Substrate structure, electrochromic device, electrochromic apparatus, and terminal product

Abstract

The application relates to the technical field of electrochromic technology, in particular to a substrate structure, an electrochromic device, an electrochromic apparatus and a terminal product. The substrate structure comprises a conductive layer, a bus assembly and a base material layer. The conductive layer has a bearing surface; the bus assembly is arranged on the bearing surface; and the base material layer is arranged on the bearing surface and located on at least one side of the bus assembly. The difference between the Zisman value of the surface of the bus assembly close to the base material layer and the surface tension of the base material layer slurry is greater than 15 dyn / cm. Since the difference between the Zisman value of the surface of the bus assembly close to the base material layer and the surface tension of the base material layer slurry is greater than 15 dyn / cm, the bus assembly does not repel the base material, so that the distribution of the base material around the bus assembly is relatively uniform.

Description

Technical Field

[0001] This application relates to the field of electrochromic technology, and more particularly to a substrate structure, an electrochromic device, an electrochromic apparatus, and an end product. Background Technology

[0002] Electrochromic devices possess optical properties that allow for stable and reversible color changes under the influence of an applied electric field, manifesting as reversible variations in color and transparency. They have a wide range of applications in products such as vehicle rearview mirrors, sunroofs, side windows, building curtain walls, window and door systems, and display devices.

[0003] In existing technologies, busbars are typically pre-formed on a conductive layer, and then a base material (electrochromic layer or ion storage layer) is coated onto the conductive layer with the busbars to form a basic structure. The base structure with the electrochromic layer and the base structure with the ion storage layer are then combined using an electrolyte to form an electrochromic device. However, the busbars in the basic structure of these technologies can repel the base material, leading to uneven distribution of the base material near the busbars, which in turn affects the optical performance of the electrochromic device. Summary of the Invention

[0004] The purpose of this application is to provide a substrate structure, an electrochromic device and apparatus, and a terminal product, wherein the basic material on the substrate structure is relatively uniformly distributed.

[0005] To achieve the above objectives, the technical solution adopted in the first aspect of this application is: a substrate structure, including a conductive layer, a busbar assembly, and a base material layer.

[0006] The conductive layer has a bearing surface; the busbar assembly is disposed on the bearing surface; the base material layer is disposed on the bearing surface and is located on at least one side of the busbar assembly; wherein the difference between the dyne value of the surface of the busbar assembly near the base material layer and the surface tension of the slurry of the base material layer is greater than 15 dyn / cm.

[0007] The beneficial effect of the substrate structure provided in this application is that, since the difference between the dyn value of the surface of the busbar assembly near the base material layer and the surface tension of the base material layer slurry is greater than 15 dyn / cm, the busbar assembly will not repel the base material, and the base material layer can adhere well to the busbar assembly. Therefore, the distribution of the base material around the busbar assembly will be more uniform.

[0008] In some embodiments, the manifold assembly includes a manifold layer disposed on the bearing surface, wherein the difference between the dyne value of the manifold layer and the surface tension of the base material layer slurry is greater than 15 dyn / cm.

[0009] In some embodiments, the dyne value of the busbar layer is 15 dyn / cm greater than the surface tension of the base material layer slurry.

[0010] In some embodiments, the material of the bus layer includes either copper or gold.

[0011] In some embodiments, the manifold assembly includes a manifold layer and a varnish layer, wherein the difference between the dyne value of the varnish layer and the surface tension of the base material layer slurry is greater than 15 dyn / cm, and the varnish layer is disposed between the manifold layer and the base material layer.

[0012] In some embodiments, the base material layer and / or the varnish layer cover a portion of the surface of the busbar layer opposite to the conductive layer.

[0013] In some embodiments, the varnish layer includes a first varnish portion and a second varnish portion, and the confluence layer includes a first portion and a second portion; the second varnish portion covers the second portion, and the first varnish portion is spaced around the outer periphery of the confluence layer.

[0014] In some embodiments, on the bearing surface, the varnish layer surrounds the outer periphery of the confluence layer.

[0015] In some embodiments, on the bearing surface, the width of the varnish layer extending toward the confluence layer or the width of the varnish layer extending toward the base material layer is 0.1 mm to 0.2 mm.

[0016] In some embodiments, on the bearing surface, the distance between the varnish layer and the flow-through layer is 0.15mm-0.30mm.

[0017] In some embodiments, the thickness of the varnish layer extending away from the conductive layer is greater than or equal to the thickness of the busbar layer extending away from the conductive layer.

[0018] In some embodiments, the thickness of the bus layer extending away from the conductive layer is 4µm-7µm, and / or the thickness of the varnish layer extending away from the conductive layer is 4µm-7µm.

[0019] In some embodiments, the dyne value of the varnish layer is 15 dyn / cm greater than the surface tension of the base material layer slurry.

[0020] To achieve the above objectives, the technical solution adopted in the second aspect of this application is: an electrochromic device, comprising an electro-optic dielectric layer and two substrate structures as described in the first aspect of the application.

[0021] The two substrate structures are a first substrate structure and a second substrate structure. The base material layer in the first substrate structure is one of an electrochromic layer and an ion storage layer, and the base material layer in the second substrate structure is the other of an electrochromic layer and an ion storage layer. The first substrate structure and the second substrate structure are disposed opposite to each other, and the electro-optic dielectric layer is located between the first substrate structure and the second substrate structure.

[0022] The beneficial effects of the electrochromic device provided in this application are as follows: by applying the substrate structure of the first aspect embodiment above to the electrochromic device, the electrochromic layer and ion storage layer in the electrochromic device can be better attached to the busbar component, and the electrochromic layer and ion storage layer are more uniformly distributed, so that the electrochromic device has a better color-changing effect.

[0023] To achieve the above objectives, the technical solution adopted in the third aspect of this application is: an electrochromic device, characterized in that it includes a substrate and the electrochromic device of the second aspect embodiment described above.

[0024] The beneficial effect of the electrochromic device provided in this application is that the substrate is disposed on the side of the first substrate structure opposite to the second substrate structure, and / or the substrate is disposed on the side of the second substrate structure opposite to the first substrate structure.

[0025] By applying the electrochromic device of the second aspect embodiment described above to an electrochromic apparatus, the electrochromic apparatus achieves a better color-changing effect.

[0026] To achieve the above objectives, the technical solution adopted in the fourth aspect of this application is: a terminal product, including the electrochromic device of the second aspect embodiment or the electrochromic apparatus of the third aspect embodiment, wherein the terminal product includes any one of a rearview mirror, a curtain wall, a car sunroof, a car side window, a car windshield, a housing of an electronic product, glasses, a vehicle, and a display panel.

[0027] The beneficial effect of the terminal product provided by this application is that by applying the electrochromic device of the second aspect embodiment or the electrochromic apparatus of the third aspect embodiment to the terminal product, the terminal product has a better color-changing effect. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0029] Figure 1 This is a schematic diagram of the substrate structure in one embodiment of this application;

[0030] Figure 2 yes Figure 1 The cross-sectional view of the substrate structure shown along the AA direction;

[0031] Figure 3 This is a schematic diagram of the substrate structure in another embodiment of this application;

[0032] Figure 4 yes Figure 3 The shown is a cross-sectional view of the substrate structure along the BB direction;

[0033] Figure 5 This is a schematic diagram of the substrate structure in another embodiment of this application;

[0034] Figure 6 yes Figure 5 The shown is a cross-sectional view of the substrate structure along the CC direction;

[0035] Figure 7 This is a schematic diagram of the substrate structure in another embodiment of this application;

[0036] Figure 8 yes Figure 7 The diagram shows the structure of the substrate after the base material layer has been removed.

[0037] Figure 9 This is a schematic diagram of the structure of an electrochromic device in one embodiment of this application;

[0038] Figure 10 This is a schematic diagram of the substrate structure in one embodiment of this application;

[0039] Figure 11 yes Figure 10 The cross-sectional view of the substrate structure shown along the DD direction;

[0040] Figure 12 This is a schematic diagram of the substrate structure in one embodiment of this application;

[0041] Figure 13 yes Figure 12 The cross-sectional view of the substrate structure shown along the EE direction;

[0042] Figure 14 This is a schematic diagram of the substrate structure in one embodiment of this application;

[0043] Figure 15 This is a schematic diagram of the substrate structure in one embodiment of this application;

[0044] Figure 16 yes Figure 15 The cross-sectional view of the substrate structure shown along the FF direction;

[0045] Figure 17 This is a schematic diagram of the structure of an electrochromic device in one embodiment of this application;

[0046] Figure 18 This is a flowchart of a method for manufacturing an electrochromic device according to one embodiment of this application;

[0047] Figure 19 These are microscope images of the busbars with varnish layers in different regions of the conductive layer in this application;

[0048] Figure 20 This is a microscope image of the conductive layer busbar with a varnish layer disposed around it in this application.

[0049] Figure label:

[0050] 1. Conductive layer;

[0051] 2. Busbar assembly; 21. Busbar layer; 211. First part; 22. Varnish layer; 221. First varnish part; 222. Second varnish part; 2a. First busbar assembly; 2b. Second busbar assembly;

[0052] 3. Basic material layer; 31. First functional section; 32. Second functional section;

[0053] 4. Electrochromic device; 41. First conductive layer; 411. First conductive region; 412. Second conductive region; 413. First conductive region; 414. Busbar; 42. Second conductive layer; 43. First conductive region;

[0054] 5. Conductive layer; 51. Conductive particles;

[0055] 61. First base material layer; 62. Electro-optic dielectric layer; 63. Second base material layer;

[0056] 7. Conductive groove;

[0057] 8. Sealing components. Detailed Implementation

[0058] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0059] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0060] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0061] In this specification, references to "one embodiment," "some embodiments," or simply "embodiment" mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. Furthermore, in one or more embodiments, specific features, structures, or characteristics may be combined in any suitable manner.

[0062] Electrochromic devices possess optical properties that allow for stable and reversible color changes under the influence of an applied electric field, manifesting as reversible variations in color and transparency. They have a wide range of applications in products such as vehicle rearview mirrors, sunroofs, side windows, building curtain walls, window and door systems, and display devices.

[0063] In existing technologies, busbars are typically pre-formed on a conductive layer, and then a base material (electrochromic layer or ion storage layer) is coated onto the conductive layer with the busbars to form a basic structure. The base structure with the electrochromic layer and the base structure with the ion storage layer are then bonded together using an electrolyte to form an electrochromic device. However, in these technologies, when the base material is sprayed onto the surface of the busbars, the busbars repel the base material, resulting in uneven distribution of the base material near the busbars, which affects the color-changing effect of the electrochromic device.

[0064] In view of the above problems, this application provides a substrate structure, an electrochromic device, and a method for manufacturing the electrochromic device, wherein the basic material on the substrate structure is distributed relatively uniformly.

[0065] To illustrate the technical solution of this application, the following description is provided in conjunction with specific accompanying drawings and embodiments.

[0066] Please refer to Figure 1 , Figure 3 , Figure 5 , Figure 7 , Figure 10 Figure 12 , Figure 14 and Figure 15 This application provides a substrate structure including a conductive layer 1, a busbar assembly 2, and a base material layer 3.

[0067] A conductive layer 1 is disposed on a substrate, which is a flexible material such as transparent flexible optical materials like PET (polyethylene terephthalate) or PC (polycarbonate). The conductive layer 1 has a bearing surface (the side of the conductive layer 1 facing away from the substrate is the bearing surface); a busbar assembly 2 is disposed on the bearing surface; a base material layer 3 is disposed on the bearing surface, and the base material layer 3 is located on at least one side of the busbar assembly 2; the conductive layer 1 includes a central portion and an edge portion, with the edge portion surrounding the outer periphery of the central portion. Specifically, the busbar assembly 2 is disposed on the edge portion of the conductive layer 1, and the corresponding base material layer 3 is disposed at least in the central portion of the conductive layer 1. The difference between the dyne value of the surface of the busbar assembly 2 near the base material layer 3 and the surface tension of the slurry in the base material layer 3 is greater than 15 dyn / cm.

[0068] In the substrate structure provided in this application, during the production process, the base material layer 3 slurry is sprayed onto one side of the busbar layer. Since the difference between the dyne value of the surface of the busbar component 2 near the base material layer 3 and the surface tension of the base material layer 3 slurry is greater than 15 dyn / cm, the busbar component 2 will not repel the base material, and the base material layer 3 can adhere well to the busbar component. Therefore, the distribution of the base material around the busbar component 2 will be relatively uniform.

[0069] Generally speaking, the higher the dyne value of a solid, the more surface energy it has, and therefore the easier it is for the solid surface to accept liquids, resulting in better adhesion between the solid and the liquid.

[0070] Specifically, the process of fabricating the substrate structure of this application embodiment involves first placing the busbar assembly 2 on the conductive layer 1, and then coating the conductive layer 1 with a base material solution to form the base material layer 3. Therefore, in this embodiment, the difference between the dyne value of the surface of the busbar assembly 2 near the base material layer 3 and the surface tension of the slurry of the base material layer 3 is greater than 15 dyn / cm, meaning that the dyne value of the surface of the busbar assembly 2 near the base material layer 3 is at least 15 dyn / cm greater than the surface tension of the slurry of the base material layer 3.

[0071] It should be noted that conductive layer 1 is a conductive thin film with a relatively soft texture. Generally, conductive layer 1 is placed on a substrate, and the conductive layer 1 and the substrate together form a conductive substrate. During the molding and transfer of conductive layer 1, the substrate plays a supporting and load-bearing role. The substrate is a transparent flexible material, such as PET or PC, and the conductive layer 1 is a transparent conductive thin film, such as ITO (Indium-Tin Oxide) film or other transparent conductive oxides.

[0072] Optionally, a conductive solution is applied to the substrate, and conductive layer 1 is formed after the conductive solution cures.

[0073] Optionally, in actual production, a substrate with conductive layer 1 can also be directly purchased.

[0074] It should be noted that the substrate structure of this application can be used to fabricate electrochromic devices, in which the base material layer 3 is one of an electrochromic layer and an ion storage layer. The base material layer 3 can be disposed on the conductive layer 1 using materials and methods available in the prior art.

[0075] Optionally, the base material layer 3 is an electrochromic layer. The materials of the electrochromic layer include, but are not limited to: tungsten trioxide, polydecyl viologen and its derivatives, polyaniline and its derivatives, electrochromic conjugated polymers, or copolymers containing acceptor units.

[0076] Electrochromic conjugated polymers include one or a combination of at least two of the following: polypyrrole and its derivatives, polythiophene and its derivatives, poly(3,4-ethylenedioxythiophene) and its derivatives, poly(propylenedioxythiophene) and its derivatives, polyfuran and its derivatives, polyfluorene and its derivatives, polycarbazole and its derivatives, and copolymers thereof.

[0077] Copolymers containing acceptor units include one or a combination of at least two of benzothiadiazole, benzoselenidazole, benzoxazole, benzotriazole, benzimidazole, quinoxaline, and pyrrolopyrroledione.

[0078] Optionally, the solvents for dispersing the electrochromic layer include, but are not limited to, ethanol, isopropanol, xylene, toluene, ethyl acetate, acetic acid, acetone, and mixtures thereof.

[0079] In summary, the base material slurry can be any one or more of the following materials: tungsten trioxide, polydecyl viologen and its derivatives, polyaniline and its derivatives, electrochromic conjugated polymers or copolymers containing acceptor units, and any one of the following solvents: ethanol, isopropanol, xylene, toluene, ethyl acetate, acetic acid, acetone, etc., and mixtures thereof.

[0080] Optionally, the base material layer 3 is an ion storage layer. The materials of the ion storage layer include, but are not limited to, one or a combination of at least two of the following: oxides or complexes formed by metal elements from Groups IIIB, IVB, VB, VIB, VIIB, VIII, IB and IIB that can store ions during electrochemical reactions.

[0081] Preferably, the metallic element is selected from Ti, V, Nb, Ta, Cr, Mo, W, Mn, Fe, Co, Ir, Ni, Cu and Zn.

[0082] Preferably, the complex is selected from one or a combination of at least two of Prussian green, Prussian white, Prussian brown, Prussian blue, KFeFe(CN)6, FeNiHCF, FeHCF, NiHCF or XmYn{Fe(CN)6}, wherein X is Na+ or K+, and Y is Fe3+, Co3+, Ni+, Mn2+, Zn2+ or Cu2+.

[0083] Optionally, the solvent for the material of the dispersed ion storage layer includes, but is not limited to, ethanol, isopropanol, xylene, toluene, ethyl acetate, acetic acid, acetone, and mixtures thereof.

[0084] In summary, the base material slurry can be a mixture of one or more materials formed by oxides or complexes of metal elements from Groups IIIB, IVB, VB, VIB, VIIB, VIII, IB, and IIB that can store ions during electrochemical reactions, and a solvent selected from ethanol, isopropanol, xylene, toluene, ethyl acetate, acetic acid, acetone, and mixtures thereof.

[0085] In electrochromic devices in related technologies, silver wires are often used as busbars 414 on the conductive layer 1. However, the dyne value of the silver wires is close to the surface tension of the electrochromic material solution and the ion storage solution. Therefore, the silver wires will repel the electrochromic material solution and the ion storage solution. So, directly coating the base material solution onto the conductive layer 1 with silver wires will result in uneven distribution of the base material near the silver wires.

[0086] Similarly, the same problem also occurs when some conductive materials with dyne values ​​close to the surface tension of the base material solution are used as busbars 414.

[0087] To address the issue of the busbar repelling the base material, some embodiments of this application employ the following technical solution: using a material with a high dyne value as the busbar 414. In this case, the base material solution can be directly applied to the bearing surface on one side of the busbar 414, or applied to both the bearing surface on one side of the busbar 414 and the busbar 414 itself. The busbar 414 will not repel the base material, thus ensuring a more uniform distribution of the base material.

[0088] Please refer to Figures 10 to 16 In some embodiments, the busbar assembly 2 includes a busbar layer 21 disposed on the bearing surface, and the difference between the dyne value of the busbar layer 21 and the surface tension of the slurry of the base material layer 3 is greater than 15 dyn / cm.

[0089] The base material layer 3 is disposed on the bearing surface and is located on at least one side of the busbar layer 21.

[0090] The base material layer 3 is at least located on one side of the busbar layer 21. Figure 10 and Figure 11 As shown: The base material layer 3 is located around the periphery of the busbar layer 21. The base material layer 3 may be disposed at least on one side of the busbar layer 21, or it may be... Figure 12 and Figure 13 As shown: The base material layer 3 is located on one side of the bus layer 21, near the center of the conductive layer 1. The base material layer 3 may be disposed at least on one side of the bus layer 21, or it may be... Figure 15 and Figure 16 As shown: The base material layer 3 is located around the conductive layer 1 of the bus layer 21, and the base material layer 3 also covers the entire surface of the bus layer 21. The base material layer 3 may be disposed at least on one side of the bus layer 21. Figure 14 As shown: the base material layer 3 is located on the periphery of the conductive layer 1 of the bus layer 21, and the base material layer 3 also covers part of the surface of the bus layer 21.

[0091] In some embodiments, the dyne value of the busbar layer 21 is 15 dyn / cm greater than the surface tension of the base material layer 3 slurry.

[0092] Optionally, the material of the bus layer 21 can be copper or gold.

[0093] Please refer to Figures 10 to 13 Specifically, the busbar layer 21 is completely exposed to the base material layer 3.

[0094] With the above configuration, the base material layer 3 is located only on one side of the busbar layer 21, or the base material layer 3 surrounds the periphery of the busbar layer 21. This reduces the amount of base material layer 3 used, thus saving costs.

[0095] Please refer to Figure 12 and Figure 13 The base material layer 3 is only set on one side of the busbar layer 21 near the center of the conductive layer 1. When spraying the base material, the base material slurry is only sprayed on the center of the conductive layer 1.

[0096] Since the busbar layer 21 is located at the edge of the electrochromic device after the substrate structure is combined into an electrochromic structure, and the central part of the electrochromic device is the visible area, the base material plays the role of color changing in the visible area. Therefore, it is only necessary to place the base material on the inner side of the busbar layer 21, that is, the central part of the conductive layer 1. This arrangement can reduce the amount of varnish layer 22 and base material layer 3 used, thereby saving costs.

[0097] However, it should be noted that this process of spraying the base material only in the center requires high spraying precision from the equipment. Therefore, the base material can be applied to the entire surface of the bearing surface, which can reduce the precision requirements of the spraying equipment.

[0098] Please refer to Figure 15 The base material layer 3 covers the entire surface of the busbar layer 21 that is away from the conductive layer 1.

[0099] In this embodiment, the base material layer 3 is sprayed onto the conductive layer 1 in one whole layer by spraying, which can make the base material layer 3 quickly and evenly coated on the bearing surface, thereby speeding up the production process.

[0100] In some embodiments of this application, such as Figure 14 As shown, the base material layer 3 covers part of the bus layer 21 and is located away from the surface of the conductive layer 1.

[0101] In this embodiment, the base material layer 3 can be sprayed onto the entire surface of the conductive layer 1 by spraying, and the base material can be wiped off at the parts where the bus layer 21 needs to be exposed.

[0102] Please refer to Figure 10 and Figure 11 In some embodiments, the base material layer 3 surrounds the outer periphery of the busbar layer 21.

[0103] In some large-scale production processes, it is necessary to place base materials around the busbar layer 21 to achieve a rapid and uniform conductivity effect. In this embodiment, the base material layer 3 can be sprayed onto the entire bearing surface of the conductive layer 1 by spraying, and then the base material on the busbar layer 21 can be wiped off by wiping.

[0104] Please refer to Figure 10 , Figure 12 and Figure 14 The bus layer 21 is fully or partially exposed, allowing the substrate structure to be used for electrical connection with other conductors, such as with an FPC (Flexible Printed Circuit), an external power supply, or with another substrate structure having an exposed bus layer 21 to create an electrochromic device with electrodes on one side.

[0105] For details, please refer to Figure 9 The two substrate structures are a first substrate structure and a second substrate structure, respectively. The steps for fabricating an electrochromic device with a lead-out electrode on one side are as follows: The first substrate structure can be cut into independent first conductive region 411 and second conductive region 412 using a cutting process. A busbar layer is provided on both the first conductive region 411 and the second conductive region 412. The first substrate structure and the second substrate structure are arranged opposite to each other, and the busbar layer on the first conductive region 411 is at least partially exposed. The exposed busbar layer on the first conductive region 411 and the exposed busbar layer in the second substrate structure are opposite to each other and electrically connected to form an electrochromic device. When connecting the electrodes of the electrochromic device, the busbar layer on the first conductive region 411 is connected to the positive electrode, and the busbar layer on the second conductive region 412 is connected to the negative electrode. Since a portion of the exposed busbar layer on the first substrate structure and the exposed busbar layer in the second substrate structure are opposite to each other and electrically connected, the conductive layer in the second substrate structure can be connected to the positive electrode. In the electrochromic device, the conductive layer in the second substrate structure is connected to the positive electrode, and the conductive layer in the second substrate structure is connected to the negative electrode. Both the positive and negative electrodes are located on the same side of the electrochromic device to achieve single-sided electrode connection.

[0106] Specifically, the steps for fabricating the substrate structure in this application embodiment can be as follows: first, attaching the bus layer 21 onto the conductive layer 1; then, disposing of the base material layer 3 on the conductive layer 1, with the base material layer 3 completely covering the bus layer 21, to obtain... Figure 15 The structure shown. Then, the base material layer 3 located on the busbar layer 21 is completely removed to obtain... Figure 10 The substrate structure shown is obtained by removing at least a portion of the base material layer 3 located on the busbar layer 21, resulting in the following: Figure 14 The substrate structure shown.

[0107] To address the aforementioned problem of silver wires repelling the base material, some embodiments of this application employ a technical solution of setting a varnish layer 22 with a large dyne value between the silver wire and the base material layer 3 to separate the silver wire and the base material layer 3, thereby reducing the repulsive effect of the silver wire on the base material. Furthermore, the varnish layer 22 has a large adhesion to the base material solution, allowing the base material to be distributed more evenly.

[0108] Please refer to Figures 1 to 8 In some embodiments, the busbar assembly 2 includes a busbar layer 21 and a varnish layer 22. The difference between the dyne value of the varnish layer 22 and the surface tension of the slurry of the base material layer 3 is greater than 15 dyn / cm. The varnish layer 22 is disposed between the busbar layer 21 and the base material layer 3.

[0109] By setting a varnish layer 22 between the busbar layer 21 and the base material layer 3, the varnish layer 22 separates the busbar layer 21 and the base material layer 3, avoiding direct contact between the base material layer 3 and the busbar layer 21. This prevents the surface of the busbar layer 21 from repelling the base material layer 3, which would cause unevenness of the base material near the surface of the busbar. This solves the technical problem in the prior art where unevenness of the base material near the surface of the busbar affects the optical performance of the device. It has the advantages of uniform distribution of the base material near the busbar layer 21 and does not affect the optical performance of the electrochromic device.

[0110] The inventors discovered through research that when materials with low dyne values, such as silver, are selected as the busbar layer 21, the adhesion between the base material layer 3 and the busbar layer 21 is weak, resulting in repulsion. This is mainly because the low dyne value of the busbar layer 21 causes it to repel the liquid base material before the base material slurry is cured, preventing the base material from adhering evenly to the surface of the conductive layer 1. Generally, the higher the dyne value of a solid, the greater its surface energy, and therefore the easier it is for the solid surface to accept liquid, resulting in better adhesion between the solid and liquid. In this application, a clear coat layer 22 is provided, which is equivalent to providing an intermediate adhesive layer between the base material layer 3 and the busbar layer 21. This intermediate adhesive layer can make adhesive contact with both the busbar layer 21 and the base material layer 3 without repulsion. Therefore, through this intermediate adhesive layer, the base material layer 3 and the busbar layer 21 can be evenly distributed without repulsion.

[0111] In some embodiments of this application, such as Figure 19 As shown, a bus layer 21 (silver wire) is set on the conductive layer 1. The black area in the figure shows that a transparent varnish (varnish layer 22) is applied to some of the bus layers 21 within the same conductive layer 1, while other parts of the bus layers 21 are left untreated, exposed to the varnish (varnish layer 22). Then, a transparent base material is sprayed onto the entire surface. It can be clearly seen that in the areas without varnish, the base material is repelled by the bus layers 21, resulting in uneven application. However, in the areas covered by the varnish layer 22, the base material adheres well to the conductive layer 1. Furthermore, as... Figure 20 As shown, a varnish layer 22 is provided around the outside of the busbar layer 21, meaning the varnish layer 22 does not cover the busbar layer 21. In this case, the base material can still adhere well to the conductive layer 1. Therefore, it can be seen that as long as a varnish layer 22 is provided around the outer periphery of the busbar layer 21, a uniform base material can be achieved.

[0112] It should be noted that the material of the varnish layer 22 is an insulating material, that is, the varnish layer 22 can prevent the bus layer 21 or the conductive layer 1 from being electrically connected to other conductors, such as to the FPC (Flexible Printed Circuit), external power supply, or to another substrate structure with exposed busbars.

[0113] Optionally, the material of the clear coat 22 includes, but is not limited to, epoxy acrylate resin, polyurethane acrylate resin, polyester acrylate resin, and mixtures thereof.

[0114] For example, the surface tension of a typical base material slurry is 33 dyn / cm, while the flow layer 21 is usually a silver layer with a dyn value of 36 dyn / cm. The dyn value of the flow layer 21 is 3 dyn / cm higher than the surface tension of the base material slurry. The small difference makes the surface of the flow layer 21 less receptive to the base material slurry, causing the base material to be repelled by the flow layer 21. Therefore, the base material near the flow layer 21 will be unevenly distributed. On the other hand, the dyn value of the varnish layer 22 is 72 dyn / cm. The dyn value of the varnish layer 22 is greater than both the surface tension of the base material slurry and the surface tension of the flow layer 21. This makes the surface of the varnish layer 22 more receptive to the base material slurry and the flow layer 21, thus connecting the flow layer 21 and the base material layer 3 and allowing the base material to be distributed more evenly.

[0115] In other embodiments, the repulsion between the base material and the busbar layer 21 may be due to the mutual repulsion of functional groups between the busbar layer 21 and the base material. In this case, it is necessary to add functional groups that combine with both to the varnish layer 22 so that the three can coexist and be evenly distributed. The embodiments in this application are only examples of some achievable methods, and the other embodiments within the scope of the principles of this application will not be described in detail.

[0116] In this embodiment, the process of fabricating the substrate structure is as follows: first, a bus layer 21 is disposed on the conductive layer 1; then, a varnish layer 22 is disposed on the conductive layer 1; and finally, a base material slurry is coated onto the conductive layer 1 to form the substrate structure. In this embodiment, the dyne value of the varnish layer 22 is 15 dyn / cm greater than the surface tension of the base material layer 3 slurry.

[0117] Please refer to Figure 3 and Figure 4 The varnish layer 22 is only set on the side of the busbar layer 21 near the center of the conductive layer 1. When spraying the base material, the base material slurry is only sprayed on the center of the conductive layer 1.

[0118] Since the busbar layer 21 is located at the edge of the electrochromic device after the substrate structure is combined into an electrochromic structure, and the central part of the electrochromic device is the visible area, the base material plays the role of color changing in the visible area. Therefore, it is only necessary to place the base material on the inner side of the busbar layer 21, that is, the central part of the conductive layer 1. This arrangement can reduce the amount of varnish layer 22 and base material layer 3 used, thereby saving costs.

[0119] However, it should be noted that this process of spraying the base material only in the center requires high spraying precision from the equipment. Therefore, the base material can be applied to the entire surface of the bearing surface, which can reduce the precision requirements of the spraying equipment.

[0120] In some embodiments of this application, such as Figure 5 and Figure 6 As shown, the base material layer 3 and / or the varnish layer 22 cover the entire surface of the busbar layer 21 away from the conductive layer 1.

[0121] In this embodiment, the base material layer 3 is sprayed onto the conductive layer 1 in one entire layer, which allows the base material layer 3 to be quickly and evenly coated on the bearing surface, thus accelerating the production speed. When spraying to the position corresponding to the busbar layer 21, the surface of the busbar layer 21 facing away from the conductive layer 1 is covered by the clear coat layer 22 without repelling the base material, further improving the uniformity of the base material.

[0122] In some embodiments of this application, such as Figure 7 and Figure 8 As shown, the base material layer 3 and / or the varnish layer 22 cover part of the surface of the busbar layer 21 that is away from the conductive layer 1.

[0123] In this embodiment, the base material layer 3 can be sprayed onto the entire surface of the conductive layer 1 by spraying. The base material and the clear coat layer 22 can then be wiped off at the locations where the busbar layer 21 needs to be exposed.

[0124] like Figure 8 As shown, the varnish layer 22 includes a first varnish portion 221 and a second varnish portion 222, and the flow-in-place layer 21 includes a first portion 211 and a second portion (the second portion is not shown in the figure because it is covered by the second varnish portion 222). The first portion 211 and the second portion are integrally formed; the second varnish portion 222 covers the second portion, and the first varnish portion 221 is spaced around the outer periphery of the flow-in-place layer 21.

[0125] In some embodiments of this application, the base material layer 3 includes a first functional part 31, which is disposed on the bearing surface and located on the side of the first varnish part 221 facing away from the busbar layer 21. After the substrate structure is assembled into an electrochromic device, the first functional part 31 plays a color-changing role and serves as the visible area of ​​the electrochromic device. The base material layer 3 also includes a second functional part 32 connected to the first functional part 31, which is disposed on the surface of the second varnish part 222 facing away from the busbar layer 21.

[0126] Please refer to Figure 6 , Figure 7 and Figure 8 In some embodiments, the second varnish portion 222 is located on the surface of the partial busbar layer 21 facing away from the conductive layer 1, and on the bearing surface, the second varnish portion 222 is also located on opposite sides of the busbar layer 21. That is, on a projection plane parallel to the bearing surface, the orthographic projection of the second portion is located within the orthographic projection of the second varnish portion 222, and the orthographic projection of the first portion 211 is located outside the orthographic projection of the second varnish portion 222, meaning the second portion is completely covered by the second varnish portion 222.

[0127] Please refer to Figure 6 Optionally, in the direction in which the condenser layer 21 and the first varnish portion 221 are spaced apart, the width of the second varnish portion 222 is (A) 1mm-2mm larger than the width of the condenser layer 21. Alternatively, in the direction in which the condenser layer 21 and the first varnish portion 221 are spaced apart, both sides of the second varnish portion 222 protrude from the condenser layer 21, and the width of each protrusion is (A) 1mm-2mm.

[0128] In some embodiments of this application, the base material layer 3 fully covers the entire surface, that is, the base material is disposed on the bearing surface, the first part 211 and the second part, and the varnish layer 22 is disposed on a portion of the bearing surface, the first part 211 and the second part (e.g. Figure 5 (As shown). In this production process, the conductive layer 1 can be directly sprayed onto its surface according to the manufacturing process. Where the busbar layer 21 needs to be exposed, the base material and clear coat layer 22 are then wiped away. For example, wiping away the base material and clear coat layer 22 on the first part 211 yields... Figure 7 The structure shown; for example, by wiping away the base material and varnish layer 22 on the first part 211 and the second part, as shown. Figure 1 The aforementioned structure.

[0129] Specifically, the steps for fabricating the substrate structure in this application embodiment can be as follows: first, attach the bus layer 21 onto the conductive layer 1; then, use a screen printing process to coat the varnish layer 22 onto the bus layer 21; then, place the base material layer 3 on the conductive layer 1, and ensure that the base material layer 3 completely covers the varnish layer 22, resulting in the following: Figure 6The substrate structure shown is one in which the busbar layer 21 is completely covered; or the base material layer 3 and the varnish layer 22 on the first part 211 are removed to obtain the following: Figure 8 The substrate structure shown has the busbar layer 21 partially exposed (the first part 211 exposed); or the base material layer 3 and varnish layer 22 on the first part 211 and the second part are removed to obtain the following: Figure 1 The busbar 21 shown is a substrate structure with the entire exposed surface.

[0130] Please refer to Figure 1 , Figure 5 and Figure 7 In some embodiments, on the bearing surface, the varnish layer 22 surrounds the outer periphery of the confluence layer 21.

[0131] By placing the varnish layer 22 on the outer periphery of the busbar layer 21, a base material can be placed on the outer periphery of the busbar layer 21. In some large-area production processes, when spraying the base material, a full-surface base material layer 3 can be sprayed onto the entire surface of the bearing surface, allowing the base material layer 3 to be quickly and evenly coated on the bearing surface, thereby accelerating production speed. Furthermore, base material needs to be placed around the busbar layer 21 to achieve a rapid and uniform conductivity effect.

[0132] In some embodiments of this application, Figure 6 As shown, the varnish layer 22 can cover the outer wall of the manifold layer 21. That is, the varnish layer 22 is attached to the manifold layer 21.

[0133] It should be noted that the varnish layer 22 is set on the conductive layer 1 by screen printing.

[0134] Specifically, after the busbar layer 21 is placed on the conductive layer 1, a varnish layer 22 is screen-printed on the conductive layer 1. Considering the alignment accuracy during screen printing, there will always be a certain distance between the first varnish section 221 and the busbar layer 21. However, the inventors have found that if the distance between the first varnish section 221 and the busbar layer 21 is too far, it will increase the unused area on the bearing surface, thus affecting the area of ​​the base material layer 3 and consequently affecting the visible area of ​​the electrochromic device. If the distance between the first varnish section 221 and the busbar layer 21 is too close, the accuracy requirements for screen printing will be relatively high.

[0135] Please refer to Figure 1 In some embodiments, the distance between the varnish layer 22 and the busbar layer 21 on the bearing surface is (B) 0.15mm-0.30mm.

[0136] In this embodiment, the distance between the varnish layer 22 and the flow layer 21 is controlled to be 0.15mm-0.30mm. While minimizing the vacant area on the bearing surface under the premise of reducing the screen printing accuracy requirements as much as possible, it does not affect the uniformity and adhesion of the first varnish part 221.

[0137] Please refer to Figure 1 and Figure 3 On the bearing surface, the distance between the varnish layer 22 and the flow-collecting layer 21 refers to the distance between the edges of the first varnish section 221 and the flow-collecting layer 21 that are close to each other.

[0138] Please refer to Figure 2 In some embodiments, the width (C) of the varnish layer 22 extending toward the confluence layer 21 or toward the base material layer 3 on the bearing surface is 0.1 mm to 0.2 mm.

[0139] Please refer to Figure 1 and Figure 3 On the bearing surface, the width of the varnish layer 22 extending toward the flow-in-flow layer 21 or the width of the varnish layer 22 extending toward the base material layer 3 refers to the width of the first varnish portion 221 extending toward the flow-in-flow layer 21 or the width of the first varnish portion 221 extending toward the base material layer 3.

[0140] Specifically, the varnish layer 22 is set on the conductive layer 1 by screen printing.

[0141] It should be noted that, considering the precision issues of screen printing, and considering that if the width of the varnish layer 22 on the bearing surface is too small, it will reduce the spacing between the busbar layer 21 and the base material layer 3, thus failing to provide an effective separation function, while if the width of the first varnish section 221 is too large, it will reduce the installation area of ​​the base material, thereby affecting the visible area of ​​the electrochromic device. In this embodiment, the width of the first varnish section 221 is controlled between 0.1mm and 0.2mm. This ensures that the first varnish section 221 has a separating function while minimizing the area occupied by the first varnish section 221, and also keeps the precision requirements within the range that the screen printing process can meet.

[0142] In some embodiments, the thickness of the varnish layer 22 extending in the direction away from the conductive layer 1 is greater than or equal to the thickness of the busbar layer 21 extending in the direction away from the conductive layer 1.

[0143] Please refer to Figure 1 and Figure 3 With the above settings, when the base material slurry is applied, the first varnish section 221 can restrict the base material slurry to prevent it from passing through the first varnish section 221 and contacting the flow layer 21, thereby avoiding the base material from being repelled and making the base material more evenly distributed.

[0144] Please refer to Figure 2 Optionally, the thickness (E) of the bus layer 21 extending in the direction away from the conductive layer 1 is 4um-7um, and / or the thickness (F) of the varnish layer 22 extending in the direction away from the conductive layer 1 is 4um-7um.

[0145] Specifically, the thickness of the flow-integrating layer 21 is 4 μm, and the thickness of the varnish layer 22 is 6 μm. The coating thickness of the base material slurry is 5 μm-15 μm, and the thickness of the base material layer 3 formed after the base material slurry cures is less than 1 μm. This prevents the base material slurry from crossing the first varnish layer 221 and contacting the flow-integrating layer 21, thereby avoiding repulsion of the base material and ensuring a more uniform distribution of the base material.

[0146] Please refer to Figure 1 and Figure 3 The busbar 21 is disposed along the edge of the conductive layer 1, occupying part of the edge, and is disposed in a shape similar to part of the edge of the conductive layer 1. For example, in a quadrilateral structure, the busbar 21 includes a first busbar portion parallel to the X direction and a second busbar portion parallel to the Y direction. The first varnish portion 221 includes a first varnish portion parallel to the X direction and a second varnish portion parallel to the Y direction.

[0147] Of course, in other embodiments, if the electrochromic device is circular, elliptical or other irregular in shape, the bus layer 21 is disposed along the edge of the conductive layer 1 to conduct current to the edge portion of the conductive layer 1, thereby playing the role of rapidly conducting current.

[0148] The substrate structure is described below with reference to an embodiment. The surface tension of the base material slurry is 33 dyn / cm, the dyn value of the conductive layer 1 is 56 dyn / cm, the dyn value of the varnish layer 22 is 72 dyn / cm, and the dyn value of the busbar layer 21 is 36 dyn / cm.

[0149] Specifically, the dyne value is one of the methods for evaluating the wettability of a solid surface, which helps implementers select appropriate materials for the busbar layer and the clear coat layer 22 when actually producing the substrate structure.

[0150] It should be noted that the contact angle is also one of the methods to evaluate the wettability of a solid surface. When it is inconvenient to test the dyne value of the busbar layer 21 and the varnish layer 22, the appropriate materials for the busbar layer 21 and the varnish layer 22 can be selected by comparing the contact angles of the base material solution relative to the busbar layer 21, the varnish layer 22 or the conductive layer 1.

[0151] Specifically, the contact angles of the base material solution relative to the busbar layer, the base material solution relative to the varnish layer 22, and the base material solution relative to the conductive layer 1 are all less than 15°.

[0152] To achieve the above objectives, the technical solution adopted in the second aspect of this application is: an electrochromic device 4, comprising an electro-optic dielectric layer 62 and two substrate structures as described in the first aspect of the embodiment.

[0153] The two substrate structures are a first substrate structure and a second substrate structure. The base material layer 3 (first base material layer 61) in the first substrate structure is one of an electrochromic layer and an ion storage layer, and the base material layer 3 (second base material layer 63) in the second substrate structure is the other of an electrochromic layer and an ion storage layer. The first substrate structure and the second substrate structure are arranged opposite to each other, and the electro-optic dielectric layer 62 is located between the first substrate structure and the second substrate structure.

[0154] By applying the substrate structure of the first aspect embodiment described above to an electrochromic device, and by providing a varnish layer 22 between the busbar layer 21 and the base material layer 3, the varnish layer 22 separates the busbar layer 21 and the base material layer 3, preventing the liquid in the base material layer 3 from directly contacting the busbar layer 21. This avoids the surface of the busbar layer 21 repelling the liquid in the base material layer 3, which would lead to unevenness of the base material near the surface of the busbar layer 21. This solves the technical problem in the prior art where unevenness of the base material near the surface of the busbar layer affects the optical performance of the device. It has the advantage of uniform distribution of the base material near the busbar layer 21 without affecting the optical performance of the electrochromic device.

[0155] In some embodiments, at least a portion of the conductive layer 1 in the first substrate structure is exposed to the base material layer 3 of the first substrate structure to form a first conductive region 413; at least a portion of the conductive layer 1 in the second substrate structure is exposed to the base material layer 3 of the second substrate structure to form a second conductive region 43; the first conductive region 413 and the second conductive region 43 are opposite to each other and electrically connected.

[0156] like Figure 9 As shown, through the above arrangement, the first conductive region 413 and the second conductive region 43 are opposite to each other and electrically connected, thus electrically connecting the conductive layers 1 in the two substrate structures. Therefore, by dividing the conductive layer 1 in the first substrate structure into a first conductive region 411 and a second conductive region 412 that are mutually insulated, with the first conductive region 411 electrically connected to the first conductive region 413, and then arranging the lead-out electrode on the same side of the first conductive region 411 and the second conductive region 412, a single-sided lead-out electrode can be achieved, eliminating the need for separate lead-outs on both sides. This solves the technical problem of needing separate lead-outs on both sides in the prior art, and has advantages such as simplifying the electrical connection method of electrochromic devices and facilitating production and simplifying the production process.

[0157] Please refer to Figure 9Specifically, the first substrate structure includes a first conductive layer 41 (same as conductive layer 1 in the first aspect embodiment), a first conductive region 413, and a bus bar 414 (same as bus bar 21 in the first aspect embodiment). The first conductive layer 41 is divided into a first conductive region 411 and a second conductive region 412 by laser etching lines. The first conductive region 413 is disposed on the first conductive region 411, and the bus bar 414 is disposed on the second conductive region 412. The second substrate structure includes a second conductive layer 42 (same as conductive layer 1 in the first aspect embodiment) and a second conductive region 43.

[0158] The electrochromic device includes an edge portion and a central portion. Correspondingly, the edge portion of the electrochromic device corresponds to the edge portion of the conductive layer 1, and the central portion of the electrochromic device corresponds to the central portion of the conductive layer 1. The second conductive region 43 is disposed on the edge portion of the second conductive layer 42, and the first conductive region 411 is disposed on the edge portion of the first conductive layer 41. The second conductive region 43 and the first conductive region 413 are opposite to and electrically connected. In this way, it is only necessary to connect the first conductive region 411 and the second conductive region 412 of the first conductive layer 41 to the positive electrode and the negative electrode respectively to achieve single-sided lead-out.

[0159] Please refer to Figure 9 In some embodiments, the orthographic projection of the first conductive region 413 onto the conductive layer 1 at least partially overlaps with the orthographic projection of the second conductive region 43 onto the conductive layer 1. This allows the first conductive region 413 and the second conductive region 43 to contact each other, thereby achieving electrical connection between the first conductive region 413 and the second conductive region 43.

[0160] In some embodiments, the electrochromic device further includes a conductive layer 5, which is located between the first conductive region 413 and the second conductive region 43, and is electrically connected to the first conductive region 413 and the second conductive region 43 respectively.

[0161] With the above configuration, the first conductive area 413 and the second conductive area 43 are electrically connected through the conductive layer 5.

[0162] Please refer to Figure 17 In some embodiments, the conductive layer 5 includes conductive particles 51, the particle size (D) of which is equal to or less than the distance (H) between the first conductive region 413 and the second conductive region 43.

[0163] In some embodiments, H < D - 2um, or H < D / 2.

[0164] Please refer to Figure 17In some embodiments, the conductive layer 5 and the electro-optic dielectric layer 62 can be integrally cured from an electro-optic dielectric solution mixed with conductive particles 51. Therefore, in this embodiment, in order to prevent the base material layers 3 in the two substrate structures from short-circuiting, the distance (L) between the base material layers 3 in the two substrate structures is greater than the particle size (D) of the conductive particles 51, that is, the thickness of the electro-optic dielectric layer 62 is greater than the particle size (D) of the conductive particles 51.

[0165] In some embodiments, L≥2D, or L≥D+2um.

[0166] In some embodiments, the value of D ranges from 7um to 100um.

[0167] Please refer to Figure 17 In some embodiments, the electrochromic device is provided with a conductive groove 7, which penetrates the second conductive layer 42, the second base material layer 63 and the electro-optic dielectric layer 62. The first conductive area 413 can be electrically connected to one of the positive and negative terminals of the external power supply through the conductive groove 7, and the second conductive area 412 can be electrically connected to one of the positive and negative terminals of the external power supply through the conductive groove 7.

[0168] With the above configuration, the first conductive region 411 and the second conductive region 412 are mutually insulated, and the first conductive region 411 and the second conductive layer are electrically connected through the conductive layer 5. Therefore, the lead-out electrodes can be arranged on the same side of the first conductive region 411 and the second conductive region 412, without the need for separate leads on both sides. This solves the technical problem of needing separate leads on both sides in the prior art, and has advantages such as simplifying the electrical connection method of electrochromic devices and facilitating production and simplifying the production process.

[0169] Please refer to Figure 17 In some embodiments, the electrochromic device further includes a sealing member 8, which has a sealing groove that extends at least through the second conductive layer 42. The sealing member 8 is housed in the sealing groove and cooperates with the first conductive layer 41 to seal the edge of the entire electrochromic device.

[0170] With the above settings, the seal 8 can seal part of the first base material layer 61, the electro-optic dielectric layer 62, and the second base material layer 63, preventing moisture from entering the first base material layer 61, the electro-optic dielectric layer 62, and the second base material layer 63, thus affecting the service life of the electrochromic device.

[0171] In some embodiments, the sealing groove is an annular groove, and the orthographic projection of the conductive groove 7 on the first conductive layer 41 is located outside the outer contour of the orthographic projection of the sealing groove on the first conductive layer 41.

[0172] With the above configuration, the seal 8 has an annular structure, and a portion of the first base material layer 61, the electro-optic dielectric layer 62, and the second base material layer 63 are confined between the seal 8, the first conductive layer 41, and the second conductive layer 42 to enhance the seal.

[0173] Specifically, the sealing groove extends through the second conductive layer 42, the second base material layer 63, the electro-optic dielectric layer 62, and the first base material layer 61 to enhance the sealing effect of the electrochromic device. Furthermore, the conductive layer 5 is located inside the seal 8.

[0174] In some embodiments, the electrochromic device further includes a first lead-out structure and a second lead-out structure; the first lead-out structure is electrically connected to the first conductive region 411 and is used to be electrically connected to one of the positive and negative terminals of an external power source; the second lead-out structure is electrically connected to the second conductive region 412 and is used to be electrically connected to the other of the positive and negative terminals of an external power source.

[0175] By setting out the lead-out structure, it is convenient to electrically connect the first conductive region 411 and the second conductive region 412 in the first conductive layer 41 to the positive and negative terminals of an external power supply. Especially in Figure 10 In the embodiment shown, the first conductive region 411 and the second conductive region 412 are both located inside the conductive groove 7, and the positive and negative terminals of the external power supply are not easily inserted into the conductive groove 7 to connect with the first conductive region 411 and the second conductive region 412.

[0176] It should be noted that the first lead-out structure and the second lead-out structure can be separate components. In this embodiment, the first lead-out structure and the second lead-out structure can be two independent FPCs.

[0177] However, since the electrochromic device of this application embodiment can lead out electrodes on one side, the first lead structure and the second lead structure can be disposed on the same surface of the same carrier plate (such as a circuit board). Specifically, the conductive ends of the first lead structure and the second lead structure are disposed on the same surface of the same carrier plate, so as to facilitate the removal of the first lead structure and the second lead structure from the positive and negative terminals of the external power supply. Moreover, the conductive ends of the first lead structure and the second lead structure face the same surface and can be directly bonded to the first conductive area 411 and the second conductive area 412, simplifying the manufacturing process of the electrochromic device of this application embodiment.

[0178] To achieve the above objectives, the technical solution adopted in the third aspect of this application is: an electrochromic device, including a substrate and the electrochromic device 4 of the second aspect embodiment, wherein the substrate is disposed on the side of the first substrate structure opposite to the second substrate structure, and / or the substrate is disposed on the side of the second substrate structure opposite to the first substrate structure.

[0179] By applying the electrochromic device 4 of the second aspect embodiment to the electrochromic device, all the advantages of the electrochromic device are obtained, and the electrochromic device has a better color-changing effect.

[0180] To achieve the above objectives, the technical solution adopted in the fourth aspect of this application is: a terminal product, including the electrochromic device 4 of the second aspect embodiment or the electrochromic device of the third aspect embodiment, wherein the terminal product includes any one of a rearview mirror, a curtain wall, a car sunroof, a car side window, a car windshield, a housing of an electronic product, glasses, a vehicle, and a display panel.

[0181] By applying the electrochromic device 4 of the second aspect embodiment or the electrochromic device of the third aspect embodiment to the end product, all the advantages of the electrochromic device are obtained, and the end product has a better color-changing effect.

[0182] Please refer to Figure 17 and Figure 18 To achieve the above objectives, the technical solution adopted in the fifth aspect embodiment of this application is: a method for manufacturing an electrochromic device, providing a first conductive layer 41;

[0183] A first busbar assembly 2a is formed on the first conductive layer 41;

[0184] A first base material layer 61 is disposed on the first conductive layer 41 and on at least one side of the first busbar assembly 2a to form a first substrate structure; wherein, the difference between the dyne value of the surface of the first busbar assembly 2a near the first base material layer 61 and the surface tension of the slurry of the first base material layer 61 is greater than 15 dyn / cm.

[0185] Provide a second conductive layer 42;

[0186] A second busbar assembly 2b is formed on the second conductive layer 42;

[0187] A second base material layer 63 is disposed on the second conductive layer 42 and on at least one side of the second busbar assembly 2b to form a second base structure; wherein the difference between the dyne value of the surface of the second busbar assembly 2b near the second base material layer 63 and the surface tension of the slurry of the second base material layer 63 is greater than 15 dyn / cm.

[0188] The first base material layer 61 and the second base material layer 63 are positioned opposite each other;

[0189] An electro-optic dielectric layer 62 is disposed between the second base material layer 63 and the second base material layer 63.

[0190] Since the difference between the dyne value of the surface of the first busbar component 2a near the first base material layer 61 and the surface tension of the slurry of the first base material layer 61 is greater than 15 dyn / cm, the first base material layer 61 can be distributed relatively evenly around the first busbar component 2a. Similarly, since the difference between the dyne value of the surface of the second busbar component 2b near the second base material layer 63 and the surface tension of the slurry of the second base material layer 63 is greater than 15 dyn / cm, the second base material layer 63 can be distributed relatively evenly around the second return component. Therefore, the electrochromic device has good optical performance.

[0191] It should be noted that the provision of a first base material layer 61 on the first conductive layer 41 and on at least one side of the first busbar assembly 2a means that the first base material layer 61 is provided on the first conductive layer 41 and the first base material layer 61 does not cover the first busbar assembly 2a, or the first base material layer 61 covers part of the first busbar assembly 2a, or the first base material layer 61 completely covers the first busbar assembly 2a.

[0192] It should be noted that the provision of a second base material layer 63 on the second conductive layer 42 and on at least one side of the second busbar assembly 2b means that the second base material layer 63 is provided on the second conductive layer 42 and the second base material layer 63 does not cover the second busbar assembly 2b, or the second base material layer 63 covers part of the second busbar assembly 2b, or the second base material layer 63 completely covers the second busbar assembly 2b.

[0193] In some embodiments, the first busbar assembly 2a may include only a busbar layer whose dyne value differs from the surface tension of the base material layer slurry by more than 15 dyn / cm, and the second busbar assembly 2b may include only a busbar layer whose dyne value is 15 dyn / cm greater than the surface tension of the base material layer slurry.

[0194] In the above embodiments, forming a first busbar assembly 2a on the first conductive layer 41 includes: providing a busbar layer on the first conductive layer 41, wherein the difference between the dyne value of the busbar layer near the surface of the first base material layer 61 and the surface tension of the slurry of the first base material layer 61 is greater than 15 dyn / cm. Forming a second busbar assembly 2b on the second conductive layer 42 includes: providing a busbar layer on the second conductive layer 42, wherein the difference between the dyne value of the busbar layer near the surface of the second base material layer 63 and the surface tension of the slurry of the second base material layer 63 is greater than 15 dyn / cm.

[0195] In some embodiments, the first busbar assembly 2a may include a varnish layer and a busbar layer whose dyne value differs from the surface tension of the first base material layer 61 slurry by less than 15 dyn / cm, and the second busbar assembly 2b may include a varnish layer and a busbar layer whose dyne value is 15 dyn / cm greater than the surface tension of the second base material layer 63 slurry.

[0196] In the above embodiment, a first busbar assembly 2a is formed on the first conductive layer 41, including:

[0197] A first bus layer is disposed on the first conductive layer 41.

[0198] A first varnish layer is provided on the first conductive layer 41 and at least on one side of the first busbar layer.

[0199] In the above embodiments, a first base material layer 61 is provided on the first conductive layer 41 and on at least one side of the first busbar assembly 2a, including:

[0200] A first base material layer 61 is disposed on the surface of the first conductive layer 41, and the first base material layer 61 covers the surface of the first varnish layer that is away from the first busbar layer.

[0201] In the above embodiment, a second busbar assembly 2b is formed on the second conductive layer 42, including:

[0202] A second bus layer is disposed on the second conductive layer 42.

[0203] A second varnish layer is provided on the second conductive layer 42 and at least on one side of the second busbar layer.

[0204] In the above embodiments, a second base material layer 63 is provided on the second conductive layer 42 and on at least one side of the second busbar assembly 2b, including:

[0205] A second base material layer 63 is disposed on the surface of the second conductive layer 42, and the second base material layer 63 covers the surface of the second varnish layer that is away from the second busbar layer.

[0206] It should be noted that, in some embodiments, the provision of a first varnish layer on the first conductive layer 41 and at least on one side of the first bus layer means that the first varnish layer is disposed on the first conductive layer 41, but does not cover the first bus layer. That is, the surfaces of the first bus layer facing away from the first conductive layer 41 are not covered, and the surfaces of the first bus layer facing away from the first conductive layer 41 form a first conductive region 413. Similarly, the provision of a second varnish layer on the second conductive layer 42 and at least on one side of the second bus layer means that the second varnish layer is disposed on the second conductive layer 42, but does not cover the second bus layer. The surfaces of the second bus layer facing away from the second conductive layer 42 are not covered, and the surfaces of the second bus layer facing away from the second conductive layer 42 form a second conductive region 43.

[0207] It should be noted that, in some embodiments, providing a first varnish layer on the first conductive layer 41 and at least on one side of the first bus layer means that the first varnish layer is provided on both the first conductive layer 41 and the portion of the first bus layer facing away from the first conductive layer 41, and the surface of the first conductive layer 41 not covered by the first varnish layer forms a first conductive region 411. Providing a second varnish layer on the second conductive layer 42 and at least on one side of the second bus layer means that the second varnish layer is provided on both the second conductive layer 42 and the portion of the second bus layer facing away from the second conductive layer 42, and the surface of the second conductive layer 42 not covered by the second varnish layer forms a second conductive region 412.

[0208] It should be noted that, in some embodiments, providing a first varnish layer on the first conductive layer 41 and at least on one side of the first bus layer means that the first varnish layer is provided on both the first conductive layer 41 and the surface of the first bus layer facing away from the first conductive layer 41. Providing a second varnish layer on the second conductive layer 42 and at least on one side of the second bus layer means that the second varnish layer is provided on both the second conductive layer 42 and the surface of the second bus layer facing away from the second conductive layer 42.

[0209] In the above embodiments, the method for manufacturing the electrochromic device further includes:

[0210] The first varnish layer and the first base material layer 61 on at least a portion of the surface of the first bus layer away from the first conductive layer 41 are removed to form a first conductive surface on the first bus layer.

[0211] The second varnish layer and the second base material layer 63 are removed from at least a portion of the surface of the second bus layer away from the second conductive layer 42 to form a second conductive surface on the second bus layer.

[0212] It should be noted that when the first substrate structure has a first conductive area 413 and the second substrate structure has a second conductive area 43, the first conductive area 413 and the second conductive area 43 can be positioned opposite each other and electrically connected. This allows the electrochromic device to achieve single-sided electrode output by dividing the first conductive layer 41 in the first substrate structure into mutually insulated first conductive areas 411 and second conductive areas 412, electrically connecting the first conductive area 411 to the first conductive area 413, and then arranging lead-out electrodes on the same side of the first conductive area 411 and the second conductive area 412. This eliminates the need for separate lead-out electrodes on both sides. This solves the technical problem of requiring separate lead-out electrodes on both sides in the prior art, and has advantages such as simplifying the electrical connection method of the electrochromic device and facilitating production processes.

[0213] Therefore, in some embodiments, the method for manufacturing the electrochromic device further includes:

[0214] The first conductive surface and the second conductive surface are placed opposite each other.

[0215] The first conductive surface and the second conductive surface are electrically connected.

[0216] In some embodiments, electrically connecting the first conductive surface and the second conductive surface includes:

[0217] A conductive layer 5 is provided between the first conductive surface and the second conductive surface.

[0218] It should be noted that the electro-optic dielectric layer 62 is disposed between the second base material layer 63 and the second base material layer 63, and the conductive layer 5 is disposed between the first conductive surface and the second conductive surface, which can be carried out simultaneously. Specifically, the first substrate structure and the second substrate structure are placed opposite each other, and then an electro-optic dielectric solution mixed with conductive particles 51 is disposed on the first substrate structure and the second substrate structure. After the electro-optic dielectric solution cures, the electro-optic dielectric layer 62 is formed between the second base material layer 63 and the second base material layer 63, and the conductive layer 5 is formed between the first conductive surface and the second conductive surface.

[0219] In the above embodiment, the distance (H) between the first conductive region 413 and the second conductive region 43 is controlled to be equal to or less than the particle size (D) of the conductive particle 51.

[0220] Alternatively, H < D - 2um, or H < D / 2.

[0221] Furthermore, in the above embodiments, the distance (L) between the first base material layer 61 and the second base layer is controlled to be greater than the particle size (D) of the conductive particles 51, that is, the thickness of the electro-optic dielectric layer is greater than the particle size (D) of the conductive particles 51.

[0222] Optional, L≥2D, or L≥D+2um.

[0223] In some embodiments, the value of D ranges from 7um to 100um.

[0224] In some embodiments, the method for manufacturing an electrochromic device further includes:

[0225] The first conductive layer 41 is divided into a first conductive region 411 and a second conductive region 412 that are mutually insulated, and the first busbar assembly 2a is disposed on the first conductive region 411.

[0226] A through-slot 7 is provided so that the first conductive area 413 can be electrically connected to one of the positive and negative terminals of an external power source via the through-slot 7, and the second conductive area 412 can be electrically connected to one of the positive and negative terminals of an external power source via the through-slot 7.

[0227] With the above configuration, the first conductive region 411 and the second conductive region 412 are mutually insulated, and the first conductive region 411 and the second conductive layer are electrically connected through the conductive layer 5. Therefore, the lead-out electrodes can be arranged on the same side of the first conductive region 411 and the second conductive region 412, without the need for separate leads on both sides. This solves the technical problem of needing separate leads on both sides in the prior art, and has advantages such as simplifying the electrical connection method of electrochromic devices and facilitating production and simplifying the production process.

[0228] In some embodiments, the method for manufacturing an electrochromic device further includes:

[0229] A sealing groove is formed, which penetrates at least the second conductive layer 42;

[0230] A sealing element 8 is installed inside the sealing groove.

[0231] The seal 8 can seal part of the first base material layer 61, the electro-optic dielectric layer 62, and the second base material layer 63 to prevent moisture from entering the first base material, the electro-optic dielectric layer 62, and the second base material layer 63.

[0232] Specifically, the sealing groove extends through the second conductive layer 42, the second base material layer 63, the electro-optic dielectric layer 62, and the first base material layer 61 to enhance the sealing effect of the electrochromic device.

[0233] It should be noted that there is no specific order in which the sealing groove and the conductive groove 7 are opened.

[0234] In some embodiments, the sealing groove is an annular groove, and the orthographic projection of the conductive groove 7 on the first conductive layer 41 is located outside the outer contour of the orthographic projection of the sealing groove on the first conductive layer 41.

[0235] With the above configuration, the seal 8 has an annular structure, and a portion of the first base material layer 61, the electro-optic dielectric layer 62, and the second base material layer 63 are confined between the seal 8, the first conductive layer 41, and the second conductive layer 42, thereby enhancing the sealing effect of the electrochromic device.

[0236] In some embodiments, the method for manufacturing an electrochromic device further includes:

[0237] Provide an outgoing component, which includes a first outgoing structure and a second outgoing structure.

[0238] The first lead-out structure is electrically connected to the first conductive area 413 via the conductive groove 7.

[0239] The second lead-out structure is electrically connected to the second conductive area 412 via the conductive groove 7.

[0240] By setting out the lead-out components, it is convenient to connect the first conductive area 413 and the second conductive area 412 in the first conductive layer 41 to the positive and negative terminals of the external power supply.

[0241] It should be noted that the first lead-out structure and the second lead-out structure can be set up separately.

[0242] However, since the electrochromic device of this application embodiment can lead out electrodes on one side, the first lead-out structure and the second lead-out structure can be disposed on the same surface of the same carrier plate, so as to facilitate the removal of the positive and negative terminals of the first lead-out structure and the second lead-out structure from the external power supply, thereby simplifying the electrical connection method of the electrochromic device of this application embodiment.

[0243] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A substrate structure, characterized in that, include: The conductive layer has a bearing surface; The busbar assembly is disposed on the bearing surface; A base material layer is disposed on the bearing surface and is located on at least one side of the busbar assembly. The base material layer is one of an electrochromic layer and an ion storage layer. The flow assembly includes a flow layer and a varnish layer. The varnish layer is disposed between the flow layer and the base material layer. The difference between the dyne value of the varnish layer and the surface tension of the slurry in the base material layer is greater than 15 dyn / cm.

2. The substrate structure according to claim 1, characterized in that, The base material layer and / or the varnish layer cover a portion of the surface of the busbar layer that is away from the conductive layer.

3. The substrate structure according to claim 2, characterized in that, The varnish layer includes a first varnish portion and a second varnish portion, and the confluence layer includes a first portion and a second portion; the second varnish portion covers the second portion, and the first varnish portion is spaced around the outer periphery of the confluence layer.

4. The substrate structure according to claim 1, characterized in that, On the bearing surface, the varnish layer surrounds the outer periphery of the confluence layer.

5. The substrate structure according to claim 1, characterized in that, On the bearing surface, the width of the varnish layer extending toward the confluence layer or the width of the varnish layer extending toward the base material layer is 0.1mm-0.2mm.

6. The substrate structure according to claim 1, characterized in that, On the bearing surface, the distance between the varnish layer and the flow-through layer is 0.15mm-0.30mm.

7. The substrate structure according to any one of claims 1 to 6, characterized in that, The thickness of the varnish layer extending away from the conductive layer is greater than or equal to the thickness of the busbar layer extending away from the conductive layer.

8. The substrate structure according to claim 7, characterized in that, The thickness of the bus layer extending away from the conductive layer is 4um-7um, and / or the thickness of the varnish layer extending away from the conductive layer is 4um-7um.

9. The substrate structure according to any one of claims 1 to 6, characterized in that, The dyne value of the varnish layer is 15 dyn / cm greater than the surface tension of the base material layer slurry.

10. An electrochromic device, characterized in that, Includes an electro-optic dielectric layer and a substrate structure according to any one of claims 1 to 9; The two substrate structures are a first substrate structure and a second substrate structure, wherein the base material layer in the first substrate structure is one of an electrochromic layer and an ion storage layer, and the base material layer in the second substrate structure is the other of the electrochromic layer and the ion storage layer. The first substrate structure and the second substrate structure are disposed opposite to each other, and the electro-optic dielectric layer is located between the first substrate structure and the second substrate structure.

11. An electrochromic device, characterized in that, Includes a substrate and the electrochromic device as described in claim 10; The substrate is disposed on the side of the first substrate structure opposite to the second substrate structure, and / or the substrate is disposed on the side of the second substrate structure opposite to the first substrate structure.

12. A terminal product, characterized in that, Includes the electrochromic device of claim 10 or the electrochromic apparatus of claim 11, wherein the end product includes any one of a rearview mirror, curtain wall, car sunroof, car side window, car windshield, electronic product housing, glasses, vehicle, and display panel.

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