Light-emitting substrate, backlight module, display device, and method for fabricating the light-emitting substrate

Abstract

This disclosure relates to the field of display technology, and more particularly to a light-emitting substrate, a backlight module, a display device, and a method for fabricating the light-emitting substrate. The light-emitting substrate includes: a substrate, a plurality of light-emitting devices, a plurality of driving chips, and a plurality of supporting structures. The plurality of light-emitting devices are disposed on one side of the substrate, and the plurality of driving chips are disposed on one side of the substrate, each driving chip being electrically connected to at least one light-emitting device; the plurality of supporting structures are disposed on one side of the substrate, wherein each of the plurality of driving chips is covered by one of the plurality of supporting structures.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, and in particular to a light-emitting substrate, a backlight module, a display device, and a method for preparing the light-emitting substrate. Background Technology

[0002] Mini LED (Mini Light-Emitting Diode) display devices are display devices that use sub-millimeter-sized light-emitting diodes as light-emitting devices. Compared with traditional light-emitting diodes, sub-millimeter-sized light-emitting diodes have a size greater than or equal to 80μm and less than 500μm.

[0003] Mini LED displays can achieve higher contrast, more layered images, and more realistic visual effects, making them a promising candidate for the future market. Summary of the Invention

[0004] On one hand, a light-emitting substrate is provided. A light-emitting substrate includes: a substrate and a plurality of light-emitting devices disposed on one side of the substrate, as well as a plurality of driving chips and a plurality of support structures disposed on one side of the substrate, each driving chip being electrically connected to at least one light-emitting device; wherein each of the plurality of driving chips is covered by one of the plurality of support structures.

[0005] In some embodiments, the bottom of the support structure has a receiving groove, and the driving chip is embedded in the receiving groove.

[0006] In some embodiments, the surface of the driver chip near the substrate is flush with the bottom surface of the support structure.

[0007] In some embodiments, the receiving groove is formed at the middle position of the bottom of the support structure.

[0008] In some embodiments, the area of ​​the orthographic projection of the receiving groove on the substrate is larger than the area of ​​the orthographic projection of the driving chip on the substrate, and the orthographic projection of the driving chip on the substrate is within the orthographic projection of the receiving groove on the substrate.

[0009] In some embodiments, the driver chip and the support structure are connected by a transparent adhesive disposed within the receiving groove.

[0010] In some embodiments, the support structure includes a first support structure, the first support structure including a first main structure, the cross-sectional area of ​​the first main structure gradually decreasing along a direction perpendicular to the substrate and away from the substrate; the receiving groove is formed at the bottom of the first main structure.

[0011] In some embodiments, the support structure includes a second support structure, the second support structure including a second main structure and a base, the second main structure being disposed on the side of the base away from the substrate, and the cross-sectional area of ​​the second main structure gradually decreasing along a direction perpendicular to the substrate and away from the substrate; the bottom of the base is provided with the receiving groove.

[0012] In some embodiments, the depth of the receiving groove is less than the thickness of the base.

[0013] In some embodiments, the base is a boss structure, and the orthographic projection of the second main structure on the substrate is located within the orthographic projection of the base on the substrate.

[0014] In some embodiments, the outer surface of the support structure is white.

[0015] In some embodiments, the reflectivity of the outer surface of the support structure is greater than 92%.

[0016] In some embodiments, the orthographic projection of the driver chip on the substrate is a square, and the side length of the square is 3cm to 3.5cm.

[0017] In some embodiments, the driver chip is provided with a plurality of pads, the substrate includes a substrate and a circuit layer disposed on one side of the substrate, the circuit layer includes a plurality of connection pad groups, each connection pad group includes a plurality of connection pads, and the plurality of pads of the driver chip are electrically connected to the plurality of connection pads in the connection pad groups respectively.

[0018] On the other hand, a backlight module includes: a light-emitting substrate as described in any of the embodiments of the above aspects; and a film assembly disposed on the side of the plurality of support structures away from the substrate.

[0019] In some embodiments, the film assembly includes: a diffuser plate, a lower diffuser sheet, a diffuser plate, a prism sheet, and an upper diffuser sheet. The diffuser plate is disposed on the side of the plurality of support structures away from the light-emitting substrate. The lower diffuser sheet is disposed on the side of the diffuser plate away from the light-emitting substrate. The prism sheet is disposed on the side of the lower diffuser sheet away from the light-emitting substrate. The upper diffuser sheet is disposed on the side of the prism sheet away from the light-emitting substrate.

[0020] In some embodiments, an air gap is provided between the diffuser plate and the top of the plurality of support structures, the air gap being in the range of 0.1 mm to 0.2 mm.

[0021] In some embodiments, the backlight module further includes a frame surrounding the film assembly, and the edge of the backlight module is provided with a sidewall extending in the light emission direction, and the frame is disposed around the outer periphery of the sidewall.

[0022] In another aspect, a display device includes: a backlight module as described in any of the embodiments of the other aspect above, wherein a display panel is stacked on the light-emitting side of the backlight module.

[0023] In another aspect, a method for preparing a light-emitting substrate includes: providing a substrate; forming a plurality of light-emitting devices on one side of the substrate; providing a plurality of support structures, and forming a receiving groove at the bottom of each support structure; embedding the driving chip in the receiving groove, so that the driving chip and the support structure form an integral whole; transferring the integral formed by the driving chip and the support structure onto the substrate, wherein the driving chip in the integral whole is soldered onto the substrate. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in this disclosure, the accompanying drawings used in some embodiments of this disclosure will be briefly described below. Obviously, the drawings described below are only drawings of some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams and are not intended to limit the actual size of the product, the actual flow of the method, the actual timing of the signals, etc. involved in the embodiments of this disclosure.

[0025] Figure 1 A structural diagram of a display device provided for some embodiments of this disclosure;

[0026] Figure 2 for Figure 1 Cross-sectional view along the AA direction;

[0027] Figure 3A A structural diagram of a backlight module provided for some embodiments of this disclosure;

[0028] Figure 3B Another structural diagram of a backlight module provided for some embodiments of this disclosure

[0029] Figure 4 Top view of the light-emitting substrate provided for some embodiments of this disclosure;

[0030] Figure 5A A structural diagram of a support structure provided for some embodiments of this disclosure;

[0031] Figure 5B Structural diagrams showing the mounting positions of the driver chip provided in some embodiments of this disclosure;

[0032] Figure 6A A structural diagram of a card slot is provided for some embodiments of this disclosure;

[0033] Figure 6B Another structural diagram of a card slot provided for some embodiments of this disclosure;

[0034] Figure 6C A structural diagram of another card slot provided for some embodiments of this disclosure;

[0035] Figure 7A A structural diagram of a support structure provided for some embodiments of this disclosure;

[0036] Figure 7B A structural diagram of another support structure provided for some embodiments of this disclosure;

[0037] Figure 7C A structural diagram of yet another support structure provided for some embodiments of this disclosure;

[0038] Figure 8A A structural diagram of a support structure provided for some embodiments of this disclosure;

[0039] Figure 8B A structural diagram of another support structure provided for some embodiments of this disclosure;

[0040] Figure 8C A structural diagram of yet another support structure provided for some embodiments of this disclosure;

[0041] Figure 9 A structural diagram of the light-emitting side of a light-emitting substrate provided for some embodiments of this disclosure;

[0042] Figure 10 An internal structural diagram of a light-emitting substrate provided for some embodiments of this disclosure;

[0043] Figure 11 Connection structure diagrams of the light-emitting group and the connecting pad group provided for some embodiments of this disclosure;

[0044] Figure 12 An internal structural diagram of another light-emitting substrate provided for some embodiments of this disclosure;

[0045] Figure 13A A structural diagram of a backlight module provided for some embodiments of this disclosure;

[0046] Figure 13B Another structural diagram of a backlight module provided for some embodiments of this disclosure;

[0047] Figure 14A A structural diagram of yet another backlight module provided for some embodiments of this disclosure;

[0048] Figure 14B A structural diagram of another backlight module provided for some embodiments of this disclosure;

[0049] Figure 15A A structural diagram of a display device provided for some embodiments of this disclosure;

[0050] Figure 15B A structural diagram of another display device provided for some embodiments of this disclosure;

[0051] Figure 16 A structural diagram of a backlight module provided for some embodiments of this disclosure;

[0052] Figure 17 A flowchart illustrating a method for fabricating a light-emitting substrate, provided for some embodiments of this disclosure. Detailed Implementation

[0053] The technical solutions in some embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments provided in this disclosure are within the scope of protection of this disclosure.

[0054] Unless the context otherwise requires, throughout the specification and claims, the term "comprise" and its other forms, such as the third-person singular "comprises" and the present participle "comprising," are interpreted as open-ended and encompassing, meaning "including, but not limited to." In the description of the specification, terms such as "one embodiment," "some embodiments," "exemplary embodiments," "example," "specific example," or "some examples," etc., are intended to indicate that a particular feature, structure, material, or characteristic associated with that embodiment or example is included in at least one embodiment or example of this disclosure. The illustrative representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics mentioned may be included in any suitable manner in any one or more embodiments or examples.

[0055] Hereinafter, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of this disclosure, unless otherwise stated, "a plurality of" means two or more.

[0056] In describing some embodiments, the terms "coupled" and "connected," and their derivative expressions, may be used. For example, the term "connected" may be used in describing some embodiments to indicate that two or more components have direct physical or electrical contact with each other. Similarly, the term "coupled" may be used in describing some embodiments to indicate that two or more components have direct physical or electrical contact. However, the terms "coupled" or "communicatively coupled" may also refer to two or more components that do not have direct contact with each other but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the content of this document.

[0057] "At least one of A, B and C" has the same meaning as "at least one of A, B or C", both including the following combinations of A, B and C: only A, only B, only C, combinations of A and B, combinations of A and C, combinations of B and C, and combinations of A, B and C.

[0058] "A and / or B" includes the following three combinations: A only, B only, and a combination of A and B.

[0059] As used herein, depending on the context, the term “if” may optionally be interpreted as meaning “when”, “in the event of”, “in response to determination”, or “in response to detection”. Similarly, depending on the context, the phrase “if it is determined that…” or “if [the stated condition or event] is detected” may optionally be interpreted as meaning “in the event of determination that…”, “in response to determination that…”, “when [the stated condition or event] is detected”, or “in response to the detection of [the stated condition or event]”.

[0060] The use of “applies to” or “configured to” in this article implies an open and inclusive language that does not preclude applicability to or configuration to devices that perform additional tasks or steps.

[0061] In addition, the use of "based on" implies openness and inclusivity, because processes, steps, calculations or other actions "based on" one or more conditions or values ​​can in practice be based on additional conditions or values ​​beyond those conditions.

[0062] As used herein, “about,” “approximately,” or “approximately” includes the value stated and the average value within an acceptable range of deviation from the given value, wherein the acceptable range of deviation is determined by a person skilled in the art taking into account the measurement under discussion and the error associated with the measurement of the given quantity (i.e., the limitations of the measurement system).

[0063] As used herein, “parallel,” “perpendicular,” and “equal” include the described situation and situations that are similar to the described situation, within an acceptable range of deviation, which is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, “parallel” includes absolute parallelism and approximate parallelism, where an acceptable range of deviation for approximate parallelism may be, for example, within 5°; “perpendicular” includes absolute perpendicularity and approximate perpendicularity, where an acceptable range of deviation for approximate perpendicularity may also be, for example, within 5°; “equal” includes absolute equality and approximate equality, where an acceptable range of deviation for approximate equality may be, for example, a difference between the two equals being less than or equal to 5% of either one.

[0064] It should be understood that when a layer or element is referred to as being on another layer or substrate, it can mean that the layer or element is directly on the other layer or substrate, or that there is an intermediate layer between the layer or element and the other layer or substrate.

[0065] This document describes exemplary embodiments with reference to cross-sectional views and / or plan views, which are idealized exemplary drawings. In the drawings, the thickness of layers and regions is enlarged for clarity. Therefore, variations in shape relative to the drawings are contemplated due to, for example, manufacturing techniques and / or tolerances. Thus, exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but rather include shape deviations due to, for example, manufacturing processes. For example, etched regions shown as rectangular would typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to show the actual shapes of the regions of the device, nor are they intended to limit the scope of the exemplary embodiments.

[0066] In related technologies, to achieve precise control of light-emitting devices, a driver chip is used to control at least one light-emitting device to control the brightness of the light emitted. The light-emitting device and the driver chip controlling its emission are placed on the same substrate. Specifically, if the driver chip is large, for example, with a side length in the centimeter range, the driver chip and the light-emitting device are placed on different sides of the backplate. However, this design increases the overall module thickness, hindering the achievement of a thinner product. If the driver chip is small, for example, with a side length in the millimeter or micrometer range, the driver chip and the light-emitting device can be placed on the same side of the backplate. However, this design also has the following problems: Firstly, for backplates with a large number of light-emitting devices and a high density of arrangement, placing the driver chip and the light-emitting device on the same side requires ensuring that the driver chip does not affect the optical effect of the light-emitting device. This imposes various limitations on the driver chip's size, appearance, and position.

[0067] In applications where multiple light-emitting devices are arranged in an array as backlights, the backlight also needs to work in conjunction with optical films. The optical films include layers for homogenizing light. The distance between the optical film closest to the light-emitting device and the device itself is called the mixing distance T. The larger the mixing distance, the larger the illumination area of ​​a single light-emitting device incident on the optical film, and the more thoroughly the light emitted by adjacent light-emitting devices mixes. To achieve the desired mixing distance between the light-emitting device and the film, support pillars can be placed between the light-emitting device and the film layer, creating a certain gap between them.

[0068] In applications where multiple light-emitting devices are arranged in an array as a backlight, in order to ensure the light output effect, priority should be given to ensuring the arrangement space of the light-emitting devices and the light output effect of the light-emitting devices. Therefore, the number of other devices (such as driver chips and / or support pillars) should be minimized as much as possible.

[0069] Based on this, some embodiments of this disclosure provide a display device 1000, such as... Figure 1 As shown, the display device 1000 can be any device that displays images, whether moving (e.g., video) or fixed (e.g., still images), and whether it contains text or images. Exemplarily, the display device 1000 can be any product or component with display functionality, such as a television, laptop, tablet, mobile phone, personal digital assistant (PDA), navigator, wearable device, augmented reality (AR) device, virtual reality (VR) device, etc.

[0070] In some embodiments, the display device 1000 described above may be a liquid crystal display (LCD), such as... Figure 2 As shown, the display device 1000 may include a backlight module 100 and a display panel 200. The backlight module 100 includes a light-emitting side aa and a backlight side bb. The light-emitting side aa refers to the side of the backlight module 100 that emits light, and the backlight side bb refers to the other side of the backlight module 100 opposite to the light-emitting side aa. The backlight module 100 can be used to provide a light source for the display panel 200, and the display panel 200 is disposed on the light-emitting side aa of the backlight module 100. In some embodiments, the display device 1000 may further include a glass cover plate 300 disposed on the side of the display panel 200 away from the backlight module 100, and the glass cover plate 300 is used to protect the display panel 200.

[0071] In some embodiments, such as Figure 3A and Figure 3B As shown, the backlight module 100 includes a light-emitting substrate 110. The light-emitting substrate 110 includes a substrate 10 and a plurality of light-emitting devices 20, a plurality of driving chips 30 and a plurality of support structures 40 disposed on one side surface of the substrate 10. Each of the plurality of driving chips 30 is electrically connected to at least one light-emitting device 20, and each of the plurality of driving chips 30 is covered by one of the plurality of support structures 40.

[0072] In some embodiments, each of the plurality of support structures 40 is disposed above a driver chip 30, and the plurality of support structures 40 cover the plurality of driver chips 30 in a one-to-one correspondence. In other embodiments, a portion of the plurality of support structures 40 covers the corresponding driver chip 30, while another portion of the support structures 40 can be independently disposed on the surface of one side of the substrate 10 as a support. That is to say, there is no absolute correspondence between the number of support structures 40 and driver chips 30. In this way, the support structures 40 can play a supporting role on the one hand, and protect the driver chips 30 on the other hand, and isolate moisture and prevent the driver chips 30 from being corroded by moisture.

[0073] For example, each of the multiple driver chips 30 is covered by one of the multiple support structures 40, with a one-to-one correspondence between the multiple driver chips 30 and the multiple support structures 40. Each driver chip 30 is disposed at the bottom of a support structure 40, which covers the driver chip 30. The support structure 40 and the driver chip 30 are integrated. The support structure 40 can be equivalent to the encapsulation structure of the driver chip 30, protecting it from moisture. At the same time, the support structure 40 provides support and can replace the support pillars in the display module in the prior art, reducing the number of devices on the light-emitting substrate 110. This improves the impact of too many devices on the optical image, reduces uneven display brightness, and reduces the risk of various marks. Furthermore, the integrated design of the support structure 40 and the driver chip 30 allows the size of the driver chip 30 to be increased beyond the micrometer level, increasing the contact area between the pads and pins, thereby reducing die bonding difficulty and minimizing cold solder joints. In the light-emitting substrate 110 provided in this disclosure, while satisfying the uniform light performance, the driving chip 30 and the light-emitting device 20 are disposed on the same side of the substrate 10, thereby reducing the thickness of the light-emitting substrate 110 and making the backlight module 100 thinner and lighter.

[0074] It is understood that each of the multiple driver chips 30 is electrically connected to one light-emitting device 20, or each of the multiple driver chips 30 is electrically connected to multiple light-emitting devices 20. This disclosure does not limit the number of driver chips 30 and light-emitting devices 20, as long as the light-emitting substrate 110 can emit light normally.

[0075] For example, the light-emitting device 20 can be a miniature light-emitting diode. The driver chip 30 can be configured to control the light-emitting state of at least one light-emitting device 20, for example, to control whether at least one light-emitting device 20 emits light. For example, one driver chip 30 can control the light-emitting state of four light-emitting devices 20. Alternatively, for example, one driver chip 30 can control the light-emitting state of eight light-emitting devices 20. This disclosure does not limit the number of light-emitting devices 20 controlled by one driver chip 30, as long as the light-emitting substrate 110 can emit light normally.

[0076] For example, each light-emitting device 20 is provided with an encapsulation portion 21 around its periphery. The encapsulation portion 21 is semi-circular and can be made of transparent silicone. The encapsulation portion 21 is mainly used to protect the light-emitting device 20. For example, the encapsulation portion 21 can prevent moisture from covering the light-emitting device 20 and can also prevent it from being bumped by other components.

[0077] For example, refer to Figure 4In this design, multiple light-emitting devices 20 and multiple support structures 40 are arrayed on a substrate 10. Each of the multiple driver chips 30 is covered by one of the support structures 40. It is understood that the orthographic projection of one support structure 40 onto the substrate 10 can cover the orthographic projection of one driver chip 30 onto the substrate 10. Therefore, the number of driver chips 30 is consistent with the number of support structures 40. In addition, the support structures 40 can be used to protect the driver chips 30 and isolate them from moisture and other minute electrolytes.

[0078] In some embodiments, such as Figure 5A and Figure 5B As shown, the bottom of the support structure 40 has a receiving groove 41, and the driving chip 30 is embedded in the receiving groove 41.

[0079] For example, the receiving groove 41 is opened upward along a part of the plane where the bottom of the support structure 40 is located. The receiving groove 41 has a certain depth, which makes it easy for the entire driving chip 30 to be embedded inside the receiving groove 41.

[0080] In some embodiments, the surface of the driver chip 30 near the substrate 10 is flush with the bottom surface of the support structure 40.

[0081] Understandably, the surface of the driver chip 30 closest to the substrate 10 has no protrusion or depression relative to the bottom surface of the support structure 40; that is, the surface of the driver chip 30 closest to the substrate 10 is flush with the bottom surface of the support structure 40. In this way, while the driver chip 30 is soldered onto the surface of the substrate 10, the receiving groove 41 at the bottom of the support structure 40 can form a sealed space with the substrate 10, preventing gaps. Thus, the support structure 40 can seal the driver chip 30 inside the sealed space, isolating it from moisture and preventing moisture corrosion.

[0082] In some embodiments, the receiving groove 41 is formed at the middle position of the bottom of the support structure 40.

[0083] For example, the geometric center of the receiving groove 41 is on the same straight line as the bottom center of the support structure 40.

[0084] In some embodiments, the area of ​​the orthographic projection of the receiving groove 41 on the substrate 10 is greater than the area of ​​the orthographic projection of the driving chip 30 on the substrate 10, and the orthographic projection of the driving chip 30 on the substrate 10 is within the orthographic projection of the receiving groove 41 on the substrate 10.

[0085] It should be noted that the area of ​​the orthographic projection of the receiving groove 41 on the substrate 10 is the sum of the orthographic projection of the driving chip 30 on the substrate 10 and the area of ​​the connection between the two. Therefore, the area of ​​the orthographic projection of the receiving groove 41 on the substrate 10 is greater than the area of ​​the orthographic projection of the driving chip 30 on the substrate 10. The orthographic projection of the driving chip 30 on the substrate 10 is within the orthographic projection of the receiving groove 41 on the substrate 10.

[0086] In some embodiments, the driver chip 30 and the support structure 40 are connected by transparent adhesive.

[0087] For example, such as Figures 6A to 6C As shown, the bottom of the support structure 40 is provided with a slot 42. The lower surface of the slot 42 is flush with the lower surface of the support structure 40. That is, the bottom of the support structure 40 and the slot 42 are recessed inward at the joint. The center of the slot 42 coincides with the center of the receiving groove 41. The middle part of the slot 42 has an opening 421 that corresponds to the position of the receiving groove 41 and is the same size. The outer contour of the slot 42 is projected onto the bottom of the support structure 40 as a polygon, such as a square, rhombus or triangle. This shape is not limited here.

[0088] The bottom of the support structure 40 is also provided with at least one marking point, such as two, four, or six marking points. Positioning points are provided on the contact surface between the slot 42 and the bottom of the support structure 40, with the positioning points corresponding to the marking points. Therefore, the slot 42 can limit the deviation that occurs during the assembly of the driver chip 30 and the support structure 40. Furthermore, the four sides of the opening 421 correspond to the four sides of the driver chip 30, and at least one side of the opening 421 is larger than the size of the corresponding side of the driver chip 30. When placing the driver chip 30, a certain space is left between the rectangular opening 421 and the driver chip 30. Transparent adhesive is injected into this space, and the surfaces of the driver chip 30, except for the surface facing away from the bottom of the support structure 40, are embedded and cured in the slot 42 or the receiving groove 41 using transparent adhesive. This transparent adhesive serves both as an adhesive and as a barrier against water and oxygen, thus protecting the driver chip 30.

[0089] For example, Figure 6A The outer contour of the slot 42 shown is a square, with a rectangular opening 421 in the middle. The size of one side of the rectangular opening 421 is larger than the size of the corresponding side of the driver chip 30. When the driver chip 30 is placed, a certain space is left between the rectangular opening 421 and the driver chip 30. Transparent glue is injected into this space to embed and fix the driver chip 30. The orthographic projection of the rectangular opening 421 on the light-emitting substrate 110 is larger than the orthographic projection of the driver chip 30 on the light-emitting substrate 110.

[0090] For example, Figure 6BThe outer contour of the slot 42 shown is a rhombus, with a rectangular opening 421 in the middle. The size of one side of the rectangular opening 421 is larger than the size of the corresponding side of the driver chip 30. When the driver chip 30 is placed, a certain space is left between the rectangular opening 421 and the driver chip 30. Transparent glue is injected into this space to embed and fix the driver chip 30. The orthographic projection of the rectangular opening 421 on the light-emitting substrate 110 is larger than the orthographic projection of the driver chip 30 on the light-emitting substrate 110.

[0091] For example, Figure 6C The outer contour of the slot 42 shown is a triangle, with a rectangular opening 421 in the middle. The size of one side of the rectangular opening 421 is larger than the size of the corresponding side of the driver chip 30. When the driver chip 30 is placed, a certain space is left between the rectangular opening 421 and the driver chip 30. Transparent glue is injected into this space to embed and fix the driver chip 30. The orthographic projection of the rectangular opening 421 on the light-emitting substrate 110 is larger than the orthographic projection of the driver chip 30 on the light-emitting substrate 110.

[0092] In some embodiments, such as Figures 7A to 7C As shown, the support structure 40 includes a first support structure 401, which includes a first main structure 4011. The cross-sectional area of ​​the first main structure 4011 gradually decreases along the direction perpendicular to the substrate 10 and away from the substrate 10. A receiving groove 41 is provided at the bottom of the first main structure 4011.

[0093] Understandably, the distance between the two ends of the first main structure 4011 gradually decreases along the direction perpendicular to the substrate 10 and away from the substrate 10 along the support structure 40. A receiving groove 41 is formed at the bottom of the first main structure 4011 for the driver chip 30 to be embedded therein.

[0094] For example, refer to Figure 7A , Figure 7A The diagram shows a first support structure 401, which includes a first main structure 4011 in the shape of a cone. That is, along the direction perpendicular to the substrate 10 and away from the substrate 10, the cross-sectional area of ​​the first main structure 4011 in the plane parallel to the substrate 10 gradually decreases until it is reduced to 0. The first main structure 4011 is equivalent to removing part of the volume of the column on the basis of the column, so as to avoid the light emitted by the light-emitting device 20 from being affected by the first support structure 401 and thus changing the light path. Figure 7A The bottom of the first main structure 4011 is provided with a receiving groove 41 for the driver chip 30 to be embedded inside it.

[0095] For example, refer to Figure 7B , Figure 7B Another first support structure 401 is shown, which includes a first main structure 4011 that is a large cone with a small cone cut off at the top. That is, along the direction perpendicular to the substrate 10 and away from the substrate 10, the cross-sectional area of ​​the first main structure 4011 gradually decreases to a fixed value, which is greater than 0. The first main structure 4011 is equivalent to removing part of the volume of the cone to obtain a smaller volume first support structure 401, thereby minimizing the impact of the first support structure 401 on the light emitted by the light-emitting device 20 and causing changes in the light path. Figure 7B The bottom of the first main structure 4011 is provided with a receiving groove 41 for the driver chip 30 to be embedded inside it.

[0096] For example, refer to Figure 7C , Figure 7C Another first support structure 401 is shown, which includes a lower part that is cylindrical and an upper part that is semi-ellipsoidal. The first main structure 4011 formed by this structure gradually reduces its cross-sectional area along the direction perpendicular to the substrate 10 and away from the substrate 10, eventually reducing it to 0. The first main structure 4011 is equivalent to removing part of the volume of the cone to obtain a smaller volume first support structure 401, thereby minimizing the impact of the first support structure 401 on the light emitted by the light-emitting device and causing changes in the light path. Figure 7C The bottom of the first main structure 4011 is provided with a receiving groove 41 for the driver chip 30 to be embedded inside it.

[0097] The structure and shape of the first support structure 401 in the above embodiments can be selected and designed according to the different requirements of the light-emitting substrate 110 for light mixing, combined with the light emission pattern of the light-emitting device 20 and the arrangement of multiple light-emitting devices 20.

[0098] In some embodiments, such as Figures 8A to 8C As shown, the support structure 40 includes a second support structure 402, which includes a second main structure 4021 and a base 4022. The second main structure 4021 is disposed on the side of the base 4022 away from the substrate 10. Along the direction perpendicular to the substrate 10 and along the support structure 40 away from the substrate 10, the cross-sectional area of ​​the second main structure 4021 gradually decreases. A receiving groove 41 is provided at the bottom of the base 4022.

[0099] Understandably, along the direction perpendicular to the substrate 10 and away from the support structure 40 from the substrate 10, the distance between the two ends of the second main structure 4021 gradually decreases. A receiving groove 41 is formed at the bottom of the base 4022 for the driver chip 30 to be embedded therein.

[0100] For example, refer to Figure 8A , Figure 8A The diagram shows a second support structure 402, which includes a second main structure 4021 that is conical in shape. That is, along the direction perpendicular to the substrate 10 and away from the substrate 10, the cross-sectional area of ​​the second main structure 4021 gradually decreases until it is reduced to 0. The second main structure 4021 is equivalent to removing part of the volume of the cone to obtain a smaller volume second support structure 402, thereby minimizing the impact of the first support structure 401 on the light emitted by the light-emitting device 20 and thus avoiding changes in the light path. Figure 8A The bottom of the base 4022 has a receiving groove 41 for the driver chip 30 to be embedded inside it.

[0101] For example, refer to Figure 8B , Figure 8B Another second support structure 402 is shown, which includes a second main structure 4021 formed by removing a small cone from the top of a large cone. That is, along the direction perpendicular to the substrate 10 and away from the support structure 40 from the substrate 10, the cross-sectional area of ​​the second main structure 4021 gradually decreases to a fixed value, which is greater than 0. The second main structure 4021 is equivalent to removing part of the cone's volume from the cone to obtain a smaller volume second support structure 402, thereby minimizing the impact of the first support structure 401 on the light emitted by the light-emitting device 20 and thus avoiding changes in the optical path. Figure 8B The bottom of the base 4022 has a receiving groove 41 for the driver chip 30 to be embedded inside it.

[0102] For example, refer to Figure 8C , Figure 8C The diagram shows another type of second support structure 402, which includes a lower cylindrical part and an upper semi-ellipsoidal part. The resulting second main body structure 4021, i.e., along the direction perpendicular to the substrate 10 and away from the support structure 40 from the substrate 10, has a gradually decreasing cross-sectional area, eventually reducing to 0. The second main body structure 4021 is equivalent to removing part of the volume of the cone to obtain a smaller volume second support structure 402, thereby minimizing the influence of the first support structure 401 on the light emitted by the light-emitting device 20 and thus avoiding changes in the optical path. Figure 8C The bottom of the base 4022 has a receiving groove 41 for the driver chip 30 to be embedded inside it.

[0103] The structure and shape of the second support structure 402 in the above embodiments can be selected and designed according to the different requirements of the light-emitting substrate 110 for light mixing, combined with the light emission pattern of the light-emitting device 20 and the arrangement of multiple light-emitting devices 20.

[0104] By adopting the above configuration, while keeping the area of ​​the bottom surface (the side close to the substrate 10) of the support structure 40 unchanged, the volume of the support structure 40 can be reduced, thereby reducing the blocking effect of the support structure 40 on light and increasing the light emission amount of the light-emitting substrate 110 in the direction perpendicular to the substrate 10 and away from the substrate 10 along the support structure 40, thereby improving the light emission efficiency of the light-emitting substrate 110.

[0105] In some embodiments, the depth of the receiving groove 41 is less than the thickness of the base 4022.

[0106] For example, the depth of the receiving groove 41 is h, and the thickness of the base 4022 is t, that is, h is less than t.

[0107] In some embodiments, the base 4022 is a boss structure, and the orthographic projection of the second main structure 4021 on the substrate 10 is located within the orthographic projection of the base 4022 on the substrate 10.

[0108] For example, refer to Figures 8A to 8C The base 4022 is a frustum structure. The maximum outer dimension of the bottom of the second main structure 4021 is g, and the maximum outer dimension of the base 4022 is G. The orthographic projection of the second main structure 4021 on the substrate 10 is located within the orthographic projection of the base 4022 on the substrate 10, that is, g < G.

[0109] In some embodiments, the outer surface of the support structure 40 is white.

[0110] In some embodiments, the reflectivity of the outer surface of the support structure 40 is greater than 92%.

[0111] By setting the outer surface color of the support structure 40 to white and the reflectivity to be greater than 92%, light absorption can be reduced and reflection increased, thereby ensuring or even increasing the light output efficiency of the light-emitting device 20, and ensuring or even reducing the overall power consumption of the product.

[0112] In some embodiments, such as Figure 12 As shown, the orthographic projection of the driver chip 30 onto the substrate 10 is a square, with a side length L of 3cm to 3.5cm.

[0113] It should be noted that since the driver chip 30 is located at the bottom of the support structure 40, it can accommodate driver chips 30 with a size in the centimeter range. Compared with the existing technology, this can greatly reduce the difficulty of die bonding and improve the welding yield. On the other hand, the area of ​​the integrated circuit inside the driver chip 30 is increased, and the functions of the driver chip 30 can be enriched.

[0114] In some embodiments, refer to Figure 9 , Figure 10 and Figure 12As shown, the driver chip 30 has multiple pins 301. The substrate 10 includes a substrate 101 and a circuit layer 102 disposed on one side of the substrate. The circuit layer 102 includes multiple connection pad groups 1021. Each connection pad group 1021 includes multiple connection pads 10211. The multiple pins 301 of the driver chip 30 are electrically connected to the multiple connection pads 10211 in the connection pad group 1021 respectively.

[0115] In some examples, such as Figure 9 and Figure 10 As shown, the light-emitting substrate 110 includes multiple light-emitting regions 111 arranged in an array. Each light-emitting region 111 has at least one set of connecting pads 1021 and at least one light-emitting group 112. Each light-emitting group 112 is uniformly arranged around the support structure 40. The distance between each light-emitting device 20 in each light-emitting group 112 and the support structure 40 is approximately equal to avoid the support structure 40 being too close to any light-emitting device 20, which would block the light emission of that light-emitting device 20 and thus prevent uneven light emission from the light-emitting substrate 110. Each light-emitting group 112 is electrically connected to a set of connecting pads 1021. The light-emitting substrate 110 also includes multiple signal lines located in the circuit layer 102 and passing through the light-emitting regions 111. The light-emitting groups 112 and the connecting pads 1021 in the light-emitting regions 111 are electrically connected to the corresponding signal lines.

[0116] In some embodiments, such as Figure 10 As shown, the light-emitting group 112 includes a plurality of light-emitting devices 20. For example, the light-emitting devices 20 can be sub-millimeter light-emitting diodes and / or micro light-emitting diodes. Each light-emitting group 112 may include 4, 6, 8, or 9 light-emitting devices 20. The plurality of light-emitting devices 20 can be connected in series and / or in parallel.

[0117] For example, such as Figure 11 As shown, where, Figure 11 for Figure 10 The enlarged view of a partial location shows that the light-emitting group 112 includes four light-emitting devices 20 connected in series. The positive terminal of the first light-emitting device 20 is the first end of the light-emitting group 112, and the negative terminal of the last light-emitting device 20 is the second end of the light-emitting group 112.

[0118] In some embodiments, such as Figure 10 , Figure 11 and Figure 12As shown, the multiple signal lines include a first power supply voltage signal line VLED, a second power supply voltage signal line PWR, and a third power supply voltage signal line GND. The connection pad group 1021 has four connection pads 10211, which are respectively connected to the four pins 301 of a driver chip 30: signal input pin Di, signal output pin Out, first power supply pin Pwr, and second power supply pin Gnd. Each pin of the driver chip 30 has a quadrilateral shape, and the side length of the quadrilateral can not exceed 90μm.

[0119] Among them, such as Figure 10 , Figure 11 and Figure 12 As shown, the first terminal of the light-emitting group 112 is electrically connected to the first power supply voltage signal line VLED. The first power supply voltage signal line VLED is configured to transmit a third-level signal to the light-emitting group 112, for example, the third-level signal can be a high-level signal. The first power supply pin Pwr of the driver chip 30 is electrically connected to the second power supply voltage signal line PWR through a connection pad of the connection pad group 1021. The second power supply voltage signal line PWR is configured to transmit a second-level signal, for example, the second-level signal can be a high-level signal. The second power supply pin Gnd of the driver chip 30 is electrically connected to the third power supply voltage signal line GND through a connection pad of the connection pad group 1021. The third power supply voltage signal line GND is configured to transmit a first-level signal to the driver chip 30, for example, the first-level signal can be a low-level signal. The second terminal of each light-emitting group 112 is electrically connected to the corresponding output pin Out of the driver chip 30.

[0120] In this disclosure, a "high-level signal" refers to the potential magnitude of an electrical signal received or output by a node, terminal, or output terminal in a circuit. For example, a high-level signal can be 3.3V or 5V. A "low-level signal" refers to the potential magnitude of an electrical signal received or output by a node, terminal, or output terminal in a circuit. For example, a low-level signal can refer to a ground signal; specifically, a low-level signal can be 0V.

[0121] In some examples, multiple light-emitting devices 20 are arranged in an array. Exemplarily, the light-emitting device 20 is a light-emitting diode (LED), meaning the size of the LED is greater than or equal to 500 μm, and the distance between the LEDs is greater than 2 mm. In other words, the LEDs serve as point light sources for the backlight module 100.

[0122] like Figure 3A and Figure 3BAs shown, when the light-emitting device 20 is a light-emitting diode, a backlight module 100 further includes: a film material group 50 disposed on the side of the plurality of support structures 40 away from the substrate, wherein the film material group 50 includes, from bottom to top: a diffuser plate 51, a lower diffuser sheet 52, a prism sheet 53 and an upper diffuser sheet 54. The diffuser plate 51 is disposed on the light-emitting side of the light-emitting substrate 110, that is, the diffuser plate 51 is disposed on the side of the plurality of support structures 40 away from the light-emitting substrate 110. The diffuser plate 51 can be used to provide mechanical support for the lower diffuser sheet 52, the prism sheet 53 and the upper diffuser sheet 54, and at the same time diffuse the point light source of the light-emitting device 20 into a surface light source. The lower diffuser 52 is located on the side of the diffuser plate 51 away from the light-emitting substrate 110. The lower diffuser 54 diffuses the light from the surface light source after it passes through the diffuser layer arranged on it, so that the light is evenly distributed and the brightness of the light-emitting side of the backlight module 100 is uniform. The prism sheet 53 is disposed on the side of the lower diffuser 52 away from the light-emitting substrate 110, which further improves the brightness of the backlight module 100 in the display range of the light-emitting side aa. The upper diffuser 54 is located on the side of the prism sheet 53 away from the light-emitting substrate 110. The upper diffuser 54 is used to protect the display panel 200 from being dirty or scratched by external objects such as the backlight module 100.

[0123] In other examples, the light-emitting device 20 is a mini light-emitting diode (Mini LED) and / or a micro light-emitting diode (Micro LED). The Mini LED has a size greater than or equal to 80 μm and less than 500 μm. The Micro LED has a size less than 50 μm.

[0124] like Figure 13A , Figure 13B , Figure 14A and Figure 14BAs shown, when the light-emitting device 20 is a sub-millimeter light-emitting diode and / or a micro light-emitting diode, another backlight module 100 further includes: a support structure 40, a quantum dot film 60, and an optical film layer 70. The support structure 40 supports each film to achieve a certain light mixing distance and eliminate lamp shadows. The light-emitting substrate 110 can emit blue light, and the quantum dot film 60 can include red quantum dot material, green quantum dot material, and a transparent material. When the blue light emitted by the light-emitting substrate 110 passes through the red quantum dot material, it is converted into red light; when it passes through the green quantum dot material, it is converted into green light; when it passes through the transparent material, no color conversion occurs. Then, the blue, red, and green light are mixed and superimposed in a certain proportion to present white light. The optical film layer 70 can include optical films such as a diffuser plate 51 or a prism sheet 53. The diffuser plate 51 has scattering and diffusion effects, which can further mix the white light; the prism sheet 53 can improve the light extraction efficiency of the backlight module 100. The embodiments of this disclosure do not specifically limit the structure of the optical film layer 70.

[0125] On the other hand, some embodiments of this disclosure also provide a backlight module 100, such as Figure 15A and Figure 15B As shown, the backlight module 100 includes: a light-emitting substrate 110 as provided in any of the embodiments described above.

[0126] In some embodiments, the backlight module 100, in addition to the light-emitting substrate 110 described above, further includes: a plurality of support structures 40, a reflective film 57, a diffuser plate 51, a quantum dot film 60, a diffuser sheet, and a composite film. The plurality of support structures 40 are fixed to the light-emitting side aa of the light-emitting substrate 110. The reflective film 57 is disposed on the light-emitting side of the light-emitting substrate 110, and the diffuser plate 51 is disposed at one end of the plurality of support structures 40 away from the light-emitting substrate 110. The quantum dot film 60 is disposed on the side of the diffuser plate 51 away from the light-emitting substrate 110. The diffuser sheet is disposed on the side of the quantum dot film away from the light-emitting substrate 110. The composite film is disposed on the side of the diffuser sheet away from the light-emitting substrate 110.

[0127] For example, multiple support structures 40 are uniformly arranged on the light-emitting substrate 110 to support various optical films, creating a distance between the reflective film 57 of the light-emitting substrate 110 and the optical films. This distance is called the optical distance (OD), meaning that the light emitted by two adjacent light-emitting devices 20 can be mixed between the reflective film 57 and the optical film (e.g., a diffuser), which can improve the shadow produced by the light-emitting substrate 110 and enhance the display quality of the display device 1000. The optical films may include: a diffuser plate 51, a quantum dot film 60, a diffuser sheet, and a composite film. The functions of each optical film layer 70 have been described in the above embodiments and will not be repeated here.

[0128] In some embodiments, such as Figure 15A and Figure 15B As shown, in actual use, the display side of the display device 1000 is perpendicular to the bottom surface, and the diffuser plate 51 does not contact the tops of the multiple support structures 40, i.e., there is a gap X, which ranges from 0.1mm to 0.2mm. The existence of gap X can prevent friction between the diffuser plate 51 and the tops of the support structures 40, which could damage the surface of the diffuser plate 51 and affect the optical image.

[0129] In some embodiments, refer to Figure 16 The backlight module 100 also includes a frame 120 that surrounds the film assembly 50. The edge of the backlight module 100 is provided with a sidewall extending along the light emission direction, and the frame 120 is provided around the outer periphery of the sidewall. Supports are provided around the frame 120.

[0130] Furthermore, some embodiments of this disclosure also provide a display device 1000, such as... Figure 15A and Figure 15B As shown, the display device 1000 includes a backlight module 100 as described in any of the other aspects of the above embodiments and a display panel 200, wherein the display panel 200 is stacked on the light-emitting side aa of the backlight module 100.

[0131] For example, the display device 1000 includes the backlight module 100 provided in the above embodiments, and has the same effect and function as the backlight module 100. The display device 1000 can be a mobile phone, wireless device, personal data assistant (PDA), handheld or portable computer, GPS receiver / navigator, camera, MP4 video player, camcorder, game console, watch, clock, calculator, TV monitor, flat panel display, computer monitor, car display (e.g., odometer display, etc.), navigator, cockpit controller and / or display, camera view display (e.g., display of a rearview camera in a vehicle), electronic photograph, electronic billboard or sign, projector, packaging and aesthetic structure (e.g., display of an image of a piece of jewelry), etc.

[0132] like Figure 17 As shown, some embodiments of this disclosure provide a method for fabricating a light-emitting substrate 110. The fabrication method includes:

[0133] S1: Provide substrate.

[0134] It should be noted that the substrate 10 includes a substrate 101 and a circuit layer 102 disposed on one side of the substrate. The circuit layer 102 includes multiple connection pad groups 1021, and each connection pad group 1021 includes multiple connection pads 10211. The pins 301 of the light-emitting device 20 and the driving chip 30 are electrically connected to the multiple connection pads 10211 in different connection pad groups 1021, respectively. It can be understood that the number of connection pads included in the connection pad group corresponds to the number of pins of the electronic components electrically connected to the connection pad group.

[0135] S2: Multiple light-emitting devices 20 are formed on one side of the substrate 10.

[0136] For example, an array of multiple light-emitting devices 20 are distributed on the substrate 10.

[0137] S3: Provide multiple support structures 40, with a receiving groove 41 formed at the bottom of each support structure 40.

[0138] For example, the receiving groove 41 is a rectangular groove with a depth consistent with the thickness of the driving chip 30, and the orthographic projection of the receiving groove 41 on the substrate 10 is slightly larger than the orthographic projection of the driving chip 30 on the substrate 10.

[0139] It should be noted that the orthographic projections of the multiple light-emitting devices 20 and the multiple support structures 40 on the substrate 10 do not overlap. Therefore, the order of S2 and S3 is not limited here when preparing the light-emitting substrate 110.

[0140] S4: The driver chip 30 is embedded in the receiving groove 41, so that the driver chip 30 and the support structure 40 form a whole.

[0141] Understandably, after the card slot 42 and the support structure 40 are precisely positioned, the driver chip 30 is fixedly embedded in the receiving groove 41 by setting transparent adhesive in the core fixing channel 422 of the card slot 42, thereby fixing the driver chip 30 and making the driver chip 30 and the support structure 40 form a whole. In addition to supporting the optical film, the support structure 40 can also cover the driver chip 30, protecting the driver chip 30 while improving the display quality of the display device 1000.

[0142] S5: Transfer the entire assembly of the driver chip 30 and the support structure 40 onto the substrate 10, wherein the driver chip 30 is soldered onto the substrate 10.

[0143] For example, after transferring the entire assembly of the driver chip 30 and the support structure 40 onto the substrate 10 and aligning them precisely, multiple pins 301 of the driver chip 30 are soldered onto the substrate 10, that is, the entire assembly of the driver chip 30 and the support structure 40 is fixed onto the substrate.

[0144] The above are merely specific embodiments of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. A light-emitting substrate, characterized by, include: substrate; Multiple light-emitting devices disposed on one side of the substrate; Multiple driving chips are disposed on one side of the substrate; each driving chip is electrically connected to at least one light-emitting device; Multiple support structures are disposed on one side of the substrate; wherein each of the multiple driver chips is covered by one of the multiple support structures, and the support structure and the driver chip are integrally disposed; The bottom of the support structure has a receiving groove, and the driving chip is embedded in the receiving groove; the surface of the driving chip near the substrate is flush with the surface of the bottom of the support structure.

2. The light-emitting substrate according to claim 1, characterized in that, The receiving groove is located at the middle of the bottom of the support structure.

3. The light-emitting substrate according to claim 2, characterized in that, The area of ​​the orthographic projection of the receiving groove on the substrate is larger than the area of ​​the orthographic projection of the driving chip on the substrate, and the orthographic projection of the driving chip on the substrate is within the orthographic projection of the receiving groove on the substrate.

4. The light-emitting substrate according to claim 1, characterized in that, The driver chip and the support structure are connected by transparent adhesive disposed in the receiving groove.

5. The light-emitting substrate according to claim 1, characterized in that, The support structure includes a first support structure, which includes a first main structure. The cross-sectional area of ​​the first main structure gradually decreases along a direction perpendicular to the substrate and away from the substrate. The receiving groove is provided at the bottom of the first main structure.

6. The light-emitting substrate according to claim 1, characterized in that, The support structure includes a second support structure, which includes a second main structure and a base. The second main structure is disposed on the side of the base away from the substrate. Along a direction perpendicular to the substrate and away from the substrate, the cross-sectional area of ​​the second main structure gradually decreases. The bottom of the base is provided with the receiving groove.

7. The light-emitting substrate according to claim 6, characterized in that, The depth of the receiving groove is less than the thickness of the base.

8. The light-emitting substrate according to claim 7, characterized in that, The base is a boss structure, and the orthographic projection of the second main structure on the substrate is located within the orthographic projection of the base on the substrate.

9. The light-emitting substrate according to claim 1, characterized in that, The outer surface of the support structure is white.

10. The light-emitting substrate according to claim 9, characterized in that, The reflectivity of the outer surface of the support structure is greater than 92%.

11. The light-emitting substrate according to claim 1, characterized in that, The orthographic projection of the driver chip onto the substrate is a square, and the side length of the square is 3cm to 3.5cm.

12. The light-emitting substrate according to claim 11, characterized in that, The driver chip has multiple pads, and the substrate includes a substrate and a circuit layer disposed on one side of the substrate. The circuit layer includes multiple connection pad groups, and each connection pad group includes multiple connection pads. The multiple pads of the driver chip are electrically connected to the multiple connection pads in the connection pad groups respectively.

13. A backlight module, characterized in that, include: The light-emitting substrate as described in any one of claims 1 to 12; A membrane assembly disposed on the side of the plurality of support structures away from the substrate.

14. The backlight module according to claim 13, characterized in that, The membrane material assembly includes: A diffuser plate is disposed on the side of the plurality of support structures away from the light-emitting substrate; A lower diffuser sheet is disposed on the side of the diffuser plate away from the light-emitting substrate; A prism sheet is disposed on the side of the lower diffuser sheet away from the light-emitting substrate; An upper diffuser sheet is disposed on the side of the prism sheet away from the light-emitting substrate.

15. The backlight module according to claim 14, characterized in that, An air gap is provided between the diffuser plate and the top of the plurality of support structures, and the air gap ranges from 0.1mm to 0.2mm.

16. The backlight module according to claim 15, characterized in that, The backlight module also includes a frame that surrounds the film assembly. The edge of the backlight module is provided with a sidewall that extends along the light emission direction, and the frame is provided around the outer periphery of the sidewall.

17. A display device, characterized in that, include: The backlight module as described in any one of claims 13 to 16; The display panel is stacked on the light-emitting side of the backlight module.

18. A method for preparing a light-emitting substrate, characterized in that, include: Provide substrate; Multiple light-emitting devices are formed on one side of the substrate; Multiple support structures are provided, with a receiving groove formed at the bottom of each support structure; The driver chip is embedded in the receiving slot, so that the driver chip and the support structure form a whole; The driver chip and the support structure are transferred to the substrate, and the driver chip in the whole is soldered onto the substrate. The surface of the driving chip near the substrate is flush with the bottom surface of the support structure.

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