Mini-led wafer sorting method and sorting device

Abstract

The application discloses a mini-LED crystal grain sorting method and equipment, comprising: adjusting the relative position of the first blue film and the second blue film, driving the thimble assembly to be attached to the back of the first blue film corresponding to the position of the mini-LED crystal grain to be sorted, and driving the adsorption assembly to be attached to the back of the second blue film corresponding to the sorting position; driving the thimble of the thimble assembly to extend to the first blue film, driving the suction nozzle of the adsorption assembly to extend to the second blue film, driving the thimble of the thimble assembly to penetrate the first blue film, and based on the thimble, driving the mini-LED crystal grain to be sorted to be abutted on the corresponding sorting position of the second blue film; driving the suction nozzle of the adsorption assembly to adsorb the mini-LED crystal grain to be sorted, and adhering the mini-LED crystal grain to be sorted on the second blue film. By setting the thimble assembly and the adsorption assembly, the quick transfer of the mini-LED crystal grain between the two blue films is realized, and the sorting efficiency of the mini-LED crystal grain is improved.

Description

Technical Field

[0001] This invention mainly relates to the field of chip sorting technology, specifically to a method and equipment for sorting mini-LED chips. Background Technology

[0002] After the photoelectric parameters of the mini-LED wafers are tested, the mini-LED chips are sorted by sorting equipment so that mini-LED chips of the same photoelectric specifications can be packaged on the same blue film for shipment.

[0003] Existing sorting equipment uses a gripping and placing device system to sort mini-LED chips. After the mini-LED chips on the blue film of the wafer are lifted by the ejector pin assembly, the suction nozzle on the swing arm adsorbs and grips the mini-LED chips. By rotating the swing arm, the mini-LED chips are transported to the sorting position on the square blue film. The suction nozzle releases the mini-LED chips to the corresponding sorting position, thus completing the sorting of mini-LED chips.

[0004] Mini-LED chips are transferred onto a square blue film by swinging the arm. During the transfer process, due to high-speed operation and machine vibration, vacuum leakage is likely to occur at the suction nozzle on the arm, causing the chips to shift and fall off, affecting the reliability of mini-LED chip transfer. Moreover, the low efficiency of the swing arm transfer affects the transfer and sorting efficiency of mini-LED chips. Summary of the Invention

[0005] The purpose of this invention is to overcome the shortcomings of the prior art. This invention provides a method and equipment for sorting mini-LED chips. By setting up a pin assembly and an adsorption assembly, the mini-LED chips can be rapidly transferred between two blue films, thereby improving the sorting efficiency and reliability of mini-LED chips.

[0006] An actual light spot estimation model for LED devices is constructed by combining the actual and theoretical light spot areas. By constructing this estimation model to estimate the light spot area of ​​LED devices, the convenience of LED device parameter design and the efficiency of LED device fabrication are improved.

[0007] This invention provides a method for sorting mini-LED chips, the method comprising:

[0008] Adjust the relative positions of the first blue film and the second blue film so that the mini-LED chips to be sorted on the first blue film and the sorting position on the second blue film are on the same horizontal line;

[0009] The driving pin assembly is attached to the back of the first blue film corresponding to the position of the mini-LED chip to be sorted, and the driving adsorption assembly is attached to the back of the second blue film corresponding to the sorting position.

[0010] The push pin of the drive push pin assembly extends toward the first blue film, and the push pin lifts the mini-LED chip to be sorted on the first blue film to a first preset distance;

[0011] The suction nozzle of the driving adsorption component extends towards the second blue film, and is lifted to a second preset distance based on the corresponding sorting position of the suction nozzle on the second blue film;

[0012] The push pin of the drive push pin assembly penetrates the first blue film, and the push pin drives the mini-LED chip to be sorted to abut against the corresponding sorting position of the second blue film;

[0013] The suction nozzle of the drive adsorption component adsorbs the mini-LED crystals to be sorted, and adheres the mini-LED crystals to the second blue film.

[0014] Furthermore, adjusting the relative positions of the first blue film and the second blue film so that the mini-LED chips to be sorted on the first blue film and the sorting positions on the second blue film are on the same horizontal line includes:

[0015] Arrange the first and second blue films in parallel, adjust the relative positions between the first and second blue films, and adjust the sorting positions of the mini-LED chips to be sorted on the first blue film and the sorting positions on the second blue film to the same horizontal line.

[0016] Furthermore, the push pin of the driving push pin assembly extends towards the first blue film, and the push pin lifts the mini-LED chips to be sorted on the first blue film to a first preset distance, including:

[0017] The ejector cap of the drive ejector assembly extends toward the first blue film, such that the ejector pins inside the ejector cap abut against the back of the mini-LED chip to be sorted;

[0018] The pin assembly drives the mini-LED chips to be sorted to move towards the second blue film at a first preset distance.

[0019] Furthermore, the first preset distance is 45 μm.

[0020] Furthermore, the suction nozzle of the driving adsorption component extends towards the second blue film, and the lifting of the nozzle to a second preset distance based on the corresponding sorting position of the second blue film includes:

[0021] The suction nozzle of the driving adsorption component extends toward the second blue film, so that the suction nozzle abuts against the back of the corresponding sorting position of the second blue film;

[0022] Based on the suction nozzle, the corresponding sorting position on the second blue film is moved toward the first blue film to a second preset distance.

[0023] Furthermore, the second preset distance is 40 μm.

[0024] The present invention also provides a mini-LED chip sorting device, wherein the mini-LED chip sorting device is used to perform the sorting method;

[0025] The mini-LED chip sorting equipment includes: a first mounting track for placing a first blue film, a second mounting track for placing a second blue film, a pin assembly, and an adsorption assembly;

[0026] The first mounting track and the second mounting track are arranged in parallel, and the first mounting track and the second mounting track are disposed between the ejector pin assembly and the adsorption assembly;

[0027] The ejector pin assembly is provided with an ejector pin and a first telescopic cylinder that extends and retracts along the X-axis. The first telescopic cylinder drives the ejector pin, and the ejector pin extends towards the first mounting track based on the first telescopic cylinder.

[0028] The adsorption assembly is provided with a suction nozzle and a second telescopic cylinder that extends and retracts along the X-axis. The second telescopic cylinder is driven and connected to the suction nozzle, and the suction nozzle extends towards the second mounting track based on the second telescopic cylinder.

[0029] Furthermore, the distance between the first mounting track and the second mounting track is h, the thickness of the mini-LED chip on the first blue film is d, and the constraint relationship between h and d is: h = 2.5d.

[0030] Furthermore, the ejector pin assembly includes an ejector pin cap and an ejector pin disposed within the ejector pin cap, wherein one end of the ejector pin cap has a first opening for the ejector pin to extend and retract.

[0031] The adsorption assembly includes an adsorption sleeve and a suction nozzle disposed inside the adsorption sleeve. One end of the adsorption sleeve is provided with a second opening for the suction nozzle to extend and retract.

[0032] Furthermore, the adsorption assembly is also equipped with a vacuum adsorption sensor, which is used to detect the adsorption state of the mini-LED chips to be sorted by the suction nozzle.

[0033] This invention provides a method and equipment for sorting mini-LED chips. By setting a pin assembly on the back of a first blue film and an adsorption assembly on the back of a second blue film, the pin assembly and the adsorption assembly work together to achieve direct transfer of mini-LED chips between the first and second blue films, thereby realizing rapid transfer of mini-LED chips between the two blue films and improving the sorting efficiency and reliability of mini-LED chips. Attached Figure Description

[0034] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0035] Figure 1 This is a front view of the structure of the mini-LED chip sorting device in an embodiment of the present invention;

[0036] Figure 2 This is a schematic diagram of the structure of the mini-LED chip sorting device in an embodiment of the present invention;

[0037] Figure 3 This is a flowchart illustrating the mini-LED chip sorting method in an embodiment of the present invention;

[0038] Figure 4 This is a schematic diagram of the working state of the pin assembly of the mini-LED chip sorting device in an embodiment of the present invention;

[0039] Figure 5 This is a schematic diagram of the working state of the adsorption component of the mini-LED crystal sorting device in an embodiment of the present invention. Detailed Implementation

[0040] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0041] Figure 1 This shows a front view of the mini-LED chip sorting device in an embodiment of the present invention. Figure 2A schematic diagram of the structure of a mini-LED chip sorting device in an embodiment of the present invention is shown. The mini-LED chip sorting device includes: a first mounting track 4 for placing a first blue film, a second mounting track 5 for placing a second blue film, a pin assembly 2, and an adsorption assembly 3. The first mounting track 4 and the second mounting track 5 are arranged in parallel. The first blue film is mounted on the first mounting track 4, and the second blue film is mounted on the second mounting track 5, so that the first blue film and the second blue film are arranged in parallel to realize the chip transfer operation between the first blue film and the second blue film.

[0042] The first mounting track 4 and the second mounting track 5 are disposed between the ejector assembly 2 and the adsorption assembly 3. When transferring the mini-LED chips to be sorted on the first blue film, the ejector assembly 2 is located on the back of the first blue film, and the adsorption assembly 3 is located on the back of the second blue film. The ejector assembly 2 and the adsorption assembly 3 cooperate with each other to realize the transfer of the mini-LED chips to be sorted on the first blue film.

[0043] Furthermore, the second blue film has a greater viscosity than the first blue film, which allows the mini-LED chips to be sorted on the first blue film to be easily transferred to the second blue film. The first blue film and the second blue film are arranged in parallel with a small pitch. With the help of the ejector pin assembly 2 and the adsorption assembly 3, the mini-LED chips to be sorted on the first blue film can be quickly transferred to the second blue film.

[0044] Figure 4 A schematic diagram showing the working state of the pin assembly of the mini-LED chip sorting device in an embodiment of the present invention is shown; Figure 5 A schematic diagram of the working state of the adsorption component of the mini-LED chip sorting device in an embodiment of the present invention is shown. The ejector pin assembly 2 is provided with ejector pin 22 and a first telescopic cylinder 23 that extends and retracts along the X-axis. The first telescopic cylinder 23 drives and connects to the ejector pin 22, and the ejector pin 22 extends towards the first mounting track 4 based on the first telescopic cylinder 23. The first telescopic cylinder 23 can drive the ejector pin 22 of the ejector pin assembly 2 to lift towards the first blue film of the first mounting track 4, so that the ejector pin 22 can push the mini-LED chips to be sorted on the first blue film towards the second blue film, so as to transfer the mini-LED chips to be sorted.

[0045] The adsorption component 3 is provided with a suction nozzle 32 and a second telescopic cylinder 33 that extends and retracts along the X-axis. The second telescopic cylinder 33 drives and connects to the suction nozzle 32, and the suction nozzle 32 extends towards the second mounting track 5 based on the second telescopic cylinder 33. The second telescopic cylinder 33 drives the suction nozzle 32 to lift and extend towards the second blue film on the second mounting track 5, so that the corresponding sorting position on the second blue film can be close to the first blue film, thereby realizing the rapid transfer of the mini-LED chips to be sorted.

[0046] Specifically, the distance between the first mounting track 4 and the second mounting track 5 is h, and the thickness of the mini-LED chip on the first blue film is d. The constraint relationship between h and d is: h = 2.5d. Adjusting the spacing between the first mounting track 4 and the second mounting track 5 according to the thickness of the mini-LED chip to be sorted on the first blue film can reduce the transfer distance of the mini-LED chip to be sorted on the first blue film, while satisfying the extensibility of the first and second blue films. During the transfer of a single mini-LED chip to be sorted, it can avoid affecting the remaining mini-LED chips to be sorted on the first blue film and the mini-LED chips on the second blue film, thereby improving the reliability of the transfer and sorting of mini-LED chips to be sorted between the first and second blue films.

[0047] Specifically, a first rotating base and a first drive motor are slidably disposed on the first mounting track 4. The first drive motor drives and connects to the first rotating base, so that the first rotating base can move along the first mounting track 4 in the Y-axis direction, thereby adjusting the position of the first blue film in the Y-axis direction.

[0048] Furthermore, the rotating base includes a rotary drive motor and a transmission belt mechanism. The rotary drive motor drives the transmission belt, and the first blue film is mounted on the driven wheel of the transmission belt mechanism. The rotary drive motor drives the first blue film to rotate around the X-axis based on the transmission belt mechanism, thereby adjusting the position of the mini-LED chips to be sorted on the first blue film.

[0049] Furthermore, the second mounting track 5 is provided with the same driving structure as the first mounting track 4, thereby realizing the movement of the second blue film in the Y-axis and the rotation in the X-axis. By adjusting the relative position between the first blue film and the second blue film, the mini-LED chips to be sorted on the first blue film and the corresponding sorting position on the second blue film can be located on the same horizontal line, thereby meeting the sorting requirements of the mini-LED chips to be sorted.

[0050] Specifically, the ejector pin assembly 2 includes an ejector pin cap 21 and an ejector pin 22 disposed inside the ejector pin cap 21. One end of the ejector pin cap 21 has a first opening for the ejector pin 22 to extend and retract. A first telescopic cylinder 23 drives and connects to the ejector pin 22. The first telescopic cylinder 23 can drive the ejector pin 22 to extend out, so that the ejector pin 22 extends outside the ejector pin cap 21 through the first opening. The ejector pin 22 can penetrate the first blue film and lift the mini-LED crystals to be sorted on the first blue film so that the adsorption assembly 3 can adsorb the mini-LED crystals to be sorted.

[0051] The adsorption assembly 3 includes an adsorption sleeve 31 and a suction nozzle 32 disposed inside the adsorption sleeve 31. One end of the adsorption sleeve 31 is provided with a second opening for the suction nozzle 32 to extend and retract. A second telescopic cylinder 33 is connected to the suction nozzle 32. The second telescopic cylinder 33 can drive the suction nozzle 32 to extend out of the adsorption sleeve 31 through the second opening and abut against the second blue film so as to complete the adsorption and transfer of the mini-LED chips to be sorted through the suction nozzle 32.

[0052] Furthermore, a vacuum pipe is connected to the end of the suction nozzle 32. The vacuum pipe is connected to an external air source and a control valve is provided on the vacuum pipe. The air intake and exhaust operations of the suction nozzle 32 can be adjusted based on the control valve, thereby realizing vacuum adsorption and release of the suction nozzle 32.

[0053] Furthermore, when the second telescopic cylinder 33 drives the suction nozzle 32 to move toward the second blue film, the suction nozzle 32 is adjusted to a suction state by the control valve to achieve vacuum adsorption of the suction nozzle 32, so that the mini-LED crystal to be sorted can be stably adsorbed on the second blue film.

[0054] Specifically, the adsorption component 3 is also equipped with a vacuum adsorption sensor. The vacuum adsorption sensor is used to detect the adsorption state of the nozzle 32 on the mini-LED crystal to be sorted. When the vacuum adsorption sensor detects that the nozzle 32 has adsorbed the mini-LED crystal to be sorted, the positions of the pin assembly 2 and the adsorption component 3 are adjusted so that the first blue film and the second blue film can be reset, and the transfer of the mini-LED crystal to be sorted from the first blue film to the second blue film is completed.

[0055] Specifically, the mini-LED sorting device is further provided with a first adjustment mechanism 6 and a second adjustment mechanism 7. The ejector pin assembly 2 is disposed on the first adjustment mechanism 6, and the adsorption assembly 3 is disposed on the second adjustment mechanism 7. The first adjustment mechanism 6 includes a Z-axis adjustment assembly 61, an X-axis adjustment assembly 63, and a Y-axis adjustment assembly 62. The Z-axis adjustment assembly 61, X-axis adjustment assembly 63, and Y-axis adjustment assembly 62 cooperate with each other to adjust the position of the ejector pin assembly 2, so that the ejector pin assembly 2 can be positioned at different positions on the back of the first blue film to meet the transfer operation of mini-LED chips to be sorted at different positions on the first and second blue films.

[0056] Furthermore, the second adjustment mechanism 7 has the same structural configuration and functional effects as the first adjustment mechanism 6, which will not be described in detail here.

[0057] Figure 3 A flowchart of a mini-LED chip sorting method according to an embodiment of the present invention is shown. The mini-LED chip sorting method includes:

[0058] S11: Adjust the relative positions of the first blue film and the second blue film so that the mini-LED chips to be sorted on the first blue film and the sorting position on the second blue film are on the same horizontal line.

[0059] Specifically, the first blue film and the second blue film are arranged in parallel, and the relative positions between the first blue film and the second blue film are adjusted so that the mini-LED chips to be sorted on the first blue film and the sorting positions on the second blue film are adjusted to the same horizontal line, so that the mini-LED chips to be sorted on the first blue film and the sorting positions on the second blue film are set to correspond, so as to transfer the mini-LED chips to be sorted from the first blue film to the second blue film.

[0060] Furthermore, the ejector pin 22 of the ejector pin assembly 2 and the suction nozzle 32 of the adsorption assembly 3 are adjusted to be on the same horizontal line. The ejector pin 22 of the ejector pin assembly 2 can lift the mini-LED crystals to be sorted on the first blue film, and the mini-LED crystals to be sorted can be adsorbed based on the suction nozzle 32 of the adsorption assembly 3, thereby completing the transfer of the mini-LED crystals to be sorted.

[0061] S12: Drive the pin assembly 2 to adhere to the back of the first blue film corresponding to the position of the mini-LED chip to be sorted, and drive the adsorption assembly 3 to adhere to the back of the second blue film corresponding to the sorting position.

[0062] Specifically, the ejector pin assembly 2 is adjusted to adhere to the back side of the first blue film corresponding to the position of the mini-LED chip to be sorted, so that the ejector pin cap 21 of the ejector pin assembly 2 abuts against the first blue film, causing the position of the mini-LED chip to be sorted on the first blue film to bulge towards the second blue film. That is, the ejector pin assembly 2 squeezes the first blue film and keeps the first blue film in a taut state. The squeezing position of the ejector pin assembly 2 corresponds to the back side of the position of the mini-LED chip to be sorted, improving the convenience of transferring the mini-LED chip to be sorted.

[0063] The adsorption component 3 is driven to adhere to the back of the second blue film, so that the suction nozzle 32 of the adsorption component 3 can adhere to the back of the second blue film at the corresponding sorting position. The adsorption component 3 is driven to squeeze the second blue film, so that the second blue film can be in a taut state, so that the second blue film can complete the adsorption and fixation of the mini-LED chips to be sorted.

[0064] S13: Drive the ejector pin 22 of the ejector pin assembly 2 to extend toward the first blue film, and lift the mini-LED chips to be sorted on the first blue film to a first preset distance based on the ejector pin 22.

[0065] Specifically, the relative position between the ejector pin assembly 2 and the adsorption assembly 3 is obtained by a position sensor to ensure that the ejector pin 22 of the ejector pin assembly 2 and the suction nozzle 32 of the adsorption assembly 3 are kept at the same horizontal position so that the ejector pin assembly 2 and the adsorption assembly 3 cooperate with each other to transfer the mini-LED chips to be sorted.

[0066] The push pin 22 of the driving push pin assembly 2 extends toward the first blue film, and the push pin 22 lifts the mini-LED chips to be sorted on the first blue film to a first preset distance, including:

[0067] The ejector cap 21 of the drive ejector assembly 2 extends toward the first blue film, such that the ejector pin 22 inside the ejector cap 21 abuts against the back of the mini-LED chip to be sorted, and the first blue film is in a taut state due to the compression of the ejector assembly 2.

[0068] The pin assembly 2 drives the mini-LED chip to be sorted to move towards the second blue film to a first preset distance.

[0069] Specifically, the ejector assembly 2 drives the ejector pin 22 to move via the first telescopic cylinder 23, so that the ejector pin 22 can quickly extend from the first opening of the ejector cap 21, and move the mini-LED chip to be sorted toward the second blue film to a first preset distance based on the ejection drive of the ejector pin 22.

[0070] Furthermore, the first preset distance is 45μm. The first preset distance is within the range of the stretch deformation of the first blue film. Based on the stretchability of the first blue film, the pin 22 can drive the position on the first blue film corresponding to the mini-LED chip to be sorted to rise to the first preset distance, and ensure that the mini-LED chips adjacent to the mini-LED chip to be sorted can remain stable.

[0071] S14: The suction nozzle 32 of the driving adsorption component 3 extends toward the second blue film, and is lifted to a second preset distance based on the corresponding sorting position of the second blue film by the suction nozzle 32.

[0072] Specifically, the adsorption component 3 is driven to adhere tightly to the second blue film, and the adsorption sleeve 31 on the adsorption component 3 abuts against the back of the corresponding sorting position of the second blue film. Based on the compression of the adsorption component 3, the second blue film is in a taut state.

[0073] The suction nozzle 32 of the driving adsorption component 3 extends toward the second blue film, and the suction nozzle 32 lifts the second blue film to a second preset distance based on the corresponding sorting position of the second blue film, including:

[0074] The suction nozzle 32 of the driving adsorption component 3 extends towards the second blue film, so that the suction nozzle 32 abuts against the back of the corresponding sorting position of the second blue film; the suction nozzle 32 inside the adsorption sleeve 31 is driven by the second telescopic cylinder 33, so that the suction nozzle 32 can extend out from the second opening of the adsorption sleeve 31, and the suction nozzle 32 abuts against the back of the corresponding sorting position of the second blue film. Based on the suction nozzle 32, the corresponding sorting position on the second blue film is moved towards the first blue film by a second preset distance, thereby reducing the distance between the mini-LED chip to be sorted on the first blue film and the corresponding sorting position on the second blue film, thereby improving the convenience of transferring the mini-LED chip to be sorted from the first blue film to the corresponding sorting position on the second blue film.

[0075] Furthermore, the second preset distance is 40μm. The second preset distance is within the range of the extensibility deformation of the second blue film. Based on the extensibility of the second blue film, the suction nozzle 32 can drive the corresponding sorting position of the second blue film to be lifted towards the first blue film to the second preset distance. When the transfer of the mini-LED crystal to be sorted is completed, and the suction nozzle 32 of the adsorption component 3 retracts inward, the second blue film can be reset based on its own extensibility, while avoiding the risk of deformation of the second blue film.

[0076] S15: Drive the pin 22 of the drive pin assembly 2 to penetrate the first blue film, and drive the mini-LED chip to be sorted to abut against the corresponding sorting position of the second blue film based on the pin 22.

[0077] Specifically, the first telescopic cylinder 23 drives the ejector pin 22 of the ejector pin assembly 2 to extend rapidly, so that the ejector pin 22 of the ejector pin assembly 2 can penetrate the first blue film. The first telescopic cylinder 23 drives the ejector pin 22 to push out the mini-LED chip to be sorted, so that the mini-LED chip can be connected to the corresponding sorting position of the second blue film. Based on the sorting position of the second blue film, the mini-LED chip can be bonded, thereby allowing the mini-LED chip to be transferred to the sorting position of the second blue film.

[0078] S16: The suction nozzle 32 of the drive adsorption component 3 adsorbs the mini-LED crystal to be sorted and adheres the mini-LED crystal to be sorted onto the second blue film.

[0079] Specifically, the suction nozzle 32 is driven into a vacuum adsorption state by the adsorption component 3, so that the second blue film can be adsorbed onto the suction nozzle 32. When the mini-LED chip adheres to the corresponding sorting position of the second blue film, the second telescopic cylinder 33 drives the suction nozzle 32 to reset. The suction nozzle 32 adsorbs onto the second blue film, so that the second blue film can be reset under the action of the second telescopic cylinder 33, and the mini-LED chip can adhere to the corresponding sorting position of the second blue film, thereby improving the reliability of the mini-LED chip transfer.

[0080] When the second blue film returns to its initial position, the suction nozzle 32 exits the vacuum adsorption state, causing the suction nozzle 32 to disengage from the adsorption engagement state with the second blue film, and the second telescopic cylinder 33 drives the suction nozzle 32 to retract into the adsorption sleeve 31.

[0081] This invention provides a method for sorting mini-LED chips. By setting a pin assembly 2 on the back of a first blue film and an adsorption assembly 3 on the back of a second blue film, the pin assembly 2 and the adsorption assembly 3 work together to achieve direct transfer of mini-LED chips between the first and second blue films, thereby realizing rapid transfer of mini-LED chips between the two blue films and improving the sorting efficiency of mini-LED chips.

[0082] Furthermore, the above provides a detailed description of the mini-LED chip sorting method and sorting equipment provided by the embodiments of the present invention. Specific examples have been used to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of the present invention. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of the present invention. Therefore, the content of this specification should not be construed as a limitation of the present invention.

Claims

1. A method for sorting mini-LED chips, characterized in that, The mini-LED chip sorting method includes: Adjust the relative positions of the first blue film and the second blue film so that the mini-LED chips to be sorted on the first blue film and the sorting position on the second blue film are on the same horizontal line; The driving pin assembly is attached to the back of the first blue film corresponding to the position of the mini-LED chip to be sorted, and the driving adsorption assembly is attached to the back of the second blue film corresponding to the sorting position. The push pin of the drive push pin assembly extends toward the first blue film, and the push pin lifts the mini-LED chip to be sorted on the first blue film to a first preset distance; The suction nozzle of the driving adsorption component extends towards the second blue film, and is lifted to a second preset distance based on the corresponding sorting position of the suction nozzle on the second blue film; The push pin of the drive push pin assembly penetrates the first blue film, and the push pin drives the mini-LED chip to be sorted to abut against the corresponding sorting position of the second blue film; The suction nozzle of the drive adsorption component adsorbs the mini-LED crystals to be sorted, and adheres the mini-LED crystals to the second blue film.

2. The mini-LED chip sorting method as described in claim 1, characterized in that, Adjusting the relative positions of the first blue film and the second blue film so that the mini-LED chips to be sorted on the first blue film and the sorting position on the second blue film are on the same horizontal line includes: Arrange the first and second blue films in parallel, adjust the relative positions between the first and second blue films, and adjust the sorting positions of the mini-LED chips to be sorted on the first blue film and the sorting positions on the second blue film to the same horizontal line.

3. The mini-LED chip sorting method as described in claim 1, characterized in that, The push pin of the driving push pin assembly extends toward the first blue film, and the push pin lifts the mini-LED chips to be sorted on the first blue film to a first preset distance, including: The ejector cap of the drive ejector assembly extends toward the first blue film, such that the ejector pins inside the ejector cap abut against the back of the mini-LED chip to be sorted; The pin assembly drives the mini-LED chips to be sorted to move towards the second blue film at a first preset distance.

4. The mini-LED chip sorting method as described in claim 3, characterized in that, The first preset distance is 45μm.

5. The mini-LED chip sorting method as described in claim 1, characterized in that, The suction nozzle of the driving adsorption component extends towards the second blue film, and the lifting of the nozzle to a second preset distance based on the corresponding sorting position of the second blue film includes: The suction nozzle of the driving adsorption component extends toward the second blue film, so that the suction nozzle abuts against the back of the corresponding sorting position of the second blue film; Based on the suction nozzle, the corresponding sorting position on the second blue film is moved toward the first blue film to a second preset distance.

6. The mini-LED chip sorting method as described in claim 1, characterized in that, The second preset distance is 40μm.

7. A mini-LED chip sorting device, characterized in that, The sorting equipment for mini-LED chips is used to perform the sorting method as described in any one of claims 1 to 6; The mini-LED chip sorting equipment includes: a first mounting track for placing a first blue film, a second mounting track for placing a second blue film, a pin assembly, and an adsorption assembly; The first mounting track and the second mounting track are arranged in parallel, and the first mounting track and the second mounting track are disposed between the ejector pin assembly and the adsorption assembly; The ejector pin assembly is provided with an ejector pin and a first telescopic cylinder that extends and retracts along the X-axis. The first telescopic cylinder drives the ejector pin, and the ejector pin extends towards the first mounting track based on the first telescopic cylinder. The adsorption assembly is provided with a suction nozzle and a second telescopic cylinder that extends and retracts along the X-axis. The second telescopic cylinder is driven and connected to the suction nozzle, and the suction nozzle extends towards the second mounting track based on the second telescopic cylinder.

8. The mini-LED chip sorting equipment as described in claim 7, characterized in that, The distance between the first mounting track and the second mounting track is h, the thickness of the mini-LED chip on the first blue film is d, and the constraint relationship between h and d is: h = 2.5d.

9. The mini-LED chip sorting equipment as described in claim 7, characterized in that, The ejector pin assembly includes an ejector pin cap and an ejector pin disposed inside the ejector pin cap, wherein one end of the ejector pin cap has a first opening for the ejector pin to extend and retract; The adsorption assembly includes an adsorption sleeve and a suction nozzle disposed inside the adsorption sleeve. One end of the adsorption sleeve is provided with a second opening for the suction nozzle to extend and retract.

10. The mini-LED chip sorting equipment as described in claim 7, characterized in that, The adsorption assembly is also equipped with a vacuum adsorption sensor, which is used to detect the adsorption state of the nozzle on the mini-LED chips to be sorted.

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