A self-brazing aluminum alloy laminated composite material, manufacturing method and application

Abstract

The application discloses a self-brazing aluminum alloy laminated composite material, a manufacturing method and application, relates to the technical field of self-brazing aluminum alloy, and comprises a core layer and a self-brazing layer. The components and mass percentage of the core layer are as follows: Si, 0.5-1.5%; Mg, 0.3-1.0%; Cu, 0.1-0.5%; Mn+Cr, 0.1-0.5%; Ti+Zr, 0.05-0.2%; and the balance of Al and inevitable impurities. The mass ratio of Mn to Cr is 1-2, and the mass ratio of Ti to Zr is 1-1.5. The components of the self-brazing layer comprise Al-Si alloy powder and rare earth element additives, and the mass percentage of the rare earth element additives is 0.1-0.5% of the total mass of the self-brazing layer. The rare earth element additives improve the brazing performance and oxidation resistance of the material and improve the stability of the material at high temperatures. A bonding surface is formed between the core layer and the self-brazing layer.

Description

Technical Field

[0001] This invention relates to the field of self-brazing aluminum alloy technology, and in particular to a self-brazing aluminum alloy layered composite material, its manufacturing method, and its application. Background Technology

[0002] Aluminum alloys are widely used in aerospace, automotive, and construction industries due to their excellent thermal conductivity and corrosion resistance. However, aluminum alloys have poor brazing properties and are easily deformed by factors such as stress and temperature. This deformation can lead to a decline in the performance of aluminum alloys, requiring frequent replacements and limiting their application in certain fields. Summary of the Invention

[0003] The purpose of this invention is to overcome the shortcomings of the prior art and provide a self-brazing aluminum alloy layered composite material, a manufacturing method, and an application. Compared with the prior art, the composite material provided by the disclosed solution in this invention is more stable and can be applied in a wider range of fields.

[0004] This invention is achieved through the following technical solution: This invention discloses a self-brazing aluminum alloy layered composite material, comprising:

[0005] Core layer 1, its components and their mass percentages are as follows: Si: 0.5%~1.5%, Mg: 0.3%~1.0%, Cu: 0.1%~0.5%, Mn+Cr: 0.1%~0.5%, the addition of manganese and chromium elements improves the corrosion resistance and mechanical strength of the material, Ti+Zr: 0.05%~0.2%, the addition of titanium and zirconium elements can refine the grain structure, improve the strength and plasticity of the material, improve the microstructure of the material, thereby improving its overall performance, the balance is Al and unavoidable impurities, the mass ratio of Mn to Cr is 1~2, and the mass ratio of Ti to Zr is 1~1.5;

[0006] The self-brazing layer 2 is composed of Al-Si alloy powder and rare earth element additives. The rare earth element additives include at least one of La, Ce, and Pr. The mass percentage of the rare earth element additives is 0.1% to 0.5% of the total mass of the self-brazing layer. The rare earth element additives improve the brazing performance and oxidation resistance of the material and enhance the stability of the material at high temperatures.

[0007] A bonding surface is formed between the core layer and the self-soldering layer.

[0008] This invention also discloses a method for manufacturing a self-brazing aluminum alloy layered composite material, comprising:

[0009] Prepare the core layer material and self-soldering layer material by mixing the specified components and their mass percentages. The core layer material includes elements such as Si, Mg, Cu, Mn+Cr, and Ti+Zr, while the self-soldering layer material includes Al-Si alloy powder and rare earth element additives.

[0010] The core material is processed to form a uniform ingot, and the ingot is processed to form a flat first substrate.

[0011] The first substrate includes a first surface and a second surface arranged opposite to each other, and equally spaced strip-shaped grooves are formed on the first surface of the first substrate;

[0012] The core layer and the self-soldering layer are brought into contact and heated to a first temperature. A bonding surface is formed between the core layer and the self-soldering layer through a hot rolling composite process, forming a second substrate and completing the manufacturing of the composite material.

[0013] Preferably, the step of forming the mating surface includes:

[0014] The core layer and self-brazing layer materials, heated to a first temperature, are fed into a hot rolling mill for rolling to form a composite layer;

[0015] After rolling, the composite layer needs to be cooled to form a bonding surface.

[0016] The present invention also discloses an application of a self-brazing aluminum alloy layered composite material, including a second substrate, wherein a glass substrate is arranged on the side surface of the second substrate away from the strip groove.

[0017] In this design, a circuit layer is formed on the surface of the glass substrate away from the second substrate, and the circuit layer is connected to the light-emitting unit.

[0018] Preferably, the light-emitting unit includes:

[0019] A light-emitting device, wherein at least one light-emitting device is disposed on the surface of a glass substrate;

[0020] The first conductive medium is used to connect the light-emitting device and the circuit layer.

[0021] The second conductive dielectric layer is located on the same side of the glass substrate as the light-emitting device.

[0022] In this case, the orthographic projection of the second conductive dielectric layer on the surface of the glass substrate does not overlap with the orthographic projection of the light-emitting device on the surface of the glass substrate.

[0023] Preferably, the light-emitting unit further includes a photothermal conversion layer disposed on the surface of the glass substrate;

[0024] A second conductive dielectric layer is arranged on the surface of the photothermal conversion layer away from the glass substrate.

[0025] The photothermal conversion layer is located directly above the strip-shaped groove, corresponding to the position of the strip-shaped groove.

[0026] Preferably, the light-emitting unit further includes a dimming layer, which is located directly above the second conductive dielectric layer;

[0027] The side surface of the dimming layer facing the second conductive dielectric layer is configured to focus light.

[0028] Preferably, the light-emitting unit further includes an encapsulation unit;

[0029] The packaging unit includes a shell component, the shell component is arranged with a housing cavity, and at least a light-emitting device and a second conductive dielectric layer are arranged in the housing cavity;

[0030] Alternatively, the packaging unit includes a barrier component located on the periphery of the integral formed by the light-emitting device and the second conductive dielectric layer, and the barrier component is made of an opaque material.

[0031] Preferably, the step of transferring the light-emitting device to the surface of the glass substrate includes:

[0032] A welding area is formed on the surface of a glass substrate to prepare a transfer substrate. The transfer substrate includes a transient substrate arranged corresponding to the glass substrate, a first transfer layer arranged on the surface of the transient substrate, and a second transfer layer arranged on the surface of the transient substrate. The first transfer layer and the second transfer layer are located on the same side surface of the transient substrate, and the first transfer layer and the second transfer layer are arranged at intervals.

[0033] A plurality of light-emitting devices are arranged on the surface of the first substrate. The transfer substrate is aligned with the first substrate so that the top of the light-emitting devices is adsorbed by the second transfer layer.

[0034] A plurality of second conductive dielectric layers are disposed on the surface of the second substrate. The transfer substrate is aligned with the second substrate so that the first transfer layer is adsorbed onto the top of the second conductive dielectric layer.

[0035] A first conductive dielectric is covered at the electrode position of the light-emitting device, and an adhesive layer is covered at the bottom of the second conductive dielectric layer.

[0036] The electrodes of the light-emitting device on the surface of the transfer substrate are aligned with the welding area of ​​the glass substrate, so that the electrodes of the light-emitting device contact the welding area and the adhesive layer contacts the glass substrate. After the second conductive dielectric layer cures, the transfer of the light-emitting device is completed.

[0037] Preferably, the process also includes a repair procedure for the light-emitting device, the specific steps of which include:

[0038] Confirm the status of the light-emitting device and determine whether the light-emitting device is connected to the circuit layer through the first conductive medium;

[0039] When the light-emitting device and the circuit layer are not connected through the first conductive medium, the second conductive medium layer is heated until it reaches the first temperature state, at which point the second conductive medium layer changes from a solid state to a liquid state.

[0040] When the liquid second conductive dielectric layer fills to the position of the first conductive dielectric, the heating of the first conductive dielectric is stopped;

[0041] Once the liquid second conductive dielectric layer has solidified, the repair of the light-emitting device is complete.

[0042] This invention discloses a self-brazing aluminum alloy layered composite material, its manufacturing method, and its application, compared with the prior art:

[0043] This invention discloses a self-brazing aluminum alloy layered composite material and its application in light-emitting devices. The composite material consists of a core layer and a self-brazing layer, exhibiting excellent thermal conductivity and mechanical strength. The core layer's properties are optimized by adding elements such as Si, Mg, Cu, Mn+Cr, and Ti+Zr, while the self-brazing layer contains Al-Si alloy powder and rare earth element additives to improve the material's brazing performance and oxidation resistance. A bonding surface is formed between the core layer and the self-brazing layer through a hot-rolling composite process, ensuring a tight bond between the two layers. By using the self-brazing aluminum alloy layered composite material as a second substrate and combining it with a glass substrate to form a composite structure, effective protection and efficient heat dissipation of the glass substrate are achieved. Attached Figure Description

[0044] Figure 1 This is a schematic flowchart of a composite material manufacturing method in one embodiment;

[0045] Figure 2 This is a schematic diagram illustrating the different steps in the manufacturing process of a composite material according to an embodiment;

[0046] Figure 3 This is a schematic diagram showing the connection between the light-emitting unit and the glass substrate in one embodiment;

[0047] Figure 4 This is a schematic diagram of the structure of the light-emitting unit in one embodiment;

[0048] Figure 5 This is a schematic diagram showing the connection between the light-emitting unit and the glass substrate in another embodiment;

[0049] Figure 6 This is a schematic diagram showing the connection between the light-emitting unit and the glass substrate in another embodiment;

[0050] Figure 7 This is a schematic diagram of the focusing state of the dimming layer in one embodiment;

[0051] Figure 8 This is a schematic diagram showing the connection between the light-emitting unit and the glass substrate in another embodiment;

[0052] Figure 9 This is a schematic diagram of the structure of a transfer substrate in one embodiment;

[0053] Figure 10 This is a schematic diagram of the corresponding states during the transfer process in one embodiment;

[0054] Figure 11 This is a schematic diagram of the repair process for a light-emitting device in one embodiment;

[0055] Figure 12 This is a schematic diagram of the structure of a light-emitting device in one embodiment. Detailed Implementation

[0056] The following description, provided with reference to the accompanying drawings, is intended to aid in a thorough understanding of the various exemplary embodiments of the present disclosure as defined by the claims and their equivalents. This description includes numerous details to aid understanding, but these details will be considered exemplary only. Accordingly, those skilled in the art will recognize that various changes and modifications can be made to the various embodiments described herein without departing from the scope and spirit of the present disclosure. Furthermore, for clarity and brevity, descriptions of well-known functions and structures may be omitted.

[0057] It will be understood that when an element or layer is referred to as being "on," "connected to," or "attached to" another element or layer, it may be directly on, directly connected to, or attached to that other element or layer, or one or more intermediate elements or layers may also exist. When an element is referred to as being "directly on," "directly connected to," or "directly attached to" another element or layer, no intermediate elements or layers exist.

[0058] It will be understood that while the terms first, second, third, etc., may be used herein to describe various elements, components, regions, layers, and / or segments, these elements, components, regions, layers, and / or segments should not be limited to these terms. These terms are used to distinguish one element, component, region, layer, or segment from another element, component, region, layer, or segment. Therefore, without departing from the teachings of the exemplary embodiments, the first element, first component, first display area, first layer, or first segment discussed below may be referred to as a second element, second component, second display area, second layer, or second segment. In the accompanying drawings, for clarity of illustration, the dimensions of various elements, layers, etc., may be exaggerated.

[0059] In the following, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0060] One embodiment of the present invention discloses a self-brazing aluminum alloy layered composite material, comprising a core layer 1 and a self-brazing layer 2. The components and their mass percentages of the core layer 1 are as follows: Si: 0.5%–1.5%, Mg: 0.3%–1.0%, Cu: 0.1%–0.5%, Mn+Cr: 0.1%–0.5%, with the addition of manganese and chromium elements improving the corrosion resistance and mechanical strength of the material; Ti+Zr: 0.05%–0.2%, with the addition of titanium and zirconium elements refining the grain structure, improving the strength and plasticity of the material, and improving the microstructure of the material, thereby enhancing its properties. The overall performance is improved, with the balance being Al and unavoidable impurities. The mass ratio of Mn to Cr is 1 to 2, and the mass ratio of Ti to Zr is 1 to 1.5. The self-brazing layer 2 is composed of Al-Si alloy powder and rare earth element additives. The rare earth element additives include at least one of La, Ce, and Pr. The mass percentage of rare earth element additives is 0.1% to 0.5% of the total mass of the self-brazing layer. The rare earth element additives improve the brazing performance and oxidation resistance of the material, and enhance the stability of the material at high temperatures. A bonding surface is formed between the core layer and the self-brazing layer.

[0061] Experiments were conducted on the properties of the above-mentioned composite materials, and three groups of materials were selected;

[0062] The first group of materials is sample A. The core layer 1 consists of Si: 0.5%, Mg: 0.3%, Cu: 0.1%, Mn+Cr: 0.2%, Ti+Zr: 0.1%, with a mass ratio of Mn to Cr of 1 and a mass ratio of Ti to Zr of 1. The balance is Al and unavoidable impurities, with a mass ratio of Mn to Cr of 1.2 and a mass ratio of Ti to Zr of 1.5. The self-soldering layer 2 consists of Al-Si alloy powder and rare earth element additives. The rare earth element additive is La, and the mass percentage of the rare earth element additive is 0.3% of the total mass of the self-soldering layer.

[0063] The second group of materials is sample B, which is 7054 aluminum alloy.

[0064] First experiment:

[0065] Prepare a standard-sized sample, where the size can be 100mm x 100mm x 1mm.

[0066] The thermal conductivity of the two samples was measured using a thermal conductivity meter.

[0067] The measurements were repeated at different temperatures (e.g., room temperature, 100℃, 200℃, 300℃) to detect the effect of temperature on thermal conductivity. The data are shown in Table 1.

[0068]

[0069] Table 1

[0070] The data shows that the thermal conductivity of the material of this invention (sample A) is higher than that of the traditional aluminum alloy (sample B) at all temperatures, proving its excellent thermal conductivity.

[0071] Second experiment:

[0072] Prepare a standard-sized tensile specimen, where the size can be 100mm x 100mm x 1mm.

[0073] Tensile tests were performed using a universal testing machine, and the maximum tensile force and the tensile force corresponding to the yield point were recorded.

[0074] Calculate the tensile strength and yield strength.

[0075] The data is shown in Table 2:

[0076]

[0077] Table 2

[0078] Data analysis: The tensile strength and yield strength of the material of this invention (sample A) are higher than those of the traditional aluminum alloy (sample B), indicating that its mechanical properties are superior.

[0079] Please refer to Figure 1 and Figure 2 In one embodiment, a method for manufacturing a self-brazing aluminum alloy layered composite material is disclosed, the steps of which include:

[0080] Step 1: Prepare the core layer material and self-soldering layer material by mixing the ingredients according to the specified components and their mass percentages.

[0081] The specific core layer material composition includes elements such as Si, Mg, Cu, Mn+Cr, Ti+Zr, etc., while the self-soldering layer material includes Al-Si alloy powder and rare earth element additives.

[0082] Step 2: The core layer 1 material is processed to form a uniform ingot. The ingot is then processed to form a flat first substrate.

[0083] In the specific casting process, the casting temperature is controlled between 680℃ and 730℃, and the casting speed is between 500mm / min and 1500mm / min to ensure the quality of the ingot. After the ingot is formed, it is processed through hot rolling, cold rolling, and other processes to form a flat first substrate. During the processing, the processing temperature needs to be controlled between 400℃ and 500℃, and the processing speed is adjusted according to the equipment capacity and material properties to avoid material deformation and cracking.

[0084] Step 3: The first substrate includes a first surface and a second surface arranged opposite to each other, and equally spaced strip-shaped grooves are formed on the first surface of the first substrate;

[0085] The specific dimensions and spacing of the grooves need to be designed according to the specific application requirements. For example, the depth of the grooves can be between 0.5mm and 2mm, and the spacing can be between 5mm and 20mm. The grooves can be formed by milling, laser cutting, etc.

[0086] Step 4: Bring the core layer 1 and self-soldering layer 2 into contact and heat them to a first temperature. Then, use a hot-rolling composite process to form a bonding surface between the core layer and the self-soldering layer, creating the second substrate and completing the composite material manufacturing process.

[0087] The specific heating temperature is controlled between 500℃ and 600℃ to ensure that the core layer and self-brazing layer materials reach a suitable temperature for composite bonding. Then, a hot rolling composite process is used to form a bonding surface between the core layer and the self-brazing layer. During the hot rolling composite process, the rolling reduction is adjusted according to the material thickness and performance requirements, and the rolling speed is controlled between 1m / min and 10m / min. After hot rolling composite is completed, it is cooled using an appropriate cooling method (such as water quenching or air cooling) to fix the structure and properties of the composite material.

[0088] Furthermore, the steps for forming the bonding surface include:

[0089] The core layer and self-brazing layer materials, heated to a first temperature, are fed into a hot rolling mill for rolling to form a composite layer.

[0090] Specifically, the heating temperature is controlled between 500℃ and 600℃ to ensure that the core layer and self-brazing layer materials reach a suitable temperature for composite bonding. In the hot rolling mill, the compression action of the rolls causes plastic deformation of the core layer and self-brazing layer materials at the contact surface, thereby achieving a tight bond. During this process, the rolling reduction is adjusted according to the material thickness and performance requirements, and the rolling speed is controlled between 1m / min and 10m / min to ensure that the material flows uniformly and forms a dense bonding surface.

[0091] After rolling, the composite layer needs to be cooled to form a bonding surface;

[0092] Specific cooling methods can include water cooling or air cooling to fix the structure and properties of the composite material.

[0093] This invention also discloses an application of a self-brazing aluminum alloy layered composite material; please refer to further details. Figure 2 Specifically, it includes a second substrate, on the side of the second substrate away from the strip groove, a glass substrate 3 is disposed and connected; wherein, a circuit layer is formed on the side of the glass substrate 3 away from the second substrate, and the circuit layer is connected to the light-emitting unit 4.

[0094] For the aforementioned composite material, applied to a light-emitting device, the second substrate is made of a self-soldering aluminum alloy layered composite material. The core layer material is improved in terms of thermal conductivity and mechanical strength by adding elements such as Si, Mg, Cu, Mn+Cr, and Ti+Zr. The self-soldering layer material is composed of Al-Si alloy powder and rare earth element additives. Furthermore, the mass percentage of rare earth element additives is 0.5% of the total mass of the self-soldering layer. The composite material has good mechanical strength and can effectively protect the glass substrate from external impacts and vibrations. Due to the large difference in thermal expansion coefficients between the glass substrate and the aluminum alloy material, direct connection may lead to stress concentration and cracking at the connection point. This invention uses a self-soldering layer as a transition layer to ensure a reliable connection between the two. A circuit layer is formed on the surface of the glass substrate away from the second substrate. The circuit layer is used to connect the light-emitting units, enabling current conduction and control. The circuit layer can be formed using traditional printed circuit board technology or semiconductor circuit processes, such as deposition, exposure, etching, and development. The light-emitting units are connected to the glass substrate through the circuit layer. The light-emitting units can be LED devices. Depending on the specific application requirements, the light-emitting units can be flexibly laid out and arranged on the glass substrate. To further improve the heat dissipation performance of the composite substrate, this invention designs equally spaced strip grooves on the second substrate. The groove design not only increases the contact area between the composite material and the external environment, improving heat dissipation efficiency, but also reduces the thermal stress concentration phenomenon of the material to a certain extent, improving the thermal stability of the material. For some weight-sensitive devices, the weight reduction achieved through the strip grooves can be directly fed back to the user, maintaining a lighter weight while providing excellent heat dissipation capabilities.

[0095] In one embodiment, the light-emitting unit 4 includes a light-emitting device 41, at least one light-emitting device 41 is disposed on the surface of the glass substrate 3; a first conductive medium 42, the light-emitting device 41 is connected to the circuit layer through the first conductive medium; and a second conductive medium layer 44, the second conductive medium layer 44 and the light-emitting device 41 are located on the same side of the glass substrate 3; wherein the orthographic projection of the second conductive medium layer 44 on the surface of the glass substrate 3 does not overlap with the orthographic projection of the light-emitting device 41 on the surface of the glass substrate 3.

[0096] The light-emitting device 41 includes at least one LED chip, which is precisely arranged on the surface of the glass substrate 3. The number of chips depends on the specific application requirements and can be one or more. Blue LEDs, white LEDs, etc., can be used. The light-emitting device 41 is precisely arranged on the surface of the glass substrate 3 through a soldering process. A first conductive medium 42 connects the light-emitting device 41 to the circuit layer to realize the transmission of electrical signals and ensure that the light-emitting device can work normally. The first conductive medium can be made of solder, conductive adhesive, or other conductive materials. The first conductive medium 42 connects the light-emitting device 41 to the circuit layer through a soldering process. During the connection process, it is necessary to ensure the reliability and stability of the connection to avoid performance degradation or failure due to poor contact or loosening. The above-mentioned materials have good conductivity and stability and can withstand the heat and current generated when the light-emitting device is working.

[0097] The second conductive dielectric layer 44 provides an alternative conductive path when the first conductive dielectric 42 between the light-emitting device 41 and the circuit layer experiences a poor solder joint or loses its conductivity. When a poor solder joint occurs, the second conductive dielectric in the corresponding area can be melted by local heating or other means, allowing it to flow and fill the poor solder joint area, thereby re-establishing the electrical connection between the light-emitting device and the circuit layer. The melting point of the material in the second conductive dielectric layer 44 is lower than that of the first conductive dielectric.

[0098] As mentioned above, please refer to Figure 3 and Figure 4 , Figure 3 This is a schematic diagram of the connection between the glass substrate and the light-emitting unit 4 in one embodiment. In this embodiment, the second conductive dielectric layer 44 is a solid material with conductive properties. When the first conductive dielectric layer 42 between the light-emitting device 41 and the circuit layer loses its conductivity, the second conductive dielectric layer 44 is heated by a laser device. Please continue to refer to... Figure 3 Position A is the laser focal point of the laser device. The laser focuses the laser on the surface of the second conductive dielectric layer 44. Through the reciprocating linear motion of the laser device, the second conductive dielectric layer 44 is melted, completing the repair. Please refer to [reference needed]. Figure 4 , Figure 4 To complete the repaired light-emitting unit 4, the first conductive medium 42 includes a solder paste layer 42a and a bonding point 42b. The bonding point 42b is formed on the surface of the glass substrate 3, and the bonding point 42b is conductive to the battery layer. The solder paste layer 42a contacts the light-emitting device 41 and the bonding point 42b. When the first conductive medium 42 between the light-emitting device 41 and the circuit layer loses its conductivity, the second conductive medium layer 44 is heated to make it flow and fill the non-conductive area.

[0099] Please refer to Figure 5In another embodiment, the light-emitting unit 4 further includes a photothermal conversion layer 43, which is disposed on the surface of the glass substrate 3; wherein, a second conductive dielectric layer is disposed on the surface of the photothermal conversion layer 43 away from the glass substrate 3; the photothermal conversion layer 43 is located directly above the strip groove and is arranged corresponding to the position of the strip groove.

[0100] Specifically, the photothermal conversion layer 43 further improves the heat dissipation performance and solder joint repair capability of the light-emitting unit. This layer is disposed on the surface of the glass substrate 3, directly above the strip-shaped groove, and corresponding to the position of the strip-shaped groove. The photothermal conversion layer 43 is made of materials with high light absorption and thermal conductivity, such as nano-carbon materials and black metal oxides. When light shines on the surface of the photothermal conversion layer 43, some light energy will be converted into heat energy. As the temperature rises, the photothermal conversion layer 43 will conduct heat to the underlying second conductive dielectric layer 44. When a solder joint occurs, the heating effect of the photothermal conversion layer 43 can accelerate the melting process of the corresponding area of ​​the second conductive dielectric layer, thereby filling the solder joint area more quickly and effectively, realizing the re-establishment of electrical connection, and thus solving the problem of the time required to melt the second conductive dielectric layer. Compared with the linear moving heating method of the laser mechanism, Figure 5 Although the structure in this embodiment is more complex, it has high stability, and the repair operation is relatively simple, requiring no special laser equipment.

[0101] In one embodiment, to achieve more efficient melting of the second conductive dielectric layer, the area containing the strip-shaped groove can be heated simultaneously with irradiation of the photothermal conversion layer 43 through the front of the glass substrate. Since the groove area corresponds to the second conductive dielectric layer, and the second substrate at this location is relatively thin, heating this area, in conjunction with the photothermal conversion layer 43, can quickly bring the second conductive dielectric layer into a fluid state, further improving repair efficiency. Once the second conductive dielectric layer is completely melted and fills the poorly soldered area, cooling and solidification can re-establish the electrical connection. This repair method eliminates the need to replace the light-emitting device or re-solder the entire circuit layer, offering advantages such as fast repair speed and low cost.

[0102] For further details, please refer to... Figure 6 and Figure 7 , Figure 6 This is a schematic diagram of the connection between another light-emitting unit and a glass substrate. The light-emitting unit 4 also includes a dimming layer 45, which is located directly above the second conductive dielectric layer 44. The side surface of the dimming layer 45 facing the second conductive dielectric layer 44 is configured to focus light.

[0103] Specifically, the dimming layer 45 can change the direction of light propagation, causing it to converge in a specific direction. Please refer to [reference needed]. Figure 7The diagram illustrates a possible structure of a dimming layer 45. In the light-emitting unit, the dimming layer is configured to focus light onto a region of the second conductive dielectric layer. Due to the concentrated light, the temperature in this region rises rapidly. When a cold solder joint occurs in the first conductive dielectric between the light-emitting device and the circuit layer, the second conductive dielectric layer, as a backup conductive path, needs to be rapidly melted to fill the cold solder joint area. One repair method might require external heating equipment to melt the second conductive dielectric layer, but this method is often inefficient and costly. The introduction of the dimming layer provides a new solution. Through the focusing effect of the dimming layer, light is concentrated onto a region of the second conductive dielectric layer, causing the temperature in this region to rise rapidly and exceed the melting point of the second conductive dielectric. As the temperature rises, the second conductive dielectric layer begins to melt and flows to the cold solder joint area for repair. This photothermal effect-based repair method eliminates the need for external heating equipment and has the advantages of fast repair speed and low cost.

[0104] Furthermore, the light-emitting unit 4 also includes an encapsulation unit.

[0105] In one embodiment, the packaging unit includes a shell member with a receiving cavity, and at least the light-emitting device 41 and the second conductive dielectric layer 44 are disposed in the receiving cavity; please refer to... Figure 3 The encapsulation unit is a shell component. During the solder joint repair process, the presence of the shell component prevents the molten second conductive medium from spreading to the unrepaired area. Since the second conductive medium layer is heated and melted during solder joint repair and flows to fill the solder joint area, without the protection of the encapsulation unit, the molten second conductive medium may spread to the surrounding area, causing unnecessary contamination and damage. The housing cavity design of the shell component confines the molten second conductive medium within the area, ensuring the accuracy and reliability of the repair process.

[0106] In yet another embodiment, please refer to Figure 8 , Figure 8 This is a schematic diagram of the connection between the glass substrate and another type of light-emitting unit 4. The encapsulation unit includes a barrier member 46. The barrier member 46 is located on the periphery of the whole formed by the light-emitting device 41 and the second conductive dielectric layer 44. The barrier member 46 is made of opaque material. Unlike the shell member, the barrier member does not form a closed cavity, but prevents interference and damage from the external environment through physical barriers.

[0107] The barrier component 46 is made of an opaque material, which not only prevents the molten second conductive medium from diffusing into the unrepaired area, but also avoids large-angle LED light from forming halos as stray light. When the light-emitting device is working, the LED chip emits light. If this light is scattered at a large angle, it may form unwanted halos, affecting the visual effect and user experience of some display devices. The opaque material of the barrier component effectively blocks these scattered lights, ensuring the concentrated and directional propagation of the light. The material of the barrier component can be a black UV adhesive layer.

[0108] As mentioned above, please refer to Figure 9 and Figure 10 , Figure 9 This is a schematic diagram of the transfer substrate structure. Figure 10 This is a schematic diagram of the corresponding states during the transfer process. The present invention achieves related applications by transferring the position of the light-emitting device and the second conductive dielectric layer. The steps of transferring the light-emitting device 41 to the surface of the glass substrate 3 include:

[0109] Step 1: A welding area is formed on the surface of the glass substrate 3 to prepare the transfer substrate 5. The transfer substrate 4 includes a transient substrate 51 arranged corresponding to the glass substrate 41, a first transfer layer 52 arranged on the surface of the transient substrate 51, and a second transfer layer 53 arranged on the surface of the transient substrate 51. The first transfer layer 52 and the second transfer layer 53 are located on the same side surface of the transient substrate 51, and the first transfer layer 52 and the second transfer layer 53 are arranged at intervals.

[0110] Specifically, the transient substrate, serving as a temporary carrier during the transfer process, primarily supports and fixes the light-emitting device and the second conductive dielectric layer. Glass is chosen as the material for the transient substrate to ensure its processing performance, mechanical strength, and compatibility with the transfer layers. The two transfer layers are located on the same side surface of the transient substrate and are spaced apart. Their main function is to adsorb the second conductive dielectric layer and the light-emitting device, respectively. During the transfer process, welding areas are first formed on the surface of the glass substrate 3. These welding areas will connect with the electrodes of the light-emitting device to ensure the transmission of electrical signals. Simultaneously, the transfer substrate 5 is prepared, ensuring that the surfaces of the first transfer layer 52 and the second transfer layer 53 are clean and flat. Multiple light-emitting devices 41 are then arranged on the surface of the first substrate (such as a temporary carrier). The light-emitting devices are arranged according to the expected layout and spacing. The transfer substrate 5 is aligned with the first substrate, so that the second transfer layer 53 contacts the top of the light-emitting device 41. Through the adsorption effect of the second transfer layer 53, the light-emitting device 41 is transferred from the first substrate to the transfer substrate 5. Multiple second conductive dielectric layers 44 are arranged on the surface of the second substrate (such as another temporary carrier). These conductive dielectric layers are used to establish an electrical connection between the light-emitting device and the glass substrate. Similarly, the transfer substrate 5 is aligned with the second substrate so that the top of the first transfer layer 52 contacts the top of the second conductive dielectric layer 44. Through the adsorption of the first transfer layer 52, the second conductive dielectric layer 44 is transferred onto the transfer substrate 5 and arranged correspondingly with the light-emitting device 41. In the above process, the spaced arrangement of the first transfer layer 52 and the second transfer layer 53 ensures that the first transfer layer 52 only adsorbs the second conductive dielectric layer 44, and the second transfer layer 53 only adsorbs the light-emitting device 41, avoiding confusion and interference between the two.

[0111] Step 2: A plurality of light-emitting devices 41 are arranged on the surface of the first substrate. The transfer substrate 5 is aligned with the first substrate so that the second transfer layer adsorbs the top of the light-emitting devices 41. In this step, the second transfer layer generates an adsorption force on its surface for the light-emitting devices 41 by applying conditions (such as heating, illumination, or power).

[0112] Step 3: A plurality of second conductive dielectric layers 44 are arranged on the surface of the second substrate. The transfer substrate 5 is aligned with the second substrate so that the first transfer layer is adsorbed onto the top of the second conductive dielectric layer 44.

[0113] Specifically, after alignment, the adsorption properties of the first transfer layer are utilized to adsorb onto the top of the second conductive dielectric layer 44. The first transfer layer can be made of a material with adhesive properties, enabling it to adhere tightly to the surface of the second conductive dielectric layer. The adhesion of the first transfer layer is sufficiently strong to ensure that the second conductive dielectric layer does not detach or shift during the transfer process. Through this step, the second conductive dielectric layer is successfully transferred from the second substrate to the transfer substrate. Subsequently, the transfer substrate, together with the second conductive dielectric layer, can be moved to the target location (such as a glass substrate), and the second conductive dielectric layer can be fixed to the glass substrate, thereby completing the entire transfer process.

[0114] Step 4: Cover the electrode position of the light-emitting device 41 with the first conductive dielectric 42, and cover the bottom of the second conductive dielectric layer 44 with an adhesive layer.

[0115] Specifically, the first conductive medium 42 enables the transmission of electrical signals between the light-emitting device and the substrate. The first conductive medium 42 is made of materials with high conductivity and good stability, such as solder or conductive adhesive. The first conductive medium 42 can effectively connect the electrodes of the light-emitting device to the corresponding solder points on the substrate, ensuring smooth current flow. The adhesive layer covering the bottom of the second conductive medium layer 44 is to enhance the adhesion between the second conductive medium layer and the glass substrate, preventing detachment or displacement during subsequent operations or use. It should be noted that the adsorption force between the adhesive layer and the glass substrate is much greater than the adsorption force between the first transfer layer and the second conductive medium layer 44.

[0116] Step 5: Align the electrodes of the light-emitting device 41 on the surface of the transfer substrate 5 with the welding area of ​​the glass substrate 3, so that the electrodes of the light-emitting device 41 contact the welding area and the adhesive layer contacts the glass substrate. After the second conductive dielectric layer 44 is cured, the transfer of the light-emitting device 41 is completed. At this time, the light-emitting device 41 is connected to the circuit layer through the second conductive dielectric layer 44, and current signals can be transmitted.

[0117] Please refer to Figure 11 , Figure 11 This is a schematic diagram of the repair process for light-emitting devices. As mentioned above, the specific steps in the repair process for light-emitting devices include:

[0118] Step A: Confirm the status of the light-emitting device 41 and determine whether the light-emitting device 41 is connected to the circuit layer through the first conductive medium;

[0119] Specifically, this can be achieved by observing the light emission of the light-emitting device and measuring its operating current and voltage. If abnormal light emission or unstable operating current and voltage are found, it may indicate a problem with the connection to the circuit layer. In this case, it is necessary to further determine whether the light-emitting device is properly connected to the circuit layer through the first conductive medium. Determining the connection status between the light-emitting device and the circuit layer can be achieved through various methods, such as visual inspection and electrical performance testing. Visual inspection mainly involves observing whether there are obvious breaks or poor soldering at the connection points between the electrodes of the light-emitting device and the circuit layer. This application does not describe this in detail. It is worth noting that, to improve repair efficiency, it is also possible to omit the determination of whether the light-emitting device is properly connected to the circuit layer through the first conductive medium. When the light-emitting device is abnormal, proceed directly to the following steps for repair.

[0120] Step B: When the light-emitting device 41 is not connected to the circuit layer through the first conductive medium, the second conductive medium layer 44 is heated until it reaches the first temperature state, at which point the second conductive medium layer 44 changes from a solid state to a liquid state.

[0121] Specifically, the second conductive dielectric layer is made of a conductive material with a melting point much lower than that of the first conductive dielectric. Heating allows the second conductive dielectric layer to transform from a solid to a liquid state, thus acquiring fluidity and filling capacity. The heating method can be selected according to specific circumstances, such as using equipment like laser heaters to locally heat the second conductive dielectric layer. During the heating process, the temperature and time are controlled. The heating temperature is determined based on the material properties and melting point of the second conductive dielectric layer to ensure it can melt and maintain fluidity.

[0122] Step C: When the liquid second conductive dielectric layer 44 fills to the position of the first conductive dielectric, stop heating the first conductive dielectric;

[0123] Specifically, once the second conductive dielectric layer is heated to a liquid state, it begins to flow and fill the areas of poor soldering or contact. During this process, the liquid second conductive dielectric layer flows along the gaps around the connection point until it completely covers and fills the areas of poor soldering or contact.

[0124] Step D: Wait for the liquid second conductive dielectric layer 44 to solidify, and the repair of the light-emitting device 41 is completed;

[0125] The specific curing time depends on factors such as the material properties of the second conductive dielectric layer and the ambient temperature. During the curing process, it is crucial to maintain environmental stability and avoid any adverse effects.

[0126] Please refer to Figure 12 In one embodiment, Figure 12The structure of a light-emitting device 41 includes a body 411 and a transparent magnetic layer 412 located on top of the body 411. The transparent magnetic layer can be a transparent adhesive layer doped with magnetic powder particles. Figure 12 In the embodiment, the light-emitting device 41 corresponds to the second transfer layer being an electromagnet. When the light-emitting device 41 needs to be transferred, the second transfer layer is energized, and then the second transfer layer adsorbs the transparent magnetic layer, thus completing the adsorption and transfer of the light-emitting device 41. It is worth noting that in the embodiment, the transparent magnetic layer is located on the outermost layer of the light-emitting device 41, in the area far away from the light-emitting chip. The resulting transparent magnetic layer is uniform and flat, and the accuracy and consistency of the adsorption force are high.

[0127] In summary, this invention discloses a self-brazing aluminum alloy layered composite material and its application in light-emitting devices. This composite material consists of a core layer and a self-brazing layer, exhibiting excellent thermal conductivity and mechanical strength. The core layer's properties are optimized by adding elements such as Si, Mg, Cu, Mn+Cr, and Ti+Zr, while the self-brazing layer contains Al-Si alloy powder and rare earth element additives to improve the material's brazing performance and oxidation resistance. A bonding surface is formed between the core layer and the self-brazing layer through a hot-rolling composite process, ensuring a tight bond between the two layers. By using the self-brazing aluminum alloy layered composite material as a second substrate and combining it with a glass substrate to form a composite structure, effective protection and efficient heat dissipation of the glass substrate are achieved.

[0128] The above are merely preferred embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

[0129] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

Claims

1. A self-brazing aluminum alloy layered composite material, characterized in that, include: The core layer (1) has the following components and their mass percentages: Si: 0.5%–1.5%, Mg: 0.3%–1.0%, Cu: 0.1%–0.5%, Mn+Cr: 0.1%–0.5%, Ti+Zr: 0.05%–0.2%, with the balance being Al and unavoidable impurities. The mass ratio of Mn to Cr is 1–2, and the mass ratio of Ti to Zr is 1–1.

5. The self-brazing layer (2) is composed of Al-Si alloy powder and rare earth element additives. The rare earth element additives include at least one of La, Ce and Pr. The mass percentage of the rare earth element additives is 0.1% to 0.5% of the total mass of the self-brazing layer. A bonding surface is formed between the core layer and the self-soldering layer; The manufacturing methods for self-brazing aluminum alloy layered composite materials include: Prepare the core layer material and self-soldering layer material by mixing the specified components and their mass percentages. The core layer (1) material is processed to form a uniform ingot, and the ingot is processed to form a flat first substrate; The first substrate includes a first surface and a second surface arranged opposite to each other, and equally spaced strip-shaped grooves are formed on the first surface of the first substrate; The core layer (1) and the self-brazing layer (2) are brought into contact and heated to a first temperature. The core layer and the self-brazing layer are bonded together by hot rolling composite process to form a second substrate and complete the composite material manufacturing. The steps to form a mating surface include: The core layer and self-brazing layer materials, heated to a first temperature, are fed into a hot rolling mill for rolling to form a composite layer; After rolling, the composite layer needs to be cooled to form a bonding surface; A connecting glass substrate (3) is arranged on the side surface of the second substrate away from the strip groove. In this case, a circuit layer is formed on the side of the glass substrate (3) away from the second substrate, and the circuit layer is connected to the light-emitting unit (4).

2. The self-brazing aluminum alloy layered composite material as described in claim 1, characterized in that, The light-emitting unit (4) includes: Light-emitting device (41), at least one light-emitting device (41) is arranged on the surface of the glass substrate (3). The first conductive medium (42) is used to connect the light-emitting device (41) to the circuit layer. The second conductive dielectric layer (44) and the light-emitting device (41) are located on the same side of the glass substrate (3); Wherein, the orthographic projection of the second conductive dielectric layer (44) on the surface of the glass substrate (3) does not overlap with the orthographic projection of the light-emitting device (41) on the surface of the glass substrate (3).

3. The self-brazing aluminum alloy layered composite material as described in claim 2, characterized in that, The light-emitting unit (4) further includes a photothermal conversion layer (43), which is disposed on the surface of the glass substrate (3); The photothermal conversion layer (43) has a second conductive dielectric layer disposed on the surface away from the glass substrate (3); The photothermal conversion layer (43) is located directly above the strip groove and is arranged corresponding to the position of the strip groove.

4. The self-brazing aluminum alloy layered composite material as described in claim 3, characterized in that, The light-emitting unit (4) further includes a dimming layer (45), which is located directly above the second conductive dielectric layer (44); The dimming layer (45) is configured to focus light onto the second conductive dielectric layer (44) on one side of its surface.

5. The self-brazing aluminum alloy layered composite material as described in claim 4, characterized in that, The light-emitting unit (4) also includes an encapsulation unit; The encapsulation unit includes a shell component, the shell component being arranged with a receiving cavity, and at least the light-emitting device (41) and the second conductive dielectric layer (44) are arranged in the receiving cavity; Alternatively, the encapsulation unit may include a barrier member (46) located on the periphery of the integral formed by the light-emitting device (41) and the second conductive dielectric layer (44), and the barrier member (46) may be made of an opaque material.

6. The self-brazing aluminum alloy layered composite material as described in claim 5, characterized in that, The step of transferring the light-emitting device (41) to the surface of the glass substrate (3) includes: A welding area is formed on the surface of the glass substrate (3) to prepare a transfer substrate (5). The transfer substrate (5) includes a transient substrate (51) arranged corresponding to the glass substrate (3), a first transfer layer (52) arranged on the surface of the transient substrate (51), and a second transfer layer (53) arranged on the surface of the transient substrate (51). The first transfer layer (52) and the second transfer layer (53) are located on the same side surface of the transient substrate (51), and the first transfer layer (52) and the second transfer layer (53) are arranged at intervals. A plurality of light-emitting devices (41) are arranged on the surface of the first substrate. The transfer substrate (5) is aligned with the first substrate so that the second transfer layer adsorbs the top of the light-emitting devices (41). A photothermal conversion layer (43) is disposed on the surface of a glass substrate (3). A second conductive dielectric layer is disposed on the surface of the photothermal conversion layer (43) away from the glass substrate (3). The transfer substrate (5) is aligned with the second substrate so that the first transfer layer is adsorbed onto the top of the second conductive dielectric layer (44). A first conductive medium (42) is covered at the electrode position of the light-emitting device (41), and an adhesive layer is covered at the bottom of the second conductive medium layer (44). The electrodes of the light-emitting device (41) on the surface of the transfer substrate (5) are aligned with the welding area of ​​the glass substrate (3) so that the electrodes of the light-emitting device (41) contact the welding area and the adhesive layer contacts the glass substrate. After the second conductive dielectric layer (44) is cured, the transfer of the light-emitting device (41) is completed.

7. The self-brazing aluminum alloy layered composite material as described in claim 6, characterized in that, It also includes the repair process for light-emitting devices, with specific steps including: Confirm the state of the light-emitting device (41) and determine whether the light-emitting device (41) is connected to the circuit layer through the first conductive medium; When the light-emitting device (41) is not connected to the circuit layer through the first conductive medium, the second conductive medium layer (44) is heated and reaches the first temperature state, at which point the second conductive medium layer (44) changes from solid to liquid. When the liquid second conductive dielectric layer (44) fills to the position of the first conductive dielectric, the heating of the second conductive dielectric is stopped; Once the liquid second conductive dielectric layer (44) has solidified, the repair of the light-emitting device (41) is completed.

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