LED display module manufacturing method and LED display module thereof

Abstract

This application relates to a method for manufacturing an LED display module and the LED display module thereof, comprising: coating a substrate structure with pads with black ink, wherein the thickness of the black ink is greater than the thickness of the pads; removing the coating on the pads, forming a pit between the black ink and the pads; placing solder paste in the pits; placing a device structure on the pads, connecting the device structure and the pads through solder paste; aligning a mold with the substrate structure, filling the cavity formed between the mold and the substrate structure with adhesive, and then curing the adhesive and solder paste; removing the mold to obtain the LED display module. In this invention, before placing the device structure on the pads, black ink is first coated on the substrate structure, achieving the effect of blackening the area outside the pads, eliminating the consistency and adhesive creep problems caused by using black adhesive for underfilling, and not affecting the light output of the device structure.

Description

Technical Field

[0001] This application relates to the field of LED display modules, and in particular to a method for manufacturing an LED display module and the LED display module thereof. Background Technology

[0002] As is well known, LED devices have advantages such as high brightness, high contrast, high color gamut, long life, strong impact resistance, and high reliability, and are widely used in high-definition display fields such as high-end rental, vehicle display, live cinema broadcasting, and virtual shooting.

[0003] With the continuous development of the LED display market, people's requirements for LED displays are becoming increasingly stringent. Especially for small-pitch module panels, the display effect requirements are high. High color gamut, high contrast, and low color difference of LED products have become the pursuit of the market and industry. Among different small-pitch packaging paths, MIP packaging is gradually being promoted. However, currently, during the manufacturing of MIP modules, a layer of black glue is filled around the MIP device to cover the color difference between the MIP device and the substrate and pads. But when filling the black glue, due to the fluidity, surface tension, and siphon effect of the black glue, uneven filling of the black glue and glue creep (black glue flowing to the surface of the MIP device) can occur. As a result, it will affect the light output of the MIP device. Summary of the Invention

[0004] This application provides a method for manufacturing an LED display module and the LED display module thereof, which can solve the problems of uneven filling and glue creep caused by filling black glue with black glue in order to solve the color difference between MIP devices and substrates and pads in related technologies.

[0005] In a first aspect, embodiments of this application provide a method for manufacturing an LED display module, comprising:

[0006] Black ink is applied to a substrate structure with pads, and the thickness of the black ink is greater than the thickness of the pads.

[0007] Remove the coating from the pads to create pits between the black ink and the pads;

[0008] Apply solder paste into the recess;

[0009] Place the device structure on the pads and connect the device structure and the pads with solder paste;

[0010] The mold and the substrate structure are aligned and set up so that the colloid fills the cavity formed between the mold and the substrate structure, and then the colloid and solder paste are cured.

[0011] Remove the mold to obtain the LED display module.

[0012] In some embodiments, the substrate structure includes: a substrate body, a conductive metal, and a film layer, wherein the conductive metal is disposed on the surface of the substrate body, and the film layer is disposed on the surface of the conductive metal;

[0013] Before applying black ink to the substrate structure with pads, the method further includes the step of fabricating pads on the substrate structure:

[0014] A film layer is applied at the location of the pads on the conductive metal.

[0015] Remove the conductive metal outside the film layer coverage so that the conductive metal at the film layer coverage area forms a pad.

[0016] In some embodiments, black ink is coated onto a substrate structure with pads, specifically including the following steps:

[0017] Use a masking element to cover the solder pads;

[0018] Black ink is coated onto the substrate.

[0019] In some embodiments, removing the coating on the pads specifically includes removing the film layer on the surface of the pads.

[0020] In some embodiments, black ink is coated onto a substrate structure having pads, specifically by coating the substrate body and the pads with black ink.

[0021] In some embodiments, removing the coating from the pads specifically includes:

[0022] Remove the black ink from the surface of the solder pads;

[0023] Remove the film layer from the surface of the solder pads.

[0024] In some embodiments, the mold and substrate structure are aligned and set so that the colloid fills the cavity formed between the mold and the substrate structure before curing the colloid and solder paste. Specific steps include:

[0025] The mold is filled with colloid;

[0026] The mold and the substrate structure are aligned and set so that the colloid is placed in the cavity between the mold and the substrate structure.

[0027] The colloid is cured at the first temperature.

[0028] The solder paste is cured by heating from the first temperature to the second temperature.

[0029] In some embodiments, the colloid comprises a black base filler adhesive and a transparent encapsulating colloid;

[0030] The mold and substrate structure are aligned and set up so that the colloid fills the cavity formed between the mold and the substrate structure, and the colloid and solder paste are cured. The specific steps include:

[0031] The mold and the substrate structure are aligned and set so that a cavity is formed between the mold and the substrate structure;

[0032] Inject black base filler into the cavity, ensuring the injection height of the black base filler is lower than the height of the device structure;

[0033] Use the first temperature to cure the black base filler adhesive;

[0034] The solder paste is cured by heating from the first temperature to the second temperature.

[0035] A transparent encapsulating colloid is injected into the cavity and then cured.

[0036] In some embodiments, the mold has flow channels for the flow of the colloid.

[0037] Secondly, embodiments of this application provide an LED display module, which includes: a substrate body, pads, black ink, solder paste, and device structure. The pads are disposed on the substrate body; the black ink is coated on the surface of the substrate body, and the thickness of the black ink is greater than the thickness of the pads, forming a pit between the black ink and the pads; the solder paste is disposed in the pits; and the device structure is disposed on the pads and connected to the pads through the solder paste.

[0038] The beneficial effects of the technical solutions provided in this application include:

[0039] This application provides an LED display module manufacturing method and an LED display module thereof. Before placing the device structure on the pads, black ink is first coated on the substrate structure to achieve the effect of blackening the area outside the pads. This eliminates the consistency and glue creep problems caused by using black glue for underfilling and does not affect the light output of the device structure. Attached Figure Description

[0040] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0041] Figure 1 This is a schematic diagram of the MIP module board structure provided in the embodiments of this application;

[0042] Figure 2 This is a schematic diagram of an LED display module provided in an embodiment of this application;

[0043] Figure 3 A top view of the substrate structure provided in an embodiment of this application;

[0044] Figure 4 A side view of the substrate structure provided in an embodiment of this application;

[0045] Figure 5 This is a side view of the conductive metal front substrate structure without removing the film covering, provided in an embodiment of this application.

[0046] Figure 6 Top view of the substrate structure provided in the embodiments of this application after being coated with black ink;

[0047] Figure 7 A side view of the substrate structure provided in the embodiments of this application after being coated with black ink;

[0048] Figure 8 A top view of the pit structure formed between the black ink and the pad provided in the embodiments of this application;

[0049] Figure 9 A side view of the recessed structure formed between the black ink and the pad provided in the embodiments of this application;

[0050] Figure 10 This is a top view of the solder paste being applied in the recess according to an embodiment of this application.

[0051] Figure 11 This is a side view of solder paste being applied in a recess, as provided in an embodiment of this application.

[0052] Figure 12 A rear top view showing the device structure placed on the pads, provided for an embodiment of this application;

[0053] Figure 13 The rear view of the device structure placed on the pads provided in the embodiments of this application;

[0054] Figure 14 A side view of the mold provided for an embodiment of this application;

[0055] Figure 15 A schematic diagram of the alignment of the mold and substrate structure provided in the embodiments of this application (glue injection method one);

[0056] Figure 16 A schematic diagram of the mold and substrate structure after alignment and setting, provided in the embodiments of this application (insertion method one);

[0057] Figure 17 Curing curves of colloid and solder paste provided for embodiments of this application;

[0058] Figure 18A schematic diagram of the alignment of the mold and substrate structure provided in the embodiments of this application (method 2 of glue injection);

[0059] Figure 19 This is a schematic diagram showing the injection of primer adhesive according to an embodiment of this application;

[0060] Figure 20 This is a schematic diagram of the injection of transparent encapsulating colloid provided in an embodiment of this application.

[0061] In the figure: 1. Substrate structure; 10. Substrate body; 11. Conductive metal; 12. Film layer; 2. Black ink; 3. Solder pad; 4. Device structure; 40. Lead; 5. Glue; 50. Black base filler glue; 51. Transparent encapsulating glue; 6. Solder paste; 7. Mold; 8. Drain hole; 80. First hole; 81. Second hole. Detailed Implementation

[0062] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present application.

[0063] This application provides an LED display module manufacturing method and an LED display module thereof, which can solve the problems of uneven filling and glue creep caused by filling black glue with black glue to solve the color difference between MIP devices and substrates and pads in related technologies.

[0064] In a first aspect, embodiments of this application provide a method for manufacturing an LED display module, comprising:

[0065] 101: Apply black ink 2 to the substrate structure 1 having pads 3, and make the thickness of the black ink 2 greater than the thickness of the pads 3.

[0066] 102: Remove the coating on pad 3 to create a pit between the black ink 2 and pad 3;

[0067] 103: Apply solder paste 6 to the recess;

[0068] 104: Place the device structure 4 on the pad 3, and connect the device structure 4 and the pad 3 through solder paste 6;

[0069] 105: Align the mold 7 with the substrate structure 1, and after the colloid 5 fills the cavity formed between the mold 7 and the substrate structure 1, cure the colloid 5 and the solder paste 6.

[0070] 106: Remove mold 7 to obtain the LED display module.

[0071] In this application, firstly, black ink 2 is coated onto the substrate structure 1 with pads 3, and the thickness of the black ink 2 is greater than the thickness of the pads 3. Then, the coating on the pads 3 is removed, forming a pit between the black ink 2 and the pads 3. Next, solder paste 6 is placed in the pit, and the device structure 4 is placed on the pads 3, so that the device structure 4 and the pads 3 are connected by the solder paste 6. Then, the mold 7 is aligned with the substrate structure 1, and the colloid 5 fills the cavity formed between the mold 7 and the substrate structure 1. After that, the colloid 5 and the solder paste 6 are cured, and finally the mold 7 is removed to obtain the LED display module. By coating the substrate structure 1 with black ink 2 before placing the device structure 4 on the pads 3, the area outside the pads 3 is blackened, which avoids the consistency problem and glue creep problem caused by using black glue for underfilling, and does not affect the light emission of the device structure 4.

[0072] It should be noted that the substrate structure 1 includes: a substrate body 10, a conductive metal 11, and a film layer 12. The conductive metal 11 is disposed on the surface of the substrate body 10, and the film layer 12 is disposed on the surface of the conductive metal 11. The substrate body 10 includes, but is not limited to, a PCB board, a glass substrate, etc. The substrate body 10 with circuits is disposed at the bottom layer, and a layer of conductive metal 11 is fixed on the surface of the substrate body 10.

[0073] Before coating the substrate structure 1 with solder pads 3 with black ink 2, the method further includes step 100: fabricating the solder pads 3 on the substrate structure 1. This step includes steps 1001 to 1002:

[0074] Step 1001: Apply a film layer 12 at the location of the pad 3 on the conductive metal 11.

[0075] Specifically, the positions of the pads 3 are pre-defined on the surface of the conductive metal 11, and then a film layer 12 is printed on the surface of the conductive metal 11 by precision printing. In this embodiment, the film layer 12 is set as a protective dry film.

[0076] Step 1002: Remove the conductive metal 11 outside the film layer 12 so that the conductive metal 11 at the film layer 12 covers the pad 3.

[0077] Specifically, the conductive metal 11 outside the protective dry film is etched away by reagent etching, and the conductive metal 11 below the film layer 12 forms the pad 3. Therefore, the pad 3 is made of conductive metal 11, and a protective dry film is covered on the surface of the pad 3.

[0078] Based on the above embodiments, in this embodiment, when coating the substrate structure 1 with solder pads 3 with black ink 2, there are several possible methods:

[0079] In some possible embodiments, one particular approach includes steps 1011 to 1012:

[0080] Step 1011: Use a masking element to mask pad 3.

[0081] Specifically, the masking element is set to a metal mesh, and the metal mesh is used to cover the pad 3. The shape and size of the metal mesh are the same as those of the pad 3.

[0082] Step 1012: Coat the substrate body 10 with black ink 2.

[0083] Specifically, since the masking component has already covered the pad 3, the surface of the pad 3 is not coated with black ink 2 when black ink 2 is applied to the substrate body 10. It should be noted that the thickness of the black ink 2 applied to the substrate body 10 is greater than the thickness of the pad 3. Therefore, after the black ink 2 is applied to the substrate body 10, the horizontal plane at the top of the black ink 2 is above the horizontal plane at the top of the pad 3.

[0084] Black ink 2 can be formed on the substrate body 10 by molding, encapsulation, deposition or coating.

[0085] Therefore, step 102: removing the coating on the pad 3 specifically includes: removing the film layer 12 on the surface of the pad 3.

[0086] Specifically, since the surface of pad 3 is not coated with black ink 2, only a protective dry film covers the surface of pad 3. Therefore, it is only necessary to remove the protective dry film from the surface of pad 3. After removing the exposed protective dry film with a solvent, the desired result is obtained. Figure 9 The concave pad 3 structure refers to the pit formed between the black ink 2 and the pad 3, that is, the horizontal plane at the top of the pad 3 is below the horizontal plane at the top of the black ink 2.

[0087] In some other possible embodiments, one of the specific steps includes step 1011: coating the substrate body 10 and the pads 3 with black ink 2.

[0088] In this embodiment, black ink 2 is directly coated onto the substrate body 10 and the pads 3. The black ink 2 can be formed by molding, encapsulation, deposition, or coating. In this embodiment, deposition or coating is preferred because this method can form protrusions in the pad 3 area. It should be noted that the thickness of the black ink 2 needs to be greater than the thickness of the pads 3. Therefore, the horizontal plane of the top of the black ink 2 on the surface of the substrate body 10 is above the horizontal plane of the top of the pads 3.

[0089] Furthermore, in this embodiment, when applying black ink 2, the thickness H of the black ink 2 on the surface of the pad 3 (see...) Figure 7 (As shown) The thickness of the black ink 2 on the surface of the substrate body 10 is less than that of the substrate body 10, so as to facilitate the subsequent removal of the coating on the pads 3.

[0090] In this embodiment, removing the coating on the pad 3 specifically includes steps 1021 to 1022:

[0091] Step 1021: Remove the black ink 2 from the surface of pad 3.

[0092] Specifically, since the surface of the pad 3 is also coated with black ink 2, it is necessary to first remove the black ink 2 from the surface of the pad 3. The black ink 2 on the protruding pad 3 is polished clean by means of laser, physical or other methods to expose the protective dry film.

[0093] Step 1022: Remove the film layer 12 on the surface of pad 3.

[0094] Specifically, after removing the exposed protective dry film with a solvent, the desired product is obtained. Figure 9 The concave pad 3 structure refers to the pit formed between the black ink 2 and the pad 3, that is, the horizontal plane at the top of the pad 3 is below the horizontal plane at the top of the black ink 2.

[0095] The above embodiments are merely various possible implementations of the embodiments of this application, and the embodiments of this application are not limited thereto.

[0096] Based on the above embodiments, in this embodiment, in step 103: setting solder paste 6 in the recess, specifically:

[0097] See Figure 11 As shown, solder paste 6 is transferred into the recess formed between the black ink 2 and the pad 3. The transfer method can be stencil printing, dotting, inkjet printing, etc. Due to the presence of the recess, the solder paste 6 will not deviate beyond the pad 3. By selecting a solder paste 6 with an appropriate viscosity, a full surface of the transferred solder paste 6 can be achieved.

[0098] Because of the fluidity of solder paste 6, it eventually flows into the recesses. Simultaneously, the recesses formed between the black ink 2 and the pads 3 have a certain depth. Therefore, deviations are permissible during solder paste 6 transfer. When the solder paste 6 melts, it also flows into the recesses, ensuring a high soldering yield. The presence of these recesses also prevents solder paste 6 from overflowing during the subsequent pressing of the mold 7 with the substrate body 10, improving the feasibility of the pressing, encapsulation, and curing process.

[0099] Next, proceed to step 104: Place device structure 4 on pad 3, connecting device structure 4 and pad 3 via solder paste 6. Specifically:

[0100] The device structure 4 is transferred onto the pad 3 with solder paste 6. In this embodiment, the device structure 4 is set as a MIP device, and the pins 40 of the MIP device are attached to the solder paste 6 on the pad 3.

[0101] In the conventional approach, after placing the device structure 4 on the pad 3, the black ink 2 does not completely cover the substrate body 10 and the pad 3. (See [reference needed]). Figure 12 After the MIP device is transferred, the substrate body 10 and pads 3 will be exposed around the MIP device. The color of the exposed substrate body 10 and pads 3 is different from the black ink 2 and the MIP device, resulting in a noticeable color difference in appearance.

[0102] Therefore, the traditional solution involves underfilling, which involves applying a layer of black adhesive around the MIP device to mask the aforementioned color difference. However, during the application of black adhesive, due to the adhesive's fluidity, surface tension, and siphon effect, uneven application and adhesive creep can occur. Adhesive creep refers to the black adhesive flowing onto the surface of the MIP device, which can affect the light emission of the MIP device.

[0103] In this application, no bottom filling operation is required, thus eliminating the consistency and glue creep problems caused by the bottom filling operation.

[0104] The black ink 2 in this application is equivalent to the black glue used in the underfill operation in the conventional solution. The black ink 2 covers the substrate body 10 before the MIP device is transferred, which has the effect of blackening the area outside the pad 3, and does not affect the light output of the MIP device.

[0105] Based on the above embodiments, in this embodiment, step 105: aligning the mold 7 with the substrate structure 1, and then curing the colloid 5 and solder paste 6 after filling the cavity formed between the mold 7 and the substrate structure 1, also has multiple implementation methods:

[0106] In some possible embodiments, one embodiment specifically includes the following steps: steps 1051 to 1054:

[0107] Step 1051: Fill the mold 7 with colloid 5.

[0108] For details, see Figure 14 As shown, the mold 7 is filled with colloid 5, which is a semi-cured adhesive. Furthermore, a flow guide hole 8 for the flow of colloid 5 is provided on the mold 7. In this embodiment, the flow guide hole 8 is located on the side wall of the mold 7 near the opening. In other embodiments, the flow guide hole 8 can also be located at the top of the mold 7. The size of the mold 7 is set to match the size of the substrate body 10.

[0109] Step 1052: Align the mold 7 with the substrate structure 1 so that the colloid 5 is placed in the cavity between the mold 7 and the substrate structure 1.

[0110] For details, see Figure 15 and Figure 16 As shown, the mold 7 is pressed onto the substrate body 10 on which the MIP device is transferred. The purpose of setting the flow guide hole 8 is that after the mold 7 is aligned with the substrate structure 1, the excess semi-cured adhesive in the mold 7 can flow out from the flow guide hole 8, ensuring that the adhesive 5 in the cavity is fully filled.

[0111] Step 1053: Cure colloid 5 using the first temperature.

[0112] Specifically, to ensure the reliability of the connection between pad 3 and pin 40 of device structure 4, such as Figure 17 As shown, a method can be used where the curing point of the prepreg is lower than the melting point of solder paste 6. The prepreg is first cured at a lower temperature, and then the temperature is increased to cure solder paste 6. Therefore, the first temperature is used to cure colloid 5. Generally, prepregs have a one-time curing property; that is, once colloid 5 has reached the curing temperature, further temperature increases will not affect the curing effect of colloid 5.

[0113] Step 1054: Increase the temperature from the first temperature to the second temperature to cure the solder paste 6.

[0114] Specifically, after the colloid 5 has cured, the temperature is raised from the first temperature to a second temperature to cure the solder paste 6, with the second temperature being higher than the first temperature. This process first allows the colloid 5 to cure and fix the position of the MIP devices, so that the subsequent melting and curing of the solder paste 6 will not cause the MIP devices to shift. Since semi-cured colloids generally have a one-time curing property, meaning that once the curing temperature is reached and the colloid 5 is cured, further temperature increases will not affect the curing effect of the colloid 5. Therefore, allowing the semi-cured colloid to cure and set first prevents the MIP devices from shifting or becoming loose during the subsequent melting and curing of the solder paste 6. Furthermore, using the method of melting the solder paste with the colloid 5 allows for heating in a regular air furnace, eliminating the need to fill the furnace with inert gases such as nitrogen, thus reducing costs.

[0115] In this application, the solder paste 6 and the encapsulating colloid 5 are cured sequentially and formed in one step, so that the device structure 4 and the pad 3 are soldered without lifting, thereby achieving the flatness of the MIP module encapsulation surface and the uniformity of light emission.

[0116] In some other possible embodiments, the colloid 5 includes a black base filler 50 and a transparent encapsulating colloid 511;

[0117] One embodiment specifically includes the following steps: steps 1051 to 1055:

[0118] Step 1051: Align the mold 7 with the substrate structure 1 to form a cavity between the mold 7 and the substrate structure 1.

[0119] Specifically, it should be noted that the dimensions of the mold 7 are matched with the dimensions of the substrate body 10. The mold 7 is pressed onto the substrate body 10 on which the MIP device has been transferred. A cavity is formed between the mold 7 and the substrate structure 1, into which transparent encapsulating colloid 511 and black base filler 50 can be injected. Furthermore, a flow guide hole 8 for the flow of colloid 5 is provided on the mold 7. In this embodiment, the flow guide hole 8 includes a first hole 80 and a second hole 81. The first hole 80 is located on the side wall of the mold 7 near the opening, and the second hole 81 is located on the side wall of the mold 7 away from the opening.

[0120] Step 1052: Inject black base filler 50 into the cavity, and make the injection height of black base filler 50 lower than the height of device structure 4.

[0121] Specifically, black base filler glue 50 is injected into the cavity through the first hole 80. The black base filler glue 50 is preferably highly fluid, which is conducive to the injection of glue.

[0122] After injecting 50g of black base filler glue, as shown Figure 19 As shown, the height of the injected black base filler 50 needs to be lower than the second hole 81 of the mold 7 and the upper surface of the device structure 4.

[0123] Step 1053: Cure the black base filler 50 using the first temperature.

[0124] Specifically, after injecting black base filler 50, heat it to the first temperature to harden it. The hardening curve of black base filler 50 is similar to... Figure 17 Similarly, the curing temperature of the black base filler 50 is lower than that of the solder paste 6. To maintain the smoothness of the hardened surface of the black base filler 50, pressure is applied into the mold 7 through the second hole 81 during the heating and curing process. Thus, the black base filler 50 is injected into the first hole 80, and the pressure applied through the second hole 81 makes the black base filler 50 harden and become smooth.

[0125] Step 1054: Increase the temperature from the first temperature to the second temperature to cure the solder paste 6.

[0126] Specifically, after the black base filler adhesive 50 has cured, the first temperature is raised to the second temperature to cure the solder paste 6, with the second temperature being higher than the first temperature.

[0127] Step 1055: Inject transparent encapsulating colloid 51 into the cavity and cure it.

[0128] Specifically, after the black base filler adhesive 50 and solder paste 6 have completely cured, a layer of transparent encapsulating colloid 51 can be injected into the mold 7 through the second hole 81. This transparent encapsulating colloid 51 can protect the black base filler adhesive 50 and improve the light emission effect of the MIP LED beads in the device structure 4. This layer of transparent encapsulating colloid 51 can directly fill the cavity, and finally, the transparent encapsulating colloid 51 is hardened to obtain the finished module.

[0129] Based on the above embodiments, in this embodiment, step 106: remove mold 7 to obtain the LED display module, specifically:

[0130] After the colloid 5 and solder paste 6 have cured, the mold 7 is removed from the substrate body 10 to obtain the LED display module.

[0131] In summary, this application optimizes the process to ensure that each pad 3 is covered with black ink 2 around its perimeter, reducing the risk of solder bridging between pads 3 and improving the blackness of the circuit board. Using this method to manufacture LED display modules eliminates the need for underfilling, preventing inconsistencies and adhesive creep issues associated with underfilling, and also reducing the likelihood of adhesive creep during subsequent underfilling processes. The method of sequentially curing solder paste 6 and encapsulating colloid 5 and forming them in one step ensures that the device structure 4 is soldered to the pads 3 without lifting, achieving flatness of the encapsulation surface and uniform light emission. This application, through the one-step forming of solder paste 6 and encapsulating colloid 5, eliminates the need for nitrogen consumption during traditional reflow curing, simplifying the process and reducing costs.

[0132] Secondly, this application provides an LED display module, which includes: a substrate body 10, pads 3, black ink 2, solder paste 6, and device structure 4. The pads 3 are disposed on the substrate body 10; the black ink 2 is coated on the surface of the substrate body 10, and the thickness of the black ink 2 is greater than the thickness of the pads 3, forming a pit between the black ink and the pads 3; the solder paste 6 is disposed in the pit; and the device structure 4 is disposed on the pads 3 and connected to the pads 3 through the solder paste 6.

[0133] The LED display module includes a substrate body 10, on which pads 3 are provided. Device structures 4 are fixed on the pads 3 by solder paste 6. At the same time, black ink 2 is coated on the surface of the substrate body 10. The black ink 2 on the surface of the substrate body 10 forms a pit between the black ink 2 and the pads 3, and the solder paste 6 is disposed in the pit.

[0134] It should be noted that the device structure 4 generally has 4 pins 40, and there are corresponding 4 pads 3 on the substrate body 10 that correspond to the pins 40. Figure 1 The diagram shows the 16 pads 3 corresponding to the four device structures 4. Each LED display module has tens of thousands of metal pads 3, meaning there are many pads 3 even in areas not marked in the diagram. Figure 1 Only a small portion of it will be shown.

[0135] In the description of this application, it should be noted that the terms "upper," "lower," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Unless otherwise expressly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two elements. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0136] It should be noted that in this application, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0137] The above description is merely a specific embodiment of this application, enabling those skilled in the art to understand or implement this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features claimed herein.

Claims

1. A method for manufacturing an LED display module, characterized in that, It includes: The black ink (2) is coated on the substrate structure (1) with pads (3) and the thickness of the black ink (2) is greater than the thickness of the pads (3). The specific steps of coating the black ink (2) on the substrate structure (1) with pads (3) include: covering the pads (3) with a masking member; coating the substrate body (10) with black ink (2). Remove the coating on the pad (3) to form a pit between the black ink (2) and the pad (3). The removal of the coating on the pad (3) specifically includes: removing the black ink (2) on the surface of the pad (3); and removing the film layer (12) on the surface of the pad (3). Solder paste is applied in the recess (6); Place the device structure (4) on the pad (3) and connect the device structure (4) and the pad (3) with solder paste (6); The mold (7) is aligned with the substrate structure (1), and the colloid (5) fills the cavity formed between the mold (7) and the substrate structure (1), and then the colloid (5) and solder paste (6) are cured. Remove the mold (7) to obtain the LED display module; The substrate structure (1) includes: a substrate body (10), a conductive metal (11) and a film layer (12), wherein the conductive metal (11) is disposed on the surface of the substrate body (10) and the film layer (12) is disposed on the surface of the conductive metal (11); Before coating the substrate structure (1) with black ink (2) on the substrate structure (1) having pads (3), the method further includes the step of fabricating pads (3) on the substrate structure (1): A film layer (12) is applied at the location of the pad on the conductive metal (11). Remove the conductive metal (11) outside the film layer (12) to form a pad (3) on the conductive metal (11) covered by the film layer (12). The mold (7) is aligned with the substrate structure (1), and the colloid (5) is filled with the cavity formed between the mold (7) and the substrate structure (1) before curing the colloid (5) and solder paste (6). The specific steps include: The mold (7) is filled with colloid (5); The mold (7) is aligned with the substrate structure (1) so that the colloid (5) is placed in the cavity between the mold (7) and the substrate structure (1); Use the first temperature to cure the colloid (5); The solder paste is cured by heating from the first temperature to the second temperature (6); The colloid (5) includes a black base filler adhesive (50) and a transparent encapsulating colloid (51). The mold (7) is aligned with the substrate structure (1) so that the colloid (5) fills the cavity formed between the mold (7) and the substrate structure (1), and the colloid (5) and solder paste (6) are cured. The specific steps include: The mold (7) is aligned with the substrate structure (1) to form a cavity between the mold (7) and the substrate structure (1). The mold (7) is provided with a flow guide hole (8) for the flow of colloid (5). The flow guide hole (8) includes a first hole (80) and a second hole (81). The first hole (80) is located on the side wall of the mold (7) near the opening, and the second hole (81) is located on the side wall of the mold (7) away from the opening. Black underfill adhesive (50) is injected into the cavity through the first hole (80), and the injection height of the black underfill adhesive (50) is lower than the height of the second hole (81) and the upper surface of the device structure (4); The black base filler glue (50) is cured at the first temperature, and pressure is applied into the mold (7) through the second hole (81) during the heating and curing process; The solder paste is cured by heating from a first temperature to a second temperature (6), where the second temperature is higher than the first temperature; A transparent encapsulating colloid (51) is injected into the cavity through the second hole (81) and cured.

2. The method for manufacturing an LED display module as described in claim 1, characterized in that, Removing the coating from the pad (3) specifically includes: Remove the film layer (12) on the surface of the pad (3).

3. The method for manufacturing an LED display module as described in claim 1, characterized in that, Applying black ink (2) to a substrate structure (1) having pads (3), specifically including the following steps: Black ink (2) is applied to the substrate body (10) and the pads (3).

4. The method for manufacturing an LED display module as described in claim 1, characterized in that: The mold (7) has a flow guide hole for the flow of colloid (5).

5. An LED display module manufactured using the LED display module manufacturing method according to any one of claims 1-4, characterized in that, It includes: Substrate body (10); The pads (3) are disposed on the substrate body (10); Black ink (2) is coated on the surface of the substrate body (10), and the thickness of the black ink (2) is greater than the thickness of the pad (3), and a pit is formed between the black ink (2) and the pad (3); Solder paste (6), wherein the solder paste (6) is disposed in the recess; Device structure (4) is disposed on pad (3) and connected to pad (3) by solder paste (6).

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