Chip pin measurement method and device based on adaptive measurement rectangular frame

Abstract

The present invention discloses a chip pin measurement method and device based on an adaptive rectangular frame, wherein the method includes: obtaining an image of the chip to be measured; based on the obtained image of the chip to be measured, determining a first region of interest and solving the minimum bounding rectangle of the first region of interest; calculating the four corner points of the minimum bounding rectangle and sequentially sorting the four corner points, wherein the pins on any side of the first region of interest correspond to two of the sorted four corner points; selecting all target pins on any side of the first region of interest, and drawing an adaptive measurement rectangular frame for the target pins based on the positions of the two corner points corresponding to the target pins and the reference parameter values ​​of the target pins; based on the adaptive measurement rectangular frame, determining a second region of interest and solving the pin edges within the second region of interest; and obtaining data of the target pins based on the pin edges. This method can reduce measurement difficulty, reduce calculation complexity, and improve the reliability and stability of measurement results.

Description

Technical Field

[0001] The present invention relates to the technical field of chip detection, and in particular to a chip pin measurement method and device based on an adaptive measurement rectangular frame. Background Art

[0002] After chip packaging, the finished chip needs to undergo electrical performance and appearance testing, especially for chips packaged in quad flat package (QFP) technology. Chips encapsulated with this technology have very small pins, with pin counts typically exceeding 100. In the past, measuring the pins of QFP chips required a significant amount of manpower, resulting in high labor costs and uncertainties in the accuracy of the test data. With the advancement of industrial technology, image processing has gained increasing adoption, but this method requires multiple fitting steps, resulting in a large and cumbersome computational effort. Summary of the Invention

[0003] The technical problem to be solved by the embodiments of the present invention is to provide a chip pin measurement method and device based on an adaptive measurement rectangular frame, which can reduce the measurement difficulty, reduce the calculation amount, and improve the reliability and stability of the measurement results.

[0004] In order to solve the above technical problems, the present invention provides a chip pin measurement method based on an adaptive measurement rectangular frame, comprising:

[0005] Acquire a picture of a chip to be measured, wherein the chip to be measured includes a chip body and pins around the chip body;

[0006] Determine a first region of interest based on the acquired image of the chip to be measured, and solve a minimum circumscribed rectangle of the first region of interest;

[0007] Calculating four corner points of the minimum circumscribed rectangle and sequentially sorting the four corner points, wherein the pins on any side of the first region of interest correspond to two of the sorted four corner points respectively;

[0008] Selecting all target pins on any side of the first region of interest, and drawing an adaptive measurement rectangle for the target pins based on the positions of two corner points corresponding to the target pins and the reference parameter values ​​of the target pins;

[0009] Determining a second region of interest based on the adaptive measurement rectangular frame, and obtaining a pin edge within the second region of interest;

[0010] Based on the pin edge, data of the target pin is obtained.

[0011] In a feasible implementation, the step of drawing the adaptive measurement rectangular frame of the detection area based on the positions of the two corner points corresponding to the target pin and the reference parameter value of the target pin includes:

[0012] Taking the two corner points corresponding to the target pin as references, the two corner points are respectively translated along the first direction by a certain offset amount to obtain two first offset points;

[0013] A line with the two first offset points as endpoints serves as a center line of the adaptive measurement rectangular frame;

[0014] Using a preset first threshold as the width of the adaptive measurement rectangular frame;

[0015] The adaptive measurement rectangle is drawn according to the center line and the width.

[0016] In a feasible implementation, the first direction is from the two corner points along two sides of the minimum circumscribed rectangle that pass through the two corner points and are parallel to each other and point to the other two corner points of the minimum circumscribed rectangle.

[0017] In a feasible implementation, the offset is half of the reference length L of the target pin.

[0018] In a feasible implementation, the preset first threshold is less than half of the reference length L of the target pin.

[0019] In a feasible implementation, after obtaining the image of the chip to be measured, the following steps are included:

[0020] Converting the obtained image of the chip to be measured into a grayscale image;

[0021] Reading reference parameter values ​​of the pins, the reference parameter values ​​including a reference width W of the pins, a reference length L of the pins, and a spacing P between adjacent pins;

[0022] Threshold segmentation is performed on the grayscale image, and disconnected areas in the grayscale image are filled to obtain the first region of interest.

[0023] In a feasible implementation, the step of sequentially sorting the four corner points includes:

[0024] Based on the four corner points of the minimum circumscribed rectangle, according to the judgment formula A(X)<C(X), A(Y)<C(Y), the four corner points are sorted clockwise and recorded as corner point A, corner point B, corner point C and corner point D.

[0025] In a feasible implementation, the step of determining a second region of interest based on the adaptive measurement rectangular frame and obtaining a pin edge within the second region of interest includes:

[0026] intercepting the adaptive measurement rectangular frame and the pin portion within the adaptive measurement rectangular frame, and amplifying them by bilinear interpolation to obtain the second region of interest;

[0027] Solving the intersection point between the adaptive measurement rectangular frame and the pin portion;

[0028] The extreme value method is used to connect the corresponding intersection points to obtain the pin edge.

[0029] In a feasible implementation, the step of acquiring the data of the target pin based on the pin edge includes:

[0030] Traversing the pin edges within the second region of interest, where each two adjacent pin edges form an edge pair, and calculating the distance between the two edges in the edge pair and the distance between adjacent edge pairs;

[0031] Determine whether the distance between the two edges in the edge pair exceeds a preset reference value W±2 / 3P; if so, abandon the edge pair and set the distance between the two edges in the edge pair to zero;

[0032] The data is stored, and the distance between the two edges in the edge pair is recorded as the width of the pin, and the distance between the adjacent edge pairs is recorded as the distance between each two adjacent pins.

[0033] A second aspect of the present application provides a chip pin measurement device based on an adaptive measurement rectangular frame, comprising:

[0034] An acquisition module is used to acquire an image of a chip to be measured, wherein the chip to be measured includes a chip body and pins around the chip body;

[0035] A first processing module is configured to determine a first region of interest based on an acquired image of the chip to be measured, and to solve a minimum bounding rectangle of the first region of interest;

[0036] a calculation module, configured to calculate four corner points of the minimum circumscribed rectangle and sequentially sort the four corner points, wherein the pins on any side of the first region of interest correspond to two of the sorted four corner points;

[0037] An adaptive measurement rectangular frame forming module is used to select a target pin and draw an adaptive measurement rectangular frame of the target pin based on the positions of two corner points corresponding to the target pin and the reference parameter value of the target pin;

[0038] A second processing module, configured to determine a second region of interest based on the adaptive measurement rectangular frame, and obtain a pin edge within the second region of interest;

[0039] A determination module is configured to obtain data of the target pin based on the pin edge.

[0040] The implementation of the present invention has the following beneficial effects:

[0041] The present application provides a chip pin method and device based on an adaptive measurement rectangular frame. By performing correlation processing on the acquired image of the chip to be measured, the minimum enclosing rectangle of the first area of ​​interest is determined and obtained, and the four corner points of the minimum enclosing rectangle are calculated and sorted, so that the pins on any side of the first area of ​​interest correspond to the corresponding two corner points respectively. The target pin and the corresponding two corner points can be quickly found during calculation, and based on the corresponding two corner points and the reference parameter values ​​of the target pin, an adaptive measurement rectangular frame is drawn, and the pin edge is obtained based on the adaptive measurement rectangular frame and the relevant data of the target pin is obtained. The chip pin is measured by the adaptive measurement rectangular frame. While ensuring measurement accuracy, it can adapt to the rotation of the chip to be measured, reduce data fitting, reduce the amount of calculation, and improve the reliability and stability of the measurement results.

[0042] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] The drawings herein are incorporated into and constitute a part of the specification, illustrate embodiments consistent with the present application, and together with the specification are used to explain the principles of the present application, and do not constitute an improper limitation on the present application.

[0044] Figure 1 1 is a flow chart of a chip pin method based on an adaptive rectangular frame measurement provided by one embodiment of the present invention;

[0045] Figure 2 is a schematic diagram of corresponding pins on any one side of the first region of interest to two of the sorted four corner points in one embodiment of the present invention;

[0046] Figure 3 、 6 , 7, and 8 are Figure 1 A flowchart of the specific implementation process of one of the steps;

[0047] Figure 4 is a schematic diagram of drawing a center line of an adaptive measurement rectangular frame in one embodiment of the present invention;

[0048] Figure 5 is a schematic diagram of drawing an adaptive measurement rectangular frame in one embodiment of the present invention;

[0049] Figure 9 It is a module schematic diagram of the chip pin device based on the adaptive measurement rectangular frame provided by the present invention.

[0050] Reference numerals: 1 - first-circle side pin, 2 - second-circle side pin, 3 - third-circle side pin, 4 - fourth-circle side pin. DETAILED DESCRIPTION

[0051] To make the above-mentioned objects, features, and advantages of the present invention more readily apparent, specific embodiments of the present invention are described in detail below with reference to the accompanying drawings. The following description sets forth numerous specific details to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways than those described herein, and those skilled in the art may make similar modifications without departing from the scope of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0052] It should be noted that the terms "first," "second," and the like in the specification and claims of the present disclosure and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or precedence. It should be understood that the numbers used in this manner are interchangeable where appropriate so that the embodiments of the present disclosure described herein can be implemented in an order other than those illustrated or described herein. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present disclosure. Instead, they are merely examples of apparatus and methods consistent with certain aspects of the present disclosure as detailed in the appended claims.

[0053] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this invention pertains. The terms used in this specification of the present invention are for the purpose of describing specific embodiments only and are not intended to limit the present invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0054] See also Figure 1 , is a flow chart of a chip pin measurement method based on an adaptive measurement rectangle provided in an embodiment of the present application. The method steps defined in the process related to the chip pin measurement method can be implemented by an electronic device with image processing and analysis functions. Figure 1 The specific process shown is described in detail.

[0055] S101 . Obtain a picture of a chip to be measured, where the chip to be measured includes a chip body and pins around the chip body.

[0056] S102 : Determine a first region of interest based on the acquired image of the chip to be measured, and solve a minimum bounding rectangle of the first region of interest.

[0057] S103 , calculating the four corner points of the minimum circumscribed rectangle and sequentially sorting the four corner points, wherein the pins on any side of the first interest region correspond to two of the sorted four corner points respectively.

[0058] S104 , selecting all target pins on any circumference of the first region of interest, and drawing an adaptive measurement rectangle of the target pins based on the positions of the two corner points corresponding to the target pins and the reference parameter values ​​of the target pins.

[0059] S105 : Determine a second region of interest based on the adaptive measurement rectangle, and obtain the edge of the pin within the second region of interest.

[0060] S106 : Acquire target pin data based on the pin edge.

[0061] In this embodiment, an image acquisition device can be used to capture an image of the chip to be measured. The image acquisition device can include a CMOS industrial area array camera. Furthermore, to improve the quality of the captured images, the image acquisition device can also include devices such as a three-color spherical light source and a camera mount. The chip to be measured can be any chip or any number of chips that constitute an integrated circuit. The chip to be measured includes a chip body and multiple pins. Multiple pins can be connected to each side of the chip body, such as the left, right, top, and bottom sides. Alternatively, multiple pins can be connected only to the left and right sides of the chip body. The orientation of the chip to be measured may be correct or incorrect. In this embodiment, the chip to be measured does not need to be rotated. It is only necessary to determine the first region of interest based on the image of the chip to be measured. The first region of interest here only includes the information of the chip body and the pins around the chip body, without the background area in the image of the chip to be measured. The outer edge of the first region of interest can be fitted by the minimum bounding rectangle fitting method, the minimum bounding rectangle of the first region of interest is solved, the four corner points of the minimum bounding rectangle are calculated and the four corner points are sorted in sequence. Here, the pins on any side of the first region of interest are respectively matched with two of the four sorted corner points, such as Figure 2As shown, after sorting the four corner points, four corner points A, B, C and D are obtained respectively, among which corner points A and B correspond to the first-circle side pin 1, corner points B and C correspond to the second-circle side pin 2, corner points C and D correspond to the third-circle side pin 3, and corner points A and D correspond to the fourth-circle side pin 4. When the fourth-circle side pin 4 is selected as the target pin, the adaptive measurement rectangle of the fourth-circle side pin 4 can be drawn according to the positions of corner points A and D and the reference parameter values ​​of the fourth-circle side pin 4, and based on the adaptive measurement rectangle of the fourth-circle side pin 4, the data of the fourth-circle side pin 4 can be obtained, wherein the data includes the pin width and the pin spacing, etc.

[0062] In one possible implementation, Figure 3 As shown, based on the positions of the two corner points corresponding to the target pin and the reference parameter value of the target pin, the steps of drawing the adaptive measurement rectangular frame of the detection area include:

[0063] S301 , taking two corner points corresponding to the target pin as references, and translating the two corner points along a first direction by a certain offset amount to obtain two first offset points.

[0064] S303 : A line with two first offset points as endpoints is used as a center line of the adaptive measurement rectangle.

[0065] S305: Use a preset first threshold as the width of the adaptively measured rectangular frame.

[0066] S307 , drawing an adaptive measurement rectangle according to the center line and the width.

[0067] In a possible implementation, the first direction is from two corner points along two parallel sides of the minimum circumscribed rectangle that pass through the two corner points and point to the other two corner points of the minimum circumscribed rectangle. Figure 2 and 4 As shown, taking the fourth peripheral pin 4 as the target pin as an example, the corner point A is translated along the AB side of the first circumscribed rectangle by a certain offset, and the corner point D is translated along the DC side of the first circumscribed rectangle by a certain offset, wherein the direction from the corner point A along the AB side to the corner point B and the direction from the corner point D along the DC side to the corner point C are the first directions, and the A' offset point and the D' offset point are obtained respectively. The line connecting the A' offset point and the D' offset point is used as the center line of the adaptive measurement rectangular frame of the fourth peripheral pin 4, the preset first threshold is used as the width of the adaptive measurement rectangular frame, and the adaptive measurement rectangular frame is drawn according to the center line and the width, as shown in FIG. Figure 5As shown. Similarly, when the first peripheral side pin 1 is the target pin, the corner points A and B are translated along the AD side and the BC side to the corner points D and C respectively by a certain offset, wherein the direction from the corner point A along the AD side to the corner point D and the direction from the corner point B along the BC side to the corner point C is the first direction. Similarly, the specific steps of taking the second peripheral side pin 2 as the target pin and the third peripheral side pin 3 as the target pin are not repeated. In one possible implementation, the offset is half of the reference length L of the target pin, which can make the center line of the adaptive measurement rectangle as close as possible to the middle of the target pin, thereby improving the accuracy of the actual detection data of the target pin. It should be noted here that because the minimum bounding rectangle obtained may be slightly larger or slightly smaller than the actual minimum bounding rectangle of the first area of ​​interest, when the offset is selected as half of the reference length L of the target pin, it is impossible to ensure that the center line of the adaptive measurement rectangle is located in the middle of the target pin. Therefore, in actual operation, the appropriate offset can be selected according to the actual size relationship between the minimum bounding rectangle and the first area of ​​interest. In one possible implementation, the preset first threshold is less than half of the reference length L of the target pin. Similarly, the adaptive measurement rectangle can be located in the middle of the target pin as much as possible, thereby improving the accuracy of the actual detection data of the target pin, reducing computing memory, and speeding up the calculation speed.

[0068] In one possible implementation, Figure 6 As shown, after obtaining the image of the chip to be measured (i.e. S601), the following steps are included:

[0069] S603: Convert the acquired image of the chip to be measured into a grayscale image.

[0070] S605 : Read reference parameter values ​​of the pins, where the reference parameter values ​​include a reference width W of the pins, a reference length L of the pins, and a spacing P between adjacent pins.

[0071] S607 , performing threshold segmentation on the grayscale image and filling in disconnected areas in the grayscale image to obtain a first region of interest.

[0072] In this embodiment, the image of the chip to be measured obtained includes information about the chip body and the pins around the chip body, as well as information about the background area in the image of the chip to be measured. The grayscale image similarly includes information about the chip body, the pins around the chip body, and the background area in the image of the chip to be measured. After the image is grayscale converted, the reference parameter values ​​of the pins are read and saved. When the reference parameter values ​​of the pins are needed, they can be called and threshold segmentation can be performed on the grayscale image. The Otsu image segmentation method can be used to implement threshold segmentation of the grayscale image. For the threshold segmentation processing of the grayscale image, a threshold can be set. The pixel values ​​of the pixels in the grayscale image with grayscale values ​​greater than the threshold can be set to 255, otherwise the pixel values ​​of the pixels are set to 0. Through the threshold segmentation processing, the foreground of the grayscale image can be extracted from the background, and then the disconnected areas are filled to obtain the first region of interest.

[0073] In a possible implementation, the step of sequentially sorting the four corner points includes:

[0074] Based on the four corner points of the minimum circumscribed rectangle, according to the judgment formula A(X) < C(X), A(Y) < C(Y), the four corner points are sorted clockwise and recorded as corner points A, B, C, and D. This sorting of the four corner points allows for quick selection of the corresponding corner point when testing target pins on any side of the chip body. Based on the corner point, an adaptive measurement rectangle is drawn to the target pin, which improves pin inspection speed.

[0075] In one possible implementation, Figure 7 As shown, the steps of determining the second region of interest based on the adaptive measurement rectangular frame and obtaining the pin edge within the second region of interest include:

[0076] S701 , intercepting the adaptive measurement rectangular frame and the pin portion within the adaptive measurement rectangular frame, and amplifying them by bilinear interpolation to obtain a second region of interest.

[0077] S703 , finding the intersection of the adaptive measurement rectangle and the pin portion.

[0078] S705. Use the extreme value method to connect the corresponding intersection points to obtain the pin edge.

[0079] The bilinear interpolation method can make the image quality of the second area of ​​interest higher, improve the clarity, and avoid discontinuous pixel values. Then, the intersection of the pin part and the adaptive measurement rectangle is solved. Because the intersection is actually composed of many pixels, the position of the pixel with the strongest grayscale is calculated, and the corresponding pixels are connected to obtain a clear pin edge, thereby improving the measurement accuracy.

[0080] In one possible implementation, Figure 8 As shown, the steps of obtaining data of a target pin based on the pin edge include:

[0081] S801 , traverse the pin edges in the second region of interest, where each two adjacent pin edges form an edge pair, and calculate the distance between the two edges in the edge pair and the distance between adjacent edge pairs.

[0082] S803: Determine whether the distance between the two edges in the edge pair exceeds a preset reference value W±2 / 3P. If so, abandon the edge pair and set the distance between the two edges in the edge pair to zero.

[0083] S805 , storing the data, recording the distance between two edges in an edge pair as the width of the pin, and recording the distance between adjacent edge pairs as the distance between every two adjacent pins.

[0084] The traversal order can be from top to bottom or from bottom to top. Two adjacent pin edges are formed into an edge pair. When the distance between the two edges in the edge pair is not within the reference value W±2 / 3P, it means that the two edges in the edge pair are unqualified, so the distance between the two edges in the edge pair is set to zero. If the distance between the two edges in the edge pair is within the reference value W±2 / 3P, it means that the two edges in the edge pair are qualified. Finally, the data of the distances between all edges are summarized to obtain the data of the target pin actually measured.

[0085] In one embodiment of the present invention, Figure 9 As shown, a chip pin measurement device based on an adaptive measurement rectangular frame is also provided, comprising:

[0086] The acquisition module 901 is used to acquire an image of a chip to be measured, where the chip to be measured includes a chip body and pins around the chip body.

[0087] It can be understood that the acquisition module 901 can be used to execute the above step S101. For the detailed implementation of the acquisition module 901, reference can be made to the above content related to step S101.

[0088] The first processing module 902 is configured to determine a first region of interest based on the acquired image of the chip to be measured, and to solve a minimum bounding rectangle of the first region of interest.

[0089] It can be understood that the first processing module 902 can be used to perform the above step S102. For the detailed implementation of the first processing module 902, reference can be made to the above content related to step S102.

[0090] The calculation module 903 is used to calculate the four corner points of the minimum circumscribed rectangle and sort the four corner points in sequence. The pins on any side of the first interest area correspond to two of the four sorted corner points.

[0091] It can be understood that the calculation module 903 can be used to perform the above step S103. For the detailed implementation of the calculation module 903, reference can be made to the above content related to step S103.

[0092] The adaptive measurement rectangle forming module 904 is used to select a target pin and draw an adaptive measurement rectangle of the target pin based on the positions of two corner points corresponding to the target pin and the reference parameter value of the target pin.

[0093] It can be understood that the adaptive measurement rectangular frame forming module 904 can be used to perform the above step S104. For the detailed implementation of the adaptive measurement rectangular frame forming module 904, reference can be made to the above content related to step S104.

[0094] The second processing module 905 is configured to determine a second region of interest based on the adaptive measurement rectangle, and obtain a pin edge within the second region of interest.

[0095] It can be understood that the second processing module 905 can be used to perform the above step S105. For the detailed implementation of the second processing module 905, reference can be made to the above content related to step S105.

[0096] The determination module 906 is configured to obtain data of a target pin based on the pin edge.

[0097] It can be understood that the determination module 906 can be used to execute the above step S106. For the detailed implementation of the determination module 906, reference can be made to the above content related to step S106.

[0098] For descriptions of the processing flow of each module in the device and the interaction flow between each module, reference can be made to the relevant descriptions in the above method embodiment, which will not be described in detail here.

[0099] Furthermore, an embodiment of the present application also provides a computer-readable storage medium, which stores machine-executable instructions. When the machine-executable instructions are executed, the chip pin measurement method provided in the above embodiment is implemented. Specifically, the computer-readable storage medium can be a general-purpose storage medium, such as a mobile disk, hard disk, etc. When the computer program on the computer-readable storage medium is executed, the above chip pin measurement method can be executed. Regarding the processes involved when the computer-readable storage medium and its executable instructions are executed, reference can be made to the relevant description in the above method embodiment, and no further details will be given here.

[0100] Other embodiments of the present disclosure will readily occur to those skilled in the art after considering the specification and practicing the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the present disclosure that follow the general principles of the present disclosure and include common knowledge or customary techniques in the art not disclosed herein. The description and examples are to be considered as exemplary only, with the true scope and spirit of the present disclosure being indicated by the following claims.

[0101] It should be understood that the present disclosure is not limited to the exact structures that have been described above and shown in the drawings, and that various modifications and changes can be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. A chip pin measurement method based on an adaptive measurement rectangle, characterized in that: include: Obtaining a picture of the chip to be measured, where the chip to be measured includes the chip body and pins around the chip body; Determine a first region of interest based on the acquired image of the chip to be measured, and solve a minimum circumscribed rectangle of the first region of interest; Calculate the four corner points of the minimum circumscribed rectangle and sort the four corner points in sequence, so that the pins on any side of the first area of ​​interest correspond to two of the four sorted corner points respectively; All target pins on any side of the first region of interest are selected, and two corner points corresponding to the target pins are used as references. The two corner points are respectively translated along the first direction by a certain offset amount to obtain two first offset points. The line with the two first offset points as endpoints is used as the center line of the adaptive measurement rectangular frame. The preset first threshold is used as the width of the adaptive measurement rectangular frame. The adaptive measurement rectangular frame is drawn according to the center line and the width; The adaptive measurement rectangle and the pin portion within the adaptive measurement rectangle are intercepted and amplified using bilinear interpolation to obtain a second region of interest. The intersection of the adaptive measurement rectangle and the pin portion is solved, and the extreme value method is used to connect the corresponding intersection points to obtain the pin edge. Traverse the pin edges in the second area of ​​interest, and each two adjacent pin edges form an edge pair. Calculate the spacing between the two edges in the edge pair and the spacing between adjacent edge pairs. Determine whether the spacing between the two edges in the edge pair exceeds a preset reference value W±2 / 3P. If so, abandon the edge pair and set the spacing between the two edges in the edge pair to zero. Store the data, record the spacing between the two edges in the edge pair as the width of the pin, and record the spacing between adjacent edge pairs as the spacing between every two adjacent pins.

2. The chip pin measurement method based on the adaptive measurement rectangular frame according to claim 1, characterized in that: The first direction is from the two corner points along two sides of the minimum circumscribed rectangle that pass through the two corner points and are parallel to each other and point to the other two corner points of the minimum circumscribed rectangle.

3. The chip pin measurement method based on the adaptive measurement rectangular frame according to claim 2, characterized in that: The offset is half of the reference length L of the target pin.

4. The chip pin measurement method based on the adaptive measurement rectangular frame according to claim 3, characterized in that: The preset first threshold is less than half of the reference length L of the target pin.

5. The chip pin measurement method based on the adaptive measurement rectangular frame according to claim 1, characterized in that: After obtaining the image of the chip to be measured, the following steps are included: Converting the obtained image of the chip to be measured into a grayscale image; Reading reference parameter values ​​of the pins, the reference parameter values ​​including a reference width W of the pins, a reference length L of the pins, and a spacing P between adjacent pins; Threshold segmentation is performed on the grayscale image, and disconnected areas in the grayscale image are filled to obtain the first region of interest.

6. The chip pin measurement method based on the adaptive measurement rectangular frame according to claim 1, characterized in that: The step of sequentially sorting the four corner points comprises: Based on the four corner points of the minimum circumscribed rectangle, according to the judgment formula A(X)<C(X), A(Y)<C(Y), the four corner points are sorted clockwise and recorded as corner point A, corner point B, corner point C and corner point D.

7. A chip pin measurement device based on an adaptive measurement rectangular frame, characterized in that: include: An acquisition module is used to acquire an image of a chip to be measured, where the chip to be measured includes a chip body and pins around the chip body; A first processing module is configured to determine a first region of interest based on an acquired image of the chip to be measured, and to solve a minimum circumscribed rectangle of the first region of interest; a calculation module, configured to calculate four corner points of a minimum circumscribed rectangle and sort the four corner points in sequence, wherein the pins on any side of the first region of interest correspond to two of the sorted four corner points; An adaptive measurement rectangular frame forming module is configured to select a target pin and use two corner points corresponding to the target pin as a reference, and translate the two corner points along a first direction by a certain offset amount to obtain two first offset points. A line connecting the two first offset points as endpoints serves as the center line of the adaptive measurement rectangular frame, and a preset first threshold serves as the width of the adaptive measurement rectangular frame. The adaptive measurement rectangular frame is drawn based on the center line and the width. The second processing module is used to intercept the adaptive measurement rectangular frame and the pin portion within the adaptive measurement rectangular frame, and use bilinear interpolation to amplify to obtain a second region of interest, solve the intersection of the adaptive measurement rectangular frame and the pin portion, and use the extreme value method to connect the corresponding intersection points to obtain the pin edge; The determination module is used to traverse the pin edges in the second area of ​​interest, where each two adjacent pin edges form an edge pair, calculate the spacing between the two edges in the edge pair and the spacing between adjacent edge pairs, and determine whether the spacing between the two edges in the edge pair exceeds a preset reference value W±2 / 3P. If so, the edge pair is discarded, the spacing between the two edges in the edge pair is set to zero, the data is stored, the spacing between the two edges in the edge pair is recorded as the width of the pin, and the spacing between adjacent edge pairs is recorded as the spacing between every two adjacent pins.

Images