An automatic monitoring and control device for polishing liquid concentration and a control method

Abstract

This application relates to the field of optical component polishing, and provides an automatic monitoring and control device and control method for polishing liquid concentration, which are used in a liquid supply device. The device includes: a polishing liquid turbidity probe for detecting the turbidity of the polishing liquid contained in the liquid supply device; a PH detection probe for detecting the PH value of the polishing liquid in the liquid supply device; a water injection structure for injecting water into the liquid supply device; and a main controller electrically connected to the polishing liquid turbidity probe, the PH detection probe, and the water injection structure respectively. The main controller controls the water injection structure to adjust the water injection according to the turbidity of the polishing liquid detected by the polishing liquid turbidity probe, so that the turbidity of the polishing liquid detected by the polishing liquid turbidity probe reaches a preset turbidity. At the same time, the main controller controls the replacement of the polishing liquid according to the PH value of the polishing liquid detected by the PH detection probe reaching a preset PH value. This solves the problems in the prior art that during the recycling of the polishing liquid, the control of the polishing liquid is based on manual experience, resulting in inconsistent standards and poor consistency of polishing quality.

Description

Technical Field

[0001] The present application relates to the technical field of optical component polishing, and more specifically, to an automatic monitoring and control device for polishing liquid concentration and a control method therefor. Background Art

[0002] In the cold processing of optical components, polishing is usually used. During the polishing process, polishing liquid is required for assistance, and the polishing liquid is recycled through a liquid supply device to save costs and reduce waste. During the recycling process of the polishing liquid, the turbidity and pH value of the polishing liquid have a direct impact on the polishing quality of optical components as the main indicators. Turbidity refers to the degree of obstruction to the transmission of light by suspended substances in water; due to the presence of trace amounts of insoluble suspended substances and colloidal substances in water, the measurement unit used in the ISO standard is FTU (turbidity unit), and FTU is the same as NTU (turbidity measurement unit). When the concentration of the polishing liquid is high, it is easy to cause precipitation and scaling, resulting in waste of polishing materials. The crystalline particles will also affect the surface finish (scratches) of the polished optical components and block the circulation pipeline at the same time; when the concentration of the polishing liquid is low, the polishing efficiency is low, and the polished optical components are prone to surface finish (scratches). The polishing material mainly contains cerium oxide, which is a metal oxide. Therefore, the pH value of the polishing liquid is slightly alkaline. The level of alkalinity of the pH value determines how many polishing particles that have come off the optical components have entered the polishing liquid. When a certain pH value is reached, the grinding property of the polishing material in the polishing liquid causes the polishing particles that have come off the optical components to lose their polishing ability after mixing. Therefore, controlling the pH value of the polishing liquid can effectively control the polishing efficiency of the polishing liquid and the replacement cycle of the polishing material.

[0003] In the existing cold processing of optical components, the mixing concentration of the polishing liquid during the circulating polishing process is manually controlled by the staff according to experience. This not only requires high experience from the staff, but also the manual operation standards are not unified, resulting in poor uniformity of polishing quality. Moreover, during the circulating polishing process, there is no standard for the replacement cycle of the polishing liquid, and it is judged by human experience, which also leads to non-uniform standards and poor consistency of polishing quality.

[0004] Therefore, the existing technology still needs to be improved and developed. Summary of the Invention

[0005] The purpose of the present application is to provide an automatic monitoring and control device for polishing liquid concentration and a control method therefor, which solves the problems of non-uniform standards and poor consistency of polishing quality caused by manual experience control of the polishing liquid during the recycling process of the existing technology.

[0006] To achieve the above purpose, the technical solution adopted by the present application is:

[0007] On the one hand, the present application provides an automatic monitoring and control device for polishing liquid concentration, which is used for a liquid supply device. Among them, the automatic monitoring and control device for polishing liquid concentration includes: a polishing liquid turbidity probe, which is used to detect the turbidity of the polishing liquid contained in the liquid supply device;

[0008] a PH detection probe, which is used to detect the PH value of the polishing liquid in the liquid supply device;

[0009] a water injection structure, which is used to inject water into the liquid supply device;

[0010] a main controller, which is electrically connected to the polishing liquid turbidity probe, the PH detection probe and the water injection structure respectively;

[0011] The main controller controls the water injection structure to adjust the water injection according to the turbidity of the polishing liquid detected by the polishing liquid turbidity probe, so that the turbidity of the polishing liquid detected by the polishing liquid turbidity probe reaches a preset turbidity. At the same time, the main controller controls the replacement of the polishing liquid according to the PH value of the polishing liquid detected by the PH detection probe reaching a preset PH value.

[0012] In an optional embodiment, the automatic monitoring and control device for polishing liquid concentration further includes: an output polishing liquid turbidity probe, which is electrically connected to the main controller and is used to detect the turbidity of the polishing liquid output from the liquid outlet of the liquid supply device;

[0013] The main controller adjusts the polishing liquid in the liquid supply device according to the comparison result of the turbidity of the polishing liquid detected by the polishing liquid turbidity probe and the turbidity of the polishing liquid detected by the output polishing liquid turbidity probe.

[0014] In an optional embodiment, the water injection structure includes: a water injection pipe, and the water injection pipe extends into the liquid supply device;

[0015] a concentration adjustment valve, which is arranged on the water injection pipe and is electrically connected to the main controller. The concentration adjustment valve controls the water injection volume of the water injection pipe through the control of the main controller;

[0016] An injection nozzle is arranged on the water injection pipe, and the injection nozzle is used to spray water towards the polishing liquid turbidity probe.

[0017] In an optional embodiment, the automatic monitoring and control device for polishing liquid concentration further includes: a temperature sensor, which is used to detect the temperature of the polishing liquid in the liquid supply device;

[0018] a heat exchanger, which is arranged at the liquid outlet of the liquid supply device and is electrically connected to the main controller;

[0019] a temperature adjustment valve, which is connected to the heat exchanger and is electrically connected to the main controller;

[0020] The main controller controls the temperature adjustment valve according to the temperature detected by the temperature sensor so that the heat exchanger adjusts the temperature of the polishing liquid.

[0021] In an optional embodiment, the automatic monitoring and control device for polishing liquid concentration further includes: a liquid stirring member, which is arranged in the liquid supply device, electrically connected to the main controller, and used to make the polishing liquid move;

[0022] Or / and

[0023] The main controller is electrically connected with a wireless communication module, and the wireless communication module is used for remote data communication with the outside.

[0024] On the other hand, the present application proposes an automatic monitoring and control method for polishing liquid concentration, which is applied to the automatic monitoring and control device for polishing liquid concentration as described above. The method includes the steps:

[0025] Detect the current turbidity of the polishing liquid in the liquid supply device through a polishing liquid turbidity probe;

[0026] Compare the current turbidity of the polishing liquid with the preset turbidity, and obtain a concentration adjustment instruction according to the comparison result;

[0027] According to the concentration adjustment instruction, control the water injection structure to inject water into the liquid supply device, so that the turbidity of the polishing liquid detected by the polishing liquid turbidity probe reaches the preset turbidity;

[0028] Detect the current pH value of the polishing liquid through a pH detection probe;

[0029] Compare the current pH value with the preset pH value, and obtain a polishing liquid replacement instruction according to the comparison result;

[0030] According to the polishing liquid replacement instruction, send out a polishing liquid reminder message to replace the polishing liquid.

[0031] In an optional embodiment, before the step of detecting the current turbidity of the polishing liquid in the liquid supply device through a polishing liquid turbidity probe, the following steps are further included:

[0032] Turn on the polishing liquid turbidity probe, and calibrate the 0NTU position of the polishing liquid turbidity probe with a standard solution;

[0033] Based on the temperature in the use environment state, test the deviation result of the polishing liquid turbidity probe, and correct the polishing liquid turbidity probe according to the deviation result.

[0034] In an optional embodiment, the step of testing the deviation result of the polishing liquid turbidity probe based on the temperature in the use environment state and correcting the polishing liquid turbidity probe according to the deviation result includes:

[0035] Measure and record the temperature value T of the current calibration solution under the use environment state 测试 , measure and record the output voltage U of the polishing liquid turbidity probe 测试 ;

[0036] The measured temperature value T 测试 Through the turbidity correction formula, the voltage difference ΔU caused by the temperature difference is calculated, where ΔU = -0.0192x(T 测试 - 25°C);

[0037] According to the measured output voltage U in the standard solution 测试 and the voltage difference ΔU, the standard voltage value U of the standard solution is calculated 25℃ , where U 25℃ = U 测试 - ΔU;

[0038] According to the standard voltage value U 25℃ , the correction constant K1 is calculated, where K1 = 865.68xU 25℃ ;

[0039] Substitute the calculated correction constant K1 into the standard curve formula to obtain the correction formula TU, where TU = -865.68xU + K1, and U is the voltage value sampled by the turbidity probe under the current operating environment temperature.

[0040] In an alternative embodiment, after the step of sending a polishing fluid reminder message to replace the polishing fluid according to the polishing fluid replacement instruction, the steps further include:

[0041] According to the type of polishing material, preset pH values and preset turbidities are matched through an AI algorithm, where the AI algorithm adjusts the preset turbidities and preset pH values of the same polishing material according to the replacement cycle of the cutting fluid and the polishing effect, and uses the updated preset pH values and updated preset turbidities corresponding to different polishing materials as the matched preset pH values and matched preset turbidities.

[0042] In an alternative embodiment, after the step of sending a polishing fluid reminder message to replace the polishing fluid according to the polishing fluid replacement instruction, it further includes:

[0043] The polishing fluid turbidity of the polishing fluid is monitored in real time through a polishing fluid turbidity probe, and a concentration-time curve graph is formed according to the results of the real-time monitoring;

[0044] The pH value of the circulating polishing fluid is monitored in real time through a pH detection probe, and a polishing fluid replacement cycle table is formed;

[0045] Transmit the concentration-time curve graph and the polishing fluid replacement cycle table to an external terminal for real-time display and monitoring.

[0046] The beneficial effects of an automatic monitoring and control device for polishing liquid concentration and a control method provided by this application are at least as follows: Through the main controller, automatic control is carried out on the turbidity probe of the polishing liquid, the PH detection probe, and the water injection structure. According to the turbidity of the polishing liquid detected by the turbidity probe of the polishing liquid, the water injection structure is controlled to adjust the water injection, so that the turbidity of the polishing liquid detected by the turbidity probe of the polishing liquid reaches the preset turbidity. At the same time, when the PH value of the polishing liquid detected by the PH detection probe reaches the preset PH value, the main controller controls the replacement of the polishing liquid, so that the mixing concentration and replacement cycle of the polishing liquid in the circulating polishing process are realized with standardized intelligent control, so that the control of the polishing liquid adopts a unified standard. Workers can ensure the stability of the polishing effect during the circulation of the polishing liquid without rich experience, which is convenient for realizing standardized management. While reducing the experience requirements of workers, the consistency of product quality is good. At the same time, the effective utilization rate of polishing materials can be improved, the waste of rare polishing materials can be effectively controlled, the recycling time of the polishing liquid is long, the impact on the environment is reduced, and resources are saved. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] In order to more clearly illustrate the technical solutions in the embodiments of this application, the following will briefly introduce the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings in the following description are only some embodiments of this application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0048] Figure 1 It is a schematic diagram of the principle of the main structure of an automatic monitoring and control device for polishing liquid concentration provided by an embodiment of this application;

[0049] Figure 2 It is a schematic diagram of the detailed structure principle of an automatic monitoring and control device for polishing liquid concentration provided by an embodiment of this application;

[0050] Figure 3 It is a schematic diagram of the principle of another structure of an automatic monitoring and control device for polishing liquid concentration provided by an embodiment of this application;

[0051] Figure 4 It is a circuit principle block diagram of an automatic monitoring and control device for polishing liquid concentration provided by an embodiment of this application;

[0052] Figure 5 It is a flowchart of the main steps of an automatic monitoring and control method for polishing liquid concentration provided by an embodiment of this application;

[0053] Figure 6 It is a specific flowchart of step S200 of an automatic monitoring and control method for polishing liquid concentration provided by an embodiment of this application;

[0054] Figure 7 It is a graph showing the relationship between turbidity and electrical signal;

[0055] Figure 8 It is a graph showing the relationship between output voltage, temperature and turbidity.

[0056] Among them, each reference numeral in the figure:

[0057] 10. Liquid supply equipment; 11. Cover plate; 12. Water pump device; 13. Return hole; 14. Liquid outlet; 20. Polishing liquid turbidity probe; 21. First AD conversion module; 22. Reflection turbidity sensing module; 23. Reflection probe; 30. Output polishing liquid turbidity probe; 31. Second AD conversion module; 32. Transmission turbidity sensing module; 33. Transmission probe; 40. PH detection probe; 50. Water injection structure; 51. Concentration adjustment valve; 52. Concentration adjustment control module; 53. Water injection pipe; 54. Water injection nozzle; 55. Stirring water pipe; 56. Stirring water nozzle; 60. Temperature sensor; 61. Heat exchanger; 62. Temperature adjustment valve; 63. Temperature adjustment control module; 70. Main controller; 71. Touch screen AI control module; 80. Liquid stirring part; 90. Wireless communication module. Detailed implementation mode

[0058] In order to make the technical problems, technical solutions and beneficial effects to be solved by this application clearer, the following further elaborates on this application in combination with the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not used to limit this application.

[0059] It should be noted that when a component is referred to as "fixed to" or "disposed on" another component, it can be directly or indirectly located on that other component. When a component is referred to as "connected to" another component, it can be directly or indirectly connected to that other component. The orientations or positions indicated by the terms "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientations or positions shown in the drawings, and are only for convenience of description and cannot be construed as a limitation to the technical solution of this application. The terms "first" and "second" are only used for the purpose of convenient description and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of technical features. The meaning of "a plurality" is two or more, unless otherwise specifically defined.

[0060] Embodiment 1

[0061] Such as Figure 1 、 Figure 4As shown in the figure, this embodiment proposes an automatic monitoring and control device for the concentration of polishing liquid, which is used for the liquid supply device 10. For example, the external dimensions of the liquid supply device 10 can be an overall box-shaped structure of 800x500x400mm. The upper cover of the liquid supply device 10 is a detachable splash-proof cover plate 11, and there are turbidity probe holes, PH probe holes, water pump installation holes, return holes 13, and water injection holes on the cover plate 11. The water pump installation hole is used to install the water pump device 12. Through the water pump device 12, the polishing liquid in the liquid supply device 10 is pumped out and used during the polishing process, and then flows back into the liquid supply device 10 through the return hole 13, so that the polishing liquid can be recycled, thereby realizing the function of circular polishing. The automatic monitoring and control device for the concentration of polishing liquid mainly includes: a polishing liquid turbidity probe 20, a PH detection probe 40, a water injection structure 50, and a main controller 70. The polishing liquid turbidity probe 20 passes through the turbidity probe hole on the cover plate 11 and is installed on the cover plate 11, and is used to detect the turbidity of the polishing liquid contained in the liquid supply device 10. The polishing liquid turbidity probe 20 can adopt a reflection type on-line monitoring probe for the turbidity of the polishing liquid. The water injection structure 50 passes through the water injection hole on the cover plate 11 and is installed on the cover plate 11, and is used to inject water into the liquid supply device 10. The main controller 70 is electrically connected to the polishing liquid turbidity probe 20 and the water injection structure 50, and controls the polishing liquid turbidity probe 20 and the water injection structure 50 to adjust the turbidity. Due to the evaporation of the water in the polishing liquid during the circular polishing process, the concentration of the polishing liquid increases. Therefore, the main controller 70 controls the water injection structure 50 to perform water injection adjustment according to the turbidity of the polishing liquid detected by the polishing liquid turbidity probe 20, so that the turbidity of the polishing liquid detected by the polishing liquid turbidity probe 20 reaches the preset turbidity. Thus, through automatic water injection adjustment, the concentration of the polishing liquid can be ensured to be constant. The PH detection probe 40 passes through the PH probe hole on the cover plate 11 and is installed on the cover plate 11, and is used to detect the PH value of the polishing liquid in the liquid supply device 10. The main controller 70 is electrically connected to the PH detection probe 40, and the main controller 70 controls the replacement of the polishing liquid according to the PH value of the polishing liquid detected by the PH detection probe 40 reaching the preset PH value. Therefore, through the automatic monitoring and control device for the concentration of polishing liquid, on-line monitoring of the turbidity of the polishing liquid can be realized, the concentration of the circular polishing liquid can be controlled to be constant, and then through the detection of the PH value of the polishing liquid, the replacement cycle of the polishing liquid can be controlled.

[0062] As Figure 1 , Figure 4As shown, the automatic monitoring and control device for the concentration of the polishing liquid automatically controls the polishing liquid turbidity probe 20, the PH detection probe 40, and the water injection structure 50 through the main controller 70, so as to realize the standardized intelligent control of the mixing concentration and replacement cycle of the polishing liquid in the circulating polishing process, so that the control of the polishing liquid forms a unified standard. Workers can reuse the same standard without rich experience to ensure the stability of the polishing effect during the circulation of the polishing liquid, which is convenient for realizing standardized management. While reducing the experience requirements of workers, it makes the consistency of product quality good. At the same time, it can improve the effective utilization rate of polishing materials, effectively control the waste of rare polishing materials, make the circulation time of the polishing liquid long, reduce the impact on the environment, and save resources. Thus, it solves the problems of waste of polishing materials caused by manual operation skills and poor replicability of the polishing liquid control standard. It enables workers to simply copy the control standard of the polishing liquid to achieve efficient operation during the polishing process, making the polishing quality more stable and reliable.

[0063] As Figure 2 , Figure 4 shown, further, the automatic monitoring and control device for the concentration of the polishing liquid further includes: an output polishing liquid turbidity probe 30, and the output polishing liquid turbidity probe 30 is installed at the liquid outlet 14 of the water pump device 12. The output polishing liquid turbidity probe 30 adopts a transmissive turbidity on-line monitoring probe, which can directly penetrate the polishing liquid output from the liquid outlet 14, so as to obtain the turbidity of the polishing liquid at the liquid outlet 14. The main controller 70 adjusts the polishing liquid in the liquid supply device 10 according to the comparison result of the turbidity of the polishing liquid detected by the polishing liquid turbidity probe 20 and the turbidity of the polishing liquid detected by the output polishing liquid turbidity probe 30; the specific process is to compare the values of the turbidity of the polishing liquid detected by the polishing liquid turbidity probe 20 and the turbidity of the polishing liquid detected by the output polishing liquid turbidity probe 30; due to the effect of particle precipitation in the polishing liquid, the turbidity of the precipitated liquid drawn out from the liquid outlet 14 is relatively small, so that the turbidity of the polishing liquid detected by the light liquid turbidity probe is greater than the turbidity of the polishing liquid during polishing use, which will lead to inaccurate control of the turbidity of the polishing liquid during the polishing process, thus affecting the polishing quality and quantity accuracy. In this embodiment, the detection results of the two turbidity probes are compared. When the comparison difference exceeds the threshold value, the difference in turbidity will not affect the polishing quality. Therefore, the main controller 70 stirs the polishing liquid in the liquid supply device 10 or reminds the operator to handle it.

[0064] As Figure 1 , Figure 2As shown, further, the polishing liquid turbidity probe 20 extending into the liquid supply device 10 is fixed on the cover plate 11 through a quick-release seat, which facilitates the quick disassembly, cleaning, and installation of the polishing liquid turbidity probe 20. Since the polishing liquid turbidity probe 20 is easily soiled by the splashing polishing liquid in the liquid supply device 10. Therefore, the polishing liquid turbidity probe 20 needs to be disassembled and cleaned frequently. Using the quick-release seat can efficiently maintain the probe.

[0065] As Figure 1 , Figure 4 shown, further, the water injection structure 50 specifically includes: a water injection pipe 53 and a concentration adjustment valve 51. The water injection pipe 53 extends into the liquid supply device 10. The concentration adjustment valve 51 is arranged on the water injection pipe 53 and is electrically connected to the main controller 70. The concentration adjustment valve 51 controls the water injection volume of the water injection pipe 53 through the control of the main controller 70. When the concentration detected by the polishing liquid turbidity probe 20 increases due to water evaporation or an increase in polishing material and exceeds the predetermined value, the main controller 70 issues a control instruction to control the concentration adjustment valve 51 to open, so that the water injection pipe 53 injects water into the liquid supply device 10, reducing the polishing liquid concentration to reach the standard. Thus, automatic adjustment of the polishing liquid concentration is achieved.

[0066] As Figure 1 , Figure 2 shown, further, a water injection nozzle 54 is arranged on the water injection pipe 53. The water injection nozzle 54 is used to spray water towards the polishing liquid turbidity probe 20. The water injection nozzle 54 is arranged at the bottom of the water injection pipe 53 and is set obliquely upward. The water injection nozzle 54 sprays water towards the polishing liquid turbidity probe 20 during the water replenishment process, thereby cleaning the polishing liquid turbidity probe 20. Automatic cleaning of the polishing liquid turbidity probe 20 is achieved while replenishing water, ensuring the continuous normal use of the polishing liquid turbidity probe 20 without being contaminated by the polishing liquid and making the concentration measurement more accurate.

[0067] As Figure 3 shown, in another structure, a water stirring nozzle 56 is further arranged at the bottom of the water injection pipe 53 and is directed towards the bottom of the liquid supply device 10. During normal water injection, the precipitated polishing liquid is sprayed by the water stirring nozzle 56, so that the polishing liquid below is stirred by the impact force of the water stirring nozzle 56, making the polishing liquid concentration more uniform. In a specific structure, a water stirring pipe 55 is further connected to the bottom of the water injection pipe 53. The water stirring pipe 55 is arranged in a circle at the bottom. A plurality of water stirring nozzles 56 are opened on the water stirring pipe 55, and the water stirring nozzles 56 are all obliquely arranged and spray water towards the inner wall of the liquid supply device 10. The inner wall reflects the water flow sprayed by the water stirring nozzles 56, thereby generating turbulent flows in different directions in the liquid supply device 10, with higher stirring efficiency. In addition, by adjusting the opening degree of the concentration adjustment valve 51 by the main controller 70, the water flow rate of the water stirring nozzles 56 can be controlled, thereby controlling the intensity of the stirring.

[0068] As Figure 2 , Figure 4 shown, further, the automatic monitoring and control device for polishing liquid concentration further includes: a temperature sensor 60, a heat exchanger 61, and a temperature regulating valve 62. The temperature sensor 60 is used to detect the temperature of the polishing liquid in the liquid supply device 10; the heat exchanger 61 is arranged at the liquid outlet 14 of the liquid supply device 10 and is electrically connected to the main controller 70; the temperature regulating valve 62 is connected to the heat exchanger 61 and is electrically connected to the main controller 70; the main controller 70 controls the temperature regulating valve 62 according to the temperature detected by the temperature sensor 60 so that the heat exchanger 61 adjusts the temperature of the polishing liquid. In this way, the intelligent control of the temperature of the polishing liquid is realized, and the use temperature of the polishing liquid is also within a constant range, thereby ensuring the polishing stability and greatly improving the polishing quality of precision optical parts. The temperature sensor 60, the heat exchanger 61, and the temperature regulating valve 62 realize the adjustable constant temperature control of the polishing liquid, can solve the problem of the deformation of the rubber plate caused by the rise of the polishing liquid temperature during high-speed polishing, and solve the problems of uncontrollable aperture and difficult control of the rubber plate surface shape during the polishing process of optical parts at high temperature, improve the utilization efficiency of the rubber plate, and increase the applicable range of the rubber plate.

[0069] In addition, the temperature sensor 60 can also detect the temperature of the polishing liquid and perform temperature deviation correction on the turbidity probe 20 of the polishing liquid based on the detected temperature. Thus, the turbidity detection is more accurate.

[0070] As Figure 4 shown, in the specific circuit connection structure: the main controller 70 adopts a touch screen AI control module 71, which can realize the AI control and data display functions. The polishing liquid turbidity probe 20 includes a first AD conversion module 21, a reflection turbidity sensing module 22, and a reflection probe 23; the reflection probe 23 is electrically connected to the reflection turbidity sensing module 22, the reflection turbidity sensing module 22 is electrically connected to the first AD conversion module 21, and the first AD conversion module 21 is electrically connected to the touch screen AI control module 71. The output polishing liquid turbidity probe 30 includes a second AD conversion module 31, a transmission turbidity sensing module 32, and a transmission probe 33; the transmission probe 33 is electrically connected to the transmission turbidity sensing module 32, the transmission turbidity sensing module 32 is electrically connected to the second AD conversion module 31, and the second AD conversion module 31 is electrically connected to the touch screen AI control module 71. The concentration regulating valve 51 is electrically connected to the touch screen AI control module 71 through a concentration regulating control module 52. The PH detection probe 40 is electrically connected to the touch screen AI control module 71. The temperature sensor 60 is electrically connected to the touch screen AI control module 71; the temperature regulating valve 62 is electrically connected to the touch screen AI control module 71 through a temperature regulating control module 63.

[0071] In the above circuit, the turbidity of the polishing liquid is monitored by the touch screen AI control module 71, enabling real-time online monitoring of the mixing concentration of the polishing liquid. Through AI data monitoring and recording, a concentration curve is formed to trace the causes affecting the polishing quality, with high control precision and avoiding waste of polishing materials caused by poor concentration control. High-precision online monitoring of the pH value of the circulating polishing liquid is achieved, enabling accurate determination of the polishing liquid replacement cycle.

[0072] As Figure 2 , Figure 4 shown, further, the automatic monitoring and control device for the polishing liquid concentration further includes: a liquid stirring member 80, which is arranged in the liquid supply device 10, electrically connected to the main controller 70, and is used to move the polishing liquid. In addition to the stirring effect added by the above-mentioned water injection pipe 53, active stirring can also be performed by the stirring member. By comparing the detection results of the polishing liquid turbidity detected by the polishing liquid turbidity probe 20 and the polishing liquid turbidity detected by the output polishing liquid turbidity probe 30, when the comparison difference exceeds the threshold, the main controller 70 controls the liquid stirring member 80 to start, causing the polishing liquid to be fully mixed, thereby making the concentration more uniform. The stirring member can adopt an ultrasonic generator. By starting the ultrasonic generator through the main controller 70, the high-frequency vibration of the released ultrasonic waves generates intense convergence and dispersion effects in the polishing liquid, thereby breaking the surface tension of the liquid, forming tiny bubbles and droplets, and then generating micro-flow and mixing. Additionally, in the case of needing to replenish water, water is sprayed through the water stirring nozzle 56. By combining the ejected water flow with the ultrasonic waves, the water flow can be stirred under the action of the water stirring nozzle 56, and then through the oscillation of the ultrasonic waves, the stirring effect is better and the stirring efficiency is high.

[0073] As Figure 2 , Figure 4 shown, further, the main controller 70 is also connected to a wireless communication module 90, which is used for remote data communication with the outside. For example, it can be wirelessly connected to a mobile terminal such as a mobile phone through Bluetooth or WIFI, thereby realizing a remote monitoring mode. The circulating polishing parameters processed by the main controller 70 can be directly obtained from the mobile phone APP side, providing real-time online monitoring for research and development, production, and management, enabling managers to grasp the usage status information of the polishing liquid in real time, and thus effectively guiding production.

[0074] This automatic monitoring and control device for polishing liquid concentration maintains the best performance of polishing liquid concentration, temperature, and replacement cycle through on-line monitoring of the turbidity, temperature, and pH value of the polishing liquid, improves processing efficiency and quality, ensures good product replication efficiency and process reproducibility, simplifies the operation of the polishing liquid for employees, only requiring operators to be able to use a weighing scale, computer, and mobile phone, with low skill requirements. It simplifies the processing efficiency and product transformation of optical parts products, and the standardization makes personnel replication simple. At the same time, it reduces the energy consumption of polishing materials and indirectly saves energy.

[0075] Embodiment 2

[0076] This embodiment proposes an automatic monitoring and control method for polishing liquid concentration, which is applied to the automatic monitoring and control device for polishing liquid concentration as described above.

[0077] As Figure 5 shown, the specific method includes the steps:

[0078] S010. Equipment startup operation.

[0079] Turn on the main power switch of the equipment to power on the equipment. Power on the main controller (touch screen AI control module), power on each sensor, and power on each control module to control each control valve and complete self-check, then enter the standby mode.

[0080] In the first control operation, perform the first ratio of the polishing liquid. Due to individual differences of the turbidity sensor, ambient light, or lack of temperature compensation, etc., for obtaining a more accurate turbidity value, calibration is performed before measurement. Taking the turbidity probe as an example, the measurement range is 0 - 100000 NTU. Turbidity is the degree of obstruction that suspended substances in water cause to the transmission of light. Suspended substances and colloids such as soil, dust, fine organic matter, zooplankton, and other microorganisms in water can make the water show turbidity. The transmission method uses a beam of light to pass through a certain thickness of the water sample to be measured and measures the attenuation of the transmitted light intensity caused by the absorption and scattering of the suspended particles in the water sample to the incident light to determine the turbidity of the water sample to be measured. The working principle of the polishing liquid turbidity probe is: in the transmission method, the change of the transmitted light intensity with turbidity follows the Lambert-Beer law, that is, the transmitted light decays exponentially with the increase of turbidity:

[0081] I = gI 0 e -KtL (1)

[0082] In the formula: I is the transmitted light intensity at turbidity t, g is the geometric parameter of the measuring instrument, I 0 is the incident light intensity, K is the proportionality constant, t is the turbidity, and L is the depth of the sample passing through.

[0083] The electrical signal obtained under the linear conversion condition of the photoelectric measurement of the turbidity meter is:

[0084] S = jI = gjI 0 e -KtL (2)

[0085] In the above formula, S is the electrical signal corresponding to the measured turbidity, and j is a constant determined by the measurement circuit parameters.

[0086] Performing a logarithmic transformation on formula (2) gives:

[0087] InS = C - KtL (3)

[0088] In the formula, C is a constant. It can be seen from formula (3) that the logarithm of the obtained electrical signal has a linear relationship with the corresponding turbidity.

[0089] From Figure 7 in (a), it can be seen that the linear relationship is good in the range of t from 0 to 1000 FTU. When t > 1000 FTU, the relationship between t and S gradually becomes non - linear. From Figure 7 the S - t curve of the transmission method in (b), it can be seen that when t is between 4000 FTU and 30000 FTU, it still shows a decaying non - linear relationship. Thus, it can be known that the turbidity measurement range of the transmission method can be from 0 to 30000 FTU, or even higher. According to actual experiments, it can be measured up to 100,000 FTU.

[0090] Therefore, the specific steps of the calibration process for the polishing liquid turbidity probe are as follows:

[0091] Step S100: Turn on the polishing liquid turbidity probe and calibrate the 0 NTU position of the polishing liquid turbidity probe with a standard solution. The standard solution can be pure water or distilled water close to 0 NTU.

[0092] Step S200: Based on the temperature in the usage environment state, test the deviation result of the polishing liquid turbidity probe and correct the polishing liquid turbidity probe according to the deviation result.

[0093] After performing temperature correction on the polishing liquid turbidity probe, the influence of temperature on turbidity during the measurement process can be excluded, so that the detection data of the polishing liquid turbidity probe is more accurate.

[0094] As Figure 6 shown, the specific process of step S200 includes the following steps:

[0095] Step S210: Measure and record the current temperature value T of the calibration solution in the usage environment state 测试 , measure and record the output voltage U of the polishing liquid turbidity probe 测试 .

[0096] As Figure 8 shown by the curve relationship between the output voltage and temperature in (a), as Figure 8The relationship curve between turbidity and voltage shown in (b) of the figure. In the environment where the sensor is used, errors caused by the intensity of light can be avoided, there are fewer interference factors in the calibration process, and the detection accuracy of the probe is improved.

[0097] Step S220: Take the measured temperature value T 测试 Through the turbidity correction formula, calculate the voltage difference ΔU caused by the temperature difference, where ΔU = -0.0192x(T 测试 - 25°C).

[0098] Step S230: According to the measured output voltage Utest and the voltage difference ΔU in the standard solution, calculate the standard voltage value U of the standard solution 25℃ , where U 25℃ = U 测试 - ΔU.

[0099] Step S240: According to the standard voltage value U 25℃ , calculate the correction constant K1, where K1 = 865.68xU 25℃ .

[0100] Step S250: Substitute the calculated correction constant K1 into the standard curve formula to obtain the correction formula TU, where TU = -865.68xU + K1, U is the voltage value sampled by the turbidity probe at the current usage environment temperature, and the result is automatically calculated by the device internally according to the corrected voltage value and presented as the current turbidity on the display terminal.

[0101] During the first measurement process of the probe, calibrate the turbidity probe according to the above method. For the calibration of the pH probe, it is calibrated by measuring the pH standard solution. After the calibration is completed, perform the following proportioning operations.

[0102] Weigh the polishing material according to the concentration ratio and put it into the device. The main controller starts and controls the concentration adjustment valve to automatically replenish water through the water injection pipe. When the water pump device starts, the water pump device starts to operate, stir the polishing liquid, and the turbidity probe of the polishing liquid detects the concentration in the liquid supply device and the concentration in the circulation system. After the concentration is normal, the system prompts that polishing can be carried out.

[0103] As Figure 5 shown, Step S300: Detect the current turbidity of the polishing liquid in the liquid supply device through the turbidity probe of the polishing liquid.

[0104] Step S310: Compare the current turbidity of the polishing liquid with the preset turbidity and obtain the concentration adjustment instruction according to the comparison result.

[0105] Step S320: According to the concentration adjustment instruction, control the water injection structure to inject water into the liquid supply device so that the turbidity of the polishing liquid detected by the turbidity probe of the polishing liquid reaches the preset turbidity.

[0106] During the polishing process, the polishing liquid is recycled. The current turbidity of the polishing liquid is compared with the preset turbidity. If the current turbidity of the polishing liquid is greater than the preset turbidity, then the main controller issues a concentration adjustment instruction to control the start of the concentration adjustment valve, so that the water injection pipe injects water into the liquid supply device, thereby reducing the concentration of the polishing liquid. If the current turbidity of the polishing liquid is less than the lowest preset turbidity, an alarm is issued to enable the operator to promptly prepare the polishing liquid.

[0107] Step S400: Detect the current pH value of the polishing liquid through a pH detection probe.

[0108] Step S410: Compare the current pH value with the preset pH value, and obtain a polishing liquid replacement instruction according to the comparison result.

[0109] Step S420: According to the polishing liquid replacement instruction, issue a polishing liquid reminder message to replace the polishing liquid.

[0110] During the process of recycling the polishing liquid, the current pH value is compared with the preset pH value. If the current pH value exceeds the preset pH value, then the main controller issues a polishing liquid replacement instruction and issues an alarm to enable the operator to promptly replace the polishing liquid. By monitoring the pH value of the polishing liquid, after the pH value reaches the replacement condition, the system automatically prompts a polishing material replacement reminder. Thus, after the polishing liquid is recycled, the polishing liquid with reduced or ineffective polishing performance can be promptly replaced, avoiding the disadvantages of low actual utilization rate of the polishing material and long personnel learning cycle due to inaccurate timing control by humans.

[0111] Step S500: According to the type of polishing material, match the preset pH value and preset turbidity through an AI algorithm. The AI algorithm adjusts and updates the preset turbidity and preset pH value of the same polishing material according to the replacement cycle and polishing effect of the cutting fluid, and uses the updated preset pH value and updated preset turbidity corresponding to different polishing materials as the preset pH value and preset turbidity to be matched.

[0112] During the normal polishing process, polishing parameters such as the concentration of the polishing liquid, the polishing material, and the temperature of the polishing liquid are associated in the touch screen AI control module. And during the polishing process, record the polishing parameters that perform better in terms of polishing quality as new preset polishing parameters (such as preset turbidity value, preset pH value, preset temperature value). Thus, the polishing parameters can be adjusted and updated. When the adjusted preset polishing parameters are used for polishing, the optical parts have better polishing quality.

[0113] Therefore, this device applies on-line turbidity monitoring to control the constant concentration during the polishing liquid circulation process. Then, by detecting the pH value of the polishing liquid, the replacement cycle of the polishing liquid is controlled to achieve a more intelligent polishing production control. To achieve intuitive and convenient monitoring, this embodiment specifically further includes the following steps:

[0114] Step S600: Detect the turbidity of the polishing liquid in real time through a polishing liquid turbidity probe, and form a concentration-time curve graph according to the results of the real-time monitoring.

[0115] Step S610: Real-time monitor the pH value of the circulating polishing liquid through a pH detection probe, and form a polishing liquid replacement cycle table. The pH detection probe measures the acidity and alkalinity of the polishing liquid, and the measured detection data is recorded in real time. The sampling period can be adjusted manually.

[0116] Step S620: Transmit the concentration-time curve graph and the polishing liquid replacement cycle table to an external terminal for real-time display and monitoring.

[0117] During the polishing process, start the circulation control, concentration control, temperature control, and pH value control, so that the main controller automatically records and monitors data through the AI algorithm. When the main controller detects abnormal or excessive data, it will automatically adjust and adjust the polishing liquid concentration and temperature to a reasonable state. If extreme monitoring data appears, it will alarm. The main controller has a remote monitoring function through the AI algorithm. By remotely obtaining the circulating polishing parameters from the mobile APP, it can provide real-time on-line monitoring for research and development, production, and management, enabling managers to effectively guide production.

[0118] In summary, a polishing liquid concentration automatic monitoring and control device and a control method proposed in this application use the turbidity of the polishing liquid as the control index for the concentration of the circulating polishing liquid. The accurate detection of turbidity ensures the stability of the polishing liquid concentration, avoiding the problem of mismatch between the polishing liquid concentration and the rubber plate and optical materials during the polishing process, thereby improving the polishing efficiency. It realizes adjustable constant temperature control, solves the problems of rubber plate deformation, uncontrollable aperture, and difficult control of the rubber plate surface shape caused by the increase in the temperature of the polishing liquid during high-speed polishing, thereby improving the utilization efficiency of the rubber plate and expanding the applicable range of the rubber plate. By matching the relationship between the pH value of the polishing liquid and the replacement cycle of the polishing liquid, operators can grasp the replacement cycle of the polishing material by monitoring the change of the pH value, achieving precise control, reducing the consumption of polishing materials, and being environmentally friendly. Using digital AI control technology, it adapts and optimizes the matching of the circulating polishing liquid and the material grade, reducing the labor cost and improving the labor efficiency.

[0119] The above are only the preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent replacements, and improvements made within the spirit and principles of this application shall be included within the protection scope of this application.

Claims

1. A polishing liquid concentration automatic monitoring and control device, used in the liquid supply equipment during the cold processing of optical parts, characterized in that: The upper cover of the liquid supply device is a detachable splash-proof cover plate, and the cover plate is provided with a turbidity probe hole, a PH probe hole, a water pump installation hole, a reflux hole and a water injection hole. The water pump installation hole is used to install a water pump device, through which the polishing liquid in the liquid supply device is pumped out and returned to the liquid supply device through the reflux hole after being used in the polishing process; the polishing liquid concentration automatic monitoring and control device comprises: A polishing liquid turbidity probe, which passes through the turbidity probe hole and is installed on the cover plate, and is used to detect the turbidity of the polishing liquid contained in the liquid supply device; A pH detection probe, passing through the pH probe hole and mounted on the cover plate, for detecting the pH value of the polishing liquid in the liquid supply device; A water injection structure is provided through the water injection hole and is installed on the cover plate, and is used to inject water into the liquid supply device; the water injection structure includes a water injection pipe and a concentration regulating valve, the water injection pipe extends into the liquid supply device, and a water injection nozzle is provided on the water injection pipe, and the water injection nozzle is used to spray water toward the polishing liquid turbidity probe during the water injection process to clean the polishing liquid turbidity probe; the concentration regulating valve is provided on the water injection pipe; A main controller, which is electrically connected to the polishing liquid turbidity probe, the pH detection probe and the concentration regulating valve of the water injection structure; The main controller controls the concentration regulating valve according to the turbidity of the polishing liquid detected by the polishing liquid turbidity probe, and controls the water injection amount of the water injection pipe to adjust the water injection, so that the turbidity of the polishing liquid detected by the polishing liquid turbidity probe reaches a preset turbidity. At the same time, the main controller controls the replacement of the polishing liquid according to the pH value of the polishing liquid detected by the pH detection probe reaches a preset pH value; The polishing liquid concentration automatic monitoring and control device further comprises: an output polishing liquid turbidity probe, which is installed at the liquid outlet of the water pump device and electrically connected to the main controller, and is used to detect the turbidity of the polishing liquid output from the liquid outlet of the liquid supply device; The main controller adjusts the polishing liquid in the liquid supply device according to a comparison result between the turbidity of the polishing liquid detected by the polishing liquid turbidity probe and the turbidity of the polishing liquid detected by the output polishing liquid turbidity probe.

2. The polishing liquid concentration automatic monitoring and control device according to claim 1, characterized in that: The polishing liquid concentration automatic monitoring and control device further comprises: a temperature sensor, the temperature sensor being used to detect the temperature of the polishing liquid in the liquid supply device; A heat exchanger, the heat exchanger is arranged at the liquid outlet of the liquid supply device and is electrically connected to the main controller; A temperature regulating valve, the temperature regulating valve is connected to the heat exchanger and is electrically connected to the main controller; The main controller controls the temperature regulating valve according to the temperature detected by the temperature sensor so that the heat exchanger adjusts the temperature of the polishing liquid.

3. The polishing liquid concentration automatic monitoring and control device according to claim 1 or 2, characterized in that: The polishing liquid concentration automatic monitoring and control device further comprises: a liquid stirring member, which is arranged in the liquid supply device, electrically connected to the main controller, and used to make the polishing liquid flow; or / and The main controller is electrically connected to a wireless communication module, and the wireless communication module is used for remote data communication with the outside.

4. A method for automatically monitoring and controlling the concentration of a polishing liquid, characterized in that: Applied to the polishing liquid concentration automatic monitoring and control device as claimed in any one of claims 1 to 3, the method comprises the steps of: Detect the current turbidity of the polishing liquid in the liquid supply device through the polishing liquid turbidity probe; Compare the current turbidity of the polishing liquid with the preset turbidity, and obtain a concentration adjustment instruction according to the comparison result; According to the concentration adjustment instruction, the water injection structure is controlled to inject water into the liquid supply device so that the turbidity of the polishing liquid detected by the polishing liquid turbidity probe reaches a preset turbidity; Detect the current pH value of the polishing liquid through the pH detection probe; Compare the current pH value with the preset pH value, and obtain a polishing liquid replacement instruction based on the comparison result; According to the polishing liquid replacement instruction, a polishing liquid reminder message is issued to replace the polishing liquid.

5. The method for automatically monitoring and controlling the polishing liquid concentration according to claim 4, characterized in that: Before the step of detecting the current turbidity of the polishing liquid in the liquid supply device by the polishing liquid turbidity probe, the step further includes: Turn on the polishing liquid turbidity probe, and calibrate the 0NTU position of the polishing liquid turbidity probe using a standard solution; Based on the temperature in the use environment, the deviation result of the polishing liquid turbidity probe is tested, and the polishing liquid turbidity probe is corrected according to the deviation result.

6. The method for automatically monitoring and controlling the polishing liquid concentration according to claim 5, characterized in that: The step of testing the deviation result of the polishing liquid turbidity probe based on the temperature in the use environment state and correcting the polishing liquid turbidity probe according to the deviation result comprises: Measure and record the temperature value T of the current calibration solution under the operating environment 测试 , measure and record the output voltage U of the polishing liquid turbidity probe 测试 ; The measured temperature value T 测试 The voltage difference ΔU caused by the temperature difference is calculated by the turbidity correction formula, where ΔU = -0.0192x(T 测试 -25℃); Output voltage U according to the measurement in the standard solution 测试 And the voltage difference ΔU, calculate the standard voltage value U of the standard solution 25℃ , where U 25℃ =U 测试 -ΔU; According to the standard voltage value U 25℃ , calculate the correction constant K1, where K1 = 865.68xU 25℃ ; Substitute the calculated correction constant K1 into the standard curve formula to obtain the correction formula TU, where TU = -865.68xU + K1, and U is the voltage value of the turbidity probe sampled at the current ambient temperature.

7. The method for automatically monitoring and controlling the polishing liquid concentration according to claim 4, characterized in that: After the step of issuing a polishing liquid reminder message to replace the polishing liquid according to the polishing liquid replacement instruction, the step further includes: According to the type of polishing material, the preset pH value and the preset turbidity are matched through the AI ​​algorithm, wherein the AI ​​algorithm adjusts the preset turbidity and the preset pH value of the same polishing material according to the replacement cycle of the cutting fluid and the polishing effect, and uses the changed preset pH value and the changed preset turbidity corresponding to different polishing materials as the matched preset pH value and the matched preset turbidity.

8. The method for automatically monitoring and controlling the polishing liquid concentration according to claim 4, characterized in that: After the step of issuing a polishing liquid reminder message to replace the polishing liquid according to the polishing liquid replacement instruction, the step further includes: The polishing liquid turbidity probe is used to detect the polishing liquid turbidity in real time, and a concentration-time curve is formed according to the real-time monitoring result; The pH value of the circulating polishing liquid is monitored in real time by the pH detection probe, and a polishing liquid replacement periodic table is formed; The concentration-time curve diagram and the polishing liquid replacement period table are transmitted to an external terminal for real-time display and monitoring.

Images