in the protection scope of the present application.

Claims

1. A method for producing micrometer-level ultra-fine enameled wire, characterized in that: The following steps are involved: a. Paying off the wire: Use a reeled soft copper rod and place it on the pay-off device. The diameter of the soft copper rod should be between 1-2mm. b. Plastic filming: a layer of elastic plastic film is wrapped on the surface of the soft copper rod to form a first wire, the plastic film is made of high-temperature resistant plastic with a thermal deformation temperature above 170 degrees Celsius, and the high-temperature resistant plastic used is a light-curing polyurethane material. The light-curing polyurethane material contacts the surface of the soft copper rod by atomizing and spraying the coating, and then is photocured by an ultraviolet lamp to form a plastic film, wherein the melting point of the light-curing polyurethane material is 170-190 degrees Celsius; c. Preheating, heating the first wire to 70-90 degrees Celsius to form a second wire; d. Initial wire drawing: drawing the second wire into a third wire with a wire diameter between 0.5 and 0.8 mm at 90-100 degrees Celsius; e. secondary heating, heating the third wire to 110-120 degrees Celsius to form a fourth wire; f. secondary wire drawing, drawing the fourth wire into a fifth wire with a wire diameter between 0.01 and 0.1 mm at 130-150 degrees Celsius; g. removing the plastic film, heating the fifth wire in an ultra-high temperature environment to liquefy the plastic film on the surface of the fifth wire, then removing the high temperature resistant plastic of the fifth wire by wiping, and forming a sixth wire with a wire diameter between 0.01-0.05 mm, wherein the ultra-high temperature environment temperature is greater than the melting point of the high temperature resistant plastic; h. Annealing and painting: continuously annealing the sixth wire and then painting it to form a seventh wire; i. Baking and cooling: the seventh wire is evaporated and solidified in a baking furnace, and then countercurrent cooled by water cooling / air cooling to obtain ultra-fine enameled wires with a wire diameter of 0.02-0.07mm.

2. The method for producing micrometer-level ultra-fine enameled wire according to claim 1, characterized in that: The time for the preheating treatment in step c is 3-5 minutes, and the time for the secondary heating treatment in step e is 6-10 minutes.

3. The method for producing micrometer-level ultra-fine enameled wire according to claim 1, characterized in that: The first wire drawing machine used in the initial wire drawing process in step d has a first electromagnetic induction heater and a second electromagnetic induction heater. The first electromagnetic induction heater is used to heat the first wire to 70-90 degrees Celsius, and the second electromagnetic induction heater is used to heat the heating environment of the initial wire drawing to 90-100 degrees Celsius.

4. The method for producing the micrometer-level ultra-fine enameled wire according to claim 1, characterized in that: The second wire drawing machine used in the secondary wire drawing process in step f has a third electromagnetic induction heater and a fourth electromagnetic induction heater. The third electromagnetic induction heater is used to heat the third wire to 110-120 degrees Celsius, and the fourth electromagnetic induction heater is used to heat the heating environment of the secondary wire drawing to 130-150 degrees Celsius.

5. The method for producing micrometer-level ultra-fine enameled wire according to claim 1, characterized in that: In step f, multiple metal wiping plates are customized, and the multiple metal wiping plates are arranged vertically and in parallel at intervals. Each metal wiping plate is provided with a hole, and a wiping sponge block is detachably bonded to the hole. The wiping sponge block is used for allowing the fifth wire to pass through and cleaning and removing the high temperature resistant plastic of the fifth wire.

6. The method for producing micrometer-level ultra-fine enameled wire according to claim 1, characterized in that: In step h, the continuous annealing method is: non-contact annealing method, and the continuous annealing adopts an annealing furnace with a multi-stage temperature control function, wherein the first stage annealing temperature of the annealing furnace is 280-300 degrees Celsius, the second stage annealing temperature of the annealing furnace is 300-330 degrees Celsius, and the third stage annealing temperature of the annealing furnace is 330-350 degrees Celsius.

7. The method for producing micrometer-level ultra-fine enameled wire according to claim 1, characterized in that: In step h, the painting treatment method is: felt painting method, wherein the distance between the felt and the paint tank is 30-40 mm, the distance between the felt and the baking oven is 150-180 mm, and the density of the felt is 0.18-0.24 g / cm3.

8. The method for producing micrometer-level ultra-fine enameled wire according to claim 1, characterized in that: The following steps are also included: j. Oil-coating and wire-winding: Apply lubricating grease to the surface of the ultra-fine enameled wire to enable it to be unwound at high speed during the winding process. Then wind the ultra-fine enameled wire on the reel continuously, tightly and evenly to form an enameled wire roll.

9. A micrometer-level ultra-fine enameled wire, characterized in that: The invention is produced by the production method of the micrometer-level ultra-fine enameled wire according to any one of claims 1 to 8.

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