Cleaning apparatus

Abstract

The application relates to the cleaning technical field, in particular to a cleaning device. The cleaning device comprises a containing assembly and a megasonic transducer. The containing assembly has a cleaning space for containing liquid; the megasonic transducer is detachably connected to the containing assembly, and the megasonic transducer is used for generating megasonic waves of at least one frequency and transmitting the megasonic waves to the cleaning space. By additionally arranging the megasonic transducer, megasonic waves of high frequency can generate strong sound pressure gradient and acoustic streaming effect to flush the surface of the device. Since the frequency of the megasonic waves is high, bubbles cannot be generated due to cavitation effect, and the device surface cannot be damaged. In addition, the megasonic waves have good cleaning power for dirt or impurities with extremely small particle size. By detaching and replacing different megasonic transducers, megasonic waves of different frequencies can be generated, and more extensive cleaning capacity and different cleaning requirements can be met.

Description

Technical Field

[0001] This application relates to the field of cleaning technology, and in particular to a cleaning device. Background Technology

[0002] Semiconductor devices are becoming increasingly integrated and precise, placing higher demands on cleaning. Ultrasonic cleaning equipment is commonly used to clean silicon wafers, with operating frequencies between 25 kHz and 100 kHz. This relatively low frequency generates large bubbles, up to 150 µm in diameter, which produce high cavitation energy upon collapse, potentially damaging sensitive structures and reducing device performance and reliability. Furthermore, most current cleaning equipment operates at fixed frequencies, resulting in limited cleaning effectiveness and failing to meet the varying cleanliness requirements of different devices. Therefore, current cleaning equipment is prone to damaging devices and struggles to satisfy diverse cleaning needs. Summary of the Invention

[0003] Therefore, it is necessary to provide a cleaning device that addresses the problem that current cleaning equipment can easily damage components and fails to meet different cleaning needs.

[0004] A cleaning device, comprising:

[0005] The containment assembly has a cleaning space for holding liquids;

[0006] A megasonic transducer, detachably connected to the housing assembly, is used to generate megasonic waves of at least one frequency and transmit the megasonic waves into the cleaning space.

[0007] In one embodiment, the megasonic transducer includes a housing assembly and a megasonic emitting assembly. The housing assembly is detachably connected to the receiving assembly and has a receiving cavity. The megasonic emitting assembly is disposed in the housing assembly and located in the receiving cavity. The megasonic emitting assembly is used to generate at least one megasonic wave and transmit the megasonic wave into the cleaning space through the housing assembly.

[0008] In one embodiment, the megason emitting assembly includes a driver, a vibrator, and a piezoelectric element. The vibrator is connected to the housing assembly, the driver is electrically connected to the piezoelectric element, and the piezoelectric element is connected to the vibrator and located between the vibrator and the housing assembly. The driver is used to drive the piezoelectric element to vibrate and cause the vibrator to vibrate, so as to generate at least one megason.

[0009] In one embodiment, the vibrating element includes opposing first and second surfaces, the first surface being connected to the housing assembly, the vibrating element having a receiving groove formed by the first surface recessing toward the second surface, and the piezoelectric element disposed in the receiving groove.

[0010] In one embodiment, the containment assembly includes a main body and an extension, the main body having a cleaning space for holding liquid, the extension being disposed on a side of the main body away from the cleaning space, the extension being angled relative to the main body, and the megasonic transducer being detachably connected to the extension.

[0011] In one embodiment, the housing assembly includes a detachably connected first housing and a second housing, the first housing and the second housing forming the receiving cavity, the first housing being detachably connected to the receiving assembly, and the megasonite emitting assembly being disposed on the first housing.

[0012] In one embodiment, the first housing includes a first part and a second part connected together, the first part being located inside the accommodating cavity and the second part being located outside the accommodating cavity, the first part being provided with the megasonic emitting component, and the second part being detachably connected to both the second housing and the receiving component.

[0013] In one embodiment, the second portion includes a first sub-part and a second sub-part connected to each other, the second sub-part being located on the side of the first sub-part away from the receiving cavity, the first sub-part being detachably connected to one of the second housing and the receiving assembly, and the second sub-part being detachably connected to the other.

[0014] In one embodiment, the cleaning device further includes a first gasket that is detachably connected to both the first housing and the receiving assembly and is located between the two.

[0015] And / or, the cleaning device further includes a second gasket, which is detachably connected to both the first housing and the second housing and located between them.

[0016] In one embodiment, the containment assembly has a hollow portion through which the megasonic transducer is detachably connected to the containment assembly to cover the hollow portion and create the cleaning space.

[0017] The aforementioned cleaning equipment incorporates a megasonic transducer, which generates megasonic waves with frequencies reaching megahertz. This high frequency creates a strong sound pressure gradient and acoustic flow to flush the surface of the device, removing particles adhering to the surface and releasing them into the liquid. Due to the high frequency of megasonic waves, cavitation effects do not generate bubbles, thus preventing damage to the device surface. The high-frequency sound of megasonic waves enables the removal of submicron particles, meeting the requirements for removing contaminants with particle sizes as small as 0.1 micrometers, and also demonstrating excellent cleaning power for extremely small particles or impurities. Furthermore, by disassembling and replacing different megasonic transducers, different frequencies of megasonic waves can be generated, providing a wider range of cleaning capabilities and adapting to different cleaning needs, offering varying removal effects for different types of contaminants. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of a cleaning device provided in an embodiment of this application.

[0019] Figure 2 This is an exploded view of a cleaning device provided in an embodiment of this application.

[0020] Figure 3 This is a schematic diagram of the assembly of the first gasket, the second gasket, the connector and the first housing in the embodiments of this application.

[0021] Figure 4 This is a schematic diagram of the structure of the first housing in an embodiment of this application.

[0022] Explanation of reference numerals in the attached drawings: 1000, cleaning equipment; 10, housing assembly; 11, cleaning space; 12, main body; 121, tank; 122, support; 13, extension; 131, second mounting hole; 14, hollow section; 15, cleaning basket; 100, megasonic transducer; 201, housing assembly; 21, accommodating cavity; 22, first housing; 221, first part; 222, second part; 2221, first sub-part; 2221a, second fastener; 222 2. Second sub-part; 2222a. First mounting hole; 23. Second housing; 231. Cover; 2311. Through hole; 232. Connecting part; 2321. Fifth mounting hole; 301. Megasonic wave emitting assembly; 31. Vibrating element; 311. First surface; 312. Second surface; 313. Receiving groove; 32. Piezoelectric element; 41. First gasket; 411. Third mounting hole; 42. Second gasket; 421. Sixth mounting hole; 43. Connecting element; 431. Fourth mounting hole. Detailed Implementation

[0023] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0024] Please see Figure 1 This application provides a cleaning device 1000, including a housing assembly 10 and a megasonic transducer 100. The housing assembly 10 has a cleaning space 11 for holding liquid. The megasonic transducer 100 is detachably connected to the housing assembly 10 and generates megasonic waves of at least one frequency, transmitting these waves into the cleaning space 11. The megasonic waves have frequencies reaching megahertz, and this high frequency allows for the generation of strong sound pressure gradients and acoustic flow to flush the surface of devices, removing particles adhering to the device surface and allowing them to enter the liquid. Due to the high frequency of the megasonic waves, cavitation effects do not generate bubbles, thus preventing damage to the device surface. The high-frequency sound of the megasonic waves enables the removal of submicron particles, satisfying the removal of contaminants with particle sizes as small as 0.1 micrometers, and also exhibiting good cleaning power for contaminants or impurities with extremely small particle sizes. Furthermore, by disassembling and replacing different megasonic transducers 100, megasonic waves of different frequencies can be generated, providing a wider range of cleaning capabilities and adapting to different cleaning needs. This allows for different removal effects on different types of contaminants, effectively removing various impurities from device surfaces, including particles, organic matter, oil, dust, and fingerprints. Moreover, different frequency bands can achieve optimal cleaning results at different times; by rationally combining and switching different frequency megasonic transducers 100, the cleaning frequency can be increased.

[0025] The megasonic transducer 100 of this application can generate megasonic waves of 0.8MHz to 5MHz, and can be any value within the above range, such as 0.8MHz, 1MHz, 1.5MHz, 2MHz, 2.5MHz, 3MHz, 3.5MHz, 4MHz, 4.5MHz, 5MHz, etc.

[0026] In some embodiments, at least two megasonic transducers 100 are included, and all megasonic transducers 100 are selectively and detachably connected to the housing assembly 10. The selection of the megasonic transducers 100 can be varied, but not limited to, in several ways: each megasonic transducer 100 is used to generate megasonic waves of one frequency, and at least two megasonic transducers 100 generate megasonic waves of different frequencies. For example, the first megasonic transducer 100 can generate a 1 MHz megasonic wave, the second megasonic transducer 100 generates a 2 MHz megasonic wave, and the third megasonic transducer 100 can generate a 2 MHz megasonic wave. Alternatively, each megasonic transducer 100 generates the same two megasonic waves. For example, the first megasonic transducer 100 can generate megasonic waves of 1 MHz and 2 MHz, the second megasonic transducer 100 generates 1 MHz and 2 MHz, and the third megasonic transducer 100 can generate megasonic waves of 1 MHz and 2 MHz. Alternatively, each megasonic transducer 100 may generate a different megasonic frequency. For example, the first megasonic transducer 100 may generate a 1 MHz megasonic wave, the second megasonic transducer 100 may generate a 2 MHz megasonic wave, and the third megasonic transducer 100 may generate a 3 MHz megasonic wave.

[0027] In some alternative embodiments, the receiving assembly 10 is provided with a cleaning tank that is open at one end and closed at the other, the cleaning tank having a cleaning space 11 for holding liquid. See also... Figure 2 In some alternative configurations, the housing assembly 10 has a hollow portion 14 extending through it, and the megasonic transducer 100 is detachably connected to the housing assembly 10 to cover the hollow portion 14, thus creating a cleaning space 11. In other words, the megasonic transducer 100 and the housing assembly 10 together form a cleaning tank, and the megasonic transducer 100 is in direct contact with the liquid, which can reduce megasonic energy loss.

[0028] Optionally, the megaacoustic transducer 100 may be connected to the periphery of the housing assembly 10 or to the bottom of the housing assembly 10.

[0029] Please see Figure 2 In some embodiments, the housing assembly 10 includes a main body 12 and an extension 13. The main body 12 has a cleaning space 11 for holding liquid. The extension 13 is located on the side of the main body 12 opposite to the cleaning space 11 and is angled to the main body 12. The megasonic transducer 100 is detachably connected to the extension 13. Adding the extension 13 increases the connection area between the megasonic transducer 100 and the housing assembly 10, enabling a more stable connection between the two. It also enables more stable transmission of the high-frequency vibrations generated by the megasonic transducer 100, reducing the energy loss of the megasonic waves.

[0030] Optionally, the main body 12 can be in the shape of a cube or a cylinder.

[0031] Please see Figure 2 Specifically, the main body 12 includes a connected tank 121 and a support 122. The support 122 is located on the outer periphery of the tank 121 to support the tank 121. The tank 121 has a hollow part 14 to form a cleaning space 11.

[0032] Please see Figure 2 Furthermore, the housing assembly 10 also includes a cleaning basket 15. The cleaning basket 15 is disposed in the hollow portion 14 and is used to hold devices such as silicon wafers, chips, optical components, blade batteries, or high-precision metal workpieces. Furthermore, hooks are provided on the tank wall surface of the tank body 121 facing the hollow portion 14, which can hook the cleaning basket 15 and suspend the cleaning basket 15 in the cleaning space 11.

[0033] Please see Figure 2 In some embodiments, the megasonic transducer 100 includes a housing assembly 201, a megasonic emitting assembly 301, a connector 43, a first gasket 41, and a second gasket 42. The housing assembly 201 is detachably connected to the receiving assembly 10 and has a receiving cavity 21. The megasonic emitting assembly 301 is disposed in the housing assembly 201 and located in the receiving cavity 21. The megasonic emitting assembly 301 is used to generate at least one megasonic wave and transmits the megasonic wave into the cleaning space 11 through the housing assembly 201. Therefore, when replacing or disassembling the megasonic transducer 100, the housing assembly 201 can be directly disassembled, and the housing assembly 201 protects the megasonic emitting assembly 301.

[0034] In some embodiments, the housing assembly 201 includes a detachably connected first housing 22 and a second housing 23, which form a receiving cavity 21. The first housing 22 is detachably connected to the receiving assembly 10, and the megasonic wave emitting assembly 301 is disposed on the first housing 22. Therefore, when replacing the megasonic wave transducer 100, only the first housing 22 and the megasonic wave emitting assembly 301 need to be replaced, without replacing the second housing 23, thus improving component utilization. In some optional embodiments, the first housing 22 is detachably connected to the extension portion 13 of the receiving assembly 10. In some optional embodiments, the first housing 22 can directly cover the hollow portion 14 of the receiving assembly 10.

[0035] Please see Figure 2 and Figure 3To enhance the sealing and connection stability between the first housing 22 and the receiving assembly 10, in some embodiments, a first gasket 41 is added. The first gasket 41 is detachably connected to both the first housing 22 and the receiving assembly 10 and is located between them. Alternatively, the first gasket 41 is detachably connected to both the first housing 22 and the extension portion 13 of the receiving assembly 10. Optionally, the first gasket 41 may be a rubber gasket, a plastic gasket, or a metal gasket.

[0036] Please see Figure 2 and Figure 3 Furthermore, in an optional configuration, the first housing 22 is provided with a first mounting hole 2222a, the extension portion 13 is provided with a second mounting hole 131, and the first gasket 41 is provided with a third mounting hole 411. The first gasket 41 is detachably connected to the extension portion 13 by passing through the first mounting hole 2222a, the second mounting hole 131, and the third mounting hole 411 simultaneously via a first fastener.

[0037] Please see Figure 2 and Figure 3 Optionally, the cleaning device 1000 further includes a connector 43, which is detachably connected to both the first housing 22 and the receiving assembly 10. The first housing 22 is located between the receiving assembly 10 and the connector 43. In other words, the connector 43 and the first gasket 41 are sandwiched on both sides of the first housing 22, which can further improve the connection stability between the first housing 22 and the receiving assembly 10. Optionally, the connector 43 is a metal gasket, which can further improve the connection strength between the first housing 22 and the receiving assembly 10.

[0038] Furthermore, in an optional embodiment, the connector 43 is provided with a fourth mounting hole 431. The connector 43 is detachably connected to the first housing 22 by means of a first fastener passing through the second mounting hole 131, the third mounting hole 411, the fourth mounting hole 431, and the first mounting hole 2222a. In other words, both the connector 43 and the first gasket 41 are detachably connected by the first fastener, which can improve the structural compactness of the cleaning equipment 1000 and reduce the number of parts.

[0039] Optionally, the first fastener can be a stud with a nut or a bolt with a nut, etc.

[0040] Please see Figure 2 , Figure 3 and Figure 4In some embodiments, the first housing 22 includes a first portion 221 and a second portion 222 connected to each other. The first portion 221 is located inside the receiving cavity 21, and the second portion 222 is located outside the receiving cavity 21. The first portion 221 is provided with a megasonic wave emitting component 301, and the second portion 222 is detachably connected to both the second housing 23 and the receiving component 10. Thus, by providing the second portion 222, a detachable connection between the second housing 23 and the receiving component 10 can be achieved, simplifying the structure of the megasonic wave transducer 100 and making it more compact.

[0041] Please see Figure 2 , Figure 3 and Figure 4 To improve the sealing and connection stability between the first housing 22 and the second housing 23, in some embodiments, a second gasket 42 is added. The second gasket 42 is detachably connected to both the first housing 22 and the second housing 23 and is located between them. Optionally, the second gasket 42 can be a rubber gasket, a plastic gasket, or a metal gasket. In some embodiments, the second gasket 42 can be located in the second part 222.

[0042] In some embodiments, the second portion 222 includes a first sub-part 2221 and a second sub-part 2222 connected to each other. The second sub-part 2222 is located on the side of the first sub-part 2221 away from the receiving cavity 21. The first sub-part 2221 is detachably connected to one of the second housing 23 and the receiving assembly 10, and the second sub-part 2222 is detachably connected to the other. In other words, there are the following optional implementations: First, the first sub-part 2221 is detachably connected to the second housing 23, and the second sub-part 2222 is detachably connected to the receiving assembly 10. Or, second, the first sub-part 2221 is detachably connected to the receiving assembly 10, and the second sub-part 2222 is detachably connected to the second housing 23. The former is preferred, as it can reduce the volume of the second housing 23, making the structure of the megaacoustic transducer 100 more compact and reducing megaacoustic energy loss.

[0043] For further details, please refer to Figure 3 and Figure 4 In some preferred embodiments, both the connector 43 and the first gasket 41 are located in the second sub-part 2222, and the first mounting hole 2222a is located in the second sub-part 2222. Please refer to [link / reference]. Figure 2 and Figure 3A second gasket 42 is disposed on the first sub-part 2221. A second fastener 2221a is fixedly mounted on the first sub-part 2221. The second housing 23 has a through-hole fifth mounting hole 2321, and the second gasket 42 has a sixth mounting hole 421. The first sub-part 2221 is detachably connected to the second gasket 42 and the second housing 23 through the second fastener 2221a passing through the sixth mounting hole 421 and the fifth mounting hole 2321. Optionally, the second fastener 2221a is a stud, which can be fixed to the first sub-part 2221 by welding. The second fastener 2221a prevents deformation of the first housing 22, ensuring the connection strength of the first housing 22.

[0044] Please see Figure 2 Furthermore, the second housing 23 includes a cover portion 231 and a connecting portion 232 connected together. The connecting portion 232 is located outside the accommodating cavity 21 and is angularly connected to the cover portion 231. The connecting portion 232 has a fifth mounting hole 2321 extending through it. The second gasket 42 is located between the first sub-part 2221 and the connecting portion 232. The cover portion 231 has several through holes 2311 for heat dissipation. Nitrogen gas can be introduced for cooling, or cold air can be introduced into some of the through holes 2311 and hot air inside the second housing 23 can be discharged from other through holes 2311. Cooling is achieved through gas circulation to maintain the normal operation of the megaacoustic wave emitting component 301.

[0045] Please see Figure 2 In some embodiments, the megasonic wave emitting assembly 301 includes a driver, a vibrator 31, and a piezoelectric element 32. The vibrator 31 is connected to the housing assembly 201. The driver is electrically connected to the piezoelectric element 32. The piezoelectric element 32 is connected to the vibrator 31 and located between the vibrator 31 and the housing assembly 201. The driver drives the piezoelectric element 32 to vibrate, thereby causing the vibrator 31 to vibrate and generate at least one megasonic wave. The driver applies a voltage to the piezoelectric element 32, which then generates mechanical vibration, which is transmitted to the vibrator 31, thereby generating a megasonic wave.

[0046] Please see Figure 2 and Figure 3 In some embodiments, the vibrating element 31 includes a first surface 311 and a second surface 312 facing each other. The first surface 311 is connected to the housing assembly 201. The vibrating element 31 is provided with a receiving groove 313, which is formed by the first surface 311 being recessed towards the second surface 312. The piezoelectric element 32 is disposed in the receiving groove 313. Disposing the piezoelectric element 32 in the receiving groove 313 can increase mechanical stability, allowing the piezoelectric ceramic to better bond with the vibrating bar, increasing the stability of the overall structure, and reducing the possibility of loosening or falling off during vibration. In addition, it can increase the contact area between the piezoelectric element 32 and the vibrating element 31, thereby improving the efficiency of energy transmission and reducing energy loss.

[0047] Please see Figure 2 and Figure 3 In some alternative embodiments, the first surface 311 of the vibrator 31 is connected to the first housing 22. Since the first housing 22 can directly cover the hollow portion 14 of the housing assembly 10, the megasonic waves can be directly transmitted to the cleaning space 11 through the first housing 22, reducing energy loss.

[0048] Furthermore, the vibrating element 31 is made of aluminum alloy, steel, or titanium. The vibrating element 31 can be bonded to the first housing 22 using epoxy resin adhesive. There can be multiple vibrating elements 31, for example, 8, 10, or 12. Each vibrating element 31 can have multiple receiving slots 313, for example, 2, 3, or 4 slots 313, to accommodate 2, 3, or 4 piezoelectric elements 32. The piezoelectric element 32 can be piezoelectric ceramic or piezoelectric polymer. Bonding the piezoelectric element 32 to the receiving slot 313 using epoxy resin adhesive reduces the gap between the piezoelectric element 32 and the vibrating element 31, thus reducing mega-sound energy loss.

[0049] Furthermore, the depth of the receiving groove 313 is 0.3mm to 0.7mm, and the depth of the receiving groove 313 can be any value within the above range, such as 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, etc. The flatness of the receiving groove 313 is 0.003mm to 0.007mm, and the flatness of the receiving groove 313 can be any value within the above range, such as 0.003mm, 0.004mm, 0.005mm, 0.006mm, 0.007mm, etc. The depth and flatness of the receiving groove 313 being within the above range can improve the transmission efficiency of megaacoustic waves.

[0050] In summary, the cleaning device 1000 provided in this application embodiment has at least the following technical effects:

[0051] First, by setting up the megasonic wave emitting component 301 to achieve megasonic wave cleaning, damage to the device can be reduced and the cleaning power can be improved.

[0052] Secondly, by setting a detachable housing assembly 201, it is easy to replace the megasonic wave emitting assembly 301 of different frequencies, thereby meeting different cleaning needs, realizing multiple uses of one machine, and facilitating maintenance. When the megasonic wave emitting assembly 301 fails, only the first housing 222 and the megasonic wave emitting assembly 301 need to be replaced without maintaining or replacing the entire equipment.

[0053] Third, by configuring the structure of the first housing 22, which includes a first part 221 and a second part 222, the first housing 22 can be detachably connected to the megasonic wave transmitting assembly 301, as well as to the housing assembly 10, the first gasket 41, the second gasket 42, the connector 43, and the second housing 23. On the one hand, this ensures the integrity and stability of the connections between the aforementioned components, preventing interface wear or damage caused by frequent disassembly and installation, which could affect the quality and reliability of megasonic wave transmission. On the other hand, it facilitates alignment, preventing uneven megasonic wave field distribution or reduced acoustic energy transmission efficiency due to incorrect alignment. Furthermore, the ingenious connection structure reduces mechanical fatigue of the aforementioned components, lowering the failure rate and maintenance requirements. Additionally, it reduces the accumulation of dust and other particles at the detachable interfaces, minimizing interface problems such as poor contact of the megasonic wave transmitting assembly 301.

[0054] Fourth, the housing assembly 201 is highly integrated with other components, featuring a sophisticated and compact structural design that effectively simplifies the structure of the cleaning equipment 1000. This makes the cleaning equipment 1000 small in size, lightweight, and easy to disassemble, suitable for small-batch applications and handling multi-frequency megasonic cleaning needs, facilitating its widespread application. Third, the structural design of the housing assembly 201 and the megasonic wave transmitting assembly 301 greatly reduces the energy loss during megasonic wave transmission, ensuring cleaning efficiency.

[0055] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0056] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0057] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0058] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0059] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0060] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0061] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A cleaning device, characterized in that, include: The containment assembly has a cleaning space for holding liquids; A megasonic transducer, detachably connected to the housing assembly, is used to generate megasonic waves of at least one frequency and transmit the megasonic waves into the cleaning space. The receiving assembly includes a main body and an extension. The main body has a cleaning space for holding liquid, and the extension is located on the side of the main body away from the cleaning space. The extension is angled to the main body. The megasonic transducer includes a housing assembly and a megasonic emitting assembly. The housing assembly includes a detachably connected first housing and a second housing, which together form the receiving cavity. The first housing includes a first portion and a second portion connected together, the first portion being located inside the accommodating cavity and the second portion being located outside the accommodating cavity, the first portion being provided with the megason wave emitting assembly; the second portion includes a first sub-part and a second sub-part connected together, the second sub-part being located on the side of the first sub-part away from the accommodating cavity; the cleaning device further includes a first gasket, a second gasket, and a connector; the extension portion of the receiving assembly, the first gasket, the second sub-part of the first housing, and the connector are detachably connected; the first sub-part of the first housing, the second gasket, and the second housing are detachably connected.

2. The cleaning equipment according to claim 1, characterized in that, The megason wave emitting assembly includes a driving element, a vibrating element, and a piezoelectric element. The vibrating element is connected to the housing assembly, the driving element is electrically connected to the piezoelectric element, and the piezoelectric element is connected to the vibrating element and located between the vibrating element and the housing assembly. The driving element is used to drive the piezoelectric element to vibrate and cause the vibrating element to vibrate, so as to generate at least one megason wave.

3. The cleaning equipment according to claim 2, characterized in that, The vibrating element includes a first surface and a second surface opposite to each other. The first surface is connected to the housing assembly. The vibrating element is provided with a receiving groove, which is formed by the first surface being recessed towards the second surface. The piezoelectric element is disposed in the receiving groove.

4. The cleaning equipment according to any one of claims 1 to 3, characterized in that, The containment assembly has a hollow section, and the megaacoustic transducer is detachably connected to the containment assembly to cover the hollow section and create the cleaning space.

5. The cleaning equipment according to any one of claims 1 to 3, characterized in that, The megaacoustic transducer includes at least two, and one of the megaacoustic transducers is selectively and detachably connected to the housing assembly.

6. The cleaning equipment according to claim 3, characterized in that, The depth of the receiving groove is 0.3mm to 0.7mm.

7. The cleaning equipment according to claim 3, characterized in that, The flatness of the receiving groove is 0.003mm~0.007mm.

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