Electromagnetic and piezoelectric macro-micro composite control circuit

Abstract

This invention discloses an electromagnetic / piezoelectric macro-micro composite control circuit, comprising a power supply terminal, a first piezoelectric output module, a second piezoelectric output module, an MCU microcontroller module, and a host computer. The first and second piezoelectric output modules are connected in parallel and then connected to the power supply terminal via a first line and a second line, respectively. A power conversion module and a V_Ref reference voltage module are also mounted on the second line, and the power conversion module and the V_Ref reference voltage module are connected in series. Both the first and second piezoelectric output modules are connected to piezoelectric drivers. The MCU microcontroller module is connected to the first piezoelectric output module via a third line, to the second piezoelectric output module via a fourth line, and to the power conversion module via a fifth line. The advantages include: wide applicability; ability to achieve rapid and precise positioning; high system integration, facilitating miniaturization; and suitability for DC low-voltage operating environments.

Description

Technical Field

[0001] This invention relates to a control circuit, and more particularly to an electromagnetic and piezoelectric macro-micro composite control circuit. Background Technology

[0002] Currently, with the development of science and technology, cross-scale precision actuation technology has become one of the core requirements of advanced instruments and equipment. For example, the workpiece stage of a lithography machine needs to achieve micron or even nanometer-level positioning accuracy within a millimeter-level range. To address this need, macro-micro actuation technologies combining different driving principles have gradually developed. Macroscopic motion often employs electromagnetic driving principles, while microscopic motion often employs piezoelectric driving principles. However, control circuits for electromagnetic / piezoelectric macro-micro composite actuation are currently rare.

[0003] Invention patent 'Motor Drive Circuit 202110750349.7' proposes a drive circuit for electromagnetic motors, which can realize motion control of three-phase DC motors, but it does not have the ability to drive piezoelectric motors. Invention patent 'Drive Control Device and Method for Macro / Micro Drive Piezoelectric Linear Motor 201410592537.1' proposes a macro / micro drive circuit based on the piezoelectric drive principle, which can output high-frequency sine wave signals to drive continuous motor movement and output DC voltage signals for precise displacement control of piezoelectric elements. However, it cannot drive electromagnetic motors, and the circuit requires AC voltage of 220V, which is not suitable for working environments with low DC power. To address the above problems, this invention proposes a control circuit that combines electromagnetic and piezoelectric control capabilities, enabling precise positioning across macro and micro scales. Summary of the Invention

[0004] The main objective of this invention is to address the problem that existing control circuits do not employ composite drive, and to provide an electromagnetic and piezoelectric macro-micro composite control circuit.

[0005] The electromagnetic and piezoelectric macro-micro composite control circuit provided by this invention includes a power supply terminal, a first piezoelectric output module, a second piezoelectric output module, an MCU microcontroller module, and a host computer. The first and second piezoelectric output modules are connected in parallel and then connected to the power supply terminal via a first line and a second line, respectively. A power conversion module and a V_Ref reference voltage module are also mounted on the second line, and the power conversion module and the V_Ref reference voltage module are connected in series. Both the first and second piezoelectric output modules are connected to piezoelectric drivers. The MCU microcontroller module is connected to the first piezoelectric output module via a third line. The MCU microcontroller module is connected to the second piezoelectric output module via the fourth line, the MCU microcontroller module is connected to the power conversion module via the fifth line, the MCU microcontroller module is connected to the host computer via the sixth line, the sixth line is equipped with the first RS485 communication module, the first RS485 communication module is also connected to the power conversion module via a line, the MCU microcontroller module is connected to the electromagnetic motor driver via the seventh line, the seventh line is equipped with the RS232 communication module, the MCU microcontroller module is connected to the spare interface via the eighth line, the eighth line is equipped with the second RS485 communication module.

[0006] The power supply terminal provides a 24V operating voltage to the control circuit.

[0007] The first and second piezoelectric output modules have the same structure. Both modules can generate 0-10V analog signal output. The DIN interface of the DAC chip U2 in both modules is connected to the PB7 interface of the MCU microcontroller module U6 for receiving digital signals. The clock interface SCLK of the DAC chip U2 is connected to the clock interface PB6 of the MCU microcontroller module U6 for receiving clock signals. The CS interface of the DAC chip U2 is the chip select signal and is connected to the PB5 interface of the MCU microcontroller module U6 for selecting the appropriate piezoelectric output module to operate. The VDD interface of the DAC chip U2 is connected to an external 24V DC voltage and is decoupled by a capacitor C12. The REFIN interface of chip U2 is connected to the voltage output interface VOUT of the V_Ref reference voltage module to provide a reference voltage. The AGND interface of DAC chip U2 is grounded. The OUT interface of DAC chip U2 is an analog output interface, which is connected to a two-stage amplifier circuit consisting of operational amplifier U5_A and transistors Q1 and Q2. R8, C13, R11, R10, R12, R13, R14 and R9 form the structure of the amplifier circuit. The analog output of DAC chip U2 is transmitted to interface OUT2 after two-stage amplification and is connected in parallel with TVS1 and EC3. TVS1 is used for protection circuit, and EC3 plays a filtering and energy storage role to reduce analog output voltage ripple. Interface OUT2 is connected to an external piezoelectric element driver to further amplify the voltage and drive the piezoelectric element.

[0008] The power conversion module converts the 24V power supply provided by the power supply terminal to a 5V power supply. The 24V power supply terminal is connected to a capacitor EC1 for filtering. The voltage input port VIN of the power chip U1 is connected to the 24V power supply. The internal operating voltage interface VDD of the power chip U1 is connected to the 24V power supply, resistors R1 and R5, diode D1, and inductor L1 to ensure the required operating voltage for the internal components of the power chip. The ground terminal VSS of the power chip U1 is grounded. The voltage feedback pin VFB of the power chip U1 is connected to the output interface CS, resistor R2, inductor L1, resistor R4, and resistor R3 to sense the output voltage of the power conversion module. The CS interface of the power chip U1 is connected to resistor R2, inductor L1, and capacitor EC2, and capacitor EC2 is connected in parallel with the load resistor R6. The aforementioned components can filter and rectify the PWM wave output from the CS port into a stable 5V voltage.

[0009] The V_Ref reference voltage module provides a reference voltage for the first and second piezoelectric output modules. The voltage interface VIN of the reference voltage chip U3 in the V_Ref reference voltage module is connected to the 5V voltage provided by the power conversion module and is decoupled by capacitor C10. The output interface VOUT of the reference voltage chip U3 in the V_Ref reference voltage module provides a 2.5V reference voltage and is decoupled by capacitor C11.

[0010] The MCU microcontroller module is the core of information processing. It can receive, process, and send instructions. VDDA, VDD_1, VDD_2, and VDD_3 of U6 in the MCU microcontroller module are connected to the 5V power conversion module, which supplies power to the MCU microcontroller module. The VSS_2 interface of U6 in the MCU microcontroller module is connected to the host computer through the J1SWD programmer for the host computer to program.

[0011] The first and second RS485 communication modules have the same structure. Both modules can convert full-duplex serial commands to RS485 half-duplex differential signals. They can also feed back position and speed information to the host computer. The voltage interface VCC of the communication chip U7 in both modules is connected to the 5V voltage of the power conversion module; the ground interface GND of the communication chip U7 is normally grounded; the enable interface RE of the communication chip U7 is connected to 5V, enabling the communication chip U7 to receive signals; the RO and DI interfaces of the communication chip U7 are responsible for data transmission and connection to the microcontroller U6 interface R, respectively. XD2 and TXD2; the differential signal output interfaces A and B of the communication chip U7 are externally connected to a peripheral circuit consisting of resistors R34, R35, R36, fuses F1 and F2, and diode T1 to ensure the quality of transmitted signals. The circuit output is ultimately connected to a 485 standard connector. The SHDN of the communication chip U7 is a shutdown interface triggered by a low level. Applying a 5V high level will not shut down the communication chip U7. The 5V voltage output from the power conversion module is also connected to resistors R39, R40, R41, and R42 in the first and second RS485 communication modules to drive indicator lights RXD1 and TXD1 to indicate whether there is signal transmission. Capacitors C5 and C6 are connected between the 5V voltage source and ground to decouple the power supply voltage.

[0012] The RS232 communication module interacts with the electromagnetic motor driver, driving the electromagnetic motor. The interfaces T1IN and R1OUT of the communication chip U9 in the RS232 communication module are connected to U6 in the MCU microcontroller module. T1OUT and R1IN are connected to the standard interface of the RS232 communication module and connected to the external electromagnetic motor driver, enabling the transmission of control signals from the MCU microcontroller module to the electromagnetic motor driver. The VDD and VCC interfaces of the communication chip U9 are both connected to the 5V voltage provided by the power conversion module and are connected to capacitors C20 and C21 for power decoupling.

[0013] The host computer, power terminals, piezoelectric actuators and electromagnetic motor actuators mentioned above are all assemblies of existing equipment, so their specific models and specifications are not described in detail.

[0014] The beneficial effects of this invention are:

[0015] The electromagnetic and piezoelectric macro-micro composite control circuit provided by this invention has the control capabilities of both electromagnetic motors and piezoelectric motors, making it widely applicable; it meets the needs of cross-scale macro-micro composite precision control systems and can be used to achieve rapid and precise positioning functions; it uses a single control module to control both types of motors simultaneously, resulting in high system integration and facilitating miniaturization; it operates at low voltage and is suitable for DC low-voltage working environments. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of the electromagnetic and piezoelectric macro-micro composite control circuit described in this invention.

[0017] Figure 2 This is a schematic diagram of the circuit structure of the first piezoelectric output module and the second piezoelectric output module according to the present invention.

[0018] Figure 3 This is a schematic diagram of the power conversion module circuit structure described in this invention.

[0019] Figure 4 This is a schematic diagram of the V_Ref reference voltage module circuit structure described in this invention.

[0020] Figure 5 This is a schematic diagram of the MCU single-chip microcomputer module circuit structure described in this invention.

[0021] Figure 6 This is a schematic diagram of the circuit structure of the first RS485 communication module and the second RS485 communication module described in this invention.

[0022] Figure 7 This is a schematic diagram of the circuit structure of the RS232 communication module described in this invention.

[0023] The annotations in the above-mentioned figures are as follows:

[0024] 1. Power terminal; 2. First piezoelectric output module; 3. Second piezoelectric output module

[0025] 4. MCU microcontroller module; 5. Host computer; 6. First circuit; 7. Second circuit.

[0026] 8. Power conversion module; 9. V_Ref reference voltage module; 10. Piezoelectric actuator.

[0027] 11. Route 3 12. Route 4 13. Route 5 14. Route 6

[0028] 15. First RS485 communication module; 16. Seventh line; 17. Electromagnetic motor driver.

[0029] 18. RS232 communication module; 19. Eighth line; 20. Spare interface

[0030] 21. Second RS485 communication module. Detailed Implementation

[0031] Please see Figures 1 to 7 As shown:

[0032] The electromagnetic and piezoelectric macro-micro composite control circuit provided by this invention includes a power supply terminal 1, a first piezoelectric output module 2, a second piezoelectric output module 3, an MCU microcontroller module 4, and a host computer 5. The first piezoelectric output module 2 and the second piezoelectric output module 3 are connected in parallel and then connected to the power supply terminal 1 via a first line 6 and a second line 7, respectively. A power conversion module 8 and a V_Ref reference voltage module 9 are also mounted on the second line 7, and the power conversion module 8 and the V_Ref reference voltage module 9 are connected in series. Both the first piezoelectric output module 2 and the second piezoelectric output module 3 are connected to a piezoelectric driver 10. The MCU microcontroller module 4 is connected to the first piezoelectric output module 2 via a third line 11. Block 4 is connected to the second piezoelectric output module 3 via the fourth line 12. The MCU microcontroller module 4 is connected to the power conversion module 8 via the fifth line 13. The MCU microcontroller module 4 is connected to the host computer 5 via the sixth line 14. The sixth line 14 is equipped with the first RS485 communication module 15. The first RS485 communication module 15 is also connected to the power conversion module 8 via a line. The MCU microcontroller module 4 is connected to the electromagnetic motor driver 17 via the seventh line 16. The seventh line 17 is equipped with the RS232 communication module 18. The MCU microcontroller module 4 is connected to the spare interface 20 via the eighth line 19. The eighth line 19 is equipped with the second RS485 communication module 21.

[0033] Power terminal 1 provides a 24V operating voltage to the control circuit.

[0034] The first piezoelectric output module 2 and the second piezoelectric output module 3 have the same structure. Both modules can generate 0-10V analog signal output. The DIN interface of the DAC chip U2 in both modules is connected to the PB7 interface of the U6 in the MCU microcontroller module 4 to receive digital signals. The clock interface SCLK of the DAC chip U2 is connected to the PB6 interface of the U6 in the MCU microcontroller module 4 to receive clock signals. The CS interface of the DAC chip U2 is the chip select signal and is connected to the PB5 of the U6 in the MCU microcontroller module 4, used by the U6 in the MCU microcontroller module 4 to select the corresponding piezoelectric output module to operate. The VDD interface of the DAC chip U2 is connected to an external 24V DC voltage and has a capacitor C12 connected to it. Decoupling; the REFIN interface of DAC chip U2 is connected to the voltage output interface VOUT of V_Ref reference voltage module 9 to provide a reference voltage; the AGND interface of DAC chip U2 is grounded; the OUT interface of DAC chip U2 is an analog output interface, which is externally connected to a two-stage amplifier circuit composed of operational amplifier U5_A and transistors Q1 and Q2. R8, C13, R11, R10, R12, R13, R14 and R9 constitute the structure of the amplifier circuit. The analog output of DAC chip U2 is transmitted to interface OUT2 after two-stage amplification, and is connected in parallel with TVS1 and EC3. TVS1 is used for protection circuit, and EC3 plays a filtering and energy storage function to reduce analog output voltage ripple; interface OUT2 is externally connected to a piezoelectric element driver, which further amplifies the voltage to drive the piezoelectric element.

[0035] The power conversion module 8 converts the 24V power supply provided by power terminal 1 into a 5V power supply. Capacitor EC1 is connected to the 24V power terminal 1 for filtering. The voltage input port VIN of the power chip U1 is connected to the 24V power supply. The internal operating voltage interface VDD of the power chip U1 is connected to the 24V power supply, resistors R1 and R5, diode D1, and inductor L1 to ensure the required operating voltage for the internal components of the power chip. The ground terminal VSS of the power chip U1 is grounded. The voltage feedback pin VFB of the power chip U1 is connected to the output interface CS, resistor R2, inductor L1, resistor R4, and resistor R3 to sense the output voltage of the power conversion module. The CS interface of the power chip U1 is connected to resistor R2, inductor L1, and capacitor EC2, and capacitor EC2 is connected in parallel with the load resistor R6. These components can filter and rectify the PWM wave output from the CS port into a stable 5V voltage.

[0036] The V_Ref reference voltage module 9 provides a reference voltage for the first piezoelectric output module 2 and the second piezoelectric output module 3. The voltage interface VIN of the reference voltage chip U3 in the V_Ref reference voltage module 9 is connected to the 5V voltage provided by the power conversion module 8 and is decoupled by a capacitor C10. The output interface VOUT of the reference voltage chip U3 in the V_Ref reference voltage module 9 provides a 2.5V reference voltage and is decoupled by a capacitor C11.

[0037] The MCU microcontroller module 4 is the core of information processing. It can receive, process, and send instructions. VDDA, VDD_1, VDD_2, and VDD_3 of U6 in the MCU microcontroller module 4 are connected to the 5V voltage of the power conversion module 8, which supplies power to the MCU microcontroller module 4. The VSS_2 interface of U6 in the MCU microcontroller module 4 is connected to the host computer 5 through the J1SWD programmer for the host computer 5 to burn programs.

[0038] The first RS485 communication module 15 and the second RS485 communication module 21 have the same structure. Both modules can convert full-duplex serial port commands to 485 half-duplex differential signals. They can also feed back position and speed information to the host computer 5. The voltage interface VCC of the communication chip U7 in both modules is connected to the 5V voltage of the power conversion module 8; the ground interface GND of the communication chip U7 is normally grounded; the enable interface RE of the communication chip U7 is connected to 5V, enabling it to receive signals; the RO and DI interfaces of the communication chip U7 are responsible for data transmission and connection to the single-chip microcontroller, respectively. The U6 interface has RXD2 and TXD2; the differential signal output interfaces A and B of the communication chip U7 are externally connected to a peripheral circuit consisting of resistors R34, R35, R36, fuses F1 and F2, and diode T1 to ensure the quality of the transmitted signal. The circuit output is finally connected to a 485 standard connector; the SHDN of the communication chip U7 is a shutdown interface and is triggered by a low level. Applying a 5V high level will not shut down the communication chip U7; the 5V voltage output by the power conversion module 8 is also connected to resistors R39, R40, R41, and R42 in the first RS485 communication module 15 and the second RS485 communication module 21 to drive indicator lights RXD1 and TXD1 to indicate whether there is a signal transmission; capacitors C5 and C6 are connected between the 5V voltage source and ground to decouple the power supply voltage.

[0039] The RS232 communication module 18 interacts with the electromagnetic motor driver 17, and drives the electromagnetic motor to run. The interfaces T1IN and R1OUT of the communication chip U9 in the RS232 communication module 18 are connected to U6 in the MCU microcontroller module 4. T1OUT and R1IN are connected to the standard interface of the RS232 communication module 18 and externally connected to the electromagnetic motor driver 17, which can transmit the control signals of the MCU microcontroller module 4 to the electromagnetic motor driver 17. The VDD and VCC interfaces of the communication chip U9 are both connected to the 5V voltage provided by the power conversion module 8, and are connected to capacitors C20 and C21 for power decoupling.

[0040] The host computer 5, power terminal 1, piezoelectric actuator 10 and electromagnetic motor actuator 17 mentioned above are all assemblies of existing equipment, so their specific models and specifications are not described in detail.

[0041] The symbols for the main components mentioned above are explained in the table below:

[0042] power chip U1 High-precision DAC chip U2 U4 Reference voltage chip U3 op amp chip U5 microcontroller U6 485 communication chip U7 U8 232 communication chip U9 diode D1 diode D2 LED beads D3 RXD1 RXD2 LED beads D4 D5 TXD1 TXD2 TVS diode TVS1 TVS2 Plug-in electrolytic capacitors EC1 Plug-in electrolytic capacitors EC2 Plug-in electrolytic capacitors EC3 EC4 Surface Mount Capacitors C1 Surface Mount Capacitors C2 C3 C4 C5 C7 C8 C9 C10 C11 C12 C22 Surface Mount Capacitors C6 C23 Surface Mount Capacitors C13 C14 C15 C16 Surface Mount Capacitors C17 C18 C19 C20 C21 Chip resistors R1 Chip resistors R2 Chip resistors R3 Chip resistors R4 Chip resistors R5 Chip resistors R6 Chip resistors R7 Chip resistors R8 R9 R12 R15 R18 R19 Chip resistors R11 R16 Chip resistors R11 R17 Chip resistors R13 R14 Chip resistors R20 R21 R32 R33 R37 R38 Chip resistors R22 R23 R24 Chip resistors R25 R27 R30 R31 R34 R36 R39 R42 Chip resistors R28 R41 Chip resistors R29 R40 Chip resistors R26 R35 Patch fuse F1 F2 F3 F4 electrostatic diode T1 T2 Surface Mount Transistors Q1 Q3 Surface Mount Transistors Q2 Q4 Terminal blocks 485_1 485_2 OUT1 OUT2 Terminal blocks 24V Terminal blocks 232_TXD

Claims

1. A composite control circuit for electromagnetic and piezoelectric macro-micro components, comprising a power supply terminal, a first piezoelectric output module, a second piezoelectric output module, an MCU microcontroller module, and a host computer. The first and second piezoelectric output modules are connected in parallel and then connected to the power supply terminal via a first line and a second line, respectively. A power conversion module and a V_Ref reference voltage module are also mounted on the second line, and the power conversion module and the V_Ref reference voltage module are connected in series. Both the first and second piezoelectric output modules are connected to piezoelectric drivers. The MCU microcontroller module is connected to the first piezoelectric output module via a third line. The microcontroller module is connected to the second piezoelectric output module via the fourth line; the MCU microcontroller module is connected to the power conversion module via the fifth line; the MCU microcontroller module is connected to the host computer via the sixth line, on which a first RS485 communication module is mounted; the first RS485 communication module is also connected to the power conversion module via a line; the MCU microcontroller module is connected to an electromagnetic motor driver via the seventh line, on which an RS232 communication module is mounted; the MCU microcontroller module is connected to a spare interface via the eighth line, on which a second RS485 communication module is mounted. Its distinguishing feature is: The first and second piezoelectric output modules have the same structure. Both modules can generate 0-10V analog signal output. The DIN interface of the DAC chip U2 in both modules is connected to the PB7 interface of the MCU microcontroller module U6 for receiving digital signals. The clock interface SCLK of the DAC chip U2 is connected to the clock interface PB6 of the MCU microcontroller module U6 for receiving clock signals. The CS interface of the DAC chip U2 is a chip select signal and is connected to the PB5 of the MCU microcontroller module U6 for selecting the appropriate piezoelectric output module to operate. The VDD interface of the DAC chip U2 is connected to an external 24V DC voltage and is decoupled by a capacitor C12. The REFIN interface of the DAC chip U2 is connected to the voltage output interface VOUT of the V_Ref reference voltage module, providing a reference voltage. The AGND interface of the DAC chip U2 is grounded. The OUT interface of the DAC chip U2... The interface is an analog output interface, externally connected to a two-stage amplifier circuit consisting of operational amplifier U5_A and transistors Q1 and Q2. R8, C13, R11, R10, R12, R13, R14, and R9 form the amplifier circuit structure. The analog output of DAC chip U2 is amplified in two stages and then transmitted to interface OUT2, connected in parallel with TVS1 and EC3. TVS1 is used for protection circuitry, and EC3 serves as a filter and energy storage unit to reduce analog output voltage ripple. Interface OUT2 is connected to an external piezoelectric element driver, which further amplifies the voltage to drive the piezoelectric element. The V_Ref reference voltage module provides a reference voltage for both the first and second piezoelectric output modules. The voltage interface VIN of the reference voltage chip U3 in the V_Ref reference voltage module is connected to the 5V voltage provided by the power conversion module, and is decoupled by capacitor C10. The output interface VOUT of the reference voltage chip U3 in the V_Ref reference voltage module provides a 2.5V reference voltage, and is decoupled by capacitor C11.

2. The electromagnetic and piezoelectric macro-micro composite control circuit according to claim 1, characterized in that: The power supply terminal provides a 24V operating voltage to the control circuit.

3. The electromagnetic and piezoelectric macro-micro composite control circuit according to claim 1, characterized in that: The power conversion module converts the 24V power supply provided by the power supply terminal to a 5V power supply. The 24V power supply terminal is connected to a capacitor EC1 for filtering. The voltage input port VIN of the power chip U1 is connected to the 24V power supply. The internal operating voltage interface VDD of the power chip U1 is connected to the 24V power supply, resistors R1 and R5, diode D1, and inductor L1 to ensure the required operating voltage for the internal components of the power chip. The ground terminal VSS of the power chip U1 is grounded. The voltage feedback pin VFB of the power chip U1 is connected to the output interface CS, resistor R2, inductor L1, resistor R4, and resistor R3 to sense the output voltage of the power conversion module. The CS interface of the power chip U1 is connected to resistor R2, inductor L1, and capacitor EC2, and capacitor EC2 is connected in parallel with the load resistor R6. The aforementioned components can filter and rectify the PWM wave output from the CS port into a stable 5V voltage.

4. The electromagnetic and piezoelectric macro-micro composite control circuit according to claim 1, characterized in that: The MCU microcontroller module is the core of information processing. It can receive, process, and send instructions. VDDA, VDD_1, VDD_2, and VDD_3 of U6 in the MCU microcontroller module are connected to the 5V power conversion module, which supplies power to the MCU microcontroller module. The VSS_2 interface of U6 in the MCU microcontroller module is connected to the host computer through the J1SWD programmer for the host computer to burn programs.

5. The electromagnetic and piezoelectric macro-micro composite control circuit according to claim 1, characterized in that: The first and second RS485 communication modules have the same structure. Both modules can convert full-duplex serial port commands to RS485 half-duplex differential signals. They can also feed back position and speed information to the host computer. The voltage interface VCC of the communication chip U7 in both modules is connected to the 5V voltage of the power conversion module; the ground interface GND of the communication chip U7 is normally grounded; the enable interface RE of the communication chip U7 is connected to 5V, enabling it to receive signals; the RO and DI interfaces of the communication chip U7 are responsible for data transmission and connection to the microcontroller U6 interface, respectively. RXD2 and TXD2; the differential signal output interfaces A and B of the communication chip U7 are externally connected to a peripheral circuit consisting of resistors R34, R35, R36, fuses F1 and F2, and diode T1 to ensure the quality of transmitted signals. The circuit output is ultimately connected to a 485 standard connector; the SHDN of the communication chip U7 is a shutdown interface and is triggered by a low level. Applying a 5V high level will not shut down the communication chip U7; the 5V voltage output from the power conversion module is also connected to resistors R39, R40, R41, and R42 in the first and second RS485 communication modules to drive indicator lights RXD1 and TXD1 to indicate whether there is signal transmission; capacitors C5 and C6 are connected between the 5V voltage source and ground to decouple the power supply voltage.

6. The electromagnetic and piezoelectric macro-micro composite control circuit according to claim 1, characterized in that: The RS232 communication module interacts with the electromagnetic motor driver, driving the electromagnetic motor to operate. The interfaces T1IN and R1OUT of the communication chip U9 in the RS232 communication module are connected to U6 in the MCU microcontroller module. T1OUT and R1IN are connected to the standard interface of the RS232 communication module and are connected to the external electromagnetic motor driver, enabling the transmission of control signals from the MCU microcontroller module to the electromagnetic motor driver. The VDD and VCC interfaces of the communication chip U9 are both connected to the 5V voltage provided by the power conversion module and are connected to capacitors C20 and C21 for power decoupling.

Images