Semiconductor temperature control method, device and semiconductor temperature control apparatus

Abstract

The application relates to the technical field of semiconductor production, in particular to a semiconductor temperature control method, a semiconductor temperature control device and a semiconductor temperature control equipment. The semiconductor temperature control method comprises the following steps: obtaining a return liquid temperature and a set temperature; determining an operation mode of a temperature control equipment based on the return liquid temperature and the set temperature; and controlling working parameters of the temperature control equipment based on the operation mode; wherein the operation mode comprises a proportional control mode and a feedback control mode. When the difference between the return liquid temperature and the set temperature is large, the proportional control mode is used, so that the response speed of the temperature control equipment is effectively improved; when the supply liquid temperature is close to the set temperature, the feedback control mode is only used when the difference between the return liquid temperature and the set temperature is small, so that the integral time is effectively reduced, and the possibility of temperature overshoot of the temperature control equipment in the feedback control mode is avoided or reduced.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing technology, and in particular to a semiconductor temperature control method, apparatus, and semiconductor temperature control equipment. Background Technology

[0002] Integrated circuit manufacturing processes have high temperature requirements, necessitating semiconductor temperature control equipment or systems capable of rapid and accurate temperature adjustment. Currently, most temperature control equipment utilizes closed-loop control with PID (Proportional-Integral-Derivative) controllers. This adjusts the refrigeration system based on the difference between the set temperature and the actual output temperature to meet the load's temperature requirements. However, PID control carries the risk of overshoot, potentially causing the temperature to exceed the set point and resulting in damage to the load and components within the semiconductor temperature control equipment. Summary of the Invention

[0003] This invention provides a semiconductor temperature control method, apparatus, and semiconductor temperature control device to solve the defects of the prior art, which only uses PID control to regulate the temperature of semiconductor temperature control devices, causing the temperature of the input load of the semiconductor temperature control device to exceed the set temperature, affecting the load and the service life of the semiconductor temperature control device. The invention achieves precise control of the temperature of the input load of the semiconductor temperature control device, improves the response speed of the semiconductor temperature control device, and avoids the problem of temperature overshoot.

[0004] The present invention also provides a semiconductor temperature control device.

[0005] The present invention also provides a semiconductor temperature control device.

[0006] A semiconductor temperature control method according to a first aspect of the present invention includes:

[0007] Obtain the return liquid temperature and the set temperature;

[0008] The operating mode of the temperature control device is determined based on the return liquid temperature and the set temperature.

[0009] Based on the operating mode, control the operating parameters of the temperature control device;

[0010] The operating modes include: proportional control mode and feedback control mode.

[0011] According to an embodiment of the present invention, determining the operating mode of the temperature control device based on the return liquid temperature and the set temperature includes:

[0012] The actual control coefficient is determined based on the return liquid temperature and the set temperature.

[0013] The operating mode of the temperature control equipment is determined based on the actual control coefficient and the set control coefficient.

[0014] According to an embodiment of the present invention, determining the operating mode of the temperature control device based on the actual control coefficient and the set control coefficient includes:

[0015] If the actual control coefficient is determined to be greater than or equal to the set control coefficient, the operating mode of the temperature control device is determined to be proportional control mode.

[0016] If the actual control coefficient is determined to be less than the set control coefficient, the operating mode of the temperature control device is determined to be feedback control mode.

[0017] According to an embodiment of the present invention, controlling the operating parameters of the temperature control device based on the operating mode includes:

[0018] The operating mode is determined to be proportional control mode;

[0019] The output power of the temperature control device of the temperature control equipment is determined based on the proportional control method, and the output power of the temperature control device is controlled.

[0020] The operating mode is determined to be feedback control mode;

[0021] The output power of the temperature control device is determined based on the proportional-integral-derivative control method, and the output power of the temperature control device is controlled.

[0022] According to one embodiment of the present invention, the temperature control device includes a refrigeration device and a heating device, and before determining the controller operating mode based on the regenerative parameters and set parameters, it further includes:

[0023] Based on the load conditions, the temperature control device is determined to be either a refrigeration device or a heating device.

[0024] The load conditions include at least two conditions: high temperature and low temperature.

[0025] According to one embodiment of the present invention, in determining the actual control coefficient based on the return liquid temperature and the set temperature:

[0026] The absolute value of the return liquid temperature is negatively correlated with the actual control coefficient;

[0027] The absolute value of the set temperature is positively correlated with the actual control coefficient.

[0028] According to one embodiment of the present invention, the actual control coefficient is:

[0029]

[0030] Where k is the actual control coefficient, SV is the set temperature, and T2 is the return liquid temperature.

[0031] A semiconductor temperature control device according to a second aspect of the present invention includes:

[0032] The acquisition module is used to acquire the return liquid temperature and the set temperature;

[0033] The determination module is used to determine the operating mode of the temperature control device based on the return liquid temperature and the set temperature;

[0034] The control module is used to control the operating parameters of the temperature control device based on the operating mode.

[0035] The operating modes include: proportional control mode and feedback control mode.

[0036] A semiconductor temperature control device according to a third aspect embodiment of the present invention includes:

[0037] Temperature control device, suitable for controlling the temperature of circulating fluid;

[0038] The liquid supply line is suitable for supplying circulating liquid to the load;

[0039] A return line is adapted to receive circulating fluid flowing out of the load;

[0040] The heat exchange pipeline, the liquid supply pipeline, the load, the liquid return pipeline and the heat exchange pipeline are connected in sequence to form a circulation loop;

[0041] The first temperature sensing element is installed in the return liquid pipeline and is suitable for detecting the return liquid temperature.

[0042] The second temperature sensing element is installed in the liquid supply line and is suitable for detecting the liquid supply temperature.

[0043] The controller executes the semiconductor temperature control method described above.

[0044] An electronic device according to a fourth aspect of this application includes a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to implement the semiconductor temperature control method described above.

[0045] According to a fifth aspect of this application, a non-transitory computer-readable storage medium includes a computer program that, when executed by the processor, implements the semiconductor temperature control method described above.

[0046] According to a sixth aspect of this application, the computer program product includes a computer program that, when executed by the processor, implements the semiconductor temperature control method described above.

[0047] This invention provides a semiconductor temperature control method that determines the operating mode based on the relationship between the return liquid temperature and the set temperature, and controls the operating parameters of the temperature control device based on the operating mode. Specifically, when the difference between the return liquid temperature and the set temperature is large, a proportional control mode is used to effectively improve the response speed of the temperature control device, allowing the supply liquid temperature to quickly approach the set temperature. When the supply liquid temperature approaches the set temperature, the difference between the return liquid temperature and the set temperature is small, and the operating mode switches from the proportional control mode to the feedback control mode. In the feedback control mode, integral control and derivative control are introduced to eliminate the steady-state error of the proportional control. Furthermore, the feedback control mode is only used when the difference between the return liquid temperature and the set temperature is small, effectively reducing the integral time and thus avoiding or reducing the possibility of temperature overshoot in the temperature control device under the feedback control mode. Moreover, this application determines the operating mode switching node based on the return liquid temperature and the set temperature. The return liquid temperature lags behind the supply liquid temperature in the temperature control device, and using the return liquid temperature helps to compensate for the lag in temperature regulation, thereby reducing the possibility of overshoot in the temperature control device. Attached Figure Description

[0048] To more clearly illustrate the technical solutions in this invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0049] Figure 1 This is one of the flowcharts of the semiconductor temperature control method provided by the present invention;

[0050] Figure 2 This is a schematic diagram of the semiconductor temperature control device provided by the present invention;

[0051] Figure 3 This is a schematic diagram of the semiconductor temperature control device provided by the present invention;

[0052] Figure 4 This is the second schematic diagram of the semiconductor temperature control method provided by the present invention;

[0053] Figure 5 This is a diagram of the semiconductor temperature control method control scheme provided by the present invention;

[0054] Figure 6 This is a schematic diagram of the structure of the electronic device provided by the present invention.

[0055] Figure label:

[0056] 400. Temperature control device; 410. Refrigeration device; 420. Heating device;

[0057] 510. Liquid supply line; 520. Liquid return line; 530. Heat exchange line; 540. Load;

[0058] 610. First temperature sensor; 620. Second temperature sensor; 630. Controller; 640. Pressure sensor; 650. Flow sensor; 660. Pump body; 670. Replenishment tank;

[0059] 700, Semiconductor temperature control device; 710, Acquisition module; 720, Determination module; 730, Control module. Detailed Implementation

[0060] The embodiments of the present invention will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and should not be construed as limiting the scope of the invention.

[0061] In the description of the embodiments of the present invention, it should be noted that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of the present invention. In addition, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0062] In the description of the embodiments of the present invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of the present invention based on the specific circumstances.

[0063] In embodiments of the present invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0064] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0065] This application provides embodiments of a semiconductor temperature control method. It should be noted that although the logical order is shown in the flowchart, under certain data conditions, the steps shown or described may be performed in a different order than that shown here.

[0066] The following is combined Figures 1 to 5 This application describes the semiconductor temperature control method, apparatus, and semiconductor temperature control device.

[0067] Before introducing the semiconductor temperature control method of the embodiments of this application, the application scenarios of the semiconductor temperature control method are first explained. The semiconductor temperature control method of this application can be applied to smart terminals such as smartphones, tablets and computers connected to semiconductor temperature control devices, as well as servers connected to semiconductor temperature control devices, and controllers 630 of semiconductor temperature control devices. This application does not make any special limitations here, as long as they can carry and implement the semiconductor temperature control method of this application.

[0068] The semiconductor temperature control method of this invention will be described below using a semiconductor temperature control device as an example. For the structure of the semiconductor temperature control device, please refer to [link to relevant documentation]. Figure 3 It includes a liquid supply pipeline 510, a load 540, a liquid return pipeline 520, and a heat exchange pipeline 530 connected in sequence. The temperature control device 400 includes a cooling device 410 and a heating device 420. The cooling device 410 is sleeved on the heat exchange pipeline 530 and is suitable for heat exchange with the circulating liquid in the heat exchange pipeline 530. The heating device 420 is provided on the liquid supply pipeline 510 and is suitable for heating the circulating liquid in the liquid supply pipeline 510. The circulating liquid circulates sequentially in the liquid supply pipeline 510, the load 540, the liquid return pipeline 520, and the heat exchange pipeline 530. The circulating liquid cooled by the cooling device 410 or heated by the heating device 420 flows through the load 540 to control the temperature of the load 540. A first temperature detection element 610 and a second temperature detection element 620 are respectively provided on the liquid return pipeline 520 and the liquid supply pipeline 510 to detect the liquid return temperature and the liquid supply temperature in real time.

[0069] According to the embodiments of the first aspect of this application, such as Figure 1 As shown, the semiconductor temperature control method includes:

[0070] Step 100: Obtain the return liquid temperature and the set temperature.

[0071] Specifically, the return liquid temperature refers to the temperature of the circulating liquid in the return liquid pipeline 520 of the temperature control equipment, and the set temperature refers to the temperature required when the load 540 is working, which is set by the user according to the actual working temperature required by different types of loads 540.

[0072] Understandably, temperature control equipment typically obtains real-time temperature values ​​through temperature sensors, and the controller 630 can determine the return liquid temperature value by acquiring the real-time temperature value from the temperature sensor.

[0073] Step 200: Determine the operating mode of the temperature control device based on the return liquid temperature and the set temperature; the operating modes include: proportional control mode and feedback control mode.

[0074] Specifically, the controller 630 determines the operating mode of the temperature control equipment as either proportional control mode or feedback control mode based on the return liquid temperature and the set temperature. Proportional control mode and feedback control mode correspond to different control methods.

[0075] Step 300: Based on the operating mode, control the operating parameters of the temperature control equipment.

[0076] In one embodiment, the temperature control device adopts a proportional control mode. The controller 630 uses the difference between the temperature of the circulating liquid in the liquid supply line 510 (defined as the liquid supply temperature) and the set temperature as the input parameter of the controller 630. The controller 630 adjusts the output power of the refrigeration device 410 or the heating device 420 in real time based on the change of the input parameter so that the liquid supply temperature approaches the set temperature. In this process, since the temperature control device changes the temperature of the load 540 by cooling or heating the circulating liquid, the temperature adjustment of the load 540 by the temperature control device has a lag. As a result, the proportional control mode will cause the actual operating temperature of the load 540 to fluctuate around the set temperature due to the lag, that is, the problem of temperature overshoot will occur.

[0077] In one embodiment, the temperature control device adopts a feedback control mode. The controller 630 first uses the difference between the liquid supply temperature and the set temperature as the input parameter of the controller 630. When adjusting the output power of the refrigeration device 410 or the heating device 420, integral control and derivative control are introduced on the basis of proportional control, thereby eliminating the steady-state error caused by proportional control. However, since the parameters of proportional control, integral control and derivative control (proportional coefficient, integral time, etc.) are set manually, unreasonable parameter settings can lead to temperature overshoot of the temperature control device. Moreover, if the feedback control mode runs for a long time, the temperature error accumulated by the temperature control device will increase over time, making it more likely to cause temperature overshoot of the temperature control device.

[0078] According to the semiconductor temperature control method of this application, the operating mode is determined based on the relationship between the return liquid temperature and the set temperature, and the operating parameters of the temperature control device are controlled based on the operating mode. Specifically, when the difference between the return liquid temperature and the set temperature is large, a proportional control mode is adopted, which effectively improves the response speed of the temperature control device and makes the supply liquid temperature quickly approach the set temperature. When the supply liquid temperature is close to the set temperature, the difference between the return liquid temperature and the set temperature is small, and the operating mode is switched from the proportional control mode to the feedback control mode. In the feedback control mode, integral control and derivative control are introduced to eliminate the steady-state error of proportional control. Moreover, the feedback control mode is only used when the difference between the return liquid temperature and the set temperature is small, which effectively reduces the integral time and thus avoids or reduces the possibility of temperature overshoot in the temperature control device under the feedback control mode. Furthermore, this application determines the operating mode switching node through the return liquid temperature and the set temperature. The return liquid temperature lags behind the supply liquid temperature in the temperature control device. Using the return liquid temperature helps to compensate for the lag in temperature regulation, thereby reducing the possibility of overshoot in the temperature control device.

[0079] According to one embodiment of the present invention, step 200 includes:

[0080] Step 210: Determine the actual control coefficient based on the return liquid temperature and the set temperature.

[0081] Specifically, the controller 630 receives the detection value from the temperature sensor on the return line 520 and inputs it into the conversion formula along with the temperature set by the user. The result obtained is the actual control coefficient.

[0082] Step 220: Determine the operating mode of the temperature control equipment based on the actual control coefficient and the set control coefficient.

[0083] Specifically, the controller 630 compares the actual control coefficient with the user-preset control coefficient, and selects the operating mode required by the temperature control equipment based on the comparison result. The comparison can be a comparison of magnitudes, or a comparison of their proportional relationship, etc.

[0084] Understandably, for temperature control devices with different lag capabilities (the time span between the temperature change of the temperature control device 400 and the temperature change of the load 540 represents the lag capability of the temperature control device; the longer the time span, the more lag the adjustment of the temperature control device, the greater the overall inertia of the device, and the easier it is to generate temperature overshoot; conversely, the less likely it is to generate overshoot), users adjust the control coefficient based on the adaptability of the temperature control device, thereby changing the switching time node of the corresponding operating mode of different temperature control devices, effectively improving the adaptability of the temperature control method to temperature control devices with different lag capabilities.

[0085] In one embodiment, step 220 includes:

[0086] If the actual control coefficient is greater than or equal to the set control coefficient, the operating mode of the temperature control equipment is determined to be proportional control mode.

[0087] Specifically, the controller 630 compares the actual control coefficient with the set control coefficient and determines that if the actual control coefficient is greater than or equal to the set control coefficient, it means that the temperature difference between the return liquid temperature and the set temperature is large. Since the return liquid temperature is the temperature of the liquid entering the return liquid line 520 after flowing through the load 540 from the supply liquid line 510, the return liquid temperature is positively correlated with the supply liquid temperature. That is, the higher the return liquid temperature, the higher the supply liquid temperature. Therefore, the fact that the actual control coefficient is greater than or equal to the set control coefficient also corresponds to a large temperature difference between the supply liquid temperature and the set temperature.

[0088] At this time, the controller 630 determines that the temperature control device adopts the proportional control mode and uses the proportional control method to quickly adjust the output power of the temperature control device 400, thereby improving the response speed of the temperature control device.

[0089] Taking the temperature control device 400 as the heating device 420 as an example, as the output power of the heating device 420 increases, the supply liquid temperature rises, and then the return liquid temperature rises. The difference between the return liquid temperature and the set temperature gradually decreases, and the corresponding actual control coefficient decreases from being greater than the set control coefficient until it is equal to the set control coefficient. The same principle applies when the temperature control device 400 is the cooling device 410.

[0090] In one embodiment, step 220 further includes:

[0091] If the actual control coefficient is determined to be less than the set control coefficient, the operating mode of the temperature control equipment is determined to be feedback control mode.

[0092] Specifically, the controller 630 compares the actual control coefficient with the set control coefficient and determines that if the actual control coefficient is less than the set control coefficient, it means that the temperature difference between the return liquid temperature and the set temperature is large, which, combined with the above, means that the temperature difference between the supply liquid temperature and the set temperature is small.

[0093] At this time, the controller 630 determines that the temperature control equipment adopts the feedback regulation mode. In the feedback control mode, integral control and derivative control are introduced on the basis of proportional control, thereby eliminating the steady-state error of proportional control. The feedback control mode is only used when the difference between the return liquid temperature and the set temperature is small, which effectively reduces the integral time and thus avoids or reduces the possibility of temperature overshoot in the temperature control equipment under the feedback control mode.

[0094] According to one embodiment of the present invention, step 300 includes:

[0095] Step 310: Determine the operating mode as proportional control mode.

[0096] Step 320: Determine the output power of the temperature control device 400 of the temperature control equipment based on the proportional control method, and control the output power of the temperature control device 400.

[0097] Specifically, the controller 630 determines that the temperature control equipment operates in a proportional control mode. The output power of the temperature control device 400 is proportional to the difference between the supply temperature and the set temperature. That is, as the output time of the temperature control device 400 increases, the temperature difference between the supply temperature and the set temperature decreases, and the output power of the temperature control device 400 decreases accordingly. The closer the supply temperature is to the set temperature, the closer the power of the temperature control device 400 is to zero. When the power of the temperature control device 400 is zero, the supply temperature drops accordingly, and a difference is generated between the supply temperature and the set temperature. As a result, the power of the temperature control device 400 increases. Due to the aforementioned lag of the temperature control equipment, the supply temperature fluctuates around the set temperature.

[0098] Taking temperature control as an example, if the set temperature is 200 degrees, when using the proportional control method, if the proportional coefficient (the coefficient used to multiply the difference between the supply temperature and the set temperature to obtain the output power of the temperature controller 400) is selected to be relatively large, then when the supply temperature reaches 200 degrees, the output of the temperature controller 400 will be 0, and the temperature will continue to rise uncontrollably, for example, to 230 degrees. When the temperature exceeds 200 degrees too much, it will start to fall back. Although the output of the temperature controller 400 will start to heat at this time, the temperature will still fall to a certain temperature before it stops falling and starts to rise again, for example, to 170 degrees. Finally, the temperature will stabilize within a certain range and oscillate, thus causing the overshoot problem.

[0099] In one embodiment, step 300 further includes:

[0100] Step 330: Determine the operating mode as feedback control mode.

[0101] Step 340: Determine the output power of the temperature control device 400 based on the proportional-integral-derivative control method, and control the output power of the temperature control device 400.

[0102] Specifically, the controller 630 determines that the temperature control equipment operates in feedback control mode. The output power of the temperature control device 400 adopts proportional control while also introducing integral control and derivative control, thereby eliminating the steady-state error generated by the proportional control method. Furthermore, the feedback control mode is only used when the difference between the return liquid temperature and the set temperature is small, which effectively reduces the integral time and thus avoids or reduces the possibility of temperature overshoot in the temperature control equipment under the feedback control mode.

[0103] According to one embodiment of the present invention, the method further includes the following step before step 100:

[0104] Based on the load condition 540, the temperature control device 400 is determined to be either the refrigeration device 410 or the heating device 420; wherein the load condition 540 includes at least: high temperature condition and low temperature condition.

[0105] Specifically, for load 540 under different operating conditions (such as high temperature or low temperature), the temperature control device is initially turned on at room temperature (e.g., 25 degrees Celsius). If load 540 needs to operate under high temperature conditions, the required liquid supply temperature is higher than the room temperature. The controller 630 selects the temperature control device 400 as the heating device 420, which heats the circulating liquid to increase the liquid supply temperature. Similarly, when load 540 is under low temperature conditions, the cooling device 410 is activated accordingly.

[0106] In this embodiment, high temperature and low temperature are relative concepts. That is, the working temperature required by the load 540 is relative to the temperature of the internal circulating fluid when the temperature control device is at room temperature. The working temperature is greater than the temperature of the circulating fluid flowing through the load 540 at room temperature.

[0107] Of course, the selection of temperature control device 400 can also be based on the current temperature of the circulating fluid reaching the user's desired set temperature. For example, if the current load 540 of the temperature control device is in a low-temperature condition and the user wants to adjust the temperature control device from a low temperature to a normal temperature, then the cooling device 410 is turned off and the heating device 420 is turned on to raise the temperature of the circulating fluid to the user's desired set temperature.

[0108] According to an embodiment of the present invention, in step 200:

[0109] The absolute value of the return liquid temperature is negatively correlated with the actual control coefficient.

[0110] The absolute value of the set temperature is positively correlated with the actual control coefficient.

[0111] Specifically, the higher or lower the actual return temperature (compared to the set temperature), the larger the absolute value, indicating that the return temperature is closer to the set temperature and the smaller the actual control coefficient. Feedback control mode is required to prevent overshoot of the temperature control device. Conversely, the higher or lower the set temperature (compared to the return temperature), the larger the absolute value, indicating that the set temperature is further away from the return temperature and the larger the actual control coefficient. Proportional control mode is required to improve the response and adjustment speed of the temperature control device.

[0112] In one embodiment, the actual control factor is:

[0113]

[0114] Where k is the actual control coefficient, SV is the set temperature, and T2 is the return liquid temperature.

[0115] In this embodiment, the user-set control coefficient is 0.1, meaning that the temperature control device switches its operating mode when the actual control coefficient k is 0.1. According to the formula, when k = 0.1, the return liquid temperature T2 is 90% of the set temperature SV, leaving a 10% temperature adjustment margin for the feedback control mode. This shortens the running time of the feedback control mode, effectively reducing the integral time of integral control and the derivative time of derivative control, thus avoiding or reducing the possibility of temperature overshoot in the temperature control device under feedback control mode. Of course, the set control coefficient can be adjusted by the user according to actual conditions to reduce the possibility of temperature overshoot in the temperature control device.

[0116] A semiconductor temperature control device 700 according to a second aspect embodiment of the present invention includes:

[0117] The acquisition module 710 is used to acquire the return liquid temperature and the set temperature;

[0118] The determination module 720 is used to determine the operating mode of the temperature control equipment based on the return liquid temperature and the set temperature;

[0119] The control module 730 is used to control the operating parameters of the temperature control equipment based on the operating mode;

[0120] The operating modes include: proportional control mode and feedback control mode.

[0121] According to a third aspect of the present invention, a semiconductor temperature control device includes: a temperature control device 400, a liquid supply line 510, a liquid return line 520, a heat exchange line 530, a first temperature sensor 610, a second temperature sensor 620, and a controller 630. The temperature control device 400 is adapted to control the temperature of the circulating liquid; the liquid supply line 510 is adapted to supply circulating liquid to a load 540; the liquid return line 520 is adapted to receive circulating liquid flowing out of the load 540; the liquid supply line 510, the load 540, the liquid return line 520, and the heat exchange line 530 are sequentially connected to form a circulation loop; the first temperature sensor 610 is disposed in the liquid return line 520 and is adapted to detect the temperature of the returned liquid; the second temperature sensor 620 is disposed in the liquid supply line 510 and is adapted to detect the temperature of the supplied liquid; the controller 630 executes the semiconductor temperature control method as described in the above embodiment.

[0122] In this embodiment, the semiconductor temperature control device further includes: a pressure detection element 640 and a flow detection element 650 disposed in the liquid supply pipeline 510; a pump body 660 disposed between the return liquid pipeline 520 and the heat exchange pipeline 530, which is suitable for traction of circulating liquid flow; and a replenishment tank 670 connected to the return liquid pipeline 520, which is suitable for replenishing circulating liquid.

[0123] Figure 6 An example is a schematic diagram of the physical structure of an electronic device, such as... Figure 6 As shown, the electronic device may include: a processor 810, a communication interface 820, a memory 830, and a communication bus 840, wherein the processor 810, the communication interface 820, and the memory 830 communicate with each other via the communication bus 840. The processor 810 can call logic instructions in the memory 830 to execute a semiconductor temperature control method, including:

[0124] Obtain the return liquid temperature and the set temperature;

[0125] The operating mode of the temperature control equipment is determined based on the return liquid temperature and the set temperature.

[0126] Based on the operating mode, control the working parameters of the temperature control equipment;

[0127] The operating modes include: proportional control mode and feedback control mode.

[0128] Furthermore, the logical instructions in the aforementioned memory 830 can be implemented as software functional units and, when sold or used as independent products, can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, in essence, or the part that contributes to the prior art, or a part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods of the various embodiments of the present invention. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0129] On the other hand, the present invention also provides a computer program product, which includes a computer program that can be stored on a non-transitory computer-readable storage medium. When the computer program is executed by a processor, the computer is able to perform the semiconductor temperature control method provided by the above methods, including:

[0130] Obtain the return liquid temperature and the set temperature;

[0131] The operating mode of the temperature control equipment is determined based on the return liquid temperature and the set temperature.

[0132] Based on the operating mode, control the working parameters of the temperature control equipment;

[0133] The operating modes include: proportional control mode and feedback control mode.

[0134] In another aspect, the present invention also provides a non-transitory computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, is implemented to perform the semiconductor temperature control method provided by the methods described above, including:

[0135] Obtain the return liquid temperature and the set temperature;

[0136] The operating mode of the temperature control equipment is determined based on the return liquid temperature and the set temperature.

[0137] Based on the operating mode, control the working parameters of the temperature control equipment;

[0138] The operating modes include: proportional control mode and feedback control mode.

[0139] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate, and the components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs. Those skilled in the art can understand and implement this without any creative effort.

[0140] Through the above description of the embodiments, those skilled in the art can clearly understand that each embodiment can be implemented by means of software plus necessary general-purpose hardware platforms, and of course, it can also be implemented by hardware. Based on this understanding, the above technical solutions, in essence or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product can be stored in a computer-readable storage medium, such as ROM / RAM, magnetic disk, optical disk, etc., including several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute the methods of various embodiments or some parts of embodiments.

[0141] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A semiconductor temperature control method, characterized in that, include: Obtain the return liquid temperature and the set temperature; The actual control coefficient is determined based on the return liquid temperature and the set temperature. Based on the actual control coefficients and the set control coefficients, the operating mode of the temperature control equipment is determined; Based on the operating mode, control the operating parameters of the temperature control device; The operating modes include: proportional control mode and feedback control mode; The actual control coefficient is: ； Where k is the actual control coefficient, SV is the set temperature, and T2 is the return liquid temperature.

2. The semiconductor temperature control method according to claim 1, characterized in that, The process of determining the operating mode of the temperature control equipment based on the actual control coefficient and the set control coefficient includes: If the actual control coefficient is determined to be greater than or equal to the set control coefficient, the operating mode of the temperature control device is determined to be proportional control mode. If the actual control coefficient is determined to be less than the set control coefficient, the operating mode of the temperature control device is determined to be feedback control mode.

3. The semiconductor temperature control method according to claim 2, characterized in that, The control of the operating parameters of the temperature control device based on the operating mode includes: The operating mode is determined to be proportional control mode; The output power of the temperature control device (400) of the temperature control equipment is determined based on the proportional control method, and the output power of the temperature control device (400) is controlled. The operating mode is determined to be feedback control mode; The output power of the temperature control device (400) is determined based on the proportional-integral-derivative control method, and the output power of the temperature control device (400) is controlled.

4. The semiconductor temperature control method according to claim 3, characterized in that, The temperature control device (400) includes a refrigeration device (410) and a heating device (420). Before determining the operating mode of the controller (630) based on the regenerative parameters and set parameters, it also includes: Based on the load (540) operating condition, the temperature control device (400) is determined to be either a refrigeration device (410) or a heating device (420); The load (540) operating conditions include at least: high temperature operating conditions and low temperature operating conditions.

5. A semiconductor temperature control device, characterized in that, include: The acquisition module (710) is used to acquire the return liquid temperature and the set temperature; The determining module (720) is used to determine the actual control coefficient based on the return liquid temperature and the set temperature; Based on the actual control coefficients and the set control coefficients, the operating mode of the temperature control equipment is determined; The control module (730) is used to control the operating parameters of the temperature control device based on the operating mode; The operating modes include: proportional control mode and feedback control mode; The actual control coefficient is: ； Where k is the actual control coefficient, SV is the set temperature, and T2 is the return liquid temperature.

6. A semiconductor temperature control device, characterized in that, include: Temperature control device (400), suitable for controlling the temperature of circulating fluid; A liquid supply line (510) is adapted to supply circulating liquid to a load (540); The return line (520) is adapted to receive circulating fluid flowing out of the load (540); The heat exchange pipeline (530) is connected in sequence to form a circulation loop, consisting of the liquid supply pipeline (510), the load (540), the liquid return pipeline (520), and the heat exchange pipeline (530). The first temperature sensing element (610) is installed in the return liquid line (520) and is suitable for detecting the return liquid temperature; The second temperature sensing element (620) is installed in the liquid supply line (510) and is suitable for detecting the liquid supply temperature; The controller (630) performs the semiconductor temperature control method as described in any one of claims 1 to 4.

7. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that, When the processor executes the program, it implements the semiconductor temperature control method as described in any one of claims 1 to 4.

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