A glass-based Mini LED backlight substrate material, preparation method and application

Abstract

The present application belongs to the field of display device technology, and in particular relates to a glass-based Mini LED backlight substrate material, a preparation method and an application thereof; the glass-based Mini LED backlight substrate material provided by the present application introduces SiO2, Al2O3, CaO, MgO, Na2O, K2O, B2O3 and La2O3 into the raw materials, and the various oxides cooperate with each other during the melting and molding process, which can significantly improve the expansion coefficient and thermal conductivity and other properties of the glass-based Mini LED backlight substrate material, so that it can stably encapsulate Mini LED displays and make the Mini LED displays have high luminous efficiency, solving the technical problem that the performance of the backlight substrate material in the prior art is poor and cannot meet the requirements of Mini LED displays.

Description

Technical Field

[0001] The present application belongs to the technical field of display devices, and in particular relates to a glass-based Mini LED backlight substrate material, a preparation method, and an application thereof. Background Art

[0002] CRT display tubes can convert electrical signals into light output and are the starting point of electronic display technology. Subsequently, the photoelectric camera tube was invented, and the combination of the two became the basis of television display devices. With the development of science and technology, there are now display technologies including PDP (plasma), LCD (liquid crystal display technology), LED (light emitting diode), OLED (organic light emitting diode), E-Paper (electronic paper), etc.

[0003] In display technology, the current mainstream terminal products are mainly equipped with LCD displays; Mini LED (micro-pitch light-emitting diode display technology) backlight is an important innovation direction in the liquid crystal display technology path, and is an upgrade and innovation of current LCD display products; Mini LED backlight products can achieve display effects similar to OLED. Compared with the main advantages of OLED such as contrast and color, Mini LED backlight products are not inferior, and have the outstanding advantages of low cost, long life, flexible specifications and a wide range of applications; therefore, the proportion of LCD products equipped with Mini LED backlight in high-end terminal products continues to increase rapidly.

[0004] Display technology requires corresponding display materials. Currently, the substrates used in Mini LED products are mainly PCBs. PCBs primarily use epoxy resin and copper foil as raw materials. PCBs made from materials like epoxy resin and copper foil have a heat resistance of less than 150°C and a thermal conductivity of only about 0.25w / (mK). They have poor heat dissipation performance, large thermal expansion, and are prone to warping and deformation. They also have low surface flatness, and the overall PCB exhibits thermal expansion and deformation, as well as poor thermal conductivity. This poses two problems for Mini LED displays. On the one hand, the PCB is prone to deformation, leading to poor packaging stability. On the other hand, the PCB has poor thermal conductivity and is prone to high temperatures, which damages the Mini LED display and reduces luminous efficiency. These two problems lead to performance defects in existing Mini LED displays.

[0005] In addition to PCB printed circuit boards, researchers are also studying the potential of fiberglass boards, polyimide, glass, ceramics, etc. as Mini LED backlight substrate materials. However, the raw materials used for Mini LED backlight glass substrates are mainly oxides such as SiO2, Na2O, Al2O3, CaO, MgO, and K2O. For example, CN114933407B involves a glass-based Mini LED backlight substrate material that uses oxides such as SiO2, Na2O, Al2O3, CaO, MgO, and K2O. The main molding method is calendering. However, with the development of technology, higher performance requirements are placed on glass-based Mini LED backlight substrate materials. The currently prepared glass cannot meet the performance requirements of substrate glass for fine-pitch light-emitting diodes, and the raw materials used in glass-based Mini LED backlight substrate materials need to be improved. Summary of the Invention

[0006] In view of this, the present application provides a glass-based Mini LED backlight substrate material, a preparation method and an application to meet the performance requirements of Mini LED display technology for substrate glass.

[0007] In a first aspect, the present application provides a glass-based Mini LED backlight substrate material, wherein the glass-based Mini LED backlight substrate material includes SiO2, Al2O3, RO, R2O, and B2O3;

[0008] Among them, RO is CaO and MgO in alkaline earth metal oxides, and R2O is Na2O and K2O in alkali metal oxides.

[0009] Preferably, calculated by mole percentage, in the glass-based Mini LED backlight substrate material,

[0010] The B2O3 content is 0.1~3mol%, and the sum of SiO2 and B2O3 content is 68~75mol%;

[0011] Al2O3 is 0.8~1.3mol%;

[0012] The sum of the contents of RO and R2O is 24.2 to 28 mol%, and the molar ratio of RO to R2O is 1.25 to 2. Preferably, the glass-based Mini LED backlight substrate material further includes La2O3.

[0013] Preferably, calculated by mole percentage, in the glass-based Mini LED backlight substrate material:

[0014] La2O3 content is 0.1~2mol%;

[0015] The B2O3 content is 1~3mol%, and the sum of SiO2 and B2O3 content is 68~75mol%;

[0016] Al2O3 is 0.8~1.3mol%;

[0017] The sum of the contents of RO and R2O is 24.2-28 mol%, and the molar ratio of RO to R2O is 1.25-2. The second aspect of the present application provides a method for preparing a glass-based Mini LED backlight substrate material.

[0018] The glass-based Mini LED backlight substrate material described in the first aspect can be prepared, and the preparation method includes the following steps:

[0019] Step S1: mixing silica sand, feldspar, dolomite, limestone, colemanite, soda ash, and lanthanum carbonate to obtain a glass-based Mini LED backlight substrate batch material;

[0020] Step S2: adding the glass-based Mini LED backlight substrate batch material into an all-oxygen melting furnace to melt into glass liquid to obtain a glass-based Mini LED backlight substrate liquid;

[0021] Step S3: Thinning and shaping the glass-based Mini LED backlight substrate liquid in a tin bath to obtain a semi-finished glass-based Mini LED backlight substrate material;

[0022] Step S4: anneal and cut the semi-finished glass-based Mini LED backlight substrate material in sequence to obtain a glass-based Mini LED backlight substrate material.

[0023] Preferably, in step S2, the temperature for melting in the all-oxygen melting furnace is 1550-1600° C., and the kiln pressure is less than 5 Pa.

[0024] Preferably, in step S3, the temperature for the thinning process in the tin bath is 650-1100°C.

[0025] Preferably, in step S4, the annealing temperature is 500-600° C., and then slowly lowered to room temperature in the annealing furnace, and after cutting, a glass-based MiniLED backlight substrate is obtained.

[0026] The third aspect of the present application provides an application of a glass-based Mini LED backlight substrate material described in the first aspect in a MiniLED display.

[0027] The fourth aspect of the present application provides a glass-based Mini LED backlight substrate, which is prepared from the glass-based Mini LED backlight substrate material described in the first aspect.

[0028] In summary, the present application provides a glass-based Mini LED backlight substrate material, a preparation method and an application. The raw materials of the glass-based Mini LED backlight substrate provided by the present application include SiO2, Al2O3, Na2O, K2O, CaO, MgO, B2O3 and La2O3; after SiO2, Al2O3, Na2O, K2O, CaO, MgO and oxides such as B2O3 and La2O3 are simultaneously introduced into the glass-based backlight substrate material, the various oxides cooperate with each other through effective combination during the melting and molding process, significantly reducing the expansion coefficient of the glass-based backlight substrate material and improving the thermal conductivity. As shown in the performance test results, the glass-based backlight substrate material provided by the present application can improve the deformation of the glass-based Mini LED backlight substrate caused by heat generation during long-term use by reducing the expansion coefficient of the glass-based backlight substrate material and improving the thermal conductivity. At the same time, it can also stably package the Mini LED display and make the Mini LED display have high luminous efficiency, thereby solving the technical problem that the performance of the backlight substrate material in the prior art is poor and cannot meet the requirements of the Mini LED display. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the specific implementation methods of the present application or the technical solutions in the prior art, a brief introduction is given below to the drawings required for use in the specific implementation methods or the description of the prior art. Obviously, the drawings described below are some implementation methods of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0030] Figure 1 Schematic diagram of the crystallization of the finished product of the glass-based Mini LED backlight substrate material corresponding to Example 6 (1 mol% La2O3) and Comparative Example 2 (3 mol% La2O3) provided in Example 1 of the present application after being kept warm in a gradient temperature furnace. DETAILED DESCRIPTION

[0031] The present application provides a glass-based Mini LED backlight substrate material, a preparation method and an application, which are used to solve the technical problem that the performance of the backlight substrate material in the prior art is poor and cannot meet the requirements of Mini LED displays.

[0032] The following will clearly and completely describe the technical solution of this application in conjunction with the accompanying drawings. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of this application.

[0033] Given that the backlight substrates currently used in fine-pitch light-emitting diode (Mini LED) display technology have poor performance and cannot meet the requirements of Mini LED displays, researchers are not only studying printed circuit boards (PCBs) as substrates, but are also investigating the potential of fiberglass boards, polyimide, glass, ceramics, and other materials as Mini LED backlight substrates. During the research and development process, it was discovered that glass is mainly composed of oxides such as silicon oxide, aluminum oxide, calcium oxide, magnesium oxide, and potassium oxide. These oxides play a corresponding role in the glass melting and forming processes, thereby affecting the performance of the glass. If glass prepared with these materials, such as the glass-based Mini LED backlight substrate material mentioned in CN114933407B, can be used as substrate glass for fine-pitch LEDs, with the development of industry technology, it cannot meet the higher performance requirements for fine-pitch LED substrate glass set forth in the group standard TCSTM 01039-2023, "Substrate Glass for Fine-Pitch LEDs."

[0034] After long-term research and development, the present application provides a glass-based backlight substrate material for Mini LED display. The raw material composition of the glass-based backlight substrate material includes SiO2, Al2O3, Na2O, K2O, CaO, MgO, B2O3 and La2O3; the various oxide components in the glass-based backlight substrate play corresponding roles in the melting and molding process, such as Al2O3 has a greater influence on the viscosity of the glass, which can increase the viscosity of the glass liquid, reduce the crystallization tendency of the glass, and improve the thermal stability and mechanical strength of the glass, while Na2O is a flux in the glass manufacturing process, which can reduce the viscosity of the glass liquid, but adding too much Na2O will also reduce the thermal stability and mechanical strength of the glass. The addition of B2O3 can not only reduce the viscosity of the glass at high temperature, which is conducive to clarification, but increase the viscosity of the glass at low temperature, which is conducive to the adjustment of the glass material properties, but also form [BO3] triangle and [BO4] tetrahedron structures in the glass-based backlight substrate material; among them, the [BO4] tetrahedron structure can improve the thermal stability and mechanical strength of the glass-based backlight substrate material, reduce Low expansion coefficient, improved gloss, and synergistically improved the material properties of the glass raw materials with the calcium oxide (CaO) in the raw materials, widening the temperature range of glass forming and heat treatment, which is conducive to the preparation of glass with high flatness, and the addition of La2O3 can form La-O-Si bonds, which are more stable than Na / K / Ca / Mg-O-Si bonds, making it difficult for the glass-based backlight substrate material to dissociate at high temperatures, slowing down the migration of alkali metal ions, and reducing the risk of substrate circuit short circuit caused by alkali metal ion migration during the use of the glass backplane; experimental results show that after introducing oxides such as SiO2, Al2O3, Na2O, K2O, CaO, MgO, B2O3 and La2O3 into the glass-based backlight substrate material, the various oxides cooperate with each other through effective combination during the melting and forming process, significantly reducing the expansion coefficient of the glass-based backlight substrate material and improving the thermal conductivity, so that the glass-based backlight substrate material provided by this application can meet the group standard TCSTM 01039-2023 "Substrate Glass for Fine Pitch Light Emitting Diodes" sets performance requirements for substrate glass for fine pitch light emitting diodes, which enables stable packaging of Mini LED displays and high luminous efficiency of Mini LED displays, thereby overcoming the current defect that the performance of backlight substrate materials is poor and cannot meet the requirements of Mini LED displays.

[0035] At the same time, on the other hand, compared with the currently used PCB backlight substrate materials which account for most of the cost of Mini LED backlight, the glass-based backlight substrate glass provided by the present invention can greatly reduce the material cost when applied to Mini LED backlight. It is preliminarily estimated that the cost of the backlight substrate material can be reduced by more than 60%.

[0036] As a preferred solution, the ratio of the glass-based backlight substrate material is specifically as follows, calculated by molar parts: 0.1-3 mol% B2O3, and the sum of SiO2 and B2O3 content is 68-75 mol%;

[0037] 0.8~1.3mol% Al2O3;

[0038] The sum of the contents of alkaline earth metal oxides RO (CaO and MgO) and alkali metal oxides R2O (Na2O and K2O) is 24.2~28mol%, and the molar ratio of RO to R2O is 1.25~2; based on this, the contents of RO and R2O can be calculated; among them, the amount of B2O3 added is relatively small, so the amount of [BO3] triangles generated is relatively small, and the amount of [BO4] tetrahedral structures generated is relatively large. The glass-based backlight substrate material mainly exists in the [BO4] structure, thereby reducing the expansion coefficient of the substrate material, which is beneficial to the stable packaging of Mini LED displays.

[0039] As a preferred solution, the present application further provides a more optimized raw material for glass-based backlight substrate material, which comprises, by molar parts:

[0040] 0.1~2mol% La2O3;

[0041] 0.1~3mol% B2O3, and the sum of SiO2 and B2O3 content is 68~75mol%;

[0042] 0.8~1.3mol% Al2O3;

[0043] The sum of the contents of alkaline earth metal oxides RO (CaO and MgO) and alkali metal oxides R2O (Na2O and K2O) is 24.2-28 mol%. In this preferred embodiment, by adding a small amount of less than 3 mol% of La2O3, a sharp increase in the upper limit of glass crystallization caused by excessive addition of La2O3 is avoided, thereby avoiding the influence on the control of float glass production. Figure 1 As shown, too high a crystallization temperature may also cause crystallization in the material channel, leading to production accidents, so the added La2O3 is controlled to be no more than 3 mol%, and more preferably no more than 2 mol%.

[0044] After determining the contents of RO and R2O, the examples of the present application further clearly record the contents of CaO, MgO, Na2O and K2O, such as the CaO content range is 6~10mol%, the MgO content range is 5~8mol%, the Na2O content range is 6~11mol%, and the K2O content range is 1~4mol%.

[0045] At the same time, the present application also provides a corresponding preparation method for glass-based backlight substrate materials, which includes conventional processes such as melting glass liquid, thinning and forming, annealing, and cutting. Among them, the melting furnace used to melt the glass liquid is an all-oxygen melting furnace. The all-oxygen melting furnace can avoid the blockage of the kiln caused by the volatilization of B2O3, which is conducive to melting the glass liquid and improving the performance of subsequent glass-based backlight substrate material products.

[0046] Furthermore, the present application also provides an application of a glass-based Mini LED backlight substrate material in a Mini LED display; the application is specifically that the glass-based Mini LED backlight substrate is made into a backlight substrate and then used in an LCD display; the process used to make the backlight substrate from the glass-based Mini LED backlight substrate material is a technology that has been applied in the field of display technology and will not be repeated here.

[0047] The content of the above technical solution is detailed in the following specific embodiments.

[0048] Example 1

[0049] Example 1 of the present application provides a method for preparing a glass-based Mini LED backlight substrate material, wherein the preparation method includes preparing raw materials, melting glass liquid in a melting furnace, thinning and forming in a tin bath, and annealing and cutting.

[0050] Among them, the steps of raw material preparation include: mainly introducing SiO2 by using silica sand and feldspar, mainly introducing B2O3 through borate stone, borax or boric acid, mainly introducing La2O3 through lanthanum carbonate or lanthanum oxide, mainly introducing alkaline earth metal oxides RO (CaO and MgO) through dolomite and limestone, and mainly introducing R2O (Na2O and K2O) through feldspar and carbonate; therefore, this application follows the formula ratio of 70.5 mol% SiO2, 1.02 mol% Al2O3, 8.7 mol% Na2O, 2.1 mol% K2O, 9.5 mol% CaO, 6.48 mol% MgO, 1.5 mol% B2O3 and 0.2 mol% La2O3 in the components of the glass-based Mini LED backlight substrate material, weighs the corresponding raw materials such as silica sand, feldspar, dolomite, limestone, borate stone, soda ash, lanthanum carbonate, etc., and mixes them evenly to obtain a glass-based Mini LED backlight substrate batch material.

[0051] The step of melting the glass liquid in the melting furnace includes: feeding the glass-based Mini LED backlight substrate batch material into an all-oxygen melting furnace with a temperature of 1550~1600℃ and a kiln pressure of <5pa through a feeding machine to melt it into glass liquid to obtain a glass-based Mini LED backlight substrate liquid.

[0052] The step of thinning and forming in the tin bath includes: cooling the glass-based Mini LED backlight substrate liquid in a cooling section at 1400℃~1500℃, entering the tin bath through the flow channel, and thinning and forming in a tin bath at 650℃~1100℃ to obtain a semi-finished glass-based Mini LED backlight substrate material.

[0053] The annealing and cutting steps include: annealing the semi-finished glass-based Mini LED backlight substrate material in a 500℃~600℃ annealing furnace, and then slowly cooling it to room temperature as the annealing furnace is used. After cutting and inspection, the substrate glass for Mini LED backlight is obtained.

[0054] Example 2

[0055] Example 2 of the present application provides a method for preparing a glass-based Mini LED backlight substrate material, wherein the preparation method includes raw material preparation, melting glass liquid in a melting furnace, thinning and forming in a tin bath, and annealing and cutting. The steps of melting glass liquid in a melting furnace, thinning and forming in a tin bath, and annealing and cutting in the preparation method of this embodiment are the same as those of Example 1. The difference from Example 1 is that the step of raw material preparation includes: mainly using silica sand and feldspar to introduce SiO2, mainly using boron ore, borax or boric acid to introduce B2O3, mainly using lanthanum carbonate or lanthanum oxide to introduce La2O3, mainly using dolomite and limestone to introduce alkaline earth metal oxides RO (CaO and MgO), and mainly using feldspar and carbonate to introduce R2O (Na2O and K2O); therefore, the present application is based on the glass-based Mini LED backlight substrate material. The components of the LED backlight substrate material include 71.2 mol% SiO2, 0.86 mol% Al2O3, 8 mol% Na2O, 2 mol% K2O, 8.64 mol% CaO, 7.2 mol% MgO, 1.2 mol% B2O3 and 0.9 mol% La2O3. The corresponding raw materials such as silica sand, feldspar, dolomite, limestone, borax, soda ash, lanthanum oxide are weighed and mixed evenly to obtain the glass-based Mini LED backlight substrate compound.

[0056] Example 3

[0057] Example 3 of the present application provides a method for preparing a glass-based Mini LED backlight substrate material, wherein the preparation method includes raw material preparation, melting glass liquid in a melting furnace, thinning and forming in a tin bath, and annealing and cutting. The steps of melting glass liquid in a melting furnace, thinning and forming in a tin bath, and annealing and cutting in the preparation method of this embodiment are the same as those of Example 1. The difference from Example 1 is that the step of raw material preparation includes: mainly using silica sand and feldspar to introduce SiO2, mainly using boron ore, borax or boric acid to introduce B2O3, mainly using lanthanum carbonate or lanthanum oxide to introduce La2O3, mainly using dolomite and limestone to introduce alkaline earth metal oxides RO (CaO and MgO), and mainly using feldspar and carbonate to introduce R2O (Na2O and K2O). Therefore, the present application is based on the glass-based Mini LED backlight substrate material. The components of the LED backlight substrate material include 69.5 mol% SiO2, 1.2 mol% Al2O3, 8.5 mol% Na2O, 3 mol% K2O, 9.3 mol% CaO, 6.5 mol% MgO, 1.3 mol% B2O3 and 0.7 mol% La2O3. The corresponding raw materials such as silica sand, feldspar, dolomite, limestone, boric acid, soda ash, lanthanum oxide are weighed and mixed evenly to obtain the glass-based Mini LED backlight substrate compound.

[0058] Example 4

[0059] Example 4 of the present application provides a method for preparing a glass-based Mini LED backlight substrate material, wherein the preparation method includes raw material preparation, melting glass liquid in a melting furnace, thinning and forming in a tin bath, and annealing and cutting. The steps of melting glass liquid in a melting furnace, thinning and forming in a tin bath, and annealing and cutting in the preparation method of this embodiment are the same as those of Example 1. The difference from Example 1 is that the step of raw material preparation includes: mainly using silica sand and feldspar to introduce SiO2, mainly using boron ore, borax or boric acid to introduce B2O3, mainly using lanthanum carbonate or lanthanum oxide to introduce La2O3, mainly using dolomite and limestone to introduce alkaline earth metal oxides RO (CaO and MgO), and mainly using feldspar and carbonate to introduce R2O (Na2O and K2O); therefore, the present application is based on the glass-based Mini LED backlight substrate material. The components of the LED backlight substrate material include 70.1 mol% SiO2, 1.1 mol% Al2O3, 7.4 mol% Na2O, 2.5 mol% K2O, 8.8 mol% CaO, 6.8 mol% MgO, 1.8 mol% B2O3 and 1.5 mol% La2O3. The corresponding raw materials such as silica sand, feldspar, dolomite, limestone, boric acid, soda ash, lanthanum carbonate are weighed and mixed evenly to obtain the glass-based Mini LED backlight substrate compound.

[0060] Example 5

[0061] Example 5 of the present application provides a method for preparing a glass-based Mini LED backlight substrate material, wherein the preparation method includes raw material preparation, melting glass liquid in a melting furnace, thinning and forming in a tin bath, and annealing and cutting. The steps of melting glass liquid in a melting furnace, thinning and forming in a tin bath, and annealing and cutting in the preparation method of this embodiment are the same as those of Example 1. The difference from Example 1 is that the step of raw material preparation includes: mainly using silica sand and feldspar to introduce SiO2, mainly using boron ore, borax or boric acid to introduce B2O3, mainly using lanthanum carbonate or lanthanum oxide to introduce La2O3, mainly using dolomite and limestone to introduce alkaline earth metal oxides RO (CaO and MgO), and mainly using feldspar and carbonate to introduce R2O (Na2O and K2O); therefore, the present application is based on the glass-based Mini LED backlight substrate material. The components of the LED backlight substrate material include 71 mol% SiO2, 0.93 mol% Al2O3, 7.5 mol% Na2O, 1.8 mol% K2O, 8.47 mol% CaO, 6.5 mol% MgO, 2 mol% B2O3 and 1.8 mol% La2O3. The corresponding raw materials such as silica sand, feldspar, dolomite, limestone, borax, soda ash, lanthanum oxide are weighed and mixed evenly to obtain the glass-based Mini LED backlight substrate compound.

[0062] Example 6

[0063] Example 6 of the present application provides a method for preparing a glass-based Mini LED backlight substrate material, wherein the preparation method includes raw material preparation, melting glass liquid in a melting furnace, thinning and forming in a tin bath, and annealing and cutting. The steps of melting glass liquid in a melting furnace, thinning and forming in a tin bath, and annealing and cutting in the preparation method of this embodiment are the same as those of Example 1. The difference from Example 1 is that the step of raw material preparation includes: mainly using silica sand and feldspar to introduce SiO2, mainly using boron ore, borax or boric acid to introduce B2O3, mainly using lanthanum carbonate or lanthanum oxide to introduce La2O3, mainly using dolomite and limestone to introduce alkaline earth metal oxides RO (CaO and MgO), and mainly using feldspar and carbonate to introduce R2O (Na2O and K2O). Therefore, the present application is based on the glass-based Mini LED backlight substrate material. The components of the LED backlight substrate material include 69 mol% SiO2, 1.15 mol% Al2O3, 10 mol% Na2O, 1.8 mol% K2O, 7.9 mol% CaO, 7.55 mol% MgO, 1.6 mol% B2O3 and 1 mol% La2O3. The corresponding raw materials such as silica sand, feldspar, dolomite, limestone, borax, soda ash, lanthanum carbonate are weighed and mixed evenly to obtain the glass-based Mini LED backlight substrate compound.

[0064] Example 7

[0065] Example 7 of the present application provides a method for preparing a glass-based Mini LED backlight substrate material, wherein the preparation method includes raw material preparation, melting glass liquid in a melting furnace, thinning and forming in a tin bath, and annealing and cutting. The steps of melting glass liquid in a melting furnace, thinning and forming in a tin bath, and annealing and cutting in the preparation method of this embodiment are the same as those of Example 1. The difference from Example 1 is that the step of raw material preparation includes: mainly using silica sand and feldspar to introduce SiO2, mainly using boron ore, borax or boric acid to introduce B2O3, mainly using lanthanum carbonate or lanthanum oxide to introduce La2O3, mainly using dolomite and limestone to introduce alkaline earth metal oxides RO (CaO and MgO), and mainly using feldspar and carbonate to introduce R2O (Na2O and K2O). Therefore, the present application is based on the glass-based Mini LED backlight substrate material. The components of the LED backlight substrate material include 71.5 mol% SiO2, 1 mol% Al2O3, 9 mol% Na2O, 1.5 mol% K2O, 6.9 mol% CaO, 7.2 mol% MgO, 1.5 mol% B2O3 and 1.4 mol% La2O3. The corresponding raw materials such as silica sand, feldspar, dolomite, limestone, borax, soda ash, lanthanum oxide are weighed and mixed evenly to obtain the glass-based Mini LED backlight substrate compound.

[0066] Example 8

[0067] Example 8 of the present application provides a method for preparing a glass-based Mini LED backlight substrate material, wherein the preparation method includes raw material preparation, melting glass liquid in a melting furnace, thinning and forming in a tin bath, and annealing and cutting. The steps of melting glass liquid in a melting furnace, thinning and forming in a tin bath, and annealing and cutting in the preparation method of this embodiment are the same as those of Example 1. The difference from Example 1 is that the step of raw material preparation includes: mainly using silica sand and feldspar to introduce SiO2, mainly using boron ore, borax or boric acid to introduce B2O3, mainly using lanthanum carbonate or lanthanum oxide to introduce La2O3, mainly using dolomite and limestone to introduce alkaline earth metal oxides RO (CaO and MgO), and mainly using feldspar and carbonate to introduce R2O (Na2O and K2O). Therefore, the present application is based on the glass-based Mini LED backlight substrate material. The components of the LED backlight substrate material include 71.47 mol% SiO2, 0.9 mol% Al2O3, 9 mol% Na2O, 1.2 mol% K2O, 7.5 mol% CaO, 6.93 mol% MgO, 1 mol% B2O3 and 2 mol% La2O3. The corresponding raw materials such as silica sand, feldspar, dolomite, limestone, borax, soda ash, lanthanum carbonate are weighed and mixed evenly to obtain the glass-based Mini LED backlight substrate compound.

[0068] Example 9

[0069] Example 9 of the present application provides a method for preparing a glass-based Mini LED backlight substrate material, wherein the preparation method includes raw material preparation, melting glass liquid in a melting furnace, thinning and forming in a tin bath, and annealing and cutting. The steps of melting glass liquid in a melting furnace, thinning and forming in a tin bath, and annealing and cutting in the preparation method of this embodiment are the same as those of Example 1. The difference from Example 1 is that the step of raw material preparation includes: mainly using silica sand and feldspar to introduce SiO2, mainly using boron ore, borax or boric acid to introduce B2O3, mainly using dolomite and limestone to introduce alkaline earth metal oxides RO (CaO and MgO), and mainly using feldspar and carbonate to introduce R2O (Na2O and K2O); therefore, the present application is based on the glass-based Mini LED backlight substrate material. The components of the LED backlight substrate material include 70.7 mol% SiO2, 1.3 mol% Al2O3, 6.7 mol% Na2O, 3.8 mol% K2O, 9 mol% CaO, 5.6 mol% MgO, 2.9 mol% B2O3 and 0 mol% La2O3. The corresponding raw materials such as silica sand, feldspar, dolomite, limestone, boric acid, soda ash are weighed and mixed evenly to obtain the glass-based Mini LED backlight substrate compound.

[0070] Comparative Example 1

[0071] Comparative Example 1 of the present application provides a method for preparing a glass-based Mini LED backlight substrate material, wherein the preparation method includes raw material preparation, melting glass liquid in a melting furnace, thinning and forming in a tin bath, and annealing and cutting. The steps of melting glass liquid in a melting furnace, thinning and forming in a tin bath, and annealing and cutting in the preparation method of this embodiment are the same as those of Example 1. The difference from Example 1 is that the step of raw material preparation includes: mainly using silica sand and feldspar to introduce SiO2, mainly introducing alkaline earth metal oxides RO (CaO and MgO) through dolomite and limestone, and mainly introducing R2O (Na2O and K2O) through feldspar and carbonate; therefore, the present application is based on the glass-based Mini LED backlight substrate material. The components of the LED backlight substrate material include 75 mol% SiO2, 1.6 mol% Al2O3, 11 mol% Na2O, 2.4 mol% K2O, 8 mol% CaO, 4 mol% MgO, 0 mol% B2O3 and 0 mol% La2O3. The corresponding raw materials such as silica sand, feldspar, dolomite, limestone, soda ash, etc. are weighed and mixed evenly to obtain the glass-based Mini LED backlight substrate compound.

[0072] Comparative Example 2

[0073] Comparative Example 2 of the present application provides a method for preparing a glass-based Mini LED backlight substrate material, wherein the preparation method includes raw material preparation, melting glass liquid in a melting furnace, thinning and forming in a tin bath, and annealing and cutting. The steps of melting glass liquid in a melting furnace, thinning and forming in a tin bath, and annealing and cutting in the preparation method of this embodiment are the same as those of Example 1. The difference from Example 1 is that the raw material preparation step includes:

[0074] SiO2 is mainly introduced by silica sand and feldspar, B2O3 is mainly introduced through borax, borax or boric acid, La2O3 is mainly introduced through lanthanum carbonate or lanthanum oxide, alkaline earth metal oxides RO (CaO and MgO) are mainly introduced through dolomite and limestone, and R2O (Na2O and K2O) is mainly introduced through feldspar and carbonate; therefore, this application follows the formula ratio of 69 mol% SiO2, 1.7 mol% Al2O3, 10.6 mol% Na2O, 3 mol% K2O, 7.4 mol% CaO, 4.3 mol% MgO, 1 mol% B2O3 and 3 mol% La2O3 in the components of the glass-based Mini LED backlight substrate material, weighs the corresponding raw materials such as silica sand, feldspar, dolomite, limestone, borax, soda ash, lanthanum carbonate, etc., mixes them evenly, and obtains the glass-based Mini LED backlight substrate compound.

[0075] Test Example 1

[0076] Test Example 1 of the present application performs performance tests on the glass-based Mini LED backlight substrate materials provided in Examples 1-9 and Comparative Examples 1-2. The performance test process refers to the test process in the group standard TCSTM 01039-2023. Among them, the formula ratios of the glass-based Mini LED backlight substrate materials provided in Examples 1-9 and Comparative Examples 1-2 are shown in Table 1, and the test results are shown in Table 2.

[0077]

[0078] Table 1

[0079]

[0080] Table 2

[0081] As can be seen from Table 1, compared with the glass-based Mini LED backlight substrate material provided in Comparative Example 1, the expansion coefficient of the glass-based Mini LED backlight substrate material prepared in Examples 1-9 is lower, and the expansion coefficient does not exceed 87*10 -7 / ℃, meeting the group standard TCSTM 01039-2023, the expansion coefficient is not greater than 90*10 -7 / ℃ requirement, while the expansion coefficient of the glass-based Mini LED backlight substrate material provided in Comparative Example 1 exceeds 90*10 -7 / ℃; at the same time, the thermal conductivity of the glass-based Mini LED backlight substrate material prepared in Examples 1-9 of the present application exceeds 1.12W / (m∙K), meeting the requirement of the group standard TCSTM01039-2023 that the thermal conductivity is not less than 1.1W / (m∙K), while the thermal conductivity of the glass-based Mini LED backlight substrate material provided in Comparative Example 1 is 0.7W / (m∙K); at the same time, the fracture toughness of the glass-based Mini LED backlight substrate material prepared in Examples 1-9 of the present application is greater than 0.9MPa∙m 1 / 2 , Lg room temperature surface resistivity is greater than 13.5 / Ω∙cm and the strain point temperature is greater than 510°C; this shows that the glass-based backlight substrates of Examples 1-9 of the present application, by introducing an effective combination of various oxides, play a synergistic role in the melting and molding processes, so that the glass-based Mini LED backlight substrate material is not easily expanded and deformed by heat during long-term use, and can be seamlessly spliced ​​when participating in the packaging of Mini LED displays. The dimensions are stable after encapsulating Mini LEDs, and at the same time, it can efficiently dissipate heat, which is beneficial to improving the luminous efficiency of Mini LED displays, thereby overcoming the defect of poor performance of backlight substrate materials in current Mini LED displays; therefore, the Mini LED backlight substrate materials provided in Examples 1-9 of the present application have better performance such as expansion coefficient, thermal conductivity, fracture toughness, Lg room temperature surface resistivity and strain point temperature, and can meet the requirements of glass-based Mini LED backlight substrate materials. However, the glass-based Mini LED backlight substrate material provided in Comparative Example 1 is an inferior product, does not meet the group standard TCSTM 01039-2023, and cannot be used in practice.

[0082] At the same time, compared with the glass-based Mini LED backlight substrate material prepared by adding 3 mol% La2O3 provided in Comparative Example 2, a maximum of 2 mol% La2O3 was added during the preparation of the glass-based Mini LED backlight substrate material in Examples 1-9. This is because the excessive lanthanum oxide is difficult to control during the production process, which refers to process control, that is, the material properties become shorter, making it difficult to control the production of the glass of the required size and thickness, and the upper limit of crystallization becomes higher, which may cause production risks and blockage of the material channel, which is a very serious production accident.

[0083] In addition, during the preparation of glass-based Mini LED backlight substrate materials, excessive La2O3 was added, which affected the content of oxides such as silicon oxide, aluminum oxide, alkaline earth metal oxides and alkali metal oxides in the glass-based Mini LED backlight substrate materials, and affected the synergistic effect of various oxides during the melting and molding process, resulting in defects such as increased expansion coefficient, decreased thermal conductivity, decreased fracture toughness, decreased Lg room temperature surface resistivity and increased strain point temperature. As a result, the performance of the glass-based Mini LED backlight substrate material has declined, and it does not meet the requirements of the group standard TCSTM 01039-2023 and cannot be used in Mini LED displays.

[0084] Each embodiment is only used to illustrate the technical solution of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, a person skilled in the art should understand that the technical solutions described in the aforementioned embodiments can still be modified, or some or all of the technical features therein can be replaced by equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solution to deviate from the scope of the technical solution of the embodiments of the present application.

Claims

1. A glass-based Mini LED backlight substrate material, characterized in that: The raw materials of the glass-based Mini LED backlight substrate material are composed of SiO2, Al2O3, RO, R2O, La2O3 and B2O3; Among them, RO is CaO and MgO in alkaline earth metal oxides, and R2O is Na2O and K2O in alkali metal oxides; La2O3 content is 0.1 to 2 mol%; The B2O3 content is 0.1-3 mol%, and the sum of SiO2 and B2O3 content is 68-75 mol%; Al2O3 is 0.8-1.3 mol%; The sum of the contents of RO and R2O is 24.2-28 mol%, and the molar ratio of RO to R2O is 1.25-2.

2. The method for preparing a glass-based Mini LED backlight substrate material according to claim 1, characterized in that: Including steps: Step S1: mixing silica sand, feldspar, dolomite, limestone, colemanite, soda ash, and lanthanum carbonate to obtain a glass-based MiniLED backlight substrate batch material; Step S2: adding the glass-based Mini LED backlight substrate batch material into an all-oxygen melting furnace to melt into glass liquid to obtain a glass-based Mini LED backlight substrate liquid; Step S3: Thinning the glass-based Mini LED backlight substrate liquid in a tin bath to obtain a semi-finished glass-based Mini LED backlight substrate material; Step S4: anneal and cut the semi-finished glass-based Mini LED backlight substrate material in sequence to obtain a glass-based Mini LED backlight substrate material.

3. The method for preparing a glass-based Mini LED backlight substrate material according to claim 2, wherein: In step S2, the temperature for melting in the all-oxygen melting furnace is 1550-1600° C., and the kiln pressure is less than 5 Pa.

4. The method for preparing a glass-based Mini LED backlight substrate material according to claim 2, wherein: In step S3, the temperature of the thinning process in the tin bath is 650-1100°C.

5. The method for preparing a glass-based Mini LED backlight substrate material according to claim 2, wherein: In step S4, the annealing temperature is 500-600°C.

6. Application of the glass-based Mini LED backlight substrate material according to claim 1 in a Mini LED display.

7. A glass-based Mini LED backlight substrate, characterized in that: It is prepared from the glass-based MiniLED backlight substrate material described in claim 1.

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