Variable flow liquid-cooled cooling module

Abstract

The present disclosure relates to a variable flow liquid-cooled cooling module. Specifically disclosed is a cooling module and a method of cooling an electronic circuit module. The cooling module includes a first cooling component and a second cooling component fluidly connected to each other. The first cooling component includes a first fluid passage having a supply section, a return section, and a body section, and a second fluid passage. The second cooling component includes an intermediate fluid passage. The body section bifurcates into a first body section and a second body section, and the first body section and the second body section further merge into a third body section. The supply section is connected to the first body section and the second body section. The return section is connected to the third body section and the intermediate fluid passage via an inlet fluid flow path established between the first cooling component and the second cooling component. The second fluid passage is connected to the intermediate fluid passage via an outlet fluid flow path established between the first cooling component and the second cooling component.

Description

Technical Field

[0001] This disclosure relates to a cooling module, an electronic device including the cooling module, and a method for cooling an electronic circuit module. Background Technology

[0002] Electronic devices such as computers and network equipment may include circuit modules, such as multi-chip modules with a substrate, wherein one or more chips (e.g., a central processing unit (CPU), a graphics processing unit (GPU), a power supply chip, a memory chip, etc.) are mounted on the substrate. The chips and / or the substrate may generate waste heat during their operation. To minimize the adverse effects of this waste heat on the circuit module, the electronic device may include a thermal management system to remove the waste heat from the chips of the circuit module. Summary of the Invention

[0003] As used herein, “thermally coupled” means that a thermally conductive path is provided between these objects to allow heat to be conducted between them. Two objects may be considered thermally coupled if any of the following are true: (1) the two objects are in contact with each other (either directly or via a TIM), (2) both objects are thermally coupled to a thermally conductive medium (e.g., heat pipes, heat diffusers, etc.) (or a chain of thermally coupled thermally conductive media), or (3) the heat transfer coefficient between the two objects is 5 W·m. 2 ·K 1 Or larger. As used herein, “electronic device” means a device such as a computer, network device, power conversion device, etc., having circuit components, one or more circuit modules, and one or more cooling modules. As used herein, “circuit component” means an electronic circuit having a printed circuit board and one or more electronic components such as capacitors and resistors. As used herein, “circuit module” means an electronic module having a substrate and multiple chipsets mounted on the substrate. The term “cold plate” as used in the art sometimes has different meanings, some more general and others more specific. As used herein, “cold plate” specifically refers to a subgroup of thermal devices configured to receive heat from at least one component (e.g., chipset) via conduction and dissipate that heat in a flow of liquid coolant (e.g., water), unlike “radiator” as used herein, which specifically refers to a subgroup of thermal devices configured to receive heat from at least one component via conduction and dissipate that heat in a gas (e.g., air). As used herein, “coolant” means a type of fluid used to absorb waste heat from a heat source such as a circuit module or from a cooling component thermally coupled to the circuit module.

[0004] Electronic devices such as computers (e.g., servers, storage devices, etc.) and network devices (e.g., wireless access points, routers, switches, etc.) may include circuit components and at least one circuit module coupled to the circuit components. Circuit components may include circuit boards (e.g., motherboards) and multiple electronic components (e.g., capacitors, resistors, etc.). For example, circuit modules may be coupled to the circuit board via solder balls. Circuit modules may include a substrate and multiple chipsets disposed on the substrate. Each of the multiple chipsets may include a first chip and a plurality of second chips optionally partially disposed around the first chip. It may be noted herein that the terms "first chip" and "second chip" may be used interchangeably without departing from the scope of this disclosure. The first chip may include, but is not limited to, a central processing unit (CPU), a graphics processing unit (GPU), etc. Each of the plurality of second chips may include, but is not limited to, a power supply chip, a memory chip, etc. During operation of the circuit components, one or more chips in the circuit module may generate waste heat. Such waste heat is undesirable because it may negatively impact the operation of the circuit components. For example, waste heat may cause physical damage to one or more chips, reduce the performance, reliability, or expected lifespan of the circuit module, and in some cases, may even cause the circuit components to fail. To overcome such waste heat problems in circuit modules having one or more chips, electronic devices may include a thermal management system for removing waste heat from one or more chips. For example, the thermal management system may include a cold plate and a coolant distribution unit (CDU) for removing waste heat from the chipset. The cold plate may be thermally coupled to one or more chips, and the CDU may be fluidly connected to the cold plate. During operation of the electronic device, the cold plate conducts waste heat from one or more chips, and the CDU may direct the flow of coolant (e.g., water) to the cold plate to dissipate the waste heat from the cold plate into the coolant flow.

[0005] However, some electronic devices may include multiple circuit components (e.g., a first circuit component and a second circuit component) and multiple circuit modules (e.g., a first set of circuit modules and a second set of circuit modules). In some examples, a first set of circuit modules (e.g., four circuit modules) may be coupled to a first circuit component, and a second set of circuit modules (e.g., eight circuit modules) may be coupled to a second circuit component. In such examples, the electronic device may further include multiple cold plates, including a first set of cold plates (e.g., four cold plates) thermally coupled to the first set of circuit modules and a second set of cold plates (e.g., eight cold plates) thermally coupled to the second set of circuit modules. The CDU may have an inlet manifold to circulate coolant to each of the first and second sets of cold plates. For example, the inlet manifold may have a first set of parallel flow paths (e.g., four parallel flow paths) and a second set of parallel flow paths (e.g., eight parallel flow paths), the first set of parallel flow paths for circulating a first portion of the coolant to the first set of cold plates and the second set of parallel flow paths for circulating a second portion of the coolant to the second set of cold plates. The CDU can be configured to circulate an equal portion of coolant (e.g., one gallon of coolant per minute) to each of the first and second sets of cold plates to effectively remove waste heat from each of the first and second sets of circuit modules. Because the first set of parallel flow paths has a smaller number of parallel flow paths and the first set of cold plates has a smaller number of cold plates, the first portion of the coolant may experience greater flow restriction. On the other hand, because the second set of parallel flow paths has a larger number of parallel flow paths and the second set of cold plates has a larger number of cold plates, the second portion of the coolant may experience less flow restriction. Therefore, the flow of coolant from the CDU may tend to flow more towards the second set of cold plates, which has less flow restriction, compared to the first set of cold plates. For example, the first set of cold plates may receive approximately 0.5 gallons of coolant per minute, and the second set of cold plates may receive approximately 1.5 gallons of coolant per minute from the CDU. Therefore, a flow imbalance may occur between the first and second sets of cold plates. Therefore, each cold plate in the first set of cold plates may become ineffective in removing waste heat from one or more chips in each circuit module of the first set of circuit modules. Such waste heat may therefore cause physical damage to one or more chips in each circuit module of the first set of circuit modules, reducing the performance, reliability, or expected lifespan of each circuit module in the first set of circuit modules, and in some cases, may even cause failure of the first circuit assembly.

[0006] A technical solution to the aforementioned problem may include providing a cooling module with a bypass thread that is configured to regulate (e.g., by opening or closing the bypass thread) a portion of the coolant to bypass one or more flow-restricting sections in the cooling module. In some examples, the bypass thread of each cooling module in a set of cooling modules (e.g., a first set of cooling modules) can be opened to allow a portion of the coolant to bypass one or more flow-restricting sections in the cooling module. However, the bypass thread of each cooling module in another set of cooling modules (e.g., a second set of cooling modules) can be closed to prevent the coolant from bypassing one or more flow-restricting sections in the cooling module. Therefore, the bypass thread of each cooling module in the first and second sets of cooling modules can balance the flow of coolant from the CDU between the first and second sets of cooling modules. Because the bypass thread of each cooling module in the first set of cooling modules creates an additional parallel flow path and allows each portion of the coolant to flow through one or more flow-restricting sections in the respective cooling module, the bypass thread is configured to reduce the flow restriction caused by the smaller number of cooling modules and the smaller number of parallel flow paths in the first set of cooling modules compared to the second set of cooling modules. Therefore, the bypass threaded parts of the first and second cooling modules are configured to maintain the flow balance between the first and second cooling modules.

[0007] Therefore, in one or more examples of this disclosure, a cooling module for a circuit module and an electronic device having multiple sets of circuit modules and multiple sets of cooling modules are disclosed. Each cooling module includes a cooling component and a bypass threaded component. The cooling component includes a fluid channel having a supply section, a main body section, and a return section. The main body section branches into a first main body section and a second main body section, and the first and second main body sections further merge into a third main body section. The supply section is connected to the first and second main body sections, and the return section is connected to the third main body section. The bypass threaded component is movably connected to the cooling component to regulate a portion of the coolant to flow directly from the supply section to the third main body section and bypass the first and second main body sections. Attached Figure Description

[0008] Various examples will be described below with reference to the accompanying figures.

[0009] Figure 1 A block diagram of a cooling module according to an exemplary embodiment of the present disclosure is shown.

[0010] Figure 2A The illustration shows a perspective view of the cooling module and circuit module assembled into the frame of an electronic device according to an exemplary embodiment of the present disclosure.

[0011] Figure 2B The illustration shows an example embodiment according to the present disclosure. Figure 2A An exploded perspective view of the framework.

[0012] Figure 2C The illustration shows an example embodiment according to the present disclosure. Figure 2A A perspective view of the circuit module.

[0013] Figure 2D The illustration shows an example embodiment according to the present disclosure. Figure 2A Exploded perspective top view of the cooling module.

[0014] Figure 2E The illustration shows an example embodiment according to the present disclosure. Figure 2A Exploded perspective bottom view of the cooling module.

[0015] Figure 2F The illustration shows an example embodiment according to the present disclosure. Figure 2A A perspective view of the bypass threaded part of the cooling module.

[0016] Figure 3 The illustration shows an example embodiment of the present disclosure along the path. Figure 2A The top view of the cooling module taken by line 1-1'.

[0017] Figure 4 The illustration shows an example embodiment of the present disclosure along the path. Figure 2A The cooling module and circuit module are shown in the cross-sectional side view taken from line 2-2'.

[0018] Figure 5 A block diagram depicts a portion of a data center environment having a coolant distribution unit and electronic equipment according to an exemplary embodiment of the present disclosure, the electronic equipment having a first circuit assembly, a second circuit assembly, a plurality of circuit modules and a plurality of cooling modules.

[0019] Figure 6 A method for the flow of a balanced coolant between multiple cooling modules in a first circuit assembly and a second cooling assembly, according to an exemplary embodiment of the present disclosure, is described. Detailed Implementation

[0020] The following detailed description refers to the accompanying drawings. For illustrative purposes, please refer to... Figures 1 to 6 The components illustrated herein describe certain examples. However, the functions of the illustrated components may overlap and may exist in a small or large number of elements and components. Furthermore, the disclosed examples can be implemented in various environments and are not limited to the illustrated examples. Further, in conjunction with... Figure 6The described sequence of operations is illustrative and not intended to be limiting. Whenever possible, the same reference numerals are used in the drawings and the following description to refer to the same or similar parts. However, it should be clearly understood that these drawings are for illustrative and descriptive purposes only. While several examples are described in this document, modifications, adaptations, and other embodiments are possible. Therefore, the following detailed description does not limit the disclosed examples. Rather, the appropriate scope of the disclosed examples may be defined by the appended claims.

[0021] Figure 1 A block diagram of a cooling module 106 is depicted. The cooling module 106 includes a cooling component 136 (e.g., a first cooling component) and a bypass threaded component 180. It should be understood that... Figure 1 The illustrations are not intended to show a particular shape, size or other structural details precisely or to scale, and embodiments of the cooling module 106 may have different numbers and arrangements of illustrated components and may also include other parts not shown.

[0022] Cooling component 136 is made of a thermally conductive material such as copper, aluminum, or an alloy. Cooling component 136 includes a fluid channel 192 (e.g., a first fluid channel) having a supply section 192A, a main body section 192B, and a return section 192C. The main body section 192B branches into a first main body section 192B1 and a second main body section 192B2. Furthermore, the first main body section 192B1 and the second main body section 192B2 merge into a third main body section 192B3. The supply section 192A connects to the main body section 192B at a bifurcation region 192B4, where the main body section 192B branches into the first main body section 192B1 and the second main body section 192B2. The supply section 192A is further fluidly connected to a coolant inlet 166 of the cooling module 106. The return section 192C is fluidly connected to the third main body section 192B3 and also fluidly connected to a coolant outlet 168 of the cooling module 106. In one or more examples, the cooling component 136 may be mounted on a portion of a circuit module (not shown) having a first chipset (not shown). In such an example, the body segment 192B further includes a plurality of first microchannels 197A that may be thermally coupled to a first chip (e.g., a graphics processing unit (GPU)) and a plurality of second chips (e.g., memory chips) in the first chipset. In some examples, the cooling component 136 further includes a first aperture 182 and a second aperture 184. In some examples, the first aperture 182 extends between a third body segment 192B3 and a bifurcation region 192B4. The second aperture 184 extends from a peripheral side (not labeled) of the cooling component 136 inside the cooling component 136 and intersects with the first aperture 182. A bypass threaded member 180 is movably connected to the cooling component 136 via the second aperture 184.

[0023] In some examples, cooling module 106 may further include a second cooling component 138 made of a thermally conductive material such as copper, aluminum, or an alloy. In one or more examples, each of the first cooling component 136 and the second cooling component 138 may serve as a cold plate. Cooling component 138 has an intermediate fluid channel 194. In one or more examples, the second cooling component 138 may be fluidly connected to cooling component 136. For example, the intermediate fluid channel 194 is fluidly connected to the return section 192C and the second fluid channel 196 of cooling component 136. In one or more examples, the second cooling component 138 may be mounted on another portion of a circuit module having a second chipset (not shown). In such an example, the intermediate fluid channel 194 further includes a plurality of second microchannels 197B that may be thermally coupled to a second chip (e.g., a central processing unit (CPU)) in the second chipset.

[0024] In electronic devices ( Figure 1During operation (not shown), the first and second chipsets of the circuit module may generate waste heat. The body section 192B and intermediate fluid channel 194, thermally coupled to the first and second chipsets respectively, can absorb the waste heat from the first and second chipsets. In such an example, the cooling module 106 can receive coolant 198A from the central distribution unit (CDU) to dissipate waste heat from the cooling component 136. For example, coolant 198A can flow from the coolant inlet 166 through the supply section 192A, the first body section 192B1, the second body section 192B2, the third body section 192B3, the return section 192C, and the second fluid channel 196 of the cooling component 136 to the coolant outlet 168. In such an example, the coolant can absorb waste heat from the first chipset via the second body section 192B2 and become partially heated coolant 198B. In some examples, partially heated coolant 198B can additionally flow from cooling component 136 to second cooling component 138 via return section 192C. For example, partially heated coolant 198B can flow from return section 192C to intermediate fluid channel 194, and from intermediate fluid channel 194 to second fluid channel 196 of cooling component 136. In such examples, partially heated coolant 198B can further absorb waste heat from second chipset via intermediate fluid channel 194 and become heated coolant 198C. Furthermore, heated coolant 198C can be discharged from cooling module 106 to CDU via coolant outlet 168. In some examples, bypass thread 180, movably connected to cooling component 136 via second orifice 184, can regulate a portion 198A1 of coolant 198A to flow directly from supply section 192A to third body section 192B3 and bypass first body section 192B1 and second body section 192B2. For example, bypass thread 180 can be moved outside the second orifice 184 (e.g., partially moved outside the second orifice) to expose the first orifice 182 and allow a portion 198A1 of coolant 198A to flow directly from the supply section 192A to the third body section 198B3. It can be noted that the distance “D” that the head portion 180A of bypass thread 180 moves away from the peripheral side portion 199 of the cooling component 136 indicates the partial movement of bypass thread 180 outside the second orifice 184. In some other examples, bypass thread 180 can be moved inside the second orifice 184 (e.g., completely moved inside the second orifice) to cover the first orifice 182 and prevent a portion 198A1 of coolant 198A from flowing directly from the supply section 192A to the third body section 192B3. For example, when the bypass threaded part 180 is fully moved into the interior of the second orifice 184, the head portion 180A of the bypass threaded part 180 contacts the peripheral side portion 199 of the cooling component 136.

[0025] Figure 2A A perspective view depicting the assembled circuit module 204 and cooling module 206 into the frame 202 of the electronic device is shown. Figure 2B Depicting Figure 2A The exploded perspective view of frame 202. Figure 2C Depicting Figure 2A A perspective view of circuit module 204. Figure 2D Depicting Figure 2A Exploded perspective top view of cooling module 206. Figure 2E Depicting Figure 2A Exploded perspective bottom view of cooling module 206. Figure 2F A perspective view of the bypass threaded part 280 of the cooling module 206 is depicted. In the following description, for ease of explanation, it is also described... Figures 2A to 2F .

[0026] refer to Figure 2A The circuit module 204 is coupled to the frame 202 of the electronic device (not shown). Specifically, the circuit module 204 is sandwiched between the base portion 202A and the cover portion 202B of the frame 202. A cooling module 206 is mounted on the circuit module 204 and connected to the frame 202. Specifically, the cooling module 206 is mounted on the cover portion 202B of the frame 202, such that the cooling module 206 is thermally coupled to the circuit module 204. The processes of coupling the circuit module 204 to the frame 202, mounting the cooling module 206 to the frame 202, and thermally coupling the cooling module 206 to the circuit module 204 are discussed in more detail below.

[0027] refer to Figure 2B The frame 202 can be used as a reinforcement and heat transfer plate for electronic devices. In some examples, the frame 202 includes a base portion 202A and a cover portion 202B. The base portion 202A is an open box-shaped element. In such an example, the base portion 202A has: a base plate segment 212A for supporting a portion of the substrate 228 of the circuit module 204; and an opening 210A for allowing the substrate 228 of the circuit module 204 (such as...) to... Figure 2CElectrical contacts in the base portion 202A (shown) protrude to the outside of the frame 202. In some examples, the electrical contacts may allow the substrate 228 to be coupled to the circuit board of the circuit assembly (not shown). The base plate segment 212A of the base portion 202A includes a plurality of first clamping holes 214A. In addition, the base portion 202A may include a plurality of retaining holes (not shown) formed in the base plate segment 212A. In such examples, the plurality of retaining holes may be used to clamp the frame 202 to the circuit board of the circuit assembly. In some examples, the cover portion 202B is another open box-shaped element. In such examples, the cover portion 202B has an opening 210B formed in the cover segment 212B of the cover portion 202B for allowing the first chipset 224 and the second chipset 226 of the circuit module 204 (as shown) to be coupled to the circuit board of the circuit assembly (as shown). Figure 2C (As shown) protrudes to the outside of the cover portion 202B. In some examples, the first chipset 224 and the second chipset 226 protruding to the outside of the cover portion 202B may allow the circuit module 204 to be thermally coupled to the cooling module 206. For example, the opening 210B may be formed substantially at the central portion of the cover segment 212B. Additionally, the cover segment 212B includes a plurality of first holes 218A, a plurality of second holes 218B, and a plurality of second clamping holes 214B. In some examples, each of the plurality of second clamping holes 214B is aligned with a corresponding hole in the plurality of first clamping holes 214A in the base portion 202A. In one or more examples, the cover portion 202B may be mounted on and coupled to the base portion 202A to form the frame 202.

[0028] refer to Figure 2CThe circuit module 204 can be used as a multi-chip module for an electronic device. In some examples, the circuit module 204 includes a first chipset 224, a second chipset 226, and a substrate 228. In some examples, the substrate 228 is a semiconductor wafer having one or more layers and can serve as a base for fabricating the first electronic chipset 224 and the second electronic chipset 226 on one side of the semiconductor wafer and connecting the first chipset 224 and the second chipset 226 to electrical contacts on the other side of the semiconductor wafer. In some examples, the first chipset 224 and the second chipset 226 are positioned adjacent to each other and disposed on and coupled to the substrate 228. For example, the first chipset 224 and the second chipset 226 can be coupled to the substrate 228 via solder bumps. In some examples, the first chipset 224 includes a plurality of first chips 224A and second chips 224B. Similarly, the second chipset 226 includes a third chip 226A. This document notes that the plurality of first chips 224A, second chips 224B, and third chips 226A can be collectively referred to as electronic chips. Examples of electronic chips may include, but are not limited to, central processing units (CPUs), graphics processing units (GPUs), power chips, memory chips, etc. In the illustrated example, each of the plurality of first chips 224A is a memory chip, the second chip 224B is a GPU, and the third chip 226A is a CPU. The plurality of first chips 224A are arranged along a first row and a second row surrounding the second chip 224B. In one or more examples, the top surface of the first chipset 224 serves as a first thermal interface 234A of the circuit module 204, and the top surface of the second chipset 226 serves as a second thermal interface 230A of the circuit module 204. It should be noted that the circuit module 204 may include various combinations of different types of electronic chips without limiting the scope of this disclosure. Furthermore, although the circuit module 204 is shown as including three types of electronic chips arranged in a particular manner, the scope of this disclosure does not limit the number or type of electronic chips or the manner in which the electronic chips are arranged on the substrate 228. The substrate 228 further includes a plurality of third clamping holes 214C, each of which is aligned with a corresponding hole in a plurality of first clamping holes 214A and second clamping holes 214B of the frame 202.

[0029] refer to Figures 2D to 2E The cooling module 206 circulates the coolant 298A (e.g., Figure 2E and Figure 3 (As shown) to absorb waste heat from electronic chips and become a cooling agent for heating 298C (as shown) Figure 3As shown), this serves as a fluid cooling module. Coolant 298A may comprise approximately 25% propylene glycol and 75% water. In some examples, the temperature of coolant 298A may be approximately 36 degrees Celsius, the temperature of heated coolant 298C may be approximately 60 degrees Celsius, and the temperature of facility fluid (not shown) may be approximately 32 degrees Celsius. It may be noted herein that facility fluid can refer to an external fluid used for indirect cooling of the heated coolant 298C. In one or more examples, the CDU may include at least one heat exchanger system to allow waste heat to be transferred from the heated coolant 298C to the facility fluid, thereby cooling the heated coolant 298C to become coolant 298A (i.e., cooling the heated coolant 298C back to a cooled state). Cooling module 206 includes a cooling component 236 (e.g., a cooling element), a second cooling component 238, and a bypass threaded component 280.

[0030] The cooling component 236 includes a pair of first flange portions 252, a recess 254 located between the pair of first flange portions 252, and a pair of first fluid connections 264. In some examples, the cooling component 236 has a top surface 256 and a bottom surface 258. The cooling component 236 further includes a first cooling portion 260 and a third cooling portion 262. In some examples, the first cooling portion 260 is formed at the bottom surface 258, corresponding to a portion of a first flange 252A of the pair of first flange portions 252. In such examples, the first cooling portion 260 protrudes outward from the bottom surface 258 of the cooling component 236. In one or more examples, the bottom surface of the first cooling portion 260 serves as a first thermal interface 260A of the cooling module 206. The third cooling portion 262 is formed on the top surface 256 of the cooling component 236. For example, the third cooling portion 262 protrudes outward from the top surface 256 and extends between the pair of first flange portions 252 and the recess 254. The cooling component 236 further includes a coolant inlet 266 and a coolant outlet 268 spaced apart from each other and formed in the first peripheral wall 262A of the third cooling section 262.

[0031] In one or more examples, a pair of first fluid connections 264 are formed at the bottom surface 258. For example, the pair of first fluid connections 264 are located at a recess 254, wherein each connection of the pair of first fluid connections 264 protrudes inward from the recess 254 toward the third cooling portion 262. In some examples, the pair of first fluid connections 264 includes a first connection 264A and a second connection 264B. In one or more examples, the first connection 264A may be formed via a first fluid channel 292 (e.g., ...) formed within the first cooling portion 260 and the third cooling portion 262 of the cooling member 236. Figure 3(As shown) fluid connection to fluid inlet 266. Similarly, the second connection 264B can be connected via a second fluid channel 296 formed in the third cooling portion 262 of the cooling member 236 (as shown). Figure 3 (As shown) The fluid is connected to fluid outlet 268. In Figures 2D to 2E In the example, each of the pair of first fluid connections 264 is a fluid orifice.

[0032] The cooling component 236 further includes a plurality of fourth holes 218D formed in a pair of first flange portions 252 in a first flange 252A. In one or more examples, each of the plurality of fourth holes 218D is aligned with a corresponding second hole in a plurality of second holes 218B formed in a cover portion 202B of the frame 202. In some examples, the cooling component 236 further includes a plurality of fifth holes 218E formed in a recess 254. Additionally, the cooling component 236 includes a plurality of fourth clamping holes 214D. Each of the plurality of fourth clamping holes 214D is aligned with a corresponding hole in a plurality of second clamping holes 214B formed in a cover portion 202B of the frame 202.

[0033] The cooling component 236 further includes a plurality of retaining holes 270 spaced apart from each other and formed on a third cooling portion 262 of the cooling component 236. For example, each of the plurality of retaining holes 270 is located in a recess 254 and extends along the third cooling portion 262. Each of the plurality of retaining holes 270 is aligned with a corresponding retaining tab in a plurality of retaining tabs 250 formed in the second cooling component 238.

[0034] The cooling component 236 further includes a plurality of fastener holes 272 formed in the peripheral wall of the third cooling portion 262. For example, a pair of fastener holes 272A are formed in the first peripheral wall 262A of the third cooling portion 262, and another pair of fastener holes (not shown) are formed in the second peripheral wall 262B of the third cooling portion 262. In some examples, each of the plurality of fastener holes 272 may extend to a corresponding retaining hole in a plurality of retaining holes 270.

[0035] In one or more examples, the second cooling component 238 includes a pair of second flange portions 240, a second cooling portion 242 located between the pair of second flange portions 240, and a pair of second fluid connections 248. In some examples, the second cooling component 238 has a top surface 244 and a bottom surface 246. In such examples, the second cooling portion 242 is formed at the bottom surface 246. For example, the second cooling portion 242 protrudes outward from the bottom surface 246 of the second cooling component 238. In one or more examples, the bottom surface of the second cooling portion 242 serves as a second thermal interface 242A of the cooling module 206.

[0036] In some examples, a pair of second fluid connections 248 are formed at the top surface 244 of the second cooling component 238. For example, the pair of second fluid connections 248 protrude outward from the top surface 244. The pair of second fluid connections 248 includes another first connection 248A and another second connection 248B of the pair of second fluid connections 248. In one or more examples, the other first connection 248A of the second cooling component 238 is aligned with the first connection 264A of the cooling component 236. Similarly, the other second connection 248B of the second cooling component 238 is aligned with the second connection 264B of the cooling component 236. In one or more examples, the pair of second fluid connections 248 may be fluidly connected to an intermediate fluid channel 294 formed within the second cooling portion 242 of the second cooling component 238. For example, the other first connection 248A may be connected to one end (not shown) of the intermediate fluid channel 294, and the other second connection 248B may be connected to the other end (not shown) of the intermediate fluid channel 294. Figures 2D to 2E In the example, each of the pair of second fluid connections 248 is a fluid piston.

[0037] The second cooling component 238 further includes a plurality of third holes 218C. For example, each flange of a pair of second flange portions 240 may include a pair of third holes 218C. In one or more examples, each of the plurality of third holes 218C is aligned with a corresponding first hole among a plurality of first holes 218A formed in the cover portion 202B of the frame 202. Furthermore, each of the pair of third holes 218C is aligned with a corresponding fifth hole among a plurality of fifth holes 218E formed in the cooling component 236. The second cooling component 238 further includes a plurality of retaining tabs 250 spaced apart from each other and formed on the top surface 244 of the second cooling component 238. For example, each of the plurality of retaining tabs 250 extends outward from the top surface 244 of the second cooling component 238.

[0038] Return to reference Figure 2A The cooling module 206 further includes a plurality of first spring-loaded fasteners 274 and a plurality of second spring-loaded fasteners 276. In one or more examples, each of the plurality of first spring-loaded fasteners 274 can be inserted through a corresponding hole in a plurality of fourth holes 218D and a plurality of second holes 218B to connect the cooling component 236 to the frame 202. Similarly, each of the plurality of second spring-loaded fasteners 276 can be inserted through a corresponding hole in a plurality of third holes 218C and a plurality of first holes 218A to connect the second cooling component 238 to the frame 202.

[0039] Return to reference Figures 2D to 2E The cooling module 206 further includes a plurality of fasteners 278. In some examples, each fastener 278 may be inserted into the interior of a corresponding fastener hole 272 formed in the cooling component 236 so that each fastener 278 engages with a retaining tab 250 of the second cooling component 238 so as to couple the cooling component 236 and the second cooling component 238 to each other.

[0040] Cooling component 236 may further include a first orifice 282 and a second orifice 284 (e.g. Figures 3 to 5 (As shown). In some examples, the first orifice 282 may be a flat orifice (e.g., unthreaded), and the second orifice 284 may be threaded. In such an example, the bypass threaded element 280 is movably connected to the cooling element 236. Figures 3 to 5 The first orifice 282 and the second orifice 284 formed in the cooling component 236 are discussed in more detail. (See reference...) Figure 2F The bypass threaded member 280 may be a cylindrical component having a body portion 280A and a head portion 280B extending from the body portion 280A. In some examples, the body portion 280A may be threaded so that the bypass threaded member 280 can be movably coupled (e.g., threadedly coupled) to the second orifice 284. Furthermore, the bypass threaded member 280 may include one or more O-ring seals 286 to prevent a portion of the coolant 278 from leaking from the second orifice 284.

[0041] refer to Figures 2A to 2F During the assembly of the cooling module 206, the circuit module 204 is disposed on the base portion 202A of the frame 202, such that the peripheral portion of the substrate 228 is located on the base plate segment 212A, and the intermediate portion of the substrate 228 having electrical contacts is accessible from the opening 210A. Furthermore, each of the plurality of third clamping holes 214C is aligned with a corresponding hole in the plurality of first clamping holes 214A. Additionally, the cover portion 202B of the frame 202 is mounted in the base portion 202A, such that the first electronic chipset 224 and the second electronic chipset 226 are accessible from the opening 210B. Furthermore, each of the plurality of second clamping holes 214B is aligned with a corresponding hole in the plurality of third clamping holes 214C. Subsequently, a plurality of clamping fasteners (not shown) are inserted into the second clamping hole 214B in the cover portion, the third clamping hole 214C in the substrate, and the first clamping hole 214A in the base portion to couple the cover portion 202B to the base portion 202A and form a frame 202, wherein the circuit module 204 is clamped between the cover portion and the base portion.

[0042] The second cooling component 238 is mounted on the frame 202 such that the second cooling portion 242 of the second cooling component 238 faces the second electronic chipset 226 of the substrate 228. In some examples, when the second cooling component 238 is mounted on the frame 202, the second thermal interface 242A of the second cooling component 238 can be with the second thermal interface 230A of the second electronic chipset 226 (e.g., ...). Figure 2C (As shown) Alignment. Furthermore, fasteners in a plurality of second spring-loaded fasteners 276 are inserted into a third hole 218C in the second cooling component 238 and a first hole 218A in the cover portion 202B to connect the second cooling component 238 to the frame 202. In some examples, each spring of the plurality of second spring-loaded fasteners 276 can bias the second cooling component 238 toward the second electronic chipset 226 and thermally couple the second thermal interface 242A of the second cooling component 238 to the second thermal interface 230A of the second electronic chipset 226.

[0043] Furthermore, the cooling component 236 is positioned above the second cooling component 238 such that a plurality of retaining holes 270 in the cooling component 236 are aligned with a plurality of retaining tabs 250 in the second cooling component 238. The cooling component 236 is then mounted on the frame 202, with a first cooling portion 260 of the cooling component 236 facing the first electronic chipset 224 of the substrate 228. In such an example, when the cooling component 236 is mounted on the frame 202, the second cooling component 238 is positioned within a recess 254 of the cooling component 236, and each retaining tab of the plurality of retaining tabs 250 protrudes along a corresponding hole in the plurality of retaining holes 270.

[0044] Furthermore, when the cooling component 236 is mounted on the frame 202, as discussed herein, each of the pair of first fluid connections 264 in the cooling component 236 is movably connected to a corresponding connection in a pair of second fluid connections 248 in the second cooling component 238 to establish a fluid flow path 390 between the first cooling component 236 and the second cooling component 238 (see...). Figure 3 For example, a first connection 264A in a pair of first fluid connections 264 is movably connected to another first connection 248A in a pair of second fluid connections 248 to establish an inlet fluid flow path 390A between the first cooling component 236 and the second cooling component 238 (see...). Figure 3 Similarly, a second connection 264B of a pair of first fluid connections 264 is movably connected to another second connection 248B of a pair of second fluid connections 248 to establish an outlet fluid flow path 390B between the first cooling component 236 and the second cooling component 238 (see...). Figure 3Furthermore, when the cooling component 236 is mounted on the frame 202, the first thermal interface 260A of the cooling component 236 can be aligned with the first thermal interface 234A of the first electronic chipset 224. Additionally, fasteners in a plurality of first spring-loaded fasteners 274 are inserted into a fourth hole 218D in the cooling component 236 and a second hole 218A in the cover portion 202B to connect the cooling component 236 to the frame 202. In some examples, each spring in the plurality of first spring-loaded fasteners 274 biases the cooling component 236 toward the first electronic chipset 224 and thermally couples the first thermal interface 260A of the cooling component 236 with the first thermal interface 234A of the first electronic chipset 224. A bypass threaded member 280 can be movably connected to the cooling component 236.

[0045] Figure 3 Depicting along Figure 2A A top-view cross-section of the cooling module 206, taken from line 1-1'. Specifically, Figure 3 A cross-sectional top view is depicted of the cooling component 236 (e.g., the first cooling component) and the second cooling component 238 in the cooling module 206.

[0046] Cooling component 236 includes a fluid passage 292 (e.g., a first fluid passage) having a supply section 292A, a main body section 292B, and a return section 292C. The supply section 292A and the return section 292C are formed in a third cooling section 262 (e.g., ...). Figure 2D As shown, the main body segment 292B is formed within the first cooling section 260. The main body segment branches into a first main body segment 292B1 and a second main body segment 292B2. The first main body segment 292B1 and the second main body segment 292B2 further merge into a third main body segment 292B3. A supply segment 292A is connected to the main body segment 292B at a bifurcation region 292B4, where the main body segment 292B branches into the first main body segment 292B1 and the second main body segment 292B2. The supply segment 292A is further fluidly connected to the coolant inlet 266 of the cooling module 206. A return segment 292C is fluidly connected to the third main body segment 292B3. In one or more examples, the cooling component 236 may be mounted on a portion of the circuit module 204 having a first chipset 224 (e.g., Figure 2C (As shown). In such an example, the main body segment 292B further includes a plurality of first microchannels (not shown) that can be thermally coupled to a plurality of first chips 224A in the first chipset 224 (e.g., as shown). Figure 2C The memory chip shown) and the second chip 224B (e.g., as shown) Figure 2CThe graphics processing unit (GPU) is shown. In some examples, the cooling component 236 further includes a first aperture 282 and a second aperture 284. In some examples, the first aperture 282 extends between the third body segment 292B3 and the bifurcation region 292B4. The second aperture 284 extends from a peripheral side portion (e.g., peripheral side portion 299) inside the cooling component 236 and intersects with the first aperture 282. A bypass threaded member 280 is movably connected to the cooling component 236 via the second aperture 284.

[0047] The second cooling component 238 has an intermediate fluid channel 294. The intermediate fluid channel 294 is formed within the second cooling portion 242 of the second cooling component 238. In one or more examples, the second cooling component 238 may be fluidly connected to the cooling component 236. For example, the intermediate fluid channel 294 is fluidly connected to the return section 292C of the cooling component 236 and the second fluid channel 296. In one or more examples, the second cooling component 238 may be mounted on another portion of the circuit module having a second chipset (e.g., ...). Figure 2C (As shown). In such an example, the intermediate fluid channel 294 further includes a plurality of second microchannels (not shown) that can be thermally coupled to a second chip (e.g., a central processing unit (CPU), 226A) of the second chipset 226.

[0048] During operation of the electronic device (not shown), the first chipset 224 and the second chipset 226 of the circuit module 204 may generate waste heat. The body section 292B and the intermediate fluid channel 294, thermally coupled to the first chipset 224 and the second chipset 226 respectively, can absorb the waste heat from the first chipset 224 and the second chipset 226. In such an example, the cooling module 206 can receive coolant 298A from the central distribution unit (CDU) to dissipate the waste heat from the cooling component 236 and the second cooling component 238. For example, coolant 298A can flow from inlet 266 through i) the supply section 292A of the cooling component 236, the first body section 292B1 and the second body section 292B2, the third body section 292B3, the return section 292C, the intermediate fluid channel 294 of the second cooling component 238, and the second fluid channel 296 of the cooling component 236, to outlet 268. In this example, the coolant can absorb waste heat from the first chipset via the second main body section 292B2 and become partially heated coolant 298B. The partially heated coolant 298B can further absorb waste heat from the second chipset via the intermediate fluid channel 294 and become heated coolant 298C. Furthermore, the heated coolant 298C can be discharged from the cooling module 206 to the CDU via coolant outlet 268.

[0049] In some examples, a bypass threaded member 280, movably connected to the cooling component 236 via a second orifice 282, can adjust a portion 298A1 of the coolant 298A to flow directly from the supply section 292A to the third body section 292B3, bypassing the first body section 292B1 and the second body section 298B2. For example, the bypass threaded member 280 can be moved outside the second orifice 282 (e.g., partially outside the second orifice) to expose the first orifice 282 and allow a portion 298A1 of the coolant 298A to flow directly from the supply section 292A to the third body section 298B3. Figure 1 As shown, the head portion 280A of the bypass thread 280 can move a distance "D" away from the peripheral portion 299 of the cooling component 236, representing a partial movement of the bypass thread 280 to the outside of the second orifice 284. In some other examples, the bypass thread 280 can be moved into the interior of the second orifice (e.g., completely into the interior of the second orifice) to cover the first orifice 282 and prevent a portion 298A1 of the coolant 298A from flowing directly from the supply section 292A to the third body section 292B3. For example, when the bypass thread 280 is completely moved into the interior of the second orifice 284, the head portion 280A of the bypass thread 280 contacts the peripheral portion 299 of the cooling component 236.

[0050] Figure 4 Depicting along Figure 2A The cross-sectional side view of the cooling module 206 and the circuit module 204, taken from line 2-2'.

[0051] exist Figure 4 In the example, a first orifice 282 extends from a bifurcation region 292B4 into a third body segment 292B3. For example, a portion 282A of the first orifice 282 protrudes vertically 10 from the bifurcation region 292B4, and another portion 282B of the first orifice 282 protrudes horizontally 20 from the third body segment 292B3, and such portions 282A and 282B of the first orifice 282 are connected to each other to define the first orifice 282. A second orifice 284 extends from a peripheral portion 299 of the cooling member 236 and intersects with a portion 282A of the first orifice 282. Figure 4In one example, the bypass thread 280 is movably coupled to the cooling component 236 via a second orifice 284. In such an example, the bypass thread 280 moves completely into the interior of the second orifice 284 to cover a portion of the first orifice 282 and prevent a portion 298A1 of coolant 298A from flowing directly from the supply section 292A to the third body section 292B3. In some other examples, the bypass thread 280 moves at least partially to the exterior of the second orifice 284 to expose a portion of the first orifice 282 and allow a portion 298A1 of coolant 298A to flow directly from the supply section 292A to the third body section 292B3. In some examples, the bypass thread 280 may be used to balance the flow of coolant 298 from the coolant distribution unit (CDU) among multiple cooling modules 206 (e.g., providing equal volumes of coolant 298). As discussed herein, coolant 298A flows from the first main body section 292B1 and the second main body section 292B2 along the third main body section 292B3, absorbing waste heat from the second chip 224B (e.g., the GPU of the first chipset 224) and becoming partially heated coolant 298B. The partially heated coolant 298B flows from the third main body section 292B3 to the intermediate fluid channel 294 via the return section 292C. The partially heated coolant 292B3 absorbs waste heat from the third chip 226A (e.g., the CPU) of the second chipset 226 and becomes heated coolant 298C. The heated coolant 298C flows into the CDU and transfers waste heat to the facility fluid via a heat exchanger (not shown), and thus, the heated coolant 298C cools down to become coolant 298A (i.e., the heated coolant 298C returns to a cooled state).

[0052] Figure 5 A block diagram depicts a portion of a data center environment 500 having a coolant distribution unit (CDU) 501 and electronics 503, the electronics having a first circuit assembly 507, a second circuit assembly 509, a plurality of circuit modules 504, and a plurality of cooling modules 506. Each of the plurality of circuit modules 504 and each of the plurality of cooling modules 506 is similar to those shown in Figures 2 to 303. Figure 4 The circuit module 204 and cooling module 206 discussed in the example. Therefore, for the sake of brevity, in Figure 5The examples do not discuss each of the multiple circuit modules 504 and each of the multiple cooling modules 506 in detail, and this omission should not be construed as a limitation of this disclosure. In some examples, each of the multiple circuit modules 504 includes a first chipset 524 and a second chipset 526, and each of the multiple cooling modules 506 includes a cooling component 536 and a bypass threaded component 580. In some examples, each of the multiple cooling modules 506 further includes a second cooling component 538 fluidly coupled to the cooling component 536.

[0053] although Figure 5 Not shown in the example, but for illustration purposes, the data center environment 500 may have four racks, each of which may have two racks, each of which may have four chassis (e.g., four electronic devices), each of which may have eight trays, each of which may have two nodes (e.g., two circuit components), and each of which may have eight modules (e.g., circuit modules). Furthermore, the CDU 501 of the data center environment 500 may be configured to supply coolant 598 to each of the eight trays at a rate of approximately 1 gallon of coolant 598 per minute to reach the four racks in the data center environment 500.

[0054] exist Figure 5 In the illustrated example, the data center environment 500 includes a cabinet (unlabeled), a rack (unlabeled), and an electronic device 503 (e.g., a chassis). Furthermore, Figure 5 The illustrated example of an electronic device 503 has a tray 505, and the tray 505 includes two circuit components, such as a first circuit component 507 and a second circuit component 509. In one or more examples, the electronic device 503 further includes a plurality of circuit modules 504. In some examples, the plurality of circuit modules 504 are referred to as a first group of circuit modules 504A and a second group of circuit modules 506B. Figure 5 In the illustrated embodiment, the first group of circuit modules 504A has two circuit modules, and the second group of circuit modules 504B has four circuit modules. Each circuit module in the first group of circuit modules 504A includes a first chipset 524A and a second chipset 526A. Similarly, each circuit module in the second group of circuit modules 504B includes a first chipset 524B and a second chipset 526B.

[0055] In one or more examples, the electronic device 503 further includes a plurality of cooling modules 506 thermally coupled to a plurality of circuit modules 504. In some examples, the plurality of cooling modules 506 are referred to as a first group of cooling modules 506A and a second group of cooling modules 506B. Figure 5 In the illustrated embodiment, the first cooling module group 506A has two cooling modules, and the second cooling module group 506B has four cooling modules. Each cooling module in the first cooling module group 506A includes a cooling component 536A, a bypass threaded component 580A, and a second cooling component 538A. Similarly, each cooling module in the second cooling module group 506B includes a cooling component 536B, a bypass threaded component 580B, and a second cooling component 538B. The first cooling module group 506A is thermally coupled to the first circuit module group 504A, and the second cooling module group 506B is thermally coupled to the second circuit module group 504B.

[0056] In one or more examples, the first circuit assembly 507 and the second circuit assembly 509 may be mounted on and coupled to the tray 505 of the chassis of the electronic device 503. A first set of circuit modules 506A may be mounted on and coupled to the first circuit assembly 507. Similarly, a second set of circuit modules 504B may be mounted on and coupled to the second circuit assembly 509. Furthermore, the first set of cooling modules 506A is thermally coupled to the first set of circuit modules 504A, and the second set of cooling modules 506B is thermally coupled to the second set of circuit modules 504B. Additionally, the CDU 501 is fluidly connected to the tray 505 via an inlet manifold 511. For example, the inlet manifold 511 branches into a first set of parallel inlet manifolds 511A and a second set of parallel inlet manifolds 511B. Figure 5 In the illustrated embodiment, the first set of parallel inlet manifolds 511A has two parallel inlet manifolds, and the second set of parallel inlet manifolds 511B has four parallel inlet manifolds. Each inlet manifold of the first set of parallel inlet manifolds 511A is connected to the coolant inlet 566A of the corresponding cooling module of the first set of cooling modules 506A. Similarly, each inlet manifold of the second set of parallel inlet manifolds 511B is connected to the coolant inlet 566B of the corresponding cooling module of the second set of cooling modules 506B. Furthermore, the coolant outlet 568A of each cooling module of the first set of cooling modules 506A and the coolant outlet 568B of each cooling module of the second set of cooling modules 506B can be connected to the outlet manifold (not shown) of CDU 501.

[0057] During operation of the data center environment 500, each circuit module 504 of the first set of circuit modules 504A in the first circuit assembly 507 and the second set of circuit modules 506B in the second circuit assembly 509 generates waste heat. Such waste heat is undesirable as it can negatively impact the operation of the first circuit assembly 507 and the second circuit assembly 509. For example, waste heat may cause physical damage to one or more chips, reduce the performance, reliability, or expected lifespan of the corresponding circuit modules of the first set of circuit modules 504A and the second set of circuit modules 504B, and in some cases, may even cause failure of the first circuit assembly 507 and / or the second circuit assembly 509. To overcome such waste heat problems in the first set of circuit modules 504A and the second set of circuit modules 504B, the CDU 501 can supply coolant 598 via inlet manifold 511 to each cooling module of the first set of cooling modules 506A and the second set of cooling modules 506B to remove waste heat from the corresponding circuit modules. For example, a first set of parallel flow paths 511A of CDU 501 can circulate a first portion 597A of coolant 598 to a first set of cooling modules 506A, and a second set of parallel flow paths 511B can circulate a second portion 599A of coolant 598 to a second set of cooling modules 506A. CDU 501 can be configured to circulate equal portions of coolant 598 (e.g., one gallon of coolant per minute) to each of the first set of cooling modules 506A and the second set of cooling modules 506B to effectively remove waste heat from each of the first set of circuit modules 504A and the second set of circuit modules 506B. Due to the smaller number of parallel flow paths in the first set of parallel flow paths 511A and the smaller number of cooling modules in the first set of cooling modules 506A, the first portion 597A of coolant 598 may experience greater flow restriction. On the other hand, due to the greater number of parallel flow paths in the second set of parallel flow paths 511B and the greater number of cooling modules in the second set of cooling modules 506B, the second portion 599A of coolant 598 may experience less flow restriction. Therefore, the flow of coolant 598 from CDU 501 may tend to flow more towards the second set of cooling modules 506B, which has less flow restriction, compared to the first set of cooling modules 506A. For example, the first set of cooling modules 506A may receive approximately 0.5 gallons of coolant per minute (instead of 1 gallon per minute), and the second set of cooling modules 506B may receive approximately 1.5 gallons of coolant per minute from CDU 501 (instead of 1 gallon per minute). Therefore, a flow imbalance may occur between the first set of cooling modules 506A and the second set of cooling modules 506B. Consequently, each cooling module of the first set of cooling modules 506A may become ineffective at removing waste heat from each circuit module of the first set of circuit modules 504A.Therefore, such waste heat may cause physical damage to one or more chips in each circuit module of the first set of circuit modules 504A, reduce the performance, reliability or expected life of each circuit module in the first set of circuit modules 504A, and in some cases, waste heat may even cause failure of the first circuit assembly 507.

[0058] To address the problem related to the flow imbalance of coolant 598 between the first cooling module 506A and the second cooling module 506B, a bypass thread 580 is configured to regulate (e.g., by at least partially opening or completely closing the bypass thread) a portion of a first portion 597A or a portion 599A of the coolant 598 to bypass one or more flow-restricting sections (e.g., a first body section and a second body section) in the cooling modules of the first cooling module 506A or the second cooling module 506B. For example, the bypass thread 580A of each cooling module of the first cooling module 506A can be moved outside the second orifice 584A (e.g., partially moved outside the second orifice) to expose the first orifice 582A and allow a portion 597A1 of the first portion 597A of the coolant 598 to flow directly from the supply section 591A to the third body section 591B3 and bypass the first body section 591B1 and the second body section 592B2. Furthermore, the bypass threaded part 580B of each cooling module in the second set of cooling modules 506B can be moved inside the second orifice 584B (e.g., completely inside the second orifice) to cover the first orifice 582B and prevent a portion of the second part 599A of the coolant 598 from flowing directly from the supply section 593A to the third body section 592B3.

[0059] Therefore, the bypass thread 580A of each cooling module in the first group of cooling modules 506A creates an additional parallel flow path and allows a portion 597A1 of the first portion 597A of the coolant 598 to flow to the third body section 591B3. Thus, compared to the second group of cooling modules 506B, the bypass thread 580A of each cooling module in the first group of cooling modules 506A reduces flow restriction caused by the smaller number of cooling modules and parallel flow paths in the first group of cooling modules 506A. Therefore, the bypass threads 580A and 580B of each cooling module in the first group of cooling modules 506A and the second group of cooling modules 506B can balance the flow of coolant 598 from CDU 501 between the first group of cooling modules 506A and the second group of cooling modules 506B.

[0060] In some examples, a portion 597A1 of coolant 598 and a portion 597A1 of the first portion 597A of coolant 598 absorb waste heat from the first chipset 524A in the first group of circuit modules 504A and become partially heated coolant 597B. The partially heated coolant 597B is guided to the second cooling component 538A via a reflux section 591C. The partially heated coolant 597B absorbs waste heat from the second chipset 526A in the second group of circuit modules 504A and becomes heated coolant 597C. Heated coolant 597C from each cooling module of the first group of cooling modules 506A is guided to CDU 501. In some examples, a second portion 599A1 of coolant 598 absorbs waste heat from the first chipset 524B in the second group of circuit modules 504B and becomes partially heated coolant 599B. Partially heated coolant 599B is guided to the second cooling component 538B via reflux section 593C. The partially heated coolant 599B absorbs waste heat from the second chipset 526B of the second group of circuit modules 504B and becomes heated coolant 599C. Heated coolant 599C from each cooling module of the second group of cooling modules 506B is guided to CDU 501. CDU 501 receives heated coolant 597C and 599C from the first group of cooling modules 506A and the second group of cooling modules 506B, respectively. As discussed herein, heated coolant 597C and 599C can flow into CDU 501 and transfer waste heat to the facility fluid via a heat exchanger (not shown), and thus, heated coolant 597C and 599C cool to become coolant 598 (i.e., heated coolant 597C and 599C return to a cooled state).

[0061] Figure 6 This is a flowchart depicting a method 600 for describing the flow of coolant between multiple cooling modules in a first and second circuit assembly of a balancing electronic device. It should be noted herein that, for example, in conjunction with... Figures 2A to 1 F and Figures 3 to 5 Method 600 is described. Method 600 begins at box 602 and continues to box 604.

[0062] At block 604, method 600 includes directing a first portion of coolant flow from a coolant distribution unit (CDU) to a plurality of cooling modules thermally coupled to a plurality of circuit modules of a first circuit assembly. In some examples, the plurality of circuit modules includes a first set of circuit modules coupled to the first circuit assembly. In such examples, the plurality of cooling modules includes a first set of cooling modules thermally coupled to the first set of circuit modules. In some examples, the first circuit assembly includes up to four circuit modules and four cooling modules. For example, the first circuit module may include four circuit modules, and the first cooling module includes four cooling modules. In some examples, the CDU directs the first portion of coolant to each of the first set of cooling modules via a first set of parallel inlet manifolds of the CDU. Method 600 continues to block 606.

[0063] At block 606, method 600 includes directing the flow of a second portion of coolant from the CDU to a plurality of cooling modules thermally coupled to a plurality of circuit modules of a second circuit assembly. In some examples, the plurality of circuit modules further includes a second set of circuit modules coupled to the second circuit assembly. In such examples, the plurality of cooling modules includes a second set of cooling modules thermally coupled to the second set of circuit modules. In some examples, the second circuit assembly includes up to eight circuit modules and eight cooling modules. For example, the second circuit module may include eight circuit modules, and the second cooling module may include eight cooling modules.

[0064] In some examples, each of the plurality of cooling modules includes a cooling component comprising a fluid channel having a supply section, a body section, and a return section, wherein the body section branches into a first body section and a second body section, and the first and second body sections further merge into a third body section, wherein the supply section is connected to the first and second body sections, and the return section is connected to the third body section. Each of the plurality of cooling modules further includes a bypass threaded connection to the cooling component. The cooling component of each cooling module further includes: i) a first orifice extending between the third body section and a bifurcation region, at which the body section branches into the first and second body sections, and ii) a second orifice extending inside the cooling component and intersecting the first orifice. The bypass threaded connection of each cooling module is movably connected to the cooling component via the second orifice. Method 600 continues to block 608.

[0065] At block 608, method 600 includes: opening a bypass threaded section of each cooling module in at least one cooling module of the first circuit assembly to allow a sub-portion of a first portion of coolant to flow directly from the supply section to the third body section and bypass the first and second body sections. In some examples, opening the bypass threaded section of each cooling module in the first circuit assembly includes: moving the bypass threaded section outside a second orifice (e.g., partially moving it outside the second orifice) to expose the first orifice and allow a sub-portion of the first portion of coolant to flow directly from the supply section to the third body section. Method 600 continues to block 610.

[0066] At block 610, method 600 includes: closing the bypass thread of each cooling module in the second circuit assembly to prevent a sub-portion of the second portion of coolant from flowing directly from the supply section to the third body section, thereby balancing the flow of the first and second portions of coolant between the multiple cooling modules in the first and second circuit assemblies. In some examples, closing the bypass thread of each cooling module in the second circuit assembly includes: moving the bypass thread into the interior of a second orifice (e.g., completely into the second orifice) to cover the first orifice and prevent a sub-portion of the second portion of coolant from flowing directly from the supply section to the third body section. Therefore, the bypass thread in each cooling module of the first and second sets of cooling modules can regulate the flow of the first and second portions of coolant into the corresponding cooling modules in the first and second sets of cooling modules, thereby balancing the flow of the first and second portions of coolant between the multiple cooling modules in the first and second circuit assemblies.

[0067] In some examples, each cooling module further includes a second cooling component, the second cooling component including an intermediate fluid channel, wherein the intermediate fluid channel is fluidly coupled to a return section and a second fluid channel of the cooling component, and wherein coolant flows from the inlet of the cooling module through i) the supply section, the first body section and the second body section, the third body section and the return section of the cooling component, ii) the intermediate fluid channel of the second cooling component and iii) the second fluid channel of the cooling component to the outlet of the cooling module. Method 600 ends at block 616.

[0068] As discussed herein, a bypass thread in each of the multiple cooling modules regulates the flow of coolant from the CDU, thereby managing the balance of coolant flow between the cooling modules of the first and second circuit assemblies. Because the bypass thread in each of the first set of cooling modules creates an additional parallel flow path and allows each portion of the coolant to flow through one or more flow-restricting sections in the respective cooling module, the bypass thread is configured to reduce flow restriction due to the smaller number of cooling modules and the smaller number of parallel flow paths in the first set of cooling modules compared to the second set. Therefore, the bypass threads in the first and second sets of cooling modules are configured to maintain flow balance between the first and second sets of cooling modules.

[0069] In the foregoing description, numerous details have been set forth to provide an understanding of the subject matter disclosed herein. However, embodiments may be practiced without some or all of these details. Other embodiments may include modifications, combinations, and variations of the details discussed above. The appended claims are intended to cover such modifications and variations.

Claims

1. A cooling module, comprising: A cooling component, comprising a fluid channel having a supply section, a main body section, and a return section, The main body segment branches into a first main body segment and a second main body segment, and the first main body segment and the second main body segment are further merged into a third main body segment, wherein the supply segment is connected to the first main body segment and the second main body segment, and the return segment is connected to the third main body segment; as well as A bypass threaded component is movably connected to the cooling component through a peripheral portion, such that the bypass threaded component can move inside and outside the cooling component to regulate a portion of the coolant to flow directly from the supply section to the third body section and bypass the first and second body sections.

2. The cooling module according to claim 1, wherein the cooling component further comprises: i) a first orifice extending between the third main body segment and the bifurcation region, where the main body segment bifurcates into the first main body segment and the second main body segment, and ii) a second orifice extending inside the cooling component and intersecting with the first orifice.

3. The cooling module of claim 2, wherein the bypass threaded member is movably connected to the cooling component via the second orifice, and wherein the bypass threaded member: i) moves to the outside of the second orifice to expose the first orifice and allow a portion of the coolant to flow directly from the supply section to the third body section, or ii) moves to the inside of the second orifice to cover the first orifice and prevent the coolant from flowing directly from the supply section to the third body section.

4. The cooling module of claim 2, wherein the bypass threaded component further comprises one or more O-ring seals to prevent a portion of the coolant from leaking from the second orifice of the cooling component.

5. The cooling module of claim 1, further comprising a second cooling component, the second cooling component including an intermediate fluid channel, wherein the intermediate fluid channel is fluidly coupled to the return section and the second fluid channel of the cooling component, and wherein the coolant flows from the inlet of the cooling module through i) the supply section, the first body section and the second body section, the third body section and the return section of the cooling component, ii) the intermediate fluid channel of the second cooling component and iii) the second fluid channel of the cooling component to the outlet of the cooling module.

6. The cooling module of claim 5, wherein the second cooling component is positioned within a recess of the cooling component to fluidly connect the second cooling component to the cooling component, and wherein the return flow section is fluidly connected to the intermediate fluid channel to establish an inlet fluid flow path from the cooling component to the second cooling component, and the intermediate fluid channel is further fluidly connected to the second fluid channel to establish an outlet fluid flow path from the second cooling component to the cooling component.

7. The cooling module according to claim 5, wherein the main body segment includes a plurality of first microchannels thermally coupled to a first chipset of the circuit module, and wherein the intermediate fluid channel includes a plurality of second microchannels thermally coupled to a second chipset of the circuit module.

8. An electronic device, comprising: The cooling module according to claim 1; Circuit components; as well as Multiple circuit modules are coupled to the circuit assembly, wherein the cooling module is thermally coupled to the circuit assembly.

9. An electronic device, comprising: First circuit assembly and second circuit assembly; Multiple circuit modules, wherein the multiple circuit modules are coupled to the first circuit component and the second circuit component; as well as Multiple cooling modules, thermally coupled to the multiple circuit modules, wherein each of the multiple cooling modules includes: A cooling component includes a fluid channel having a supply section, a main body section, and a return section, wherein the main body section branches into a first main body section and a second main body section, and the first main body section and the second main body section further merge into a third main body section, wherein the supply section is connected to the first main body section and the second main body section, and the return section is connected to the third main body section; as well as A bypass threaded component, which is movably connected to the cooling component. The bypass threads of each cooling module coupled to the first circuit assembly are open to allow a sub-portion of a first portion of the coolant to flow directly from the supply section to the third body section and bypass the first and second body sections, and the bypass threads of each cooling module coupled to the second circuit assembly are closed to prevent a sub-portion of a second portion of the coolant from flowing directly from the supply section to the third body section, thereby balancing the flow of the first and second portions of the coolant between the plurality of cooling modules in the first and second circuit assemblies.

10. The electronic device of claim 9, wherein the first circuit assembly comprises up to four circuit modules and four cooling modules, and wherein the second circuit assembly comprises up to eight circuit modules and eight cooling modules.

11. The electronic device of claim 9, wherein the cooling component of each cooling module further comprises: i) a first orifice extending between the third main body segment and the bifurcation region, where the main body segment bifurcates into the first main body segment and the second main body segment, and ii) a second orifice extending inside the cooling component and intersecting with the first orifice.

12. The electronic device of claim 11, wherein the bypass threaded member of each cooling module is movably connected to the cooling component via the second orifice. The bypass threaded member of each cooling module coupled to the first circuit assembly is moved to the outside of the second orifice to expose the first orifice and allow a sub-portion of the first portion of the coolant to flow directly from the supply section to the third body section, and The bypass threaded part of each cooling module coupled to the second circuit assembly moves into the interior of the second orifice to cover the first orifice and prevent a sub-part of the second portion of the coolant from flowing directly from the supply section to the third body section.

13. The electronic device of claim 11, wherein the bypass threaded part of each cooling module further comprises one or more O-ring seals to prevent leakage of a first portion or a second portion of the coolant from a second orifice of the cooling component.

14. The electronic device of claim 9, wherein each cooling module further includes a second cooling component, the second cooling component including an intermediate fluid channel, wherein the intermediate fluid channel is fluidly coupled to the return section and the second fluid channel of the cooling component, and wherein the coolant flows from the inlet of the cooling module through i) the supply section, the first body section and the second body section, the third body section and the return section of the cooling component, ii) the intermediate fluid channel of the second cooling component and iii) the second fluid channel of the cooling component to the outlet of the cooling module.

15. The electronic device of claim 14, wherein the second cooling component is positioned within a recess of the cooling component to fluidly connect the second cooling component to the cooling component, and wherein the return flow section is fluidly connected to the intermediate fluid channel to establish an inlet fluid flow path from the cooling component to the second cooling component, and the intermediate fluid channel is further fluidly connected to the second fluid channel to establish an outlet fluid flow path from the second cooling component to the cooling component.

16. The electronic device of claim 14, wherein the main body segment of the cooling component includes a plurality of first microchannels thermally coupled to a first chipset of a corresponding circuit module, and wherein the intermediate fluid channel of the second cooling component includes a plurality of second microchannels thermally coupled to a second chipset of a corresponding circuit module.

17. A method for cooling an electronic circuit module, comprising: The flow of a first portion of the coolant from the coolant distribution unit (CDU) is directed to multiple cooling modules that are thermally coupled to multiple circuit modules of the first circuit assembly. The flow of a second portion of the coolant from the CDU is directed to a plurality of cooling modules thermally coupled to the plurality of circuit modules of the second circuit assembly, wherein each of the plurality of cooling modules comprises: A cooling component, comprising a fluid channel having a supply section, a main body section, and a return section, wherein the main body section branches into a first main body section and a second main body section, and the first main body section and the second main body section further merge into a third main body section, wherein the supply section is connected to the first main body section and the second main body section, and the return section is connected to the third main body section; and A bypass threaded component, which is connected to the cooling component; Open the bypass thread of each cooling module in at least one cooling module of the first circuit assembly to allow a sub-portion of the first portion of the coolant to flow directly from the supply section to the third body section and bypass the first and second body sections; and The bypass threaded section of each cooling module in the second circuit assembly is closed to prevent a sub-portion of the second portion of the coolant from flowing directly from the supply section to the third body section, thereby balancing the flow of the first and second portions of the coolant between the plurality of cooling modules in the first and second circuit assemblies.

18. The method of claim 17, wherein the cooling component of each cooling module further comprises: i) a first orifice extending between the third body segment and the bifurcation region, where the body segment bifurcates into the first body segment and the second body segment, and ii) a second orifice extending inside the cooling component and intersecting with the first orifice, wherein the bypass thread of each cooling module is movably connected to the cooling component via the second orifice.

19. The method of claim 18, wherein the bypass threaded member of each cooling module in the first circuit assembly is moved to the outside of the second orifice to expose the first orifice and allow a sub-portion of the first portion of the coolant to flow directly from the supply section to the third body section, and the bypass threaded member of each cooling module in the second circuit assembly is moved to the inside of the second orifice to cover the first orifice and prevent a sub-portion of the second portion of the coolant from flowing directly from the supply section to the third body section.

20. The method of claim 17, wherein each cooling module further includes a second cooling component, the second cooling component including an intermediate fluid channel, wherein the intermediate fluid channel is fluidly coupled to the return section and the second fluid channel of the cooling component, and wherein the coolant flows from the inlet of the cooling module through i) the supply section, the first body section and the second body section, the third body section and the return section of the cooling component, ii) the intermediate fluid channel of the second cooling component and iii) the second fluid channel of the cooling component to the outlet of the cooling module.

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