Display module, manufacturing method thereof, and display device

Abstract

This application relates to a display module, its manufacturing method, and a display device. The display module includes a display panel, a circuit board, and a connecting portion. A preset area is provided on the backlight side of the display panel; a connecting hole is provided on the circuit board; the connecting portion is located in the preset area, and the connecting portion and the connecting hole are correspondingly arranged. The connecting portion passes through the connecting hole to fix a portion of the circuit board in the preset area. This improves the fit between the circuit board and the preset area of ​​the display panel, avoiding edge warping of the circuit board due to insufficient connection between the circuit board and the preset area of ​​the display panel.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display module, its manufacturing method, and a display device. Background Technology

[0002] During the lamination process of the display module, after the chip-on-film (COF) is connected and bonded to the screen end of the display panel, the COF needs to be folded and attached to the backlight side of the display panel. However, due to the influence of material characteristics and processes, there is a risk of edge warping of the COF after folding and attaching, which affects the adhesion between the COF and the backlight side of the display panel. Summary of the Invention

[0003] Therefore, it is necessary to provide a display module and its preparation method, as well as a display device, that can improve the sweat-proof capability of the display module in response to the above-mentioned technical problems.

[0004] In a first aspect, this application provides a display module, comprising:

[0005] The display panel has a preset area on its backlight side;

[0006] The circuit board has connection holes;

[0007] A connecting part is provided in the preset area, and the connecting part and the connecting hole are correspondingly provided. The connecting part passes through the connecting hole to fix part of the circuit board in the preset area.

[0008] The aforementioned display module, by setting connection holes on the circuit board and providing corresponding connection parts in the preset area of ​​the display panel, with the connection parts passing through the connection holes to fix the circuit board, improves the fit between the circuit board and the preset area of ​​the display panel, avoiding edge warping of the circuit board due to insufficient connection between the circuit board and the preset area of ​​the display panel.

[0009] In one embodiment, the connecting portion includes:

[0010] A connecting plug passes through the connecting hole and covers the periphery of the connecting hole of the circuit board;

[0011] The main body is connected to the side of the connecting plug near the display panel and is located in the gap between the circuit board and the preset area;

[0012] Optionally, the main body portion is an adhesive layer;

[0013] Optionally, the connecting plug fills the connecting hole;

[0014] Optionally, the material of the connecting plug includes a colloid, the connecting plug is in a fluid state at a first temperature, and the connecting plug is in a solidified state at a second temperature, the second temperature being lower than the first temperature;

[0015] Optionally, the circuit board is a flip-chip film, with one end of the flip-chip film located on the light-emitting side of the display panel and the other end located on the backlight side of the display panel. The portion of the flip-chip film located on the backlight side of the display panel is provided with the connection hole.

[0016] In this way, by setting a connecting plug to fill the connecting hole and cover the circuit board around the connecting hole, the fit between the circuit board and the preset area is strengthened, so that the circuit board and the preset area are firmly connected; by filling the gap between the circuit board and the preset area by the main body, the connection between the circuit board and the preset area is strengthened, the problem of edge warping of the circuit board is prevented to the greatest extent, and the product yield of the display module is improved.

[0017] In one embodiment, the connection hole includes:

[0018] The first hole is located on the side of the circuit board facing the preset area;

[0019] The second hole is located on the side of the circuit board facing away from the preset area. The second hole communicates with the first hole, and the opening area of ​​the first hole is larger than the opening area of ​​the second hole.

[0020] Optionally, the circuit board located around the connection hole protrudes to the side opposite to the preset area, forming a protrusion.

[0021] Thus, the connecting plug fills the first and second holes. The side of the connecting plug closer to the preset area is larger, which can prevent the connecting plug from detaching from the connecting hole and ensure that the connecting plug and the circuit board are firmly connected, fixing the circuit board in the preset area. The circuit board on the periphery of the connecting hole forms a protrusion on the side opposite to the preset area. The connecting plug covers the protrusion on the periphery of the connecting hole, which can further enhance the connection between the connecting plug and the circuit board.

[0022] In one embodiment, the connecting plug passes through the first hole, the second hole, and covers the protrusion;

[0023] Optionally, a metal skeleton is embedded in the connecting plug, the metal skeleton comprising:

[0024] A support base is disposed within the connection hole;

[0025] A fixed support leg is provided on the support base and extends to the side opposite to the preset area. The fixed support leg is bent toward the circuit board around the connection hole.

[0026] Optionally, the support base is disposed in the first hole.

[0027] This further enhances the robustness of the connection between the circuit board and the preset area, prevents the edges of the circuit board from warping, and improves the product yield of the display module.

[0028] In one embodiment, the connector includes a free end that passes through the connector hole and is bonded to the preset area to secure the circuit board.

[0029] In this way, the method of fixing the circuit board to the connector is simple, which reduces the manufacturing difficulty of the display module, avoids damage to the display module during the manufacturing process of the connector, improves the product yield of the display module, and ensures the structural and performance integrity of the display module.

[0030] Secondly, this application provides a method for manufacturing a display module, including:

[0031] A display panel and a circuit board are provided; the backlight side of the display panel is provided with a preset area;

[0032] Connection holes are formed on the circuit board;

[0033] A connecting portion corresponding to the connecting hole is formed in the preset area, and the connecting portion passes through the connecting hole to fix part of the circuit board in the preset area.

[0034] The above-described method for manufacturing the display module involves setting connection holes on the circuit board and providing corresponding connection portions in a preset area of ​​the display panel. The circuit board is then fixed by passing the connection portions through the connection holes. This improves the fit between the circuit board and the preset area of ​​the display panel, preventing edge warping of the circuit board due to insufficient connection between the two areas.

[0035] In one embodiment, a connecting portion corresponding to the connecting hole is formed in the preset area, and the connecting portion passes through the connecting hole to fix a portion of the circuit board in the preset area, including:

[0036] A glue column is formed in the preset area, and the glue column and the connecting hole are correspondingly arranged, with the glue column passing through the connecting hole;

[0037] The adhesive column is subjected to heating and / or pressurization to form the connecting portion, the connecting portion including a connecting plug and a main body, the connecting plug passing through the connecting hole and covering the circuit board around the connecting hole, the main body being connected to the side of the connecting plug near the display panel and disposed in the gap between the circuit board and the preset area;

[0038] Optionally, the main body portion is an adhesive layer;

[0039] Optionally, the connecting plug fills the connecting hole;

[0040] Optionally, the material of the gel column includes a colloid, the gel column is in a fluid state at a first temperature, and the gel column is in a solidified state at a second temperature, the second temperature being lower than the first temperature;

[0041] Optionally, the circuit board is a flip-chip film, with one end of the flip-chip film located on the light-emitting side of the display panel and the other end located on the backlight side of the display panel. The portion of the flip-chip film located on the backlight side of the display panel is provided with the connection hole.

[0042] Thus, by heating and / or pressurizing the glue column to form the connection part, the connection plug of the connection part fills the connection hole and covers the circuit board around the connection hole to fix the circuit board; the main body of the connection part fills the gap between the circuit board and the preset area, as well as the gap between each functional layer between the circuit board and the preset area, thereby improving the firmness of the connection between the circuit board and the preset area, preventing the problem of edge warping of the circuit board to the greatest extent, and improving the product yield of the display module.

[0043] In one embodiment, a metal frame is embedded in the adhesive column. The metal frame includes a support base and a fixed support leg disposed on the support base. The fixed support leg extends toward the side opposite to the preset area.

[0044] The adhesive column is pressurized, and the fixing leg bends toward the circuit board around the connection hole;

[0045] Optionally, the fixed support leg has a bent portion at one end away from the support base. The bent portion extends outward from the connecting hole, and when the rubber column is pressurized, the bent portion bends outward from the connecting hole.

[0046] In this way, the connection can be formed without heating the glue column, avoiding damage to the display module during the heating process, improving the product yield of the display module, and ensuring the structural and performance integrity of the display module; at the same time, the fixing foot is pressed onto the circuit board around the connection hole, and the fixing foot and the circuit board are firmly connected, thereby fixing the circuit board in the preset area and preventing the edge of the circuit board from warping.

[0047] In one embodiment, a connecting portion corresponding to the connecting hole is formed in the preset area, and the connecting portion passes through the connecting hole to fix a portion of the circuit board in the preset area, including:

[0048] A connecting portion is formed in the preset area, the connecting portion including a free end;

[0049] The free end is passed through the connection hole and bonded to the preset area to fix the circuit board.

[0050] In this way, the method of fixing the circuit board to the connector is simple, which reduces the manufacturing difficulty of the display module, avoids damage to the display module during the manufacturing process of the connector, improves the product yield of the display module, and ensures the structural and performance integrity of the display module.

[0051] Thirdly, this application provides a display device including the display module as described in the first aspect.

[0052] The aforementioned display device, by providing connection holes on the circuit board and a corresponding connecting part on the preset area of ​​the display panel, fixes the circuit board through the connection holes via the connecting part. This improves the fit between the circuit board and the preset area of ​​the display panel, preventing edge warping of the circuit board due to insufficient connection. Attached Figure Description

[0053] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the conventional technology, the following briefly introduces the drawings required for use in the embodiments or the conventional technology descriptions. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0054] Figure 1 This is a schematic diagram of the structure of a display module provided in one embodiment of this application;

[0055] Figure 2 for Figure 1 The diagram shows a schematic of the circuit board for the display module.

[0056] Figure 3 for Figure 2 Cross-sectional view of the circuit board shown;

[0057] Figure 4 for Figure 3 A magnified view of a portion of region A in the middle;

[0058] Figure 5 This is a schematic diagram showing the relative positions of the circuit board and the adhesive post according to an embodiment of this application;

[0059] Figure 6 This is a schematic diagram of the connection between the circuit board and the connector provided in one embodiment of this application;

[0060] Figure 7 A schematic diagram showing the relative positions of the circuit board and the adhesive post according to another embodiment of this application;

[0061] Figure 8 for Figure 7 A magnified view of a portion of region A in the middle;

[0062] Figure 9 A schematic diagram of the connection between the circuit board and the connector provided in another embodiment of this application;

[0063] Figure 10 for Figure 9 A magnified view of a portion of region A in the middle;

[0064] Figure 11 A schematic diagram of an attachment layer provided for yet another embodiment of this application;

[0065] Figure 12 A schematic diagram of the connection between the circuit board and the connector provided in another embodiment of this application;

[0066] Figure 13 This is a schematic flowchart illustrating a method for fabricating a display module according to an embodiment of this application.

[0067] Figure label:

[0068] 10. Display module; 11. Display panel; 111. Display area; 112. Bezel area; 113. Preset area; 12. Circuit board; 13. Connecting part; 131. Connecting plug; 132. Main body; 1302. Free end; 14. Connecting hole; 141. First hole; 142. Second hole; 143. Protrusion; 15. Adhesive layer; 16. Pad layer; 17. Metal frame; 171. Support base; 172. Fixed leg; 173. Bending part; 18. Adhesive column. Detailed Implementation

[0069] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings. Preferred embodiments of this application are shown in the drawings. However, this application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of this application.

[0070] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the specification of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0071] When describing positional relationships, unless otherwise specified, when an element such as a layer, film, or substrate is referred to as being "on" another element, it may be directly on the other element or there may be intermediate elements present. Furthermore, when a layer is referred to as being "below" another layer, it may be directly below it or there may be one or more light-emitting units present. It is also understood that when a layer is referred to as being "between" two layers, it may be the only layer between the two layers, or there may be one or more light-emitting units present.

[0072] When using the terms “including,” “having,” and “comprising” as described herein, another component may be added unless explicitly qualifying terms such as “only,” “consisting of,” etc. are used. Unless otherwise stated, singular terms may include plural forms and should not be construed as having a quantity of one.

[0073] It should be understood that although the terms “first,” “second,” etc., may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used only to distinguish one element from another. For example, without departing from the scope of this application, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element.

[0074] It should also be understood that, in interpreting an element, although not explicitly described, the element is interpreted as including a range of error, which should be within the acceptable deviation range of a particular value as determined by a person skilled in the art. For example, "approximately," "about," or "substantially" can mean within one or more standard deviations, without limitation herein.

[0075] Furthermore, in the instruction manual, the phrase "planar distribution diagram" refers to the diagram when the target part is viewed from above, and the phrase "cross-sectional diagram" refers to the diagram when the target part is viewed from the side as a cross-section taken by vertically cutting the target part.

[0076] Furthermore, the accompanying drawings are not drawn to a 1:1 scale, and the relative dimensions of the components are shown in the drawings only as examples and not necessarily to actual scale.

[0077] As described in the background section, during the bonding process of the display module, after the chip-on-film (COF) is connected and bonded to the screen end of the display panel, the COF needs to be folded and attached to the backlight side of the display panel. However, due to the influence of material characteristics and processes, there is a risk of edge warping of the COF after folding and attaching, which affects the adhesion between the COF and the backlight side of the display panel.

[0078] In view of the above-mentioned problems, the inventors of this application have discovered through research that by providing connection holes on the circuit board and providing connection parts corresponding to the connection holes in the preset area of ​​the display panel, and by having the connection parts pass through the connection holes to fix the circuit board in the preset area, the fit between the circuit board and the preset area of ​​the display panel can be improved, avoiding the situation where insufficient connection between the circuit board and the preset area of ​​the display panel leads to edge warping of the circuit board.

[0079] Firstly, referring to Figure 1 and Figure 2 As shown, this application embodiment provides a display module 10.

[0080] The display module 10 can be an organic light-emitting diode (OLED) display module, a liquid crystal display (LCD) display module, a mini light-emitting diode (Mini LED) display module, or a micro light-emitting diode (Micro LED) display module.

[0081] Specifically, the display module 10 includes a display panel 11, a circuit board 12, and a connecting part 13. The backlight side of the display panel 11 is provided with a preset area 113; the circuit board 12 is provided with a connecting hole 14; the connecting part 13 is provided in the preset area 113, and the connecting part 13 and the connecting hole 14 are correspondingly provided. The connecting part 13 passes through the connecting hole 14 to fix part of the circuit board 12 in the preset area 113.

[0082] It is understood that the display panel 11 includes a light-emitting side 11a and a backlight side 11b, wherein the side of the display panel 11 that emits light is the light-emitting side 11a, and the side away from the light-emitting side 11a is the backlight side 11b. The light-emitting side 11a of the display panel 11 is provided with a display area 111 and a bezel area 112. Here, it should be noted that one end of the circuit board 12 is connected to the bezel area 112, and the other end of the circuit board 12 is bent to the backlight side 11b of the display panel 11 and connected to the preset area 113. The connection hole 14 is provided at the end where the circuit board 12 is connected to the circuit board 12.

[0083] The circuit board 12 may have one or more connecting holes 14, and the number of connecting portions 13 is the same as the number of connecting holes 14. In one example, if the circuit board 12 has one connecting hole 14, then the preset area 113 will have one corresponding connecting portion 13. In another example, if the circuit board 12 has multiple connecting holes 14, then the preset area 113 will have the same number of connecting portions 13. The connecting portions 13 and connecting holes 14 are arranged in a one-to-one correspondence, and the connecting portions 13 pass through the corresponding connecting holes 14 to fix the circuit board 12 to the preset area 113.

[0084] This embodiment does not limit the arrangement or location of the connecting holes 14. In one example, refer to... Figure 1 and Figure 2 As shown, multiple connecting holes 14 and multiple connecting portions 13 are evenly spaced along the edge of the end where the circuit board 12 connects to the preset area 113. The connecting portions 13 fix the edge of the circuit board 12, preventing the edge of the circuit board 12 from warping. In another example, a row of connecting holes 14 is provided on each of the two sides of the circuit board 12. In yet another example, connecting holes 14 are also provided in the middle area where the circuit board 12 connects to the preset area 113, fixing the middle area of ​​the circuit board 12 and increasing the connection strength between the circuit board 12 and the preset area 113.

[0085] The aforementioned display module 10 features a connection hole 14 at one end of the circuit board 12 that connects to the preset area 113, and a connection portion 13 corresponding to the connection hole 14 is provided in the preset area 113 of the display panel 11. The circuit board 12 is fixed by passing the connection portion 13 through the connection hole 14. This improves the fit between the circuit board 12 and the preset area 113 of the display panel 11, preventing edge warping of the circuit board 12 due to insufficient connection between the circuit board 12 and the preset area 113 of the display panel 11.

[0086] In one embodiment, the circuit board 12 is a chip-on-film (COF) film, with one end of the COF film located on the light-emitting side 11a of the display panel 11 and the other end located on the backlight side 11b of the display panel 11. The portion of the COF film located on the backlight side 11b of the display panel 11 is provided with a connection hole 14.

[0087] In one embodiment, reference Figure 1 As shown, the display module 10 also includes an attachment layer 15 and a padding layer 16. The attachment layer 15 is disposed in the preset area 113 of the display panel 11, the padding layer 16 is disposed between the attachment layer 15 and the display panel 11, and the connecting part 13 is disposed in the attachment layer 15. The attachment layer 15 is used to bond the circuit board 12 to bond the circuit board 12 to the preset area 113.

[0088] In one example, the attachment layer 15 and the preset area 113 have exactly the same size and shape, with the preset area 113 completely covered by the attachment layer 15 to increase the attachment area between the circuit board 12 and the attachment layer 15, thus binding the circuit board 12 to the preset area 113. In another example, the size of the attachment layer 15 can be larger than the preset area 113, with the edge of the attachment layer 15 covering the periphery of the preset area 113. This helps to reduce the problem of edge warping of the circuit board 12 after it is connected to the attachment layer 15.

[0089] In one example, the adhesive layer 15 may be a composite tape, such as adhesive layer 15 comprising laminated foam, polyimide (PI) and metal foil, the metal foil being made of copper, aluminum or copper alloy, etc.

[0090] The aforementioned display module 10, by setting an attachment layer 15 in the preset area 113, attaches the end of the circuit board 12 connected to the preset area 113 to the attachment layer 15, thereby improving the adhesion performance between the attachment layer 15 and the circuit board 12 and better fixing the circuit board 12 to the preset area 113. At the same time, the connecting part 13 is provided on the attachment layer 15, which can enhance the bonding strength between the circuit board 12 and the attachment layer 15, and avoid the problem of warping at the connection edge between the circuit board 12 and the attachment layer 15 due to the influence of the material properties and processes of the attachment layer 15, so as to attach the circuit board 12 flatly to the preset area 113 and improve the product yield of the display module 10.

[0091] It is understandable that the above-mentioned display module 10 also increases the distance between the border area 112 of the display panel 11 and the preset area 113 by setting the pad height 16. This is beneficial for the circuit board 12 to bend towards the preset area 113 after it is connected to the border area 112, and avoids the circuit board 12 from breaking due to the large bending strength.

[0092] In one embodiment, reference Figure 6 , Figure 7 , Figure 9 As shown, the connecting part 13 includes a connecting plug 131 and a main body 132. The connecting plug 131 passes through the charging connection hole 14 and covers the circuit board 12 around the connection hole 14. The main body 132 is connected to the side of the connecting plug 131 near the display panel 11 and is located in the gap between the circuit board 12 and the preset area 113.

[0093] In one example, the connecting plug 131 fills the connecting hole 14.

[0094] In one embodiment, the material of the connecting plug 131 includes a colloid, the connecting plug 131 is in a fluid state at a first temperature, and the connecting plug 131 is in a solidified state at a second temperature, the second temperature being lower than the first temperature.

[0095] Similarly, the main body 132 is an adhesive layer. The material of the main body 132 includes a colloid, and the main body 132 is in a fluid state at a first temperature and in a solidified state at a second temperature to bond the circuit board 12 and the preset area 113.

[0096] The material of the connecting plug 131 may include hot melt adhesive; the material of the main body 132 may also include hot melt adhesive. For example, the hot melt adhesive may be a silicone-based liquid adhesive, an epoxy resin-based liquid adhesive, a polyurethane-based liquid adhesive, etc.

[0097] In one example, refer to Figure 1 , Figure 5 , Figure 6 As shown, the connecting plug 131 and the main body 132 are formed by heating or pressurizing the adhesive column 18. The main body 132 is filled between the circuit board 12 and the adhesive layer 15. The circuit board 12 and the adhesive layer 15 are bonded together by the main body 132, which enhances the connection strength between the circuit board 12 and the adhesive layer 15. The connecting plug 131 is connected to the adhesive layer 15, fills the connecting hole 14 and covers the circuit board 12 around the connecting hole 14, so as to firmly fix the circuit board 12 to the adhesive layer 15.

[0098] Thus, by providing the connecting plug 131 to fill the connecting hole 14 and cover the circuit board 12 around the connecting hole 14, the fit between the circuit board 12 and the preset area 113 is strengthened, so that the circuit board 12 and the preset area 113 are firmly connected. By providing the main body 132, the gap between the circuit board 12 and the preset area 113 can be filled, as well as the gap between each functional layer (adhesive layer 15) between the circuit board 12 and the preset area 113 can be filled, thereby improving the bonding strength between the circuit board 12 and the adhesive layer 15, avoiding the influence of the adhesive layer 15 on its material properties, process and other reasons, and preventing the edge warping problem of the circuit board 12 to the greatest extent.

[0099] In one embodiment, reference Figure 3 , Figure 4 As shown, the connecting hole 14 includes a first hole portion 141 and a second hole portion 142. The first hole portion 141 is located on the side of the circuit board 12 facing the preset area 113; the second hole portion 142 is located on the side of the circuit board 12 away from the preset area 113. The second hole portion 142 communicates with the first hole portion 141, and the opening area of ​​the first hole portion 141 is larger than the opening area of ​​the second hole portion 142.

[0100] Reference Figure 6 or Figure 9The connecting plug 131 passes through the first hole 141 and the second hole 142 and covers the circuit board 12 surrounding the connecting hole 14. The size of the connecting plug 131 in the first hole 141 and the size of the connecting plug 131 covering the circuit board 12 surrounding the connecting hole 14 are larger than the size of the connecting plug 131 in the second hole 142. The cross-section of the connecting plug 131 in the direction perpendicular to the thickness of the display panel 11 is "I" shaped.

[0101] In this way, the connecting plug 131 can be prevented from falling out of the connecting hole 14, ensuring that the connecting plug 131 and the circuit board 12 are firmly connected, thereby fixing the circuit board 12 and preventing the edges of the circuit board 12 from warping.

[0102] In one embodiment, reference Figure 3 The circuit board 12 located around the connection hole 14 protrudes to the side opposite to the preset area 113, forming a protrusion 143.

[0103] Thus, referring to Figure 6 or Figure 9 The connecting plug 131 covers the protrusion 143, and the circuit board 12 around the connecting plug 131 and the connecting hole 14 is more firmly fixed, which can prevent the connecting plug 131 from falling out of the connecting hole 14 and ensure that the connecting plug 131 and the circuit board 12 are firmly fixed.

[0104] In one embodiment, reference Figure 7 , Figure 8 , Figure 9 , Figure 10 A metal frame 17 is embedded in the connecting plug 131. The metal frame 17 includes a support base 171 and a fixed leg 172. The support base 171 is located in the connecting hole 14. The fixed leg 172 is located on the support base 171 and extends to the side opposite to the preset area 113. The fixed leg 172 is bent toward the circuit board 12 around the connecting hole 14.

[0105] In one example, the fixed leg 172 bends onto the protrusion 143, and the fixed leg 172 hooks onto the protrusion 143.

[0106] Thus, by increasing the strength of the connecting plug 131 to fix the circuit board 12 through the metal frame 17, and by bending the fixed support 172 to fix the circuit board 12, the edge warping of the circuit board 12 can be more effectively avoided.

[0107] In one embodiment, a support base 171 is provided in the first hole 141 to increase the connection strength between the connecting plug 131 and the connecting hole 14 and to prevent the connecting plug 131 from falling out of the connecting hole 14.

[0108] In one embodiment, reference Figure 11 , Figure 12 The connecting part 13 includes a free end 1302, which passes through the connecting hole 14 and is bonded to the preset area 113 to fix the circuit board 12. One end of the connecting part 13 is fixedly connected to the preset area 113, and the free end 1302 can freely pass through the connecting hole 14. After passing through the connecting hole 14 and being bonded, the free end 1302 is bonded to the preset area 113.

[0109] In one example, one end of the connecting part 13 is connected to the adhesive layer 15, and the connecting part 13 and the adhesive layer 15 are integrally formed.

[0110] In the aforementioned display module 10, the connecting part 13 passes through the connecting hole 14 and is bonded to the preset area 113, fixing the circuit board 12 in the preset area 113. The way the connecting part 13 fixes the circuit board 12 is simple, reducing the manufacturing difficulty of the display module 10, avoiding damage to the display module 10 during the manufacturing process of the connecting part 13, improving the product yield of the display module 10, and ensuring the structural and performance integrity of the display module 10.

[0111] Secondly, referring to Figure 13 As shown in the figure, this application provides a method for manufacturing a display module, including:

[0112] Step S100: Provide a display panel 11 and a circuit board 12; the backlight side 11b of the display panel 11 is provided with a preset area 113;

[0113] Step S200: Form connection holes 14 on circuit board 12;

[0114] Step S300: A connecting part 13 corresponding to the connecting hole 14 is formed in the preset area 113. The connecting part 13 passes through the connecting hole 14 to fix part of the circuit board 12 in the preset area 113.

[0115] Reference Figure 1 , Figure 2 , Figure 3 The display panel 11 includes a light-emitting side 11a and a backlight side 11b. The side of the display panel 11 that emits light is the light-emitting side 11a, and the side facing away from the light-emitting side 11a is the backlight side 11b. The light-emitting side 11a of the display panel 11 is provided with a display area 111 and a frame area 112. It should be noted that one end of the circuit board 12 is connected to the frame area 112, and the other end of the circuit board 12 is bent to the backlight side 11b of the display panel 11 and connected to the preset area 113. A connection hole 14 is provided at the end where the circuit board 12 is connected to the circuit board 11.

[0116] The circuit board 12 may have one or more connecting holes 14, and the number of connecting portions 13 is the same as the number of connecting holes 14. In one example, if the circuit board 12 has one connecting hole 14, then the preset area 113 will have one corresponding connecting portion 13. In another example, if the circuit board 12 has multiple connecting holes 14, then the preset area 113 will have the same number of connecting portions 13. The connecting portions 13 and connecting holes 14 are arranged in a one-to-one correspondence, and the connecting portions 13 pass through the corresponding connecting holes 14 to fix the circuit board 12 to the preset area 113.

[0117] This embodiment does not limit the arrangement and location of the connecting holes 14. In one example, multiple connecting holes 14 and multiple connecting portions 13 are evenly spaced along the edge of the end where the circuit board 12 connects to the preset area 113. The connecting portions 13 fix the edge of the circuit board 12, preventing the edge of the circuit board 12 from warping. In another example, a row of connecting holes 14 is provided on each of the two side edges of the circuit board 12. In yet another example, connecting holes 14 are also provided in the middle area where the circuit board 12 connects to the preset area 113, fixing the middle area of ​​the circuit board 12 and increasing the connection strength between the circuit board 12 and the preset area 113.

[0118] The above-described method for manufacturing the display module involves providing a connection hole 14 at one end of the circuit board 12 that connects to the preset area 113, and providing a connection portion 13 corresponding to the connection hole 14 in the preset area 113 of the display panel 11. The circuit board 12 is then fixed by passing the connection portion 13 through the connection hole 14. This improves the fit between the circuit board 12 and the preset area 113 of the display panel 11, preventing edge warping of the circuit board due to insufficient connection between the circuit board 12 and the preset area 113 of the display panel 11.

[0119] In one embodiment, the circuit board 12 is a chip-on-film (COF) film, with one end of the COF film located on the light-emitting side 11a of the display panel 11 and the other end located on the backlight side 11b of the display panel 11. The portion of the COF film located on the backlight side 11b of the display panel 11 is provided with a connection hole 14.

[0120] In one embodiment, step S300: forming a connecting portion 13 corresponding to the connecting hole 14 in the preset area 113, the connecting portion 13 passing through the connecting hole 14 to fix a portion of the circuit board 12 to the preset area 113, including:

[0121] Step S310: Form a glue column 18 in the preset area 113. The glue column 18 and the connecting hole 14 are correspondingly set, and the glue column 18 passes through the connecting hole 14.

[0122] Step S320: Perform heating and / or pressurization on the glue column 18 to form a connecting part 13. The connecting part 13 includes a connecting plug 131 and a main body 132. The connecting plug 131 passes through the connecting hole 14 and covers the circuit board 12 around the connecting hole 14. The main body 132 is connected to the side of the connecting plug 131 near the display panel 11 and is located in the gap between the circuit board 12 and the preset area 113.

[0123] In one example, the main body 132 is an adhesive layer.

[0124] In one example, the connecting plug 131 fills the connecting hole 14.

[0125] In one embodiment, the material of the gel column 18 includes a colloid, the gel column 18 is in a fluid state at a first temperature, and the gel column 12 is in a solidified state at a second temperature, the second temperature being lower than the first temperature.

[0126] Reference Figure 5 After one end of the circuit board 12 is connected to the frame area 112, the other end of the circuit board 12 is bent to the preset area 113 of the backlight side 11b of the display panel 11. Adhesive posts 18 are set in the preset area 113 according to the position of the connection hole 14 of the circuit board 12, and the adhesive posts 18 are adhered to the preset area 113.

[0127] The adhesive post 18 is passed through the connection hole 14, and the height of the adhesive post 18 is higher than the top surface of the circuit board 12, so that the formed connection portion 13 can fill the connection hole 14.

[0128] Then, refer to Figure 6 The adhesive column 18 is subjected to heating and pressurization treatment, which raises its temperature from a second temperature to a first temperature. The adhesive column 18 melts from a solidified state to a fluid state. Under pressure, the fluid adhesive diffuses and fills the gap between the circuit board 12 and the preset area 113, forming the main body 132. At the same time, the liquid adhesive fills the connection hole 14 and covers the circuit board 12 around the connection hole 14 to form a connection plug 131, which strengthens the fit between the circuit board 12 and the preset area 113, so that the circuit board 12 and the preset area 113 are firmly connected, thereby improving the bonding strength between the circuit board 12 and the preset area 113 and preventing the edge warping of the circuit board 12 to the greatest extent.

[0129] For example, the adhesive column 18 may include hot melt adhesive, which may be silicone liquid adhesive, epoxy resin liquid adhesive, polyurethane liquid adhesive, etc.

[0130] In one embodiment, reference Figure 7 , Figure 8A metal frame 17 is embedded in the glue column 18. The metal frame 17 includes a support base 171 and a fixed support leg 172 disposed on the support base 171. The fixed support leg 172 extends to the side opposite to the preset area 113. (Refer to...) Figure 9 , Figure 10 Pressure is applied to the glue column 18, and the fixed support leg 172 is bent towards the circuit board 12 around the connection hole 14.

[0131] In this embodiment, adhesive posts 18 are set in the preset area 113 according to the position of the connection hole 14 of the circuit board 12. The adhesive posts 18 are adhered to the preset area 113 and then pass through the connection hole 14. After the adhesive posts 18 pass through the connection hole 14, the top surface of the fixing foot 172 is higher than the top surface of the side of the circuit board 12 facing away from the preset area 113.

[0132] The adhesive column 18 is subjected to pressure treatment, and the fixed support leg 172 is deformed under pressure, bending towards the circuit board 12 around the connection hole 14 and pressing it against the circuit board 12 around the connection hole 14, hooking the circuit board 12; at the same time, the adhesive column 18 is compressed and diffuses to fill the gap between the circuit board 12 and the preset area 113, forming the main body 132, which improves the fit between the circuit board 12 and the preset area 113; at the same time, the adhesive column 18 is compressed and fills the connection hole 14 and covers the circuit board 12 around the connection hole 14 to form a connecting plug 131, and the metal skeleton 17 is embedded in the connecting plug 131.

[0133] In this way, only pressure treatment is applied to the glue column 18, without the need for heating, thus avoiding damage to the display module 10 during the heating process, improving the product yield of the display module 10, and ensuring the structural and performance integrity of the display module 10. At the same time, by using pressure to squeeze the glue column 18, the fixed support 172 bends towards the circuit board 12 around the connection hole 14, hooking the circuit board 12 and mechanically fixing the circuit board 12. The glue column 18 is squeezed to form a connecting part 13, which bonds the circuit board 12 and the preset area 113, effectively preventing the edge warping of the circuit board 12.

[0134] In one embodiment, reference Figure 8 The fixed support 172 has a bent portion 173 at the end away from the support base 171. The bent portion 173 extends outward from the connecting hole 14. When the rubber column 18 is pressurized, the bent portion 173 bends outward from the connecting hole 14.

[0135] Thus, by limiting the bending direction through the bending portion 173, pressure is applied to the adhesive post 18, and the fixing leg 172 can be bent in the direction of the circuit board 12 surrounding the connecting hole 14, ensuring the effect of fixing the circuit board 12 by the fixing leg 172.

[0136] In one embodiment, step S300: forming a connecting portion 13 corresponding to the connecting hole 14 in the preset area 113, the connecting portion 13 passing through the connecting hole 14 to fix a portion of the circuit board 12 to the preset area 113, including:

[0137] Step S330: A connecting portion 13 is formed in the preset area 113, the connecting portion 13 including a free end 1302.

[0138] Step S340: Pass the free end 1302 through the connection hole 14 and attach it to the preset area 113 to fix the circuit board 12.

[0139] Reference Figure 11 , Figure 12 One end of the connecting part 13 is fixedly connected to the preset area 113, and the free end 1302 can freely pass through the connecting hole 14. After the free end 1302 passes through the connecting hole 14 and is bonded to the preset area 113, the circuit board 12 can be firmly fixed, preventing the edge of the circuit board 12 from warping.

[0140] In one embodiment, S100: After the step of providing a display panel 11 and a circuit board 12; and providing a preset area 113 on the backlight side 11b of the display panel 11, the following steps are included:

[0141] Step S400: An attachment layer 15 is formed in the preset area 113. The attachment layer 15 is used to bond the circuit board 12 to the preset area 113. In one example, the attachment layer 15 may be a composite tape, such as the attachment layer 15 comprising laminated foam, polyimide (PI) and metal foil, the metal foil being made of copper, aluminum or copper alloy, etc.

[0142] In one example, refer to Figure 1 , Figure 11 , Figure 12 The attachment layer 15 and the preset area 113 have exactly the same size and shape. The preset area 113 is completely covered by the attachment layer 15 to increase the bonding area between the circuit board 12 and the attachment layer 15, thus binding the circuit board 12 to the preset area 113. In another example, the size of the attachment layer 15 can be larger than the preset area 113, and the edge of the attachment layer 15 can cover the periphery of the preset area 113. This helps to reduce the problem of edge warping of the circuit board 12 after the circuit board 12 and the attachment layer 15 are connected.

[0143] In one embodiment, step S400, before forming the attachment layer 15 in the preset area 113, includes:

[0144] Step S500: A padding layer 16 is formed in the preset area 113. The padding layer 16 is disposed between the adhesive layer 15 and the display panel 11 to increase the distance between the bezel area 112 of the display panel 11 and the preset area 113. This facilitates the bending of the circuit board 12 towards the preset area 113 after it is connected to the bezel area 112, and avoids the circuit board 12 from breaking due to the large bending strength.

[0145] In the above-mentioned method for manufacturing the display module, the connecting part 13 passes through the connecting hole 14 and is bonded to the preset area 113, and the circuit board 12 is fixed in the preset area 113. The way the connecting part 13 fixes the circuit board 12 is simple, which reduces the manufacturing difficulty of the display module 10, avoids damage to the display module 10 during the manufacturing process of the connecting part 13, improves the product yield of the display module 10, and ensures the structural and performance integrity of the display module 10.

[0146] It should be understood that although the steps in the flowchart of this application are shown sequentially as indicated by the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless explicitly stated herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some steps in the flowchart of this application may include multiple steps or multiple stages, which are not necessarily completed at the same time, but may be executed at different times, and the execution order of these steps or stages is not necessarily sequential, but may be performed alternately or in turn with other steps or at least some of the steps or stages of other steps.

[0147] Thirdly, embodiments of this application provide a display device, including the display module described in the first aspect.

[0148] The display device can be a mobile or fixed terminal with a display module, such as a mobile phone, television, tablet computer, laptop computer, Ultra-Mobile Personal Computer (UMPC), Personal Digital Assistant (PDA), or virtual reality device.

[0149] The aforementioned display device, by providing connection holes on the circuit board and a corresponding connecting part on the preset area of ​​the display panel, fixes the circuit board through the connection holes via the connecting part. This improves the fit between the circuit board and the preset area of ​​the display panel, preventing edge warping of the circuit board due to insufficient connection.

[0150] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0151] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A display module, characterized in that, include: The display panel has a preset area on its backlight side; The circuit board has connection holes; A connecting part is provided in the preset area, and the connecting part and the connecting hole are correspondingly provided. The connecting part passes through the connecting hole to fix part of the circuit board in the preset area. The connection hole includes: The first hole is located on the side of the circuit board facing the preset area; The second hole is located on the side of the circuit board facing away from the preset area. The second hole communicates with the first hole, and the opening area of ​​the first hole is larger than the opening area of ​​the second hole.

2. The display module according to claim 1, characterized in that, The connecting part includes: A connecting plug passes through the connecting hole and covers the periphery of the connecting hole of the circuit board; The main body is connected to the side of the connecting plug near the display panel and is located in the gap between the circuit board and the preset area.

3. The display module according to claim 2, characterized in that, The main body is an adhesive layer.

4. The display module according to claim 2, characterized in that, The connecting plug fills the connecting hole.

5. The display module according to claim 2, characterized in that, The material of the connecting plug includes a colloid, the connecting plug is in a fluid state at a first temperature, and the connecting plug is in a solidified state at a second temperature, the second temperature being lower than the first temperature.

6. The display module according to claim 2, characterized in that, The circuit board is a flip-chip film, with one end of the flip-chip film located on the light-emitting side of the display panel and the other end located on the backlight side of the display panel. The portion of the flip-chip film located on the backlight side of the display panel is provided with the connection hole.

7. The display module according to claim 2, characterized in that, The circuit board located around the connection hole protrudes to the side opposite to the preset area, forming a protrusion.

8. The display module according to claim 7, characterized in that, The connecting plug passes through the first hole and the second hole and covers the protrusion.

9. The display module according to claim 8, characterized in that, A metal skeleton is embedded in the connecting plug, and the metal skeleton includes: A support base is disposed within the connection hole; A fixed support leg is provided on the support base and extends to the side opposite to the preset area. The fixed support leg bends toward the circuit board around the connection hole.

10. The display module according to claim 9, characterized in that, The support base is located at the first hole.

11. The display module according to claim 1, characterized in that, The connecting portion includes a free end that passes through the connecting hole and is bonded to the preset area to fix the circuit board.

12. A method for manufacturing a display module, characterized in that, include: Provide display panels and circuit boards; The display panel has a preset area on its backlight side; A connection hole is formed on the circuit board; the connection hole includes: a first hole portion, provided on the side of the circuit board facing the preset area; a second hole portion, provided on the side of the circuit board away from the preset area, the second hole portion communicating with the first hole portion, and the opening area of ​​the first hole portion being larger than the opening area of ​​the second hole portion; A connecting portion corresponding to the connecting hole is formed in the preset area, and the connecting portion passes through the connecting hole to fix part of the circuit board in the preset area.

13. The method for preparing a display module according to claim 12, characterized in that, A connecting portion corresponding to the connecting hole is formed in the preset area. The connecting portion passes through the connecting hole to fix a portion of the circuit board in the preset area, including: A glue column is formed in the preset area, and the glue column and the connecting hole are correspondingly arranged, with the glue column passing through the connecting hole; The adhesive column is subjected to heating and / or pressurization to form the connection portion, which includes a connecting plug and a main body. The connecting plug passes through the connecting hole and covers the circuit board surrounding the connecting hole. The main body is connected to the side of the connecting plug near the display panel and is located in the gap between the circuit board and the preset area.

14. The method for preparing a display module according to claim 13, characterized in that, The main body is an adhesive layer.

15. The method for preparing a display module according to claim 13, characterized in that, The connecting plug fills the connecting hole.

16. The method for preparing a display module according to claim 13, characterized in that, The material of the gel column includes a colloid. The gel column is in a fluid state at a first temperature and in a solidified state at a second temperature, where the second temperature is lower than the first temperature.

17. The method for preparing a display module according to claim 13, characterized in that, The circuit board is a flip-chip film, with one end of the flip-chip film located on the light-emitting side of the display panel and the other end located on the backlight side of the display panel. The portion of the flip-chip film located on the backlight side of the display panel is provided with the connection hole.

18. The method for preparing a display module according to claim 13, characterized in that, A metal frame is embedded in the adhesive column. The metal frame includes a support base and a fixed support leg on the support base. The fixed support leg extends to the side opposite to the preset area. The adhesive column is pressurized, and the fixing leg bends toward the circuit board surrounding the connection hole.

19. The method for preparing a display module according to claim 18, characterized in that, The fixed support leg has a bent portion at one end away from the support base. The bent portion extends outward from the connecting hole. When the rubber column is pressurized, the bent portion bends outward from the connecting hole.

20. The method for preparing a display module according to claim 12, characterized in that, A connecting portion corresponding to the connecting hole is formed in the preset area. The connecting portion passes through the connecting hole to fix a portion of the circuit board in the preset area, including: A connecting portion is formed in the preset area, the connecting portion including a free end; The free end is passed through the connection hole and bonded to the preset area to fix the circuit board.

21. A display device, characterized in that, Includes the display module as described in any one of claims 1-11.

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