Temperature compensated time delay transducer assembly

Abstract

The application discloses a temperature compensation type delay transducing element assembly, which comprises a transducing element, an upper substrate, a delay fuse circuit, a lower substrate, a connecting column and a solder pad; the transducing element is located on the surface of the upper substrate, the delay fuse circuit is located on the surface of the lower substrate, and two solder pads are located at the bottom of the lower substrate; the connecting column is arranged in the upper substrate and the lower substrate, and the transducing element, the delay fuse circuit and the solder pad are connected through the connecting column; the transducing element and the delay fuse circuit are connected in parallel, and the two solder pads serve as power supply electrodes of the transducing element assembly; when input power supply current is input, the delay fuse circuit shunts the current of the transducing element, and loop energy is loaded on the delay fuse circuit; after a certain time, heat on the delay fuse circuit is gradually accumulated and then the delay fuse circuit is fused, the power supply current is loaded on the transducing element, and ignition and detonation are realized.

Description

Technical Field

[0001] This invention relates to the field of pyrotechnics, and more particularly to a pyrotechnic transducer component with temperature-compensated delayed ignition and detonation capability. Background Technology

[0002] Current ignition-initiated pyrotechnics typically use bridge wires, semiconductor bridges, bridge strips, or metal film bridges as transducers. When current is applied, heat is generated through the electrothermal effect to ignite the initial charge. For applications requiring delayed ignition and detonation, an external delay circuit is generally used.

[0003] To improve the delayed ignition accuracy of pyrotechnic devices, invention patent CN101666595A discloses a digital detonator control chip. This chip includes a central processing control module, a communication interface module, a clock circuit module, a memory module, an initiation safety verification control module, an ignition control module, a functional status detection module, a safety threshold voltage detection module, a power supply module, and a charging / discharging module. It improves the chip's delay accuracy and consistency by compensating for the delay parameters of ignition circuits with different resistance values ​​through an adaptive time accuracy control circuit. Utility model patent CN202562380U introduces an electronic delayed ignition control circuit, and invention patent CN101586931A introduces a calibrable electronic detonator control chip and its control process, including design methods and control strategies for external delay circuits. This type of technology can realize high-precision delayed detonation control of digital electronic detonators and is applicable to civil blasting and other application scenarios. The main shortcomings are: (1) It requires the addition of processing chips, timing chips and their peripheral circuit modules, which increases complexity, reduces reliability, and is large in size and high in cost, and cannot be adapted to application scenarios with strict requirements for reliability and size; (2) The temperature adaptability range of electronic components in the circuit module is narrow, making it difficult to achieve high-precision delay in the temperature range of -62℃ to 107℃ at low cost.

[0004] The utility model patent with authorization number CN201852529U discloses an electronic delay semiconductor bridge detonator, which includes a basic detonator, a connecting plug, an electronic delay chip, and a semiconductor bridge (SCB) element. The two poles of the semiconductor bridge (SCB) element are connected to the two poles of the output end of the electronic delay chip, and the lead wire of the connecting plug is connected to the two poles of the input end of the electronic delay chip. The assembly is formed into an electronic delay ignition component. The electronic delay ignition component is inserted into the basic detonator, and the connecting plug is clamped at the mouth of the basic detonator. Precise delay is achieved through the electronic delay chip. After the delay ends, the detonation current is output to the semiconductor bridge element to realize the detonator detonation. This patent can solve the problem of low delay accuracy of electric detonators. It has a simple structure and good safety, and is suitable for industrial controlled blasting. The main shortcomings are: (1) It fails to achieve integrated integration with the semiconductor bridge transducer, which significantly increases the length of the product; (2) It does not have a high-precision delay function in a wide temperature range.

[0005] In summary, in order to achieve delay control of ignition and detonation of pyrotechnics, existing technologies usually adopt external delay circuits. No integrated design with the transducer has been found. Furthermore, existing solutions do not consider the impact of the difference in the transducer's excitation time on delay accuracy at high and low temperatures, and cannot meet the application scenarios with high requirements for operating temperature range. Summary of the Invention

[0006] The technical problem solved by this invention is to overcome the shortcomings of the prior art and provide a transducer component that integrates a multi-component, temperature-compensated material delay-blow circuit with the transducer, so as to achieve a high-precision delayed ignition and detonation function with small volume and wide temperature range without adding an additional delay control circuit.

[0007] The technical solution of this invention is: a temperature-compensated time-delay transducer assembly, comprising a transducer, an upper substrate, a time-delay fuse circuit, a lower substrate, connecting pillars, and pads; the transducer is located on the surface of the upper substrate, the time-delay fuse circuit is located on the surface of the lower substrate, and two pads are located at the bottom of the lower substrate; both the upper and lower substrates have connecting pillars, which connect the transducer, the time-delay fuse circuit, and the pads; the transducer and the time-delay fuse circuit are connected in parallel, and the two pads serve as the power supply electrodes of the transducer assembly; when the power supply current is input, the time-delay fuse circuit shunts the current of the transducer, and the loop energy is loaded on the time-delay fuse circuit; after a certain period of time, the heat on the time-delay fuse circuit gradually accumulates and melts, and the power supply current is loaded onto the transducer, realizing ignition and detonation.

[0008] The transducer is a metal film bridge, which is deposited on the upper surface of the substrate by magnetron sputtering or ion beam sputtering.

[0009] The metal membrane bridge material is Ni, Cr, Pt, NiCr, PtW, or TaN.

[0010] The time-delay fuse is composed of two material components with positive and negative temperature coefficients of resistivity, and is fabricated on the upper surface of the lower substrate using microelectronic processes.

[0011] The resistance of the time-delay fuse circuit is much smaller than that of the transducer at all temperatures.

[0012] The time-delay fuse circuit is connected to the transducer and pads via connecting posts. It adopts a centrally symmetrical design with a fuse zone in the center. The width of the fuse zone is smaller than that of other parts of the time-delay fuse circuit.

[0013] Adjust the material composition ratio of the time-delay fuse circuit according to the ignition time characteristics of the selected transducer so that its resistance is lower at high temperature than at low temperature.

[0014] The fusing time of the time-delay fuse circuit can be controlled by adjusting the length, width, thickness, and graphic design of the time-delay fuse circuit.

[0015] Both the upper and lower substrates are made of AlN or Si3N4 material.

[0016] In practical applications, low and high temperature operating environments can affect the ignition and detonation time of the transducer, with the high-temperature ignition time being shorter than the low-temperature ignition time. By adjusting the ratio of the delay fuse circuit based on the ignition time characteristics of the selected transducer, its resistance is made slightly lower at high temperatures than at low temperatures. Under the influence of the operating current, the delay fuse time is correspondingly extended, thereby compensating for the difference in transducer ignition time between low and high temperatures and achieving high-precision delay over a wide temperature range.

[0017] The advantages of this invention compared to the prior art are:

[0018] (1) By using a two-component temperature compensation material, the difference between the agent activation time and the delay time can be compensated by the delay melting time at high and low temperatures, so that the delay accuracy of the product can be guaranteed in the high and low temperature working temperature range.

[0019] (2) Existing technologies typically use external discrete time-delay detonation control circuits. Compared to discrete device solutions, the integrated solution using microelectronic technology significantly reduces the product size.

[0020] (3) It can achieve mass production, with better consistency and lower cost. Attached Figure Description

[0021] Figure 1 This is a cross-sectional view of the overall structure of the time-delayed energy transfer element component of the present invention;

[0022] Figure 2 This is an isometric view of the overall structure of the time-delayed energy transfer element component of the present invention;

[0023] Figure 3 This is an isometric view of the relevant structure of the time-delay fuse circuit of the present invention;

[0024] Figure 4 This is a top view of the time-delay fuse circuit of the present invention;

[0025] Figure 5 This is the equivalent circuit of the time-delayed transducer component of the present invention;

[0026] Figure 6 This is a cross-sectional view of the relevant structure of the time-delay fuse circuit of the present invention;

[0027] Figure 7 This is a schematic diagram of the resistance versus temperature curve under typical material composition ratios for the time-delay fuse circuit of this invention. Detailed Implementation

[0028] like Figure 1-3 As shown, this invention discloses a temperature-compensated time-delay transducer assembly, comprising a transducer 1, an upper substrate 2, a time-delay fuse line 3, a lower substrate 4, connecting posts 5, and pads 6. The transducer 1 is located on the surface of the upper substrate 2, the time-delay fuse line 3 is located on the surface of the lower substrate 4, and two pads 6 are located at the bottom of the lower substrate 4. Both the upper substrate 2 and the lower substrate 4 contain connecting posts 5, which connect the transducer 1, the time-delay fuse line 3, and the pads 6. The transducer 1 and the time-delay fuse line 3 are connected in parallel. The solder pad 6 serves as the power supply electrode for the transducer component; the time-delay fuse 3 is composed of two material components with positive and negative temperature coefficients of resistivity, and its resistance value at each temperature is much smaller than that of the transducer; when the power supply current is input, the time-delay fuse 3 shunts the current of the transducer 1, and the main current of the circuit is loaded on the time-delay fuse 3; within a predetermined time, the heat on the fuse 3 gradually accumulates and melts, and the power supply current is loaded onto the transducer 1 to achieve ignition and detonation.

[0029] like Figure 1 As shown, the transducer 1 of the present invention is a metal film bridge with a typical resistance of (0.9~1.2)Ω. The material is one of Ni / Cr / Pt / NiCr / PtW / TaN, and the typical thickness is (1~4)μm. It can be deposited on the upper surface of the upper substrate 2 by magnetron sputtering or ion beam sputtering. Both the upper substrate and the lower substrate are made of AlN or Si3N4 material.

[0030] like Figure 4As shown, the time-delay fuse circuit 3 of the present invention is a non-polar resistive material with a typical resistance value of (50~100) mΩ. It is connected to the transducer 1 and the pad 6 through the connecting post 5. It adopts a central symmetrical design and has a fuse zone in the center. The width of the fuse zone is narrower than other parts of the time-delay fuse circuit. The typical width w is (50~200) μm.

[0031] Figure 5 The diagram shows the equivalent circuit of the time-delayed transducer component of this invention. When a normal operating current is applied, since the resistance of the time-delayed fuse circuit 3 is much smaller than that of the transducer 1, the current mainly acts on the time-delayed fuse circuit 3. The current diverted to the transducer 1 is insufficient to generate heat to trigger the detonation of the propellant. When the temperature of the central fuse zone of the time-delayed fuse circuit 3 rises to the fuse temperature Tm due to heat accumulation, the circuit melts. At this time, the entire operating current acts on the transducer 1. Under the action of the operating current, the temperature of the core bridge region of the transducer 1 gradually increases, triggering the detonation of the propellant and realizing the ignition and detonation function.

[0032] like Figure 6 As shown, the time-delay fuse 3 of the present invention is composed of two material components and is fabricated on the upper surface of the lower substrate 4 using microelectronic processes, with a typical thickness h of 1µm to 8µm. The two material components are a material 31 with a positive temperature coefficient of resistivity and a material 32 with a negative temperature coefficient of resistivity. The choice of materials depends on the temperature range required for the product. Theoretically, all materials with positive and negative temperature coefficients of resistivity can be used to combine and fabricate the time-delay fuse 3 of the present invention.

[0033] The time-delay fuse 3 of the present invention can achieve a delay in the range of milliseconds to hundreds of milliseconds by adjusting the width d, thickness h and material composition ratio to control the delay time.

[0034] Figure 7 The diagram shows the resistance value of the delay fuse circuit 3 as a function of temperature under different component ratios. In practical applications, low and high temperature operating environments can affect the ignition and detonation time of transducer 1. For example, the difference in 5A ignition time between bridge-band and metal film bridge transducers at low temperature (-62℃) and high temperature (107℃) is generally in the sub-millisecond to millisecond range, with the high-temperature ignition time being shorter than the low-temperature ignition time. By adjusting the ratio of the delay fuse circuit 3 according to the ignition time characteristics of the selected transducer 1, the resistance at high temperature is slightly lower than that at low temperature, and the delay fuse time is correspondingly extended, thereby compensating for the difference in ignition time between low and high temperatures and achieving high-precision delay over a wide temperature range.

[0035] Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make possible changes and modifications to the technical solutions of the present invention based on the above-disclosed technical content without departing from the spirit and scope of the present invention. Therefore, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solutions of the present invention shall fall within the protection scope of the technical solutions of the present invention.

Claims

1. A temperature-compensated time-delay transduction element assembly, characterized by, It includes a transducer, an upper substrate, a time-delay fuse circuit, a lower substrate, connecting pillars, and pads. The transducer is located on the surface of the upper substrate, the time-delay fuse circuit is located on the surface of the lower substrate, and two pads are located at the bottom of the lower substrate. Both the upper and lower substrates have connecting pillars, which connect the transducer, the time-delay fuse circuit, and the pads. The transducer and the time-delay fuse circuit are connected in parallel, and the two pads serve as the power supply electrodes for the transducer assembly. When the power supply current is input, the time-delay fuse circuit shunts the current to the transducer, and the loop energy is loaded onto the time-delay fuse circuit. After a certain period of time, the heat on the time-delay fuse circuit gradually accumulates and melts, and the power supply current is loaded onto the transducer, achieving ignition and detonation. The transducer is a metal film bridge, which is deposited on the upper surface of the upper substrate by magnetron sputtering or ion beam sputtering. The metal membrane bridge material is Ni, Cr, Pt, NiCr, PtW, or TaN. The time-delay fuse circuit is composed of two material components with positive and negative temperature coefficients of resistivity, and is fabricated on the upper surface of the lower substrate using microelectronic processes. The resistance of the time-delay fuse circuit is much smaller than that of the transducer at all temperatures; The time-delay fuse circuit is connected to the transducer and pads through connecting posts. It adopts a centrally symmetrical design with a fuse zone in the center. The width of the fuse zone is smaller than that of other parts of the time-delay fuse circuit. Adjust the material composition ratio of the time-delay fuse circuit according to the ignition time characteristics of the selected transducer so that its resistance at high temperature is less than that at low temperature. Both the upper and lower substrates are made of AlN or Si3N4 material.

2. A temperature-compensated time delay transduction element assembly according to claim 1, wherein, The fusing time of the time-delay fuse circuit is designed by adjusting the length, width, and thickness of the time-delay fuse circuit, as well as the circuit path and graphic design.

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