A single-mode optical module

Abstract

The application relates to the technical field of silicon optical modules, in particular to a single-mode optical module. The single-mode optical module comprises a laser chip, a light splitting optical fiber, a connector and a backlight chip, wherein the laser chip is provided with a waveguide port; the light splitting optical fiber comprises an incident surface and a light splitting surface which are oppositely arranged in the extension direction of the optical fiber, the incident surface is oppositely arranged with the waveguide port, and the incident surface is perpendicular to the extension direction of the optical fiber, and the light splitting surface is arranged at an angle with the extension direction of the optical fiber; the connector is used for transmitting and receiving optical signals, and the connector comprises a transmitting optical fiber which is located on the transmission light path of the light splitting surface; the transmitting optical fiber comprises an incident surface which is oppositely arranged with the light splitting surface, the backlight chip is located on the refractive light path of the light splitting surface, and the backlight chip is used for monitoring and feeding back the power of the optical wave. The single-mode optical module can solve the problem that it is difficult to reduce the size of the optical module in the prior art, the layout is simple, other optical elements are reduced, and the volume is reduced.

Description

Technical Field

[0001] This invention relates to the field of silicon photonics module technology, and in particular to a single-mode optical module. Background Technology

[0002] In the manufacturing of optical modules, due to increasingly smaller optical module packaging specifications and protocol requirements, the size and volume requirements for components such as small optical devices and electronic chips are becoming more and more stringent.

[0003] An existing discrete component optical module includes a housing, a laser chip, a backlight chip, a beam splitter, and a connector. The light emitted by the laser chip inside the housing is split by the beam splitter, with part of the light being output to the outside via the connector, and the other part being split to the backlight chip for monitoring and detection.

[0004] Since the light output from the beam splitter cannot be directly and efficiently transmitted into the optical fiber of the connector, adapters, optical couplers, or optical fiber connectors need to be added between the connector and the beam splitter, which makes the optical module structure complex and limits the further reduction in the size of the optical module. Summary of the Invention

[0005] The technical problem to be solved by the embodiments of the present invention is to provide a single-mode optical module to solve the problems of complex structure and difficulty in miniaturization of optical modules in the prior art.

[0006] The single-mode optical module provided in this embodiment of the invention includes:

[0007] The laser chip has a waveguide port;

[0008] The optical fiber includes an incident surface and a splitting surface disposed opposite to each other in the extension direction of the optical fiber. The incident surface is disposed opposite to the waveguide port and is perpendicular to the extension direction of the optical fiber. The splitting surface is disposed at an angle to the extension direction of the optical fiber.

[0009] A connector for receiving and transmitting light signals, the connector including a transmitting optical fiber located in the transmission optical path of the beam splitter; the transmitting optical fiber including an incident surface connected to and parallel to the beam splitter, the extension direction of the beam splitter forming an angle with the incident surface;

[0010] A backlight chip is located on the refracted light path of the beam splitter, and the backlight chip is used to monitor and provide feedback on the power of the light wave.

[0011] In one embodiment, the laser chip further includes a first silicon substrate, the waveguide port is disposed on the first silicon substrate, and the first silicon substrate is provided with a snap-fit ​​structure for mounting the beam splitter fiber.

[0012] In one embodiment, a pressure plate is also included, with the optical fiber sandwiched between the first silicon substrate and the pressure plate.

[0013] In one embodiment, it further includes:

[0014] The detector chip has a first active region;

[0015] The connector also includes a receiving optical fiber for receiving the returned optical signal. The receiving optical fiber includes a reflective surface, and the extension direction of the receiving optical fiber is set at a 45° angle to the reflective surface. The first active region is located on the refracted light path of the reflective surface.

[0016] In one embodiment, the detector chip further includes a second silicon substrate, the first active region is disposed on the second silicon substrate, the second silicon substrate is provided with a placement boss, and the receiving optical fiber is installed at the placement boss so that the reflecting surface is located on top of the first active region.

[0017] In one embodiment, the system further includes a thermally conductive substrate, on which the laser chip, the detector chip, and the backlight chip are all mounted.

[0018] In one embodiment, the system further includes a circuit board, on which the thermally conductive substrate is mounted. The circuit board has a plurality of first pads, and the laser chip, the detector chip, and the backlight chip are electrically connected to the circuit board through corresponding first pads.

[0019] In one embodiment, the circuit board is provided with a mounting groove, and the thermally conductive substrate is housed in the mounting groove.

[0020] In one embodiment, the system further includes a base with a receiving groove. The circuit board is installed in the receiving groove and spaced apart from the bottom of the receiving groove. A protrusion is provided at the bottom of the receiving groove, which is in contact with the circuit board and corresponds to the thermally conductive substrate.

[0021] In one embodiment, a shielding cover is also included, which covers the exterior of the laser chip, detector chip, beam splitter fiber, and backlight chip.

[0022] Compared with the prior art, the single-mode optical module provided by the embodiments of the present invention has the following advantages: the single-mode optical module has a simple layout, reduces the use of devices such as adapters, optical couplers or fiber optic connectors, thereby reducing production costs and significantly reducing the size of the single-mode optical module.

[0023] Specifically, the light wave emitted from the waveguide port enters the beam splitter fiber directly from the incident surface and is coupled. At the beam splitter, the light wave is divided into a reflected beam and a transmitted beam. Part of the light wave forms a transmitted beam, which enters the transmitting fiber of the connector and transmits the optical signal outward. The other part of the emitted light wave forms a reflected beam, which is transmitted to the backlight chip. The backlight chip monitors and receives feedback on the light wave power to control or stabilize the output light power. Compared to existing technologies that use adapters, optical couplers, or fiber optic connectors for coupling, this application utilizes a beam splitter fiber to achieve direct light coupling. Furthermore, because the beam splitter fiber replaces related optical components, the structure is simpler, and the overall space occupancy is reduced. Ultimately, this reduces the size of the single-mode optical module, optimizes the overall structure, and lowers production costs. Attached Figure Description

[0024] The specific embodiments of the present invention will be further described in detail below with reference to the accompanying drawings and examples. In the accompanying drawings:

[0025] Figure 1 This is a three-dimensional schematic diagram of a single-mode optical module provided in an embodiment of the present invention;

[0026] Figure 2 This is a disassembly diagram of a single-mode optical module provided in an embodiment of the present invention;

[0027] Figure 3 yes Figure 2 A magnified view of a section at point A in the middle;

[0028] Figure 4 This is a disassembly diagram of the laser chip, beam splitting fiber, and connector provided in an embodiment of the present invention;

[0029] Figure 5 yes Figure 4 A magnified view of a section at point B in the middle;

[0030] Figure 6 This is a half-section schematic diagram of the laser chip, beam splitting fiber, and connector provided in an embodiment of the present invention;

[0031] Figure 7 This is a disassembly diagram of the pressure plate, beam splitting fiber, and laser chip provided in an embodiment of the present invention;

[0032] Figure 8 This is a disassembly diagram of the receiving optical fiber and detector chip provided in an embodiment of the present invention;

[0033] Figure 9 This is a schematic diagram of the assembly of the circuit board and the thermally conductive substrate provided in an embodiment of the present invention;

[0034] Figure 10This is a disassembly diagram of the circuit board and thermally conductive substrate provided in an embodiment of the present invention;

[0035] Figure 11 This is a disassembly diagram of the base and circuit board provided in an embodiment of the present invention;

[0036] Figure 12 This is a schematic diagram of the optical path principle provided in an embodiment of the present invention.

[0037] The labels for the attached figures are as follows:

[0038] 1000, Single-mode optical module;

[0039] 100. Laser chip; 110. Waveguide port; 120. First silicon substrate; 121. Snap-fit ​​structure; 121a. Positioning groove; 122. Second pad;

[0040] 200, beam splitter fiber; 210, incident light surface; 220, beam splitter surface;

[0041] 300 Connector; 310 Transmitting fiber; 311 Incident surface; 320 Receiving fiber; 321 Reflecting surface;

[0042] 400. Backlight chip; 410. Second active area;

[0043] 500, pressure plate;

[0044] 600, Detector chip; 610, First active region; 620, Second silicon substrate; 621, Placement boss; 622, Third pad;

[0045] 700, thermally conductive substrate; 710, fourth pad;

[0046] 800, Circuit board; 810, First solder pad; 820, Mounting slot; 830, Gold finger;

[0047] 900, Housing; 910, Base; 911, Receiving groove; 912, Protrusion; 920, Top cover; 930, Shielding cover. Detailed Implementation

[0048] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

[0049] This invention provides a single-mode optical module 1000, such as... Figures 1 to 6As shown, the single-mode optical module 1000 includes a laser chip 100, a beam splitter 200, a connector 300, and a backlight chip 400. The laser chip 100 is provided with a waveguide port 110. The beam splitter 200 includes an incident surface 210 and a beam splitter 220 arranged opposite to each other in the extension direction of the optical fiber. The incident surface 210 is opposite to the waveguide port 110, and the incident surface 210 is perpendicular to the extension direction of the optical fiber. The beam splitter 220 is arranged at an angle to the extension direction of the optical fiber. Connector 300 is used to receive and transmit light signals. Connector 300 includes transmitting optical fiber 310, which is located on the transmission optical path of beam splitting surface 220. Transmitting optical fiber 310 includes incident surface 311 which is connected to and parallel to beam splitting surface 220. The extension direction of beam splitting optical fiber 200 is set at an angle with both beam splitting surface 220 and incident surface 311. Backlight chip 400 is located on the refraction optical path of beam splitting surface 220. Backlight chip 400 is used to monitor and feedback the power of light waves.

[0050] The single-mode optical module 1000 of this application can solve the problem of the difficulty in reducing the size of optical modules in the prior art. Its layout is simple and the volume is reduced by reducing other optical components.

[0051] Specifically, the light wave emitted from waveguide 110 enters the beam splitter 200 through the incident surface 210. The light wave then passes through the beam splitter 220, which splits the light wave into a reflected beam and a transmitted beam. Part of the emitted light wave forms a transmitted beam, entering the transmitting fiber 310 of connector 300 to transmit the optical signal externally. The other part of the emitted light wave forms a reflected beam, which is transmitted to the backlight chip 400. The backlight chip 400 monitors and feeds back the power of the emitted light wave to control or stabilize the output light power. Compared to existing embodiments that use lenses for beam splitting, this application utilizes the beam splitter 200 to achieve direct optical coupling. Furthermore, because the beam splitter 200 replaces adapters, optical couplers, or fiber optic connectors, the structure is simplified while the overall space occupancy is reduced, ultimately reducing the size of the single-mode optical module 1000 and optimizing the overall structure. In addition, the reduction in the use of adapters, optical couplers, or fiber optic connectors lowers the production cost of this application's solution, making it more suitable for mass production.

[0052] In this application, multiple waveguide ports 110 can be provided, and the number of splitting optical fibers 200 and transmitting optical fibers 310 is matched with the number of waveguide ports 110 to realize synchronous transmission of multi-channel optical paths. For example, four waveguide ports 110, four splitting optical fibers 200 and four transmitting optical fibers 310 are provided.

[0053] The light-incident surface 210 of the beam splitter 200 is positioned close to and parallel to the waveguide port 110, so that the light waves emitted from the waveguide port 110 can be directly coupled into the beam splitter 200, reducing optical power loss, maximizing the coupled optical power, and stably reaching the power of the light waves at the beam splitter surface 220.

[0054] Preferably, in this application, the extension direction of the beam splitter 200 is set at a 45° angle to both the beam splitter surface 220 and the incident surface 311. The 45° angle setting allows the reflected light path to enter the backlight chip 400 perpendicular to the extension direction of the fiber, resulting in a shorter transmission distance and reduced light loss during transmission.

[0055] It should be noted that the principle by which light waves can pass through the beam splitter 220 is that an optical film is deposited on its 45° inclined surface to form the beam splitter 220. The optical film can be a titanium dioxide optical film, so that the light beam transmitted to the beam splitter 220 is partially reflected and partially transmitted.

[0056] It is worth mentioning that the reflectance of the optical film can be adjusted arbitrarily to meet different performance requirements.

[0057] For example, the reflection ratio of the portion of the optical film coated on the beam-splitting surface 220 can be set to 98%, while the transmission ratio can be 2%. Of course, those skilled in the art can freely adjust the ratio values ​​according to actual design requirements, and no limitation is made here.

[0058] In this application, the backlight chip 400 is configured to monitor the optical power within the single-mode optical module 1000 in real time, enabling the single-mode optical module 1000 to output optical power of different requirements and levels according to needs, thus improving adaptability. Operators can control the current of the laser chip 100 based on the optical power monitored and fed back by the backlight chip 400. The magnitude of the current affects the output power and frequency of the laser chip 100, thereby controlling or stabilizing the output optical power. Specifically, the backlight chip 400 can be a 4-channel MPD array chip. The backlight chip 400 includes a second active region 410 for receiving reflected light. The center of the 45° beam splitting surface 220 is located on the same center line as the center of the second active region 410, which is more conducive to the reception of the beam by the second active region 410, ensuring that all beams can be received by the second active region 410.

[0059] Preferably, in this application, the incident surface 311 and the beam splitting surface 220 are bonded together. Bonding the incident surface 311 and the beam splitting surface 220 can improve the positional accuracy of their assembly and make the connection between them more reliable, thereby making the output of the beam splitting fiber 200 to the transmitting fiber 310 more stable and reliable.

[0060] It should be noted that in this application, optical path adhesive is used for bonding, such as 353ND adhesive, which not only ensures a strong connection but also avoids negative impacts on the performance of the optical fiber.

[0061] Reference Figure 7 In one embodiment, the laser chip 100 further includes a first silicon substrate 120, with waveguide ports 110 disposed on the first silicon substrate 120. The first silicon substrate 120 is provided with a snap-fit ​​structure 121 for mounting the beam splitter 200. This configuration eliminates the need for adding a specific component to fix the beam splitter 200; the laser chip 100 itself fixes the beam splitter 200, which is more conducive to reducing the overall size. Furthermore, since the waveguide ports 110 of the beam splitter 200 are all mounted on the first silicon substrate 120, the first silicon substrate 120 provides the same mounting reference for the waveguide ports 110 and the beam splitter 200. Fixing the beam splitter 200 also ensures that the beam splitter 200 and the waveguide ports 110 are aligned, improving the stability and accuracy of the optical path output.

[0062] Specifically, the waveguide port 110 is integrated on the first silicon substrate 120, which helps to reduce the size of the laser chip 100. The waveguide port 110 protrudes from the first silicon substrate 120, and the snap-fit ​​structure 121 is a positioning groove 121a provided on the first silicon substrate 120. The positioning groove 121a extends in the extension direction of the optical fiber, with one end adjacent to the waveguide port 110 and the other end penetrating through the side wall of the first silicon substrate 120. This allows a portion of the splitting optical fiber 200 to be accommodated in the positioning groove 121a, which enables it to automatically align with the waveguide port 110, ensuring assembly accuracy while reducing assembly alignment time.

[0063] In this embodiment, the positioning groove 121a can be a V-shaped groove to ensure that it can fully fit and fix with the beam splitter 200. Of course, the positioning groove 121a can also be set to a shape that is compatible with the beam splitter 200, which is not limited here.

[0064] Refer again Figure 7 In one embodiment, the single-mode optical module 1000 further includes a pressure plate 500, with the splitting fiber 200 sandwiched between the first silicon substrate 120 and the pressure plate 500. This arrangement allows the pressure plate 500 to hold the splitting fiber 200, effectively preventing it from detaching from the first silicon substrate 120, further maintaining the relative position of the splitting fiber 200 and the waveguide port 110, and improving the stability of the optical path output.

[0065] Preferably, when the optical fiber 200 is sandwiched between the first silicon substrate 120 and the pressure plate 500, it can also be glued to make the connection between the three more secure.

[0066] Reference Figure 8In one embodiment, the single-mode optical module 1000 further includes a detector chip 600, which has a first active region 610. The first active region 610 is used to receive externally transmitted optical signals and convert them into electrical signals. The connector 300 also includes a receiving optical fiber 320, which is used to receive the transmitted optical signals. The receiving optical fiber 320 includes a reflective surface 321, and the extension direction of the receiving optical fiber 320 is set at a 45° angle to the reflective surface 321. The first active region 610 is located on the refracted optical path of the reflective surface 321. With this configuration, the receiving optical fiber 320 can reflect the transmitted light waves through the reflective surface 321 to the first active region 610 of the detector chip 600, thereby achieving signal exchange. The 45° angle between the reflective surfaces 321 allows the light waves to be transmitted vertically downwards to the detector chip 600, resulting in a shorter transmission distance and reduced optical loss.

[0067] Specifically, the number of the first active region 610 and the receiving optical fiber 320 is the same as that of the waveguide port 110. For example, there are four of each of the first active region 610 and the receiving optical fiber 320.

[0068] Connector 300 can be a 12-channel MPO / MTP type connector, enabling signal transmission and reception while also having spare optical fiber for future channel additions.

[0069] Refer again Figure 8 In one embodiment, the detector chip 600 further includes a second silicon substrate 620, with a first active region 610 disposed on the second silicon substrate 620. A mounting protrusion 621 is provided on the second silicon substrate 620, and the receiving optical fiber 320 is mounted on the mounting protrusion 621, so that the reflecting surface 321 is located on top of the first active region 610. This configuration utilizes the detector chip 600's own structure to fix the receiving optical fiber 320, eliminating the need for additional components and resulting in a more compact overall design. Furthermore, the integration of the first active region 610 into the second silicon substrate 620 further reduces the size of the detector chip 600, making it easier to maintain the relative position of the reflecting surface 321 with the receiving active region, thereby improving the reception stability of the optical path.

[0070] Furthermore, the receiving optical fiber 320 is secured at the placement boss 621 to prevent the receiving optical fiber 320 from shifting and improve the stability of optical path transmission. Specifically, the placement boss 621 is provided with a slot, and a portion of the receiving optical fiber 320 adjacent to the reflective surface 321 is secured in the slot to maintain a limiting and fixing effect. More specifically, the slot is also a V-shaped groove.

[0071] Reference Figure 2In one embodiment, the single-mode optical module 1000 further includes a thermally conductive substrate 700, on which the laser chip 100, detector chip 600, and backlight chip 400 are all mounted. This arrangement, with the laser chip, detector chip 600, and backlight chip 400 all mounted on the same thermally conductive substrate 700, helps ensure the accuracy of their assembly positions. Furthermore, the thermally conductive substrate 700 is designed to dissipate heat from all chips, ensuring that these optical chips operate at the same temperature and guaranteeing the stability of all chip outputs.

[0072] Specifically, the thermally conductive substrate 700 is made of ceramic or silicon.

[0073] Reference Figure 9 In one embodiment, the single-mode optical module 1000 further includes a circuit board 800, with a thermally conductive substrate 700 mounted on the circuit board 800. The circuit board 800 has a plurality of first pads 810. The laser chip 100, detector chip 600, and backlight chip 400 are electrically connected to the circuit board 800 through corresponding first pads 810. This arrangement provides a robust physical connection through the first pads 810, helping to ensure the reliability of the connection between the circuit board 800 and the silicon-based chip. Simultaneously, the pad connection method is simple and low-cost, suitable for mass production, which helps reduce manufacturing costs and improve production efficiency.

[0074] Specifically, a second pad 122 is provided on the first silicon substrate 120, a third pad 622 is provided on the second silicon substrate 620, and a fourth pad 710 is provided on the thermally conductive substrate 700. The second pad 122, the third pad 622, and the fourth pad 710 are respectively soldered to the corresponding first pad 810 by metal wire, thereby realizing the electrical connection of the circuit board 800 to the laser chip 100, the detector chip 600, and the backlight chip 400.

[0075] In this embodiment, the circuit board 800 is also provided with gold fingers 830, which are used for communication and identification with the metal connection points of external devices. The metal sheet is located outside the single-mode optical module 1000, which facilitates installation and improves the stable connection and data transmission between the single-mode optical module 1000 and external devices.

[0076] Reference Figure 10 In one embodiment, the circuit board 800 is provided with a mounting groove 820, in which the thermally conductive substrate 700 is housed. This arrangement reduces the space occupied by the thermally conductive substrate 700 within the single-mode optical module 1000, thus contributing to a smaller overall size. Furthermore, the mounting groove 820 can also position the thermally conductive substrate 700, improving the assembly position accuracy between the chip and the circuit board 800 and facilitating electrical connection between the two.

[0077] It is worth mentioning that the heat-conducting substrate 700, housed in the mounting groove 820, can also shorten the height difference between the second pad 122, the third pad 622, the fourth pad 710 and the first pad 810, thereby helping to shorten the connection length of the metal wire. The shorter metal wire is less likely to break, making the single-mode optical module 1000 more reliable.

[0078] Reference Figure 2 and Figure 11 In one embodiment, the single-mode optical module 1000 further includes a housing 900, in which the laser chip 100, the beam splitter 200, the connector 300, and the backlight chip 400 are all housed for protection.

[0079] Furthermore, the housing 900 also includes a top cover 920 and a base 910. The top cover 920 covers the base 910, and the base 910 has a receiving groove 911. The circuit board 800 is installed in the receiving groove 911. A protrusion 912 is provided at the bottom of the receiving groove 911. The protrusion 912 fits against the circuit board 800 and is correspondingly arranged with the heat-conducting substrate 700. This arrangement helps to transfer the heat of the heat-conducting substrate 700 to the outside of the housing 900 through the protrusion 912, further improving the heat dissipation effect of the single-mode optical module 1000 and enabling it to maintain stable operation.

[0080] Reference Figure 2 In one embodiment, the single-mode optical module 1000 further includes a shielding cover 930, which covers the laser chip 100, the detector chip 600, the beam splitter 200 and the backlight chip 400 to reduce interference from external factors when the single-mode optical module 1000 is working.

[0081] Reference Figure 12 To better understand the work and optical path principle of this application, a detailed description is provided below through specific implementation methods.

[0082] The divergent light output from the waveguide port 110 of the laser chip 100 is directly coupled into the light-incident surface 210 of the beam splitter 200 and transmitted within the beam splitter 200. Upon reaching the beam splitter 220, the divergent light is split into reflected and transmitted light. The reflected light is transmitted downwards to the backlight chip 400 to monitor the optical power. The transmitted light enters the transmitting fiber 310 in the connector 300 and continues to transmit signals to external devices. The signals returned by the external devices are received by the receiving fiber 320 in the connector 300 and, through total internal reflection by the reflecting surface 321, transmitted downwards to the first active region 610 of the detector chip 600. The optical signal is then converted into an electrical signal and transmitted to the circuit board 800, completing the information exchange.

[0083] It should be understood that the above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit them. Those skilled in the art can modify the technical solutions described in the above embodiments, or make equivalent substitutions for some of the technical features; and all such modifications and substitutions should fall within the protection scope of the appended claims of the present invention.

Claims

1. A single mode optical module, characterized by, The application relates to a laser chip, a light splitting fiber, a connector, a backlight chip, a probe chip, a heat-conducting substrate, a circuit board, a base and a shielding cover. The laser chip is provided with a waveguide port; the light splitting fiber is provided with an incident surface and a light splitting surface which are oppositely arranged in the extending direction of the light splitting fiber; the incident surface is arranged opposite to the waveguide port and is perpendicular to the extending direction of the light splitting fiber; the light splitting surface is arranged at an angle with the extending direction of the light splitting fiber; the connector is used for transmitting and receiving optical signals and comprises a transmitting optical fiber which is arranged on the transmission light path of the light splitting surface; the transmitting optical fiber comprises an incident surface which is connected with the light splitting surface and is arranged in parallel; the extending direction of the light splitting fiber is arranged at an angle with the incident surface; the backlight chip is arranged on the refraction light path of the light splitting surface and is used for monitoring and feeding back the power of the optical wave. The laser chip further comprises a first silicon base, the waveguide port is arranged on the first silicon base, and the first silicon base is provided with a clamping structure for mounting the light splitting fiber. The light splitting fiber is clamped between the first silicon base and a pressing plate. The probe chip is provided with a first active region; the connector further comprises a receiving optical fiber which is used for receiving the returned optical signals; the receiving optical fiber comprises a reflecting surface; the extending direction of the receiving optical fiber is arranged at an angle of 45 degrees with the reflecting surface; and the first active region is arranged on the refraction light path of the reflecting surface.

2. The single-mode optical module according to claim 1, characterized by The probe chip further comprises a second silicon base, the first active region is arranged on the second silicon base, the second silicon base is provided with a placing boss, the receiving optical fiber is mounted on the placing boss so that the reflecting surface is arranged on the top of the first active region.

3. The single-mode optical module according to claim 2, characterized by The laser chip and the probe chip and the backlight chip are mounted on the heat-conducting substrate.

4. The single-mode optical module according to any one of claims 1 to 3, characterized by, The heat-conducting substrate is mounted on the circuit board, the circuit board is provided with a plurality of first pads, and the laser chip, the probe chip and the backlight chip are electrically connected with the circuit board through the corresponding first pads. The circuit board is provided with a mounting groove, and the heat-conducting substrate is accommodated in the mounting groove. The base is provided with an accommodating groove, the circuit board is mounted in the accommodating groove, the bottom of the accommodating groove is provided with a protrusion, the protrusion is matched with the circuit board, and the protrusion is arranged in correspondence with the heat-conducting substrate.

5. The single-mode optical module according to claim 4, characterized by The shielding cover is arranged outside the laser chip, the probe chip, the light splitting fiber and the backlight chip.

6. The single-mode optical module according to claim 5, characterized by ​ 7. The single-mode optical module according to claim 6, characterized by ​ 8. The single-mode optical module according to claim 7, characterized by ​ 9. The single-mode optical module according to claim 8, characterized by ​ 10. The single-mode optical module according to claim 9, characterized by ​

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