Substrate processing device and substrate processing method

Abstract

The present invention provides a substrate processing device and a substrate processing method that can suppress the decline in conveying efficiency. A plurality of conveying robots and a plurality of modules are arranged in an interface portion that connects a pre-processing section that performs a process before exposure processing on a substrate and a post-processing section that performs a process after a post-process to an exposure device. In the interface portion, outbound path conveying of conveying a substrate from the pre-processing section to the exposure device and return path conveying of conveying a substrate from the exposure device to the post-processing section are performed. When a conveying conflict occurs between the outbound path conveying and the return path conveying, the outbound path conveying is performed in priority over the return path conveying. Specifically, even when a delivery notice signal on the outbound path conveying side is sent later than a delivery notice signal on the return path conveying side, the substrate conveying on the outbound path conveying side is performed first. The exposure device can be prevented from being in a standby state, thereby suppressing the decline in the conveying efficiency of the substrate.

Description

Technical Field

[0001] The present invention relates to a substrate processing device and a substrate processing method for performing a pre-exposure processing on a substrate and a post-exposure processing on a substrate. The substrate to be processed includes, for example, a glass substrate for a liquid crystal display device, a glass substrate for an organic electroluminescence (EL) display, a glass substrate for a plasma display panel (PDP), or a glass substrate for a photomask. Background Art

[0002] In the past, there is known a substrate processing device, wherein the substrate is moved in from a device having a loading table for placing a cassette for accommodating a plurality of substrates and a transport device (also called an indexer device), and the substrate processing device takes the substrate as an object, sequentially performs a process of forming a coating film of a photoresist, a process of drying under reduced pressure, a process of drying by heating, moving the substrate into an exposure device, moving the substrate out of the exposure device, a process of developing the photoresist film after exposure, a process of rinsing, and a process of drying, and then moves the substrate out to the indexer device (for example, Patent Document 1, Patent Document 2, etc.).

[0003] In the substrate processing apparatus disclosed in Patent Documents 1 and 2, two exposure devices are connected to the substrate processing apparatus in order to avoid speed limitation in the exposure apparatus having a relatively long processing time. If two exposure devices are provided, even if one of the exposure devices is processing, the other idle exposure device can be used to perform exposure processing on the substrate, thereby preventing the substrate before exposure from being retained in the substrate processing apparatus.

[0004] [Prior art literature]

[0005] [Patent Document]

[0006] [Patent Document 1] Japanese Patent Application Publication No. 2006-24643

[0007] [Patent Document 2] Japanese Patent Application Publication No. 2006-24642 Summary of the invention

[0008] [Problems to be solved by the invention]

[0009] Furthermore, when two exposure devices are connected, depending on the user-side operation of the substrate processing device, there may be a case where two exposure devices that perform the same process (equipped with the same mask) are connected, and a case where two exposure devices that perform different processes (equipped with different masks) are connected. When two exposure devices that perform different processes are connected, the substrate is usually transported to the two exposure devices in sequence and subjected to exposure processes using different masks twice. On the other hand, when two exposure devices that perform the same process are connected, the substrate is transported to only one exposure device and subjected to exposure processing once. That is, depending on the connection status of the two exposure devices, it is necessary to change the transport form of the interface portion that is carried in and out of the exposure device, thereby forming a complex transport sequence.

[0010] In addition, in the exposure device, the time required for the exposure process of one substrate is not fixed in most cases, but varies. When the processing time in the exposure device varies, a transport conflict may occur in the interface between the outbound path transporting the unexposed substrate to the exposure device and the return path transporting the exposed substrate returning from the exposure device. When such a transport conflict occurs, substrates are left in a standby state waiting for transport, and the transport efficiency of the interface is significantly reduced.

[0011] The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a substrate processing apparatus and a substrate processing method capable of suppressing a decrease in transfer efficiency.

[0012] [Technical means to solve the problem]

[0013] In order to solve the above-mentioned problem, the invention of technical solution 1 is a substrate processing device, which performs a pre-exposure processing process on a substrate and a post-exposure processing process on a substrate, and the substrate processing device is characterized in that it includes: a pre-processing unit, which performs the processing of the pre-processing process; a post-processing unit, which performs the processing of the post-processing process; an interface unit, which connects the pre-processing unit and the post-processing unit with a first exposure device and a second exposure device, and includes a plurality of transport robots and a plurality of modules for transporting substrates; and a control unit, which controls the plurality of transport robots, and the control unit controls the plurality of transport robots and the plurality of modules in a manner that prioritizes the outgoing path transport of the substrate from the pre-processing unit to the first exposure device or the second exposure device over the return path transport of the substrate from the first exposure device or the second exposure device to the post-processing unit.

[0014] In addition, the invention of Technical Solution 2 is a substrate processing device according to the invention of Technical Solution 1, characterized in that the multiple transport robots include a bidirectional transport robot that performs both the outgoing path transport and the return path transport, and the multiple modules include: a first module, which is located on the upstream side of the bidirectional transport robot along the transport direction of the outgoing path transport; and a second module, which is located on the upstream side of the bidirectional transport robot along the transport direction of the return path transport, and the control unit controls the bidirectional transport robot in a manner that prioritizes the removal of the substrate from the first module when the bidirectional transport robot receives a delivery notice signal from the first module after receiving the delivery notice signal from the second module and before accepting the substrate from the second module.

[0015] In addition, the invention of technical solution 3 is a substrate processing device based on the invention of technical solution 2, characterized in that the first module sends a delivery notification signal at a set time earlier than the delivery request signal, and the set time is the value obtained by adding the time required for the bidirectional transport robot to transport the substrate from the second module to the module of the next process and the time required for the preparation action to move the substrate out of the first module.

[0016] In addition, the invention of technical solution 4 is a substrate processing device according to the invention of technical solution 2, characterized in that the control unit controls the bidirectional transport robot in such a manner that the substrate is moved out of the second module when the substrate transportation from the first module to the module of the next process, which is executed preferentially, is completed and a delivery request signal has been sent from the second module.

[0017] In addition, the invention of technical solution 5 is a substrate processing device according to the invention of technical solution 1, characterized in that the multiple transport robots include an upstream transport robot whose transport direction along the going path is on the upstream side and a downstream transport robot whose transport direction along the going path is on the downstream side, and the multiple modules include a temperature control module, which is located between the upstream transport robot and the downstream transport robot along the transport direction of the going path, and performs temperature control processing on the substrate, and the temperature control module sends an acceptance notice signal to the upstream transport robot after a specified time earlier than the completion of the temperature control processing and after the downstream transport robot starts to replace the substrate with the first exposure device or the second exposure device.

[0018] In addition, the invention of technical solution 6 is a substrate processing device according to the invention of technical solution 1, characterized in that the multiple transport robots include a bidirectional transport robot that performs both the outgoing path transport and the return path transport, and the control unit controls the bidirectional transport robot in a manner of dividing the cycle time of the bidirectional transport robot for a series of actions into two equal parts, one of which is set as the outgoing path transport time for the outgoing path transport, and the other is set as the return path transport time for the return path transport, and the outgoing path transport time and the return path transport time each include surplus time.

[0019] In addition, the invention of technical solution 7 is a substrate processing device according to the invention of technical solution 6, characterized in that the multiple modules include an upstream module, and the upstream module is located on the upstream side of the bidirectional transport robot along the transport direction of the transport path, and the control unit controls the bidirectional transport robot in such a way that the bidirectional transport robot moves the starting substrate out of the upstream module after the starting substrate of a batch waits in the upstream module for a specified time.

[0020] In addition, the invention of technical solution 8 is a substrate processing device according to any one of the inventions of technical solutions 1 to 7, characterized in that the pre-processing unit includes a coating unit for coating the substrate with an anti-etching agent, and the post-processing unit includes a developing unit for developing the substrate after exposure processing.

[0021] In addition, the invention of technical solution 9 is a substrate processing method, which performs a pre-exposure processing process on a substrate and performs a post-exposure processing process on a substrate. The substrate processing method is characterized in that it includes a transport process, and the transport process uses an interface part that connects a pre-processing part that performs the pre-processing process and a post-processing part that performs the post-processing process to a first exposure device and a second exposure device to transport the substrate that has undergone the pre-processing process to the first exposure device and / or the second exposure device, and transports the substrate that has undergone the exposure process to the post-processing part. The interface part includes multiple transport robots and multiple modules for transporting the substrate. In the transport process, compared with the return path transport of the substrate from the first exposure device or the second exposure device to the post-processing part, the outbound path transport of the substrate from the pre-processing part to the first exposure device or the second exposure device is prioritized.

[0022] In addition, the invention of technical solution 10 is a substrate processing method according to the invention of technical solution 9, characterized in that the multiple transport robots include a bidirectional transport robot that performs both the outgoing path transport and the return path transport, and the multiple modules include: a first module, which is located on the upstream side of the bidirectional transport robot along the transport direction of the outgoing path transport; and a second module, which is located on the upstream side of the bidirectional transport robot along the transport direction of the return path transport. In the transport process, when the bidirectional transport robot receives a delivery notice signal from the first module after receiving the delivery notice signal from the second module and before accepting the substrate from the second module, the bidirectional transport robot prioritizes carrying the substrate out of the first module.

[0023] In addition, the invention of technical solution 11 is a substrate processing method according to the invention of technical solution 10, characterized in that the first module sends a delivery notification signal at a set time earlier than the delivery request signal, and the set time is the value obtained by adding the time required for the bidirectional transport robot to transport the substrate from the second module to the module of the next process and the time required for the preparation action to move the substrate out of the first module.

[0024] In addition, the invention of technical solution 12 is a substrate processing method according to the invention of technical solution 10, characterized in that when the substrate transportation from the first module to the module of the next process is completed and a delivery request signal has been sent from the second module, the bidirectional transport robot executes the removal of the substrate from the second module.

[0025] In addition, the invention of technical solution 13 is a substrate processing method according to the invention of technical solution 9, characterized in that the multiple transport robots include an upstream transport robot whose transport direction along the going path is on the upstream side and a downstream transport robot whose transport direction along the going path is on the downstream side, and the multiple modules include a temperature control module, which is located between the upstream transport robot and the downstream transport robot along the transport direction of the going path, and performs temperature control processing on the substrate, and the temperature control module sends an acceptance notice signal to the upstream transport robot after a specified time earlier than the completion of the temperature control processing and after the downstream transport robot starts to replace the substrate with the first exposure device or the second exposure device.

[0026] In addition, the invention of technical solution 14 is a substrate processing method according to the invention of technical solution 9, characterized in that the multiple transport robots include a bidirectional transport robot that performs both the outgoing path transport and the return path transport, and the cycle time for the bidirectional transport robot to perform a series of actions is divided into two equal parts, one of which is set as the outgoing path transport time for the outgoing path transport, and the other is set as the return path transport time for the return path transport, so that the bidirectional transport robot performs the transport action, and the outgoing path transport time and the return path transport time each include surplus time.

[0027] In addition, the invention of technical solution 15 is a substrate processing method according to the invention of technical solution 14, characterized in that the multiple modules include an upstream module, and the upstream module is located on the upstream side of the bidirectional transport robot along the transport direction of the transport path, and after the starting substrate of the batch waits in the upstream module for a specified time, the bidirectional transport robot moves the starting substrate out of the upstream module.

[0028] In addition, the invention of technical solution 16 is a substrate processing method according to any one of the inventions of technical solution 9 to technical solution 15, characterized in that the front process includes a process of coating the substrate with an anti-etching agent, and the back process includes a process of developing the substrate after exposure processing.

[0029] [Effects of the Invention]

[0030] According to the invention of claim 1 to claim 8 , the outgoing path transport is prioritized over the return path transport, thereby preventing the substrate from being stopped during the outgoing path transport and the exposure device from being in a standby state, thereby suppressing a decrease in the substrate transport efficiency.

[0031] In particular, according to the invention of technical solution 4, when the substrate transportation from the first module to the module of the next process is completed and the delivery request signal has been sent from the second module, the substrate is carried out from the second module, thereby preventing the transportation on the outgoing path from being over-prioritized and the transportation on the return path from being stagnant.

[0032] In particular, according to the invention of technical solution 5, the temperature control module sends an acceptance warning signal to the upstream transport robot after a specified time earlier than the completion of the temperature control process and after the downstream transport robot starts to replace the substrate with the first exposure device or the second exposure device, thereby preventing the upstream transport robot from waiting while maintaining the substrate to be moved in, thereby suppressing the decrease in transport efficiency.

[0033] In particular, according to the invention of technical solution 6, the cycle time of the bidirectional transport robot performing a series of actions is divided into two equal parts, one of which is the outgoing path transport time for outgoing path transport, and the other is the return path transport time for return path transport, and the outgoing path transport time and the return path transport time each include surplus time, so that the surplus time can absorb the change in the processing time of the exposure device, and the substrate can be periodically sent out at a position downstream of the bidirectional transport robot, thereby suppressing the decrease in the transport efficiency of the substrate.

[0034] According to the invention of technical solutions 9 to 16, the outgoing path conveyance is performed preferentially compared with the return path conveyance, thereby preventing the substrate from being stagnant during the outgoing path conveyance and the exposure device from being put into a standby state, thereby suppressing the reduction in the conveyance efficiency of the substrate.

[0035] In particular, according to the invention of technical solution 12, when the substrate transportation from the first module to the module of the next process is completed and the delivery request signal has been sent from the second module, the bidirectional transport robot executes the transportation of the substrate from the second module, thereby preventing the excessive priority of the transport on the outgoing path and the stagnation of the transport on the return path.

[0036] In particular, according to the invention of technical solution 13, the temperature control module sends an acceptance warning signal to the upstream transport robot after a specified time earlier than the completion of the temperature control process and after the downstream transport robot starts to replace the substrate with the first exposure device or the second exposure device, thereby preventing the upstream transport robot from waiting while maintaining the substrate to be moved in, thereby suppressing the decrease in transport efficiency.

[0037] In particular, according to the invention of technical solution 14, the cycle time for a series of actions of the bidirectional transport robot is divided into two equal parts, one of which is set as the outgoing path transport time for outgoing path transport, and the other is set as the return path transport time for return path transport, so that the bidirectional transport robot can perform the transport action, and the outgoing path transport time and the return path transport time respectively include surplus time, so that the surplus time can absorb the variation of the processing time of the exposure device, and the substrate can be periodically sent out at a position downstream of the bidirectional transport robot, thereby suppressing the reduction in the transport efficiency of the substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] Figure 1 This is a schematic diagram showing an example of the overall structure of the substrate processing apparatus of the present invention.

[0039] Figure 2 It is a block diagram showing the structure of the control unit.

[0040] Figure 3 This is a diagram showing an example of the structure of the interface unit.

[0041] Figure 4 This is a diagram showing an example of a stacked configuration of modules.

[0042] Figure 5 It means in Figure 3 A diagram of a transport route for transporting a substrate to both a first exposure device and a second exposure device through an interface portion.

[0043] Figure 6 It means in Figure 3 A diagram of a transport route in which the interface portion transports the substrate only to the first exposure device.

[0044] Figure 7 It means in Figure 3 A diagram of a transport route in which the interface portion transports the substrate only to the second exposure device.

[0045] Figure 8 This is a diagram showing another example of the structure of the interface unit.

[0046] Fig. 9 It means in Figure 8 A diagram of a transport route for transporting a substrate to both a first exposure device and a second exposure device through an interface portion.

[0047] Fig.10 It means in Figure 8 A diagram of a transport route in which the interface portion transports the substrate only to the first exposure device.

[0048] Fig.11 It means in Figure 8 A diagram of a transport route in which the interface portion transports the substrate only to the second exposure device.

[0049] Fig.12 This is a schematic diagram for explaining an example of transport conflict.

[0050] Fig.13 This is a timing diagram showing the transmission and reception of handshake signals between the module and the transport robot.

[0051] Fig.14 This is a timing chart showing an example of a transport sequence when a transport conflict occurs.

[0052] Fig.15 is a timing chart showing another example of a transport sequence when a transport conflict occurs.

[0053] Fig.16 This is a diagram showing the operation time distribution of the transport robot.

[0054] [Explanation of Symbols]

[0055] 1: Substrate processing equipment

[0056] 2: Indexer device

[0057] 3a: First exposure device

[0058] 3b: Second exposure device

[0059] 3: Exposure device

[0060] 11: Pre-processing unit

[0061] 12: Post-processing unit

[0062] 20: Interface part / first interface part

[0063] 220: Interface part / second interface part

[0064] 31: The first transport robot

[0065] 32: Second handling robot

[0066] 33: The third transport robot

[0067] 34: The fourth transport robot

[0068] 35: The fifth transport robot

[0069] 37: First Path

[0070] 38: Second Path

[0071] 39: The Third Path

[0072] 51: Cooling plate

[0073] 52: Edge exposure machine

[0074] 53: Buffer

[0075] 55: First temperature regulator

[0076] 56: Second temperature regulator

[0077] 57: Output path

[0078] 58: First output path

[0079] 59: Second output path

[0080] 61: Air supply unit

[0081] 62: Loading table

[0082] 63: Driving mechanism

[0083] 64: Opening

[0084] 65: Support pin

[0085] 90: Control Department

[0086] 92: Input

[0087] 93: Display unit

[0088] 94: Memory Department

[0089] 95: Solution

[0090] 111: Cleaning Department

[0091] 112: Coating Department

[0092] 113: Decompression drying section

[0093] 114: Pre-baking section

[0094] 121: Development Department

[0095] 122: Post-baking department

[0096] 123: Cooling Department

[0097] G: Substrate

[0098] PA, PB: Free space / space

[0099] S1, S2, S3, S4, S5, S6, S7: Steps DETAILED DESCRIPTION

[0100] Hereinafter, the embodiments of the present invention will be described in detail with reference to the accompanying drawings. Hereinafter, the expressions (e.g., "in a direction", "along a direction", "parallel", "orthogonal", "center", "concentric", "coaxial", etc.) representing relative or absolute positional relationships, as long as there is no special description, not only strictly represent the positional relationship, but also represent the state of relative displacement of angle or distance within the tolerance or the range of the same degree of function. In addition, the expressions (e.g., "same", "equal", "homogeneous", etc.) representing equal states, as long as there is no special description, not only represent the state of being strictly equal quantitatively, but also represent the state of difference in the presence of tolerance or the same degree of function. In addition, the expressions (e.g., "circular shape", "quadrilateral shape", "cylindrical shape", etc.) representing shapes, as long as there is no special description, not only strictly represent the shape geometrically, but also represent the shape of the range of the same degree of effect, for example, it may also have concave-convex or chamfered corners, etc. In addition, each expression such as "include", "contain", "include", "include", "have" constituent elements is not an exclusive expression that excludes the presence of other constituent elements. In addition, the expression "at least one of A, B, and C" includes "only A", "only B", "only C", "any two of A, B, and C", and "all of A, B, and C".

[0101] <First embodiment>

[0102] <1-1. Overall structure of substrate processing apparatus>

[0103] Figure 1 This is a schematic diagram showing an example of the overall structure of the substrate processing device 1 of the present invention. The substrate processing device 1 is a device that performs a process before the exposure process on the substrate G, and performs a process after the exposure process. The process before the exposure process includes, for example, cleaning, coating of a processing liquid, drying of the processing liquid, and forming a coating film by heating. On the other hand, the process after the exposure process includes development, drying by heating after development, and cooling. The substrate G that becomes the processing object is, for example, a flat glass substrate. The substrate G has a first surface (also called an upper surface) as a first main surface, and a second surface (also called a lower surface) as a second main surface opposite to the first surface. In addition, Figure 1 In the following drawings, the size or number of each component may be exaggerated or simplified as necessary to facilitate understanding.

[0104] The indexer device 2 is connected to one end of the substrate processing device 1, and the first exposure device 3a and the second exposure device 3b are connected to the other end. That is, in this embodiment, two exposure devices 3a and 3b are connected to one line of substrate processing devices 1. In addition, when the first exposure device 3a and the second exposure device 3b are not particularly distinguished, they are collectively referred to as the exposure device 3.

[0105] The substrate processing apparatus 1 includes a pre-processing section 11 for performing a process before an exposure process, a post-processing section 12 for performing a process after an exposure process, and an interface section 20. In the overall transport route of the substrate G in the substrate processing apparatus 1, the pre-processing section 11 constitutes a portion of the outgoing path from the indexer device 2 to the interface section 20. On the other hand, the post-processing section 12 constitutes a portion of the return path from the interface section 20 to the indexer device 2.

[0106] The indexer device 2 has a stage on which a cassette containing a plurality of substrates G is placed, and a transfer mechanism for transferring the substrates G. As the transfer mechanism, for example, a transfer robot is used to transfer the substrates G between the cassette on the stage and the pre-processing section 11 and the post-processing section 12. The transfer mechanism takes out an unprocessed substrate G from the cassette on the stage and transfers it to the pre-processing section 11. In addition, the transfer mechanism receives the processed substrate G from the post-processing section 12 and stores it in the cassette.

[0107] The pre-processing section 11 includes a cleaning section 111, a coating section 112, a reduced pressure drying section 113, and a pre-baking section 114 as a plurality of processing sections. The processing sections of the pre-processing section 11 are arranged in the order in which the processing sections are described. The substrate G is transported by a transport robot or a conveyor, such as Figure 1 As indicated by the arrows drawn with two-dot chain lines in FIG. 1 , as the processing proceeds, the material is conveyed to each processing unit in the order described above.

[0108] The cleaning section 111 performs a cleaning process on the substrate G carried in from the indexer device 2. The cleaning process includes, for example, a process for removing organic contamination, such as fine particles, metal contamination, grease, and natural oxide film. In the cleaning section 111, for example, organic matter attached to the surface of the substrate G is removed by irradiation with ultraviolet light, the surface of the substrate G is cleaned by supplying a cleaning liquid such as deionized water and a cleaning member such as a brush, and the substrate G is dried by a blower. In the drying of the substrate G by the blower, for example, the cleaning liquid is removed from the substrate G by an air knife.

[0109] The coating unit 112 coats the processing liquid on the substrate G cleaned by the cleaning unit 111. The coating unit 112 is, for example, a slit coater. The slit coater can coat the processing liquid on the substrate G by moving the slit nozzle that ejects the processing liquid from the ejection port relative to the substrate G. Here, in the coating unit 112, in the area where the processing liquid is applied to the substrate G (also referred to as the coating area), the substrate G with the upper and lower surfaces in a horizontal position (also referred to as a horizontal position) is conveyed in a horizontal direction by a suspended conveying mechanism. The suspended conveying mechanism, for example, supports or holds the two end portions of the substrate G in the width direction perpendicular to the conveying direction of the substrate G (also referred to as the substrate conveying direction) from below, and blows compressed air toward the substrate G from below to hold the substrate G in a state where the upper and lower surfaces are in a horizontal direction, while moving the substrate G in a horizontal direction. In the coating unit 112, for example, the substrate G is conveyed by a conveyor in each of the portion located on the upstream side of the coating area (also referred to as the entry side portion) and the portion located on the downstream side of the coating area (also referred to as the exit side portion). The conveyor rotates a plurality of rollers arranged along the substrate conveying direction of the substrate G by a driving mechanism (not shown) to move the substrate G in a horizontal position in a horizontal direction. The coating unit 112 may also be a coating device of another coating method.

[0110] The treatment liquid applied by the coating unit 112 is, for example, a resist liquid or a liquid containing a polyimide precursor and a solvent (also called a PI (Polyimide) liquid) or the like for coating (also called a coating liquid). For example, polyimide precursors include polyamic acid (Polyamic acid). For example, NMP (N-Methyl-2-Pyrrolidone) is used as the solvent.

[0111] The reduced pressure drying unit 113 performs a process (also referred to as reduced pressure drying process) of drying the processing liquid applied to the substrate G by reducing pressure. Here, the solvent of the processing liquid applied to the surface of the substrate G is gasified (evaporated) by reducing pressure, thereby drying the substrate G.

[0112] The pre-baking section 114 heats the substrate G dried by the reduced pressure drying section 113, and solidifies the components contained in the treatment liquid on the surface of the substrate G. Thus, a film related to the treatment liquid is formed on the substrate G. For example, when the treatment liquid is a resist, a resist film is formed by heat-treating the coating film of the resist. For example, when the treatment liquid is a polyimide precursor, a polyimide film is formed by imidizing the polyimide precursor. The pre-baking section 114 can be a single-chip heating treatment section that heats a single substrate G, or a batch heating treatment section that heats a plurality of substrates G at once. Here, the processing time of the reduced pressure drying treatment in the reduced pressure drying section 113 is greatly different from the processing time of the heating treatment in the pre-baking section 114, and it is conceivable that the pre-baking section 114 has a single-chip heating treatment section. In this case, the pre-baking section 114 can also have, for example, a plurality of single-chip heating treatment sections that perform heating treatment in parallel. The plurality of heat treatment units are arranged, for example, in a state of being stacked up and down.

[0113] The interface unit 20 connects the pre-processing unit 11 and the post-processing unit 12 to the first exposure device 3a and the second exposure device 3b. The interface unit 20 transports the substrate G received from the pre-processing unit 11 to the first exposure device 3a and / or the second exposure device 3b. In addition, the interface unit 20 transports the exposed substrate G received from the first exposure device 3a and / or the second exposure device 3b to the post-processing unit 12. The interface unit 20 includes a plurality of transport robots and a plurality of modules for transporting the substrate G, and the detailed structure of the interface unit 20 will be further described later.

[0114] The first exposure device 3a and the second exposure device 3b perform exposure processing on the film related to the processing liquid formed on the substrate G in the pre-processing unit 11. Specifically, the exposure device 3 irradiates light of a specific wavelength such as far ultraviolet rays through a mask depicting a circuit pattern, and transfers the pattern to the film related to the processing liquid. The exposure device 3 may also include a peripheral exposure unit and a coding machine (TITLER). The peripheral exposure unit is a part that performs the following exposure processing, that is, it is used to remove the peripheral edge of the film related to the processing liquid on the substrate G. The coding unit is, for example, a part that writes specified information to the substrate G. The peripheral exposure unit and the coding unit may also have a rotating mechanism that changes the direction of the substrate G.

[0115] The post-processing unit 12 includes a developing unit 121, a post-baking unit 122, and a cooling unit 123 as a plurality of processing units. The processing units of the post-processing unit 12 are arranged in the order in which the processing units are described. Figure 1 As indicated by the arrows drawn with two-dot chain lines in FIG. 1 , as the processing proceeds, the material is conveyed to each processing unit in the order described above.

[0116] The developing section 121 performs a developing process on the film related to the processing liquid formed in the pre-processing section 11. The developing process includes, for example, a process of developing the film related to the processing liquid, a process of rinsing the developing liquid, and a process of drying the substrate G. In the developing section 121, for example, a process of immersing the film related to the processing liquid on the substrate G exposed to a pattern by the exposure device 3 in the developing liquid, a process of rinsing the developing liquid on the substrate G with a cleaning liquid such as deionized water, and a process of drying the substrate G with a blower or the like is performed. In the drying of the substrate G by the blower or the like, for example, it includes removing the cleaning liquid from the substrate G with an air knife.

[0117] The post-baking section 122 heats the substrate G to vaporize the cleaning liquid attached to the substrate G in the developing section 121 , thereby drying the substrate G.

[0118] The cooling unit 123 cools the substrate G heated by the post-baking unit 122. The cooling unit 123 adopts, for example, a structure in which the substrate G is air-cooled while being conveyed by a conveyor, or a structure in which the substrate G is placed on a shelf-like portion and cooled by blowing a gas such as air. The substrate G cooled by the cooling unit 123 is carried out from the post-processing unit 12 to the outside of the substrate processing apparatus 1 by the indexer device 2.

[0119] The operation of each unit of the substrate processing apparatus 1 is controlled by the control unit 90 . Figure 2 : is a block diagram showing the structure of the control unit 90. The hardware structure of the control unit 90 is the same as that of a general computer. That is, the control unit 90 includes: a central processing unit (CPU) which is a circuit for performing various calculations, a read-only memory (ROM (read only memory)) for storing basic programs, a random access memory (RAM) for storing various information, and a memory unit 94 (such as a magnetic disk or solid state disk (SSD)) for storing control software or data. The processing in the substrate processing device 1 is performed by executing a prescribed processing program by the CPU of the control unit 90.

[0120] The memory unit 94 of the control unit 90 stores a processing recipe 95 that specifies the order and conditions for processing the substrate G. The processing recipe 95 is input by an operator of the apparatus through an input unit 92 described later and stored in the memory unit 94, and is acquired by the substrate processing apparatus 1. Alternatively, the processing recipe 95 may be transmitted from a host computer that manages a plurality of substrate processing apparatuses 1 to the substrate processing apparatus 1 through communication and stored in the memory unit 94.

[0121] The control unit 90 is electrically connected to components such as a transfer robot provided in the interface unit 20 described later. The control unit 90 controls the transfer robot and the like according to the content of the processing recipe 95, for example.

[0122] In addition, the control unit 90 is connected to a display unit 93 and an input unit 92. The display unit 93 and the input unit 92 function as a user interface of the substrate processing apparatus 1. The control unit 90 displays various information on the display unit 93. The operator of the substrate processing apparatus 1 can input various instructions or parameters from the input unit 92 while confirming the information displayed on the display unit 93. As the input unit 92, for example, a keyboard or a mouse can be used. As the display unit 93, for example, a liquid crystal display can be used. In the present embodiment, as the display unit 93 and the input unit 92, a liquid crystal touch screen provided on the outer wall of the substrate processing apparatus 1 is used so that it has the functions of both.

[0123] <1-2. Structure of the first interface section>

[0124] Figure 3 2 is a diagram showing the structure of the first interface unit 20. The interface unit 20 includes a transport mechanism for transporting the substrate G and a plurality of modules. Figure 3 The interface unit 20 includes five transfer robots (a first transfer robot 31 , a second transfer robot 32 , a third transfer robot 33 , a fourth transfer robot 34 , and a fifth transfer robot 35 ) as a transfer mechanism.

[0125] The first transfer robot 31, the second transfer robot 32, the third transfer robot 33, the fourth transfer robot 34, and the fifth transfer robot 35 can each move the hand holding the substrate G forward and backward, and can perform rotation and lifting movements. Thus, the first transfer robot 31, the second transfer robot 32, the third transfer robot 33, the fourth transfer robot 34, and the fifth transfer robot 35 can each transfer the substrate G to the surrounding modules.

[0126] The first transport robot 31, the third transport robot 33, and the fourth transport robot 34 are one-handed robots that carry the substrate G with one hand. On the other hand, the second transport robot 32 that carries the substrate G in and out with respect to the first exposure device 3a and the fifth transport robot 35 that carries the substrate G in and out with respect to the second exposure device 3b are two-handed robots that have two hands. Thus, the second transport robot 32 and the fifth transport robot 35 can replace the unexposed substrate G with the exposed substrate G with respect to the first exposure device 3a and the second exposure device 3b, respectively.

[0127] In addition, the interface unit 20 has a cooling plate 51, an edge exposure machine 52, a buffer 53, a first temperature regulator 55, a second temperature regulator 56, a first path 37, a second path 38, a third path 39, a first output path 58, and a second output path 59 as modules. The module is a component that does not have a function of conveying the substrate G among the components provided in the interface unit 20, and is also the minimum control unit in the conveying control within the interface unit 20. In addition, strictly speaking, the control of the cooling plate 51 and the edge exposure machine 52 does not belong to the interface unit 20 (the control of the cooling plate 51 belongs to the pre-baking unit 114).

[0128] The cooling plate 51 is a plate including a cooling mechanism such as a cooling water circulation mechanism or a Peltier element. The substrate G after the temperature is raised is placed on the cooling plate 51 to cool the substrate G. The edge exposure device 52 exposes the peripheral portion of the substrate G on which the resist film is formed by irradiating light to the peripheral portion.

[0129] The buffer 53 includes shelves stacked in multiple layers (eg, 16 layers) that can accommodate one substrate G. Therefore, the buffer 53 can accommodate one or more substrates G.

[0130] The first temperature regulator 55 supplies gas adjusted to a predetermined temperature to the substrate G to adjust the temperature of the substrate G. The second temperature regulator 56 has the same structure as the first temperature regulator 55. The first temperature regulator 55 and the second temperature regulator 56 adjust the temperature of the substrate G to 23°C, which is a standard temperature in a clean room, for example.

[0131] The first path 37, the second path 38, and the third path 39 are respectively formed by stacking two stages on which a substrate G can be placed. The first output path 58 and the second output path 59 are respectively formed by stacking five stages on which a substrate G can be placed. The first path 37, the second path 38, the third path 39, the first output path 58, and the second output path 59 are respectively components for transferring substrates G between two transport robots.

[0132] Among the plurality of modules provided in the interface unit 20 , the first temperature regulator 55 , the first path 37 , and the first output path 58 are stacked in three layers along the vertical direction. Figure 4 FIG. 1 is a diagram showing an example of a stacked configuration of modules. Figure 4 In the stacked structure, the first temperature regulator 55 is arranged in the upper layer, the first path 37 is arranged in the middle layer, and the first output path 58 is arranged in the lower layer.

[0133] The first temperature regulator 55 on the upper layer includes an air supply unit 61, a mounting table 62 and a driving mechanism 63. A plurality of support pins 65 are erected on the upper surface of the mounting table 62. The mounting table 62 can carry a substrate G. The driving mechanism 63 moves the mounting table 62 up and down in the vertical direction, and rotates the mounting table 62 around an axis along the vertical direction. That is, the first temperature regulator 55 regulates the temperature of the substrate G, and also has the function of a turntable for rotating the substrate G in a horizontal plane. The air supply unit 61 blows gas whose temperature is adjusted to 23°C, for example, toward the substrate G which is placed on the mounting table 62 and raised to a specified temperature adjustment position by the driving mechanism 63. The first temperature regulator 55 is provided with an opening 64 for the hand of the first handling robot 31 to enter and exit. In addition, in the first temperature regulator 55, a portion of the air supply unit 61 is provided along the direction corresponding to the substrate G. Figure 4 An opening for the hand of the second transfer robot 32 to enter and exit is also provided on the near front side in a direction perpendicular to the paper surface.

[0134] The first path 37 in the middle layer is stacked in two layers and includes a loading table that can load one substrate G. The first output path 58 in the lower layer is stacked in five layers and includes a loading table that can load one substrate G. Both the first path 37 and the first output path 58 are provided with an opening (not shown) for the hand of the adjacent transfer robot to enter and exit.

[0135] Back to Figure 3 , the second output path 59 and the second path 38 are stacked in two layers along the vertical direction. The second output path 59 is arranged in the upper layer, and the second path 38 is arranged in the lower layer. In addition, the second temperature regulator 56 and the third path 39 are also stacked in two layers along the vertical direction. The second temperature regulator 56 is arranged in the upper layer, and the third path 39 is arranged in the lower layer. The second temperature regulator 56 has the same structure as the first temperature regulator 55, regulates the temperature of the substrate G, and also has the function of a turntable for rotating the substrate G in a horizontal plane.

[0136] like Figure 3As shown, a stacked structure of a cooling plate 51, a buffer 53, a first temperature regulator 55, a first path 37, and a first output path 58 is arranged around the first transport robot 31. The first transport robot 31 delivers the substrate G relative to the cooling plate 51, the buffer 53, the first temperature regulator 55, and the first path 37. The first transport robot 31 can deliver the substrate G relative to any shelf among the multiple shelves formed in the buffer 53. The first transport robot 31 is mainly responsible for the substrate transport on the entry side of the interface part 20.

[0137] A stacked structure of the first temperature regulator 55, the first path 37, and the first output path 58 is arranged around the second transfer robot 32. The second transfer robot 32 transfers the substrate G to the first temperature regulator 55, the first path 37, the first output path 58, and the first exposure device 3a. The second transfer robot 32 is mainly responsible for transferring the substrate G to the first exposure device 3a.

[0138] The first temperature regulator 55, the stacked structure of the first path 37 and the first output path 58, the stacked structure of the second output path 59 and the second path 38, and the edge exposure machine 52 are arranged around the third transport robot 33. The third transport robot 33 transfers the substrate G with respect to the first path 37, the first output path 58, the second output path 59, the second path 38, and the edge exposure machine 52. The third transport robot 33 is mainly responsible for transporting the substrate on the output side of the interface unit 20.

[0139] A stacked structure of the second output path 59 and the second path 38 and a stacked structure of the second temperature regulator 56 and the third path 39 are arranged around the fourth transfer robot 34. The fourth transfer robot 34 delivers the substrate G to the second output path 59, the second path 38, the second temperature regulator 56, and the third path 39. The fourth transfer robot 34 is responsible for the transfer of substrates in the interface unit 20.

[0140] A stacked structure of the second temperature regulator 56 and the third path 39 is arranged around the fifth transfer robot 35. The fifth transfer robot 35 transfers the substrate G to the second temperature regulator 56, the third path 39, and the second exposure device 3b. The fifth transfer robot 35 is mainly responsible for transferring the substrate G to the second exposure device 3b.

[0141] <1-3. Substrate processing sequence>

[0142] Next, a description will be given of a processing procedure of the substrate G in the substrate processing apparatus 1. First, a processing flow of the substrate G in the entire substrate processing apparatus 1 will be briefly described.

[0143] The indexer device 2 takes out the unprocessed substrate G stored in the cassette and puts it into the cleaning section 111 of the pre-processing section 11. The cleaning section 111 supplies, for example, a cleaning liquid to clean the surface of the substrate G, and dries the cleaning liquid after cleaning. The substrate G cleaned by the cleaning section 111 is conveyed to the coating section 112. In the present embodiment, the coating section 112 coats the surface of the cleaned substrate G with a resist liquid.

[0144] The substrate G coated with the resist liquid is conveyed from the coating section 112 to the reduced pressure drying section 113. The reduced pressure drying section 113 dries the resist liquid coated on the substrate G under reduced pressure. Thereafter, the substrate G is further conveyed from the reduced pressure drying section 113 to the pre-baking section 114. The pre-baking section 114 heats the substrate G and bakes the surface of the substrate G into a resist film.

[0145] The substrate G on which the resist film is formed in the pre-processing section 11 is conveyed to the first exposure device 3a and / or the second exposure device 3b through the interface section 20 and subjected to exposure processing. The substrate G after the exposure processing is conveyed to the post-processing section 12 through the interface section 20. The conveyance of the substrate G in the interface section 20 is described in more detail.

[0146] The developing unit 121 of the post-processing unit 12 supplies a developing solution to the substrate G after the exposure process to develop the resist film. The developing unit 121 also performs a process of washing the developing solution from the substrate G and drying the substrate G.

[0147] The substrate G after the development process is conveyed from the developing section 121 to the post-baking section 122. The post-baking section 122 heats the substrate G to evaporate and remove the developer or cleaning solution remaining on the substrate G. Thereafter, the substrate G is conveyed from the post-baking section 122 to the cooling section 123. The cooling section 123 cools the substrate G heated by the post-baking section 122. The substrate G cooled by the cooling section 123 is returned to the indexer device 2 and stored in the cassette by the indexer device 2.

[0148] <1-4. Substrate transport in the first interface section>

[0149] Continue to explain Figure 3 As the conveying mode of the substrate G in the interface part 20, there are prepared a double exposure processing mode in which each of the plurality of substrates G is sequentially conveyed to both the first exposure device 3a and the second exposure device 3b to repeat the exposure processing twice, and a single exposure processing mode in which the plurality of substrates G is conveyed to either the first exposure device 3a or the second exposure device 3b to perform a single exposure processing.

[0150] The control unit 90 selects either the double exposure processing mode or the single exposure processing mode. Specifically, the operator of the device specifies the double exposure processing mode or the single exposure processing mode from the input unit 92, and the control unit 90 selects the mode. Alternatively, the control unit 90 may also select the double exposure processing mode according to the processing scheme 95 ( Figure 2 ) is described to select a mode. Furthermore, the control unit 90 may also select a mode according to an instruction from a superior host computer or the like. The double exposure processing mode is adopted, for example, when the first exposure device 3a and the second exposure device 3b use different types of masks to perform multiple exposure processing on the same substrate G. On the other hand, the single exposure processing mode is adopted, for example, when the first exposure device 3a and the second exposure device 3b use the same type of masks to perform exposure processing with high throughput. In the single exposure processing mode, a plurality of substrates G may also be transported alternately to the first exposure device 3a and the second exposure device 3b.

[0151] First, the conveyance of the substrate G when the double exposure processing mode is selected by the control unit 90 will be described. Figure 5 It means in Figure 3 FIG. 2 is a diagram showing a transport route for transporting the substrate G to both the first exposure device 3a and the second exposure device 3b at the interface 20. The transport of the substrate G described below is achieved by the control unit 90 controlling the plurality of transport robots of the interface 20.

[0152] The substrate G heated by the pre-baking section 114 of the pre-processing section 11 is first moved to the cooling plate 51 to be cooled. The first transfer robot 31 takes out the cooled substrate G from the cooling plate 51 and moves it to the buffer 53. Then, the first transfer robot 31 takes out the substrate G from the buffer 53 and moves the substrate G into the first temperature regulator 55. In addition, it is not necessary to move the substrate into the buffer 53. As long as the first temperature regulator 55 is idle, the first transfer robot 31 can also directly move the substrate G taken out from the cooling plate 51 into the first temperature regulator 55.

[0153] In the double exposure processing mode, the buffer 53 plays a role in absorbing the fluctuation of the processing time of the first exposure device 3a and the second exposure device 3b. The processing time of the first exposure device 3a and the second exposure device 3b is not necessarily constant. For example, the first exposure device 3a and the second exposure device 3b sometimes perform self-maintenance irregularly, and the processing time sometimes becomes longer at this time. In addition, the first exposure device 3a and the second exposure device 3b require a long time to align, especially for the first substrate G of the batch, so the processing time will also become longer. When the processing time of the first exposure device 3a or the second exposure device 3b becomes longer, the substrate G with the resist film formed in the pre-processing unit 11 is temporarily stored in the buffer 53 to prevent the processing in the pre-processing unit 11 from stagnating. The buffer 53 includes shelves that can accommodate the number of layers of all substrates G that have been coated in the pre-processing unit 11 even if the first exposure device 3a or the second exposure device 3b stops for a long time.

[0154] The first temperature regulator 55 accurately adjusts the temperature of the substrate G immediately before the exposure process to a predetermined temperature (e.g., 23° C.). The first temperature regulator 55 can also adjust the temperature of the substrate G while rotating the direction of the substrate G in a horizontal plane as needed. The temperature-regulated substrate G is carried out from the first temperature regulator 55 by the second transfer robot 32 and carried into the first exposure device 3a. At this time, the second transfer robot 32 carries out the previously exposed substrate G from the first exposure device 3a, and carries the unexposed substrate G into the first exposure device 3a to replace the substrate.

[0155] The first exposure device 3a performs exposure processing on the substrate G and transfers the pattern to the resist film. The substrate G after the exposure processing is carried out from the first exposure device 3a by the second transfer robot 32 and carried into the first path 37. Then, the third transfer robot 33 carries out the substrate G from the first path 37 and carries it into the second path 38. Then, the fourth transfer robot 34 carries out the substrate G from the second path 38 and carries it into the second temperature regulator 56.

[0156] The second temperature regulator 56 adjusts the temperature of the substrate G to a predetermined temperature before the second exposure process. The second temperature regulator 56 can also adjust the temperature of the substrate G while rotating the direction of the substrate G in a horizontal plane as needed. The temperature-regulated substrate G is carried out from the second temperature regulator 56 by the fifth transfer robot 35 and carried into the second exposure device 3b. At this time, the fifth transfer robot 35 carries out the previously exposed substrate G from the second exposure device 3b, and carries the unexposed substrate G into the second exposure device 3b to replace the substrate.

[0157] The second exposure device 3b uses a mask different from that of the first exposure device 3a to expose the substrate G and transfer the pattern to the resist film. That is, in the double exposure processing mode, different patterns are overlapped and transferred on the substrate G. The substrate G after exposure is carried out from the second exposure device 3b by the fifth handling robot 35 and carried into the third path 39. Then, the fourth handling robot 34 carries out the substrate G from the third path 39 and carries it into the second output path 59. Then, the third handling robot 33 carries out the substrate G from the second output path 59 and carries it into the edge exposure machine 52. The second output path 59 also functions as a buffer when the substrate G exposed by the second exposure device 3b is carried out from the interface part 20. The edge exposure machine 52 performs exposure processing on the peripheral part of the substrate G. Thereafter, the substrate G is carried out to the developing part 121 of the post-processing part 12.

[0158] As described above, when the double exposure processing mode is selected, all substrates G are transported according to the same transport route and order. In the double exposure processing mode, a plurality of substrates G on which resist films are formed are sequentially transported to both the first exposure device 3a and the second exposure device 3b, and subjected to double exposure processing.

[0159] Next, the conveyance of the substrate G when the single exposure processing mode is selected by the control unit 90 is described. In the single exposure processing mode in which a plurality of substrates G are conveyed to only one of the first exposure device 3a or the second exposure device 3b, the route for conveying the substrate G to the first exposure device 3a is different from the route for conveying the substrate G to the second exposure device 3b. Therefore, the route for conveying the substrate G to the first exposure device 3a is described first. Figure 6 It means in Figure 3 FIG. 2 is a diagram of a transport route in which the interface unit 20 transports the substrate G only to the first exposure device 3a. Similar to the double exposure processing mode, the transport of the substrate G in the single exposure processing mode is also achieved by the control unit 90 controlling the transport mechanism of the interface unit 20.

[0160] The substrate G heated by the pre-baking unit 114 of the pre-processing unit 11 is first carried into the cooling plate 51 to be cooled. The first transfer robot 31 takes out the cooled substrate G from the cooling plate 51 and carries it into the buffer 53. Then, the first transfer robot 31 carries out the substrate G from the buffer 53 and carries the substrate G into the first temperature regulator 55.

[0161] In the single exposure processing mode, the buffer 53 also plays a role in absorbing the fluctuation of the processing time of the first exposure device 3a and the second exposure device 3b. That is, when the processing time of the first exposure device 3a and the second exposure device 3b becomes longer, in order to prevent the processing in the pre-processing unit 11 from being stagnant, the buffer 53 temporarily stores the substrate G with the resist film formed thereon.

[0162] The first temperature regulator 55 accurately regulates the temperature of the substrate G immediately before the exposure process to a predetermined temperature. The temperature-regulated substrate G is carried out from the first temperature regulator 55 by the second transfer robot 32 and carried into the first exposure device 3a.

[0163] The first exposure device 3a performs an exposure process on the substrate G and transfers the pattern to the resist film. The substrate G after the exposure process is carried out from the first exposure device 3a by the second transfer robot 32 and carried into the first output path 58. Then, the third transfer robot 33 carries out the substrate G from the first output path 58 and carries it into the edge exposure machine 52. The first output path 58 also functions as a buffer when the substrate G subjected to the exposure process by the first exposure device 3a is carried out from the interface unit 20. The edge exposure machine 52 performs an exposure process on the peripheral portion of the substrate G. Then, the substrate G is carried out to the developing unit 121 of the post-processing unit 12.

[0164] Next, a route for conveying the substrate G to the second exposure device 3 b will be described. Figure 7 It means in Figure 3 FIG. 2 is a diagram of a transport route in which the interface unit 20 transports the substrate G only to the second exposure device 3 b.

[0165] The substrate G heated by the pre-baking unit 114 of the pre-processing unit 11 is first carried into the cooling plate 51 to be cooled. The first transfer robot 31 takes out the cooled substrate G from the cooling plate 51 and carries it into the buffer 53. Then, the first transfer robot 31 carries out the substrate G from the buffer 53 and carries the substrate G into the first path 37.

[0166] Next, the third transfer robot 33 carries out the substrate G from the first path 37 and carries it into the second path 38 . Then, the fourth transfer robot 34 carries out the substrate G from the second path 38 and carries it into the second temperature regulator 56 .

[0167] The second temperature regulator 56 accurately regulates the temperature of the substrate G immediately before the exposure process to a predetermined temperature. The temperature-regulated substrate G is carried out from the second temperature regulator 56 by the fifth transfer robot 35 and carried into the second exposure device 3 b.

[0168] The second exposure device 3b performs exposure processing on the substrate G and transfers the pattern to the resist film. The substrate G after exposure processing is carried out from the second exposure device 3b by the fifth transfer robot 35 and carried into the third path 39. Then, the fourth transfer robot 34 carries out the substrate G from the third path 39 and carries it into the second output path 59. Then, the third transfer robot 33 carries out the substrate G from the second output path 59 and carries it into the edge exposure machine 52. The edge exposure machine 52 performs exposure processing on the peripheral portion of the substrate G. Then, the substrate G is carried out to the developing unit 121 of the post-processing unit 12.

[0169] As described above, when the single exposure processing mode is selected, the substrate G is transported to the transport route ( Figure 6 ) and the transport route for transporting the substrate G to the second exposure device 3b ( Figure 7 ) is different. In the single exposure processing mode, a plurality of substrates G on which resist films are formed are respectively conveyed to either the first exposure device 3a or the second exposure device 3b for a single exposure processing. As long as the same mask is used in the first exposure device 3a and the second exposure device 3b, the plurality of substrates G are conveyed alternately to the first exposure device 3a and the second exposure device 3b, the throughput can be improved.

[0170] <1-5. Structure of the second interface section>

[0171] Figure 8 2 is a diagram showing the structure of the second interface unit 220. Figure 3 The same components are denoted by the same reference numerals. The second interface unit 220 includes a transport mechanism for transporting the substrate G and a plurality of modules. Figure 8 The interface unit 220 includes five transfer robots (a first transfer robot 31 , a second transfer robot 32 , a third transfer robot 33 , a fourth transfer robot 34 , and a fifth transfer robot 35 ) as a transfer mechanism.

[0172] The first transport robot 31, the second transport robot 32, the third transport robot 33, the fourth transport robot 34, and the fifth transport robot 35 are respectively the same as the transport robots of the first embodiment. Therefore, the first transport robot 31, the second transport robot 32, the third transport robot 33, the fourth transport robot 34, and the fifth transport robot 35 can respectively transfer the substrate G to the surrounding modules. In addition, the first transport robot 31, the third transport robot 33, and the fourth transport robot 34 are single-handed robots with one hand. On the other hand, the second transport robot 32 that carries in and out the substrate G relative to the first exposure device 3a and the fifth transport robot 35 that carries in and out the substrate G relative to the second exposure device 3b are two-handed robots with two hands.

[0173] In addition, the interface unit 220 includes a cooling plate 51, an edge exposure device 52, a buffer 53, a first temperature regulator 55, a second temperature regulator 56, a first path 37, a second path 38, and an output path 57 as modules. Figure 3 The components with the same reference numerals are the same components as those in the first interface unit 20. The output path 57 is Figure 3 The first output path 58 (or the second output path 59) is the same as the first output path 58 (or the second output path 59), and the loading table that can load one substrate G is stacked into five layers, for example, and is a component for transferring the substrate G between two transfer robots. In addition, similar to the first interface part 20, strictly speaking, the control of the cooling plate 51 and the edge exposure device 52 does not belong to the interface part 220.

[0174] Among the multiple modules provided in the interface part 220, the first temperature regulator 55 and the first path 37 are stacked in two layers along the vertical direction. The first temperature regulator 55 is arranged in the upper layer, and the first path 37 is arranged in the lower layer. In addition, the second temperature regulator 56 and the second path 38 are also stacked in two layers along the vertical direction. The second temperature regulator 56 is arranged in the upper layer, and the second path 38 is arranged in the lower layer.

[0175] Thus, the second interface unit 220 also includes substantially the same components (transport robot and module) as the first interface unit 20. Figure 8 As shown, in the second interface part 220, the layout of the components is different from that of the first interface part 20. Figure 3 In the embodiment, the first exposure device 3a and the second exposure device 3b are arranged horizontally, and in contrast, Figure 8 In the embodiment, the first exposure device 3a is separated from the second exposure device 3b. Figure 3 different.

[0176] When a plurality of substrate processing apparatuses 1 are arranged in a row in a factory, it is preferable to arrange them alternately. Figure 3 The first interface portion 20 shown is Figure 8 The second interface portion 220 shown. In this case, Figure 8 The first exposure device 3a in the layout is arranged between the pre-processing unit 11 of a substrate processing device 1 and the post-processing unit 12 of the substrate processing device 1 arranged adjacent thereto. Figure 3 ) and the free space PB at the corner of the second interface portion 220 ( Figure 8) are arranged in a manner that the interface parts of both sides are meshed with each other, so that the space in the factory can be effectively used without waste. That is, by arranging the interface parts of both sides in a manner that the fifth transfer robot 35 of the first interface part 20 is located in the space PB and the second transfer robot 32 of the second interface part 220 is located in the space PA, the utilization efficiency of the space can be improved.

[0177] like Figure 8 As shown, in the second interface part 220, a stacked structure of a cooling plate 51, a buffer 53, a first temperature regulator 55, and a first path 37, and a stacked structure of a second temperature regulator 56 and a second path 38 are arranged around the first transfer robot 31. The first transfer robot 31 transfers the substrate G to and from the cooling plate 51, the buffer 53, the first temperature regulator 55, and the second temperature regulator 56.

[0178] A stacked structure of the first temperature regulator 55 and the first path 37 is arranged around the second transfer robot 32. The second transfer robot 32 transfers the substrate G to and from the first temperature regulator 55, the first path 37, and the first exposure device 3a.

[0179] A buffer 53 , a carrying path 57 , and an edge exposure machine 52 are arranged around the third transfer robot 33 . The third transfer robot 33 transfers the substrate G to and from the carrying path 57 and the edge exposure machine 52 .

[0180] A stacked structure of the first temperature regulator 55 and the first path 37 and a stacked structure of the second temperature regulator 56 and the second path 38 are arranged around the fourth transfer robot 34. The fourth transfer robot 34 delivers the substrate G to the first path 37, the second temperature regulator 56, and the second path 38.

[0181] A stacked structure of the second temperature regulator 56 and the second path 38, a buffer 53, and a transport path 57 are arranged around the fifth transport robot 35. The fifth transport robot 35 delivers the substrate G to the second temperature regulator 56, the second path 38, the transport path 57, and the second exposure device 3b.

[0182] <1-6. Substrate transport in the second interface section>

[0183] Continue to explain Figure 8As the conveying mode of the substrate G in the second interface unit 220, there are also prepared a double exposure processing mode in which each of the plurality of substrates G is sequentially conveyed to both the first exposure device 3a and the second exposure device 3b to perform double exposure processing, and a single exposure processing mode in which the plurality of substrates G is conveyed to either the first exposure device 3a or the second exposure device 3b to perform single exposure processing. Then, as described above, the control unit 90 selects either the double exposure processing mode or the single exposure processing mode.

[0184] Fig. 9 It means in Figure 8 FIG. 2 is a diagram of a transport path for transporting the substrate G to both the first exposure device 3a and the second exposure device 3b in the interface unit 220 (i.e., a transport path when the double exposure processing mode is selected). The transport of the substrate G described below is also achieved by the control unit 90 controlling the multiple transport robots of the interface unit 220.

[0185] The substrate G heated by the pre-baking section 114 of the pre-processing section 11 is first carried into the cooling plate 51 to be cooled. The first handling robot 31 takes out the cooled substrate G from the cooling plate 51 and carries it into the buffer 53. Then, the first handling robot 31 takes out the substrate G from the buffer 53 and carries the substrate G into the first temperature regulator 55. As described above, in the double exposure processing mode, the buffer 53 plays a role in absorbing the fluctuation of the processing time of the first exposure device 3a and the second exposure device 3b. In addition, as described above, if the first temperature regulator 55 is idle, the first handling robot 31 can also directly carry the substrate G taken out from the cooling plate 51 into the first temperature regulator 55.

[0186] The first temperature regulator 55 adjusts the temperature of the substrate G immediately before the exposure process to a predetermined temperature. The first temperature regulator 55 can also adjust the temperature of the substrate G while rotating the direction of the substrate G in a horizontal plane as needed. The temperature-regulated substrate G is carried out from the first temperature regulator 55 by the second transfer robot 32 and carried into the first exposure device 3a. At this time, the second transfer robot 32 carries out the previously exposed substrate G from the first exposure device 3a, and carries the unexposed substrate G into the first exposure device 3a to replace the substrate.

[0187] The first exposure device 3a performs exposure processing on the substrate G to transfer the pattern to the resist film. The substrate G after exposure processing is carried out from the first exposure device 3a by the second transfer robot 32 and carried into the first path 37. Then, the fourth transfer robot 34 carries out the substrate G from the first path 37 and carries it into the second temperature regulator 56.

[0188] The second temperature regulator 56 adjusts the temperature of the substrate G to a predetermined temperature before the second exposure process. The second temperature regulator 56 can also adjust the temperature of the substrate G while rotating the direction of the substrate G in a horizontal plane as needed. The temperature-regulated substrate G is carried out from the second temperature regulator 56 by the fifth transfer robot 35 and carried into the second exposure device 3b. At this time, the fifth transfer robot 35 carries out the previously exposed substrate G from the second exposure device 3b, and carries the unexposed substrate G into the second exposure device 3b to replace the substrate.

[0189] The second exposure device 3b uses a mask different from that of the first exposure device 3a to perform an exposure process on the substrate G and transfer the pattern to the resist film. The substrate G after the exposure process is carried out from the second exposure device 3b by the fifth transfer robot 35 and carried into the output path 57. Then, the third transfer robot 33 carries out the substrate G from the output path 57 and carries it into the edge exposure machine 52. The edge exposure machine 52 performs an exposure process on the peripheral portion of the substrate G. Then, the substrate G is carried out to the developing unit 121 of the post-processing unit 12.

[0190] As described above, in the second interface unit 220, when the double exposure processing mode is selected, all substrates G are also transported according to the same transport route and order. In the double exposure processing mode, a plurality of substrates G on which resist films are formed are sequentially transported to both the first exposure device 3a and the second exposure device 3b, and subjected to double exposure processing.

[0191] Next, the conveyance of the substrate G when the single exposure processing mode is selected by the control unit 90 will be described. In the single exposure processing mode in which a plurality of substrates G are conveyed to only one of the first exposure device 3a or the second exposure device 3b in the second interface unit 220, the route for conveying the substrate G to the first exposure device 3a is different from the route for conveying the substrate G to the second exposure device 3b. Therefore, the route for conveying the substrate G to the first exposure device 3a will be described first. Fig.10 It means in Figure 8 FIG. 2 is a diagram of a transport route in which the interface unit 220 transports the substrate G only to the first exposure device 3a. Similar to the double exposure processing mode, the transport of the substrate G in the single exposure processing mode is also achieved by the control unit 90 controlling the transport mechanism of the interface unit 220.

[0192] The substrate G heated by the pre-baking section 114 of the pre-processing section 11 is first carried into the cooling plate 51 to be cooled. The first transfer robot 31 takes out the cooled substrate G from the cooling plate 51 and carries it into the buffer 53. Then, the first transfer robot 31 takes out the substrate G from the buffer 53 and carries the substrate G into the first temperature regulator 55. In addition, as described above, the first transfer robot 31 may also carry the substrate G taken out from the cooling plate 51 directly into the first temperature regulator 55 as long as the first temperature regulator 55 is idle.

[0193] In the single exposure processing mode, the buffer 53 also plays a role in absorbing the fluctuation of the processing time of the first exposure device 3a and the second exposure device 3b. That is, when the processing time of the first exposure device 3a and the second exposure device 3b becomes longer, in order to prevent the processing in the pre-processing unit 11 from being stagnant, the buffer 53 temporarily stores the substrate G with the resist film formed thereon.

[0194] The first temperature regulator 55 accurately regulates the temperature of the substrate G immediately before the exposure process to a predetermined temperature. The temperature-regulated substrate G is carried out from the first temperature regulator 55 by the second transfer robot 32 and carried into the first exposure device 3a.

[0195] The first exposure device 3a performs exposure processing on the substrate G and transfers the pattern to the resist film. The substrate G after exposure processing is carried out from the first exposure device 3a by the second transfer robot 32 and carried into the first path 37. Then, the fourth transfer robot 34 carries out the substrate G from the first path 37 and carries it into the second path 38. Then, the fifth transfer robot 35 carries out the substrate G from the second path 38 and carries it into the output path 57. Then, the third transfer robot 33 carries out the substrate G from the output path 57 and carries it into the edge exposure machine 52. The edge exposure machine 52 performs exposure processing on the peripheral portion of the substrate G. Then, the substrate G is carried out to the developing section 121 of the post-processing section 12.

[0196] Next, a route for conveying the substrate G to the second exposure device 3 b will be described. Fig.11 It means in Figure 8 FIG. 2 is a diagram of a transport route in which the interface unit 220 transports the substrate G only to the second exposure device 3 b .

[0197] The substrate G heated by the pre-baking section 114 of the pre-processing section 11 is first carried into the cooling plate 51 to be cooled. The first transfer robot 31 takes out the cooled substrate G from the cooling plate 51 and carries it into the buffer 53. Then, the first transfer robot 31 takes out the substrate G from the buffer 53 and carries the substrate G into the second temperature regulator 56. As described above, the first transfer robot 31 may also carry the substrate G taken out from the cooling plate 51 directly into the second temperature regulator 56 as long as the second temperature regulator 56 is idle.

[0198] The second temperature regulator 56 accurately regulates the temperature of the substrate G immediately before the exposure process to a predetermined temperature. The temperature-regulated substrate G is carried out from the second temperature regulator 56 by the fifth transfer robot 35 and carried into the second exposure device 3 b.

[0199] The second exposure device 3b performs exposure processing on the substrate G to transfer the pattern to the resist film. The substrate G after the exposure processing is carried out from the second exposure device 3b by the fifth transfer robot 35 and carried into the output path 57. Then, the third transfer robot 33 carries out the substrate G from the output path 57 and carries it into the edge exposure machine 52. The edge exposure machine 52 performs exposure processing on the peripheral portion of the substrate G. Then, the substrate G is carried out to the developing unit 121 of the post-processing unit 12.

[0200] As described above, in the second interface unit 220, when the single exposure processing mode is selected, the substrate G is transported to the transport route ( Fig.10 ) and the transport route for transporting the substrate G to the second exposure device 3b ( Fig.11 In the single exposure processing mode, a plurality of substrates G on which a resist film is formed are respectively conveyed to either the first exposure device 3a or the second exposure device 3b and subjected to a single exposure processing.

[0201] <1-7. Transport control>

[0202] In either the first interface 20 or the second interface 220, the substrate G coated with the resist liquid and formed with the resist film in the pre-processing unit 11 is conveyed to the exposure device 3, and the substrate G after the exposure process is conveyed from the exposure device 3 to the post-processing unit 12. Hereinafter, in the first interface 20 or the second interface 220, the case where the substrate G before the exposure process is conveyed from the pre-processing unit 11 to the exposure device 3 is referred to as "outward path conveyance", and the case where the substrate G after the exposure process is conveyed from the exposure device 3 to the post-processing unit 12 is referred to as "return path conveyance". In addition, in the double exposure process mode, the conveyance of the substrate G from the first exposure device 3a to the second exposure device 3b is equivalent to either the outward path conveyance or the return path conveyance.

[0203] In the interface unit 20 and the interface unit 220, the substrate G is sequentially transported according to the predetermined transport sequence as described above, but since the processing time of the exposure device 3 is not constant and varies, a transport conflict between the outgoing path transport and the return path transport may sometimes occur. The so-called transport conflict refers to the repeated generation of the task of the outgoing path transport and the task of the return path transport for one transport robot. The transport conflict is particularly likely to occur in the third transport robot 33 and the fourth transport robot 34 of the interface unit 20 that perform the double exposure processing mode, and the fifth transport robot 35 of the interface unit 220.

[0204] Fig.12 : is a schematic diagram for illustrating an example of a transport conflict. In the first interface section 20, the substrate G that is transported on the outgoing path toward the second exposure device 3b is received by the fourth transport robot 34 from the second path 38 and carried into the second temperature regulator 56. The second path 38 is an upstream module (first module) located on the upstream side of the fourth transport robot 34 along the transport direction of the outgoing path transport. On the other hand, the substrate G that is transported on the return path from the second exposure device 3b to the post-processing section 12 is received by the fourth transport robot 34 from the third path 39 and carried into the second output path 59. The third path 39 is an upstream module (second module) located on the upstream side of the fourth transport robot 34 along the transport direction of the return path transport. Moreover, the fourth transport robot 34 is a bidirectional transport robot that performs both the outgoing path transport and the return path transport.

[0205] For the fourth transport robot 34, when a task of outbound transport of the substrate G from the second path 38 to the second temperature regulator 56 is generated, a task of return transport of the substrate G from the third path 39 to the second output path 59 is also generated, the fourth transport robot 34 cannot perform either transport. Conversely, when a task of outbound transport is generated when a task of return transport is generated, the fourth transport robot 34 cannot perform either transport. This state is a transport conflict.

[0206] When the substrate G is transferred between any module and the transfer robot, the transfer of the substrate is performed by repeatedly transmitting and receiving handshake signals between the modules and the transfer robot. Fig.13 38 and the fourth transport robot 34 when the fourth transport robot 34 carries out the substrate G from the second path 38. The fourth transport robot 34 carries out the substrate G from the second path 38, which is a process of the on-path transport. In addition, the transmission and reception of the synchronous handshake signal is performed between a module as a control unit in the transport control performed by the control unit 90 and the transport robot.

[0207] First, a delivery notice signal is sent from the second path 38 to the fourth transport robot 34 (step S1). The delivery notice signal is not a signal requesting the immediate removal of the substrate, but a signal notifying the transport robot, which is the target of the delivery, of the removal of the substrate in advance. That is, even if the substrate is suddenly requested to be removed without any prior notice, there is a situation where the transport robot cannot cope with it, so the removal of the substrate is notified in advance. At the moment of sending the delivery notice signal, the substrate G to be removed may not exist in the second path 38. In addition, since the second path 38 is not a module for performing a certain process treatment, but a loading table for substrate transfer, when the delivery notice signal is sent after the substrate G arrives at the second path 38, it is late as a prior notice. Therefore, the second path 38 transmits the delivery notice signal received from a third transport robot 33 that is upstream of the second path 38 in the transport direction along the outbound path to the fourth transport robot 34.

[0208] The fourth transfer robot 34 that has received the delivery notice signal starts the carry-out preparation operation (step S2 ). Specifically, the fourth transfer robot 34 completes the operation in progress and then performs an operation to direct the hand toward the second path 38 .

[0209] Furthermore, the third transfer robot 33 carries the substrate G into the second path 38 (step S3 ). By carrying the substrate G into the second path 38 , the substrate G to be carried out exists in the second path 38 , and the substrate can be carried out from the second path 38 .

[0210] After the substrate G is carried into the second path 38, a transfer request signal is transmitted from the second path 38 to the fourth transfer robot 34 (step S4). The transfer request signal is a signal requesting the transfer robot to be transmitted to carry out the substrate.

[0211] The fourth transport robot 34 that receives the delivery request signal moves the substrate G out of the second path 38 (step S5). Then, the second path 38 that becomes idle due to the substrate G being moved out sends a delivery completion signal to the fourth transport robot 34 (step S6). Next, the fourth transport robot 34 that receives the substrate G sends a reception completion signal to the second path 38 (step S7). Thereafter, the fourth transport robot 34 moves the substrate G into the second temperature regulator 56. In addition, when the fourth transport robot 34 moves the substrate G out of the third path 39, the same synchronous exchange signal is also sent and received between the third path 39 and the fourth transport robot 34. Moving the substrate G out of the third path 39 by the fourth transport robot 34 is a process of return path transport.

[0212] In the first embodiment, when a transport conflict occurs between the outgoing path transport and the return path transport, the control unit 90 controls the plurality of transport robots and the plurality of modules so that the outgoing path transport is performed with priority over the return path transport. Specifically, the control unit 90 controls the fourth transport robot 34 so that when the fourth transport robot 34 receives a delivery notice signal from the second path 38 after receiving a delivery notice signal from the third path 39 and before receiving the substrate G from the third path 39, the substrate is preferentially carried out from the second path 38.

[0213] Fig.14 This is a timing diagram showing an example of a transport sequence when a transport conflict occurs. Fig.14 In the example, the delivery notice signal is first sent from the third path 39 to the fourth transfer robot 34. Thereafter, the delivery notice signal is sent from the second path 38 to the fourth transfer robot 34. That is, the fourth transfer robot 34 receives the delivery notice signal from the second path 38 after receiving the delivery notice signal from the third path 39.

[0214] Next, after the delivery notice signal is sent from the second path 38 to the fourth transfer robot 34, a delivery request signal is sent from the third path 39 to the fourth transfer robot 34. The fourth transfer robot 34 performs the unloading operation of unloading the substrate G from the third path 39 after receiving the delivery request signal from the third path 39. Fig.14 In the example shown in FIG. 5 , at the time when the fourth transfer robot 34 receives the delivery notification signal from the second path 38 , the fourth transfer robot 34 has not yet started the operation of receiving the substrate G from the third path 39 .

[0215] Thus, when the fourth transport robot 34 receives a delivery notice signal from the second path 38 after receiving the delivery notice signal from the third path 39 and before receiving the substrate G from the third path 39, the fourth transport robot 34 preferentially performs the unloading of the substrate from the second path 38 compared with the unloading of the substrate from the third path 39. Specifically, the fourth transport robot 34 does not unload the substrate from the third path 39 even after receiving the delivery request signal from the third path 39, but first performs the unloading of the substrate from the second path 38, triggered by the receipt of the delivery request signal from the second path 38.

[0216] In a typical event-driven transport control, such as Fig.14For example, when the delivery notice signal from the third path 39 is received earlier than the delivery notice signal from the second path 38, the fourth transfer robot 34 first performs the substrate unloading from the third path 39 according to the order of receiving. In this way, even after the delivery request signal is sent from the second path 38, the fourth transfer robot 34 cannot unload the substrate G from the second path 38 before the fourth transfer robot 34 completes the action of transferring the substrate G from the third path 39 to the second output path 59. As a result, the substrate G to be transferred to the path waits in the second path 38, and the timing of the substrate G arriving at the second exposure device 3b is delayed, and sometimes the second exposure device 3b is in a standby state. When reaching this state, the transfer efficiency of the substrate G as the interface unit 20 as a whole decreases.

[0217] Therefore, in the first embodiment, even if the delivery notice signal from the second path 38 is received later than the delivery notice signal from the third path 39, the fourth transfer robot 34 performs the unloading of the substrate G from the second path 38 as a process of the outgoing path transfer, in comparison with the unloading of the substrate from the third path 39. As a result, the substrate G transferred through the outgoing path is smoothly transferred without waiting in the second path 38, thereby preventing the second exposure device 3b from being in a waiting state. As a result, the decrease in the transfer efficiency of the substrate G of the entire interface unit 20 can be suppressed. In addition, as a result of the priority of the outgoing path transfer, the substrate G transferred through the return path waits in the third path 39. However, even if the substrate G that has completed the exposure process in the second exposure device 3b and is transferred through the return path waits in the third path 39, there is no concern that the process in the exposure device 3 is affected. Therefore, compared with the case where the substrate G transferred through the outgoing path is made to wait, even if the substrate G transferred through the return path is made to wait for a while, the degree of decrease in the transfer efficiency is small.

[0218] However, as described above, if the outgoing path transport is continuously prioritized, there is a concern that the substrate G transported via the return path will continue to wait for a long time. If the substrate G transported via the return path waits for a long time on, for example, the third path 39, the transport route of the return path transport becomes congested, and the fifth transport robot 35 cannot transport the substrate G that has completed the exposure process in the second exposure device 3b.

[0219] Therefore, in the first embodiment, the control unit 90 controls the transport robot so that the return path transport is performed after the outward path transport is performed preferentially. Fig.14As shown, the control unit 90 controls the fourth transfer robot 34 so that when the fourth transfer robot 34 preferentially performs the transfer of the substrate from the second path 38 to the second temperature regulator 56 of the module as the next process, and the delivery request signal from the third path 39 has been sent, the substrate G is carried out from the third path 39. In this way, the substrate G transported through the return path will not wait for too long, thereby preventing the transport route of the return path from becoming congested.

[0220] Fig.15 FIG. 2 is a timing diagram showing another example of a transport sequence when a transport conflict occurs. Fig.15 In the example, first, the delivery notice signal is sent from the third path 39 to the fourth transfer robot 34. Then, the delivery notice signal is sent from the second path 38 to the fourth transfer robot 34. Fig.14 Similar to the example of , the fourth transfer robot 34 receives the delivery notice signal from the second path 38 after receiving the delivery notice signal from the third path 39 .

[0221] However, in Fig.15 In the example of , after the delivery request signal is sent from the third path 39 to the fourth transfer robot 34, the delivery notice signal is sent from the second path 38 to the fourth transfer robot 34. Fig.15 In the example, at the moment when the fourth transport robot 34 receives the delivery notice signal from the second path 38, the fourth transport robot 34 has already started the action of receiving the substrate G from the third path 39. In this case, the fourth transport robot 34 does not interrupt the substrate unloading from the third path 39 and preferentially performs the substrate unloading from the second path 38. Moreover, the situation where the fourth transport robot 34 receives the delivery notice signal from the second path 38 immediately after starting the action of receiving the substrate G from the third path 39 is the situation where there is the highest concern that the substrate G transported via the outgoing path will be in the standby state.

[0222] Therefore, in the first embodiment, the second path 38 outputs the delivery notice signal in advance before the delivery request signal in consideration of the time required for the operation of the fourth transfer robot 34. Specifically, the delivery notice signal is issued from the second path 38 in advance of the delivery request signal by the time required for the fourth transfer robot 34 to transfer the substrate G from the third path 39 to the second output path 59 as the module of the next process and the time required for the subsequent preparation operation to remove the substrate from the second path 38. In this way, even if the delivery notice signal is sent from the second path 38 immediately after the fourth transfer robot 34 starts the operation of receiving the substrate G from the third path 39, at the time when the second path 38 sends the delivery request signal, the fourth transfer robot 34 completes the transfer of the substrate G from the third path 39 to the second output path 59 and also completes the preparation to remove the substrate G from the second path 38. Therefore, the fourth transfer robot 34 can start the operation of removing the substrate G from the second path 38 without delay after receiving the delivery request signal from the second path 38, thereby avoiding the situation where the substrate G transferred via the outgoing path waits in the second path 38. The third path 39 on the return path side may transmit the payment notice signal at a predetermined time (for example, about 5 seconds required for the fourth transfer robot 34 to move toward the third path 39 ) before the delivery request signal.

[0223] In the first embodiment, when a transport conflict occurs between the outgoing path transport and the return path transport, the outgoing path transport is performed with priority over the return path transport. In the example, when the fourth transport robot 34 receives a delivery notice signal from the second path 38 after receiving a delivery notice signal from the third path 39 and before receiving the substrate G from the third path 39, the fourth transport robot 34 performs substrate removal from the second path 38 with priority. As a result, the substrate G transported via the outgoing path is smoothly transported without waiting, thereby suppressing a decrease in the transport efficiency of the substrate G as a result of the exposure device 3 being in a waiting state.

[0224] The above mainly illustrates the description of the fourth transport robot 34 of the interface part 20, but by performing the same transport control on the other transport robots of the interface part 20 and the interface part 220, it is possible to suppress the reduction in the transport efficiency of the substrate G. In particular, as long as the third transport robot 33 of the interface part 20 or the fifth transport robot 35 of the interface part 220, which are prone to transport conflicts, is subjected to the same transport control as described above, the reduction in the transport efficiency can be further suppressed.

[0225] <Second embodiment>

[0226] Next, the second embodiment of the present invention is described. The structures of the substrate processing apparatus 1 and the interface unit 20 and the interface unit 220 of the second embodiment are the same as those of the first embodiment. In addition, the processing sequence of a substrate G in the substrate processing apparatus 1 and the interface unit 20 and the interface unit 220 of the second embodiment is also the same as that of the first embodiment.

[0227] exist Figure 3 In the layout of the interface unit 20 shown, the fourth transfer robot 34 and the fifth transfer robot 35 are arranged with the second temperature regulator 56 sandwiched therebetween. In the transfer direction to the path, the fourth transfer robot 34 arranged on the upstream side of the second temperature regulator 56 is the upstream transfer robot, and the fifth transfer robot 35 arranged on the downstream side of the second temperature regulator 56 is the downstream transfer robot.

[0228] Among the multiple modules provided in the interface part 20, the processing time of the first temperature regulator 55 and the second temperature regulator 56 for temperature adjustment is relatively long, and the set takt time is almost fully used to adjust the temperature of the substrate G. Therefore, in order to maintain the handling efficiency, it is necessary to carry the next substrate G into the second temperature regulator 56 by the fourth handling robot 34 immediately after the fifth handling robot 35 carries out the substrate G from the second temperature regulator 56. Due to the above reasons, if the fourth handling robot 34 starts the action of carrying the substrate G from the second path 38 to the second temperature regulator 56 after sending the acceptable signal from the second temperature regulator 56 to the fourth handling robot 34, it will be late. Therefore, before sending the acceptable signal, the second temperature regulator 56 sends the acceptance notice signal for notifying the substrate to be carried in to the fourth handling robot 34 in advance. The second temperature regulator 56 sends the acceptance notice signal to the fourth handling robot 34 at a time of a predetermined time set in advance before the time when the temperature adjustment process of the substrate G is completed. In addition, the acceptance notice signal and the acceptable signal are similar to the delivery notice signal and the delivery request signal of the first embodiment. The delivery notice signal and the delivery request signal are sent from the upstream module, whereas the acceptance notice signal and the acceptance signal are sent from the downstream module.

[0229] As described above, the processing time of the second exposure device 3b is sometimes not constant and may be prolonged. If the processing time of the second exposure device 3b is prolonged, the fifth transfer robot 35 cannot replace the substrate with respect to the second exposure device 3b. If so, the transport route to the path transport becomes congested, and even after the temperature adjustment process is completed, the fifth transfer robot 35 cannot carry out the temperature-adjusted substrate G from the second temperature regulator 56. As a result, the fourth transfer robot 34 cannot carry a new substrate G into the second temperature regulator 56.

[0230] Even if the fourth transfer robot 34 receives the reception notice signal from the second temperature regulator 56 and completes the preparation for carrying a new substrate G into the second temperature regulator 56, if the substrate G is on standby in the second temperature regulator 56, the fourth transfer robot 34 cannot carry the new substrate G into the second temperature regulator 56. In this case, the fourth transfer robot 34 also waits while holding the substrate G scheduled to be carried in. If so, the fourth transfer robot 34 cannot carry out the outgoing path or the return path, and the substrate transportation in the interface unit 20 becomes a deadlock state.

[0231] Therefore, in the second embodiment, the second temperature regulator 56 may send an acceptance notice signal to the fourth transfer robot 34 after a predetermined time earlier than the completion of the temperature adjustment process and after the fifth transfer robot 35 starts the substrate replacement relative to the second exposure device 3b. The fifth transfer robot 35 sends the acceptance notice signal at the time of starting the substrate replacement relative to the second exposure device 3b. Therefore, more specifically, the second temperature regulator 56 sends the acceptance notice signal to the fourth transfer robot 34 when a predetermined time earlier than the scheduled time of completion of the temperature adjustment passes and the fifth transfer robot 35 sends the acceptance notice signal.

[0232] If so, after it is determined that the hand of the fifth transfer robot 35 for receiving the temperature-regulated substrate G from the second temperature regulator 56 is idle, the second temperature regulator 56 sends a reception notice signal. Thus, when the fourth transfer robot 34 that has received the reception notice signal completes preparations for carrying a new substrate G into the second temperature regulator 56, the fifth transfer robot 35 carries out the temperature-regulated substrate G from the second temperature regulator 56, and the second temperature regulator 56 becomes idle. As a result, the fourth transfer robot 34 can reliably carry a new substrate G into the second temperature regulator 56, thereby preventing the fourth transfer robot 34 from waiting in a state of holding the substrate G scheduled to be carried in, and suppressing the reduction of the transfer efficiency.

[0233] In addition, in order to reliably prevent the fourth transport robot 34 from waiting while holding the substrate G, when none of the five-layer loading tables is idle, the second output path 59 does not send any of the reception advance signal and the receivable signal to the fourth transport robot 34. Furthermore, in order to prevent the third transport robot 33 from waiting while holding the substrate G, the reception advance signal is sent from the edge exposure machine 52 in advance of the receivable signal by the time required for the third transport robot 33 to move toward the edge exposure machine 52 after taking out the substrate G from the second output path 59.

[0234] <Third embodiment>

[0235] Next, the third embodiment of the present invention is described. The structures of the substrate processing apparatus 1 and the interface unit 20 and the interface unit 220 of the third embodiment are the same as those of the first embodiment. In addition, the processing sequence of a substrate G in the substrate processing apparatus 1 and the interface unit 20 and the interface unit 220 of the third embodiment is also the same as that of the first embodiment.

[0236] As described above, the processing time of the exposure device 3 varies, and the processing time tends to be longer for the first substrate of the batch. In addition, for the substrate in the middle of the batch, the processing time of the exposure device 3 may vary by several seconds depending on the conditions. In the double exposure processing mode, when the processing time in the first exposure device 3a changes, the outgoing path transportation from the first exposure device 3a to the second exposure device 3b and the return path transportation from the second exposure device 3b to the edge exposure machine 52 are all affected, and transportation conflicts are likely to occur.

[0237] In addition, the deviation of the processing time of the processing section upstream of the interface section 20 and the interface section 220, such as the reduced pressure drying section 113, may also affect the forwarding path conveyance and the return path conveyance in the interface section 20 and the interface section 220, thereby causing a conveyance conflict. In the reduced pressure drying section 113, the processing time may vary by about ±2 seconds depending on the time required for decompression.

[0238] On the other hand, tact times are also set for the multiple transport robots and multiple modules provided in the interface unit 20 and the interface unit 220. The tact time for a module is the time required for one substrate G. In addition, the tact time for a transport robot is the time required for the transport robot to perform one cycle of action. Each transport robot and each module is controlled to transport and process the substrate while satisfying the tact time.

[0239] In the third embodiment, the control unit 90 controls the bidirectional transport robots in a manner that one of the tact time of a bidirectional transport robot among the plurality of transport robots that performs a series of actions is divided into two equal parts, and becomes the outgoing path transport time for outgoing path transport, and the remaining other part is used as the return path transport time for return path transport. Specifically, for example, the tact time of a series of actions of the third transport robot 33 of the interface unit 20 is divided into two equal parts, and one part is used as the outgoing path transport time for outgoing path transport, and the remaining other part is used as the return path transport time for return path transport.

[0240] Fig.16 2 is a diagram showing the operation time distribution of the third transfer robot 33 . Fig.16The figure shows the operation time distribution of the third transfer robot 33 in the interface section 20 when both the first exposure device 3a and the second exposure device 3b perform exposure processing, or when only the second exposure device 3b performs exposure processing.

[0241] The tact time set in the third transfer robot 33 is, for example, 40 seconds. The first half of the tact time, 20 seconds ( Fig.16 The right half of the takt time is allocated to the outbound path transport time. On the other hand, the second half of the takt time (20 seconds) is allocated to the outbound path transport time. Fig.16 The left half of ) is allocated to the return path transport time for the return path transport.

[0242] The third transport robot 33 performs a series of actions related to the outgoing path transport during the 20 seconds of the first half of the takt time allocated. That is, during the first half of 20 seconds, the third transport robot 33 performs the action of moving toward the first path 37, the action of moving the substrate G out of the first path 37, the action of moving toward the second path 38, and the action of moving the substrate G into the second path 38. The total time required for all these actions is also less than 20 seconds. Fig.16 As shown, there is a margin time of about several seconds in the forwarding path transport time in the first half of the tact time.

[0243] In addition, the third transport robot 33 performs a series of actions related to the return path transport during the 20 seconds of the return path transport time in the second half of the tact time. That is, during the second half of the 20 seconds, the third transport robot 33 performs the action of moving toward the second output path 59, the action of moving the substrate G out of the second output path 59, the action of moving toward the edge exposure machine 52, and the action of moving the substrate G into the edge exposure machine 52. Similar to the outward path transport time, the time required for all actions related to the return path transport is also less than 20 seconds, such as Fig.16 As shown, there is a margin of several seconds in the return path transport time in the second half of the tact time.

[0244] Thus, in the third embodiment, a margin time is set in each of the outgoing path transport time and the return path transport time, which are two parts of the tact time set in the third transport robot 33. Thus, even if the processing time of the first exposure device 3a changes, or if the processing time of the reduced pressure drying section 113 on the upstream side changes, the margin time set in the outgoing path transport time and the return path transport time can be used to absorb the change. That is, the margin time set in the outgoing path transport time and the return path transport time is used as a margin time to absorb the change in the processing time on the upstream side. For example, even if the processing time of the first exposure device 3a is extended and the substrate G arrives at the first path 37 about 2 seconds later than the predetermined time, the delay time can be absorbed by the margin time set in the outgoing path transport time of the tact time. As a result, in the downstream of the third transport robot 33 along the transport route, the substrate G can be periodically transported to each transport robot and each module, and the transport is rectified to prevent transport conflicts, thereby suppressing the decrease in the transport efficiency of the substrate G.

[0245] However, when the processing time of the first exposure device 3a or the reduced pressure drying unit 113 on the upstream side is significantly prolonged, the delay time caused by the delay time may not be absorbed by the margin time alone. Therefore, in the third embodiment, the control unit 90 controls the third transport robot 33 in such a manner that the third transport robot 33 carries out the starting substrate of the batch from the first path 37 after the starting substrate of the batch is allowed to stand by for a predetermined time (for example, about 10 seconds) on the first path 37. The first path 37 is an upstream module located on the upstream side of the third transport robot 33 along the transport direction of the path transport. By making the starting substrate of the batch stand by for a predetermined time on the first path 37, even if the processing time of the first exposure device 3a or the reduced pressure drying unit 113 on the upstream side varies greatly, the variation can be absorbed and the transport downstream of the third transport robot 33 can be rectified. For example, even if the processing time of the first exposure device 3a is significantly prolonged and the substrate G arrives at the first path 37 about 10 seconds later than the predetermined time, since the starting substrate of the batch stands by for about 10 seconds on the first path 37, the delay of the transport is eliminated at the downstream of the third transport robot 33.

[0246] The above mainly illustrates the description of the third transport robot 33 of the interface unit 20, but by performing the same transport control on other bidirectional transport robots of the interface unit 20 and the interface unit 220, it is possible to suppress the decrease in the transport efficiency of the substrate G. In addition, in the third embodiment, since a surplus time is set in the outgoing path transport time and the return path transport time, the throughput itself may decrease compared with the event-driven method.

[0247] <Fourth embodiment>

[0248] Next, the fourth embodiment of the present invention is described. The structures of the substrate processing apparatus 1 and the interface unit 20 and the interface unit 220 of the fourth embodiment are the same as those of the first embodiment. In addition, the processing sequence of a substrate G in the substrate processing apparatus 1 and the interface unit 20 and the interface unit 220 of the fourth embodiment is also the same as that of the first embodiment.

[0249] In the fourth embodiment, the cooling plate 51 outputs a delivery notice signal in advance before the delivery request signal, taking into account the time required for the action of the first handling robot 31. Specifically, the delivery notice signal is sent from the cooling plate 51 in advance of the delivery request signal by the following time, that is, the time required for the first handling robot 31 to carry the substrate G from the buffer 53 to the first temperature regulator 55 plus the time required for the subsequent preparatory action of unloading the substrate from the cooling plate 51. The time required for the first handling robot 31 to carry the substrate G from the buffer 53 to the first temperature regulator 55 is the sum of the time required for the first handling robot 31 to carry the substrate G from the buffer 53, the action toward the first temperature regulator 55, and the action of carrying the substrate G into the first temperature regulator 55. In addition, the time required for the preparatory action of the first handling robot 31 to carry the substrate out of the cooling plate 51 is the time required for the first handling robot 31 to move its hand toward the cooling plate 51 so that the hand faces the cooling plate 51.

[0250] In this way, even if the delivery notice signal is sent from the cooling plate 51 immediately after the first transfer robot 31 starts to carry out the substrate G from the buffer 53, at the moment when the cooling plate 51 sends the delivery request signal, the first transfer robot 31 completes the transfer of the substrate G from the buffer 53 to the first temperature regulator 55 and also completes the preparation for carrying out the substrate G from the cooling plate 51. Therefore, the first transfer robot 31 can start the action of carrying out the substrate G from the cooling plate 51 without delay after receiving the delivery request signal from the cooling plate 51. In this way, the situation where the substrate G is waiting on the cooling plate 51 can be avoided.

[0251] As described above, the delivery notice signal from the cooling plate 51 is sometimes sent, for example, 20 seconds or more in advance of the delivery request signal. In this case, it can also be said that the delivery notice signal is sent too early before the delivery request signal. Therefore, in the fourth embodiment, the operation margin time in the pre-baking section 114 on the upstream side of the cooling plate 51 is considered to mitigate the advance degree of the delivery notice signal. Specifically, compared with the scheduled sending time of the delivery notice signal derived as described above, the delivery notice signal is sent by delaying half of the operation margin time in the pre-baking section 114.

[0252] The pre-baking section 114 for heat treatment also includes a robot for carrying substrate G, and the robot is also set with a tact time, and the robot performs a carrying action while meeting the tact time. Moreover, the tact time set in the robot of the pre-baking section 114 is also provided with an action surplus time. Therefore, as long as it is within the range of the action surplus time, even if the substrate G is on standby at the cooling plate 51, the robot of the pre-baking section 114 can also act while complying with the tact time. Therefore, the cooling plate 51 delays half of the action surplus time of the robot of the pre-baking section 114 and sends a delivery notice signal. Thus, although the substrate G can be on standby at the cooling plate 51 for a short time, the robot of the pre-baking section 114 can act while complying with the tact time, and the excessive early output of the delivery notice signal can be alleviated. In addition, the reason why the delay time is set to half of the action surplus time of the robot of the pre-baking section 114 is that the deviation of the processing time in the upstream side (such as the decompression drying section 113) more upstream than the cooling plate 51 is considered.

[0253] In the fourth embodiment, when the first transfer robot 31 receives a delivery notice signal from the cooling plate 51 before taking out the substrate G from the buffer 53, the substrate G is preferentially taken out from the cooling plate 51. This can also avoid the situation where the substrate G waits on the cooling plate 51.

[0254] <Modification>

[0255] The above is a description of the embodiments of the present invention, but the present invention can be modified in various ways without departing from the main purpose thereof. For example, the layout of the transport mechanism and the module in the interface is not limited to Figure 3 and Figure 8 The example shown. It is sufficient to configure a plurality of transport robots and a plurality of modules in the interface portion. Among the plurality of modules, it is preferred to include a buffer for allocating which of the first exposure device 3a and the second exposure device 3b the substrate G is transported to. In addition, in order to save space, it is preferred to stack a portion of the plurality of modules. The layout of the interface portion can be appropriately changed according to the installation positions of the first exposure device 3a and the second exposure device 3b.

[0256] In addition, the structures of the pre-processing unit 11 and the post-processing unit 12 are not limited to Figure 1 For example, an inspection unit or the like may be arranged between the cooling unit 123 and the indexer device 2. The inspection unit is a unit that inspects the substrate G using an optical component such as a camera. In addition, for example, a dehydration baking unit may be arranged between the cleaning unit 111 and the coating unit 112. The dehydration baking unit is a unit that heats the cleaned substrate G to remove moisture. Alternatively, the post-baking unit 122 and the cooling unit 123 may be omitted.

[0257] In addition, as the substrate G to be processed, a substrate for other precision electronic devices such as a semiconductor wafer, a color filter substrate, a recording disk substrate, or a solar cell substrate other than a glass substrate may be used.

[0258] Furthermore, in each of the above-described embodiments, the substrate processing apparatus 1 may include the indexer apparatus 2, and may include the first exposure apparatus 3a and the second exposure apparatus 3b.

Claims

1. A substrate processing device for performing a pre-exposure process and a post-exposure process on a substrate, wherein the substrate processing device comprises: A pre-processing unit, which performs the processing of the pre-process; A post-processing unit, which performs the post-processing; An interface unit connects the pre-processing unit and the post-processing unit to the first exposure device and the second exposure device, and includes a plurality of transport robots and a plurality of modules for transporting the substrate; as well as A control unit controls the plurality of transport robots. The control unit controls the plurality of transport robots and the plurality of modules in such a manner that the outbound path transport of the substrate from the pre-processing unit to the first exposure device or the second exposure device is prioritized over the return path transport of the substrate from the first exposure device or the second exposure device to the post-processing unit, The plurality of transport robots include a bidirectional transport robot that performs both the outward path transport and the return path transport. The multiple modules include: A first module is located at an upstream side of the bidirectional transport robot along the transport direction of the transport to the path; as well as The second module is located at the upstream side of the bidirectional transport robot along the transport direction of the return path transport, The control unit controls the bidirectional transport robot in such a manner that, when the bidirectional transport robot receives a delivery notice signal from the first module after receiving a delivery notice signal from the second module and before receiving a substrate from the second module, the bidirectional transport robot preferentially performs the unloading of the substrate from the first module. The first module sends a delivery notice signal at a set time earlier than the delivery request signal, The set time is a value obtained by adding the time required for the bidirectional transfer robot to transfer the substrate from the second module to the module of the next process and the time required for the preparation operation of transferring the substrate from the first module.

2. A substrate processing device for performing a pre-exposure process and a post-exposure process on a substrate, wherein the substrate processing device comprises: A pre-processing unit, which performs the processing of the pre-process; A post-processing unit, which performs the post-processing; An interface unit connects the pre-processing unit and the post-processing unit to the first exposure device and the second exposure device, and includes a plurality of transport robots and a plurality of modules for transporting the substrate; as well as A control unit controls the plurality of transport robots. The control unit controls the plurality of transport robots and the plurality of modules in such a manner that the outbound path transport of the substrate from the pre-processing unit to the first exposure device or the second exposure device is prioritized over the return path transport of the substrate from the first exposure device or the second exposure device to the post-processing unit, The plurality of transport robots include a bidirectional transport robot that performs both the outward path transport and the return path transport. The multiple modules include: A first module is located at an upstream side of the bidirectional transport robot along the transport direction of the transport to the path; as well as The second module is located at the upstream side of the bidirectional transport robot along the transport direction of the return path transport, The control unit controls the bidirectional transport robot in such a manner that, when the bidirectional transport robot receives a delivery notice signal from the first module after receiving a delivery notice signal from the second module and before receiving a substrate from the second module, the bidirectional transport robot preferentially performs the unloading of the substrate from the first module. The control unit controls the bidirectional transfer robot so that, when the substrate transfer from the first module to the next process module is completed and the delivery request signal is transmitted from the second module, the substrate is carried out from the second module.

3. A substrate processing device for performing a pre-exposure process and a post-exposure process on a substrate, wherein the substrate processing device comprises: A pre-processing unit, which performs the processing of the pre-process; A post-processing unit, which performs the post-processing; An interface unit connects the pre-processing unit and the post-processing unit to the first exposure device and the second exposure device, and includes a plurality of transport robots and a plurality of modules for transporting the substrate; as well as A control unit controls the plurality of transport robots. The control unit controls the plurality of transport robots and the plurality of modules in such a manner that the outbound path transport of the substrate from the pre-processing unit to the first exposure device or the second exposure device is prioritized over the return path transport of the substrate from the first exposure device or the second exposure device to the post-processing unit, The plurality of transport robots include an upstream transport robot whose transport direction is upstream along the destination path and a downstream transport robot whose transport direction is downstream along the destination path. The plurality of modules include a temperature adjustment module, which is located between the upstream transfer robot and the downstream transfer robot along the transfer direction of the transport path, and performs temperature adjustment processing on the substrate. The temperature adjustment module transmits a reception notice signal to the upstream transfer robot after a predetermined time before completion of the temperature adjustment process and after the downstream transfer robot starts replacing the substrate with respect to the first exposure device or the second exposure device.

4. A substrate processing device for performing a pre-exposure process and a post-exposure process on a substrate, wherein the substrate processing device comprises: A pre-processing unit, which performs the processing of the pre-process; A post-processing unit, which performs the post-processing; An interface unit connects the pre-processing unit and the post-processing unit to the first exposure device and the second exposure device, and includes a plurality of transport robots and a plurality of modules for transporting the substrate; as well as A control unit controls the plurality of transport robots. The control unit controls the plurality of transport robots and the plurality of modules in such a manner that the outbound path transport of the substrate from the pre-processing unit to the first exposure device or the second exposure device is prioritized over the return path transport of the substrate from the first exposure device or the second exposure device to the post-processing unit, The plurality of transport robots include a bidirectional transport robot that performs both the outward path transport and the return path transport. The control unit controls the bidirectional transport robot in such a manner that one of the halves of the cycle time for the bidirectional transport robot to perform a series of actions is set as the outgoing path transport time for the outgoing path transport, and the other is set as the return path transport time for the return path transport, and the outgoing path transport time and the return path transport time each include a surplus time.

5. The substrate processing device according to claim 4, characterized in that: The plurality of modules include an upstream module, the upstream module being located at an upstream side of the bidirectional transport robot along a transport direction of the transport to the path, The control unit controls the bidirectional transfer robot so that the bidirectional transfer robot carries out the starting substrate from the upstream module after the starting substrate of a batch has been waiting in the upstream module for a predetermined time.

6. The substrate processing apparatus according to any one of claims 1 to 5, characterized in that: The pre-processing unit includes a coating unit for coating a resist on the substrate. The post-processing unit includes a developing unit for performing a developing process on the substrate after the exposure process.

7. A substrate processing method, performing a pre-exposure processing step and a post-exposure processing step on a substrate, the substrate processing method being characterized by comprising: a transporting step, using an interface unit that connects a pre-processing unit that performs the processing of the pre-processing unit and a post-processing unit that performs the processing of the post-processing unit to the first exposure device and the second exposure device, to transport the substrate subjected to the processing of the pre-processing unit to the first exposure device and / or the second exposure device, and to transport the substrate subjected to the exposure processing to the post-processing unit, The interface part includes a plurality of transport robots and a plurality of modules for transporting the substrate. In the transporting step, a forward path transport of the substrate from the pre-processing section to the first exposure device or the second exposure device is preferentially performed compared to a return path transport of the substrate from the first exposure device or the second exposure device to the post-processing section, The plurality of transport robots include a bidirectional transport robot that performs both the outward path transport and the return path transport. The multiple modules include: A first module located at an upstream side of the bidirectional transport robot along a transport direction of the transport to the path; and The second module is located at the upstream side of the bidirectional transport robot along the transport direction of the return path transport, In the transport process, when the bidirectional transport robot receives a delivery notice signal from the first module after receiving a delivery notice signal from the second module and before receiving a substrate from the second module, the bidirectional transport robot preferentially performs the unloading of the substrate from the first module. The first module sends a delivery notice signal at a set time earlier than the delivery request signal, The set time is a value obtained by adding the time required for the bidirectional transfer robot to transfer the substrate from the second module to the module of the next process and the time required for the preparation operation of transferring the substrate from the first module.

8. A substrate processing method, performing a pre-exposure processing step and a post-exposure processing step on a substrate, the substrate processing method being characterized by comprising: a transporting step, using an interface unit that connects a pre-processing unit that performs the processing of the pre-processing unit and a post-processing unit that performs the processing of the post-processing unit to the first exposure device and the second exposure device, to transport the substrate subjected to the processing of the pre-processing unit to the first exposure device and / or the second exposure device, and to transport the substrate subjected to the exposure processing to the post-processing unit, The interface part includes a plurality of transport robots and a plurality of modules for transporting the substrate. In the transporting step, a forward path transport of the substrate from the pre-processing section to the first exposure device or the second exposure device is preferentially performed compared to a return path transport of the substrate from the first exposure device or the second exposure device to the post-processing section, The plurality of transport robots include a bidirectional transport robot that performs both the outward path transport and the return path transport. The multiple modules include: A first module located at an upstream side of the bidirectional transport robot along a transport direction of the transport to the path; and The second module is located at the upstream side of the bidirectional transport robot along the transport direction of the return path transport, In the transport process, when the bidirectional transport robot receives a delivery notice signal from the first module after receiving a delivery notice signal from the second module and before receiving a substrate from the second module, the bidirectional transport robot preferentially performs the unloading of the substrate from the first module. When the substrate transfer from the first module to the module of the next process, which is preferentially performed, is completed and a delivery request signal is sent from the second module, the bidirectional transfer robot performs the transfer of the substrate from the second module.

9. A substrate processing method, performing a pre-exposure processing step and a post-exposure processing step on a substrate, the substrate processing method being characterized by comprising: a transporting step, using an interface unit that connects a pre-processing unit that performs the processing of the pre-processing unit and a post-processing unit that performs the processing of the post-processing unit to the first exposure device and the second exposure device, to transport the substrate subjected to the processing of the pre-processing unit to the first exposure device and / or the second exposure device, and to transport the substrate subjected to the exposure processing to the post-processing unit, The interface part includes a plurality of transport robots and a plurality of modules for transporting the substrate. In the transporting step, a forward path transport of the substrate from the pre-processing section to the first exposure device or the second exposure device is preferentially performed compared to a return path transport of the substrate from the first exposure device or the second exposure device to the post-processing section, The plurality of transport robots include an upstream transport robot whose transport direction is upstream along the destination path and a downstream transport robot whose transport direction is downstream along the destination path. The plurality of modules include a temperature adjustment module, which is located between the upstream transfer robot and the downstream transfer robot along the transfer direction of the transport path, and performs temperature adjustment processing on the substrate. The temperature adjustment module transmits a reception notice signal to the upstream transfer robot after a predetermined time before completion of the temperature adjustment process and after the downstream transfer robot starts replacing the substrate with respect to the first exposure device or the second exposure device.

10. A substrate processing method, performing a pre-exposure processing step and a post-exposure processing step on a substrate, the substrate processing method comprising: a transporting step, using an interface unit that connects a pre-processing unit that performs the processing of the pre-processing unit and a post-processing unit that performs the processing of the post-processing unit to the first exposure device and the second exposure device, to transport the substrate subjected to the processing of the pre-processing unit to the first exposure device and / or the second exposure device, and to transport the substrate subjected to the exposure processing to the post-processing unit, The interface part includes a plurality of transport robots and a plurality of modules for transporting the substrate. In the transporting step, a forward path transport of the substrate from the pre-processing section to the first exposure device or the second exposure device is preferentially performed compared to a return path transport of the substrate from the first exposure device or the second exposure device to the post-processing section, The plurality of transport robots include a bidirectional transport robot that performs both the outward path transport and the return path transport. The bidirectional transport robot is enabled to perform a transport action by dividing the cycle time of a series of actions of the bidirectional transport robot into two equal parts, one of which is set as the outgoing path transport time for the outgoing path transport, and the other is set as the return path transport time for the return path transport, and the outgoing path transport time and the return path transport time each include a surplus time.

11. The substrate processing method according to claim 10, characterized in that: The plurality of modules include an upstream module, the upstream module being located at an upstream side of the bidirectional transport robot along a transport direction of the transport to the path, After a starting substrate of a batch waits in the upstream module for a predetermined time, the bidirectional transfer robot carries out the starting substrate from the upstream module.

12. The substrate processing method according to any one of claims 7 to 11, characterized in that: The preceding step includes a step of applying a resist to the substrate. The post-process includes a process of developing the substrate after the exposure process.

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