Microdisplay panel and method of forming the same, near-eye display device

Abstract

The application discloses a micro display panel and a forming method thereof and a near-eye display device, relates to the technical field of micro display, and discloses the micro display panel, which comprises a driving backboard, a micro display chip and a plurality of first lead plates on the driving backboard, the micro display chip and the plurality of first lead plates being electrically connected with the driving backboard respectively, a circuit board, the circuit board having opposite first and second surfaces, the driving backboard being fixedly connected to the first surface of the circuit board, a plurality of second lead plates on the second surface of the circuit board, the plurality of second lead plates being electrically connected with the circuit board respectively, a plurality of third lead plates on the first surface of the circuit board, each third lead plate being electrically connected with a corresponding second lead plate, and a wire arrangement structure, the wire arrangement structure being electrically connected with the plurality of first lead plates and the plurality of third lead plates respectively. The driving backboard is stacked and fixed on the circuit board, and then the wire arrangement structure is used to realize the electrical connection between the driving backboard and the circuit board, so that the requirement of circuit design is met. The stacked and fixed connection reduces the volume occupied by the micro display panel in the transverse direction, so that the overall structure of the micro display panel is more compact. Moreover, the wire arrangement structure is used as a conduction carrier, the gold wire welding process is cancelled, and the overall volume of the micro display panel is reduced.

Description

Technical Field

[0001] This invention relates to the field of microdisplay technology, and more particularly to a microdisplay panel and its forming method, and a near-eye display device. Background Technology

[0002] Inorganic micropixel light-emitting diodes, also known as micro LEDs or μ-LEDs, have become increasingly important since their application in various fields, including self-emissive microdisplays, visible light communication, and optogenetics. Compared to traditional LEDs, Micro LEDs offer advantages such as better strain relaxation, higher light extraction efficiency, more uniform current diffusion, and higher output performance. Micro LEDs also boast improved thermal performance, faster response times, a wider operating temperature range, higher resolution, a broader color gamut, higher contrast, lower power consumption, and higher current density.

[0003] However, existing Micro LED microdisplay panels still have many problems. Summary of the Invention

[0004] The technical problem solved by the present invention is to provide a micro-display panel and a method for forming the same, as well as a near-eye display device, so as to make the structure of the micro-display panel more compact and reduce the overall volume of the micro-display panel.

[0005] To address the aforementioned problems, the present invention provides a micro-display panel, comprising: a driving backplane; a micro-display chip and a plurality of first lead plates located on the driving backplane, the micro-display chip and the plurality of first lead plates being electrically connected to the driving backplane respectively; a circuit board having opposing first and second surfaces, the driving backplane being fixedly connected to the first surface of the circuit board; a plurality of second lead plates located on the second surface of the circuit board, the plurality of second lead plates being electrically connected to the circuit board respectively; a plurality of third lead plates located on the first surface of the circuit board, each of the third lead plates being electrically connected to a corresponding second lead plate; and a cabling structure electrically connected to the plurality of first lead plates and the plurality of third lead plates respectively.

[0006] Optionally, the wiring structure includes: a substrate; a plurality of connecting lines located on the substrate, each connecting line having a first connecting portion and a second connecting portion; the first connecting portion of each connecting line being electrically connected to a corresponding first lead plate; and the second connecting portion of each connecting line being electrically connected to a corresponding third lead plate.

[0007] Optionally, each of the connecting lines further has a middle portion located between the first connecting portion and the second connecting portion and connected to the first connecting portion and the second connecting portion respectively, wherein the first connecting portion and the second connecting portion protrude from the middle portion.

[0008] Optionally, the ribbon cable structure further includes a cover film that covers the middle portion of the plurality of connecting wires.

[0009] Optionally, the wiring structure electrically connects a plurality of first lead plates and a plurality of third lead plates through an anisotropic conductive adhesive film lamination process or an alignment welding process.

[0010] Optionally, it further includes: a plurality of lead-through holes located within the circuit board, each lead-through hole extending from a first surface of the circuit board to a second surface, and each lead-through hole exposing a corresponding second lead plate; conductive posts located within each lead-through hole, and each third lead plate being electrically connected to a corresponding conductive post.

[0011] Optionally, the circuit board has a protrusion, each of the lead through holes passes through the protrusion, and a plurality of third lead plates are located on the protrusion; after the drive back plate is fixedly connected to the circuit board, the height of the first lead plate and the third lead plate are flush.

[0012] Optionally, the material of the first lead plate includes one or more combinations of gold, copper, nickel, aluminum and tin.

[0013] Optionally, the material of the circuit board includes one or more combinations of alumina ceramic or aluminum nitride ceramic.

[0014] Accordingly, the present invention also provides a method for forming a micro-display panel, comprising: providing a driving backplate; forming a micro-display chip and a plurality of first lead plates on the driving backplate, wherein the micro-display chip and the plurality of first lead plates are electrically connected to the driving backplate respectively; forming a ribbon cable structure; providing a circuit board having opposing first and second surfaces; forming a plurality of second lead plates on the second surface of the circuit board, wherein the plurality of second lead plates are electrically connected to the circuit board respectively; forming a plurality of third lead plates on the first surface of the circuit board, wherein each of the third lead plates is electrically connected to a corresponding second lead plate respectively; fixing the driving backplate to the first surface of the circuit board; and after fixing the driving backplate to the circuit board, electrically connecting the ribbon cable structure to the plurality of first lead plates and the plurality of third lead plates respectively.

[0015] Optionally, the wiring structure includes: a substrate; a plurality of connecting lines located on the substrate, each connecting line having a first connecting portion and a second connecting portion; the method for electrically connecting the wiring structure to a plurality of first lead plates and a plurality of third lead plates includes: electrically connecting the first connecting portion of each connecting line to the corresponding first lead plate; and electrically connecting the second connecting portion of each connecting line to the corresponding third lead plate.

[0016] Optionally, each of the connecting lines further has a middle portion located between the first connecting portion and the second connecting portion and connected to the first connecting portion and the second connecting portion respectively, the first connecting portion and the second connecting portion protruding from the middle portion respectively; the cable structure further includes: a cover film, the cover film covering the middle portions of the plurality of connecting lines; the method of forming the cable structure includes: providing the substrate; forming the plurality of connecting lines on the substrate; forming the cover film on the substrate.

[0017] Optionally, a method for forming a plurality of third lead plates on the first surface of the circuit board, wherein each of the third lead plates is electrically connected to a corresponding second lead plate, includes: performing a through-hole treatment from the first surface of the circuit board to the second surface of the circuit board to form a plurality of lead through holes in the circuit board, wherein each lead through hole exposes a corresponding second lead plate; forming a conductive post in each lead through hole; and forming a plurality of the third lead plates on the first surface of the circuit board, wherein each of the third lead plates is electrically connected to a corresponding conductive post.

[0018] Optionally, the perforation process includes one or more combinations of laser perforation and wet perforation.

[0019] Optionally, the process of forming a plurality of the first lead plates on the drive backplate includes one or more combinations of magnetron sputtering coating, electron beam evaporation, and electroplating.

[0020] Optionally, the wiring structure electrically connects a plurality of first lead plates and a plurality of third lead plates through an anisotropic conductive adhesive film lamination process or an alignment welding process.

[0021] Accordingly, the present invention also provides a near-eye display device, comprising: a micro-display panel as described in any of the above technical solutions.

[0022] Compared with the prior art, the technical solution of the present invention has the following advantages:

[0023] In the micro-display panel of this invention, a driving backplane is stacked and fixed onto a circuit board, and then an electrical connection between the driving backplane and the circuit board is achieved using a ribbon cable structure to meet the requirements of circuit design. This stacked and fixed connection method reduces the lateral volume occupied by the micro-display panel, making the overall structure of the micro-display panel more compact. Furthermore, by using the ribbon cable structure as the conductive carrier, the gold wire bonding process is eliminated, further reducing the overall size of the micro-display panel.

[0024] Furthermore, the circuit board has a raised portion, through which several lead holes pass, and several third lead plates are formed on the raised portion; after the drive backplate is fixedly connected to the circuit board, the first lead plate and the third lead plate are at the same height. The raised portion ensures that after the drive backplate is fixedly connected to the circuit board, the first lead plate and the third lead plate are at the same horizontal height, which facilitates the connection of the ribbon cable structure and improves the connection stability of the ribbon cable structure.

[0025] In the method for forming a micro-display panel according to the technical solution of the present invention, a driving backplane is stacked and fixed onto a circuit board, and then an electrical connection between the driving backplane and the circuit board is achieved using a ribbon cable structure to meet the requirements of circuit design. This stacked and fixed connection method reduces the volume occupied by the micro-display panel in the horizontal direction, making the overall structure of the micro-display panel more compact. Furthermore, by using a ribbon cable structure as the conductive carrier, the gold wire bonding process is eliminated, further reducing the overall size of the micro-display panel.

[0026] Furthermore, the circuit board has a raised portion, through which several lead holes pass, and several third lead plates are formed on the raised portion; after the drive backplate is fixedly connected to the circuit board, the first lead plate and the third lead plate are at the same height. The raised portion ensures that after the drive backplate is fixedly connected to the circuit board, the first lead plate and the third lead plate are at the same horizontal height, which facilitates the connection of the ribbon cable structure and improves the connection stability of the ribbon cable structure. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the structure of a Micro LED microdisplay panel;

[0028] Figures 2 to 9 This is a schematic diagram of the steps in a method for forming a micro-display panel according to an embodiment of the present invention;

[0029] Figure 10 This is a schematic diagram of the structure of a micro-display panel according to another embodiment of the present invention. Detailed Implementation

[0030] As described in the background section, existing Micro LED microdisplay panels still have many problems. These will be explained in detail below with reference to the accompanying drawings.

[0031] Figure 1 This is a schematic diagram of the structure of a Micro LED microdisplay panel.

[0032] Please refer to Figure 1 A Micro LED microdisplay panel includes: a microdisplay chip 10, a driving backplane 11, an FPC flexible flat cable 12, and a connector 13. The microdisplay chip 10 is electrically connected to the driving backplane. One end of the FPC flexible flat cable 12 is electrically connected to the microdisplay chip 10 through several gold wires 14. The other end of the FPC flexible flat cable is electrically connected to the connector 13. The connector 13 is suitable for electrical connection with external compatible devices.

[0033] Current microdisplay panels employ either Chips on Board (COB) or Molding on Board (MOC) packaging. Both methods require wire bonding (14) of gold wire, which necessitates a flat-lay connection between the FPC flexible cable (12) and connector (13), resulting in a larger horizontal footprint for the microdisplay panel. Furthermore, the gold wire bonding itself also occupies considerable space, further contributing to the overall larger size of the microdisplay panel.

[0034] Based on this, the present invention provides a micro-display panel and its forming method, as well as a near-eye display device. By stacking and fixing a driving backplane onto a circuit board, and then using a ribbon cable structure to achieve electrical connection between the driving backplane and the circuit board, the requirements of circuit design are met. The stacked and fixed connection method reduces the volume occupied by the micro-display panel in the horizontal direction, making the overall structure of the micro-display panel more compact. Furthermore, by using the ribbon cable structure as the conductive carrier, the gold wire bonding process is eliminated, further reducing the overall size of the micro-display panel.

[0035] To make the above-mentioned objectives, features, and advantages of the present invention more apparent and understandable, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0036] In the description of this invention, it should be understood that the terms "upper," "lower," "top surface," "bottom surface," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the indicated position or element must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, the terms "first" and "second" are only used to distinguish an entity or operation from another entity or operation, and do not require or imply any actual relationship, order, or relative importance between these entities or operations.

[0037] Figures 2 to 9 This is a schematic diagram of the steps in a method for forming a micro-display panel according to an embodiment of the present invention; Figure 10 This is a schematic diagram of the structure of a micro-display panel according to another embodiment of the present invention.

[0038] Please refer to Figure 2 and Figure 3 , Figure 3 yes Figure 2 A schematic diagram of the cross-section along line AA, providing the drive backplate 200.

[0039] In some embodiments, the driving backplane 200 may be an IC (Integrated Circuit) substrate or a TFT (Thin Film Transistor) substrate.

[0040] Please continue to refer to this. Figure 2 and Figure 3 A microdisplay chip 201 and several first lead plates 202 are formed on the driving backplate 200, and the microdisplay chip 201 and several first lead plates 202 are electrically connected to the driving backplate 200 respectively.

[0041] In some embodiments, the material of the first lead plate 202 includes one or more combinations of gold, copper, nickel, aluminum and tin.

[0042] In some embodiments, the process of forming a plurality of first lead plates 202 on the drive backplane 200 includes one or more combinations of magnetron sputtering coating, electron beam evaporation and electroplating.

[0043] It should be noted that, in this embodiment, the first lead plate 202 can be arranged in one or more rows, and the position of the first lead plate 202 can be any position outside the coverage area of ​​the micro display chip 201.

[0044] Please refer to Figure 4 and Figure 5 , Figure 5 yes Figure 4 A schematic diagram of the cross-section along the BB line in the middle, forming the wiring structure 203.

[0045] In this embodiment, the cable structure 203 includes: a substrate 2031; and a plurality of connecting lines 2032 located on the substrate 2031, each connecting line 2032 having a first connecting portion 2032a and a second connecting portion 2032b.

[0046] In this embodiment, each connecting line 2032 further has a middle portion 2032c located between the first connecting portion 2032a and the second connecting portion 2032b, and connected to the first connecting portion 2032a and the second connecting portion 2032b respectively, with the first connecting portion 2032a and the second connecting portion 2032b protruding from the middle portion 2032c respectively.

[0047] In this embodiment, the cabling structure 203 further includes a cover film 2033, which covers the middle portion 2032c of a plurality of connecting lines 2032.

[0048] In this embodiment, the method for forming the cabling structure 203 includes: providing a substrate 2031; forming a plurality of connecting lines 2032 on the substrate 2031; and forming a cover film 2033 on the substrate 2031.

[0049] Please refer to Figure 6 and Figure 7 , Figure 7 yes Figure 6 A schematic diagram of the cross-section along the CC line is provided, and a circuit board 204 is provided, which has a first surface 204a and a second surface 204b opposite to each other.

[0050] It should be noted that, in this embodiment, the circuit board 204 is used to connect the micro display panel to an external device. The first side 204a of the circuit board 204 is the front side of the circuit board 204, and the second side 204b of the circuit board 204 is the back side of the circuit board 204.

[0051] In some embodiments, the material of the circuit board 204 includes one or more combinations of alumina ceramic or aluminum nitride ceramic.

[0052] In this embodiment, the circuit board 204 has a protrusion 2041.

[0053] Please continue to refer to this. Figure 6 and Figure 7 A plurality of second lead plates 205 are formed on the second side 204b of the circuit board 204, and the plurality of second lead plates 205 are electrically connected to the circuit board 204 respectively; a plurality of third lead plates 206 are formed on the first side 204a of the circuit board 204, and each third lead plate 206 is electrically connected to the corresponding second lead plate 205 respectively.

[0054] In this embodiment, a plurality of third lead plates 206 are formed on the first surface 204a of the circuit board 204, and each third lead plate 206 is electrically connected to a corresponding second lead plate 205. The method includes: performing a through-hole process from the first surface 204a to the second surface 204b of the circuit board 204 to form a plurality of lead through holes (not shown) in the circuit board 204, each lead through hole exposing a corresponding second lead plate 205; forming a conductive post 207 in each lead through hole; forming a plurality of third lead plates 206 on the first surface 204a of the circuit board 204, and each third lead plate 206 is electrically connected to a corresponding conductive post 207.

[0055] In some embodiments, the perforation process includes one or more combinations of laser perforation and wet perforation.

[0056] In this embodiment, a plurality of lead wire through holes penetrate the protrusion 2041, and a plurality of third lead wire plates 206 are formed on the protrusion 2041.

[0057] It should be noted that in this embodiment, the protrusion 2041 is only used to stack several third lead plates 206. Therefore, in order to prevent surface perforation from causing damage to the circuit board 204, no circuit structure is provided in the protrusion 2041.

[0058] It should be noted that in this embodiment, there are more second lead plates 205 and fewer third lead plates 206. Each third lead plate 206 is electrically connected to only one second lead plate 205. The number of lead wire through holes is the same as the number of second lead plates 205. Each third lead plate 206 is electrically connected to a lead wire post in a lead wire through hole.

[0059] Please refer to Figure 8 and Figure 9 , Figure 9 yes Figure 8 A schematic diagram of the cross-section of the DD line shows that the drive backplate 200 is fixedly connected to the first surface 204a of the circuit board 204; after the drive backplate 200 is fixedly connected to the circuit board 204, the cabling structure 203 is electrically connected to a number of first lead plates 202 and a number of third lead plates 206 respectively.

[0060] By stacking and fixing the driver backplane 200 onto the circuit board 204, and then using the ribbon cable structure 203 to achieve electrical connection between the driver backplane 200 and the circuit board 204, the requirements of circuit design are met. This stacked and fixed connection method reduces the lateral volume occupied by the micro-display panel, making the overall structure of the micro-display panel more compact. Furthermore, by using the ribbon cable structure 203 as the conductive carrier, the gold wire bonding process is eliminated, further reducing the overall size of the micro-display panel.

[0061] In this embodiment, the method of electrically connecting the ribbon cable structure 203 to a plurality of first lead plates 202 and a plurality of third lead plates 206 includes: electrically connecting the first connecting portion 2032a of each connecting line 2032 to the corresponding first lead plate 202; and electrically connecting the second connecting portion 2032b of each connecting line 2032 to the corresponding third lead plate 206.

[0062] In this embodiment, after the drive backplate 200 is fixedly connected to the circuit board 204, the first lead plate 202 and the third lead plate 206 are at the same height. The protrusion 2041 ensures that after the drive backplate 200 and the circuit board 204 are fixedly connected, the first lead plate 202 and the third lead plate 206 are at the same horizontal height, which facilitates the connection of the ribbon cable structure 203 and improves the connection stability of the ribbon cable structure 203.

[0063] Please continue to refer to this. Figure 9 In this embodiment, the drive backplate 200 and the circuit board 204 are bonded and fixed with adhesive. The ribbon cable structure 203 uses anisotropic conductive film 208 (ACF) lamination process to electrically connect a plurality of first lead plates 202 and a plurality of third lead plates 206, thereby realizing the electrical connection between the drive backplate 200 and the circuit board 204. The anisotropic conductive film 208 is only coated on the surface of the first lead plates 202 and the third lead plates 206.

[0064] Please refer to Figure 10 In other embodiments, the anisotropic conductive film 208 may also be coated on the surfaces of the first lead plate 202 and the third lead plate 206, as well as in the gap between the first lead plate 202 and the third lead plate 206.

[0065] In other embodiments, the cabling structure can also utilize an alignment soldering process to electrically connect a plurality of first lead plates and a plurality of third lead plates, thereby achieving electrical connection between the drive backplane and the circuit board.

[0066] In this embodiment, the micro-display panel is a Micro LED micro-display panel.

[0067] The aforementioned microdisplay panel has a very small volume, with length and width dimensions ranging from 500 μm to 50,000 μm. The light-emitting area of ​​the microdisplay panel is extremely small, for example, 1 mm × 1 mm, 2.64 mm × 2.02 mm, or 3 mm × 5 mm. The light-emitting area of ​​the microdisplay panel comprises multiple micro-LED pixels arranged in an array, with specific pixel arrangements including 320 × 240, 640 × 480, 1600 × 1200, 1920 × 1080, and 2560 × 1440. The size of a single micro-LED pixel is between 100 nm and 100 micrometers.

[0068] In some implementations, the size of a single microLED pixel is between 150 nm and 15 micrometers.

[0069] In some implementations, the size of a single micro-LED pixel can be less than 10 micrometers.

[0070] A driving backplate 200 is disposed on the back of the micro-LED pixel array. The driving backplate 200 is electrically connected to the micro-LEDs in the micro-LED pixel array. The driving backplate 200 can acquire signals such as image data from the outside world and can control the corresponding micro-LEDs to emit light or not emit light. For example, the driving backplate 200 of the micro-display panel described above integrates a frame buffer, a column driving circuit, and a row driving circuit. The frame buffer includes a first pixel storage area, and the micro-LED pixel array includes a second pixel storage area. A complete frame of pixel grayscale data from the outside world can first enter the first pixel storage area of ​​the frame buffer. The column driving circuit can load the pixel grayscale data in the first pixel storage area of ​​the frame buffer into the second pixel storage area of ​​the micro-LED pixel array. The row driving circuit can scan the pixel grayscale data in the second pixel storage area and generate a pulse modulation signal to achieve the purpose of displaying different grayscale levels. When driving multiple micro-LED pixels in the micro-LED pixel array, either a single pixel can be driven independently, or multiple pixel units can be driven independently. The specific driving method should not constitute a limitation of this application.

[0071] Accordingly, this invention also provides a micro-display panel, please refer to the following embodiments. Figure 8 and Figure 9The system includes: a driving backplane 200; a microdisplay chip 201 and a plurality of first lead plates 202 located on the driving backplane 200, the microdisplay chip 201 and the plurality of first lead plates 202 being electrically connected to the driving backplane 200; a circuit board 204 having opposing first surfaces 204a and second surfaces 204b, the driving backplane 200 being fixedly connected to the first surface 204a of the circuit board 204; a plurality of second lead plates 205 located on the second surface 204b of the circuit board 204, the plurality of second lead plates 205 being electrically connected to the circuit board 204; a plurality of third lead plates 206 located on the first surface 204a of the circuit board 204, each third lead plate 206 being electrically connected to a corresponding second lead plate 205; and a cabling structure 203, the cabling structure 203 being electrically connected to the plurality of first lead plates 202 and the plurality of third lead plates 206.

[0072] By stacking and fixing the driver backplane 200 onto the circuit board 204, and then using the ribbon cable structure 203 to achieve electrical connection between the driver backplane 200 and the circuit board 204, the requirements of circuit design are met. This stacked and fixed connection method reduces the lateral volume occupied by the micro-display panel, making the overall structure of the micro-display panel more compact. Furthermore, by using the ribbon cable structure 203 as the conductive carrier, the gold wire bonding process is eliminated, further reducing the overall size of the micro-display panel.

[0073] Please continue to refer to this. Figure 4 and Figure 5 In this embodiment, the cable structure 203 includes: a substrate 2031; and a plurality of connecting lines 2032 located on the substrate 2031, each connecting line 2032 having a first connecting portion 2032a and a second connecting portion 2032b.

[0074] In this embodiment, the wiring structure 203 is electrically connected to a plurality of first lead plates 202 and a plurality of third lead plates 206, respectively, including: the first connecting portion 2032a of each connecting line 2032 is electrically connected to the corresponding first lead plate 202; and the second connecting portion 2032b of each connecting line 2032 is electrically connected to the corresponding third lead plate 206.

[0075] In this embodiment, each connecting line 2032 further has a middle portion 2032c located between the first connecting portion 2032a and the second connecting portion 2032b, and connected to the first connecting portion 2032a and the second connecting portion 2032b respectively, with the first connecting portion 2032a and the second connecting portion 2032b protruding from the middle portion 2032c respectively.

[0076] Please continue to refer to this. Figure 4 and Figure 5In this embodiment, the cable structure 203 further includes a cover film 2033, which covers the middle portion 2032c of a plurality of connecting lines 2032.

[0077] Please continue to refer to this. Figure 6 and Figure 7 In this embodiment, it further includes: a plurality of lead through holes (not shown) located in the circuit board 204, each lead through hole extending from the first surface 204a to the second surface 204b of the circuit board 204, and each lead through hole exposing a corresponding second lead plate 205; conductive posts 207 located in each lead through hole, and each third lead plate 206 being electrically connected to the corresponding conductive post 207.

[0078] In this embodiment, the circuit board 204 has a protrusion 2041, through which each lead wire through hole passes, and several third lead plates 206 are located on the protrusion 2041. After the drive back plate 200 is fixedly connected to the circuit board 204, the first lead plate 202 and the third lead plate 206 are at the same height. The protrusion 2041 ensures that after the drive back plate 200 is fixedly connected to the circuit board 204, the first lead plate 202 and the third lead plate 206 are at the same horizontal height, which facilitates the connection of the ribbon cable structure 203 and improves the connection stability of the ribbon cable structure 203.

[0079] In some embodiments, the material of the first lead plate 202 includes one or more combinations of gold, copper, nickel, aluminum and tin.

[0080] In some embodiments, the material of the circuit board 204 includes one or more combinations of alumina ceramic or aluminum nitride ceramic.

[0081] Please continue to refer to this. Figure 9 In this embodiment, the drive backplate 200 and the circuit board 204 are bonded and fixed with adhesive. The ribbon cable structure 203 uses anisotropic conductive film 208 (ACF) lamination process to electrically connect a plurality of first lead plates 202 and a plurality of third lead plates 206, thereby realizing the electrical connection between the drive backplate 200 and the circuit board 204. The anisotropic conductive film 208 is only coated on the surface of the first lead plates 202 and the third lead plates 206.

[0082] Please continue to refer to this. Figure 10 In other embodiments, the anisotropic conductive film 208 may also be coated on the surfaces of the first lead plate 202 and the third lead plate 206, as well as in the gap between the first lead plate 202 and the third lead plate 206.

[0083] In other embodiments, the cabling structure can also utilize an alignment soldering process to electrically connect a plurality of first lead plates and a plurality of third lead plates, thereby achieving electrical connection between the drive backplane and the circuit board.

[0084] Accordingly, the present invention also provides a near-eye display device, comprising: a micro-display panel as described in any of the above embodiments.

[0085] While the present invention has been disclosed above, it is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the invention; therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.

Claims

1. A micro-display panel, characterized in that, include: Drive backplane; The microdisplay chip and several first lead plates are located on the driving backplane, and the microdisplay chip and several first lead plates are electrically connected to the driving backplane respectively. A circuit board having a first side and a second side facing each other, and a drive backplate fixedly connected to the first side of the circuit board; A plurality of second lead plates are located on the second surface of the circuit board, and the plurality of second lead plates are electrically connected to the circuit board respectively; A plurality of third lead plates are located on the first surface of the circuit board, and each of the third lead plates is electrically connected to the corresponding second lead plate. A ribbon cable structure, wherein the ribbon cable structure is electrically connected to a plurality of first lead plates and a plurality of third lead plates respectively; A plurality of lead-through holes are located within the circuit board, each lead-through hole extending from a first surface to a second surface of the circuit board, and each lead-through hole exposes a corresponding second lead plate; conductive posts are located within each lead-through hole, and each third lead plate is electrically connected to a corresponding conductive post. The circuit board has a protrusion, and each of the lead wire through holes passes through the protrusion. A plurality of third lead wire plates are located on the protrusion. After the drive back plate is fixedly connected to the circuit board, the height of the first lead wire plate and the third lead wire plate are flush. The protrusion is used to stack the plurality of third lead wire plates. Anisotropic conductive adhesive film is coated only on the surfaces of the first lead plate and the third lead plate, or the anisotropic conductive adhesive film is coated on the surfaces of the first lead plate and the third lead plate, as well as in the gap between the first lead plate and the third lead plate, for the wiring structure to electrically connect a plurality of the first lead plates and a plurality of the third lead plates respectively.

2. The micro-display panel according to claim 1, characterized in that, The wiring structure includes: a substrate; a plurality of connecting lines located on the substrate, each connecting line having a first connecting portion and a second connecting portion; the first connecting portion of each connecting line being electrically connected to a corresponding first lead plate; and the second connecting portion of each connecting line being electrically connected to a corresponding third lead plate.

3. The micro-display panel according to claim 2, characterized in that, Each of the connecting lines also has a middle portion located between the first connecting portion and the second connecting portion and connected to the first connecting portion and the second connecting portion respectively, wherein the first connecting portion and the second connecting portion protrude from the middle portion.

4. The micro-display panel according to claim 3, characterized in that, The cable structure further includes a cover film that covers the middle portion of several of the connecting wires.

5. The micro-display panel according to claim 1, characterized in that, The material of the first lead plate includes one or more combinations of gold, copper, nickel, aluminum and tin.

6. The micro-display panel according to claim 1, characterized in that, The circuit board is made of one or more combinations of alumina ceramic or aluminum nitride ceramic.

7. A method for forming a micro-display panel, characterized in that, include: Provides a drive backplane; A microdisplay chip and a plurality of first lead plates are formed on the driving backplane, and the microdisplay chip and the plurality of first lead plates are electrically connected to the driving backplane respectively. Forming a cabling structure; A circuit board is provided, the circuit board having opposing first and second sides; A plurality of second lead plates are formed on the second surface of the circuit board, and the plurality of second lead plates are electrically connected to the circuit board respectively; A plurality of third lead plates are formed on the first surface of the circuit board, and each of the third lead plates is electrically connected to the corresponding second lead plate. The drive backplate is fixedly connected to the first side of the circuit board; After the drive backplane is fixedly connected to the circuit board, the ribbon cable structure is electrically connected to a plurality of first lead plates and a plurality of third lead plates respectively; wherein, A method for forming a plurality of third lead plates on a first surface of the circuit board, wherein each third lead plate is electrically connected to a corresponding second lead plate, includes: performing a through-hole treatment from the first surface of the circuit board to the second surface of the circuit board to form a plurality of lead through holes in the circuit board, wherein each lead through hole exposes a corresponding second lead plate; forming a conductive post in each lead through hole; and forming a plurality of third lead plates on the first surface of the circuit board, wherein each third lead plate is electrically connected to a corresponding conductive post. The circuit board has a protrusion, and each of the lead wire through holes passes through the protrusion. A plurality of third lead wire plates are located on the protrusion. After the drive back plate is fixedly connected to the circuit board, the height of the first lead wire plate and the third lead wire plate are flush. The protrusion is used to stack the plurality of third lead wire plates. Anisotropic conductive adhesive film is coated only on the surfaces of the first lead plate and the third lead plate, or the anisotropic conductive adhesive film is coated on the surfaces of the first lead plate and the third lead plate, as well as in the gap between the first lead plate and the third lead plate, for the wiring structure to electrically connect a plurality of the first lead plates and a plurality of the third lead plates respectively.

8. The method for forming a microdisplay panel according to claim 7, characterized in that, The wiring structure includes: a substrate; a plurality of connecting lines located on the substrate, each connecting line having a first connecting portion and a second connecting portion; a method for electrically connecting the wiring structure to a plurality of first lead plates and a plurality of third lead plates includes: electrically connecting the first connecting portion of each connecting line to the corresponding first lead plate; and electrically connecting the second connecting portion of each connecting line to the corresponding third lead plate.

9. The method for forming a microdisplay panel according to claim 8, characterized in that, Each of the connecting lines also has a middle portion located between the first connecting portion and the second connecting portion, and connected to the first connecting portion and the second connecting portion respectively, wherein the first connecting portion and the second connecting portion protrude from the middle portion; The cable structure further includes: a cover film covering the middle portion of the plurality of connecting lines; the method of forming the cable structure includes: providing the substrate; forming the plurality of connecting lines on the substrate; and forming the cover film on the substrate.

10. The method for forming a microdisplay panel according to claim 7, characterized in that, The perforation process includes one or more combinations of laser perforation and wet perforation.

11. The method for forming a microdisplay panel according to claim 7, characterized in that, The process of forming a plurality of the first lead plates on the drive backplate includes one or more combinations of magnetron sputtering coating, electron beam evaporation, and electroplating.

12. A near-eye display device, characterized in that, include: The microdisplay panel as described in any one of claims 1 to 6.

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