A heat dissipation device

Abstract

The application relates to the heat dissipation technical field of communication equipment and discloses a heat dissipation device for meeting the heat dissipation demand of communication equipment. The heat dissipation device comprises a heat dissipation substrate, a gas transmission pipeline and a condensing assembly. The heat dissipation substrate internally stores liquid refrigerant, and the heat dissipation substrate comprises an evaporation end and a condensing end. The evaporation end is used for being attached to the surface of a heating element. The two ends of the gas transmission pipeline are respectively communicated with the evaporation end and the condensing assembly. The gas transmission pipeline is used for transmitting the refrigerant, which is changed into a gaseous state by absorbing heat at the evaporation end, to the condensing assembly. The condensing assembly is communicated with the condensing end. The condensing assembly is used for condensing the gaseous refrigerant into liquid refrigerant and transmitting the liquid refrigerant to the condensing end. The heat dissipation substrate internally is provided with a first capillary structure. The liquid refrigerant returns to the evaporation end under the action of the first capillary structure.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation technology for communication equipment, and more particularly to a heat dissipation device. Background Technology

[0002] In the field of communications, communication equipment is used for data transmission. With the increasing demand for data transmission, the heat flux density of internal chips is getting higher and higher, which poses a severe challenge to the heat dissipation capacity of the equipment. If the heat generated by the chip cannot be dissipated in time, it will easily cause the chip to operate at a high temperature, thereby reducing the working efficiency of the equipment or even causing it to crash, making the equipment unable to work properly. Summary of the Invention

[0003] This invention provides a heat dissipation device to meet the heat dissipation requirements of communication equipment.

[0004] This invention provides a heat dissipation device, which includes a heat dissipation substrate, a gas transmission pipeline, and a condensation assembly. The heat dissipation substrate stores liquid refrigerant and includes an evaporation end and a condensation end. The evaporation end is attached to the surface of a heating element. The two ends of the gas transmission pipeline are respectively connected to the evaporation end and the condensation assembly. The gas transmission pipeline is used to transmit the refrigerant, which absorbs heat and becomes gaseous at the evaporation end, to the condensation assembly. The condensation assembly is connected to the condensation end and is used to condense the gaseous refrigerant into liquid refrigerant and transmit it to the condensation end. A first capillary structure is provided inside the heat dissipation substrate, and the liquid refrigerant returns from the condensation end to the evaporation end under the action of the first capillary structure.

[0005] In the above embodiments, the heat dissipation device includes a heat dissipation substrate, a gas transmission pipeline, and a condensation assembly. In use, the evaporation end of the heat dissipation substrate is attached to the surface of the heating element. After absorbing the heat generated by the heating element at the evaporation end, the liquid refrigerant vaporizes and becomes gaseous refrigerant. The gaseous refrigerant is transported by the gas transmission pipeline to the condensation assembly located outside the heat dissipation substrate. The gaseous refrigerant releases heat in the condensation assembly and becomes liquid refrigerant again. After entering the condensation end of the heat dissipation substrate, the liquid refrigerant returns to the evaporation end under the action of capillary force, completing one cycle. The refrigerant can circulate repeatedly in the above manner, thereby continuously dissipating the heat generated by the heating element to the external environment, reducing the temperature of the heating element, and ensuring the normal operation of the heating element.

[0006] In some embodiments, the gas transmission conduit includes a spiral tube that extends in a spiral manner away from the heat dissipation substrate.

[0007] In the above embodiments, the spiral tube extends the flow path of the gaseous refrigerant and increases the heat exchange time between the gaseous refrigerant and the air, so that the gaseous refrigerant can exchange heat with the air in advance before entering the condensing component and dissipate some heat, so as to ensure that the gaseous refrigerant can be completely liquefied when it exchanges heat with the air again in the condensing component.

[0008] In some embodiments, the spiral tube gradually approaches its own central axis in a direction away from the heat dissipation substrate.

[0009] In some embodiments, one or more drainage pipes are provided between the first and last ends of the spiral tube, one end of the drainage pipe is connected to the spiral tube and the other end is connected to the condensing assembly, and the drainage pipe is used to guide the refrigerant that has liquefied in the spiral tube to the condensing assembly.

[0010] In the above embodiments, the gaseous refrigerant may liquefy during its flow along the spiral tube. The liquefied refrigerant can flow into the condensation assembly under the guidance of the drainage pipe, thus avoiding gas-liquid blockage of the gaseous and liquid refrigerant in the spiral tube.

[0011] In some embodiments, the gas transmission pipeline includes a flexible tube located at the end of the gas transmission pipeline, and the end of the flexible tube is provided with a quick-connect fitting, which is inserted into the connection end of the condensation assembly to enable communication between the flexible tube and the condensation assembly.

[0012] In the above embodiments, the flexible tube is flexible and can be bent during installation to facilitate the insertion of the quick-connect fitting into the connection end of the condenser assembly, thereby enabling the gas transmission pipeline and the condenser assembly to be connected, which is convenient for installation.

[0013] In some embodiments, the flexible tube includes a first end disposed away from the condenser assembly and a second end disposed close to the condenser assembly, the flexible tube being inclined from the first end to the second end.

[0014] In the above embodiments, the flexible tube is inclined and guides the flowing gaseous refrigerant, thereby quickly guiding the gaseous refrigerant into the condensation assembly.

[0015] In some embodiments, the condensation assembly includes a condenser tube, the inner wall surface of which is provided with a second capillary structure, and the condenser tube is perpendicularly connected to the heat dissipation substrate.

[0016] In the above embodiments, the gaseous refrigerant is liquefied in the condenser tube and becomes liquid refrigerant. Under the influence of gravity and capillary force, the liquid refrigerant can quickly flow into the condenser end of the heat dissipation substrate.

[0017] In some embodiments, a partition is provided inside the heat dissipation substrate, which divides the cavity inside the heat dissipation substrate into an evaporation cavity and a condensation cavity. Multiple flow channels are provided inside the partition, which are arranged side by side. The flow channels are respectively connected to the evaporation cavity and the condensation cavity, and the cross-sectional area of ​​the flow channels gradually decreases along the direction from the condensation cavity to the evaporation cavity.

[0018] In the above embodiment, the partition is located between the evaporation chamber and the condensation chamber, and a flow guiding channel is provided inside the partition to connect the evaporation chamber and the condensation chamber. The flow guiding channel gradually narrows along the direction from the condensation chamber to the evaporation chamber. This helps to prevent the gaseous refrigerant in the evaporation chamber from flowing in the opposite direction and prevents the internal gas-liquid mixture from blocking the channel.

[0019] In some embodiments, the mesh count of the first capillary structure located in the evaporation chamber is greater than the mesh count of the first capillary structure located in the condensation chamber.

[0020] In the above embodiments, the capillary force on the liquid refrigerant during its flow is greater than that on the liquid refrigerant during its flow from the evaporation chamber, which helps to accelerate the flow of the liquid refrigerant from the condensation chamber to the evaporation chamber.

[0021] In some embodiments, the heat dissipation substrate is provided with a refrigerant injection port, the refrigerant injection port is located near the evaporation end, and the refrigerant injection port is provided with a connector for connecting multiple heat dissipation devices.

[0022] In the above embodiments, different heat dissipation devices can be connected to each other through connectors, thereby making the internal components of different heat dissipation devices interconnected and enhancing the heat dissipation effect of the heat-generating elements. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the heat dissipation device provided in an embodiment of the present invention;

[0024] Figure 2 This is a schematic diagram of the gas transmission pipeline in the heat dissipation device provided in an embodiment of the present invention;

[0025] Figure 3 This is a schematic diagram of the structure of the partition in the heat dissipation device provided in an embodiment of the present invention.

[0026] Figure label:

[0027] 10-Heat dissipation base plate; 101-Refrigerant injection port; 11-Evaporation end; 12-Condensation end; 20-Gas transmission pipeline; 21-Spiral tube; 22-Flexible tube; 23-Bend; 30-Condensation assembly; 31-Condensation tube; 311-Bend section; 312-Bulk section; 40-Drainage pipeline; 50-Baffle plate; 501-Flow guiding channel. Detailed Implementation

[0028] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be described in further detail below with reference to the accompanying drawings. Obviously, the described embodiments are merely some embodiments of this invention, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without creative effort are within the scope of protection of this invention.

[0029] This invention provides a heat dissipation device to meet the heat dissipation requirements of high-power products.

[0030] like Figure 1 As shown, the heat dissipation device includes a heat dissipation substrate 10, a gas transmission pipeline 20, and a condensation assembly 30. The heat dissipation substrate 10 stores liquid refrigerant and includes an evaporation end 11 and a condensation end 12. The evaporation end 11 is attached to the surface of the heating element. The two ends of the gas transmission pipeline 20 are respectively connected to the evaporation end 11 and the condensation assembly 30. The gas transmission pipeline 20 is used to transmit the refrigerant that has absorbed heat and turned into gaseous state at the evaporation end 11 to the condensation assembly 30. The condensation assembly 30 is connected to the condensation end 12 and is used to condense the gaseous refrigerant into liquid refrigerant and transmit it to the condensation end 12. A first capillary structure (not shown) is provided inside the heat dissipation substrate 10. Under the action of the first capillary structure, the liquid refrigerant returns from the condensation end 12 to the evaporation end 11.

[0031] Specifically, the heat dissipation device mainly includes a heat dissipation substrate 10, a gas transmission pipeline 20, and a condensation assembly 30. Inside the heat dissipation substrate 10, the evaporation end 11 and the condensation end 12 are connected. Outside the heat dissipation substrate 10, one end of the gas transmission pipeline 20 is connected to the evaporation end 11 of the heat dissipation substrate 10, and the other end is connected to the condensation assembly 30. The condensation assembly 30 is connected to the condensation end 12 of the heat dissipation substrate 10. In this way, the evaporation end 11-gas transmission pipeline 20-condensation assembly 30-condensation end 12-evaporation end 11 form a refrigerant circulation path. In use, the evaporation end 11 is attached to the surface of the heating element. The heat generated by the heating element can be transferred to the evaporation end 11. The liquid refrigerant absorbs heat at the evaporation end 11 and becomes gaseous refrigerant. The gaseous refrigerant enters the condensation assembly 30 through the gas transmission pipeline 20. The gaseous refrigerant releases heat in the condensation assembly 30 and becomes liquid refrigerant, which is then transported to the condensation end 12 of the heat dissipation substrate 10. Under the capillary force of the first capillary structure, the liquid refrigerant returns from the condensation end 12 of the heat dissipation substrate 10 to the evaporation end 11, completing one cycle. The refrigerant can circulate repeatedly in the above manner, thereby continuously dissipating the heat generated by the heating element to the external environment, reducing the temperature of the heating element, and ensuring the normal operation of the heating element.

[0032] In this heat dissipation device, an ion vacuum pump can be used to maintain the vacuum inside the device below 10^-5 torr, where "torr" is a pressure unit, i.e., "torr", 1 torr = 133.3223684 Pa.

[0033] In this heat dissipation device, the refrigerant that absorbs heat from the heat-generating element and becomes gaseous is guided to the outside of the heat dissipation substrate 10 and liquefies in the condensation assembly 30. The condensation assembly 30 can be air-cooled. By increasing the surface area of ​​the condensation assembly 30, the heat exchange effect between the gaseous refrigerant and the air can be improved.

[0034] In commonly used VC vacuum chamber vapor chamber technology, the vapor chamber usually needs to rely on a large extended area for heat exchange. However, in this heat dissipation device, the condenser component 30 occupies a part of the space above the heating element, which improves the overall space utilization. Since this part of the space is far away from the surface of the heating element, the air circulation is better and the ambient temperature is lower than that of the heating element surface. Therefore, the heat exchange rate of the gaseous refrigerant can be improved. Furthermore, since the liquefaction of the gaseous refrigerant mainly occurs in the condenser component 30, the area of ​​the heat dissipation substrate 10 can be relatively reduced.

[0035] This heat dissipation device can dissipate heat from small-sized, high-power chips when space is limited. It can also be extended to dissipate heat from other products, such as servers, wireless routers and other communication equipment. Of course, this heat dissipation device can also be applied to other fields besides communication.

[0036] In some embodiments, such as Figure 1 , Figure 2 As shown, the gas transmission pipeline 20 includes a spiral tube 21, which extends in a spiral manner in a direction away from the heat dissipation substrate 10.

[0037] The spiral tube 21 extends the flow path of the gaseous refrigerant and increases the heat exchange time between the gaseous refrigerant and the air, so that the gaseous refrigerant can exchange heat with the air before entering the condenser assembly 30 and dissipate some heat. This ensures that the gaseous refrigerant is fully liquefied when it exchanges heat with the air again in the condenser assembly 30, thereby reducing the amount of gas residue in the condenser assembly 30.

[0038] Meanwhile, the spiral tube 21 guides the gaseous refrigerant to the far end of the heat dissipation substrate 10, forming a height difference with the surface of the heat dissipation substrate 10, which provides space for the arrangement of the condensation component 30. At the same time, it also keeps the gaseous refrigerant away from the heat source when exchanging heat with the air, thus improving the heat exchange efficiency.

[0039] When the heating element generates a lot of heat, the spiral tube 21 can also buffer the gaseous refrigerant, preventing a large amount of gaseous refrigerant from entering the condenser assembly 30 in a short time, exceeding the cooling capacity of the condenser assembly 30, and causing some of the gaseous refrigerant to fail to liquefy in the condenser assembly 30.

[0040] like Figure 1 , Figure 2 As shown, the spiral tube 21 is located at the beginning of the gas transmission pipeline 20. The central axis of the spiral tube 21 is perpendicular to the heat dissipation substrate 10, and the spiral tube 21 extends in a spiral manner away from the heat dissipation substrate 10.

[0041] In some embodiments, the spiral tube 21 gradually approaches its central axis in a direction away from the heat dissipation substrate 10. That is, the spiral tube 21 has a tapered structure with a small top and a large bottom. The liquid refrigerant absorbs heat and undergoes a phase change inside the heat dissipation substrate 10, becoming a gaseous refrigerant. The increase in gas in the cavity of the heat dissipation substrate 10 generates pressure, which pushes the gaseous refrigerant to flow along the spiral tube 21. Since the spiral tube 21 gradually approaches its central axis, this helps to push the gaseous refrigerant to rise gradually, allowing the gaseous refrigerant to rise to a greater height.

[0042] In addition, such as Figure 2 As shown, the spiral tube 21 forms a hollow structure as it spirals upward, creating a chimney effect to enhance the flow of air inside the tube. Specifically, as the gaseous refrigerant flows inside the spiral tube 21, it can exchange heat with the air inside the tube. This heated air will flow upward and out from the top. At the same time, in the space outside the spiral tube 21, cold air re-enters the space surrounded by the tube from the bottom, forming an airflow circulation. In this way, the internal and external air can circulate, improving the heat exchange efficiency between the gaseous refrigerant and the air.

[0043] The pitch of the spiral tube 21 is the same as or nearly the same as the tube diameter, which can reduce the gap between the tubes and facilitate the formation of the airflow circulation mentioned above.

[0044] like Figure 1 , Figure 2 As shown, the portion of the spiral tube 21 connected to the heat dissipation substrate 10 is arranged perpendicular to the heat dissipation substrate 10. The gaseous refrigerant first enters the spiral tube 21 vertically from the inner cavity of the heat dissipation substrate 10, and then continues to spiral upward along the spiral tube 21. This can reduce the flow resistance of the gas and prevent the liquid refrigerant from climbing up the inner wall of the spiral tube 21.

[0045] The spiral tube 21 and the heat dissipation substrate 10 can be connected by copper brazing, vacuum brazing or laser welding, or they can be made into an integrated structure using 3D printing technology.

[0046] In some embodiments, such as Figure 1 As shown, one or more drainage pipes 40 are provided between the first end and the last end of the spiral tube 21. One end of the drainage pipe 40 is connected to the spiral tube 21 and the other end is connected to the condenser assembly 30. The drainage pipe 40 is used to guide the refrigerant that has liquefied in the spiral tube 21 into the condenser assembly 30.

[0047] This is because the gaseous refrigerant may liquefy during its flow along the spiral tube 21, and the liquefied portion of the refrigerant can flow into the condenser assembly 30 under the guidance of the drainage pipe 40, thus avoiding gas-liquid blockage of the gaseous and liquid refrigerant within the spiral tube 21.

[0048] In some embodiments, the drainage pipe 40 is inclined, with one end of the drainage pipe 40 connected to the spiral pipe 21 being higher and the other end connected to the condenser assembly 30 being lower. This facilitates the flow of liquid refrigerant to the condenser assembly 30 under the action of gravity.

[0049] The inner wall surface of the drainage pipe 40 can also be provided with capillary structures, so that the liquid refrigerant can flow to the condenser assembly 30 under the combined action of gravity and capillary force, thereby accelerating the flow rate of the liquid refrigerant in the drainage pipe 40. The capillary structures include, but are not limited to, one or more combinations of microgrooves, copper powder (copper mesh) or aluminum powder (aluminum mesh) sintered structures.

[0050] When there are multiple drainage pipes 40, these drainage pipes 40 can be installed at different locations along the height direction, such as... Figure 1 As shown, there are two drainage tubes 40.

[0051] Continue to refer to Figure 1 , Figure 2 The gas transmission pipeline 20 also includes a flexible pipe 22, which is located at the end of the gas transmission pipeline 20. The end of the flexible pipe 22 is provided with a quick-connect fitting (not shown), which is inserted into the connection end of the condenser assembly 30 so that the flexible pipe 22 is connected to the condenser assembly 30.

[0052] The flexible tube 22 can be a spring tube or a PE plastic tube. During installation, the flexible tube 22 can be bent due to its flexibility, which facilitates the insertion of the quick-connect fitting at the end of the flexible tube 22 into the connection end of the condenser assembly 30, so that the gas transmission pipeline 20 and the condenser assembly 30 can be connected. In addition, the quick-connect fitting allows for quick connection between the gas transmission pipeline 20 and the condenser assembly 30, which is convenient and quick to install and remove. Furthermore, the quick-connect fitting allows for flexible replacement of the condenser assembly 30, so that a condenser assembly 30 with corresponding cooling capacity can be adapted according to the heat output of the heating element.

[0053] The flexible tube 22 includes a first end disposed away from the condenser assembly 30 and a second end disposed close to the condenser assembly 30. In some embodiments, the flexible tube 22 is inclined from the first end to the second end, that is, the first end of the flexible tube 22 is higher than the second end. Figure 1 , Figure 2 As shown, the flexible tube 22 is inclined, so that the flexible tube 22 can guide the gaseous refrigerant flowing through it, thereby guiding the gaseous refrigerant into the condenser assembly 30 and preventing the liquid refrigerant in the condenser assembly 30 from flowing back.

[0054] In addition, such as Figure 1 , Figure 2 As shown, the gas transmission pipeline 20 also includes a bend 23, which is disposed between the spiral pipe 21 and the flexible pipe 22 and serves as a connection between the spiral pipe 21 and the flexible pipe 22. The spiral pipe 21 and the bend 23 can be an integral structure.

[0055] like Figure 1 As shown, the condensation assembly 30 includes a condenser tube 31, the inner wall surface of which is provided with a second capillary structure (not shown), and the condenser tube 31 is perpendicularly connected to the heat dissipation substrate 10. In this way, liquid refrigerant can rapidly flow into the condensation end 12 of the heat dissipation substrate 10 under the combined action of gravity and capillary force. The second capillary structure includes, but is not limited to, one or more combinations of microgrooves, copper powder (copper mesh), or aluminum powder (aluminum mesh) sintered to form a capillary structure.

[0056] The second capillary structure can be a combination of microgrooves, copper powder (copper mesh) or aluminum powder (aluminum mesh) sintered to form a capillary structure to enhance the adsorption force on liquefied refrigerant. Among them, the microgrooves are V-shaped structures and are set on the inner wall of the condenser tube 31. The included angle between the two side walls of the microgrooves is 30° and the central angle between two adjacent microgrooves is 1.25°.

[0057] The condenser tube 31 uses air cooling for heat dissipation. Specifically, the condenser tube 31 is made of a material with high thermal conductivity, thereby improving the heat exchange efficiency between the gaseous refrigerant and the air. The condenser tube 31 and the heat dissipation substrate 10 can be connected by copper brazing, vacuum brazing, or laser welding, or they can be made into an integrated structure using 3D printing technology.

[0058] Continue to refer to Figure 1The condenser tube 31 includes a bent section 311 and a manifold section 312. The bent section 311 is located between the manifold section 312 and the gas transmission pipeline 20, serving as a transition between them and extending the flow path of the gaseous refrigerant to improve the heat exchange effect between the gaseous refrigerant and the air. The manifold section 312 is connected to the condenser end 12 of the heat dissipation substrate 10 and is perpendicular to the heat dissipation substrate 10. Generally, in use, the heat dissipation substrate 10 can be horizontally or nearly horizontally attached to the surface of the heating element. In this way, the manifold section 312 can be in a vertical or nearly vertical state. Thus, after the gaseous refrigerant liquefies into liquid refrigerant within the condenser tube 31, the liquid refrigerant can quickly flow into the condenser end 12 of the heat dissipation substrate 10 under the action of gravity.

[0059] In addition, the drainage pipes 40 mentioned above are all connected to the manifold 312. The liquid refrigerant in the drainage pipes 40 and the liquid refrigerant in the manifold 312 merge and flow into the condensation end 12 of the heat dissipation substrate 10.

[0060] To accelerate the heat exchange efficiency between the gaseous refrigerant and the air, fins are provided on the outer wall of the condenser tube 31. The fins increase the contact area between the condenser tube 31 and the air, thereby improving the heat exchange efficiency between the gaseous refrigerant and the air. Specifically, fins are provided on the outer wall surfaces of both the curved section 311 and the confluence section 312 of the condenser tube 31.

[0061] In some embodiments, such as Figure 1 , Figure 3 As shown, a partition 50 is provided inside the heat dissipation substrate 10. The partition 50 divides the cavity inside the heat dissipation substrate 10 into an evaporation cavity and a condensation cavity. Multiple flow channels 501 are provided inside the partition 50. The multiple flow channels 501 are arranged side by side. The flow channels 501 are respectively connected to the evaporation cavity and the condensation cavity. The cross-sectional area of ​​the flow channels 501 gradually decreases along the direction from the condensation cavity to the evaporation cavity.

[0062] A partition 50 is located between the evaporation chamber and the condensation chamber. A flow guide channel 501 is provided inside the partition 50, thereby connecting the evaporation chamber and the condensation chamber. Figure 3 As shown, along the direction from the condenser chamber to the evaporator chamber ( Figure 3 As indicated by the arrow in the image, the flow channel 501 gradually narrows. Since the opening of the flow channel 501 near the evaporation chamber is smaller, it helps to prevent the gaseous refrigerant in the evaporation chamber from flowing backward into the condensation chamber, causing gas-liquid mixing and blocking the channel. At the same time, the baffle 50 can also play a supporting role inside the heat dissipation substrate 10.

[0063] In some embodiments, the mesh size of the first capillary structure located in the evaporation chamber is greater than that of the first capillary structure located in the condensation chamber. This results in the liquid refrigerant experiencing greater capillary force from the evaporation chamber than from the condensation chamber during its flow, thereby facilitating the acceleration of the liquid refrigerant flow from the condensation chamber to the evaporation chamber.

[0064] In some embodiments, such as Figure 1 As shown, the heat dissipation substrate 10 is provided with a refrigerant injection port 101. The refrigerant injection port 101 is located close to the evaporation end 11. In this way, when injecting liquid, it is beneficial to store most of the liquid refrigerant in the evaporation end 11, so that the liquid refrigerant can absorb heat in the evaporation end 11 and thus carry out heat dissipation circulation. In addition, the refrigerant injection port 101 is provided with a connector, which is used to connect multiple heat dissipation devices. That is to say, different heat dissipation devices can be connected to form a whole through the connector.

[0065] The connector can be a male connector or a female connector. Taking two heat dissipation devices as an example, one heat dissipation device has a male connector at its refrigerant inlet 101, and the other heat dissipation device has a female connector at its refrigerant inlet 101. By cooperating with the male connector and the female connector, the two heat dissipation devices can be connected, thereby enhancing the heat dissipation effect of the heat-generating element.

[0066] In some embodiments, the heat dissipation substrate 10 may be provided with one condensation component 30 or multiple condensation components 30. When multiple condensation components 30 are provided on the heat dissipation substrate 10, the liquefaction of gaseous refrigerant can be accelerated, allowing the liquid refrigerant to quickly return to the heat dissipation substrate 10, increasing the circulation rate, and improving the heat dissipation effect of the heat-generating element.

[0067] In addition, when multiple condensation components 30 are provided on the heat dissipation substrate 10, multiple gas transmission pipes 20 can be provided accordingly. The gaseous refrigerant generated by the evaporation end 11 can be guided to different condensation components 30 through the multiple gas transmission pipes 20 to improve the heat dissipation effect of the heat-generating element.

[0068] In this heat dissipation device, the heat dissipation substrate 10, the gas transmission pipeline 20, and the condensation component 30 can all be manufactured using 3D printing technology, making the structure more precise. The materials can be graphene, copper, nickel, copper-nickel composite materials, stainless steel, or magnesium-aluminum composite materials. Of course, other materials can also be used. The wall thickness of the three components can be between 0.25 and 3.0 mm. Furthermore, the outer surface can be coated with nano-carbon, silicon carbide, or paint to form a coating with a thickness between 0.001 and 0.2 mm.

[0069] As can be seen from the above description, the heat dissipation device provided in the embodiments of the present invention has a condensation component disposed outside the heat dissipation substrate. The refrigerant sequentially passes through the evaporation end of the heat dissipation substrate, the condensation component, and the condensation end of the heat dissipation substrate before returning to the evaporation end of the heat dissipation substrate, completing one cycle. In the repeated cycle, the refrigerant continuously dissipates the heat generated by the heating element to the external environment, thereby reducing the temperature of the heating element and ensuring the normal operation of the heating element.

[0070] Obviously, those skilled in the art can make various modifications and variations to this invention without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of the claims of this invention and their equivalents, this invention also intends to include these modifications and variations.

Claims

1. A heat dissipation device, characterized in that, The device includes a heat dissipation substrate, a gas transmission pipeline, and a condensation assembly. The heat dissipation substrate stores liquid refrigerant and includes an evaporation end and a condensation end. The evaporation end is attached to the surface of a heating element. The two ends of the gas transmission pipeline are respectively connected to the evaporation end and the condensation assembly. The gas transmission pipeline is used to transmit the refrigerant, which absorbs heat and turns into a gaseous state at the evaporation end, to the condensation assembly. The condensation assembly is connected to the condensation end and is used to condense the gaseous refrigerant into a liquid state and transmit it to the condensation end. The heat dissipation substrate has a first capillary structure inside, under the action of the first capillary structure, the liquid refrigerant returns from the condensation end to the evaporation end. The gas transmission pipeline includes a spiral tube that extends in a spiral manner away from the heat dissipation substrate; one or more drainage channels are provided between the first and last ends of the spiral tube. The heat dissipation substrate is provided with a partition, and the partition is provided with multiple flow guiding channels. The cross-sectional area of ​​the flow guiding channels gradually decreases along the direction from the condensation end to the evaporation end.

2. The heat dissipation device as described in claim 1, characterized in that, Along the direction away from the heat dissipation substrate, the spiral tube gradually approaches its own central axis.

3. The heat dissipation device as described in claim 1, characterized in that, One end of the drainage pipe is connected to the spiral tube, and the other end is connected to the condensation assembly. The drainage pipe is used to guide the refrigerant that has liquefied in the spiral tube to the condensation assembly.

4. The heat dissipation device as described in claim 1, characterized in that, The gas transmission pipeline includes a flexible tube located at the end of the gas transmission pipeline, and the end of the flexible tube is provided with a quick-connect fitting. The quick-connect fitting is inserted into the connection end of the condensation assembly so that the flexible tube is connected to the condensation assembly.

5. The heat dissipation device as described in claim 4, characterized in that, The flexible tube includes a first end located away from the condenser assembly and a second end located close to the condenser assembly, and the flexible tube is inclined from the first end to the second end.

6. The heat dissipation device according to any one of claims 1 to 5, characterized in that, The condensation assembly includes a condenser tube, the inner wall of which is provided with a second capillary structure, and the condenser tube is perpendicularly connected to the heat dissipation substrate.

7. The heat dissipation device according to any one of claims 1 to 5, characterized in that, The partition divides the cavity inside the heat dissipation substrate into an evaporation cavity and a condensation cavity. Multiple flow channels are arranged side by side, and the flow channels are respectively connected to the evaporation cavity and the condensation cavity. The cross-sectional area of ​​the flow channels gradually decreases along the direction from the condensation cavity to the evaporation cavity.

8. The heat dissipation device as described in claim 7, characterized in that, The mesh count of the first capillary structure located in the evaporation chamber is greater than the mesh count of the first capillary structure located in the condensation chamber.

9. The heat dissipation device according to any one of claims 1 to 5, characterized in that, The heat dissipation substrate is provided with a refrigerant injection port, which is located near the evaporation end, and the refrigerant injection port is provided with a connector for connecting multiple heat dissipation devices.

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