Etching method for adjusting trench structure by air blowing and metal heat sink

Abstract

This invention relates to the field of wet etching technology, and in particular to an etching method for adjusting the trench structure by air blowing and the resulting metal heat sink. The method mainly includes the following steps: B. Transporting the workpiece to the area directly below the etching mechanism via a transport mechanism; D. Connecting the nozzles to the etching solution source using an electromagnetic valve, spraying the etching solution onto the workpiece through the nozzles; E. Deactivating the connection between the nozzles and the etching solution source using an electromagnetic valve, allowing the workpiece to be etched by the etching solution to create primary trenches; F. Connecting some nozzles to the air source using a partial electromagnetic valve, blowing air onto the workpiece through the nozzles, separating the etching solution within the primary trenches by the gas, thereby continuing to etch part of the inner bottom wall of the primary trench to form secondary trenches. This invention switches the nozzles between the etching solution source and the air source using an electromagnetic valve, and uses a matrix-distributed nozzle for air blowing control, thus forming a more complex trench structure.

Description

Technical Field

[0001] This invention relates to the field of wet etching technology, and in particular to an etching method for adjusting the trench structure by air blowing and a metal heat sink. Background Technology

[0002] For electronic devices such as mobile phones, heat dissipation performance typically determines parameters such as lifespan and battery life. Therefore, electronic devices are usually equipped with metal heat sinks to absorb and dissipate heat in a timely manner. As electronic devices tend to be thinner and lighter, there are strict requirements on the thickness and size of the heat sinks. This leads to the current use of metal heat sinks and liquid wicking structures as components for heat dissipation in electronic devices.

[0003] The depth of the trenches, the level of the surface microstructure, and the shape of the trenches on the surface of such heat dissipation components typically affect their heat dissipation performance. Existing technologies often use wet etching to process the surface structure of these heat dissipation components. However, since wet etching can usually only form rectangular trenches, the regular structure limits the heat dissipation performance of the heat dissipation components. Therefore, there is currently much research and development on how to form trenches with more diverse shapes on metal heat sinks. For example, Chinese invention patent CN202210210319.1 provides a wind-assisted non-uniform depth etching processing device and method, which sprays etching liquid and then controls the flow of the etching liquid by blowing air, thereby achieving the processing of non-uniform depth trench structures.

[0004] However, this method has the following drawbacks: the blowing and etching processes are two separate structures, which means that the blowing mechanism can only be set on one side of the etching mechanism, resulting in limitations on the structure of the formed trenches and making it impossible to prepare more complex and diverse trench shapes. Summary of the Invention

[0005] This invention addresses the problems of existing technologies by providing an etching method and a metal heat sink that adjusts the trench structure by air blowing, enabling the formation of more complex and diverse trench shapes.

[0006] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:

[0007] The present invention provides an etching method for adjusting the trench structure by air blowing, and provides an apparatus including a transmission mechanism, a lifting mechanism and an etching mechanism. The etching mechanism includes an etching seat, and the bottom of the etching seat is arranged in a rectangular array with multiple nozzles. Each nozzle is connected to a solenoid valve, and the nozzles are connected to an etching liquid source or an air source through the solenoid valves.

[0008] Includes the following steps:

[0009] A. Clean the boards and then expose and develop them;

[0010] B. The board is transferred to the area directly below the etching mechanism via a transfer mechanism;

[0011] C. The etching mechanism is lowered to a specific height via a lifting mechanism;

[0012] D. The solenoid valve controls the nozzle to connect with the etching solution source, and sprays the etching solution onto the board through the nozzle;

[0013] E. The nozzle is de-connected to the etching solution source by the solenoid valve, so that the board is etched by the etching solution to produce primary grooves.

[0014] F. By controlling the corresponding nozzles to connect to the air source through some solenoid valves, the nozzles blow air onto the board so that the etching solution in the first-level trench is separated by gas, thereby continuing to etch part of the inner bottom wall of the first-level trench to form the second-level trench.

[0015] G. Stop blowing air and transfer the panel to the subsequent cleaning unit.

[0016] Furthermore, a positioning mechanism and at least one carrier for loading plates are provided. The surface of the carrier is passivated, the carrier has a loading groove for loading plates, a heating wire is provided inside the carrier, and a positioning socket is provided at the bottom of the carrier. The positioning mechanism includes a positioning drive, a positioning pin, and an electrical connector, the electrical connector being installed on the positioning pin.

[0017] Step B specifically includes:

[0018] B1. The transfer mechanism transfers the carrier containing the plates to the area directly below the etching mechanism;

[0019] B2. The positioning drive unit drives the positioning pin to rise until the positioning pin is inserted into the positioning socket;

[0020] B3. The energized connector contacts the resistance wire inside the carrier, thus conducting electricity and allowing the resistance wire to heat the plate through the carrier.

[0021] Furthermore, each nozzle is connected to a rotating module, and step F specifically includes:

[0022] F1. The nozzle posture is adjusted by rotating the module according to the characteristics and distance of each secondary groove;

[0023] F2. The solenoid valve controls the connection between the nozzle and the gas source, so that the nozzle sprays gas.

[0024] Furthermore, adjusting the nozzle orientation based on the distance of the secondary grooves specifically includes:

[0025] F11. Obtain the position coordinates of each secondary trench, and calculate the distance between adjacent secondary trenches using the coordinates;

[0026] F12. Based on the position coordinates of each secondary trench and the distance between adjacent secondary trenches, select the corresponding solenoid valve for control;

[0027] F13. Among the selected solenoid valves, obtain the position coordinates of the solenoid valves located at the beginning and end, and compare them with the position coordinates of each secondary groove;

[0028] F14. Based on the comparison results, control the attitude of the nozzles of the solenoid valves located at the beginning and / or end by rotating the module.

[0029] Preferably, in step F14, the rotation module controls the nozzle to rotate at an angle of 0 to 10°. If the comparison result shows that the nozzle rotation angle is greater than 10°, the etching mechanism is raised by the lifting mechanism, and then steps F11-F14 are executed again.

[0030] Furthermore, adjusting the nozzle orientation according to the shape of the secondary groove specifically includes:

[0031] Obtain the features of the secondary trench, including its shape, width, and depth;

[0032] Based on the location coordinates of the secondary trench, select the nozzles near the location coordinates of the secondary trench; based on the shape and width of the secondary trench, control the nearby nozzles to rotate at different angles and directions, so that the nozzles near the trench can spray air to confine the etching solution to a specific area, and the etching solution can etch the specific area to form the secondary trench.

[0033] The nozzle jetting time is controlled according to the depth of the secondary trench;

[0034] The step of adjusting the nozzle posture according to the shape of the secondary groove is performed after adjusting the nozzle posture according to the distance of the secondary groove.

[0035] Furthermore, in step F, after the solenoid valve switches to the point where the nozzle is connected to the gas source, the gas source begins to output gas. The initial rate of the gas output from the gas source is v / 2, and it reaches v after time t.

[0036] Where v is the rated speed of the gas output from the gas source, and t is the time it takes for the gas to reach the rated speed from the initial speed.

[0037] Furthermore, between steps F and G, the method also includes: controlling the corresponding nozzle to connect to the air source and blow air according to the position of the primary groove.

[0038] The present invention also provides a metal heat sink, which is prepared by the etching method described above.

[0039] Furthermore, the body is provided with a plurality of primary grooves, and the bottom of some / all of the primary grooves is connected to at least one secondary groove; the width of the secondary groove is not greater than the width of the primary groove, the length of the secondary groove is less than the length of the primary groove, and the ratio of the depth of the secondary groove to the depth of the primary groove is less than 1:1.

[0040] The beneficial effects of the present invention are as follows: The present invention controls the nozzle to switch between the etching liquid source and the gas source by means of an electromagnetic valve, and controls the blowing by means of nozzles arranged in a matrix, thereby forming a more complex trench structure. Attached Figure Description

[0041] Figure 1 This is a schematic diagram of the present invention.

[0042] Figure 2 This is a schematic diagram of the etching apparatus used in this invention.

[0043] Figure 3 This is a schematic diagram illustrating the cooperation between the vehicle and the positioning mechanism of the present invention.

[0044] Figure 4 This is a cross-sectional view of a metal heat sink etched according to the present invention.

[0045] Figure 5 for Figure 4 A schematic diagram of direction A.

[0046] Reference numerals: 1—Transmission mechanism, 2—Lifting mechanism, 3—Etching mechanism, 4—Positioning mechanism, 5—Carrier, 6—Body, 31—Etching seat, 32—Nozzle, 33—Solenoid valve, 41—Positioning drive, 42—Positioning pin, 43—Power connector, 44—Temperature probe, 51—Loading groove, 52—Heating wire, 53—Positioning port, 61—Primary groove, 62—Secondary groove. Detailed Implementation

[0047] To facilitate understanding by those skilled in the art, the present invention will be further described below with reference to embodiments and accompanying drawings. The content mentioned in the embodiments is not intended to limit the present invention. The present invention will be described in detail below with reference to the accompanying drawings.

[0048] Example 1

[0049] like Figures 1 to 3 As shown, this embodiment provides an etching method for adjusting the trench structure by air blowing, and provides an apparatus including a transmission mechanism 1, a lifting mechanism 2 and an etching mechanism 3. The etching mechanism 3 includes an etching seat 31, and the bottom of the etching seat 31 is provided with a plurality of nozzles 32 arranged in a rectangular array. Each nozzle 32 is connected to a solenoid valve 33, and the nozzles 32 are connected to an etching liquid source or an air source through the solenoid valves 33.

[0050] Includes the following steps:

[0051] A. Clean the boards and then expose and develop them;

[0052] B. The board is transferred to the area directly below the etching mechanism 3 via the transfer mechanism 1;

[0053] C. The etching mechanism 3 is lowered to a specific height by the lifting mechanism 2;

[0054] D. The solenoid valve 33 controls the nozzle 32 to connect with the etching solution source, and sprays the etching solution onto the board through the nozzle 32;

[0055] E. The solenoid valve 33 controls the nozzle 32 to no longer connect to the etching solution source, so that the board is etched by the etching solution to produce a first-level groove 61.

[0056] F. By controlling the corresponding part of the solenoid valve 33 to connect the corresponding part of the nozzle 32 to the air source, the nozzle 32 blows air onto the plate so that the etching solution in the first-level trench 61 is separated by gas, thereby continuing to etch part of the inner bottom wall of the first-level trench 61 to form the second-level trench 62.

[0057] G. Stop blowing air and transfer the panel to the subsequent cleaning unit.

[0058] Specifically, the conveying mechanism 1 is preferably a conveying roller mechanism, which uses a vision mechanism or a linearly lifting baffle to position the board, ensuring that the board is accurately positioned directly below the etching mechanism 3. During etching, the etching mechanism 3 first descends to a certain height and sprays etching solution onto the surface of the board. Since some areas of the board surface are protected by exposure and development, the remaining areas are etched by the etching solution, forming primary trenches 61. During the formation of primary trenches 61, the position of the etching solution can be controlled by switching the nozzles 32 to the air source via the solenoid valve 33 to control the shape of the primary trenches 61. After etching the primary trenches 61, according to the shape requirements of the secondary trenches 62, some nozzles 32 are switched to the air source, while others are blocked. By using some nozzles 32 to spray air, the position of the etching solution within the primary trenches 61 is restricted, ensuring that the etching solution can etch the areas where the secondary trenches 62 need to be formed. After etching, the board is conveyed to the next station for cleaning to remove the protective film and residual etching solution from the surface.

[0059] Compared with the prior art, the present invention adopts a method of switching the nozzle 32 to spray etching liquid or air through the solenoid valve 33, which makes the structure more compact and eliminates the need to separate the spraying of etching liquid and the blowing of air into two separate mechanisms. In addition, since the air nozzle is located directly above the plate, the accuracy of air blowing is better and the shape of the primary groove 61 / secondary groove 62 can be better controlled, thereby making the groove structure more diverse.

[0060] In this embodiment, a positioning mechanism 4 and at least one carrier 5 for loading plates are provided. The surface of the carrier 5 is passivated. The carrier 5 has a loading groove 51 for loading plates. A heating wire 52 is provided inside the carrier 5. A positioning socket 53 is provided at the bottom of the carrier 5. The positioning mechanism 4 includes a positioning drive 41, a positioning pin 42 and an electrical connector 43. The electrical connector 43 is installed on the positioning pin 42.

[0061] Step B specifically includes:

[0062] B1. The transfer mechanism 1 transfers the carrier 5 carrying the plate to the area directly below the etching mechanism 3;

[0063] B2. Positioning drive unit 41 drives positioning pin 42 to rise until positioning pin 42 is inserted into positioning socket 53;

[0064] B3. The power connector 43 contacts the resistance wire inside the carrier 5 and conducts electricity, so that the resistance wire heats the plate through the carrier 5.

[0065] In actual use, the positioning drive 41 is preferably a conventional linear drive module, while the power connector 43 is a telescopic probe used to insert into the corresponding power socket in the carrier 5 to provide power. The positioning mechanism 4 has a temperature probe 44 for sensing the temperature of the carrier 5; the heating wire 52 is used to ensure that the board reaches a certain temperature before etching, thereby making the etching more efficient.

[0066] Specifically, when the carrier 5, carrying the plate, reaches directly below the etching mechanism 3, the positioning drive 41 drives the positioning pin 42 to rise into the positioning socket 53. When the positioning pin 42 is inserted into the positioning socket 53 to a certain depth, the power connector 43 is inserted into the corresponding power socket of the carrier 5, thereby supplying power to the heating wire 52 inside the carrier 5, which heats the plate. When the temperature probe senses that the carrier 5 has reached the preset temperature, the heating wire 52 stops working to prevent the carrier 5 from overheating. After etching is completed, the positioning mechanism 4 resets to de-energize the heating wire 52. Through the integrated design of the structure, the present invention allows the carrier 5 to be heated only when it is positioned, achieving the effects of simplifying the structure and improving etching efficiency.

[0067] In this embodiment, each nozzle 32 is connected to a rotating module, and step F specifically includes:

[0068] F1. The orientation of the nozzle 32 is adjusted by the rotating module according to the characteristics and distance of each secondary groove 62;

[0069] F2. Solenoid valve 33 controls nozzle 32 to connect to the gas source so that nozzle 32 ejects gas.

[0070] Specifically, the rotating module is preferably a gimbal that can rotate at all angles or other conventional modules, as long as it can allow the nozzle 32 to rotate within a small range. Before spraying the etching solution, the rotating module will reset the nozzle 32 so that the output end of the nozzle 32 faces directly downwards to ensure that the etching solution is not sprayed outside the carrier 5. Before spraying, the nozzle 32 needs to be rotated by the control module to adjust the spray direction according to the characteristics of the secondary groove 62 and the distance between adjacent secondary grooves 62. Thus, the coordinated action of multiple nozzles 32 achieves the effect of limiting the position of the sprayed solution by the sprayed gas.

[0071] Specifically, adjusting the attitude of the nozzle 32 according to the distance of the secondary groove 62 includes:

[0072] F11. Obtain the position coordinates of each secondary trench 62, and calculate the distance between adjacent secondary trenches 62 using the coordinates;

[0073] F12. Based on the position coordinates of each secondary trench 62 and the distance between adjacent secondary trenches 62, select the corresponding solenoid valve 33 for control;

[0074] F13. Among the selected solenoid valves 33, obtain the position coordinates of the solenoid valves 33 located at the beginning and end, and compare them with the position coordinates of each secondary groove 62;

[0075] F14. Based on the comparison results, the attitude of the nozzle 32 of the solenoid valve 33 located at the beginning and / or end is controlled by rotating the module.

[0076] Multiple secondary trenches 62 may need to be prepared within a primary trench 61. These secondary trenches 62 are usually arranged side by side, and there should be no etching solution between adjacent secondary trenches 62 to avoid over-etching. Therefore, this invention first determines the number and individual nozzles 32 to be activated based on the position coordinates of each secondary trench 62. Since the distance between adjacent secondary trenches 62 is not necessarily exactly the total length between multiple nozzles 32, the position coordinates of the first and last nozzles 32 need to be adjusted according to the distance between the secondary trenches 62. That is, if the distance between the first and last nozzles 32 is greater than the distance between adjacent secondary trenches 62, the first nozzle 32 and / or the last nozzle 32 need to be rotated inward to change the path of the ejected gas, thereby changing the distance of the ejected gas position and ensuring the accuracy of the formation position of the secondary trenches 62.

[0077] Preferably, in step F14, the rotation module controls the nozzle 32 to rotate at an angle of 0 to 10°. If the comparison result shows that the angle of rotation of the nozzle 32 is greater than 10°, the etching mechanism 3 is raised by the lifting mechanism 2, and then steps F11-F14 are executed again.

[0078] Because the nozzles 32 are arranged relatively densely, their rotation angle should not be too large to avoid interfering with the surrounding nozzles 32. Therefore, if the present invention determines, through comparison, that the nozzle 32 needs to rotate an angle greater than 10° to be successfully adjusted, the etching seat 31 can be raised by the lifting mechanism 2, and then the rotation angle of the nozzle 32 located at the beginning / end can be re-determined, thereby making the adjustable progress and range of the present invention more flexible.

[0079] Specifically, adjusting the orientation of the nozzle 32 according to the shape of the secondary groove 62 includes:

[0080] The features of the secondary trench 62 are obtained, including its shape, width, and depth;

[0081] Based on the position coordinates of the secondary trench 62, a nozzle 32 near the position coordinates of the secondary trench 62 is selected; based on the shape and width of the secondary trench 62, the nozzle 32 in the vicinity is controlled to rotate at different angles and directions, so that the nozzle 32 in the vicinity sprays air to confine the etching solution in a specific area, and the etching solution etches the specific area to form the secondary trench 62.

[0082] The jetting time of nozzle 32 is controlled according to the depth of the secondary groove 62;

[0083] The step of adjusting the posture of the nozzle 32 according to the shape of the secondary groove 62 is performed after adjusting the posture of the nozzle 32 according to the distance of the secondary groove 62.

[0084] After adjusting the position of the secondary trench 62, it is also necessary to adjust the airflow landing point of the nozzle 32 according to the shape of the secondary trench 62. In this invention, after determining the position where the secondary trench 62 is formed, the nozzle 32 surrounding the position and located directly above the position is rotated to adjust the posture, and air is blown through the multiple nozzles 32 to form an unblown "eye". The shape of the eye is the position where the etching solution can be contained. The etching solution can then continue etching at this position to form the secondary trench 62.

[0085] Preferably, the orientation of the nozzle 32 can be controlled according to the etching time, so that the etching solution can adjust its shape over time, forming a more complex groove structure, making the grooves of the metal heat sink more abundant and the capillary performance better.

[0086] Specifically, in step F, after the solenoid valve 33 switches to the nozzle 32 and connects to the gas source, the gas source starts to output gas. The initial rate of the gas output from the gas source is v / 2, and it reaches v after time t.

[0087] Where v is the rated speed of the gas output from the gas source, and t is the time it takes for the gas to reach the rated speed from the initial speed.

[0088] That is, the blowing speed of the nozzle 32 of the present invention is gradually increased to the maximum. This method can ensure that the etching solution is forced to move to a specific position of the primary trench 61 as much as possible, avoiding the etching solution being directly splashed outside the primary trench 61 due to the gas impact caused by the initial excessive wind speed, and ensuring that there is etching solution at the etching position of the secondary trench 62.

[0089] Preferably, the ejected gas is an inert gas, such as nitrogen, to avoid contaminating the etching solution and affecting the etching effect.

[0090] In this embodiment, between steps F and G, the method further includes: controlling the corresponding nozzle 32 to connect to the air source for blowing based on the position of the primary trench 61. That is, after the secondary trench 62 is formed, the present invention connects all the nozzles 32 directly above the primary trench 61 to the air source, thereby blowing the etching solution away from the primary trench 61 and the secondary trench 62, so that the etching solution adheres to the position of the board mask, and prevents the etching solution from causing excessive time to the primary trench 61 and the secondary trench 62 during the process of the transfer mechanism 1 transferring the board to the next cleaning process.

[0091] Example 2

[0092] like Figure 4 and Figure 5 As shown, this embodiment provides a metal heat sink, which is prepared by the etching method described in Embodiment 1.

[0093] Specifically, the metal heat sink includes a body 6, which is provided with a plurality of primary grooves 61, and the bottom of some / all of the primary grooves 61 is connected to at least one secondary groove 62; the width of the secondary groove 62 is not greater than the width of the primary groove 61, the length of the secondary groove 62 is less than the length of the primary groove 61, and the ratio of the depth of the secondary groove 62 to the depth of the primary groove 61 is less than 1:1.

[0094] That is, the bottom of a primary trench 61 is connected to at least one secondary trench 62. In order to avoid perforation of the metal heat sink, the depth of the secondary trench 62 is no greater than the depth of the primary trench 61. In addition, since the secondary trench 62 is set at the bottom of the primary trench 61, in order to avoid collapse, the width of the secondary trench 62 is at most the same as that of the primary trench 61, while the length of the secondary trench 62 must be less than that of the primary trench 61.

[0095] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some changes or modifications to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present invention. Any simple modifications, equivalent changes, and modifications made to the above embodiments based on the present invention without departing from the scope of the present invention are within the scope of the present invention.

Claims

1. An etching method for adjusting trench structure by air blowing, characterized in that: An apparatus is provided, comprising a transmission mechanism, a lifting mechanism, and an etching mechanism. The etching mechanism includes an etching seat, the bottom of which is arranged in a rectangular array with multiple nozzles. Each nozzle is connected to a solenoid valve, and the nozzles are connected to an etching liquid source or a gas source through the solenoid valves. Includes the following steps: A. Clean the boards and then expose and develop them; B. The board is transferred to the area directly below the etching mechanism via a transfer mechanism; C. The etching mechanism is lowered to a specific height via a lifting mechanism; D. The solenoid valve controls the nozzle to connect with the etching solution source, and sprays the etching solution onto the board through the nozzle; E. The nozzle is de-connected to the etching solution source by the solenoid valve, so that the board is etched by the etching solution to produce primary grooves. F. By controlling the corresponding nozzles to connect to the air source through some solenoid valves, the nozzles blow air onto the board so that the etching solution in the first-level trench is separated by gas, thereby continuing to etch part of the inner bottom wall of the first-level trench to form the second-level trench. G. Stop blowing air and transfer the panel to the subsequent cleaning unit.

2. The etching method for adjusting the trench structure by air blowing according to claim 1, characterized in that: A positioning mechanism and at least one carrier for loading plates are provided. The surface of the carrier is passivated. The carrier has a loading groove for loading plates. A heating wire is provided inside the carrier. A positioning socket is provided at the bottom of the carrier. The positioning mechanism includes a positioning drive, a positioning pin, and an electrical connector, with the electrical connector mounted on the positioning pin. Step B specifically includes: B1. The transfer mechanism transfers the carrier containing the plates to the area directly below the etching mechanism; B2. The positioning drive unit drives the positioning pin to rise until the positioning pin is inserted into the positioning socket; B3. The energized connector contacts the resistance wire inside the carrier, thus conducting electricity and allowing the resistance wire to heat the plate through the carrier.

3. The etching method for adjusting the trench structure by air blowing according to claim 1, characterized in that: Each nozzle is connected to a rotating module. Step F specifically includes: F1. The nozzle posture is adjusted by rotating the module according to the characteristics and distance of each secondary groove; F2. The solenoid valve controls the connection between the nozzle and the gas source, so that the nozzle sprays gas.

4. The etching method for adjusting the trench structure by air blowing according to claim 3, characterized in that: In step F1, the nozzle orientation is adjusted according to the distance of the secondary groove, specifically including: F11. Obtain the position coordinates of each secondary trench, and calculate the distance between adjacent secondary trenches using the coordinates; F12. Based on the position coordinates of each secondary trench and the distance between adjacent secondary trenches, select the corresponding solenoid valve for control; F13. Among the selected solenoid valves, obtain the position coordinates of the solenoid valves located at the beginning and end, and compare them with the position coordinates of each secondary groove; F14. Based on the comparison results, control the attitude of the nozzles of the solenoid valves located at the beginning and / or end by rotating the module.

5. The etching method for adjusting the trench structure by air blowing according to claim 4, characterized in that: In step F14, the rotating module controls the nozzle to rotate at an angle of 0 to 10°. If the comparison result shows that the nozzle rotation angle is greater than 10°, the etching mechanism is raised by the lifting mechanism, and then steps F11-F14 are executed again.

6. The etching method for adjusting the trench structure by air blowing according to claim 3, characterized in that: In step F1, the nozzle orientation is adjusted according to the shape of the secondary groove, specifically including: Obtain the features of the secondary trench, including its shape, width, and depth; Based on the location coordinates of the secondary trench, select the nozzles near the location coordinates of the secondary trench; based on the shape and width of the secondary trench, control the nearby nozzles to rotate at different angles and directions, so that the nozzles near the trench can spray air to confine the etching solution to a specific area, and the etching solution can etch the specific area to form the secondary trench. The nozzle jetting time is controlled according to the depth of the secondary trench; The step of adjusting the nozzle posture according to the shape of the secondary groove is performed after adjusting the nozzle posture according to the distance of the secondary groove.

7. The etching method for adjusting the trench structure by air blowing according to claim 1, characterized in that: In step F, after the solenoid valve switches to the point where the nozzle is connected to the gas source, the gas source begins to output gas. The initial rate of the gas output from the gas source is v / 2, and it reaches v after time t. Where v is the rated speed of the gas output from the gas source, and t is the time it takes for the gas to reach the rated speed from the initial speed.

8. The etching method for adjusting the trench structure by air blowing according to claim 1, characterized in that: Between steps F and G, the following step is also included: according to the position of the primary groove, control the corresponding nozzle to connect to the air source for blowing.

9. A metal heat sink, characterized in that: It is prepared by the etching method described in any one of claims 1-8.

10. The metal heat sink according to claim 9, characterized in that: Includes a body, which is provided with a plurality of primary grooves, and the bottom of some / all of the primary grooves is connected to at least one secondary groove. The width of the secondary trench is no greater than the width of the primary trench, the length of the secondary trench is less than the length of the primary trench, and the ratio of the depth of the secondary trench to the depth of the primary trench is less than 1:1.

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