Optoelectronic interconnect structure and its fabrication method

By placing the optical interconnect network and the electrical interconnect network on different core layers in the optoelectronic interconnect structure, the problems of substrate warping and limited wiring freedom are solved, and a simple manufacturing process and efficient optoelectronic interconnect are achieved.

CN117784324BActive Publication Date: 2026-06-30HANGZHOU GUANGZHIYUAN TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
HANGZHOU GUANGZHIYUAN TECH CO LTD
Filing Date
2022-09-20
Publication Date
2026-06-30

AI Technical Summary

Technical Problem

Existing optoelectronic interconnect structures suffer from problems such as difficult fabrication processes, high risk of warping, and limited freedom of electrical interconnect wiring due to the asymmetric surface structure of the substrate.

Method used

Optical interconnect networks and electrical interconnect networks are respectively set on different core layers. By connecting a first substrate with an optical interconnect network and a second substrate with an electrical interconnect network, a substrate with both optical and electrical interconnect functions is formed.

Benefits of technology

It avoids the risk of substrate warping, increases the wiring freedom of electrical interconnect networks, and simplifies the manufacturing process.

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Abstract

This invention provides an optoelectronic interconnect structure and its fabrication method. The aim is to obtain a first substrate with an optical interconnect network and a second substrate with an electrical interconnect network by separately placing optical interconnect networks and electrical interconnect networks on different core layers. The first substrate with the optical interconnect network and the second substrate with the electrical interconnect network are then interconnected to obtain a substrate that possesses both optical and electrical interconnect functions. This ensures that the fabrication processes of the optical interconnect network and the electrical interconnect network do not interfere with each other, avoiding the risk of substrate warping and increasing the flexibility of wiring for the electrical interconnect network used for electrical interconnect functions.
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