A super junction IGBT device and a manufacturing method thereof

CN117832085BActive Publication Date: 2026-08-28XIAN LONTEN RENEWABLE ENERGY TECH
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Patent Information

Application Number
CN202311860768.1
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2023-12-31
Publication Date
2026-08-28
Estimated Expiration
2043-12-31

AI Technical Summary

Technical Problem

此时,如果超结IGBT的短路耐受时间不足,可能会导致设备损坏,甚至引发安全事故

Benefits of technology

本发明涉及一种具有电子注入增强结构和关断空穴抽取路径的超结IGBT。相对与常规超结IGBT器件,该发明通过在正面有源栅极两侧引入电子注入增强结构,显著降低了超结IGBT的饱和压降,提高了其正向导通电流密度。这一创新设计得益于深P+注入区和Pbody区与沟槽形成的电子注入增强区,进一步优化了超结IGBT的导通性能。

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Abstract

The application provides a super-junction IGBT device and a manufacturing method thereof, and a specific technical scheme is as follows: the application connects the positive forward conduction current path, the off hole extraction path and the separation of the super-junction IGBT through a P column region, and connects the front P type region with the second P column region, so that a longitudinal PNP structure is formed, the super-junction IGBT structure can be opened under the strong collector-emitter voltage of the short-circuit device, and the short-circuit current discharge channel of the super-junction IGBT structure can be formed through the bipolar transistor. The application provides the super-junction IGBT with innovation and practicability, the electron injection enhancement structure and the off hole extraction path are optimized, and the compromise of the conduction performance, the switching characteristic and the short-circuit capability of the super-junction IGBT is significantly improved.
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Citation Information

Patent Citations

  • IGBT (insulated gate bipolar translator) device and manufacturing method thereof

    CN107994069A

  • A superjunction IGBT with a shielded gate and a manufacturing method thereof

    CN109037312A