Substrate processing apparatus and substrate processing method

Abstract

This invention relates to a substrate processing apparatus and a substrate processing method. The substrate processing apparatus includes multiple substrate cleaning units and a main robot. The main robot is configured to move substrates into and out of each substrate cleaning unit. Each substrate cleaning unit has a processing chamber. Inside the processing chamber, a brush cleaning section is provided to clean the lower surface of the substrate by contacting a brush with the lower surface of the substrate. Additionally, the substrate cleaning unit has cleaning nozzles that spray cleaning fluid onto the brushes. During the loading and unloading of substrates by the main robot, the supply of cleaning fluid to the cleaning nozzles is stopped.

Description

Technical Field

[0001] This invention relates to a substrate processing apparatus and a substrate processing method for cleaning a substrate. Background Technology

[0002] Substrate processing apparatus is used to perform various processing on various substrates used in liquid crystal display devices or organic EL (Electroluminescence) display devices, such as substrates for FPD (Flat Panel Display), semiconductor substrates, optical disc substrates, magnetic disk substrates, magneto-optical disc substrates, photomask substrates, ceramic substrates, or solar cell substrates. Substrate cleaning apparatus is used to clean the substrates.

[0003] For example, the substrate cleaning apparatus described in Japanese Patent No. 5904169 includes: two adsorption pads for holding the peripheral portion of the back side of a wafer; a rotating chuck for holding the central portion of the back side of the wafer; and a brush for cleaning the back side of the wafer. The two adsorption pads hold the wafer and move it laterally. In this state, the central portion of the back side of the wafer is brushed clean. Then, the rotating chuck receives the wafer from the adsorption pads and rotates while holding the central portion of the back side of the wafer. In this state, the peripheral portion of the back side of the wafer is brushed clean. Summary of the Invention

[0004] In a substrate cleaning apparatus, the cleanliness of the brushes gradually decreases as the substrate is repeatedly cleaned. If the cleanliness of the brushes decreases, the substrate will not be properly cleaned.

[0005] In the substrate cleaning apparatus, a brush is positioned to expose the upper surface of the wafer for cleaning. To prevent a decrease in the cleanliness of the brush, it is considered to spray cleaning fluid onto the brush to clean it. However, when the cleaning fluid used for brush cleaning spreads within the substrate cleaning apparatus, the cleanliness of the substrate and its cleaning environment may be reduced due to the spread of cleaning fluid.

[0006] The purpose of this invention is to provide a substrate processing apparatus and a substrate processing method that can prevent the use of a brush that reduces the cleanliness of the substrate, and can reduce the reduction in the cleanliness of the substrate and the cleanliness of the substrate cleaning environment caused by brush cleaning.

[0007] An embodiment of the substrate processing apparatus of the present invention includes: a processing chamber; a conveying device configured to perform a conveying operation of conveying a substrate into the processing chamber and a conveying operation of conveying a substrate out of the processing chamber; a first substrate holding section disposed in the processing chamber and holding the substrate conveyed by the conveying device; a brush cleaning section disposed in the processing chamber and configured to clean the lower surface of the substrate by contacting a brush with the substrate held by the first substrate holding section; a cleaning nozzle disposed in the processing chamber and configured to spray a brush cleaning liquid for cleaning the brush; a cleaning liquid supply section configured to supply the brush cleaning liquid to the cleaning nozzle; and a control section configured to stop supplying the brush cleaning liquid to the cleaning nozzle during at least a portion of the time during the conveying operation and the conveying operation by controlling the cleaning liquid supply section.

[0008] Another embodiment of the substrate processing apparatus of the present invention includes: a first substrate holding section configured to hold a substrate; a brush cleaning section configured to clean the lower surface of the substrate by contacting a brush with the substrate held by the first substrate holding section; a second substrate holding section configured to hold the substrate; a processing section for performing a predetermined processing on the substrate held by the second substrate holding section; a relative movement section for performing a relative movement operation to switch the state in which the substrate is held by the first substrate holding section to the state in which the substrate is held by the second substrate holding section, i.e., by moving at least one of the first substrate holding section, the second substrate holding section, and the substrate, thereby changing the relative position of the first substrate holding section and the substrate; a cleaning nozzle configured to spray a brush cleaning liquid for cleaning the brush onto the brush; a cleaning liquid supply section for supplying the brush cleaning liquid to the cleaning nozzle; and a control section for stopping the supply of the brush cleaning liquid to the cleaning nozzle when the relative movement operation of the relative movement section is performed by controlling the cleaning liquid supply section.

[0009] Another aspect of the substrate processing apparatus of the present invention includes: a first substrate holding section configured to hold a substrate; a brush cleaning section configured to clean the lower surface of the substrate by contacting a brush with the substrate held by the first substrate holding section; a cleaning nozzle configured to spray a brush cleaning liquid for cleaning the brush; a cleaning liquid supply section configured to supply the brush cleaning liquid to the cleaning nozzle; and a control section configured to stop supplying the brush cleaning liquid to the cleaning nozzle during at least a portion of the period during which the substrate is held by the first substrate holding section by controlling the cleaning liquid supply section.

[0010] Another aspect of the substrate processing apparatus of the present invention includes: a first substrate holding section configured to hold a substrate; a brush for cleaning the lower surface of the substrate by contacting it; a brush moving section configured to move the brush between a cleaning position in contact with the lower surface of the substrate held by the first substrate holding section and a standby position located lower than the first substrate holding section and separated from the substrate held by the first substrate holding section; a second substrate holding section disposed at a position higher than the first substrate holding section and configured to hold the substrate; a processing section for performing a predetermined processing on the substrate held by the second substrate holding section; a cleaning nozzle configured to spray a cleaning solution for cleaning the brush onto the brush; a cleaning solution supply section configured to supply the cleaning solution to the cleaning nozzle; and a control section configured to stop supplying the cleaning solution to the cleaning nozzle when the substrate is held by the second substrate holding section and the brush is in a position other than the standby position by controlling the cleaning solution supply section.

[0011] Another aspect of the substrate processing apparatus of the present invention includes: a first substrate holding section configured to hold a substrate; a brush cleaning section configured to bring a brush into contact with the substrate held by the first substrate holding section to clean the lower surface of the substrate; a second substrate holding section disposed at a position higher than the first substrate holding section and configured to hold the substrate; a processing section for performing a predetermined processing on the substrate held by the second substrate holding section; a cleaning nozzle configured to spray a brush cleaning liquid for cleaning the brush; and a cleaning liquid supply section. The system includes: an operation unit for inputting supply conditions for the cleaning solution supplied by the cleaning solution supply unit during the specified treatment of the substrate by the processing unit; a receiving unit for receiving the supply conditions of the cleaning solution input by the operation unit; and a control unit for controlling the cleaning solution supply unit according to the supply conditions received by the receiving unit, thereby adjusting the supply state of the cleaning solution to the cleaning nozzle during the specified treatment of the substrate by the processing unit.

[0012] One aspect of the substrate processing method of the present invention includes the following steps: feeding a substrate into a processing chamber using a conveying device configured to perform a feeding operation of feeding a substrate into a processing chamber and a feeding operation of feeding a substrate out of the processing chamber; holding the substrate fed in by the conveying device in the processing chamber using a first substrate holding portion; cleaning the lower surface of the substrate by contacting a brush with the substrate held by the first substrate holding portion in the processing chamber; spraying the brush cleaning solution from the cleaning nozzle to the brush by supplying the brush cleaning solution to the cleaning nozzle in the processing chamber; and feeding the substrate out of the processing chamber using the conveying device; and the step of spraying the brush cleaning solution to the brush includes: stopping the supply of the brush cleaning solution to the cleaning nozzle during at least a portion of the feeding operation and the feeding operation performed by the conveying device.

[0013] Another embodiment of the substrate processing method of the present invention includes the following steps: holding a substrate using a first substrate holding portion; cleaning the lower surface of the substrate by contacting a brush with the substrate held by the first substrate holding portion; holding the substrate using a second substrate holding portion; performing a predetermined treatment on the substrate held by the second substrate holding portion; performing a relative movement operation to switch the state of the substrate being held by the first substrate holding portion to the state of the substrate being held by the second substrate holding portion, that is, changing the relative position of the first substrate holding portion and the substrate by moving at least one of the first substrate holding portion, the second substrate holding portion, and the substrate; and spraying the brush cleaning liquid from the cleaning nozzle to the brush by supplying a brush cleaning liquid for cleaning the brush to the cleaning nozzle; and the step of spraying the brush cleaning liquid to the brush includes: stopping the supply of the brush cleaning liquid to the cleaning nozzle during the relative movement operation.

[0014] Another aspect of the substrate processing method of the present invention includes the following steps: holding a substrate using a first substrate holding portion; cleaning the lower surface of the substrate by contacting a brush with the substrate held by the first substrate holding portion; and spraying the brush cleaning liquid from the cleaning nozzle onto the brush by supplying a brush cleaning liquid for cleaning the brush to a cleaning nozzle; and the step of spraying the brush cleaning liquid onto the brush includes: stopping the supply of the brush cleaning liquid to the cleaning nozzle for at least a portion of the period during which the substrate is held using the first substrate holding portion.

[0015] Another aspect of the substrate processing method of the present invention includes the following steps: holding a substrate using a first substrate holding portion; moving a brush that cleans the lower surface of the substrate by contacting the lower surface of the substrate between a cleaning position in contact with the lower surface of the substrate held by the first substrate holding portion and a standby position that is lower than the first substrate holding portion and separated from the substrate held by the first substrate holding portion; holding the substrate using a second substrate holding portion disposed at a position higher than the first substrate holding portion; and performing a predetermined treatment on the substrate held by the second substrate holding portion; spraying the brush cleaning liquid from the cleaning nozzle onto the brush by supplying the brush cleaning liquid for cleaning the brush to the cleaning nozzle; and the step of spraying the brush cleaning liquid onto the brush includes: stopping the supply of the brush cleaning liquid to the cleaning nozzle when the substrate is held by the second substrate holding portion and the brush is in a position other than the standby position.

[0016] Another aspect of the substrate processing method of the present invention includes the following steps: holding a substrate using a first substrate holding portion; cleaning the lower surface of the substrate by contacting a brush with the substrate held by the first substrate holding portion; holding the substrate using a second substrate holding portion disposed at a position higher than the first substrate holding portion; performing a predetermined treatment on the substrate held by the second substrate holding portion; spraying the brush cleaning liquid from the cleaning nozzle to the brush by supplying a brush cleaning liquid for cleaning the brush to a cleaning nozzle; when a supply condition for the brush cleaning liquid to the cleaning nozzle during the predetermined treatment of the substrate held by the second substrate holding portion is input to an operation unit, accepting the supply condition for the brush cleaning liquid input by the operation unit; and accepting the supply condition for the brush cleaning liquid input by the operation unit; and spraying the brush cleaning liquid to the brush includes: adjusting the supply state of the brush cleaning liquid to the cleaning nozzle during the predetermined treatment of the substrate according to the supply condition accepted in the acceptance step.

[0017] According to the present invention, it is possible to prevent the substrate from being cleaned with a brush that reduces cleanliness, and to reduce the decrease in cleanliness of the substrate and the cleanliness of the cleaning environment caused by brush cleaning. Attached Figure Description

[0018] Figure 1 This is a schematic top view of a substrate processing apparatus according to an embodiment of the present invention.

[0019] Figure 2 yes Figure 1 A schematic cross-sectional view of the substrate processing apparatus at the JJ line.

[0020] Figure 3 yes Figure 1A schematic top view of the substrate cleaning apparatus.

[0021] Figure 4 It means Figure 3 An external perspective view of the internal structure of the substrate cleaning device.

[0022] Figure 5 It means from Figure 4 A side view of an example of a brush nozzle spraying cleaning solution onto a downward-facing surface.

[0023] Figure 6 It means from Figure 4 Another side view of an example of a brush nozzle spraying cleaning solution onto a downward-facing surface.

[0024] Figure 7 It means Figure 1 A block diagram illustrating the configuration of the control system for the substrate cleaning apparatus.

[0025] Figure 8 It is used for explanation Figure 3 A schematic diagram of the general operation of the substrate cleaning device.

[0026] Figure 9 It is used for explanation Figure 3 A schematic diagram of the general operation of the substrate cleaning device.

[0027] Figure 10 It is used for explanation Figure 3 A schematic diagram of the general operation of the substrate cleaning device.

[0028] Figure 11 It is used for explanation Figure 3 A schematic diagram of the general operation of the substrate cleaning device.

[0029] Figure 12 It is used for explanation Figure 3 A schematic diagram of the general operation of the substrate cleaning device.

[0030] Figure 13 It is used for explanation Figure 3 A schematic diagram of the general operation of the substrate cleaning device.

[0031] Figure 14 It is used for explanation Figure 3 A schematic diagram of the general operation of the substrate cleaning device.

[0032] Figure 15 It is used for explanation Figure 3 A schematic diagram of the general operation of the substrate cleaning device.

[0033] Figure 16 It is used for explanation Figure 3A schematic diagram of the general operation of the substrate cleaning device.

[0034] Figure 17 It is used for explanation Figure 3 A schematic diagram of the general operation of the substrate cleaning device.

[0035] Figure 18 It is used for explanation Figure 3 A schematic diagram of the general operation of the substrate cleaning device.

[0036] Figure 19 It is used for explanation Figure 3 A schematic diagram of the general operation of the substrate cleaning device.

[0037] Figure 20 This diagram illustrates the relationship between a series of actions of a substrate cleaning apparatus during the cleaning process of a substrate and whether or not cleaning solution can be supplied from the cleaning solution supply unit to the brush nozzle.

[0038] Figure 21 This diagram illustrates an example of the supply status of the cleaning solution for brushing during the period when the substrate W is held by the upper holding device.

[0039] Figure 22 This diagram illustrates an example of the supply status of the cleaning solution for brushing during the period when the substrate W is held by the upper holding device. Detailed Implementation

[0040] Hereinafter, a substrate processing apparatus and substrate processing method according to an embodiment of the present invention will be described using drawings. In the following description, "substrate" refers to a semiconductor substrate (wafer), a substrate for an FPD (Flat Panel Display) such as a liquid crystal display device or an organic EL (ElectroLuminescence) display device, a substrate for an optical disc, a substrate for a magnetic disk, a substrate for a magneto-optical disc, a substrate for a photomask, a ceramic substrate, or a substrate for a solar cell, etc. Furthermore, in this embodiment, the upper surface of the substrate is the circuit formation surface (front side), and the lower surface of the substrate is the surface opposite to the circuit formation surface (back side). Additionally, the substrate used in this embodiment has at least a circular outer periphery. For example, the substrate used in this embodiment has a circular outer periphery outside the notch.

[0041] 1. Composition of the substrate processing device

[0042] Figure 1 This is a schematic top view of a substrate processing apparatus according to an embodiment of the present invention. Figure 2 yes Figure 1 A schematic cross-sectional view of the substrate processing apparatus 100 at the JJ line. (See attached image.) Figure 1As shown, the substrate processing apparatus 100 of this embodiment has a indexing block 110 and a processing block 120. The indexing block 110 and the processing block 120 are arranged adjacent to each other.

[0043] The indexing block 110 includes multiple (four in this example) carrier placement stages 140 and a transport section 150. The multiple carrier placement stages 140 are arranged in a row, connected to the transport section 150 and spaced apart. On each carrier placement stage 140, a carrier C for accommodating multiple substrates W is placed.

[0044] In the conveying section 150, an indexing robot 200 and a control device 170 are provided. The indexing robot 200 includes multiple (four in this example) hands Ia, Ib, Ic, Id, a hand support component 210, and a conveying drive unit 220.

[0045] Multiple hands Ia to Id are configured to hold multiple substrates W respectively, such as Figure 2 As shown, the hand support members 210 are arranged at regular intervals along the vertical direction. The hand support members 210 are formed to extend in one direction, supporting multiple hands Ia to Id so that they can move forward and backward in that direction. The transport drive unit 220 is configured to move in the horizontal direction (the direction in which the multiple carrier platforms 140 are arranged), supporting the hand support members 210 so that they can rotate and move up and down about a vertical axis. Furthermore, the transport drive unit 220 includes multiple motors and cylinders, etc., to move the hand support members 210 horizontally and rotate and move up and down about a vertical axis in order to transport multiple substrates W using the multiple hands Ia to Id. Additionally, the transport drive unit 220 causes the multiple hands Ia to Id to move forward and backward in the horizontal direction. The control device 170 includes a computer, etc., to control the constituent elements within the substrate processing apparatus 100. The computer includes a CPU (Central Processing Unit), RAM (Random Access Memory), ROM (Read-Only Memory), and a storage device.

[0046] An operation panel 180 is provided in a portion of the conveying section 150 (a portion of the outer wall of the conveying section 150) in the indexing block 110. The operation panel 180 is configured to be operated by a user from outside the substrate processing apparatus 100. The operation panel 180 is connected to a control device 170, for example, to allow the user to input operating conditions for the constituent elements within the substrate processing apparatus 100.

[0047] like Figure 1 As shown, the processing block 120 includes washing sections 161 and 162 and a conveying section 163. The washing sections 161, 162, and 163 are arranged adjacent to and sequentially arranged with respect to the conveying section 150. In the washing section 161, as... Figure 2As shown, multiple (four in this example) substrate cleaning devices 1 are configured on the upper and lower layers. Figure 1 The cleaning section 162 has the same configuration as the cleaning section 161. Therefore, in the cleaning section 162, in the same configuration as the cleaning section 161, a plurality of (four in this example) substrate cleaning devices 1 are arranged in the upper and lower layers.

[0048] Each substrate cleaning apparatus 1 has an inlet / outlet 2x for loading and unloading a substrate W into and out of the substrate cleaning apparatus 1. Figure 2 The details of the composition and operation of the substrate cleaning apparatus 1 will be described below.

[0049] In the conveying section 163, a main robot arm 300 is provided. The main robot arm 300 includes multiple (four in this example) hands Ma, Mb, Mc, and Md, a hand support member 310, and a conveying drive unit 320. The multiple hands Ma to Md have a common configuration and are arranged on the hand support member 310 in a vertical direction. Each hand Ma to Md is configured to hold the substrate W in a horizontal position.

[0050] like Figure 1 As shown, the hand support member 310 is formed extending in one direction, independently supporting each of the plurality of hands Ma to Md, enabling them to move forward and backward in that direction. The transport drive unit 320, controlled by the control device 170, supports the hand support member 310, allowing it to rotate and move up and down about a vertical axis. Furthermore, the transport drive unit 320 includes multiple motors and cylinders, etc., to rotate and move the hand support member 310 about a vertical axis in order to transport multiple substrates W using the plurality of hands Ma to Md. Additionally, the transport drive unit 320 causes the plurality of hands Ma to Md to move forward and backward in a horizontal direction.

[0051] Between the indexing block 110 and the processing block 120, multiple (four in this example) substrate placement sections PASS1 and multiple substrate placement sections PASS2 are stacked on top of each other for transferring the substrate W between the indexing robot 200 and the main robot 300. The multiple substrate placement sections PASS1 are located above the multiple (four in this example) substrate placement sections PASS2.

[0052] Multiple substrate placement units PASS2 are used to transfer substrate W from indexing robot 200 to main robot 300. Multiple substrate placement units PASS1 are used to transfer substrate W from main robot 300 to indexing robot 200.

[0053] The indexing robot 200 removes the unprocessed substrate W from one of the multiple carriers C placed on the multiple carrier placement stages 140. Then, the indexing robot 200 places the removed unprocessed substrate W onto one of the multiple substrate placement sections PASS2. Next, the indexing robot 200 receives the processed substrate W placed on one of the multiple substrate placement sections PASS1 and houses it in an empty carrier C.

[0054] The main robot 300 receives multiple unprocessed substrates W placed on multiple substrate placement sections PASS2 via multiple hands Ma to Md. Furthermore, the main robot 300 transfers the unprocessed substrates W received from the substrate placement sections PASS2 via the multiple hands Ma to Md into multiple substrate cleaning devices 1 of the cleaning section 161 or cleaning section 162. Then, the main robot 300 removes multiple processed substrates W from the multiple substrate cleaning devices 1 via the multiple hands Ma to Md. Afterwards, the main robot 300 places the processed substrates W removed from each substrate cleaning device 1 onto any one of the multiple substrate placement sections PASS1.

[0055] 2. Composition of substrate cleaning apparatus 1

[0056] Figure 3 yes Figure 1 A schematic top view of the substrate cleaning apparatus 1. Figure 4 It means Figure 3 A perspective view of the internal structure of the substrate cleaning apparatus 1. In the substrate cleaning apparatus 1 of this embodiment, the X, Y, and Z directions, which are orthogonal to each other, are defined to clarify the positional relationships. Figure 3 and Figure 4 In the subsequent diagrams, arrows will be used to indicate the X, Y, and Z directions. The X and Y directions are orthogonal to each other in the horizontal plane, and the Z direction corresponds to the vertical direction (up and down).

[0057] like Figure 3 As shown, the substrate cleaning apparatus 1 includes upper holding devices 10A and 10B, lower holding device 20, base device 30, transfer device 40, lower surface cleaning device 50, protective cover device 60, upper surface cleaning device 70, end cleaning device 80, and opening / closing device 90. These components are disposed within the unit housing 2. Figure 4 In the image, the unit housing 2 is shown in dashed lines.

[0058] The unit housing 2 has a rectangular bottom portion 2a and four sidewall portions 2b, 2c, 2d, and 2e extending upward from the four sides of the bottom portion 2a. Sidewall portions 2b and 2c face each other, and sidewall portions 2d and 2e face each other. A rectangular opening is formed in the center of the sidewall portion 2b. This opening is a loading / unloading outlet 2x for the substrate W, used when the substrate W is loaded into and unloaded from the unit housing 2. Figure 4 In the diagram, the loading / unloading outlet 2x is shown as a thick dashed line. In the following description, the direction in the Y direction from the inside of the unit housing 2 through the loading / unloading outlet 2x to the outside of the unit housing 2 (the direction from side wall 2c to side wall 2b) is referred to as the front, and the opposite direction (the direction from side wall 2b to side wall 2c) is referred to as the rear.

[0059] An opening and closing device 90 is provided in the area where the inlet / outlet 2x is formed on the side wall portion 2b and in the vicinity thereon. The opening and closing device 90 includes a baffle 91 configured to be able to be opened and closed, and a baffle drive portion 92 for driving the baffle 91. Figure 4 In the diagram, baffle 91 is shown with a thick double-dotted line. Baffle drive unit 92 drives baffle 91 to open the loading / unloading outlet 2x when the substrate W is loaded into and out of the substrate cleaning apparatus 1. Thus, baffle 91 is in the open state. Alternatively, baffle drive unit 92 drives baffle 91 to close the loading / unloading outlet 2x during cleaning of the substrate W in the substrate cleaning apparatus 1. Thus, baffle 91 is in the closed state.

[0060] A base device 30 is provided at the center of the bottom portion 2a. The base device 30 includes a linear guide rail 31, a movable base 32, and a base drive unit 33. The linear guide rail 31 includes two tracks, which are arranged to extend from near the side wall portion 2b along the Y direction to near the side wall portion 2c when viewed from above. The movable base 32 is arranged so that it can move along the Y direction on the two tracks of the linear guide rail 31. The base drive unit 33 includes, for example, a pulse motor, to move the movable base 32 along the Y direction on the linear guide rail 31.

[0061] On the movable base 32, a lower holding device 20 and a lower surface cleaning device 50 are arranged in a Y-direction configuration. The lower holding device 20 includes an adsorption holding section 21 and an adsorption holding drive section 22. The adsorption holding section 21 is a so-called rotating chuck, having a circular adsorption surface capable of adsorbing and holding the lower surface of the substrate W, and is configured to rotate about an axis extending in the vertical direction (the Z-direction axis). In the following description, the area on the lower surface of the substrate W that should be adsorbed by the adsorption surface of the adsorption holding section 21 when the substrate W is adsorbed and held by the adsorption holding section 21 is referred to as the central region of the lower surface. On the other hand, the area on the lower surface of the substrate W that surrounds the central region of the lower surface is referred to as the outer region of the lower surface.

[0062] The adsorption-holding drive unit 22 includes a motor. The motor of the adsorption-holding drive unit 22 is mounted on a movable base 32 with its rotation axis projecting upwards. The adsorption-holding unit 21 is mounted on the upper end of the rotation axis of the adsorption-holding drive unit 22. Furthermore, the rotation axis of the adsorption-holding drive unit 22 forms a suction path for adsorbing and holding the substrate W in the adsorption-holding unit 21. This suction path is connected to an air inlet device (not shown). The adsorption-holding drive unit 22 rotates the adsorption-holding unit 21 about the rotation axis.

[0063] On the movable base 32, near the lower holding device 20, a connecting device 40 is further provided. The connecting device 40 includes multiple (three in this example) support pins 41, pin connecting members 42, and pin lifting drive 43. The pin connecting members 42 are formed to surround the adsorption holding part 21 from a top view and connect multiple support pins 41. The multiple support pins 41 are interconnected by the pin connecting members 42 and extend upward from the pin connecting members 42 by a certain length. The pin lifting drive 43 causes the pin connecting members 42 to rise and fall on the movable base 32. As a result, the multiple support pins 41 rise and fall relative to the adsorption holding part 21.

[0064] The lower surface cleaning device 50 includes a lower surface brush 51, two substrate nozzles 52, two brush nozzles 52a and 52b, a gas ejection section 53, a lifting support section 54, a lower surface brush rotation drive section 55a, and a lower surface brush lifting drive section 55b. Figure 4 As shown, the lifting support 54 is mounted on the movable base 32 in a way that allows it to be lifted and lowered. The lifting support 54 has an upper surface 54u that is inclined downward in a direction away from the adsorption and holding part 21 (rearward in this example).

[0065] like Figure 3 As shown, the lower surface brush 51 has a circular shape when viewed from above, and is formed to be relatively large in this embodiment. Specifically, the diameter of the lower surface brush 51 is larger than the diameter of the adsorption surface of the adsorption holding portion 21, for example, it is 1.3 times the diameter of the adsorption surface of the adsorption holding portion 21. In addition, the diameter of the lower surface brush 51 is larger than 1 / 3 of the diameter of the substrate W and smaller than 1 / 2 of the diameter of the substrate W. Furthermore, the diameter of the substrate W is, for example, 300 mm.

[0066] The lower surface brush 51 is a sponge brush, preferably formed of a material with relatively low wettability, such as a fluorinated resin. In this case, the adhesion of contaminants to the lower surface brush 51 is reduced. Thus, the lower surface brush 51 is less prone to contamination. In this example, the lower surface brush 51 is formed of PTFE (polytetrafluoroethylene), but the embodiment is not limited to this. The lower surface brush 51 may also be formed of a relatively soft resin material such as PVA (polyvinyl alcohol).

[0067] The lower surface brush 51 has a cleaning surface that can contact the lower surface of the substrate W. In addition, the lower surface brush 51 is mounted on the upper surface 54u of the lifting support 54 with the cleaning surface facing upward and the cleaning surface being rotatable about an axis that passes through the center of the cleaning surface and extends in the vertical direction.

[0068] Two substrate nozzles 52 are each mounted on the upper surface 54u of the lifting support 54, positioned near the lower surface brush 51 with the liquid outlet facing upwards. A lower surface cleaning liquid supply unit 56 is connected to each substrate nozzle 52. Figure 7 The lower surface cleaning solution supply unit 56 supplies cleaning solution for substrate cleaning to the substrate nozzle 52. When the substrate W is cleaned using the lower surface brush 51, the substrate nozzle 52 sprays the cleaning solution supplied from the lower surface cleaning solution supply unit 56 onto the lower surface of the substrate W. In this embodiment, pure water is used as the cleaning solution supplied to the substrate nozzle 52.

[0069] Two brush nozzles 52a and 52b are used to clean the lower surface brush 51. Each of the two brush nozzles 52a and 52b is mounted on the upper surface 54u of the lifting support 54, positioned near the lower surface brush 51. A brush cleaning solution supply unit 57 is connected to the brush nozzles 52a and 52b. Figure 7 The cleaning solution supply unit 57 supplies cleaning solution to the brush nozzles 52a and 52b. The cleaning solution supplied by the cleaning solution supply unit 57 is then sprayed from the brush nozzles 52a and 52b toward the lower surface brush 51. The cleaning solution supplied to the two substrate nozzles 52 is the same as the cleaning solution supplied to the two brush nozzles 52a and 52b. Therefore, in this embodiment, pure water is used as the cleaning solution supplied to the brush nozzles 52a and 52b.

[0070] Figure 5 It means from Figure 4 This is a side view of an example of a brush nozzle 52a spraying cleaning solution onto the lower surface brush 51. The brush nozzle 52a is positioned such that its front end (liquid outlet) faces upwards toward the lower surface brush 51 on the upper surface 54u of the lifting support 54. Therefore, as... Figure 5 As shown by the dashed arrow, the cleaning liquid sprayed from the brush nozzle 52a is guided to the center of the cleaning surface of the lower surface brush 51 in a parabolic manner from the side of the lower surface brush 51.

[0071] Figure 6 It means from Figure 4 Another side view of an example of a brush nozzle 52b spraying cleaning solution onto the lower surface brush 51. The brush nozzle 52b is positioned on the upper surface 54u of the lifting support 54 such that its front end (liquid outlet) faces the side (outer peripheral end) of the lower surface brush 51. Therefore, as... Figure 6 As shown by the dashed arrow, the cleaning fluid sprayed from the brush nozzle 52b is guided from the side of the lower surface brush 51 to the side (outer peripheral end) of the lower surface brush 51.

[0072] Figure 4 The gas ejection section 53 is a slit-shaped gas nozzle with a gas outlet extending in one direction. The gas ejection section 53 is independently and vertically mounted on the movable base 32 relative to the other components of the lower surface cleaning device 50. The description of the drive unit for raising and lowering the gas ejection section 53 is omitted. The gas outlet of the gas ejection section 53, viewed from above, is located between the lower surface brush 51 and the adsorption holding section 21 and faces upwards. The gas ejection section 53 is connected to the ejected gas supply section 58. Figure 7 ).

[0073] The ejected gas supply unit 58 supplies gas to the gas ejection unit 53. In this embodiment, an inert gas such as nitrogen is used as the gas supplied to the gas ejection unit 53. When the substrate W is cleaned using the lower surface brush 51 and when the lower surface of the substrate W is dried (described later), the gas ejection unit 53 ejects the gas supplied by the ejected gas supply unit 58 onto the lower surface of the substrate W. In this case, a strip-shaped air curtain extending in the X direction is formed between the lower surface brush 51 and the adsorption holding unit 21.

[0074] Figure 3 The lower surface brush rotation drive unit 55a includes a motor that rotates the lower surface brush 51 substantially during the power-on period of the substrate processing apparatus 100. The lower surface brush lifting drive unit 55b includes a stepper motor or cylinder that lifts and lowers the lifting support unit 54 on the movable base 32.

[0075] A protective cover device 60 is also provided in the center of the bottom part 2a. The protective cover device 60 includes a protective cover 61 and a protective cover drive unit 62. The protective cover 61 is provided in a way that surrounds the lower side holding device 20 and the base device 30 when viewed from above, and can be raised and lowered. Figure 4 In the diagram, the shield 61 is shown in dashed lines. The shield drive unit 62 moves the shield 61 between a lower shield position and an upper shield position depending on which portion of the lower surface of the substrate W is cleaned by the lower surface brush 51. The lower shield position is when the upper end of the shield 61 is at a height lower than the substrate W held by the adsorption and holding unit 21. Conversely, the upper shield position is when the upper end of the shield 61 is at a height higher than the adsorption and holding unit 21. When the shield 61 is in the upper shield position, the shield 61 and the adsorption and holding unit 21 overlap each other in a side view.

[0076] At a height higher than the protective cover 61, a pair of upper retaining devices 10A and 10B are arranged opposite each other across the base device 30 when viewed from above. The upper retaining device 10A includes a lower chuck 11A, an upper chuck 12A, a lower chuck drive unit 13A, and an upper chuck drive unit 14A. The upper retaining device 10B includes a lower chuck 11B, an upper chuck 12B, a lower chuck drive unit 13B, and an upper chuck drive unit 14B.

[0077] The lower chucks 11A and 11B are arranged symmetrically about the center of the adsorption holding part 21 and extending vertically in the Y direction (front-to-back direction) when viewed from above, and are configured to be movable in the X direction within a common horizontal plane. Each of the lower chucks 11A and 11B has two support plates that can support the lower periphery of the substrate W from below. The lower chuck driving parts 13A and 13B move the lower chucks 11A and 11B either by bringing them closer together or by moving them further apart.

[0078] Like the lower chucks 11A and 11B, the upper chucks 12A and 12B are symmetrically arranged in a vertical plane extending along the Y direction (front-to-back direction) through the center of the adsorption holding portion 21 when viewed from above, and are configured to be movable in the X direction within a common horizontal plane. Each of the upper chucks 12A and 12B has two holding tabs configured to abut against the outer peripheral end of the substrate W to hold the outer peripheral end of the substrate W. The upper chuck driving portions 14A and 14B move the upper chucks 12A and 12B by either bringing them closer together or moving them further apart.

[0079] like Figure 3 As shown, an upper surface cleaning device 70 is disposed on one side of the protective cover 61, near the upper holding device 10B in a top view. The upper surface cleaning device 70 includes a rotating support shaft 71, an arm 72, a spray nozzle 73, and an upper surface cleaning drive unit 74.

[0080] The rotating support shaft 71 extends vertically on the bottom part 2a and is supported by the upper surface cleaning drive part 74, allowing it to be raised, lowered, and rotated. Figure 4 As shown, arm 72 is positioned above the upper retaining device 10B, extending horizontally from the upper end of the rotating support shaft 71. A spray nozzle 73 is mounted at the front end of arm 72.

[0081] The spray nozzle 73 is connected to the upper surface cleaning fluid supply section 75. Figure 7The upper surface cleaning fluid supply unit 75 supplies cleaning fluid and gas to the spray nozzle 73. In this embodiment, pure water is used as the cleaning fluid supplied to the spray nozzle 73, and an inert gas such as nitrogen is used as the gas supplied to the spray nozzle 73. When cleaning the upper surface of the substrate W, the spray nozzle 73 mixes the cleaning fluid supplied from the upper surface cleaning fluid supply unit 75 with the gas to generate a mixed fluid, and sprays the generated mixed fluid downward.

[0082] The upper surface cleaning drive unit 74 includes one or more pulse motors and cylinders, which raise and lower the rotating support shaft 71 and rotate the rotating support shaft 71. According to the above configuration, by moving the spray nozzle 73 in an arc shape on the upper surface of the substrate W, which is adsorbed, held and rotated by the adsorption and holding unit 21, the entire upper surface of the substrate W can be cleaned.

[0083] like Figure 3 As shown, on the other side of the cover 61, in a top view near the upper holding device 10A, an end cleaning device 80 is provided. The end cleaning device 80 includes a rotating support shaft 81, an arm 82, a bevel brush 83, and a bevel brush drive unit 84.

[0084] The rotating support shaft 81 is located on the bottom part 2a and is supported by the inclined brush drive part 84 in a vertically extending manner, allowing it to be raised, lowered, and rotated. Figure 4 As shown, arm 82 is positioned above the upper holding device 10A, extending horizontally from the upper end of the rotary support shaft 81. At the front end of arm 82, a beveled brush 83 is provided, protruding downwards and capable of rotating about an axis in the vertical direction.

[0085] The upper half of the beveled brush 83 has an inverted frustum shape and the lower half has a frustum shape. According to this beveled brush 83, the outer peripheral end of the substrate W can be cleaned using the central portion of the outer peripheral surface in the vertical direction.

[0086] The inclined brush drive unit 84 includes one or more pulse motors and cylinders, which raise and lower the rotating support shaft 81 and rotate the rotating support shaft 81. According to the above configuration, by bringing the central portion of the outer peripheral surface of the inclined brush 83 into contact with the outer peripheral end of the substrate W which is adsorbed, held, and rotated by the adsorption and holding unit 21, the entire outer peripheral end of the substrate W can be cleaned.

[0087] Here, the bevel brush drive unit 84 also includes a motor built into the arm 82. This motor causes the bevel brush 83, which is located at the front end of the arm 82, to rotate about an axis in the vertical direction. Therefore, when cleaning the outer peripheral end of the substrate W, the cleaning force of the bevel brush 83 on the outer peripheral end of the substrate W is increased by rotating the bevel brush 83.

[0088] 3. Control system of substrate processing apparatus

[0089] Figure 7 It means Figure 1 A block diagram illustrating the configuration of the control system for the substrate processing apparatus 100. As described above, Figure 1 The control device 170 includes a CPU, RAM, ROM, and a storage device. RAM is used as the operating area of ​​the CPU. ROM stores the system program. The storage device stores the substrate processing program.

[0090] Figure 7 Only shown in Figure 1 The configuration of the control system of the substrate processing apparatus 100 and the corresponding part of each of the plurality of substrate cleaning apparatuses 1. For example... Figure 7 As shown, the control device 170 includes a chuck control unit 9A, an adsorption control unit 9B, a base control unit 9C, a transfer control unit 9D, a lower surface cleaning control unit 9E, a protective cover control unit 9F, an upper surface cleaning control unit 9G, an inclined surface cleaning control unit 9H, a transfer in / out control unit 9I, and a condition receiving unit 9J, serving as functional units for controlling the operation of each of the multiple substrate cleaning devices 1. Figure 5 As shown, the control device 170 includes a chuck control unit 9A, an adsorption control unit 9B, a base control unit 9C, a transfer control unit 9D, a lower surface cleaning control unit 9E, a protective cover control unit 9F, an upper surface cleaning control unit 9G, an inclined surface cleaning control unit 9H, and a loading / unloading control unit 9I, serving as functional units for controlling the operation of each of the multiple substrate cleaning devices 1. The functions of the control device 170 are implemented by the CPU executing the substrate cleaning program stored in the RAM. Alternatively, some or all of the functions of the control device 170 can be implemented using hardware such as electronic circuits.

[0091] The chuck control unit 9A controls the lower chuck drive units 13A and 13B and the upper chuck drive units 14A and 14B to receive the substrate W that is brought into the substrate cleaning apparatus 1 and hold it above the adsorption holding unit 21. The adsorption control unit 9B controls the adsorption holding drive unit 22 to adsorb and hold the substrate W using the adsorption holding unit 21 and to rotate the adsorbed and held substrate W.

[0092] The base control unit 9C controls the base drive unit 33 to move the movable base 32 relative to the substrate W held by the upper holding devices 10A and 10B. The transfer control unit 9D controls the pin lifting drive unit 43 to move the substrate W between the height position of the substrate W held by the upper holding devices 10A and 10B and the height position of the substrate W held by the adsorption holding unit 21.

[0093] The lower surface cleaning control unit 9E controls the lower surface brush rotation drive unit 55a, the lower surface brush lifting drive unit 55b, the lower surface cleaning liquid supply unit 56, and the ejected gas supply unit 58 to clean the lower surface of the substrate W. Additionally, the lower surface cleaning control unit 9E controls the brush cleaning liquid supply unit 57 to clean the lower surface brush 51. The shield control unit 9F controls the shield drive unit 62 to catch the cleaning liquid that spills from the substrate W when cleaning the substrate W held by the adsorption and holding unit 21.

[0094] The upper surface cleaning control unit 9G controls the upper surface cleaning drive unit 74 and the upper surface cleaning fluid supply unit 75 to clean the upper surface of the substrate W held by the adsorption holding unit 21. The inclined surface cleaning control unit 9H controls the inclined surface brush drive unit 84 to clean the outer peripheral end of the substrate W held by the adsorption holding unit 21. The loading and unloading control unit 9I controls the baffle drive unit 92 to open and close the loading and unloading outlet 2x of the unit housing 2 when loading and unloading the substrate W into and out of the substrate cleaning apparatus 1.

[0095] The condition receiving unit 9J receives the operating conditions of each component in the substrate processing apparatus 100 input through the operation panel 180, and stores the received operating conditions in a storage device, such as that of the control device 170. This allows the setting of operating conditions for various components of the substrate processing apparatus 100.

[0096] 4. General Operation of Substrate Cleaning Apparatus 1

[0097] Figures 8-19 It is used for explanation Figure 3 A schematic diagram of the general operation of the substrate cleaning device 1. Figures 8-19 In each figure, the upper section shows a top view of the substrate cleaning apparatus 1. The middle section shows a side view of the lower holding device 20 and its periphery as viewed along the Y direction, and the lower section shows a side view of the lower holding device 20 and its periphery as viewed along the X direction. The side view in the middle section corresponds to... Figure 3 The side view of line AA, the side view of the lower segment corresponds to Figure 3 The BB line side view. Furthermore, to facilitate understanding of the shape and operating state of each component of the substrate cleaning apparatus 1, the scaling ratios of some components differ between the top view of the upper section and the side views of the middle and lower sections. Additionally, in Figures 8-19 In the image, the shield 61 is shown with a double-dotted line, and the shape of the substrate W is shown with a thick single-dotted line.

[0098] In the initial state (standby state) before the substrate W is moved into the substrate cleaning apparatus 1, the baffle 91 of the opening and closing device 90 closes the loading and unloading outlet 2x. Additionally, as... Figure 3As shown, the lower chucks 11A and 11B are maintained at a distance from each other that is sufficiently greater than the diameter of the substrate W. Similarly, the upper chucks 12A and 12B are also maintained at a distance from each other that is sufficiently greater than the diameter of the substrate W.

[0099] Furthermore, the movable base 32 of the base device 30 is arranged such that, when viewed from above, the center of the adsorption holding portion 21 is located at the center of the protective cover 61. The lower surface cleaning device 50 is located on the movable base 32 at a certain distance from the adsorption holding portion 21 along the Y direction. The cleaning surface (upper end) of the lower surface brush 51 of the lower surface cleaning device 50 is located lower than the adsorption holding portion 21. The vertical (Z direction) position of the lower surface brush 51 in the initial state is referred to as the standby position. When the substrate W is held by the adsorption holding portion 21, the brush standby position is located below the substrate W. In particular, in this embodiment, the standby position corresponds to the lowest position in the vertical range that the lower surface brush 51 can move up and down via the lifting support portion 54.

[0100] Furthermore, in the initial state, the transfer device 40 is positioned with the multiple support pins 41 located lower than the adsorption holding portion 21. Furthermore, the cover 61 of the cover device 60 is in the lower cover position. In the following description, the center position of the cover 61 viewed from above is referred to as the planar reference position rp. Additionally, the position of the movable base 32 on the bottom surface 2a when the center of the adsorption holding portion 21 is at the planar reference position rp viewed from above is referred to as the first horizontal position.

[0101] The substrate W is moved into the unit housing 2 of the substrate cleaning apparatus 1. Specifically, just before the substrate W is moved in, the baffle 91 opens the inlet / outlet 2x. Then, as... Figure 8 As shown by the medium-thick solid line arrow a1, Figure 1 The main robotic arm 300's hand (hand Ma in this example) enters the unit housing 2 through the loading / unloading outlet 2x, moving the substrate W to a position approximately in the center of the unit housing 2. At this time, the substrate W held by hand Ma is located between the lower chuck 11A and upper chuck 12A and the lower chuck 11B and upper chuck 12B.

[0102] Next, as Figure 9 As shown by the thick solid arrow a2, the lower chucks 11A and 11B are positioned close to each other with multiple support tabs located below the lower peripheral edge of the substrate W. In this state, the hand chuck Ma descends, and the substrate W held by the hand chuck Ma is placed onto the pair of lower chucks 11A and 11B. Multiple portions of the lower peripheral edge of the substrate W are supported by the multiple support tabs of the lower chucks 11A and 11B. Afterward, the empty hand chuck Ma exits from the loading / unloading outlet 2x. After the hand chuck Ma exits, the baffle 91 closes the loading / unloading outlet 2x.

[0103] In the following explanation, Figure 1 The action of the main robot 300 moving the substrate W into a substrate cleaning device 1 is called the moving action. This moving action includes: with at least a portion of the hand Ma inside the unit housing 2, the hand Ma performs a forward and backward movement. Therefore, in this embodiment, the period during which the main robot 300 performs the moving action includes, for example, the period when the substrate W is moved into a substrate cleaning device 1 and either hand (Ma to Md) of the main robot 300 is inside the unit housing 2.

[0104] Next, as Figure 10 As shown by the thick solid arrow a3, the upper clamps 12A and 12B are brought close together by their multiple retaining tabs abutting against the outer periphery of the substrate W. The substrate W, supported by the lower clamps 11A and 11B, is held by the upper clamps 12A and 12B by the multiple retaining tabs of the upper clamps 12A and 12B abutting against multiple portions of the outer periphery of the substrate W. Furthermore, as... Figure 10 As shown by the thick solid arrow a4, the movable base 32 moves forward from the first horizontal position with the adsorption and holding part 21 offset from the plane reference position rp by a predetermined distance, and the center of the lower surface brush 51 located at the plane reference position rp. The position on the bottom surface 2a of the movable base 32 when the center of the lower surface brush 51 is located at the plane reference position rp when viewed from above is called the second horizontal position.

[0105] Next, as Figure 11 As indicated by the thick solid arrow a5, the lifting support 54 rises with the cleaning surface of the lower surface brush 51 in the standby position contacting the central region of the lower surface of the substrate W. The position of the lower surface brush 51 in contact with the lower surface of the substrate W when the substrate W is held by the upper holding devices 10A and 10B is referred to as the first processing position. Furthermore, as... Figure 11 As shown by the thick solid arrow a6, the lower surface brush 51 rotates (spins) about an axis in the vertical direction. This physically removes contaminants adhering to the central region of the lower surface of the substrate W using the lower surface brush 51.

[0106] exist Figure 11The following section shows an enlarged side view of the portion where the lower surface brush 51 contacts the lower surface of the substrate W, within a bubble frame. As shown in the bubble frame, with the lower surface brush 51 in contact with the substrate W, the substrate nozzle 52 and the gas ejection section 53 are held close to the lower surface of the substrate W. At this time, as indicated by the hollow arrow a51, the substrate nozzle 52 sprays cleaning fluid toward the lower surface of the substrate W from a position near the lower surface brush 51. Thus, the cleaning fluid supplied from the substrate nozzle 52 to the lower surface of the substrate W is guided to the contact portion between the lower surface brush 51 and the substrate W, thereby rinsing away contaminants removed from the back side of the substrate W by the cleaning fluid. In this way, in the lower surface cleaning apparatus 50, the substrate nozzle 52 and the lower surface brush 51 are mounted together on the lifting support section 54. This allows for efficient supply of cleaning fluid to the cleaning section that uses the lower surface brush 51 to clean the lower surface of the substrate W. Therefore, the consumption of cleaning fluid is reduced and excessive dispersion of the cleaning fluid is suppressed.

[0107] Here, the upper surface 54u of the lifting support portion 54 is inclined downwards in a direction away from the adsorption and holding portion 21. In this case, when the cleaning liquid containing contaminants drips from the lower surface of the substrate W onto the lifting support portion 54, the cleaning liquid caught by the upper surface 54u will be guided away from the adsorption and holding portion 21.

[0108] Additionally, when cleaning the lower surface of the substrate W using the lower surface brush 51, such as Figure 11 As indicated by the hollow arrow a52 within the bubble frame, the gas ejection section 53 sprays gas toward the lower surface of the substrate W at a position between the lower surface brush 51 and the adsorption holding section 21. In this embodiment, the gas ejection section 53 is mounted on the movable base 32 with the gas ejection nozzle extending in the X direction. In this case, when gas is sprayed from the gas ejection section 53 toward the lower surface of the substrate W, a ribbon-like air curtain extending in the X direction is formed between the lower surface brush 51 and the adsorption holding section 21. This prevents the cleaning liquid containing contaminants from scattering toward the adsorption holding section 21 when the lower surface of the substrate W is cleaned using the lower surface brush 51. Therefore, it is possible to prevent the cleaning liquid containing contaminants from adhering to the adsorption holding section 21 when the lower surface of the substrate W is cleaned using the lower surface brush 51, thereby keeping the adsorption surface of the adsorption holding section 21 clean.

[0109] In addition, Figure 11 In the example, regarding the gas ejection section 53, as shown by the hollow arrow a52, gas is ejected obliquely upwards from the gas ejection section 53 toward the lower surface brush 51, but the present invention is not limited to this. The gas ejection section 53 may also eject gas in the Z direction toward the lower surface of the substrate W.

[0110] Next, in Figure 11In this state, after the central region of the lower surface of the substrate W is cleaned, the lifting support 54 is lowered such that the cleaning surface of the lower surface brush 51 is at a predetermined distance from the substrate W. At the same time, the spraying of cleaning liquid from the substrate nozzle 52 onto the substrate W stops. Meanwhile, gas continues to be sprayed onto the substrate W from the gas ejection section 53.

[0111] After that, as Figure 12 As indicated by the thick solid arrow a7, the movable base 32 is moved rearward with the center of the adsorption and holding part 21 located at the plane reference position rp when viewed from above. That is, the movable base 32 moves from the second horizontal position to the first horizontal position. At this time, by continuing to spray gas from the gas ejection part 53 onto the substrate W, the central region of the lower surface of the substrate W is dried sequentially by the gas curtain.

[0112] Next, as Figure 13 As indicated by the thick solid arrow a8, the lifting support 54 is lowered such that the cleaning surface of the lower surface brush 51 is positioned lower than the adsorption surface (upper end) of the adsorption holding part 21. This moves the lower surface brush 51 to the standby position. Additionally, as... Figure 13 As shown by the thick solid arrow a9, the upper chucks 12A and 12B are spaced apart from the outer periphery of the substrate W by the multiple holding tabs of the upper chucks 12A and 12B. At this time, the substrate W is in a state supported by the lower chucks 11A and 11B (a mounted state). In addition, the lower surface brush 51 can also be moved from the first processing position to the standby position after the central area of ​​the lower surface of the substrate W is cleaned and before drying by the gas ejection section 53.

[0113] After that, as Figure 13 As indicated by the thick solid arrow a10, the pin connecting member 42 is raised such that the upper ends of the plurality of support pins 41 are positioned slightly above the lower clamps 11A and 11B. As a result, the substrate W supported by the lower clamps 11A and 11B is received by the plurality of support pins 41.

[0114] Next, as Figure 14 As indicated by the thick solid arrow a11, the lower clamps 11A and 11B are moved away from each other. At this time, the lower clamps 11A and 11B are moved to a position that, when viewed from above, does not overlap with the substrate W supported by the multiple support pins 41. Thus, the upper holding devices 10A and 10B are restored to their initial state.

[0115] Next, as Figure 15As indicated by the thick solid arrow a12, the pin-connecting member 42 is lowered such that the upper ends of the multiple support pins 41 are positioned lower than the adsorption and holding portion 21. Consequently, the substrate W supported on the multiple support pins 41 is received by the adsorption and holding portion 21. In this state, the adsorption and holding portion 21 adsorbs and holds the central region of the lower surface of the substrate W. Simultaneously with or after the lowering of the pin-connecting member 42, as... Figure 15 As shown by the thick solid line arrow a13, the protective cover 61 rises from the lower protective cover position to the upper protective cover position.

[0116] Next, as Figure 16 As shown by the thick solid arrow a14, the adsorption holding part 21 rotates about an axis in the vertical direction (the axis of rotation of the adsorption holding drive part 22). As a result, the substrate W adsorbed and held in the adsorption holding part 21 rotates in a horizontal position.

[0117] Next, the rotating support shaft 71 of the upper surface cleaning device 70 rotates and descends. Thus, as... Figure 16 As indicated by the thick solid arrow a15, the spray nozzle 73 moves to a position above the substrate W. Furthermore, the spray nozzle 73 descends at a predetermined distance from the substrate W. In this state, the spray nozzle 73 sprays a mixture of cleaning fluid and gas onto the upper surface of the substrate W. Additionally, the rotation support shaft 71 rotates. Thus, as... Figure 16 As indicated by the thick solid arrow a16, the spray nozzle 73 moves to a position above the rotating substrate W. The entire upper surface of the substrate W is cleaned by spraying the mixed fluid onto it.

[0118] When the upper surface of the substrate W is cleaned using the spray nozzle 73, the rotating support shaft 81 of the end cleaning device 80 also rotates and descends. Thus, as... Figure 16 As indicated by the thick solid arrow a17, the beveled brush 83 moves to a position above the outer peripheral end of the substrate W. It then descends such that the central portion of the outer peripheral surface of the beveled brush 83 contacts the outer peripheral end of the substrate W. In this state, the beveled brush 83 rotates (spins) about its vertical axis. This physically removes contaminants adhering to the outer peripheral end of the substrate W using the beveled brush 83. The contaminants removed from the outer peripheral end of the substrate W are then rinsed away by a cleaning solution sprayed from the nozzle 73 onto the substrate W.

[0119] Furthermore, when cleaning the upper surface of the substrate W using the spray nozzle 73, the lifting support 54 is raised by contacting the cleaning surface of the lower surface brush 51 with the outer region of the lower surface of the substrate W. The position of the lower surface brush 51 in contact with the lower surface of the substrate W while it is held by the lower holding device 20 is referred to as the second processing position. Additionally, as... Figure 16As shown by the thick solid arrow a18, the lower surface brush 51 rotates (spins) about an axis in the vertical direction. Furthermore, the substrate nozzle 52 sprays cleaning liquid toward the lower surface of the substrate W, and the gas ejection section 53 sprays gas toward the lower surface of the substrate W. Thus, the entire outer region of the lower surface of the substrate W, which is held and rotated by the adsorption and holding section 21, can be cleaned using the lower surface brush 51. The rotation direction of the lower surface brush 51 can also be opposite to the rotation direction of the adsorption and holding section 21. In this case, the outer region of the lower surface of the substrate W can be cleaned efficiently.

[0120] Furthermore, the lifting support 54 can also be configured to move relative to the lower holding device 20 in the Y direction on the movable base 32. In this case, such as Figure 16 As indicated by the thick solid arrow a19, the lifting support 54 moves along the Y direction on the movable base 32. Thus, regardless of the size of the lower surface brush 51, the entire outer region of the lower surface of the substrate W can be cleaned using the lower surface brush 51.

[0121] After the upper surface, outer peripheral end, and outer area of ​​the lower surface of substrate W are cleaned, the spraying of the mixing fluid from nozzle 73 onto substrate W is stopped. Additionally, as... Figure 17 As indicated by the thick solid line arrow a20, the spray nozzle 73 has moved to a position to one side of the shield 61 (its initial position). Additionally, as... Figure 17 As indicated by the thick solid arrow a21, the inclined brush 83 moves to the other side of the protective cover 61 (the initial position). Then, the lifting support 54 descends such that the cleaning surface of the lower surface brush 51 is at a predetermined distance from the substrate W. As a result, the lower surface brush 51 moves from the second processing position to the standby position. Furthermore, the ejection of cleaning liquid from the substrate nozzle 52 onto the substrate W and the ejection of gas from the gas ejection section 53 onto the substrate W cease. In this state, the high-speed rotation of the adsorption holding section 21 causes the cleaning liquid adhering to the substrate W to be shaken off, thus drying the entire substrate W.

[0122] Next, as Figure 18 As shown by the thick solid arrow a22, the shield 61 descends from the upper shield position to the lower shield position. Additionally, in preparation for moving the new substrate W into the cell housing 2, as... Figure 1 As shown by the thick solid arrow a23 in 8, bring the lower clamps 11A and 11B close to each other until they can support the new substrate W.

[0123] Finally, the substrate W is removed from the unit housing 2 of the substrate cleaning apparatus 1. Specifically, just before the substrate W is removed, the baffle 91 opens the inlet / outlet 2x. Then, as... Figure 1 As shown by the thick solid line arrow a24 in 9, Figure 1The main robotic arm 300's hand Ma enters the unit housing 2 through the inlet / outlet 2x. Then, the hand Ma receives the substrate W on the adsorption holding part 21 and exits from the inlet / outlet 2x. After the hand Ma exits, the baffle 91 closes the inlet / outlet 2x.

[0124] In the following description, Figure 1 The action of the main robotic arm 300 removing the substrate W from a substrate cleaning device 1 is called the removal action. This removal action includes: the hand Ma performing a forward and backward movement while at least a portion of the hand Ma is inside the unit housing 2. Therefore, in this embodiment, the period during which the main robotic arm 300 performs the removal action includes, for example, the period during which the substrate W is removed from a substrate cleaning device 1 and either hand of the main robotic arm 300 is inside the unit housing 2.

[0125] 5. Spray cleaning solution from brush nozzles 52a and 52b onto the lower surface brush 51.

[0126] (a) Clean the lower surface with 51 brush.

[0127] In the substrate cleaning apparatus 1, cleaning fluid is sprayed from brush nozzles 52a and 52b onto the rotating lower surface brush 51. In this case, cleaning fluid is supplied to the entire lower surface brush 51, rinsing away contaminants adhering to it. This prevents the substrate W from being cleaned using a lower surface brush 51 with reduced cleanliness. Furthermore, it prevents the lower surface brush 51 from drying out, and prevents defects (damage) from occurring due to contact between a dried lower surface brush 51 and the substrate W.

[0128] The outer region of the lower surface of the substrate W is cleaned using a relatively large lower surface brush 51. Figure 16 The time required is longer than that required to clean the upper surface of substrate W using nozzle 73. Figure 16 The required time is short. Therefore, in this embodiment, during the cleaning of the upper surface of the substrate W using the spray nozzle 73, the lower surface brush 51 moves back and forth multiple times between the cleaning position and the standby position. Furthermore, when the lower surface brush 51 is in the standby position, cleaning fluid is sprayed from the brush nozzles 52a and 52b onto the lower surface brush 51. Thus, the cleaning of the outer region of the lower surface of the substrate W and the cleaning of the lower surface brush 51 are performed alternately. In this case, compared to the case where the outer region of the lower surface of the substrate W is continuously cleaned during the cleaning of the upper surface of the substrate W using the spray nozzle 73, the cleanliness of the outer region of the lower surface of the substrate W is improved after cleaning.

[0129] (b) During periods when it is not suitable to clean the lower surface brush 51

[0130] As described above, the lower surface brush 51 is preferably not dried when it comes into contact with the substrate W. Therefore, it is preferable not to spray cleaning solution from the brush nozzles 52a, 52b to the lower surface brush 51 when cleaning the upper surface of the substrate W using the spray nozzle 73.

[0131] However, when the cleaning solution sprayed from the brush nozzles 52a and 52b disperses from the lower surface brush 51, the droplets may unexpectedly adhere to the substrate W or its surrounding components. In this case, the cleanliness of the substrate W after cleaning, or the cleanliness of the cleaning environment of the substrate W, is reduced due to the cleaning of the lower surface brush 51. Furthermore, the cleanliness of the cleaning environment of the substrate W refers to the cleanliness of the constituent elements disposed inside the unit housing 2 and the cleanliness of the device for transporting the substrate W.

[0132] Therefore, in this embodiment, in Figure 7 During a portion of the series of actions performed by the lower surface cleaning control unit 9E in order to clean a substrate W (hereinafter referred to as the basic stop period), the supply of cleaning liquid from the brush cleaning liquid supply unit 57 to the brush nozzles 52a, 52b is prohibited, and the lower surface brush 51 is not cleaned.

[0133] On the other hand, during at least a portion of the other part of the series of actions performed in order to clean a substrate W (hereinafter referred to as the cleaning allowance period), the lower surface cleaning control unit 9E allows the supply of cleaning liquid from the brush cleaning liquid supply unit 57 to the brush nozzles 52a, 52b.

[0134] Figure 20 This diagram illustrates the relationship between a series of actions of the substrate cleaning apparatus 1 when cleaning a substrate W and whether cleaning liquid can be supplied from the cleaning liquid supply unit 57 to the brush nozzles 52a and 52b. Figure 20 The diagram shows multiple operating states of the cleaning device 1 in chronological order, and together with the corresponding diagram numbers, it shows whether the supply of cleaning solution for brushing is permitted in each operating state.

[0135] (c) The loading and unloading period of substrate W

[0136] In this embodiment, the basic stop period includes the period during which substrate W is moved in and the period during which substrate W is moved out. For example... Figure 20 As shown in this embodiment, Figure 7The lower surface cleaning control unit 9E stops supplying cleaning fluid from the cleaning fluid supply unit 57 to the brush nozzles 52a and 52b during the loading and unloading of the substrate W relative to the substrate cleaning apparatus 1. The loading period of the substrate W is the period during which the substrate W is loaded using the main robot 300. The unloading period of the substrate W is the period during which the substrate W is unloaded using the main robot 300. As a result, the cleaning fluid for brush cleaning will not scatter inside the unit housing 2 during the loading and unloading of the substrate W using the main robot 300. Therefore, the cleaning fluid for brush cleaning will not adhere to the substrate W being transported by the main robot 300 during the loading and unloading of the substrate W. In addition, the cleaning fluid for brush cleaning will not adhere to the hand Ma of the main robot 300 entering the unit housing 2. Therefore, the decrease in the cleanliness of the substrate W caused by the cleaning of the lower surface brush 51 and the decrease in the cleanliness of the hand Ma of the main robot 300 can be reduced.

[0137] (d) During the transfer of substrate W between the upper and lower holding devices (10A, 10B, 20)

[0138] In addition, in this embodiment, the basic stop period includes the period of substrate W exchange between the upper and lower holding devices (10A, 10B, 20).

[0139] Figure 7 When the substrate W is transferred between the upper holding devices 10A and 10B and the lower holding device 20, the lower surface cleaning control unit 9E stops supplying cleaning liquid from the cleaning liquid supply unit 57 to the brush nozzles 52a and 52b.

[0140] Specifically, in this embodiment, the plurality of support pins 41 move up and down to switch from a state where the substrate W is held by the upper holding devices 10A and 10B to a state where the substrate W is held by the lower holding device 20. Therefore, the lower surface cleaning control unit 9E stops the supply of cleaning fluid during the up and down movement of the plurality of support pins 41. As a result, the cleaning fluid does not scatter within the unit housing 2 during the up and down movement of the plurality of support pins 41. Therefore, during the transfer of the substrate W between the upper holding devices 10A and 10B and the lower holding device 20, the cleaning fluid does not adhere to the substrate W and its peripheral components (the plurality of support pins 41 and pin connecting components 42, etc.). Therefore, the decrease in the cleanliness of the substrate W and the transfer device 40 caused by the cleaning of the lower surface brush 51 is reduced.

[0141] (e) During and after the drying of the substrate W held by the lower holding device 20

[0142] In addition, in this embodiment, the basic stop period includes the drying process and the drying period of the substrate W held by the lower holding device 20.

[0143] Figure 7 When the substrate W is held by the lower holding device 20, the lower surface cleaning control unit 9E stops the supply of cleaning liquid from the brush cleaning liquid supply unit 57 to the brush nozzles 52a and 52b during the drying process after the substrate W has been cleaned. Additionally, the lower surface cleaning control unit 9E stops the supply of cleaning liquid from the brush cleaning liquid supply unit 57 to the brush nozzles 52a and 52b while the dried substrate W is held by the lower holding device 20.

[0144] Specifically, in a series of processes involving a substrate W, it is assumed that the cleaning of the upper surface, outer peripheral end, and outer region of the lower surface of the substrate W, held by the adsorption and holding unit 21, is complete. In this case, after the cleaning is completed and without supplying cleaning solution or the like to the substrate W, the adsorption and holding unit 21 rotates at high speed to dry the substrate W (rotation drying). Therefore, the lower surface cleaning control unit 9E stops the supply of cleaning solution for brush cleaning from the start of the rotation drying of the substrate W until the substrate W is received by the main robot 300. As a result, after the rotation drying of the substrate W begins, the cleaning solution for brush cleaning will not scatter within the unit housing 2. Therefore, the cleaning solution for brush cleaning will not adhere to the dried substrate W and its surrounding components. Therefore, the decrease in the cleanliness of the substrate W and the decrease in the cleanliness of the lower holding device 20 caused by the cleaning of the lower surface brush 51 can be reduced.

[0145] (f) Cleaning allowance period

[0146] In this embodiment, the permissible cleaning period includes the period during which the substrate W is not present inside the unit housing 2. In this example, it includes the period before the substrate W before cleaning is moved into the substrate cleaning apparatus 1 and the period after the substrate W after cleaning is removed from the substrate cleaning apparatus 1. During the period during which the substrate W is not present inside the unit housing 2, even if cleaning fluid for brush cleaning is sprayed from the lower surface brush 51, the cleaning fluid that is sprayed out will not come into contact with the substrate W. Here, when the substrate W is not present inside the unit housing 2, the substrate cleaning apparatus 1 is essentially in its initial state. During the initial state, the lower surface brush 51 is held in a standby position. The standby position is located below the adsorption holding portion 21. Therefore, during the initial state, even when cleaning fluid is sprayed from the lower surface brush 51, the cleaning fluid is unlikely to adhere to the upper holding devices 10A, 10B and the adsorption holding portion 21 of the lower holding device 20.

[0147] In addition to the examples described above, the permissible cleaning period includes the period from when the substrate W is held by the upper holding devices 10A and 10B until the holding state is released. Furthermore, the permissible cleaning period includes the period from when the substrate W is held by the lower holding device 20 until the substrate W is being cleaned, that is, the period from when the substrate W is held by the lower holding device 20 until the rotational drying of the substrate W begins.

[0148] It is believed that even if the cleaning solution for brush cleaning is sprayed during the allowable cleaning period, the cleanliness of the substrate W and its cleaning environment is unlikely to decrease significantly. Therefore, the substrate cleaning apparatus 1 is not limited to cleaning the upper surface of the substrate W, and the lower surface brush 51 can be cleaned at any point during the allowable cleaning period.

[0149] However, even during the permissible cleaning period, depending on the positional relationship of the constituent elements within the unit housing 2, the spraying of the cleaning solution may cause a decrease in the cleanliness of the substrate W and its cleaning environment.

[0150] It is believed that the user has a certain understanding of the positional relationships of the constituent elements within the unit housing 2 during substrate W processing in the substrate cleaning apparatus 1. Furthermore, it is believed that the user can predict to some extent the impact of the spraying of the cleaning solution during substrate W processing on the cleanliness of the substrate W and its surrounding components. Taking these aspects into consideration, regarding the permissible cleaning period, it is preferable that the user appropriately set the spraying time of the cleaning solution.

[0151] Therefore, in this embodiment, the user operates... Figure 7 The operation panel 180 allows the user to set the supply and stop of the cleaning solution during the cleaning period as the operating conditions for the cleaning solution supply unit 57. For example, the user can set the supply and stop of the cleaning solution during the period when the substrate W is held by the upper holding devices 10A and 10B as the operating conditions for the cleaning solution supply unit 57.

[0152] Figure 21 and Figure 22 This diagram illustrates an example of the supply status of the cleaning solution for brushing during the period when the substrate W is held by the upper holding devices 10A and 10B. Figure 21 and Figure 22 In each of the diagrams, multiple configuration examples are shown in the upper, middle, and lower sections. In each configuration example diagram, the horizontal axis represents time. Furthermore, the washing of the central region of the lower surface of the substrate W, held by the upper holding devices 10A and 10B, begins at time t1 and ends at time t2, drying of the central region of the lower surface of the substrate W.

[0153] exist Figure 21 In the example setting above, during the period from time point t1 to time point t2, the cleaning solution for brushing is continuously sprayed onto the lower surface 51. Additionally, in Figure 21 In the middle section of the setting example, during the period from time point t1 to time point t2, the brush 51 sprays cleaning solution onto the lower surface discontinuously.

[0154] exist Figure 21In the following example setting, during the period from time t1 to time t2, the cleaning solution is sprayed onto the lower surface only during a portion of the initial period. Figure 22 In the example setting above, during the period from time point t1 to time point t2, the cleaning solution for brushing is sprayed onto the lower surface only for a portion of the time roughly in the middle. Figure 22 In the example setting of the middle section, during the period from time point t1 to time point t2, the cleaning solution for brushing is sprayed onto the lower surface only during a portion of the final period. Furthermore, in Figure 22 In the lower section of the setting example, the cleaning solution for brushing is sprayed onto the lower surface only during the period from time point t1 to time point t2, during a part of the initial period and a part of the final period.

[0155] As described above, by operating the control panel 180, the user can set the supply and stop of the cleaning solution during the permissible cleaning period as the operating conditions for the cleaning solution supply unit 57. The set operating conditions are determined as described above by... Figure 7 The conditions are accepted by the acceptance department 9J and stored in the control device 170. Figure 7 The lower surface cleaning control unit 9E controls the cleaning liquid supply unit 57 based on the set operating conditions.

[0156] 6. Effects

[0157] (a) In the substrate cleaning apparatus 1, the substrate W, which is moved into the unit housing 2 by the main robot 300, is held by the upper holding device 10A, 10B or the lower holding device 20. The lower surface of the substrate W is cleaned by bringing the lower surface brush 51 into contact with the substrate W held by the upper holding device 10A, 10B or the lower holding device 20. The lower surface brush 51 is cleaned by cleaning liquid sprayed from the brush nozzles 52a, 52b. This prevents the substrate W from being cleaned with the lower surface brush 51, which has reduced cleanliness, thereby reducing the decrease in cleanliness of the cleaned substrate W.

[0158] Furthermore, according to the substrate cleaning apparatus 1, during the loading and unloading of the substrate W, the cleaning liquid is not sprayed onto the lower surface brush 51, and the cleaning liquid will not scatter near the substrate W. Therefore, during the loading and unloading of the substrate W, the cleaning liquid for brush cleaning will not adhere to the substrate W and the hands (Ma to Md) of the main robot arm 300.

[0159] As a result, it is possible to prevent the substrate W from being cleaned by the lower surface brush 51 with reduced cleanliness, and to reduce the decrease in cleanliness of the substrate W and the cleanliness of the cleaning environment of the substrate W caused by the cleaning of the lower surface brush 51.

[0160] (b) According to the substrate cleaning apparatus 1, during the period when the substrate W is transferred between the upper holding devices 10A, 10B and the lower holding device 20, that is, during the period when the substrate W is raised and lowered by the transfer device 40, the cleaning solution for brushing is not sprayed onto the lower surface brush 51, and the cleaning solution does not scatter near the substrate W. During the period when the substrate W is transferred between the upper holding devices 10A, 10B and the lower holding device 20, the cleaning solution for brushing does not adhere to the substrate W, the plurality of support pins 41 and the pin connecting parts 42. As a result, it is possible to prevent the substrate W from being cleaned by the lower surface brush 51 with reduced cleanliness, and it is possible to reduce the reduction in the cleanliness of the substrate W and the cleanliness of the cleaning environment of the substrate W caused by the cleaning of the lower surface brush 51.

[0161] (c) According to the substrate cleaning apparatus 1, during and after the drying of the substrate W held by the lower holding device 20, the cleaning solution for brushing is not sprayed onto the lower surface brush 51, and the cleaning solution does not scatter near the substrate W. Therefore, after the start of drying of the substrate W held by the lower holding device 20, the cleaning solution for brushing will not adhere to the substrate W and the lower holding device 20. As a result, it is possible to prevent the substrate W from being cleaned using the lower surface brush 51, which has reduced cleanliness, and to reduce the decrease in the cleanliness of the substrate W and the cleanliness of the cleaning environment of the substrate W caused by the cleaning of the lower surface brush 51.

[0162] (d) As described above, during the permissible cleaning period, depending on the processing state of the substrate W in the substrate cleaning apparatus 1, even if the cleaning fluid sprayed from the lower surface brush 51 adheres to the substrate W, this adhesion may not affect the cleanliness of the cleaned substrate W. Furthermore, depending on the relative position of the lower surface brush 51 to the substrate W, the cleaning fluid sprayed from the lower surface brush 51 may not spread to the substrate W and its surrounding components. Additionally, the impact of the cleaning fluid sprayed from the lower surface brush 51 on the substrate W and its surrounding components during the permissible cleaning period can be predicted to some extent.

[0163] According to the substrate cleaning apparatus 1, the user can input and set the operating conditions of the brush cleaning liquid supply unit 57 during the permissible cleaning period by operating the operation panel 180. Thus, the supply state of cleaning liquid to the lower surface brush 51 is adjusted according to the set operating conditions of the brush cleaning liquid supply unit 57. For example, by setting the desired operating conditions, the user can stop the spraying of cleaning liquid at a point during the cleaning process after the substrate W is held by the upper holding devices 10A and 10B, when it is believed that the spraying of cleaning liquid would adversely affect the cleanliness of the substrate W. As a result, cleaning of the substrate W using the lower surface brush 51 with reduced cleanliness is prevented, and the reduction in the cleanliness of the substrate W and the cleaning environment of the substrate W caused by the cleaning of the lower surface brush 51 is reduced.

[0164] 7. Other implementation methods

[0165] (a) In the substrate cleaning apparatus 1 of the embodiment, the cleaning allowable period includes the period from when the substrate W is held by the upper holding devices 10A and 10B until the holding state is released, but the present invention is not limited thereto.

[0166] When the lower surface brush 51 is in the standby position, even if cleaning fluid is sprayed onto the lower surface brush 51, the droplets are less likely to reach the upper retaining devices 10A, 10B and their surrounding areas. Conversely, when the lower surface brush 51 is in a position other than the standby position, for example, when the lower surface brush 51 is positioned higher than in the standby position, the distance between the lower surface brush 51 and the upper retaining devices 10A, 10B becomes shorter. When cleaning fluid is sprayed onto the lower surface brush 51 in this state, the droplets of the cleaning fluid are more likely to reach the upper retaining devices 10A, 10B and their surrounding areas compared to when the lower surface brush 51 is in the standby position.

[0167] Therefore, cleaning fluid can be supplied from the cleaning fluid supply section 57 to the brush nozzles 52a and 52b only during the period from when the substrate W is held by the upper holding devices 10A and 10B until the holding state is released. In other words, during the period when the substrate W is held by the upper holding devices 10A and 10B, cleaning fluid can be sprayed when the lower surface brush 51 is in the standby position, and spraying of cleaning fluid is prohibited when the lower surface brush 51 is in a position other than the standby position.

[0168] In this case, Figure 7 The lower surface cleaning control unit 9E controls the brush cleaning liquid supply unit 57 to stop supplying cleaning liquid to the brush nozzles 52a and 52b when the substrate W is held by the upper holding devices 10A and 10B and the lower surface brush 51 is in a position other than the standby position. This further reduces the amount of cleaning liquid adhering to the substrate W and its surrounding components while the substrate W is held by the upper holding devices 10A and 10B. As a result, it prevents the substrate W from being cleaned using the lower surface brush 51, which has reduced cleanliness, and reduces the decrease in cleanliness of the substrate W and the cleaning environment caused by the cleaning of the lower surface brush 51.

[0169] (b) In the substrate cleaning apparatus 1 of the embodiment, the cleaning allowable period includes the period during which the substrate W is not present inside the unit housing 2, but the present invention is not limited thereto.

[0170] As described above, when the substrate W is not present inside the unit housing 2, the substrate cleaning apparatus 1 is essentially in its initial state (standby state), and the lower surface brush 51 is held in the standby position. However, even when the substrate W is not present inside the unit housing 2, the lower surface brush 51 may move to a position other than the standby position due to maintenance or malfunction of the substrate cleaning apparatus 1. Therefore, it is permissible to supply cleaning fluid from the cleaning fluid supply unit 57 to the brush nozzles 52a and 52b only when the lower surface brush 51 is in the standby position during the period when the substrate W is not present inside the unit housing 2. In other words, it is permissible to spray cleaning fluid when the lower surface brush 51 is in the standby position during the period when the substrate W is not present inside the unit housing 2, and prohibit the spraying of cleaning fluid when the lower surface brush 51 is in a position other than the standby position.

[0171] In this case, Figure 7 The lower surface cleaning control unit 9E controls the brush cleaning liquid supply unit 57 to stop supplying cleaning liquid to the brush nozzles 52a and 52b when the substrate W is not present in the unit housing 2 and the lower surface brush 51 is in a position other than the standby position. Therefore, when the user performs operations inside the unit housing 2 due to maintenance or malfunction of the substrate cleaning device 1, it can prevent the brush cleaning liquid from being sprayed out unexpectedly, thus preventing a decrease in work efficiency and a reduction in the cleanliness inside the unit housing 2.

[0172] (c) In the substrate cleaning apparatus 1 of the described embodiment, a transfer device 40 is provided to switch between a state in which the substrate W is held by the upper holding devices 10A and 10B and a state in which the substrate W is held by the lower holding device 20. The transfer device 40 transfers the substrate W by moving the substrate W up and down relative to the upper holding devices 10A and 10B and the lower holding device 20 relative to the multiple support pins 41. The present invention is not limited to the described example.

[0173] In the substrate cleaning apparatus 1, a lifting drive unit may be provided to move the lower holding device 20 up and down relative to the upper holding devices 10A and 10B. Alternatively, a lifting drive unit may be provided to move the upper holding devices 10A and 10B up and down relative to the lower holding device 20. In this case, the lifting drive unit functions as a relative movement unit. Thus, by moving at least one of the lower holding device 20 and the upper holding devices 10A and 10B up and down relative to the other, the substrate W can be transferred between the two holding devices without using multiple support pins 41. In this case, the transfer device 40 is not required.

[0174] (d) In the described embodiment, the outer region of the lower surface of the substrate W is repeatedly cleaned during the cleaning of the upper surface of the substrate W, and the lower surface brush 51 is also cleaned. However, the present invention is not limited to this. The lower surface cleaning control unit 9E may also prohibit the supply of cleaning liquid from the brush cleaning liquid supply unit 57 to the brush nozzles 52a and 52b while the substrate W is held by the lower holding device 20. In this case, the lower surface cleaning control unit 9E allows the supply of cleaning liquid from the brush cleaning liquid supply unit 57 to the brush nozzles 52a and 52b during the permissible cleaning period and when the substrate W is not held by the lower holding device 20.

[0175] (e) In the embodiment described above, the basic stop period includes the period during which the substrate W is loaded, the period during which the substrate W is unloaded, the period during which the substrate W is handed over between the two holding devices, and the period after the drying of the substrate W held by the lower holding device 20 begins, but the present invention is not limited thereto. The basic stop period set in the substrate cleaning apparatus 1 may include at least one of the following periods: the period during which the substrate W is loaded, the period during which the substrate W is unloaded, the period during which the substrate W is handed over between the two holding devices, and the period after the drying of the substrate W held by the lower holding device 20 begins.

[0176] (f) In the embodiment described above, the cleaning solution supplied to the two substrate nozzles 52 is the same as the cleaning solution supplied to the two brush nozzles 52a and 52b, but these cleaning solutions may also be different from each other. That is, the cleaning solution for substrate cleaning and the cleaning solution for brush cleaning may be the same or different from each other.

[0177] (g) As shown in the embodiment described above, if the cleaning solution for substrate cleaning is the same as the cleaning solution for brush cleaning, the two substrate nozzles 52 may not be provided. In this case, when cleaning the central region of the lower surface of the substrate W and when cleaning the outer region of the lower surface of the substrate W, the cleaning solution sprayed from the brush nozzles 52a and 52b to the lower surface brush 51 can be used as the cleaning solution for substrate cleaning.

[0178] (h) In the substrate cleaning apparatus 1 of the embodiment, during the process of cleaning the central region of the lower surface of the substrate W using the lower surface brush 51, cleaning liquid is supplied to the substrate W from two substrate nozzles 52, but the present invention is not limited thereto.

[0179] In the substrate cleaning apparatus 1, before cleaning the central region of the lower surface of the substrate W using the lower surface brush 51, the lower surface brush 51 can be pre-cleaned so that the cleaning solution is immersed in the lower surface brush 51. In this case, by bringing the lower surface brush 51, which has been immersed in the cleaning solution, into contact with the central region of the lower surface of the substrate W, the central region of the lower surface of the substrate W can be cleaned without supplying new cleaning solution.

[0180] (i) The substrate cleaning apparatus 1 of the embodiment may also have a backwash nozzle that supplies rinsing liquid to the outer region of the lower surface of the substrate W held by the lower holding device 20.

[0181] (j) In the described embodiment, after cleaning the central region of the lower surface of the substrate W held by the upper holding devices 10A and 10B, cleaning is performed on the outer region of the lower surface of the substrate W held by the lower holding device 20. However, the embodiment is not limited to this. Alternatively, cleaning may be performed on the outer region of the lower surface of the substrate W in the lower holding device 20, followed by cleaning of the central region of the lower surface of the substrate W in the upper holding devices 10A and 10B.

[0182] (k) In the described embodiment, the central region of the lower surface of the substrate W is cleaned in the upper holding devices 10A and 10B, and the outer region of the lower surface of the substrate W is cleaned in the lower holding device 20. However, the embodiment is not limited to this. In the substrate cleaning apparatus 1, it is sufficient to perform the cleaning process on the substrate W held by any one of the holding devices 10A, 10B and 20. Therefore, it is also possible to perform processes other than cleaning (such as polishing or developing) on ​​the substrate W held by the other holding device 20.

[0183] (l) In the described embodiment, the upper surface of the substrate W is cleaned using a spray nozzle 73, but the embodiment is not limited to this. The upper surface of the substrate W may also be cleaned using a brush or a rinsing nozzle that sprays rinsing liquid. Alternatively, the upper surface of the substrate W may not be cleaned. In this case, the substrate cleaning apparatus 1 does not include an upper surface cleaning device 70. Similarly, the outer peripheral ends of the substrate W may not be cleaned. In this case, the substrate cleaning apparatus 1 does not include an end cleaning device 80.

[0184] (m) In the described embodiment, the cleaning of the outer region of the lower surface of the substrate W at the processing position and the cleaning of the lower surface brush 51 at the standby position are performed repeatedly, but the embodiment is not limited to this. Alternatively, the cleaning of the outer region of the lower surface of the substrate W at the processing position and the cleaning of the lower surface brush 51 at the standby position may not be performed repeatedly.

[0185] 8. Correspondence between the constituent elements of the technical solution and the various parts of the implementation method

[0186] Hereinafter, examples of the correspondence between the constituent elements of the technical solution and the elements of the implementation method will be described, but the present invention is not limited to the following examples. As constituent elements of the technical solution, various other elements having the structure or function described in the technical solution may also be used.

[0187] In the embodiment described above, the substrate processing apparatus 100 and the substrate cleaning apparatus 1 are examples of substrate processing apparatuses, the unit housing 2 is an example of a processing chamber, the main robot 300 is an example of a conveying device, the upper holding devices 10A and 10B are examples of a first substrate holding part or a second substrate holding part, the lower surface brush 51 is an example of a brush, and the lower surface cleaning apparatus 50 is an example of a brush cleaning part.

[0188] In addition, the brush nozzles 52a and 52b that spray the cleaning solution are examples of cleaning nozzles, the brush cleaning solution supply unit 57 is an example of a cleaning solution supply unit, the control device 170 and the lower surface cleaning control unit 9E are examples of control units, the hands Ma to Md of the main robot 300 are examples of transport and holding units, the transport drive unit 320 is an example of a transport drive unit, and the lifting support unit 54 is an example of a brush moving unit.

[0189] In addition, the lower holding device 20 is an example of a second substrate holding part or a first substrate holding part, the lower surface cleaning device 50, the upper surface cleaning device 70 and the end cleaning device 80 are examples of processing parts, the transfer device 40 is an example of a relative moving part, the central region of the lower surface of the substrate W is an example of a first region in the lower surface of the substrate, and the outer region of the lower surface of the substrate W is an example of a second region in the lower surface of the substrate.

[0190] In addition, the first and second processing positions of the lower surface brush 51 are examples of cleaning positions, the standby position of the lower surface brush 51 is an example of a standby position, the operation panel 180 is an example of an operation unit, and the condition acceptance unit 9J is an example of an acceptance unit.

[0191] 9. Summary of Implementation Methods

[0192] (Item 1) The substrate processing apparatus of item 1 includes:

[0193] Processing room;

[0194] The conveying device is configured to perform a conveying action of conveying a substrate into the processing chamber and a conveying action of conveying a substrate out of the processing chamber.

[0195] A first substrate holding section is provided in the processing chamber to hold the substrate that has been moved in by the conveying device;

[0196] A brush cleaning section is provided in the processing chamber and is configured to allow the brush to contact the substrate held by the first substrate holding section to clean the lower surface of the substrate.

[0197] A cleaning nozzle is provided in the treatment chamber and configured to spray a cleaning solution onto the brush for cleaning the brush.

[0198] The cleaning solution supply unit is capable of supplying the cleaning solution to the cleaning nozzle; and

[0199] The control unit, by controlling the cleaning fluid supply unit, stops supplying the cleaning fluid to the cleaning nozzle during at least a portion of the time during the loading and unloading operations performed using the conveying device.

[0200] In this substrate processing apparatus, a substrate, which has been moved into the processing chamber by a conveying device, is held by a first substrate holding section. The lower surface of the substrate is cleaned by bringing a brush into contact with the substrate held by the first substrate holding section. The brush is cleaned by a brush cleaning solution sprayed from a cleaning nozzle. This prevents the substrate from being cleaned using a brush with reduced cleanliness.

[0201] Furthermore, according to the substrate processing apparatus, during at least a portion of the substrate loading and unloading operations of the conveying device, no cleaning solution is supplied to the cleaning nozzle. Therefore, when the supply of cleaning solution is stopped, the cleaning solution will not scatter near the substrate in the processing chamber. Thus, the occurrence of cleaning solution adhering to a portion of the conveying device that enters the processing chamber during the substrate loading or unloading operations is reduced. Additionally, the occurrence of cleaning solution adhering to a portion of the substrate being conveyed by the conveying device during the substrate loading or unloading operations is reduced.

[0202] As a result, it is possible to prevent the substrate from being cleaned with a brush that reduces its cleanliness, and to reduce the decrease in substrate cleanliness and the cleanliness of the substrate cleaning environment caused by brush cleaning.

[0203] (Item 2) In the substrate processing apparatus described in Item 1, it may be

[0204] The conveying device includes:

[0205] The transport and holding section is configured to hold the substrate during movement; and

[0206] The conveying drive unit moves the conveying holding unit.

[0207] The control unit then

[0208] By controlling the conveying drive unit, during the conveying action and the conveying action of the conveying device, the conveying holding unit is caused to enter and exit the processing chamber from the outside of the processing chamber and from the processing chamber.

[0209] By controlling the cleaning solution supply unit, the supply of cleaning solution from the cleaning nozzle to the brush is stopped while the conveying and holding unit is inside the processing chamber.

[0210] In this case, with the conveying and holding section of the conveying device inside the processing chamber, the cleaning solution is not sprayed from the cleaning nozzle. This prevents the cleaning solution from adhering to the conveying and holding section and the substrate being conveyed by the conveying and holding section.

[0211] (Item 3) In the substrate processing apparatus described in Item 1 or Item 2, it may be

[0212] The cleaning unit includes:

[0213] The brush; and

[0214] The brush moving part is configured to move the brush between a cleaning position that contacts the lower surface of the substrate held by the first substrate holding part and a standby position that is separated from the substrate held by the first substrate holding part.

[0215] The cleaning nozzle is configured to spray cleaning solution onto the brush in the standby position.

[0216] The control unit

[0217] By controlling the cleaning solution supply unit, when there is no substrate in the processing chamber and the brush is in a position other than the standby position, the supply of cleaning solution from the cleaning nozzle to the brush is stopped.

[0218] According to the aforementioned configuration, the supply of cleaning fluid from the cleaning nozzle to the brush is stopped when there is no substrate in the processing chamber and the brush is in a position other than the standby position. Therefore, when a user performs operations inside the substrate processing apparatus due to maintenance or malfunction of the substrate processing apparatus, it prevents the cleaning fluid from being sprayed out unexpectedly, thus avoiding reduced work efficiency and decreased cleanliness of the processing chamber.

[0219] (Item 4) The substrate processing apparatus of item 4 includes:

[0220] The first substrate holding portion is configured to hold the substrate;

[0221] The brush cleaning section is configured to allow the brush to contact the substrate held by the first substrate holding section and clean the lower surface of the substrate.

[0222] The second substrate holding portion is configured to hold the substrate;

[0223] The processing unit performs a prescribed process on the substrate held by the second substrate holding unit;

[0224] The relative moving part performs a relative moving operation in order to switch the state in which the substrate is held by the first substrate holding part to the state in which the substrate is held by the second substrate holding part. That is, by moving at least one of the first substrate holding part, the second substrate holding part, and the substrate, the relative position of the first substrate holding part and the substrate changes.

[0225] The cleaning nozzle is configured to spray a cleaning solution onto the brush for cleaning the brush.

[0226] The cleaning solution supply unit is capable of supplying the cleaning solution to the cleaning nozzle; and

[0227] The control unit, by controlling the cleaning liquid supply unit, stops supplying the cleaning liquid to the cleaning nozzle when the relative movement of the relative movement unit is activated.

[0228] In this substrate processing apparatus, a first substrate holding section holds the substrate. The lower surface of the substrate is cleaned by bringing a brush into contact with the substrate held by the first substrate holding section. A second substrate holding section holds the substrate. The substrate held by the second substrate holding section undergoes a prescribed treatment. The brush is cleaned by a brush cleaning solution sprayed from a cleaning nozzle. This prevents the substrate from being cleaned using a brush with reduced cleanliness.

[0229] Furthermore, according to the substrate processing apparatus, during the relative movement of the relative moving parts, no cleaning solution is supplied to the cleaning nozzle. When the supply of cleaning solution stops, the cleaning solution will not scatter near the substrate. Therefore, it is possible to prevent cleaning solution from adhering to the substrate and its surrounding components when switching from a state where the substrate is held by the first substrate holding part to a state where the substrate is held by the second substrate holding part.

[0230] As a result, it is possible to prevent the substrate from being cleaned with a brush that reduces its cleanliness, and to reduce the decrease in substrate cleanliness and the cleanliness of the substrate cleaning environment caused by brush cleaning.

[0231] (Item 5) In the substrate processing apparatus described in Item 4, it is possible to provide

[0232] The brush cleaning section is configured to allow the brush to contact a first region on the lower surface of the substrate held by the first substrate holding section and clean the first region, and is also configured to allow the brush to contact a second region on the lower surface of the substrate held by the second substrate holding section that is different from the first region and clean the second region.

[0233] The control unit

[0234] With the substrate held by the first substrate holding part, the brush cleaning part is controlled to clean the first region of the lower surface of the substrate.

[0235] With the substrate held by the second substrate holding part, the brush cleaning part is controlled and used as the processing part to clean the second region of the lower surface of the substrate.

[0236] In this case, the first region of the lower surface of the substrate is cleaned while the substrate is held by the first substrate holding part, and the second region of the lower surface of the substrate is cleaned while the substrate is held by the second substrate holding part.

[0237] (Item 6) In the substrate processing apparatus described in Item 4 or 5, it may be possible to

[0238] The substrate processing apparatus also includes a processing chamber.

[0239] The processing chamber houses the first substrate holding section, the brush cleaning section, the second substrate holding section, the processing section, the cleaning nozzle, and the cleaning solution supply section.

[0240] The cleaning unit includes:

[0241] The brush; and

[0242] The brush moving part is configured to move the brush between a cleaning position that contacts the lower surface of the substrate held by the first substrate holding part and a standby position that is separated from the substrate held by the first substrate holding part.

[0243] The cleaning nozzle is configured to spray cleaning solution onto the brush in the standby position.

[0244] The control unit

[0245] By controlling the cleaning solution supply unit, when there is no substrate in the processing chamber and the brush is in a position other than the standby position, the supply of cleaning solution from the cleaning nozzle to the brush is stopped.

[0246] According to the aforementioned configuration, the supply of cleaning fluid from the cleaning nozzle to the brush is stopped when there is no substrate in the processing chamber and the brush is in a position other than the standby position. Therefore, when a user performs operations inside the substrate processing apparatus due to maintenance or malfunction of the substrate processing apparatus, it prevents the cleaning fluid from being sprayed out unexpectedly, thus avoiding reduced work efficiency and decreased cleanliness of the processing chamber.

[0247] (Item 7) The substrate processing apparatus of item 7 includes:

[0248] The first substrate holding portion is configured to hold the substrate;

[0249] The brush cleaning section is configured to allow the brush to contact the substrate held by the first substrate holding section and clean the lower surface of the substrate.

[0250] The cleaning nozzle is configured to spray a cleaning solution onto the brush for cleaning the brush.

[0251] The cleaning solution supply unit is capable of supplying the cleaning solution to the cleaning nozzle; and

[0252] The control unit, by controlling the cleaning liquid supply unit, stops supplying the cleaning liquid to the cleaning nozzle during at least a portion of the period during which the substrate is held by the first substrate holding unit.

[0253] In this substrate processing apparatus, a substrate is held by a first substrate holding section. The lower surface of the substrate is cleaned by bringing a brush into contact with the substrate held by the first substrate holding section. The brush is cleaned by a brush cleaning solution sprayed from a cleaning nozzle. This prevents the substrate from being cleaned using a brush with reduced cleanliness.

[0254] Furthermore, according to the substrate processing apparatus, during at least a portion of the period when the substrate is held using the first substrate holding section, cleaning fluid is not supplied to the cleaning nozzle. When the supply of cleaning fluid stops, the cleaning fluid will not scatter near the substrate. Therefore, it is possible to prevent cleaning fluid from adhering to the substrate and its surrounding components during at least a portion of the period when the substrate is held using the first substrate holding section.

[0255] As a result, it is possible to prevent the substrate from being cleaned with a brush that reduces its cleanliness, and to reduce the decrease in substrate cleanliness and the cleanliness of the substrate cleaning environment caused by brush cleaning.

[0256] (Item 8) In the substrate processing apparatus described in Item 7, it is possible to provide

[0257] The first substrate holding portion is configured to allow the held substrate to rotate.

[0258] The control unit controls the first substrate holding unit to dry the substrate after the lower surface of the substrate has been cleaned by the brush cleaning unit and the first substrate holding unit rotates at a predetermined speed.

[0259] At least a portion of the period during which the substrate is held by the first substrate holding portion includes the period from the point when the substrate begins to be dried by rotating the first substrate holding portion to the point when the holding state of the substrate by the first substrate holding portion is released.

[0260] In this case, it is possible to prevent the cleaning solution from adhering to the substrate during and after drying.

[0261] (Item 9) In the substrate processing apparatus described in Item 7 or 8, it may be possible to

[0262] The substrate processing apparatus also includes a processing chamber.

[0263] The processing chamber houses the first substrate holding section, the brush cleaning section, the cleaning nozzle, and the cleaning solution supply section.

[0264] The cleaning unit includes:

[0265] The brush; and

[0266] The brush moving part is configured to move the brush between a cleaning position that contacts the lower surface of the substrate held by the first substrate holding part and a standby position that is separated from the substrate held by the first substrate holding part.

[0267] The cleaning nozzle is configured to spray cleaning solution onto the brush in the standby position.

[0268] The control unit controls the cleaning solution supply unit to stop supplying cleaning solution from the cleaning nozzle to the brush when there is no substrate in the processing chamber and the brush is in a position other than the standby position.

[0269] According to the aforementioned configuration, the supply of cleaning fluid from the cleaning nozzle to the brush is stopped when there is no substrate in the processing chamber and the brush is in a position other than the standby position. Therefore, when a user performs operations inside the substrate processing apparatus due to maintenance or malfunction of the substrate processing apparatus, it prevents the cleaning fluid from being sprayed out unexpectedly, thus avoiding reduced work efficiency and decreased cleanliness of the processing chamber.

[0270] (Item 10) The substrate processing apparatus of item 10 includes:

[0271] The first substrate holding portion is configured to hold the substrate;

[0272] A brush cleans the lower surface of the substrate by contacting it.

[0273] The brush moving part is configured to move the brush between a cleaning position that contacts the lower surface of the substrate held by the first substrate holding part, and a standby position that is lower than the first substrate holding part and separated from the substrate held by the first substrate holding part.

[0274] The second substrate holding portion is provided at a position higher than the first substrate holding portion, and is configured to hold the substrate.

[0275] The processing unit performs a prescribed process on the substrate held by the second substrate holding unit;

[0276] The cleaning nozzle is configured to spray a cleaning solution onto the brush for cleaning the brush.

[0277] The cleaning solution supply unit is capable of supplying the cleaning solution to the cleaning nozzle; and

[0278] The control unit controls the cleaning fluid supply unit to stop supplying the brush cleaning fluid to the cleaning nozzle when the substrate is held by the second substrate holding unit and the brush is in a position other than the standby position.

[0279] In this substrate processing apparatus, a first substrate holding section holds the substrate. The lower surface of the substrate is cleaned by bringing a brush into contact with the substrate held by the first substrate holding section. A second substrate holding section holds the substrate. The substrate held by the second substrate holding section undergoes a prescribed treatment. The brush is cleaned by a brush cleaning solution sprayed from a cleaning nozzle. This prevents the substrate from being cleaned using a brush with reduced cleanliness.

[0280] Furthermore, according to the substrate processing apparatus, the first substrate holding portion is located higher than the brush's standby position. Additionally, the second substrate holding portion is located even higher than the first substrate holding portion. Therefore, even when the brush is in the standby position, if cleaning fluid is sprayed onto the brush, the resulting droplets are unlikely to reach the second substrate holding portion and its surrounding area.

[0281] In contrast, when the brush is in a position other than the standby position, for example, when the brush is positioned higher than the standby position, the distance between the brush and the second substrate holding portion becomes shorter. When cleaning fluid is sprayed onto the brush in this state, the droplets of cleaning fluid are more likely to reach the second substrate holding portion and its surrounding area compared to when the brush is in the standby position.

[0282] Therefore, in the substrate processing apparatus, when the substrate is held by the second substrate holding part and the brush is in a position other than the standby position, no cleaning fluid is supplied to the cleaning nozzle. This reduces the amount of cleaning fluid adhering to the substrate and its surrounding components when the substrate is held by the second substrate holding part.

[0283] As a result, it is possible to prevent the substrate from being cleaned with a brush that reduces its cleanliness, and to reduce the decrease in substrate cleanliness and the cleanliness of the substrate cleaning environment caused by brush cleaning.

[0284] (Item 11) In the substrate processing apparatus described in Item 10, it is possible to provide

[0285] The substrate processing apparatus also includes a processing chamber.

[0286] The processing chamber houses the first substrate holding section, the brush, the brush moving section, the second substrate holding section, the processing section, the cleaning nozzle, and the cleaning solution supply section.

[0287] The cleaning nozzle is configured to spray cleaning solution onto the brush in the standby position.

[0288] The control unit

[0289] By controlling the cleaning solution supply unit, when there is no substrate in the processing chamber and the brush is in a position other than the standby position, the supply of cleaning solution from the cleaning nozzle to the brush is stopped.

[0290] According to the aforementioned configuration, the supply of cleaning fluid from the cleaning nozzle to the brush is stopped when there is no substrate in the processing chamber and the brush is in a position other than the standby position. Therefore, when a user performs operations inside the substrate processing apparatus due to maintenance or malfunction of the substrate processing apparatus, it prevents the cleaning fluid from being sprayed out unexpectedly, thus avoiding reduced work efficiency and decreased cleanliness of the processing chamber.

[0291] (Item 12) The substrate processing apparatus of item 12 comprises:

[0292] The first substrate holding portion is configured to hold the substrate;

[0293] The brush cleaning section is configured to allow the brush to contact the substrate held by the first substrate holding section and clean the lower surface of the substrate.

[0294] The second substrate holding portion is provided at a position higher than the first substrate holding portion, and is configured to hold the substrate.

[0295] The processing unit performs a prescribed process on the substrate held by the second substrate holding unit;

[0296] The cleaning nozzle is configured to spray a cleaning solution onto the brush for cleaning the brush.

[0297] The cleaning solution supply unit is capable of supplying the cleaning solution to the cleaning nozzle;

[0298] An operation unit is used to input the supply conditions for the cleaning solution supplied by the cleaning solution supply unit during the specified treatment of the substrate by the processing unit.

[0299] The receiving department receives the supply conditions of the cleaning solution input by the operating department; and

[0300] The control unit controls the cleaning solution supply unit according to the supply conditions received by the receiving unit, and adjusts the supply state of the cleaning solution to the cleaning nozzle during the specified treatment of the substrate by the processing unit.

[0301] In this substrate processing apparatus, a first substrate holding section holds the substrate. The lower surface of the substrate is cleaned by bringing a brush into contact with the substrate held by the first substrate holding section. A second substrate holding section holds the substrate. The substrate held by the second substrate holding section undergoes a prescribed treatment. The brush is cleaned by a brush cleaning solution sprayed from a cleaning nozzle. This prevents the substrate from being cleaned using a brush with reduced cleanliness.

[0302] During the specified processing period (hereinafter referred to as the specified processing period) of the substrate held by the second substrate holding section, depending on the state of the processing, even if the cleaning fluid sprayed onto the brush adheres to the substrate, its adhesion may not affect the cleanliness of the substrate. Furthermore, depending on the relative position of the brush to the substrate, the cleaning fluid sprayed onto the brush may not spread to the substrate and its surrounding components. Additionally, the impact of the cleaning fluid sprayed onto the brush on the substrate and its surrounding components during the specified processing period can be predicted to some extent.

[0303] According to the substrate processing apparatus, the user can input the supply conditions of the cleaning solution sprayed onto the brush during a specified processing period, taking into account the impact on the substrate and its surrounding components. Thus, the supply state of the cleaning solution from the cleaning nozzle to the brush is adjusted based on the supply conditions input by the user. For example, the user can input the desired supply conditions to stop the spraying of the cleaning solution at the point during the specified processing period when it adversely affects the cleanliness of the substrate.

[0304] As a result, it is possible to prevent the substrate from being cleaned with a brush that reduces its cleanliness, and to reduce the decrease in substrate cleanliness and the cleanliness of the substrate cleaning environment caused by brush cleaning.

[0305] (Item 13) In the substrate processing apparatus described in Item 12, it is possible to provide

[0306] The substrate processing apparatus also includes a processing chamber.

[0307] The processing chamber houses the first substrate holding section, the brush cleaning section, the second substrate holding section, the processing section, the cleaning nozzle, and the cleaning solution supply section.

[0308] The cleaning unit includes:

[0309] The brush; and

[0310] The brush moving part is configured to move the brush between a cleaning position that contacts the lower surface of the substrate held by the first substrate holding part and a standby position that is separated from the substrate held by the first substrate holding part.

[0311] The cleaning nozzle is configured to spray cleaning solution onto the brush in the standby position.

[0312] The control unit

[0313] By controlling the cleaning solution supply unit, when there is no substrate in the processing chamber and the brush is in a position other than the standby position, the supply of cleaning solution from the cleaning nozzle to the brush is stopped.

[0314] According to the aforementioned configuration, the supply of cleaning fluid from the cleaning nozzle to the brush is stopped when there is no substrate in the processing chamber and the brush is in a position other than the standby position. Therefore, when a user performs operations inside the substrate processing apparatus due to maintenance or malfunction of the substrate processing apparatus, it prevents the cleaning fluid from being sprayed out unexpectedly, thus avoiding reduced work efficiency and decreased cleanliness of the processing chamber.

[0315] (Item 14) The substrate processing method in Item 14 includes the following steps:

[0316] A substrate is fed into the processing chamber using a conveying device configured to perform a conveying operation of moving a substrate into the processing chamber and a conveying operation of moving a substrate out of the processing chamber.

[0317] In the processing chamber, the substrate brought in by the conveying device is held by the first substrate holding part;

[0318] In the processing chamber, the lower surface of the substrate is cleaned by bringing the brush into contact with the substrate held by the first substrate holding part.

[0319] In the processing chamber, the cleaning solution is sprayed from the cleaning nozzle onto the brush by supplying a cleaning solution to the cleaning nozzle for cleaning the brush; and

[0320] The substrate is removed from the processing chamber using the conveying device;

[0321] The step of spraying the cleaning solution onto the brush includes: stopping the supply of the cleaning solution to the cleaning nozzle during at least a portion of the time during the loading action and the unloading action performed by the conveying device.

[0322] In this substrate processing method, a substrate, which has been moved into the processing chamber by a conveying device, is held by a first substrate holding section. The lower surface of the substrate is cleaned by bringing a brush into contact with the substrate held by the first substrate holding section. The brush is cleaned by a brush cleaning solution sprayed from a cleaning nozzle. This prevents the substrate from being cleaned using a brush with reduced cleanliness.

[0323] Furthermore, according to the substrate processing method, during at least a portion of the substrate loading and unloading operations of the conveying device, no cleaning solution is supplied to the cleaning nozzle. Therefore, when the supply of cleaning solution is stopped, the cleaning solution will not scatter near the substrate in the processing chamber. Thus, the occurrence of cleaning solution adhering to a portion of the conveying device that enters the processing chamber during the substrate loading or unloading operations is reduced. Additionally, the occurrence of cleaning solution adhering to a portion of the substrate being conveyed by the conveying device during the substrate loading or unloading operations is reduced.

[0324] As a result, it is possible to prevent the substrate from being cleaned with a brush that reduces its cleanliness, and to reduce the decrease in substrate cleanliness and the cleanliness of the substrate cleaning environment caused by brush cleaning.

[0325] (Item 15) The substrate processing method in Item 15 includes the following steps:

[0326] The substrate is held using the first substrate holding section;

[0327] The brush is brought into contact with the substrate held by the first substrate holding part to clean the lower surface of the substrate;

[0328] The substrate is held in place by the second substrate holding section;

[0329] The substrate held by the second substrate holding portion undergoes a prescribed treatment;

[0330] In order to switch the state in which the substrate is held by the first substrate holding portion to the state in which the substrate is held by the second substrate holding portion, a relative movement operation is performed, that is, by moving at least one of the first substrate holding portion, the second substrate holding portion, and the substrate, the relative position of the first substrate holding portion and the substrate changes; and

[0331] The cleaning solution is supplied to the cleaning nozzle to clean the brush, and the cleaning solution is sprayed from the cleaning nozzle onto the brush; and

[0332] The step of spraying the cleaning solution onto the brush includes: stopping the supply of the cleaning solution to the cleaning nozzle during the relative movement.

[0333] In this substrate processing method, a first substrate holding section is used to hold the substrate. The lower surface of the substrate is cleaned by bringing a brush into contact with the substrate held by the first substrate holding section. A second substrate holding section is then used to hold the substrate. A prescribed treatment is performed on the substrate held by the second substrate holding section. The brush is cleaned by a brush cleaning solution sprayed from a cleaning nozzle. This prevents the substrate from being cleaned using a brush with reduced cleanliness.

[0334] Furthermore, according to the substrate processing method, during the relative movement, no cleaning solution is supplied to the cleaning nozzle. When the supply of cleaning solution stops, the cleaning solution will not scatter near the substrate. Therefore, it is possible to prevent cleaning solution from adhering to the substrate and its surrounding components when switching from a state where the substrate is held by the first substrate holding section to a state where the substrate is held by the second substrate holding section.

[0335] As a result, it is possible to prevent the substrate from being cleaned with a brush that reduces its cleanliness, and to reduce the decrease in substrate cleanliness and the cleanliness of the substrate cleaning environment caused by brush cleaning.

[0336] (Item 16) The substrate processing method in Item 16 includes the following steps:

[0337] The substrate is held using the first substrate holding section;

[0338] The brush is brought into contact with the substrate held by the first substrate holding portion to clean the lower surface of the substrate; and

[0339] The cleaning solution is supplied to the cleaning nozzle to clean the brush, and the cleaning solution is sprayed from the cleaning nozzle onto the brush; and

[0340] The step of spraying the cleaning solution onto the brush includes: stopping the supply of the cleaning solution to the cleaning nozzle during at least a portion of the period during which the substrate is held using the first substrate holding portion.

[0341] In this substrate processing method, a substrate is held using a first substrate holding section. The lower surface of the substrate is cleaned by bringing a brush into contact with the substrate held by the first substrate holding section. The brush is cleaned by a brush cleaning solution sprayed from a cleaning nozzle. This prevents the substrate from being cleaned using a brush with reduced cleanliness.

[0342] Furthermore, according to the substrate processing method, during at least a portion of the period when the substrate is held using the first substrate holding portion, cleaning fluid is not supplied to the cleaning nozzle. When the supply of cleaning fluid stops, the cleaning fluid will not scatter near the substrate. Therefore, it is possible to prevent cleaning fluid from adhering to the substrate and its surrounding components during at least a portion of the period when the substrate is held using the first substrate holding portion.

[0343] As a result, it is possible to prevent the substrate from being cleaned with a brush that reduces its cleanliness, and to reduce the decrease in substrate cleanliness and the cleanliness of the substrate cleaning environment caused by brush cleaning.

[0344] (Item 17) The substrate processing method in Item 17 includes the following steps:

[0345] The substrate is held using the first substrate holding section;

[0346] The brush that cleans the lower surface of the substrate by contacting the lower surface of the substrate moves between a cleaning position that contacts the lower surface of the substrate held by the first substrate holding part and a standby position that is lower than the first substrate holding part and separated from the substrate held by the first substrate holding part.

[0347] The substrate is held using a second substrate holding portion located above the first substrate holding portion;

[0348] The substrate held by the second substrate holding portion undergoes a prescribed process; and

[0349] The cleaning solution is supplied to the cleaning nozzle to clean the brush, and the cleaning solution is sprayed from the cleaning nozzle onto the brush; and

[0350] The step of spraying the cleaning solution onto the brush includes: stopping the supply of the cleaning solution to the cleaning nozzle while the substrate is held by the second substrate holding part and the brush is in a position other than the standby position.

[0351] In this substrate processing method, a first substrate holding section is used to hold the substrate. The lower surface of the substrate is cleaned by bringing a brush into contact with the substrate held by the first substrate holding section. A second substrate holding section is then used to hold the substrate. A prescribed treatment is performed on the substrate held by the second substrate holding section. The brush is cleaned by a brush cleaning solution sprayed from a cleaning nozzle. This prevents the substrate from being cleaned using a brush with reduced cleanliness.

[0352] Furthermore, according to the substrate processing method, the first substrate holding portion is located higher than the brush's standby position. Additionally, the second substrate holding portion is located even higher than the first substrate holding portion. Therefore, even when the brush is in the standby position, if cleaning fluid is sprayed onto the brush, the resulting droplets are unlikely to reach the second substrate holding portion and its surrounding area.

[0353] In contrast, when the brush is in a position other than the standby position, for example, when the brush is positioned higher than the standby position, the distance between the brush and the second substrate holding portion becomes shorter. When cleaning fluid is sprayed onto the brush in this state, the droplets of cleaning fluid are more likely to reach the second substrate holding portion and its surrounding area compared to when the brush is in the standby position.

[0354] Therefore, in the substrate processing method, when the substrate is held by the second substrate holding part and the brush is in a position other than the standby position, no cleaning solution is supplied to the cleaning nozzle. Thus,

[0355] As a result, it is possible to prevent the substrate from being cleaned with a brush that reduces its cleanliness, and to reduce the decrease in substrate cleanliness and the cleanliness of the substrate cleaning environment caused by brush cleaning.

[0356] (Item 18) The substrate processing method in Item 18 includes the following steps:

[0357] The substrate is held using the first substrate holding section;

[0358] The brush is brought into contact with the substrate held by the first substrate holding part to clean the lower surface of the substrate;

[0359] The substrate is held using a second substrate holding portion located above the first substrate holding portion;

[0360] The substrate held by the second substrate holding portion undergoes a prescribed treatment;

[0361] The cleaning solution is sprayed from the cleaning nozzle onto the brush by supplying a cleaning solution to the cleaning nozzle for cleaning the brush; and

[0362] When the supply conditions of the cleaning solution to the cleaning nozzle during the specified treatment of the substrate held by the second substrate holding part are input to the operation unit, the supply conditions of the cleaning solution input by the operation unit are accepted.

[0363] The step of spraying the cleaning solution onto the brush includes: adjusting the supply state of the cleaning solution to the cleaning nozzle during the period when the substrate is subjected to the prescribed treatment according to the supply conditions accepted in the acceptance step.

[0364] In this substrate processing method, a first substrate holding section is used to hold the substrate. The lower surface of the substrate is cleaned by bringing a brush into contact with the substrate held by the first substrate holding section. A second substrate holding section is then used to hold the substrate. A prescribed treatment is performed on the substrate held by the second substrate holding section. The brush is cleaned by a brush cleaning solution sprayed from a cleaning nozzle. This prevents the substrate from being cleaned using a brush with reduced cleanliness.

[0365] During the specified processing period (hereinafter referred to as the specified processing period) of the substrate held by the second substrate holding section, depending on the state of the processing, even if the cleaning fluid sprayed onto the brush adheres to the substrate, its adhesion may not affect the cleanliness of the substrate. Furthermore, depending on the relative position of the brush to the substrate, the cleaning fluid sprayed onto the brush may not spread to the substrate and its surrounding components. Additionally, the impact of the cleaning fluid sprayed onto the brush on the substrate and its surrounding components during the specified processing period can be predicted to some extent.

[0366] According to the substrate processing apparatus, the user can input the supply conditions of the cleaning solution sprayed onto the brush during a specified processing period, taking into account the impact on the substrate and its surrounding components. Thus, the supply state of the cleaning solution from the cleaning nozzle to the brush is adjusted according to the supply conditions input by the user. For example, the user can input the desired supply conditions to stop the spraying of the cleaning solution at the point during the specified processing period when it adversely affects the cleanliness of the substrate.

[0367] As a result, it is possible to prevent the substrate from being cleaned with a brush that reduces its cleanliness, and to reduce the decrease in substrate cleanliness and the cleanliness of the substrate cleaning environment caused by brush cleaning.

[0368] The substrate processing apparatus according to the described embodiment can reduce the decrease in cleanliness of the washed substrate and the decrease in cleanliness of the substrate washing environment, thereby suppressing the generation of substrate processing defects. Therefore, the yield of products obtained through substrate processing is improved. This reduces unnecessary substrate processing, thus achieving energy savings in substrate processing. Furthermore, when using a chemical solution in this substrate processing, the utilization of excess chemical solution can be reduced as the yield improves, thus contributing to reducing environmental pollution.

Claims

1. A substrate processing apparatus comprising: Processing room; The conveying device is configured to perform a conveying action of conveying a substrate into the processing chamber and a conveying action of conveying a substrate out of the processing chamber. A first substrate holding section is provided in the processing chamber to hold the substrate that has been moved in by the conveying device; A brush cleaning section is provided in the processing chamber and is configured to allow the brush to contact the substrate held by the first substrate holding section to clean the lower surface of the substrate. A cleaning nozzle is provided in the treatment chamber and configured to spray a cleaning solution onto the brush for cleaning the brush. The cleaning solution supply unit is capable of supplying the cleaning solution to the cleaning nozzle; as well as The control unit, by controlling the cleaning liquid supply unit, stops supplying the cleaning liquid to the cleaning nozzle during at least a portion of the time during the loading and unloading operations performed by the conveying device. The cleaning unit includes: The brush; as well as The brush moving part is configured to move the brush between a cleaning position that contacts the lower surface of the substrate held by the first substrate holding part and a standby position that is separated from the substrate held by the first substrate holding part. The cleaning nozzle is configured to spray cleaning solution onto the brush in the standby position. The control unit By controlling the cleaning fluid supply unit, when there is no substrate in the processing chamber and the brush is in the standby position, the supply of cleaning fluid from the cleaning nozzle to the brush is permitted, while when there is no substrate in the processing chamber and the brush is in a position other than the standby position, the supply of cleaning fluid from the cleaning nozzle to the brush is stopped.

2. The substrate processing apparatus according to claim 1, wherein the conveying device comprises: The transport and holding section is configured to hold the substrate during movement; and The conveying drive unit moves the conveying holding unit. The control unit then controls the conveying drive unit to cause the conveying holding unit to enter and exit the processing chamber from the outside of the processing chamber and from the processing chamber during the conveying action and the conveying action of the conveying device. At least a portion of the period during which the conveying device performs the conveying action and the period during which the conveying action is performed is the period during which the conveying holding part is located inside the processing chamber.

3. A substrate processing apparatus, comprising: The first substrate holding portion is configured to hold the substrate; The brush cleaning section is configured to allow the brush to contact the substrate held by the first substrate holding section and clean the lower surface of the substrate. The second substrate holding portion is configured to hold the substrate; The processing unit performs a prescribed process on the substrate held by the second substrate holding unit; The relative moving part performs a relative moving operation in order to switch the state in which the substrate is held by the first substrate holding part to the state in which the substrate is held by the second substrate holding part. That is, by moving at least one of the first substrate holding part, the second substrate holding part, and the substrate, the relative position of the first substrate holding part and the substrate changes. The cleaning nozzle is configured to spray a cleaning solution onto the brush for cleaning the brush. The cleaning solution supply unit is capable of supplying the cleaning solution to the cleaning nozzle; The control unit, by controlling the cleaning liquid supply unit, stops supplying the cleaning liquid to the cleaning nozzle when the relative movement unit performs the relative movement operation; as well as The processing chamber houses the first substrate holding section, the brush cleaning section, the second substrate holding section, the processing section, the cleaning nozzle, and the cleaning solution supply section. The cleaning unit includes: The brush; as well as The brush moving part is configured to move the brush between a cleaning position that contacts the lower surface of the substrate held by the first substrate holding part and a standby position that is separated from the substrate held by the first substrate holding part. The cleaning nozzle is configured to spray cleaning solution onto the brush in the standby position. The control unit controls the cleaning fluid supply unit to allow the supply of cleaning fluid from the cleaning nozzle to the brush when there is no substrate in the processing chamber and the brush is in the standby position, and to stop the supply of cleaning fluid from the cleaning nozzle to the brush when there is no substrate in the processing chamber and the brush is in a position other than the standby position.

4. The substrate processing apparatus according to claim 3, wherein the brush cleaning section is configured to clean the first region by contacting the brush with a first region on the lower surface of the substrate held by the first substrate holding section, and is configured to clean the second region by contacting the brush with a second region on the lower surface of the substrate held by the second substrate holding section that is different from the first region. With the substrate held by the first substrate holding unit, the control unit controls the brush cleaning unit to clean the first region of the lower surface of the substrate. With the substrate held by the second substrate holding part, the brush cleaning part is controlled and used as the processing part to clean the second region of the lower surface of the substrate.

5. A substrate processing apparatus, comprising: The first substrate holding portion is configured to hold the substrate; The brush cleaning section is configured to allow the brush to contact the substrate held by the first substrate holding section and clean the lower surface of the substrate. The cleaning nozzle is configured to spray a cleaning solution onto the brush for cleaning the brush. The cleaning solution supply unit is capable of supplying the cleaning solution to the cleaning nozzle; The control unit, by controlling the cleaning liquid supply unit, stops supplying the cleaning liquid to the cleaning nozzle during at least a portion of the period during which the substrate is held by the first substrate holding unit; as well as The processing chamber houses the first substrate holding section, the brush cleaning section, the cleaning nozzle, and the cleaning solution supply section. The cleaning unit includes: The brush; as well as The brush moving part is configured to move the brush between a cleaning position that contacts the lower surface of the substrate held by the first substrate holding part and a standby position that is separated from the substrate held by the first substrate holding part. The cleaning nozzle is configured to spray cleaning solution onto the brush in the standby position. The control unit controls the cleaning fluid supply unit to allow the supply of cleaning fluid from the cleaning nozzle to the brush when there is no substrate in the processing chamber and the brush is in the standby position, and to stop the supply of cleaning fluid from the cleaning nozzle to the brush when there is no substrate in the processing chamber and the brush is in a position other than the standby position.

6. The substrate processing apparatus according to claim 5, wherein the first substrate holding portion is configured to rotate the held substrate. The control unit controls the first substrate holding unit to dry the substrate after the lower surface of the substrate has been cleaned by the brush cleaning unit and the first substrate holding unit rotates at a predetermined speed. At least a portion of the period during which the substrate is held by the first substrate holding portion includes the period from the point when the substrate begins to be dried by rotating the first substrate holding portion to the point when the holding state of the substrate by the first substrate holding portion is released.

7. A substrate processing apparatus comprising: The first substrate holding portion is configured to hold the substrate; A brush cleans the lower surface of the substrate by contacting it. The brush moving part is configured to move the brush between a cleaning position that contacts the lower surface of the substrate held by the first substrate holding part, and a standby position that is lower than the first substrate holding part and the brush is separated from the substrate held by the first substrate holding part; The second substrate holding portion is provided at a position higher than the first substrate holding portion, and is configured to hold the substrate. The processing unit performs a prescribed process on the substrate held by the second substrate holding unit; The cleaning nozzle is configured to spray a cleaning solution onto the brush for cleaning the brush. The cleaning solution supply unit is capable of supplying the cleaning solution to the cleaning nozzle; The control unit controls the cleaning fluid supply unit to stop supplying the brush cleaning fluid to the cleaning nozzle when the substrate is held by the second substrate holding unit and the brush is in a position other than the standby position. as well as The processing chamber houses the first substrate holding part, the brush, the brush moving part, the second substrate holding part, the processing part, the cleaning nozzle, and the cleaning solution supply part. The cleaning nozzle is configured to spray cleaning solution onto the brush in the standby position. The control unit controls the cleaning fluid supply unit to allow the supply of cleaning fluid from the cleaning nozzle to the brush when there is no substrate in the processing chamber and the brush is in the standby position, and to stop the supply of cleaning fluid from the cleaning nozzle to the brush when there is no substrate in the processing chamber and the brush is in a position other than the standby position.

8. A substrate processing apparatus comprising: The first substrate holding portion is configured to hold the substrate; The brush cleaning section is configured to allow the brush to contact the substrate held by the first substrate holding section and clean the lower surface of the substrate. The second substrate holding portion is provided at a position higher than the first substrate holding portion, and is configured to hold the substrate. The processing unit performs a prescribed process on the substrate held by the second substrate holding unit; The cleaning nozzle is configured to spray a cleaning solution onto the brush for cleaning the brush. The cleaning solution supply unit is capable of supplying the cleaning solution to the cleaning nozzle; as well as An operation unit is used to input the supply conditions for the cleaning solution supplied by the cleaning solution supply unit during the specified treatment of the substrate by the processing unit. The receiving department receives the supply conditions of the cleaning solution input by the operation department; The control unit controls the cleaning solution supply unit according to the supply conditions received by the receiving unit, and adjusts the supply state of the cleaning solution to the cleaning nozzle during the specified treatment of the substrate by the processing unit. as well as The processing chamber houses the first substrate holding section, the brush cleaning section, the second substrate holding section, the processing section, the cleaning nozzle, and the cleaning solution supply section. The cleaning unit includes: The brush; as well as The brush moving part is configured to move the brush between a cleaning position that contacts the lower surface of the substrate held by the first substrate holding part and a standby position that is separated from the substrate held by the first substrate holding part. The cleaning nozzle is configured to spray cleaning solution onto the brush in the standby position. The control unit controls the cleaning fluid supply unit to allow the supply of cleaning fluid from the cleaning nozzle to the brush when there is no substrate in the processing chamber and the brush is in the standby position, and to stop the supply of cleaning fluid from the cleaning nozzle to the brush when there is no substrate in the processing chamber and the brush is in a position other than the standby position.

9. A substrate processing apparatus comprising: Processing room; A substrate holding section is provided in the processing chamber to hold the substrate; A brush, provided in the processing chamber, is capable of cleaning the lower surface of the substrate held by the substrate holding part; A cleaning nozzle is provided in the treatment chamber and configured to spray a cleaning solution onto the brush for cleaning the brush. The cleaning solution supply unit is capable of supplying the cleaning solution to the cleaning nozzle; The brush moving part is configured to move the brush between a cleaning position in contact with the lower surface of the substrate held by the substrate holding part, and a standby position separated from the substrate held by the substrate holding part; and The control unit, by controlling the cleaning fluid supply unit, allows the supply of cleaning fluid from the cleaning nozzle to the brush when there is no substrate in the processing chamber and the brush is in the standby position, and stops the supply of cleaning fluid from the cleaning nozzle to the brush when there is no substrate in the processing chamber and the brush is in a position other than the standby position.

10. A substrate processing method, comprising the following steps: A substrate is fed into the processing chamber using a conveying device configured to perform a conveying operation of moving a substrate into the processing chamber and a conveying operation of moving a substrate out of the processing chamber. In the processing chamber, the substrate brought in by the conveying device is held by the first substrate holding part; In the processing chamber, the lower surface of the substrate is cleaned by bringing the brush into contact with the substrate held by the first substrate holding part. In the processing chamber, the cleaning solution is sprayed from the cleaning nozzle onto the brush by supplying a cleaning solution to the cleaning nozzle for cleaning the brush; and The substrate is removed from the processing chamber using the conveying device; and The step of spraying the cleaning solution onto the brush includes: stopping the supply of the cleaning solution to the cleaning nozzle during at least a portion of the time during the loading action and the unloading action performed by the conveying device. The step of cleaning the lower surface of the substrate includes: moving the brush between a cleaning position in contact with the lower surface of the substrate held by the first substrate holding part and a standby position separated from the substrate held by the first substrate holding part; The cleaning nozzle is configured to spray cleaning solution onto the brush in the standby position. The step of spraying the cleaning solution onto the brush further includes: With no substrate present in the processing chamber and the brush in the standby position, it is permissible to supply cleaning solution to the brush from the cleaning nozzle. When there is no substrate in the processing chamber and the brush is in a position other than the standby position, the supply of cleaning solution from the cleaning nozzle to the brush is stopped.

11. A substrate processing method, comprising the following steps: The substrate is held using the first substrate holding section; The brush is brought into contact with the substrate held by the first substrate holding part to clean the lower surface of the substrate; The substrate is held in place by the second substrate holding section; The substrate held by the second substrate holding portion undergoes a prescribed treatment; In order to switch the state in which the substrate is held by the first substrate holding portion to the state in which the substrate is held by the second substrate holding portion, a relative movement operation is performed, that is, by moving at least one of the first substrate holding portion, the second substrate holding portion, and the substrate, the relative position of the first substrate holding portion and the substrate changes; and The cleaning solution is supplied to the cleaning nozzle to clean the brush, and the cleaning solution is sprayed from the cleaning nozzle onto the brush; and The step of spraying the cleaning solution onto the brush includes: stopping the supply of the cleaning solution to the cleaning nozzle during the relative movement. The first substrate holding part, the brush, the second substrate holding part, and the cleaning nozzle are housed in a processing chamber; The step of cleaning the lower surface of the substrate includes: moving the brush between a cleaning position in contact with the lower surface of the substrate held by the first substrate holding part and a standby position separated from the substrate held by the first substrate holding part; The cleaning nozzle is configured to spray cleaning solution onto the brush in the standby position. The step of spraying the cleaning solution onto the brush further includes: With no substrate present in the processing chamber and the brush in the standby position, it is permissible to supply cleaning solution to the brush from the cleaning nozzle. When there is no substrate in the processing chamber and the brush is in a position other than the standby position, the supply of cleaning solution from the cleaning nozzle to the brush is stopped.

12. A substrate processing method, comprising the following steps: The substrate is held using the first substrate holding section; The brush is brought into contact with the substrate held by the first substrate holding portion to clean the lower surface of the substrate; and The cleaning solution is supplied to the cleaning nozzle to clean the brush, and the cleaning solution is sprayed from the cleaning nozzle onto the brush; and The step of spraying the cleaning solution onto the brush includes: stopping the supply of the cleaning solution to the cleaning nozzle during at least a portion of the period during which the substrate is held using the first substrate holding portion; The first substrate holding part, the brush, and the cleaning nozzle are housed in the processing chamber; The step of cleaning the lower surface of the substrate includes: moving the brush between a cleaning position in contact with the lower surface of the substrate held by the first substrate holding part and a standby position separated from the substrate held by the first substrate holding part; The cleaning nozzle is configured to spray cleaning solution onto the brush in the standby position. The step of spraying the cleaning solution onto the brush further includes: With no substrate present in the processing chamber and the brush in the standby position, it is permissible to supply cleaning solution to the brush from the cleaning nozzle. When there is no substrate in the processing chamber and the brush is in a position other than the standby position, the supply of cleaning solution from the cleaning nozzle to the brush is stopped.

13. A substrate processing method, comprising: The substrate is held using the first substrate holding section; The brush that cleans the lower surface of the substrate by contacting it is moved between a cleaning position in contact with the lower surface of the substrate held by the first substrate holding part, and a standby position that is lower than the first substrate holding part and the brush is separated from the substrate held by the first substrate holding part; The substrate is held using a second substrate holding portion located above the first substrate holding portion; The substrate held by the second substrate holding portion undergoes a prescribed treatment; as well as The cleaning solution is supplied to the cleaning nozzle to clean the brush, and the cleaning solution is sprayed from the cleaning nozzle onto the brush; and The step of spraying the cleaning solution onto the brush includes: stopping the supply of the cleaning solution to the cleaning nozzle when the substrate is held by the second substrate holding part and the brush is in a position other than the standby position; The first substrate holding part, the brush, the second substrate holding part, and the cleaning nozzle are housed in a processing chamber; The cleaning nozzle is configured to spray cleaning solution onto the brush in the standby position. The step of spraying the cleaning solution onto the brush further includes: With no substrate present in the processing chamber and the brush in the standby position, it is permissible to supply cleaning solution to the brush from the cleaning nozzle. When there is no substrate in the processing chamber and the brush is in a position other than the standby position, the supply of cleaning solution from the cleaning nozzle to the brush is stopped.

14. A substrate processing method, comprising: The substrate is held using the first substrate holding section; The brush is brought into contact with the substrate held by the first substrate holding part to clean the lower surface of the substrate; The substrate is held using a second substrate holding portion located above the first substrate holding portion; The substrate held by the second substrate holding portion undergoes a prescribed treatment; The cleaning solution is sprayed from the cleaning nozzle onto the brush by supplying a cleaning solution to the cleaning nozzle for cleaning the brush; and When the supply conditions for supplying the cleaning solution to the cleaning nozzle during the specified treatment of the substrate held by the second substrate holding section are input to the operation unit, the supply conditions for the cleaning solution input by the operation unit are accepted; and The step of spraying the cleaning solution onto the brush includes: adjusting the supply state of the cleaning solution to the cleaning nozzle during the period when the substrate is subjected to the prescribed treatment according to the supply conditions accepted in the acceptance step. The first substrate holding part, the brush, the second substrate holding part, and the cleaning nozzle are housed in a processing chamber; The step of cleaning the lower surface of the substrate includes: moving the brush between a cleaning position in contact with the lower surface of the substrate held by the first substrate holding part and a standby position separated from the substrate held by the first substrate holding part; The cleaning nozzle is configured to spray cleaning solution onto the brush in the standby position. The step of spraying the cleaning solution onto the brush further includes: With no substrate present in the processing chamber and the brush in the standby position, it is permissible to supply cleaning solution to the brush from the cleaning nozzle. When there is no substrate in the processing chamber and the brush is in a position other than the standby position, the supply of cleaning solution from the cleaning nozzle to the brush is stopped.

15. A substrate processing method, comprising the following steps: The substrate is held in the processing chamber using a substrate holding section; In the processing chamber, a brush is brought into contact with the substrate held by the substrate holding portion to clean the lower surface of the substrate; and In the processing chamber, the cleaning solution is sprayed from the cleaning nozzle onto the brush by supplying the cleaning nozzle with a cleaning solution for cleaning the brush. The step of cleaning the lower surface of the substrate includes: moving the brush between a cleaning position in contact with the lower surface of the substrate held by the substrate holding part and a standby position separated from the substrate held by the substrate holding part; The step of spraying the cleaning solution onto the brush further includes: With no substrate present in the processing chamber and the brush in the standby position, it is permissible to supply cleaning solution to the brush from the cleaning nozzle. When there is no substrate in the processing chamber and the brush is in a position other than the standby position, the supply of cleaning solution from the cleaning nozzle to the brush is stopped.

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