Assembly method of LED display module

Abstract

The application relates to an assembling method of an LED display module, which comprises the following steps: first, manufacturing a first layer light source plate, the first layer light source plate comprising a plurality of first layer pixel light sources, a first layer light source plate controller and a plurality of light source windows; second, manufacturing a second layer light source plate, the second layer light source plate comprising a plurality of second layer pixel light sources and a second layer light source plate controller; third, manufacturing a module lamp plate, stacking the second layer light source plate behind the first layer light source plate, and making each second layer pixel light source pass through the corresponding light source window; and fourth, assembling the module lamp plate in the module shell, connecting the first layer light source plate controller to the first layer light source plate through a signal line, and connecting the second layer light source plate controller to the second layer light source plate through a signal line.

Description

Technical Field

[0001] This invention relates to a module assembly method, and more particularly to an assembly method for an LED display module in which a module light panel is assembled in a module housing, wherein the module light panel is composed of a first light source board and a second light source board stacked together. Background Technology

[0002] LED displays are a new type of imaging electronic device made by arranging light-emitting diodes in sequence. Due to their high brightness, wide viewing angle, and long lifespan, they are being widely used in products such as outdoor advertising screens.

[0003] like Figure 1 The diagram shows a traditional LED display screen, especially an LED dot matrix screen. A traditional LED display screen has several LED beads 1 arranged on it. Each LED bead 1 can be configured with a red light source (R light source), a green light source (G light source), or a blue light source (B light source). The light sources in the LED beads 1 can be configured in various ways, such as BBR, RRG, BBG, RRB, etc. The LED display screen is connected to a controller 2. When the traditional LED display screen is working, the controller 2 controls the light emission state of the several LED beads 1, thereby achieving the function of displaying image information.

[0004] In practical applications, one LED bead (1) represents one pixel. The center-to-center distance between two pixels is called the pixel pitch (D). The number of pixels per unit area is called pixel density, and the amount of displayed content per unit area is called information capacity. The number of rows and columns of pixels on an LED display screen is called the resolution. Resolution is the total number of pixels on the screen, which determines the information capacity of the display. In practical applications, the smaller the pixel pitch (D), the higher the pixel density, the greater the information capacity, and the closer the suitable viewing distance. Conversely, the larger the pixel pitch (D), the lower the pixel density, the less the information capacity, and the farther the suitable viewing distance.

[0005] However, traditional LED displays still have the following drawbacks in practical applications, which are described below. First, once a traditional LED display is designed, its pixel pitch D is a unique and fixed value, so it can only be used in a specific scenario, limiting its application. Second, in practice, to increase the pixel density and information capacity of the display, it is necessary to reduce the pixel pitch D. However, due to the limitations of manufacturing equipment precision, the smallest pixel pitch D that manufacturers can currently produce has reached its limit. With current manufacturing equipment and processes, it is impossible to further reduce the pitch D, thus preventing further increases in pixel density. These are the main drawbacks of the existing technology. Summary of the Invention

[0006] The technical solution adopted in this invention is: an assembly method for an LED display module, which includes the following steps: Step 1, fabricating a first layer of light source board.

[0007] The first-layer light source board includes several first-layer pixel light sources, a first-layer light source board controller, and several light source windows. Several first-layer pixel light sources are electrically connected to the first-layer light source board. Several light source windows are cut out of the first-layer light source board. Each light source window is located between any two adjacent first-layer pixel light sources. There is a first-layer pixel pitch between any two adjacent first-layer pixel light sources. Several first-layer pixel light sources are located on the first light-emitting surface at the same time.

[0008] The second step is to create the second layer of the light source board.

[0009] The second-layer light source board includes several second-layer pixel light sources and a second-layer light source board controller. The several second-layer pixel light sources are electrically connected to the second-layer light source board. There is a second-layer pixel pitch between any two adjacent second-layer pixel light sources. The several second-layer pixel light sources are located on the second light-emitting surface at the same time.

[0010] Step 3: Make the modular light panel.

[0011] The second light source board is stacked behind the first light source board, and each second-layer pixel light source extends out from the corresponding light source window, so that the second light-emitting surface coincides with the first light-emitting surface. On the module light board, there is a set pixel pitch between any adjacent first-layer pixel light sources and second-layer pixel light sources. The set pixel pitch is smaller than the first-layer pixel pitch and smaller than the second-layer pixel pitch.

[0012] Fourth step: Assemble the module light board from the third step into the module housing, connect the first layer light source board controller to the first layer light source board via a signal line, and connect the second layer light source board controller to the second layer light source board via a signal line.

[0013] The beneficial effects of this invention are as follows: When producing according to the production method of this invention, it is only necessary to attach pixel light sources with a pixel pitch equal to the pixel pitch of the first layer on the first layer light source board, and only necessary to attach pixel light sources with a pixel pitch equal to the pixel pitch of the second layer on the second layer light source board. However, the pixel pitch of the module light board formed by stacking the second layer light source board and the first layer light source board can be half of the pixel pitch of the first layer and the pixel pitch of the second layer. By using the technology of this invention, it is possible to process small-pitch, high-density LED displays with a pixel pitch reduced by half using traditional equipment, without the need to introduce expensive high-end precision surface mount equipment, which can greatly reduce production costs and improve the display effect of LED displays. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of existing technology.

[0015] Figure 2 This is a schematic diagram of the present invention.

[0016] Figure 3 This is a schematic diagram of the first and second light source boards of the present invention.

[0017] Figure 4 This is a front view of the first layer light source plate of the present invention.

[0018] Figure 5 This is a front view of the second layer light source plate of the present invention.

[0019] Figure 6 This is a schematic diagram of the dual-mode display system of the present invention.

[0020] Figure 7 This is a schematic diagram of the light emission of the present invention in myopia light emission mode.

[0021] Figure 8 This is a schematic diagram of light emission under the farsighted energy-saving light emission mode of the present invention.

[0022] Figure 9 This is another schematic diagram of light emission under the farsighted energy-saving light emission mode of the present invention.

[0023] Figure 10 This is a schematic diagram of the structure of the second layer pixel light source of the present invention.

[0024] Figure 11 This is a schematic diagram of the structure of the inserted LED light source of the present invention.

[0025] Figure 12 This is a schematic diagram of the structure of the light source portion of the inserted LED light source of the present invention.

[0026] Figure 13 This is a schematic diagram of the adhesive structure of the present invention.

[0027] Figure 14 This is a schematic diagram of the assembly of the LED light source and the bonding adhesive of the present invention.

[0028] Figure 15 This is a schematic diagram of the assembly of the lens top cover of the present invention.

[0029] Figure 16 This is a schematic diagram of the pressing and assembly of the LED light source, bonding colloid, and lens top cover of the present invention.

[0030] Figure 17 This is an assembly diagram of the insertion part of the present invention.

[0031] Figure 18 This is a three-dimensional schematic diagram of the insertion part of the present invention.

[0032] Figure 19 This is a top view of the assembly of the insertion part of the present invention. Detailed Implementation

[0033] like Figures 2 to 19 As shown, an assembly method for an LED display module includes the following steps.

[0034] like Figure 4 As shown, the first step is to fabricate a first-layer light source board 200, which includes several first-layer pixel light sources 210, a first-layer light source board controller 220, and several light source windows 230. Several first-layer pixel light sources 210 are electrically connected to the first-layer light source board 200. Several light source windows 230 are cut out on the first-layer light source board 200. Each light source window 230 is located between any two adjacent first-layer pixel light sources 210. There is a first-layer pixel pitch D1 between any two adjacent first-layer pixel light sources 210. Several first-layer pixel light sources 210 are simultaneously located on the first light-emitting surface S1.

[0035] like Figure 5 As shown, the second step is to fabricate a second-layer light source board 300. The second-layer light source board 300 includes several second-layer pixel light sources 310 and a second-layer light source board controller 320. The several second-layer pixel light sources 310 are electrically connected to the second-layer light source board 300. There is a second-layer pixel pitch D2 between any two adjacent second-layer pixel light sources 310. The several second-layer pixel light sources 310 are simultaneously located on the second light-emitting surface S2.

[0036] like Figures 2 to 3As shown, the third step is to fabricate the module light board 100. The second layer light source board 300 is stacked behind the first layer light source board 200. Each second layer pixel light source 310 passes through the corresponding light source window 230, so that the second light-emitting surface S2 coincides with the first light-emitting surface S1. On the module light board 100, any adjacent first layer pixel light source 210 and second layer pixel light source 310 have a set pixel pitch D3. The set pixel pitch D3 is smaller than the first layer pixel pitch D1 and smaller than the second layer pixel pitch D2.

[0037] Fourth step: Assemble the module light board 100 from the third step into the module housing, connect the first layer light source board controller 220 to the first layer light source board 200 via a signal line, the first layer light source board controller 220 is used to control the working state of several first layer pixel light sources 210, and connect the second layer light source board controller 320 to the second layer light source board 300 via a signal line, the second layer light source board controller 320 is used to control the working state of several second layer pixel light sources 310.

[0038] In practical implementation, the module housing includes a bottom shell and a face mask. The module light board 100 is disposed between the bottom shell and the face mask. The first layer pixel light source 210 and the second layer pixel light source 310 extend out from the face mask. In practice, several of these module housings are connected to an LED cabinet to form an LED display screen.

[0039] like Figures 4 to 5 As shown, in the specific implementation, in the first step, any two adjacent first-layer pixel light sources 210 refer to any two first-layer pixel light sources 210 that are arbitrarily adjacent in both horizontal and vertical directions on the first-layer light source board 200. The pixel pitch D1 between any two horizontally adjacent first-layer pixel light sources 210 can be equal to or unequal to the pixel pitch D1 between any two vertically adjacent first-layer pixel light sources 210. In the second step, any two adjacent second-layer pixel light sources 310 refer to any two second-layer pixel light sources 310 that are arbitrarily adjacent in both horizontal and vertical directions on the second-layer light source board 300. The pixel pitch D2 between any two horizontally adjacent second-layer pixel light sources 310 can be equal to or unequal to the pixel pitch D2 between any two vertically adjacent second-layer pixel light sources 310.

[0040] like Figures 6 to 9As shown, in the specific implementation, in the fourth step, the module light panel 100 has two working modes: a nearsighted light emission mode and a farsighted energy-saving light emission mode. In the nearsighted light emission mode, the first-layer light source board controller 220 controls several first-layer pixel light sources 210 to work and emit light. At the same time, the second-layer light source board controller 320 controls several second-layer pixel light sources 310 to work and emit light. The light emission pixel light sources 110 of the module light panel 100 are composed of several first-layer pixel light sources 210 and several second-layer pixel light sources 310. The pixel spacing between any two adjacent light emission pixel light sources 110 is the set pixel spacing D3. In the nearsighted light emission mode, the pixel spacing value of the module light panel 100 is small, its pixel density is high, its information capacity is large, and it is suitable for close-range viewing.

[0041] In this farsighted energy-saving lighting mode, the first-layer light source board controller 220 controls several first-layer pixel light sources 210 to operate and emit light. These several first-layer pixel light sources 210 form the light-emitting pixel light sources 110 of the module light board 100. The pixel spacing between any two adjacent light-emitting pixel light sources 110 is the first-layer pixel spacing D1. Alternatively, the second-layer light source board controller 320 controls several second-layer pixel light sources 310 to operate and emit light. These several second-layer pixel light sources 310 form the light-emitting pixel light sources 110 of the module light board 100. The pixel spacing between any two adjacent light-emitting pixel light sources 110 is D1. The pixel pitch is D2, meaning that in this far-sighted energy-saving lighting mode, only one of the first-layer light source board 200 or the second-layer light source board 300 is in the light-emitting state. In this far-sighted energy-saving lighting mode, the pixel pitch of the module light board 100 is relatively large, its pixel density is low, and its information capacity is small, making it suitable for viewing at a distance. Furthermore, since only one of the first-layer light source board 200 or the second-layer light source board 300 is in the light-emitting state, the LED display screen is in energy-saving mode in this far-sighted energy-saving lighting mode, and its energy consumption is about half that of the near-sighted lighting mode.

[0042] In the specific implementation, in the third step, the first layer light source board 200 has a first layer device surface 250 and a first layer connection surface 260. The first layer device surface 250 and the first layer connection surface 260 are located on the front and back sides of the first layer light source board 200, respectively, and the first layer pixel light source 210 is connected to the first layer device surface 250.

[0043] The second-layer light source board 300 has a second-layer device surface 350 and a second-layer connection surface 360. The second-layer device surface 350 and the second-layer connection surface 360 ​​are located on the front and back sides of the second-layer light source board 300, respectively. The second-layer pixel light source 310 is connected to the second-layer device surface 350. The second-layer connection surface 360 ​​is stacked on the first-layer connection surface 260. In practice, a shielding layer is provided between the second-layer connection surface 360 ​​and the first-layer connection surface 260.

[0044] In the second step, the second layer light source board 300 is provided with several through windows 370. The through windows 370 correspond one-to-one with the light source window 230 of the first layer light source board 200 and are connected. Each second layer pixel light source 310 is simultaneously inserted into the corresponding through window 370 and the light source window 230, so that the first light-emitting surface S1 of the first layer light source board 200 and the second light-emitting surface S2 of the second layer light source board 300 coincide.

[0045] In specific implementation, the second-layer pixel light source 310 is an intercalated LED light source. The intercalated LED light source includes an insertion part 10, a light source part 20, and several power connection pins 30. The light source part 20 is connected to the top of the insertion part 10, the several power connection pins 30 are connected to the bottom of the insertion part 10, and the several power connection pins 30 are connected to the second-layer device surface 350. The insertion part 10 passes through the through window 370 of the second-layer light source board 300 and the light source window 230 of the first-layer light source board 200.

[0046] In a specific implementation, the light source part 20 includes a light source structure 40, an LED light source 45, and an adhesive 46. The light source structure 40 includes a base plate 41, a side wall 42, and a lens top cover 43. The side wall 42 is disposed around the base plate 41, and the lens top cover 43 is snapped onto the side wall 42. A light source cavity 44 is formed by the base plate 41, the side wall 42, and the lens top cover 43.

[0047] The LED light source 45 and the adhesive 46 are disposed in the light source cavity 44. The LED light source 45 is fixedly disposed on the base plate 41, and the adhesive 46 is pressed between the LED light source 45 and the lens top cover 43. The light emitted by the LED light source 45 passes through the adhesive 46 and the lens top cover 43 in sequence and is then emitted.

[0048] The bonding adhesive 46 is generally disc-shaped and includes a bonding disc 50 and an annular rib 60. The annular rib 60 is arranged around the bonding disc 50. During production, the bonding adhesive 46 is formed in one step using optical adhesive. The bonding disc 50 contains phosphor to enhance light efficiency. In practice, the cross-section of the annular rib 60 is disc-shaped. The bonding disc 50 has a top cover bonding surface 51 and a light source bonding surface 52. The annular rib 60 has an inner ring surface 61, a bottom ring surface 62, and an outer ring surface 63. The top cover bonding surface 51 is connected to the outer ring surface 63. The top cover bonding surface 51 is a plane and corresponds to the top cover bonding surface 51. An externally convex lens 53 is provided on the inner side of the lens top cover 43. The externally convex surface of the externally convex lens 53 is pressed onto the top cover bonding surface 51.

[0049] The light source bonding surface 52 is connected to the inner side surface 61 of the ring. A light source bonding cavity 47 is formed by the light source bonding surface 52 and the inner side surface 61 of the ring. The light source bonding surface 52 is an outwardly convex arc surface. The LED light source 45 is covered in the light source bonding cavity 47. The light source bonding surface 52 is pressed against the top surface of the LED light source 45, the inner side surface 61 of the ring is pressed against the side wall of the LED light source 45, and the bottom surface 62 of the ring is pressed against the base plate 41 of the light source structure 40. Through the above structure, the bonding adhesive 46 can completely wrap the LED light source 45, so that the light emitted by the LED light source 45 can completely pass through the bonding adhesive 46 and then be irradiated through the lens top cover 43.

[0050] The structure of the adhesive 46 described above has the following effects. First, it can completely encapsulate the LED light source 45, allowing the light emitted by the LED light source 45 to completely pass through the adhesive 46 before being emitted through the lens cover 43, thus improving luminous efficiency. Second, it can achieve comprehensive heat conduction of the LED light source 45 by the adhesive 46, and finally dissipate the heat outward through the light source structure 40. In addition, the complete encapsulation of the LED light source 45 by the adhesive 46 can improve the waterproof rating of the LED light source part. Finally, its structure facilitates production and improves processing efficiency. Specifically, the following steps are followed when processing the light source part 20.

[0051] Step A: Connect the LED light source 45 to the base plate 41. Step B: Cover the LED light source 45 with the adhesive 46 so that the LED light source 45 is located in the light source bonding cavity 47, completing the initial positioning. Step C: Press the lens top cover 43 into the light source structure 40 to complete the overall pressing assembly.

[0052] The specific working process of step C is described as follows. The lens cover 43 moves gradually toward the light source structure 40, and the lens cover 43 is finally snapped into the light source structure 40.

[0053] During the aforementioned pressing process, the bonding pad 50 is located between the top surface of the LED light source 45 and the outer convex surface of the convex lens 53. During the pressing process, between the bonding pad 50 and the outer convex surface of the convex lens 53, firstly, the central portion of the outer convex surface of the convex lens 53 contacts the top cover bonding surface 51. Then, the peripheral portion of the outer convex surface of the convex lens 53 is gradually pressed into the top cover bonding surface 51 from the inside out. Figure 16 As indicated by the middle arrow, during this process, the air is gradually expelled by the compression of the top cover contact surface 51. The physical deformation of the top cover contact surface 51 forces the air out between the convex surface of the convex lens 53 and the top cover contact surface 51. Figure 16 As shown by the middle arrow, during the pressing process, between the bonding plate 50 and the top surface of the LED light source 45, firstly, the central part of the light source bonding surface 52 contacts the top surface of the LED light source 45. Then, the surrounding parts of the light source bonding surface 52 are gradually pressed onto the top surface of the LED light source 45 from the inside out. During this process, the light source bonding surface 52 gradually completes the extrusion and degassing. Through the physical deformation of the light source bonding surface 52, the air between the light source bonding surface 52 and the top surface of the LED light source 45 is expelled. In the above manner, one-time pressing and molding can be achieved, and a tight connection can be achieved between the LED light source 45, the bonding adhesive 46, and the lens top cover 43. At the same time, the pressing structure is compact and there are no air bubbles between the structures.

[0054] In practice, the insertion portion 10 has various structural implementations, which are described below.

[0055] like Figures 14 to 15 As shown in Embodiment 1, the insertion portion 10 is integrally extended from the light source structure 40 of the light source portion 20, and the insertion portion 10 and the light source structure 40 are connected to form a whole.

[0056] like Figures 17 to 19As shown in Embodiment 2, the insertion portion 10 has a top surface 71, a bottom surface 72, and an outer surface 73. The outer surface 73 is connected between the top surface 71 and the bottom surface 72. One end of the power pin 30 is connected to the bottom surface 72, and the other end of the power pin 30 is connected to the second layer device surface 350. The top surface 71 is provided with a contact point 74. Corresponding to the contact point 74, the bottom of the light source portion 20 is provided with a light source contact point 21. The light source contact point 21 corresponds one-to-one with the contact point 74 and is connected to the contact point 74 to realize the electrical connection between the light source portion 20 and the second layer device surface 350. The contact point 74 is electrically connected to the power pin 30. This is prior art and will not be described in detail here.

[0057] The outer surface 73 includes an upper top surface 81, a lower bottom surface 82, a vertical side surface 91, and a clearance side surface 92. The vertical side surface 91 and the clearance side surface 92 are connected between the upper top surface 81 and the lower bottom surface 82. An insertion mounting surface 83 and a clearance cavity 84 are respectively provided on the upper top surface 81 and the lower bottom surface 82. The clearance cavity 84 is recessed on the upper top surface 81 and the lower bottom surface 82, and a solder block 85 is provided in the clearance cavity 84. An upper mounting ridge 93, a lower mounting ridge 94, and a clearance groove 95 are provided on the clearance side surface 92. The clearance groove 95 is located between the upper mounting ridge 93 and the lower mounting ridge 94. The upper mounting ridge 93 is connected to one side of the upper top surface 81, and the lower mounting ridge 94 is connected to one side of the lower bottom surface 82.

[0058] The assembly of the inserted LED light source is performed according to the following steps: First, the second-layer light source board 300 is stacked behind the first-layer light source board 200, so that the through-hole 370 of the second-layer light source board 300 is connected to the light source window 230 of the first-layer light source board 200. Second, the insert portion 10 is inserted into the through-hole 370 and the light source window 230, and the second-layer light source board 300 is fixedly stacked behind the first-layer light source board 200 through the insert portion 10. During this process, the avoidance cavity 84 and the avoidance groove 95 can reduce the contact area between the outer surface of the insert portion 10 and the inner wall of the hole, so as to facilitate the control of flatness. The vertical side 91, the upper mounting ridge 93, and the lower mounting ridge 94 can facilitate insertion and positioning. The clearance cavity 84 allows the clamp to easily pick up the insertion part 10 from the top and bottom sides and insert it into the hole. The third step is to weld several of the power-connecting pins 30 of the inserted LED light source onto the second layer device surface 350. The fourth step is to melt the solder block 85 using a welding machine (e.g., microwave welding machine, wave soldering machine, etc.) and weld the insertion part 10 into the hole. The fifth step is to attach the light source part 20 to the attachment top surface 71 of the insertion part 10, so that the light source contact 21 is connected to the attachment contact 74, thereby realizing the electrical connection between the light source part 20 and the second layer device surface 350. Finally, it is worth emphasizing that the structure of the first layer pixel light source 210 is the same as the structure of the light source part 20 of the second layer pixel light source 310, so as to facilitate mass production and assembly.

[0059] According to the production method of this invention, it is only necessary to attach pixel light sources with a pixel pitch of D1 to the first layer light source board 200, and only necessary to attach pixel light sources with a pixel pitch of D2 to the second layer light source board 300. However, the pixel pitch D3 of the module light board 100 formed by stacking the second layer light source board 300 and the first layer light source board 200 can be half the pixel pitch D1 and the pixel pitch D2 of the first layer. Using the technology of this invention, it is possible to process small-pitch, high-density light sources with half the pixel pitch using conventional equipment. LED displays can significantly reduce production costs and improve display effects without the need for expensive high-end precision surface mount equipment. In practice, the first-layer light source board controller 220 and the second-layer light source board controller 320 are connected to the main controller. The main controller adjusts the working state of the first-layer light source board 200 and the second-layer light source board 300 through the first-layer light source board controller 220 and the second-layer light source board controller 320. This is prior art and will not be elaborated here. In specific implementation, the shape of each first-layer pixel light source 210 and each second-layer pixel light source 310 can be circular or rectangular.

Claims

1. A method for assembling an LED display module, characterized in that, Includes the following steps: Step 1: Make the first layer of the light source board. The first-layer light source board includes several first-layer pixel light sources, a first-layer light source board controller, and several light source windows. The several first-layer pixel light sources are electrically connected to the first-layer light source board. Several light source windows are cut out of the first-layer light source board, and each light source window is positioned between any two adjacent first-layer pixel light sources. There is a first-layer pixel pitch between any two adjacent first-layer pixel light sources. The several first-layer pixel light sources are simultaneously located on the first light-emitting surface. Step 2: Make the second layer of the light source board. The second-layer light source board includes several second-layer pixel light sources and a second-layer light source board controller. The several second-layer pixel light sources are electrically connected to the second-layer light source board. There is a second-layer pixel pitch between any two adjacent second-layer pixel light sources. The several second-layer pixel light sources are simultaneously located on the second light-emitting surface. Step 3: Make the modular light panels. The second light source board is stacked behind the first light source board, and each pixel light source of the second layer extends out from its corresponding light source window, so that the second light-emitting surface coincides with the first light-emitting surface. On this module light panel, any adjacent first-layer pixel light source and second-layer pixel light source have a set pixel spacing, which is smaller than the pixel spacing of the first layer and smaller than the pixel spacing of the second layer. Step 4: Assemble the module light panel from step 3 into the module housing. The first-layer light source board controller is connected to the first-layer light source board via a signal line, and the second-layer light source board controller is connected to the second-layer light source board via a signal line. In the second step, the second-layer pixel light source includes an insertion part, a light source part, and several power-connecting pins. The light source includes a light source structure, an LED light source, and an adhesive. The light source structure includes a base plate, side walls, and a lens cover. The side walls are disposed around the base plate, and the lens cover is snapped onto the side walls. The base plate, side walls, and lens cover together form a light source cavity. The LED light source and the adhesive are disposed in the light source cavity, wherein the LED light source is fixedly disposed on the base plate, and the adhesive is pressed between the LED light source and the lens top cover. The bonding adhesive includes a bonding disc and annular ribs. The annular ribs are arranged around the bonding disc. The bonding disc has a top cover bonding surface and a light source bonding surface. The annular ribs have an inner surface, a bottom surface, and an outer surface. The top cover bonding surface is connected to the outer surface of the annular ribs and is a flat surface. Corresponding to the top cover bonding surface, a convex lens is disposed on the inner side of the lens top cover, and the convex surface of the convex lens is pressed against the top cover bonding surface. The light source bonding surface is connected to the inner surface of the ring, and a light source bonding cavity is formed by the light source bonding surface and the inner surface of the ring. The light source bonding surface is a convex arc surface. The LED light source is encased in the light source bonding cavity, wherein the bonding surface of the light source is pressed against the top surface of the LED light source, the inner side of the ring is pressed against the side wall of the LED light source, and the bottom surface of the ring is pressed against the base plate of the light source structure.

2. The assembly method of an LED display module as described in claim 1, characterized in that: In the fourth step, the module housing includes a bottom shell and a face mask. The module light board is disposed between the bottom shell and the face mask. The first layer of pixel light source and the second layer of pixel light source pass through the face mask. Several module housings are connected to the LED cabinet to form an LED display screen.

3. The assembly method of an LED display module as described in claim 1, characterized in that: In the third step, the first-layer light source board has a first-layer device surface and a first-layer connection surface, which are located on the front and back sides of the first-layer light source board, respectively. The first-layer pixel light source is connected to the first-layer device surface. The second-layer light source board has a second-layer device surface and a second-layer connection surface. The second-layer device surface and the second-layer connection surface are located on the front and back sides of the second-layer light source board, respectively. The second-layer pixel light source is connected to the second-layer device surface, and the second-layer connection surface is superimposed on the first-layer connection surface.

4. The assembly method of an LED display module as described in claim 3, characterized in that: A shielding layer is provided between the second connecting surface and the first connecting surface.

5. The assembly method of an LED display module as described in claim 3, characterized in that: In the second step, the second layer light source board is provided with several through windows, which correspond one-to-one with and are connected to the light source window of the first layer light source board. Each second layer pixel light source is simultaneously disposed in the corresponding through window and the light source window, so that the first light-emitting surface of the first layer light source board coincides with the second light-emitting surface of the second layer light source board.

6. The assembly method of an LED display module as described in claim 1, characterized in that: The following steps should be followed when processing the light source part: Step A: Connect the LED light source to the base plate. Step B: Apply the bonding adhesive to the LED light source, positioning the LED light source within the bonding cavity, thus completing the initial positioning. Step C: Press the lens top cover into the light source structure to complete the overall pressing assembly.

7. The assembly method of an LED display module as described in claim 6, characterized in that: In step C, the lens cap gradually moves towards the light source structure, and the lens cap is eventually snapped into the light source structure. During the aforementioned pressing process, the bonding pad is located between the top surface of the LED light source and the convex surface of the convex lens. During the pressing process, between the bonding disc and the convex surface of the convex lens, firstly, the central portion of the convex surface of the convex lens contacts the top cover bonding surface. Then, the peripheral portion of the convex surface of the convex lens is gradually pressed into the top cover bonding surface from the inside out. During this process, the top cover bonding surface gradually expels air by squeezing it out. The physical deformation of the top cover bonding surface forces the air out between the convex surface of the convex lens and the top cover bonding surface. During the pressing process, between the bonding pad and the top surface of the LED light source, firstly, the central part of the bonding surface of the light source contacts the top surface of the LED light source. Then, the surrounding parts of the bonding surface of the light source are gradually pressed onto the top surface of the LED light source from the inside out. During this process, the bonding surface of the light source gradually completes the extrusion and degassing. Through the physical deformation of the bonding surface of the light source, the air between the bonding surface of the light source and the top surface of the LED light source is expelled.

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