Camera module and electronic device

Abstract

This application provides a camera module and an electronic device. The camera module includes a circuit assembly, a motor, a lens, an image sensor, an adhesive, and a filter. The motor is fixed to the circuit assembly. The lens is mounted on the motor. The image sensor is fixed and electrically connected to the circuit assembly. A first surface of the image sensor faces the lens. The first surface includes an imaging area and an edge area surrounding the imaging area. The adhesive is fixed to the circuit assembly and surrounds the image sensor. Alternatively, the adhesive is fixed to the edge area of ​​the first surface. The filter is fixed to the surface of the adhesive away from the circuit assembly. The adhesive has a viscosity greater than 10000 Cps, a thixotropic index greater than 2, a Young's modulus at room temperature in the range of 1000 MPa to 10000 MPa, and a coefficient of thermal expansion less than 80 ppm / k. This application obtains a camera module with high imaging performance and a thinner thickness by using an adhesive to replace the fixed step supporting the filter.

Description

Technical Field

[0001] This application relates to the field of camera technology, and in particular to a camera module and electronic device. Background Technology

[0002] As mobile phone performance continues to improve, camera modules, as a crucial component, face the dual challenges of achieving both thinner designs and enhanced image quality. Currently, camera modules on the market often require increasing lens size to improve image quality. This leads to an increase in the module's height, making it impossible to achieve a thinner design while simultaneously improving image quality. Summary of the Invention

[0003] This application provides a camera module and an electronic device including the camera module, aiming to improve the photography performance while obtaining a camera module and electronic device with a smaller thickness that can achieve a thin design.

[0004] In a first aspect, a camera module is provided. The camera module includes a circuit assembly, a motor, a lens, an image sensor, an adhesive, and a filter. The motor is fixed to the circuit assembly. The lens is mounted on the motor. The image sensor is fixed and electrically connected to the circuit assembly. A first surface of the image sensor faces the lens. The first surface includes an imaging area and an edge area surrounding the imaging area. The adhesive is fixed to the circuit assembly and surrounds the image sensor. Alternatively, the adhesive is fixed to the edge area of ​​the first surface. The filter is fixed to the surface of the adhesive away from the circuit assembly. The adhesive has a viscosity greater than 10000 Cps, a thixotropic index greater than 2, a Young's modulus at room temperature in the range of 1000 MPa to 10000 MPa, and a coefficient of thermal expansion less than 80 ppm / k.

[0005] Understandably, compared to traditional camera modules, the camera module in this embodiment eliminates the fixed step. Instead, it uses adhesive to fix the filter, thus assembling the filter. This completely decouples the filter from the base, effectively preventing the risk of filter deformation or even breakage due to base deformation caused by environmental stress. Therefore, the filter in this embodiment only needs to meet low micro-strain at the three-point bending fracture surface to resist deformation caused by environmental stress, effectively reducing the filter's manufacturing cost.

[0006] Secondly, by using adhesive instead of a fixed step to support the filter, the thickness of the adhesive layer and the fixed step in the back focus of the camera module can be effectively reduced. Thus, with the same imaging performance parameters, the camera module of this embodiment can effectively reduce the back focus length of the camera module, which is beneficial for achieving a thinner camera module design. When the module height is the same, the camera module of this embodiment can improve its imaging performance by increasing the length of the solid portion of the lens. In other words, the camera module of this embodiment can achieve a thinner design while improving imaging performance by shortening the back focus length of the mechanism.

[0007] Furthermore, when the adhesive meets the aforementioned physical parameter requirements, it possesses high strength. This effectively prevents excessive pressure from the filter during installation, which could lead to adhesive collapse or breakage. Simultaneously, the adhesive's sufficient strength ensures its height, allowing it to stably support the filter. Moreover, the high strength of the adhesive reduces the impact of environmental stress, thus preventing deformation due to external environmental stress and the risk of filter deformation and breakage caused by adhesive deformation.

[0008] Meanwhile, when the adhesive meets the above physical parameter requirements, the adhesive has suitable surface tension and wettability, so that when the filter is fixed from above the adhesive, a part of the adhesive will adhere to the surface of the filter close to the image sensor and extend outward along the surface, thereby preventing the adhesive from overflowing into the image sensor during the assembly of the filter and causing contamination to the image sensor.

[0009] In one possible implementation, the adhesive has a viscosity greater than 15000 Cps, a thixotropic index greater than 4, a Young's modulus at room temperature in the range of 1000 MPa to 6000 MPa, and a coefficient of thermal expansion less than 60 ppm / K. It is understandable that when the adhesive meets these physical parameters, its strength is higher, thus better resisting external environmental stress and preventing deformation due to such stress. This allows the adhesive to better maintain its height, providing more stable support for the filter and preventing collisions between the filter and the connecting wires that could cause breakage. Furthermore, higher adhesive strength also better prevents filter breakage due to deformation of the adhesive itself.

[0010] In one possible implementation, the camera module further includes a connecting wire that connects the image sensor and circuit components. Adhesive wraps at least a portion of the connecting wire, and a gap is formed between the filter and the highest point of the connecting wire. The highest point of the connecting wire is the point on the connecting wire closest to the lens in a first direction, which is parallel to the optical axis of the lens. In this way, the adhesive supports and fixes the filter while also protecting the connecting wire from damage. Furthermore, compared to traditional camera modules where the connecting wire is completely exposed to the air and can be bent and moved freely inside the camera module, the adhesive in this embodiment can wrap at least a portion of the connecting wire 30, thereby preventing the connecting wire from colliding with other components inside the module due to bending and movement, thus avoiding the problem of the connecting wire breaking.

[0011] In one possible implementation, the dimension of the highest point of the filter and the connecting line in the first direction is the safety distance of the connecting line. The safety distance of the connecting line is greater than or equal to 30 micrometers. In this way, a certain safety distance exists between the highest point of the filter and the connecting line, which can effectively avoid collision between the filter and the connecting line and reduce the risk of breakage or damage to the connecting line.

[0012] In one possible implementation, the adhesive wraps around the highest point of the connecting wire. This way, the adhesive wraps at least part of the connecting wire, including its highest point, thus fixing the highest point and preventing the connecting wire from colliding with other components inside the module due to bending or shaking, which could lead to wire breakage. Simultaneously, this allows the safety distance between the connecting wires in this embodiment to be significantly smaller than that in traditional camera modules, thereby further reducing the thickness of the camera module. In other words, compared to traditional camera modules, the camera module in this embodiment effectively saves on adhesive layer thickness, fixing step thickness, and part of the safety distance for the connecting wires.

[0013] In one possible implementation, the adhesive has a dimension in the first direction ranging from 50 micrometers to 400 micrometers. This gives the adhesive a certain height, allowing it to support the filter while maintaining a safe distance between the filter and the highest point of the connecting line, thus reducing the risk of connecting line breakage or filter rupture.

[0014] In one possible implementation, the circuit assembly includes a circuit board and a reinforcing plate. A motor is fixed to the circuit board. The reinforcing plate is fixed to the surface of the circuit board away from the motor. The circuit board has mounting holes. At least a portion of the reinforcing plate is exposed through the mounting holes. An image sensor is fixed to the reinforcing plate and is at least partially located within the mounting holes. Adhesive is fixed to the surface of the circuit board away from the reinforcing plate. The distance between the surface of the circuit board away from the reinforcing plate and the highest point of the connecting line in a first direction is a first distance. The distance of the adhesive in the first direction is equal to the sum of the safety distance of the connecting line and the first distance. Thus, by limiting the height of the adhesive to be equal to the sum of the safety distance of the connecting line and the first distance, a certain safety distance can be ensured between the highest point of the connecting line and the filter. This effectively avoids the problem of the connecting line breaking due to collision between the filter and the connecting line during installation, thereby effectively reducing the risk of connecting line damage and improving the yield of the camera module.

[0015] In one possible implementation, the circuit assembly includes a circuit board. A motor is fixed to the circuit board. An image sensor is fixed to the surface of the circuit board near the lens. Adhesive is fixed to the image sensor. The distance between the surface of the image sensor away from the circuit board and the highest point of the connecting line in a first direction is a second distance. The distance of the adhesive in the first direction is equal to the sum of the safety distance of the connecting line and the second distance. Thus, by limiting the height of the adhesive to be equal to the sum of the safety distance of the connecting line and the second distance, a certain safety distance can be maintained between the highest point of the connecting line and the filter. This effectively avoids the problem of the connecting line breaking due to collision between the filter and the connecting line during installation, thereby effectively reducing the risk of connecting line damage and improving the yield rate of the camera module.

[0016] In one possible implementation, the adhesive is a UV-curable adhesive. This allows the adhesive to be cured by irradiating it with ultraviolet light. The adhesive cures relatively quickly, which helps maintain its adhesion.

[0017] In one possible implementation, the adhesive, the filter, and the image sensor together enclose the inner space of the adhesive. Alternatively, the adhesive, the filter, and the circuit components together enclose the inner space of the adhesive. The adhesive is used to prevent dust from entering the inner space of the adhesive. In this way, the adhesive can seal the space between the filter and the image sensor (i.e., the inner space of the adhesive), thereby effectively preventing dust and other contaminants from entering the space between the filter and the image sensor, avoiding problems such as image shadows that could affect the camera module's imaging performance.

[0018] In one possible implementation, the adhesive, filter, and image sensor together enclose the inner space of the adhesive. Alternatively, the adhesive, filter, and circuit components together enclose the inner space of the adhesive. The adhesive has an opening that extends through both the inner and outer peripheral sides of the adhesive. The camera module also includes a breathable membrane. The breathable membrane is fixed to the adhesive and covers the opening. The breathable membrane cooperates with the adhesive to prevent dust from entering the inner space of the adhesive. The breathable membrane allows gas to pass through. In this way, the breathable membrane can prevent dust from entering the inner space of the adhesive while allowing gas to flow between the inner space of the adhesive and the internal space of the camera module. This ensures that the pressure in the inner space of the adhesive and the internal space of the camera module are the same, meaning that the air pressure on the inside and outside of the filter is the same. This effectively avoids the problem of filter deformation caused by process baking stress and air pressure difference stress on the inside and outside of the filter during the assembly of the camera module, thus effectively reducing the risk of filter breakage.

[0019] In one possible implementation, the micro-strain on the three-point bending fracture surface of the filter is greater than 2000µe. It is understood that when the filter meets the above physical parameter requirements, the filter has high strength, which can effectively reduce the impact of environmental stress on the filter, thereby reducing the risk of filter breakage and extending the service life of the camera module.

[0020] In one possible implementation, the micro-strain of the three-point bending fracture surface of the filter is greater than 4000µe. This results in higher filter strength, allowing it to better resist external environmental stresses and preventing deformation and breakage due to such stresses.

[0021] In one possible implementation, the filter includes an edge portion and a filtering portion. The edge portion surrounds the filtering portion. An adhesive is fixedly attached to the edge portion. The filtering portion faces the image sensor. The camera module also includes a first dustproof adhesive. The first dustproof adhesive is located on the side of the filter away from the adhesive and is fixed to the edge portion. The first dustproof adhesive is used to absorb dust. It is understood that there is a gap between the lens and the motor of some camera modules, which allows some dirt to enter the interior of the camera module through the gap and fall onto the filtering portion of the filter, causing a black shadow in the image. In this embodiment, the camera module provides a first dustproof adhesive on the edge portion of the filter, thereby adhering to dirt that has entered the camera module, preventing dirt from falling onto the filtering portion of the filter or the imaging area of ​​the image sensor, reducing the risk of black shadows in the image, and effectively improving the imaging performance of the camera module.

[0022] In one possible implementation, the camera module further includes a second dustproof adhesive, which is fixed to the surface of the circuit assembly near the lens and surrounds the adhesive. It is understood that some camera modules have gaps between the lens and the motor, allowing dirt to enter the camera module and fall onto the filter portion of the optical filter, causing shadows in the image. In this embodiment, by providing a second dustproof adhesive around the adhesive, the camera module can retain dirt that has entered the module, preventing it from falling onto the filter portion of the optical filter or the imaging area of ​​the image sensor. This reduces the risk of shadows in the image and effectively improves the camera module's photographic performance.

[0023] In one possible implementation, the camera module also includes a base. The base is fixed to the circuit assembly. The motor is fixed to a surface of the base away from the circuit assembly. A shock-absorbing step is formed on the surface of the base near the lens. The shock-absorbing step is located between the lens and the filter. In this way, the shock-absorbing step can be used to prevent the lens from colliding with the filter during downward movement under extreme mechanical stress, thus preventing the filter from breaking.

[0024] In one possible implementation, the adhesive comprises a first part and a second part. The first part connects the filter and the circuit assembly. The second part connects to the first part and also connects to the circuit assembly. The second part is used to reinforce the circuit assembly. Thus, on the one hand, the adhesive can support and fix the filter, reducing the back focus of the camera module. On the other hand, the second part of the adhesive can also structurally reinforce the circuit assembly, thereby effectively increasing its strength, improving its resistance to deformation, reducing the risk of damage, and ultimately improving the overall structural stability of the camera module and extending its service life.

[0025] Secondly, an electronic device is provided. The electronic device includes an image processor and the aforementioned camera module. The image processor is communicatively connected to the camera module. The image processor is used to acquire image data from the camera module and process the image data. It is understood that the camera module in this embodiment can achieve a thinner design while improving its photographic performance by shortening the back focal length of the mechanism, thereby facilitating the acquisition of an electronic device with high photographic performance and a thinner profile.

[0026] Thirdly, a method for assembling a light filter is provided. The method includes: fixing the light filter to the mounting portion of a placement tool; placing the support portion of the placement tool on the surface of a circuit board so that the light filter contacts the surface of uncured adhesive; curing the adhesive; and removing the placement tool.

[0027] Understandably, compared to curing the adhesive before assembling the filter, this embodiment cures the adhesive after assembling the filter. This allows the adhesive to better control its height using the mounting tool, thereby accurately achieving the designed height of the adhesive and precisely controlling the safe distance between the highest point of the filter and the connecting line (i.e., the safe distance of the connecting line). This helps to ensure the assembly accuracy of the camera module and improve the yield rate of the camera module.

[0028] In one possible implementation, the height of the support portion is equal to the sum of the filter thickness and the adhesive height. It is understood that in this embodiment, the height of the support portion of the mounting tool is equal to the sum of the filter thickness and the adhesive height of the camera module. This allows the mounting tool to ensure the filter is assembled at a constant height from the circuit components or image sensor surface during the assisted assembly process. This avoids the filter collapsing the adhesive during assembly, colliding with the connecting wires, and causing the connecting wires to break, thus improving the assembly yield of the camera module. In this way, using a mounting tool to assemble the filter at a constant height significantly reduces the probability of the filter colliding with the connecting wires, allowing the safety distance of the connecting wires to be kept relatively small to ensure the safety of the filter. In other words, the safety distance of the connecting wires required to assemble the filter using the assembly method of this embodiment is much smaller than the safety distance required to assemble the filter using conventional methods, which is beneficial for achieving a thinner design of the camera module. Attached Figure Description

[0029] To more clearly illustrate the technical solutions in the embodiments of this application or the background art, the accompanying drawings used in the embodiments of this application or the background art will be described below.

[0030] Figure 1 This is a schematic diagram of the structure of the electronic device provided in some embodiments of this application;

[0031] Figure 2 This is a schematic diagram of the internal structure of a camera module;

[0032] Figure 3 yes Figure 2 The diagram shown is an enlarged view of the camera module at point B.

[0033] Figure 4 yes Figure 1 A cross-sectional view of the camera module of the electronic device shown on line AA in one embodiment;

[0034] Figure 5 yes Figure 4 A cross-sectional view of the camera module shown from another perspective;

[0035] Figure 6 yes Figure 4 The diagram shows an enlarged view of the camera module at point C.

[0036] Figure 7 yes Figure 4 A schematic diagram illustrating the assembly process of the filter for the camera module shown.

[0037] Figure 8 yes Figure 7 A partial process diagram of the assembly method shown;

[0038] Figure 9 yes Figure 7 A partial process diagram of the assembly method shown;

[0039] Figure 10 yes Figure 4 A cross-sectional view of the camera module shown in another embodiment;

[0040] Figure 11 yes Figure 10 A cross-sectional view of the camera module shown from another perspective;

[0041] Figure 12 yes Figure 4 A cross-sectional view of the camera module shown in yet another embodiment;

[0042] Figure 13 yes Figure 12 The image shows a cross-sectional view of the camera module in another embodiment. Detailed Implementation

[0043] The embodiments of this application are described below with reference to the accompanying drawings.

[0044] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. "Fixed connection" refers to a connection where the relative positional relationship remains unchanged after connection. The directional terms mentioned in the embodiments of this application, such as "upper," "lower," "inner," and "outer," are only for reference to the directions in the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of this application, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application. "Multiple" refers to at least two.

[0045] In the embodiments of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature.

[0046] References to "one embodiment" or "some embodiments" in the description of embodiments in this application mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, phrases such as "in one embodiment," "in some embodiments," "in another embodiment," "in yet another embodiment," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0047] Furthermore, in the embodiments of this application, the term "similar areas" refers to areas that are equal or approximately equal. For example, "similar areas of A and B" means that the area of ​​A is equal to the area of ​​B, or the area of ​​A is slightly larger than the area of ​​B, or the area of ​​A is slightly smaller than the area of ​​B.

[0048] It is understood that the specific embodiments described herein are merely for explaining the relevant invention and not for limiting the invention. It should also be noted that, for ease of description, only the parts relevant to the invention are shown in the accompanying drawings.

[0049] Figure 1 This is a schematic diagram of the structure of the electronic device 1000 provided in some embodiments of this application.

[0050] like Figure 1 As shown, the electronic device 1000 can be a mobile phone, tablet personal computer, laptop computer, personal digital assistant (PDA), camera, personal computer, laptop computer, in-vehicle equipment, wearable device, augmented reality (AR) glasses, AR helmet, virtual reality (VR) glasses, or VR helmet, or other devices with camera functions. Figure 1 The electronic device 1000 shown is illustrated using a mobile phone as an example.

[0051] For example, the electronic device 1000 may include a camera module 100, a device housing 200, an image processor (not shown), and a display screen (not shown). The camera module 100 may be a rear-facing camera module or a front-facing camera module. It should be noted that... Figure 1 The accompanying drawings below only schematically illustrate some components included in the electronic device 1000; the actual shape, size, location, and construction of these components are not subject to change. Figure 1 As well as the accompanying drawings below. Furthermore, when the electronic device 1000 is a device of some other form, the electronic device 1000 may not include a screen.

[0052] like Figure 1 As shown, the device housing 200 may include a frame 201 and a rear cover 202. The rear cover 202 is fixed to the frame 201. For example, the rear cover 202 can be fixedly connected to the frame 201 by adhesive. The rear cover 202 may also be integrally formed with the frame 201, that is, the rear cover 202 and the frame 201 are a single structure.

[0053] Alternatively, the screen can be located on the side of the bezel 201 away from the back cover 202. In this case, the screen and the back cover 202 are located on opposite sides of the bezel 201. The screen, bezel 201, and back cover 202 together enclose the entire internal cavity of the electronic device 1000. The internal cavity of the electronic device 1000 can be used to house the camera module 100, the image processor, and other components of the electronic device 1000, such as a battery, receiver, or microphone. The screen can be a flat screen or a curved screen.

[0054] For example, the camera module 100 can be fixed to the side of the screen facing the rear cover 202. The rear cover 202 may have a light-transmitting hole 203. The shape of the light-transmitting hole 203 is not limited to the following. Figure 1 The schematic diagram shows a circle. The light-transmitting aperture 203 connects the interior of the electronic device 1000 to the exterior. Light from outside the electronic device 1000 can enter the interior through the light-transmitting aperture 203. The camera module 100 can capture the ambient light entering the interior of the electronic device 1000.

[0055] For example, the camera module 100 can be a conventional camera module (i.e., the optical axis of the camera module 100 is in the thickness direction of the electronic device 1000). In some embodiments, the camera module 100 can also be a periscope camera module (i.e., the optical axis of the camera module 100 is in the width direction of the electronic device 1000).

[0056] For example, an image processor can be communicatively connected to a camera module 100. The image processor can acquire and process image data from the camera module 100. The communication connection between the camera module 100 and the image processor can include data transmission via electrical connections such as wiring, or data transmission via coupling or other methods. It is understood that the camera module 100 and the image processor can also communicate via other methods capable of data transmission.

[0057] The function of an image processor is to optimize digital image signals through a series of complex mathematical algorithms, and finally transmit the processed signals to the display. An image processor can be an image processing chip or a digital signal processing chip.

[0058] Understandable Figure 1 The installation position of the camera module 100 in the illustrated embodiment of the electronic device 1000 is merely illustrative, and this application does not strictly limit the installation position of the camera module 100. In some embodiments, the camera module 100 may also be installed in other locations on the electronic device 1000, for example, the camera module 100 may also be installed on the upper-middle part or the upper right corner of the back of the electronic device 1000. In other embodiments, the electronic device 1000 may include a device body and auxiliary components that can rotate, move, or be detached relative to the device body. In this case, the camera module 100 may also be disposed on the auxiliary components.

[0059] The structure of the electronic device 1000 has been described in detail above. The structure of the camera module 100 in some embodiments will be described in detail below with reference to the relevant accompanying drawings.

[0060] Figure 2 This is a schematic diagram of the internal structure of a camera module 300. Figure 3 yes Figure 2 The enlarged schematic diagram of the camera module 300 at point B is shown.

[0061] like Figure 2 and Figure 3As shown, the camera module 300 may include an image sensor 310, a filter 320, multiple connecting wires 330, a base 340, a circuit assembly 350, a motor 360, and a lens 370. The image sensor 310 can also be referred to as a photosensitive chip or photosensitive element. The image sensor 310 can be used to collect ambient light and convert the image information carried by the ambient light into electrical signals. The motor 360 can be fixedly connected to the top surface of the base 340 by means of adhesive bonding or other methods. The circuit assembly 350 can be fixedly connected to the bottom surface of the base 340 by means of adhesive bonding or other methods. The lens 370 can be mounted on the motor 360. The image sensor 310 can be fixed to the circuit assembly 350 and electrically connected to the circuit assembly 350 via multiple connecting wires 330.

[0062] The base 340 may have a fixing step 341 on its inner peripheral side. The filter 320 may be fixed to the surface of the fixing step 341 away from the image sensor 310 by means of adhesive bonding or other methods. Exemplarily, the camera module 300 may also include an adhesive layer 380. The adhesive layer 380 may be fixedly connected to the surface of the fixing step 341 away from the image sensor 310. The filter 320 may be fixed to the surface of the adhesive layer 380 away from the fixing step 341. Exemplarily, the adhesive layer 380 may be double-sided adhesive. A collision-resistant step surface 342 may be formed on a portion of the base 340 near the lens 370. The collision-resistant step surface 342 may be located between the lens 370 and the filter 320.

[0063] It is understandable that the flange focal length (FBL) of the camera module 300 refers to the distance between the last mechanical surface of the lens 370 in the camera module 300 and the imaging surface of the image sensor 310. The flange focal length of the camera module 300 can also be called the flange focal length. The flange focal length in the camera module 300 can be composed of multiple parts. For example... Figure 3 In the camera module 300 shown, the mechanism back focus may include a lens safety distance L1, an anti-collision step height L2, a filter thickness L3, an adhesive layer thickness L4, a fixing step thickness L5, a connecting line safety distance L6, and a connecting line height L7. Specifically, the lens safety distance L1 is the distance between the last mechanism surface of the lens 370 and the anti-collision step surface 342. The anti-collision step height L2 is the distance between the anti-collision step surface 342 and the surface of the filter 320 furthest from the lens 370. The connecting line safety distance L6 is the distance between the surface of the fixing step 341 furthest from the lens 370 and the highest point of the connecting line 330.

[0064] In some implementations, the lens safety distance L1 can be 230 micrometers. The anti-collision step height L2 can be 40 micrometers. The filter thickness L3 can be 210 micrometers. The adhesive layer thickness L4 can be 30 micrometers. The fixing step thickness L5 can be 200 micrometers. The connecting line safety distance L6 can be 100 micrometers. The connecting line height L7 can be 130 micrometers. In this case, the back focus of the camera module 100 can be 940 micrometers.

[0065] Figure 4 yes Figure 1 A cross-sectional view of the camera module 100 of the electronic device 1000 shown on line AA in one embodiment. Figure 5 yes Figure 4 The camera module 100 shown is a cross-sectional view from another perspective.

[0066] like Figure 4 and Figure 5 As shown, the camera module 100 may include an image sensor 10, a filter 20, multiple connecting cables 30, a base 40, a circuit assembly 50, a motor 60, a lens 70, and adhesive 90. For ease of description, the width direction of the camera module 100 is defined as the X-axis. The length direction of the camera module 100 is defined as the Y-axis. The thickness direction of the camera module 100 is defined as the Z-axis. It is understood that the coordinate system of the camera module 100 can be flexibly set according to specific actual needs. The optical axis direction of the lens 70 is the same as the optical axis direction of the camera module 100, which is the first direction (i.e., the Z-axis direction in this embodiment).

[0067] Exemplarily, the base 40 may include a top surface and a bottom surface facing away from each other. The base 40 may have a through hole 41. The through hole 41 may penetrate through the top surface and the bottom surface of the base 40. A portion of the surface of the base 40 near the lens 70 may form an anti-collision step surface 42. The orientation of the anti-collision step surface 42 is the same as the orientation of the top surface of the base 40. The anti-collision step surface 42 can be used to prevent the lens 70 from colliding with the filter 20 during downward movement under extreme mechanical stress, thus preventing the filter 20 from breaking.

[0068] For example, the motor 60 can be fixedly connected to the top surface of the base 40. For instance, the motor 60 can be fixedly connected to the top surface of the base 40 by means of adhesive bonding. The lens 70 can be mounted on the motor 60. The motor 60 can be used to drive the lens 70 to move along the optical axis of the camera module 100, thereby achieving the focusing function of the camera module 100. The light-emitting side of the lens 70 can face the through-hole 41.

[0069] Exemplarily, the circuit assembly 50 can be fixedly connected to the bottom surface of the base 40. For example, the circuit assembly 50 can also be fixedly connected to the bottom surface of the base 40 by means of adhesive bonding or the like. Exemplarily, the circuit assembly 50 may include a reinforcing plate 51 and a circuit board 52. The reinforcing plate 51 can be fixed to the surface of the circuit board 52 away from the motor 60 by means of adhesive bonding or the like. The surface of the circuit board 52 away from the reinforcing plate 51 can be fixed to the bottom surface of the base 40 by means of adhesive bonding or the like. In this case, the space enclosed by the base 40, the circuit assembly 50, the motor 60, and the lens 70 can constitute the internal space 100a of the camera module 100.

[0070] For example, circuit board 52 can be a rigid circuit board. Reinforcing plate 51 can be a metal plate. For example, reinforcing plate 51 can be a stainless steel plate. Reinforcing plate 51 can be fixedly connected to circuit board 52 with conductive adhesive and electrically connected to circuit board 52. In this way, on the one hand, reinforcing plate 51 can be grounded through circuit board 52, and on the other hand, reinforcing plate 51 can structurally reinforce circuit board 52, thereby enhancing the structural strength of circuit board 52 and improving the structural stability of camera module 100.

[0071] For example, the circuit board 52 may have mounting holes 521. The mounting holes 521 may be opposite to and communicate with the through holes 41 of the base 40. A portion of the surface of the reinforcing plate 51 may be exposed through the mounting holes 521. The image sensor 10 may be fixed to the surface of the reinforcing plate 51 exposed in the mounting holes 521. In this case, the image sensor 10 may be at least partially located within the mounting holes 521. It is understood that by providing mounting holes 521 on the circuit board 52 and placing the image sensor 10 within the mounting holes 521, the image sensor 10 can utilize the thickness space of the circuit board 52 to a greater extent, thereby facilitating the thinner design of the camera module 100.

[0072] In some embodiments, the circuit assembly 50 may further include an electronic component 53. The electronic component 53 may be fixed to the surface of the circuit board 52 away from the reinforcing plate 51. The portion of the base 40 near the electronic component 53 may be recessed inward to form a clearance space 44 to allow the electronic component 53 to pass. The electronic component 53 may be a capacitor, resistor, or other similar device.

[0073] In some embodiments, circuit board 52 may also be a flexible circuit board or a rigid-flex circuit board. Reinforcing plate 51 may also be a board material made of other conductive materials.

[0074] In some other embodiments, the circuit assembly 50 may not include the reinforcing plate 51. The image sensor 10 may be mounted on the surface of the circuit board 52 facing the lens 70.

[0075] In some other embodiments, the circuit board 52 may not have mounting holes 521. The image sensor 10 may be fixed to the surface of the circuit board 52 away from the reinforcing plate 51.

[0076] like Figure 4 and Figure 5 As shown, the image sensor 10 may be generally square. The image sensor 10 may include a first surface 10a facing the lens 70. The first surface 10a of the image sensor 10 may include an edge region 11 and an imaging region 12. The edge region 11 of the image sensor 10 may connect to the periphery of the imaging region 12. In this case, the edge region 11 may surround the imaging region 12. It should be understood that... Figure 4 The edge region 11 and the imaging region 12 of the image sensor 10 are schematically divided by dashed lines.

[0077] For example, the connecting wires 30 may include a first end 31 and a second end 32 disposed opposite to each other. The first end 31 of each connecting wire 30 may be fixed to the edge region 11 of the image sensor 10 by means of soldering or the like, and electrically connected to the image sensor 10. The second end 32 of each connecting wire 30 may be fixed to the surface of the circuit board 52 away from the reinforcing plate 51 by means of soldering or the like, and electrically connected to the circuit board 52. The second end 32 of each connecting wire 30 may be fixed to the edge portion of the circuit board 52 near the mounting hole 521. In this case, the image sensor 10 can be electrically connected to the circuit board 52 via multiple connecting wires 30.

[0078] Exemplarily, the adhesive 90 can be fixed to the surface of the circuit board 52 away from the reinforcing plate 51 and is disposed around the mounting hole 521, that is, around the image sensor 10. In this case, the adhesive 90 can be generally frame-shaped. The adhesive 90 can wrap at least a portion of each connecting line 30. For example, the adhesive 90 can cover the second end 32 of each connecting line 30. The sum of the projected area of ​​the adhesive 90 on the first plane (i.e., the XY plane in this embodiment) and the area enclosed by the projection can be greater than the projected area of ​​the image sensor 10 on the first plane. Exemplarily, the adhesive 90 can have a certain structural strength. This allows the adhesive 90 to better protect the connecting lines 30 and prevent damage to them. Simultaneously, the structural strength of the adhesive 90 can also ensure the height of the adhesive 90. Thus, when the filter 20 is fixed to the adhesive 90, the adhesive 90 can better support the filter 20. The adhesive 90 can be selected to have a certain structural strength.

[0079] For example, the adhesive 90 can also wrap the highest point of the connecting line 30 while wrapping at least a portion of it. The highest point of the connecting line 30 is the point on the connecting line 30 closest to the lens 70 in the Z-axis direction (i.e., the first direction in this embodiment). It is understood that in this embodiment, the image sensor 10 is fixed to the reinforcing plate 51 and located within the mounting hole 521 of the circuit board 52, allowing the highest point of the connecting line 30 to be close to the circuit board 52. Thus, when the adhesive 90 is fixed to the surface of the circuit board 52, it can wrap the highest point of the connecting line 30 while wrapping at least a portion of it, thereby better protecting the connecting line 30 and preventing it from colliding with the filter 20 or other internal components of the camera module 100, which could damage the connecting line 30.

[0080] For example, the filter 20 may include an edge portion 21 and a filtering portion 22. The edge portion 21 of the filter 20 may be connected to the periphery of the filtering portion 22. In this case, the edge portion 21 of the filter 20 may be disposed around the filtering portion 22. The filter 20 may be a blue glass filter (BG) or an infrared ray cut-off filter (IRCF), etc.

[0081] For example, the micro-strain on the surface of the filter 20 at three-point bending fracture can be greater than 2000µe. For instance, the micro-strain on the surface of the filter 20 at three-point bending fracture can be 3400µe, 4000µe, 6000µe, 6800µe, 8200µe, etc. This results in higher strength for the filter 20, effectively reducing the impact of environmental stress on the filter 20, thereby reducing the risk of filter 20 breakage and extending the service life of the camera module 100. It should be understood that... Figure 4 The edge portion 21 and the filter portion 22 of the filter 20 are schematically divided by dashed lines.

[0082] For example, the edge portion 21 of the filter 20 can be fixed to the surface of the adhesive 90 away from the circuit board 52. In this case, the anti-collision step surface 42 of the base 40 can be located between the filter 20 and the lens 70. A gap can be formed between the filter 20 and the highest point of the connecting line 30.

[0083] For example, the projected area of ​​the filter 20 on the first plane can be approximately the sum of the projected area of ​​the adhesive 90 on the first plane and the area enclosed by the projection. That is, the projected area of ​​the filter 20 on the first plane can be larger than the projected area of ​​the image sensor 10 on the first plane. The filtering portion 22 of the filter 20 can be disposed facing the image sensor 10. The space enclosed by the adhesive 90, the filter 20, and the image sensor 10 can constitute the inner space 91 of the adhesive 90. In this way, the adhesive 90 can seal the space between the filter 20 and the image sensor 10 (that is, the inner space 91 of the adhesive 90 in this embodiment), thereby effectively preventing dust and other particles from entering the space between the filter 20 and the image sensor 10, avoiding problems such as image shadows, and affecting the imaging performance of the camera module 100.

[0084] For example, the distance between the surface of the circuit board 52 near the lens 70 and the highest point of the connecting line 30 in the Z-axis direction is a first distance D1. The dimension of the adhesive 90 in the Z-axis direction (hereinafter referred to as the height of the adhesive 90) can be greater than the first distance D1. In this way, on the one hand, the adhesive 90 can better wrap the connecting line 30 to protect it and prevent it from breaking. On the other hand, the height of the adhesive 90 is greater than the first distance D1, thereby avoiding the problem of the connecting line 30 being damaged due to collision between the filter 20 and the connecting line 30 during the assembly of the filter 20.

[0085] For example, the height difference in the Z-axis direction between the surface of the filter 20 near the image sensor 10 and the highest point of the connecting line 30 is the connecting line safety distance L6. The connecting line safety distance L6 can be greater than or equal to 30 micrometers. For example, the connecting line safety distance L6 can be 30 micrometers, 50 micrometers, 85 micrometers, 92 micrometers, 120 micrometers, etc.

[0086] For example, the height of the adhesive 90 can also be equal to the sum of the safety distance L6 between the connecting lines and the first distance D1. The height of the adhesive 90 can be in the range of 50 micrometers to 400 micrometers. For example, the height of the adhesive 90 can be 60 micrometers, 80 micrometers, 100 micrometers, 200 micrometers, 320 micrometers, etc. By limiting the height of the adhesive 90 to be equal to the sum of the safety distance L6 between the connecting lines and the first distance D1, a certain safety distance can be maintained between the highest point of the connecting line 30 and the surface of the filter 20 near the image sensor 10. This effectively avoids the problem of the connecting line 30 breaking due to collision between the filter 20 and the connecting line 30 during installation, thereby effectively reducing the risk of damage to the connecting line 30 and improving the yield of the camera module 100.

[0087] For example, adhesive 90 can be an epoxy resin-based adhesive. Adhesive 90 can have a viscosity greater than 10000 Cps, a thixotropic index (TI) greater than 2, a room temperature Young's modulus in the range of 1000 MPa to 10000 MPa, and a coefficient of thermal expansion (CTE) less than 80 ppm / k. For instance, the viscosity of adhesive 90 can be 20000 Cps, 30000 Cps, 45000 Cps, 46000 Cps, or 50500 Cps, etc. The thixotropic index of adhesive 90 can be 3.6, 5, 5.5, 6.4, 8, etc. The room temperature Young's modulus of adhesive 90 can be 1500 MPa, 2200 MPa, 3000 MPa, 3800 MPa, 5000 MPa, etc. The coefficient of thermal expansion of adhesive 90 can be 26ppm / k, 35ppm / k, 43ppm / k, 50ppm / k, 58ppm / k, etc.

[0088] It should be noted that the physical parameters of the adhesive 90 in this embodiment were measured under normal temperature, humidity, and pressure conditions. Normal temperature refers to a temperature of approximately 25°C. Normal humidity refers to a relative humidity of approximately 50%. Normal pressure refers to an atmospheric pressure of approximately 101 kPa. The viscosity and thixotropic index of the adhesive 90 can be measured using a Brinell viscometer with a suitable rotor range and a rotational speed between 0.1 rpm and 50 rpm. The room temperature Young's modulus can be measured using dynamic mechanical analysis (DMA). The coefficient of thermal expansion can be measured using a thermomechanical analyzer (TMA).

[0089] Understandably, when the adhesive 90 meets the aforementioned physical parameter requirements, its strength is high. This effectively prevents the filter 20 from applying excessive pressure to the adhesive 90 during installation, which could cause the adhesive 90 to collapse and expose the connecting wire 30, leading to the breakage of the connecting wire 30. Simultaneously, the adhesive 90 possesses sufficient strength to maintain its height, allowing it to stably support the filter 20 and ensuring a safe distance between the filter 20 and the highest point of the connecting wire 30. Furthermore, the high strength of the adhesive 90 reduces the impact of environmental stress, thus preventing deformation of the adhesive 90 due to external environmental stress and avoiding the risks of filter 20 deformation and breakage or connecting wire 30 breakage caused by adhesive 90 deformation.

[0090] Secondly, when the adhesive 90 meets the above-mentioned physical parameter requirements, the adhesive 90 has suitable surface tension and wettability, so that when the filter 20 is fixed from above the adhesive 90, a portion of the adhesive 90 will adhere to the surface of the filter 20 near the image sensor 10 and extend outward along that surface, instead of adhering to the circuit board 52 near the surface of the filter 20 and extending outward along that surface. This can prevent the adhesive 90 from overflowing into the image sensor 10 during the assembly of the filter 20 and causing contamination to the image sensor 10.

[0091] In some embodiments, the viscosity of the adhesive 90 can be greater than 15000 Cps, the thixotropic index can be greater than 4, the Young's modulus at room temperature can be in the range of 1000 MPa to 6000 MPa, and the coefficient of thermal expansion can be less than 60 ppm / k. In this case, the adhesive 90 has higher strength, thus better resisting external environmental stress and preventing deformation due to such stress. This allows the adhesive 90 to better maintain its height, thereby more stably supporting the filter 20 and preventing collisions between the filter 20 and the connecting line 30 that could cause the connecting line 30 to break. Furthermore, the higher strength of the adhesive 90 also better prevents the filter 20 from cracking due to deformation of the adhesive 90 itself.

[0092] In some embodiments, the micro-strain of the three-point bending fracture surface of the filter 20 can be greater than 4000µe. In this case, the filter 20 has higher strength, thus better resisting external environmental stress and preventing the filter 20 from deforming and cracking due to external environmental stress.

[0093] Figure 6 yes Figure 4 A magnified view of the camera module 100 at point C.

[0094] like Figure 6 As shown, the rear focus mechanism of the camera module 100 may include a lens safety distance L1, an anti-collision step height L2, a filter thickness L3, a connecting line safety distance L6, and a connecting line height L7. For example, the connecting line safety distance L6 can be 30 micrometers. The lens safety distance L1, the anti-collision step height L2, the filter thickness L3, and the connecting line height L7 can all be [equal to / inclusive of other parameters]. Figure 3 The camera module 300 shown is the same.

[0095] Understandably, compared to Figure 2The camera module 300 shown fixes the filter 320 to the fixing step 341 of the base 340. In this embodiment, the camera module 100 eliminates the fixing step 341. The filter 20 is assembled by applying adhesive 90 to the connecting line 30 and fixing it to the adhesive 90. In this case, the filter 20 can be completely decoupled from the base 40, effectively avoiding the risk of deformation or even breakage of the filter 20 due to environmental stress. This allows the filter 20 in this embodiment to resist deformation caused by environmental stress by only meeting a low three-point bending fracture surface micro-strain, thereby effectively reducing the manufacturing cost of the filter 20.

[0096] Secondly, by using adhesive 90 to replace the fixing step 341 in supporting the filter 20, the thickness of the adhesive layer L4 and the thickness of the fixing step L5 in the back focus of the camera module 100 can be effectively reduced. Meanwhile, compared to... Figure 3 The camera module 300 shown exposes the connecting wire 330 completely to the air. The connecting wire 330 can be bent and moved freely inside the camera module 300. In this embodiment, the adhesive 90 can wrap at least a portion of the connecting wire 30, including its highest point, thereby fixing the highest point of the connecting wire 30 and preventing it from colliding with other components inside the module due to bending and shaking, thus avoiding breakage. In other words, by wrapping at least a portion of the connecting wire 30 and its highest point with the adhesive 90, this embodiment better protects the connecting wire 30 and allows the safety distance L6 of the connecting wire in this embodiment to be much smaller than... Figure 3 The safety distance L6 between the connecting lines in the shown camera module 300 allows for a further reduction in the thickness of the camera module 100. That is, the camera module 100 in this embodiment is thinner than... Figure 3 The camera module 300 shown can effectively save adhesive layer thickness L4, fixed step thickness L5, and some connection line safety distance L6.

[0097] Thus, under the same camera performance parameters, the camera module 100 of this embodiment can effectively save the back focal length of the camera module 100 mechanism, which is beneficial to achieving a thinner design of the camera module 100. When the module height is the same, the camera module 100 of this embodiment can improve the image-taking performance by increasing the length of the solid portion of the lens 70. In other words, the camera module 100 of this embodiment can achieve a thinner design while improving image-taking performance by shortening the back focal length of the mechanism.

[0098] Among them, when the safety distance L6 of the connecting line is 30 micrometers, the lens safety distance L1, the height of the anti-collision step L2, the filter thickness L3, and the height of the connecting line L7 are all the same as those of the connecting line. Figure 3 When the camera module 300 shown is the same, the camera module 100 of this embodiment is different from the one shown. Figure 3 The camera module 300 shown can effectively save 300 micrometers of back focal length, thereby effectively reducing the overall module height by 200 micrometers and achieving a thinner design for the camera module 100. Alternatively, the camera module 100 of this embodiment can increase the length of the solid portion of the lens 70 by 300 micrometers, effectively improving the imaging performance of the camera module 100 without increasing its volume.

[0099] Please refer to it again. Figure 4 and Figure 5 The adhesive 90 may have an opening 92. The opening 92 may extend through the inner and outer peripheral sides of the adhesive 90. In this case, the inner space 91 of the adhesive 90 can be connected to the internal space 100a of the camera module 100 through the opening 92.

[0100] For example, the camera module 100 may also include a breathable membrane 110. The breathable membrane 110 may be fixed to the outer peripheral side of the adhesive 90 and cover the opening 92. In this case, the breathable membrane 110 may cooperate with the adhesive 90 to prevent dust from entering the inner space 91 of the adhesive 90.

[0101] For example, the breathable membrane 110 can be a silicone resin adhesive, such as a moisture-curing silicone resin adhesive. In this case, the breathable membrane 110 can be a breathable adhesive. For example, the breathable membrane 110 can have multiple pores inside. The pore size can be in the range of 0.5 micrometers to 10 micrometers. In this way, the pores can block liquid and solid molecules from passing through while allowing gaseous molecules to pass through. In other words, the breathable membrane 110 can be waterproof and breathable, with excellent breathability. The breathable membrane 110 can prevent dust from entering the inner space 91 of the adhesive 90 while allowing gas to flow between the inner space 91 of the adhesive 90 and the internal space 100a of the camera module 100. This ensures that the pressure in the inner space 91 of the adhesive 90 and the pressure in the internal space 100a of the camera module 100 are the same, meaning that the air pressure on the inner and outer sides of the filter 20 is the same. This effectively avoids the problem of the filter 20 deforming during the assembly of the camera module 100 due to process baking stress and the air pressure difference stress on the inner and outer sides of the filter 20, thus effectively reducing the risk of the filter 20 breaking.

[0102] In some embodiments, the breathable membrane 110 may also be other adhesives with waterproof and breathable properties. Alternatively, the breathable membrane 110 may also be other materials such as membranes or papers with waterproof and breathable properties.

[0103] In some embodiments, when the breathable membrane 110 is fixed to the outside of the opening 92, a portion of the breathable membrane 110 may also fill the opening 92 of the adhesive 90.

[0104] In some other embodiments, the number of adhesives 90 may also be multiple. Multiple adhesives 90 may be spaced apart and fixed to the circuit board 52, and arranged around the mounting hole 521. The edge portion 21 of the filter 20 may connect the surfaces of the multiple adhesives 90 away from the circuit board 52.

[0105] Please refer to it again. Figure 4 and Figure 5 The camera module 100 may further include a first dust-resistant adhesive 120 and a second dust-resistant adhesive 130. The first dust-resistant adhesive 120 may be located on the side of the filter 20 away from the adhesive 90 and fixed to the edge portion 21 of the filter 20. The second dust-resistant adhesive 130 may be fixed to the surface of the circuit board 52 near the lens 70 and surround the adhesive 90. Both the first dust-resistant adhesive 120 and the second dust-resistant adhesive 130 have dust-adhesive capabilities. Both the first dust-resistant adhesive 120 and the second dust-resistant adhesive 130 may be epoxy resin-based adhesives. In some embodiments, the first dust-resistant adhesive 120 and the second dust-resistant adhesive 130 may also be other adhesives with dust-adhesive capabilities.

[0106] It is understandable that in some embodiments, there is a gap between the lens 70 and the motor 60 of the camera module 100, which allows some dirt to enter the interior of the camera module 100 through the gap and fall onto the filtering portion 22 of the filter 20, resulting in a black shadow in the image. In this embodiment, the camera module 100 uses a first dustproof adhesive 120 on the edge portion 21 of the filter 20 and a second dustproof adhesive 130 around the adhesive 90 to adhere dirt that has entered the camera module 100, preventing it from falling onto the filtering portion 22 of the filter 20 or the imaging area 12 of the image sensor 10. This reduces the risk of black shadows in the image and effectively improves the photographic performance of the camera module 100. Simultaneously, the adhesive 90 also provides some barrier to prevent dirt from entering the inner space 91 of the adhesive 90.

[0107] In some implementations, the camera module 100 may be provided with only the first dustproof adhesive 120 or only the second dustproof adhesive 130.

[0108] In some embodiments, the camera module 100 may further include a third dustproof adhesive (not shown). The third dustproof adhesive may be disposed around the periphery of the filter 20 and the periphery of the adhesive 90. The third dustproof adhesive may connect the first dustproof adhesive 120 and the second dustproof adhesive 130.

[0109] Figure 7 yes Figure 4 A schematic diagram of the assembly process of the filter 20 of the camera module 100 shown. Figure 8 yes Figure 7 The diagram shows a partial process of the assembly method. Figure 9 yes Figure 7 The diagram shows a partial process of the assembly method.

[0110] For example, the filter 20 can be assembled using a mounting tool (see [link]). Figure 8 and Figure 9 The mounting tool 140 may include a mounting portion 141 and a support portion 142. The mounting portion 141 may have a mounting surface 1411. The center of the mounting surface 1411 may be recessed inward to form a mounting cavity 1412. The mounting portion 141 may also be provided with a first channel 1413. The first channel 1413 may communicate with the mounting cavity 1412.

[0111] For example, the support portion 142 may be fixedly protruding from the periphery of the mounting surface 1411 of the mounting portion 141. The support portion 142 has a certain height. For example, the height of the support portion 142 of the mounting tool 140 may be equal to the sum of the thickness of the filter 20 of the camera module 100 and the height of the adhesive 90.

[0112] By way of example, the support portion 142 of the mounting tool 140 may also be provided with a light-transmitting portion (not shown). It should be understood that Figure 8 and Figure 9 Only a partial structural cross-sectional view of the mounting tool 140 is shown.

[0113] At this time, the assembly process of the filter 20 of the camera module 100 may include, for example: Figure 7 Steps S10 to S40 are shown below:

[0114] S10: Fix the filter 20 to the mounting part 141 of the mounting tool 140.

[0115] S20: Place the support 142 of the mounting tool 140 on the surface of the circuit board 52 so that the filter 20 contacts the surface of the uncured adhesive 90.

[0116] S30: Cured adhesive 90.

[0117] S40: Remove mounting tool 140.

[0118] When assembling the filter 20 using the mounting tool 140, the filter 20 can be placed on the mounting surface 1411. At this time, the mounting tool 140 can evacuate the mounting cavity 1412 through the first channel 1413, so that the filter 20 can be fixed to the mounting surface 1411 of the mounting tool 140. Then, the support portion 142 of the mounting tool 140 is placed on the surface of the circuit board 52, so that the edge portion 21 of the filter 20 can contact the adhesive 90. Finally, the adhesive 90 is cured. After the adhesive 90 has cured, the mounting tool 140 is removed, and the assembly of the filter 20 is completed.

[0119] The adhesive 90 can be a UV-curable adhesive. Thus, the adhesive 90 can be cured by irradiating it with ultraviolet light. The adhesive 90 cures relatively quickly, which helps to maintain its height.

[0120] For example, the light-transmitting portion of the support portion 142 can be a perforated structure. In this case, ultraviolet light can pass through the light-transmitting portion into the inner side of the mounting tool 140 and irradiate the adhesive 90 to cure the adhesive 90. In other embodiments, the light-transmitting portion of the support portion 142 can also be a solid structure with light transmittance. In this case, ultraviolet light can pass through the light-transmitting portion to irradiate the adhesive 90 to cure the adhesive 90.

[0121] In some other embodiments, the adhesive 90 may also be made of other materials and cured by static curing, heat curing or other methods.

[0122] It is understood that the height of the support portion 142 of the mounting tool 140 in this embodiment is equal to the sum of the thickness of the filter 20 of the camera module 100 and the height of the adhesive 90. This allows the mounting tool 140 to ensure that the filter 20 is assembled at a certain height from the surface of the circuit board 52 during the assisted assembly process. This avoids the filter 20 collapsing the adhesive 90 during assembly and colliding with the connecting wire 30, which could lead to the breakage of the connecting wire 30. This is beneficial to improving the assembly yield of the camera module 100. In this way, by using the mounting tool 140 to assemble the filter 20 at a fixed height, the probability of the filter 20 colliding with the connecting wire 30 can be greatly reduced, so that the safety distance L6 of the connecting wire only needs to meet a small size to ensure the safety of the filter 20. In other words, the safety distance L6 of the connecting lines required to assemble the filter 20 using the assembly method of this embodiment can be much smaller than the safety distance L6 required to assemble the filter 20 using conventional methods, which is beneficial for achieving a thinner design of the camera module 100. Specifically, in this embodiment, by assembling the filter 20 using the mounting tool 140, the safety distance of the connecting lines can be reduced to 30 micrometers. Compared to... Figure 3 The camera module 300 shown in this embodiment has a connection safety distance that is effectively reduced by 70 micrometers.

[0123] Secondly, compared to curing the adhesive 90 before assembling the filter 20, this embodiment cures the adhesive 90 after assembling the filter 20. This allows the adhesive 90 to better control its height using the mounting tool 140, thereby accurately achieving the designed height of the adhesive 90 and precisely controlling the safe distance (i.e., the safe distance L6 between the filter 20 and the highest point of the connecting line 30). This helps to ensure the assembly accuracy of the camera module 100 and improve the yield of the camera module 100.

[0124] In some embodiments, the adhesive 90 may have an opening 92. After step S30 or step S40, a breathable membrane 110 may be applied to the opening 92 of the adhesive 90. The breathable membrane 110 may be cured by standing.

[0125] In some embodiments, the mounting portion 141 of the mounting tool 140 may not have the first channel 1413. The mounting tool 140 may also use other methods to adsorb or fix the filter 20.

[0126] Figure 10 yes Figure 4 A cross-sectional view of the camera module 100 shown in another embodiment. Figure 11 yes Figure 10The camera module 100 shown is a cross-sectional view from another perspective.

[0127] like Figure 10 and Figure 11 As shown, the structure of the camera module 100 in this embodiment is similar to... Figure 4 The camera modules 100 shown have roughly the same structure. The following mainly describes the differences between the two, and the similarities will not be repeated.

[0128] In this embodiment, the circuit board 52 may not have mounting holes 521. The image sensor 10 can be fixed to the surface of the circuit board 52 away from the reinforcing plate 51. This eliminates the need for additional drilling operations on the circuit board 52, simplifying the manufacturing process and reducing costs.

[0129] Exemplarily, the adhesive 90 can be fixed to the surface of the image sensor 10 away from the circuit board 52 and located at the edge region 11 of the image sensor 10. In this case, the adhesive 90 can wrap at least a portion of each connecting wire 30. For example, the adhesive 90 can cover the first end 31 of each connecting wire 30. The projected area of ​​the adhesive 90 on the first plane and the area enclosed by the projection can be similar to the projected area of ​​the image sensor 10 on the first plane.

[0130] For example, the edge portion 21 of the filter 20 can be fixed to the surface of the adhesive 90 away from the image sensor 10. In this case, the projected area of ​​the filter 20 on the first plane can be approximately the area enclosed by the projection of the adhesive 90 onto the first plane; that is, the projected area of ​​the filter 20 on the first plane can be approximately the same as the projected area of ​​the image sensor 10 on the first plane. The filtering portion 22 of the filter 20 can be positioned facing the imaging area 12 of the image sensor 10. The edge portion 21 of the filter 20 can be spaced apart from the edge area 11 of the image sensor 10.

[0131] Understandably, compared to the camera module 100 where the adhesive 90 is fixed to the surface of the circuit board 52, in this embodiment, the adhesive 90 of the camera module 100 is fixed to the surface of the image sensor 10, allowing the filter 20 to be indirectly fixed to the image sensor 10 via the adhesive 90. In this way, the projected area of ​​the filter 20 on the first plane can be similar to the projected area of ​​the image sensor 10 on the first plane, thereby effectively reducing the volume of the filter 20 and the space it occupies on the first plane, which is beneficial for achieving a miniaturized camera module 100.

[0132] Secondly, in this embodiment, the image sensor 10 is fixed to the surface of the circuit board 52, so that the highest point of the connecting line 30 can be close to the image sensor 10. In this way, when the adhesive 90 is fixed to the surface of the image sensor 10, the adhesive 90 can wrap at least part of the connecting line 30 and the highest point of the connecting line 30, thereby better protecting the connecting line 30 and preventing the highest point of the connecting line 30 from colliding with the filter 20 or other internal components of the camera module 100, which would cause damage to the connecting line 30.

[0133] For example, the height difference in the Z-axis direction between the surface of the image sensor 10 near the filter 20 and the highest point of the connecting line 30 is the second distance D2. The height of the adhesive 90 can be greater than the second distance D2. In this way, on the one hand, the adhesive 90 can better wrap the connecting line 30 to protect it and prevent it from breaking. On the other hand, the height of the adhesive 90 is greater than the second distance D2, thereby avoiding the problem of the filter 20 colliding with the connecting line 30 during the assembly of the filter 20, which could damage the connecting line 30. For example, the height of the adhesive 90 can also be equal to the sum of the connecting line safety distance L6 and the second distance D2. In this way, by limiting the height of the adhesive 90 to be equal to the sum of the safety distance L6 and the second distance D2 of the connecting line, a certain safety distance can be maintained between the highest point of the connecting line 30 and the surface of the filter 20 near the image sensor 10. This can effectively prevent the connecting line 30 from breaking due to collision between the filter 20 and the connecting line 30 during installation, thereby effectively reducing the risk of damage to the connecting line 30 and improving the yield of the camera module 100.

[0134] For example, the second dustproof adhesive 130 can be fixed to the circuit board 52 and disposed around the image sensor 10. For instance, the second dustproof adhesive 130 can cover the second end 32 of each connecting wire 30. In this way, the second dustproof adhesive 130 and the connecting wires 30 can reuse the space on the surface of the circuit board 52, which is beneficial to improving the space utilization of the camera module 100.

[0135] For example, the surface of the first dustproof adhesive 120 away from the filter 20 can be lower than the anti-collision step surface 42 of the base 40. In this way, it can be avoided that the lens 70 will collide with the first dustproof adhesive 120 or even with the filter 20 when it moves downward, which would cause the filter 20 to break.

[0136] In some other embodiments, the circuit board 52 may also have holes. In this case, the image sensor 10 can be placed inside the holes. The height of the adhesive 90 can be greater than the sum of the safety distance L6 of the connecting line and the first distance D1, and can also be greater than the sum of the safety distance L6 of the connecting line and the second distance D2, so that the filter 20 and the connecting line 30 will not interfere with each other, and collision between the filter 20 and the connecting line 30 is avoided.

[0137] Figure 12 yes Figure 4 The camera module 100 shown is a cross-sectional view in another embodiment.

[0138] like Figure 12 As shown, the structure of the camera module 100 in this embodiment is similar to... Figure 4 The structure of the camera module 100 shown is largely the same, and the identical parts will not be described again. The difference is that the camera module 100 in this embodiment may not include the base 40. The motor 60 can be fixed to the surface of the circuit board 52 away from the reinforcing plate 51 by means of bonding or other methods. For example, the part of the motor 60 near the electronic component 53 can be recessed inward to form a relief groove 62 to avoid the electronic component 53.

[0139] It is understandable that the camera module 100 in this embodiment eliminates the base 40, making the overall structure of the camera module 100 simpler and facilitating a thinner design. At the same time, eliminating the base 40 also simplifies the assembly process of the camera module 100, thereby improving its assembly efficiency.

[0140] In other embodiments, the structural design of the camera module 100 can also be consistent with... Figure 10 The structural scheme of the camera module 100 shown is combined. For example, the circuit board 52 in this embodiment may not have mounting holes 521. The image sensor 10 can be directly fixed to the surface of the circuit board 52 away from the reinforcing plate 51.

[0141] Figure 13 yes Figure 12 The camera module 100 shown is a cross-sectional view in another embodiment.

[0142] like Figure 13As shown, the adhesive 90 may include a first portion 93 and a second portion 94. The first portion 93 of the adhesive 90 can be connected to the filter 20. The filter 20 can cover the first portion 93 of the adhesive 90 in the Z-axis direction. The second portion 94 of the adhesive 90 can be connected to the first portion 93. The second portion 94 can cover at least a portion of the surface of the electronic component 53 in the Z-axis direction. At this time, the portion of the second portion 94 of the adhesive 90 covering the surface of the circuit board 52 increases. It is understood that, on the one hand, the second portion 94 of the adhesive 90 can be used to protect the electronic component 53 from damage caused by contamination. On the other hand, the second portion 94 of the adhesive 90 can also structurally reinforce the circuit board 52, thereby effectively increasing the strength of the circuit board 52, improving the resistance to deformation of the circuit board 52, reducing the risk of breakage of the circuit board 52, thereby effectively improving the overall structural stability of the camera module 100 and extending the service life of the camera module 100. It should be understood that... Figure 13 The first part 93 and the second part 94 of the adhesive 90 are schematically divided by dashed lines.

[0143] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments described in this application can be combined with each other, and any combination of features in different embodiments is also within the protection scope of this application. That is to say, the multiple embodiments described above can also be arbitrarily combined according to actual needs.

[0144] It should be noted that all the above figures are exemplary illustrations of this application and do not represent the actual size of the product. Furthermore, the dimensional proportions between the components in the figures are not intended to limit the actual product of this application.

[0145] The above are merely some embodiments of this application, and the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A camera module (100), characterized in that, The device includes a circuit assembly (50), a motor (60), a lens (70), an image sensor (10), an adhesive (90), and a filter (20). The motor (60) is fixed to the circuit assembly (50), the lens (70) is mounted on the motor (60), and the image sensor (10) is fixed and electrically connected to the circuit assembly (50). A first surface (10a) of the image sensor (10) faces the lens (70). The first surface (10a) includes an imaging area (12) and an edge area (11) surrounding the imaging area (12). The adhesive (90) is fixed to the circuit assembly (50) and surrounds the image sensor (10). Alternatively, the adhesive (90) is fixed to the edge area (11) of the first surface (10a), and the filter (20) is fixed to the surface of the adhesive (90) away from the circuit assembly (50). The adhesive (90) has a viscosity greater than 10000 Cps, a thixotropic index greater than 2, a room temperature Young's modulus in the range of 1000 MPa to 10000 MPa, and a coefficient of thermal expansion less than 80 ppm / k. The adhesive (90), the filter (20) and the image sensor (10) together enclose the inner space (91) of the adhesive (90), or the adhesive (90), the filter (20) and the circuit assembly (50) together enclose the inner space (91) of the adhesive (90). The adhesive (90) has an opening (92) that extends through the inner and outer peripheral sides of the adhesive (90). The camera module (100) also includes a breathable membrane (110) that is fixed to the adhesive (90) and covers the opening (92). The breathable membrane (110) works in conjunction with the adhesive (90) to prevent dust from entering the inner space (91) of the adhesive (90), while the breathable membrane (110) allows gas to pass through.

2. The camera module (100) according to claim 1, characterized in that, The camera module (100) also includes a connecting line (30) that connects the image sensor (10) and the circuit assembly (50). The adhesive (90) wraps at least a portion of the connecting line (30). A gap is formed between the filter (20) and the highest point of the connecting line (30). The highest point of the connecting line (30) is the point on the connecting line (30) that is closest to the lens (70) in a first direction, which is parallel to the optical axis of the lens (70).

3. The camera module (100) according to claim 2, characterized in that, The dimension of the highest point of the filter (20) and the connecting line (30) in the first direction is the connecting line safety distance (L6), which is greater than or equal to 30 micrometers.

4. The camera module (100) according to claim 2, characterized in that, The adhesive (90) wraps around the highest point of the connecting line (30).

5. The camera module (100) according to claim 2, characterized in that, The adhesive (90) has a size in the first direction ranging from 50 micrometers to 400 micrometers.

6. The camera module (100) according to claim 3, characterized in that, The circuit assembly (50) includes a circuit board (52) and a reinforcing plate (51). The motor (60) is fixed to the circuit board (52), and the reinforcing plate (51) is fixed to the surface of the circuit board (52) away from the motor (60). The circuit board (52) has a mounting hole (521) that exposes at least a portion of the reinforcing plate (51). The image sensor (10) is fixed to the reinforcing plate (51) and is at least partially located within the mounting hole (521). The adhesive (90) is fixed to the surface of the circuit board (52) away from the reinforcing plate (51). The distance between the surface of the circuit board (52) away from the reinforcing plate (51) and the highest point of the connecting line (30) in the first direction is a first distance (D1), and the distance of the adhesive (90) in the first direction is equal to the sum of the safety distance (L6) of the connecting line and the first distance (D1).

7. The camera module (100) according to claim 3, characterized in that, The circuit assembly (50) includes a circuit board (52), the motor (60) is fixed to the circuit board (52), the image sensor (10) is fixed to the surface of the circuit board (52) near the lens (70), and the adhesive (90) is fixed to the image sensor (10). The dimension of the surface of the image sensor (10) away from the circuit board (52) and the highest point of the connecting line (30) in the first direction is a second distance (D2), and the dimension of the adhesive (90) in the first direction is equal to the sum of the safety distance (L6) of the connecting line and the second distance (D2).

8. The camera module (100) according to any one of claims 1 to 7, characterized in that, The adhesive (90) is a UV-curable adhesive.

9. The camera module (100) according to any one of claims 1 to 7, characterized in that, The micro-strain on the three-point bending fracture surface of the filter (20) is greater than 2000u.

10. The camera module (100) according to any one of claims 1 to 7, characterized in that, The filter (20) includes an edge portion (21) and a filter portion (22). The edge portion (21) is disposed around the filter portion (22). The edge portion (21) is fixedly connected to the adhesive (90). The filter portion (22) faces the image sensor (10). The camera module (100) also includes a first dustproof adhesive (120), which is located on the side of the filter (20) away from the adhesive (90) and fixed to the edge portion (21). The first dustproof adhesive (120) is used to adsorb dust.

11. The camera module (100) according to any one of claims 1 to 7, characterized in that, The camera module (100) also includes a second dustproof adhesive (130), which is fixed to the surface of the circuit assembly (50) near the lens (70) and is disposed around the adhesive (90).

12. The camera module (100) according to any one of claims 1 to 7, characterized in that, The camera module (100) also includes a base (40) fixed to the circuit assembly (50), and a motor (60) fixed to the surface of the base (40) away from the circuit assembly (50). A portion of the base (40) near the lens (70) forms an anti-collision step surface (42), which is located between the lens (70) and the filter (20).

13. The camera module (100) according to any one of claims 1 to 7, characterized in that, The adhesive (90) includes a first part (93) and a second part (94), the first part (93) being connected between the filter (20) and the circuit assembly (50), the second part (94) being connected to the first part (93) and the circuit assembly (50), and the second part (94) being used to reinforce the circuit assembly (50).

14. An electronic device, characterized in that, The system includes an image processor and a camera module (100) according to any one of claims 1 to 13, wherein the image processor is communicatively connected to the camera module (100), and the image processor is used to acquire image data from the camera module (100) and process the image data.

Images