Deep-sea ecological multi-parameter in-situ detection device

Abstract

The application discloses a deep-sea ecological multi-parameter in-situ detection device. In the technical scheme, the first watertight plug and the sealing element seal one end of the first pressure-resistant shell, the insulating sealing glue seals the other end of the first pressure-resistant shell, the outer contour of the PCB is larger than that of the first through hole, and the PCB is located above the first through hole, so that the first through hole position is also sealed when the insulating sealing glue is filled, the surface of the multi-parameter detection chip integrated on the PCB is provided with a sealing layer, and the sensing end of the multi-parameter detection chip is in contact with seawater, so that the multi-parameter detection chip can be measured and is not affected by seawater; one end of the second pressure-resistant shell is sealed by the first sealing cover, and the other end is sealed by the second sealing assembly, so that the data acquisition device is not affected by seawater when collecting data, and the single sensor can be used to detect various different types of parameters in the deep-sea environment.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of deep-sea environment detection, and in particular to a deep-sea ecological multi-parameter in-situ detection device. BACKGROUND

[0002] When ecological parameters are detected in-situ in deep-sea hydrothermal areas, cold spring areas and other seabed areas, a plurality of parameters in a typical habitat need to be detected in real time, including pH, temperature, heavy metal ion concentration and other parameters.

[0003] At present, when deep-sea ecological parameters are detected in-situ, a plurality of sensors are often used for detection. For example, when heavy metal ion concentration in the deep sea is detected, a special heavy metal sensor is used, and when the temperature in the deep sea is detected, a special temperature sensor is used, and it is difficult to realize the detection of multiple parameters by a single sensor. After different types of detection data are obtained by a plurality of sensors, clock synchronization and data fusion are required, and the positions of different sensors are different when they are deployed in-situ in the deep sea, and there is a certain difference in the target areas detected.

[0004] Therefore, the prior art still needs to be improved and developed. SUMMARY

[0005] In view of the above problems of the prior art, the purpose of the present application is to provide a deep-sea ecological multi-parameter in-situ detection device to solve the problem that it is difficult to detect pH, temperature and heavy metal ion concentration in a deep-sea ecological environment by using a single sensor in the prior art.

[0006] The technical scheme adopted by the present application to solve the technical problem is to provide a deep-sea ecological multi-parameter in-situ detection device, comprising:

[0007] A sensor, wherein the sensor comprises:

[0008] A first pressure-resistant shell with a hollow cavity passing through, an installation groove is arranged on the outer wall of the first pressure-resistant shell in contact with seawater, and a first through hole communicating the installation groove and the hollow cavity of the first pressure-resistant shell is formed in the installation groove;

[0009] A PCB is fixedly installed in the installation groove, the PCB is located above the first through hole, and the outer contour of the PCB is larger than the contour of the first through hole;

[0010] The multi-parameter detection chip is used for detecting multi-parameters of deep sea ecology, and is integrated on the PCB board, one side of the PCB board integrated with the multi-parameter detection chip is provided with a sealing layer, wherein the sensing end of the multi-parameter detection chip extends out of the sealing layer along the thickness direction of the sealing layer and contacts with seawater, and the multi-parameters include pH, temperature and heavy metal ion concentration.

[0011] The first water-proof plug for transmitting signals has a plurality of pins, the first water-proof plug is installed in the hollow chamber away from one end of the pins, and a sealing member is pressed on the first pressure-resistant shell, and the wiring end of the first water-proof plug is connected with the multi-parameter detection chip through the first through hole.

[0012] The insulating sealing glue is filled into the hollow chamber of the first pressure-resistant shell away from the end of the first pressure-resistant shell on which the first water-proof plug is installed, so that the first pressure-resistant shell and the first through hole away from the end of the first pressure-resistant shell on which the first water-proof plug is installed are sealed.

[0013] The second pressure-resistant shell has a hollow chamber penetrating through;

[0014] The first sealing assembly includes a first sealing cover and a first water-proof joint matched with the first water-proof plug, the first sealing cover is used for sealing one end of the second pressure-resistant shell, and the first water-proof joint is arranged on the first sealing cover.

[0015] The second sealing assembly is used for sealing the other end of the second pressure-resistant shell.

[0016] The data acquisition device is arranged in the hollow chamber of the second pressure-resistant shell and is connected with the multi-parameter detection chip through the first water-proof joint, the first water-proof plug and the multi-parameter detection chip.

[0017] Further, the PCB board is provided with a second through hole penetrating through the upper surface and the lower surface of the PCB board, the second through hole is located above the first through hole and communicates with the first through hole.

[0018] The first through hole and the second through hole are used for discharging air in the hollow chamber of the first pressure-resistant shell when the insulating sealing glue is filled into the hollow chamber of the first pressure-resistant shell.

[0019] Further, the invention provides that the insulating sealant fills the hollow chamber of the first pressure-resistant shell from the end of the first pressure-resistant shell away from the first watertight plug to the first pressure-resistant shell to form a seal at the end of the first pressure-resistant shell away from the first watertight plug and the first through hole.

[0020] Further, the invention provides that one side of the PCB integrated with the multi-parameter detection chip is coated with the insulating sealant to form the sealing layer on one side of the PCB integrated with the multi-parameter detection chip.

[0021] Further, the invention provides that the mounting groove comprises a first groove and a second groove processed at the groove bottom of the first groove, and the first through hole is arranged in the second groove, and the PCB is mounted in the first groove.

[0022] Further, the invention provides that the second sealing assembly comprises:

[0023] a bottom cover having a third through hole penetrating through the upper surface and the lower surface of the bottom cover, a first support table arranged in the third through hole, a fourth through hole penetrating through the upper surface and the lower surface of the first support table arranged on the first support table, a first boss arranged at one end of the bottom cover along the circumference of the bottom cover, and the first boss extending out of the outer wall of the bottom cover, wherein the first boss is pressed on the second pressure-resistant shell, and the end of the bottom cover away from the first boss is mounted in the hollow chamber of the second pressure-resistant shell.

[0024] a pressure-bearing gas-permeable sheet arranged on the first support table.

[0025] a waterproof gas-permeable film arranged on the pressure-bearing gas-permeable sheet away from the first support table.

[0026] a methane-hydrogen detection sensor arranged in the hollow chamber of the second pressure-resistant shell, and the methane-hydrogen detection sensor is connected with the data acquisition device.

[0027] wherein the hydrogen and the methane enter the hollow chamber of the second pressure-resistant shell from the fourth through hole through the waterproof gas-permeable film and the pressure-bearing gas-permeable sheet.

[0028] Further, the invention provides that the pressure-bearing gas-permeable sheet is a titanium filter sheet.

[0029] Further, the invention provides that the waterproof gas-permeable film is a PDMS film.

[0030] Further, the invention provides that the second sealing assembly further comprises:

[0031] The reinforcing support is arranged on the pressure-bearing air permeable sheet near one side of the first support table, wherein the first support table is provided with a sink groove near one end of the pressure-bearing air permeable sheet, and the reinforcing support is arranged in the sink groove and abuts to the groove bottom of the sink groove.

[0032] The pressing part comprises a pressing cylinder, one end of the pressing cylinder is provided with a second boss in the circumferential direction, the second boss extends outwardly from the outer wall of the pressing cylinder, the second boss is mounted on the first boss, one end of the pressing cylinder is inserted into the third through hole and pressed onto the water-resisting and air-permeating film, and a plurality of annular grooves are arranged in the circumferential direction of the pressing cylinder, and sealing rings are mounted in the annular grooves.

[0033] The further arrangement of the present application further comprises:

[0034] The second water-tight plug is arranged on the first sealing cover and is used for connecting with an external power supply.

[0035] The third water-tight plug is arranged on the first sealing cover and is used for connecting with an upper computer.

[0036] The present application has the following beneficial effects:

[0037] In the technical scheme, one end of the first pressure-resistant shell is sealed by the first water-tight plug and the sealing member, and the other end of the first pressure-resistant shell is sealed by the insulating sealing glue, because the outer contour of the PCB is larger than the outer contour of the first through hole and the PCB is located above the first through hole, the first through hole is also sealed during the filling of the insulating sealing glue, so that no water flows into the first pressure-resistant shell, and because the surface of the PCB on which the multi-parameter detection chip is integrated is provided with a sealing layer and the sensing end of the multi-parameter detection chip is in contact with seawater, the multi-parameter detection chip can measure without being affected by seawater; further, the data acquisition device is connected with the multi-parameter detection chip through the first water-tight joint and the first water-tight plug, so that the data detected by the multi-parameter detection chip can be acquired, and the data acquisition device is arranged in the second pressure-resistant shell, one end of the second pressure-resistant shell is sealed by the first sealing cover, and the other end is sealed by the second sealing assembly, so that the data acquisition device is not affected by seawater when acquiring data, and thus the detection of a plurality of different types of parameters in a deep-sea environment by a single sensor is realized. BRIEF DESCRIPTION OF DRAWINGS

[0038] In order to make the technical solutions of the embodiments of the present application or the prior art clearer, the accompanying drawings needed in the embodiments or prior art description will be briefly introduced. Obviously, the accompanying drawings in the following description only only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained from the structures shown in the drawings without creative labor.

[0039] Figure 1 It is an exploded view of the sensor of the present application.

[0040] Figure 2 It is an assembly view of the sensor of the present application.

[0041] Figure 3 It is a sectional view of the sensor of the present application.

[0042] Figure 4 It is a top view of the sensor of the present application.

[0043] Figure 5 It is a flow chart of the method for preparing the sensor of the present application.

[0044] Figure 6 It is an exploded view of part of the structure of the deep-sea ecological multi-parameter in-situ detection device of the present application.

[0045] Figure 7 It is an assembly view of the deep-sea ecological multi-parameter in-situ detection device of the present application.

[0046] Figure 8 It is a sectional view of the second pressure-resistant shell part in the assembly view of the deep-sea ecological multi-parameter in-situ detection device of the present application.

[0047] Figure 9 It is an assembly view of the second sealing assembly in one embodiment of the present application.

[0048] Figure 10 It is a sectional view of the second sealing assembly in one embodiment of the present application.

[0049] Figure 11 It is a sectional view of the bottom cover in one embodiment of the present application.

[0050] Figure 12 It is a top view of the first sealing cover in one embodiment of the present application.

[0051] Figure 13 It is a principle block diagram of the data acquisition device in one embodiment of the present application.

[0052] Figure 14 It is a circuit structure diagram of the central control unit in one embodiment of the present application.

[0053] Figure 15is a circuit structure diagram of a power supply unit in an embodiment of the present application.

[0054] Figure 16 is a circuit structure diagram of a communication circuit in an embodiment of the present application.

[0055] Figure 17 is a circuit diagram of a ferroelectric memory in an embodiment of the present application.

[0056] Figure 18 is a circuit diagram of a flash memory in an embodiment of the present application.

[0057] Figure 19 is a pH detection circuit diagram in an embodiment of the present application.

[0058] Figure 20 is a temperature detection circuit diagram in an embodiment of the present application.

[0059] Figure 21 is an ADC converter circuit diagram in an embodiment of the present application.

[0060] Figure 22 is a methane-hydrogen detection circuit diagram in an embodiment of the present application.

[0061] Figure 23 is a reference electrode circuit diagram in a three-electrode circuit in an embodiment of the present application.

[0062] Figure 24 is a current-voltage conversion circuit diagram in a three-electrode circuit in an embodiment of the present application.

[0063] Figure 25 is a low-pass filter circuit and gain and compensation circuit diagram in a three-electrode circuit in an embodiment of the present application. DETAILED DESCRIPTION

[0064] In order to have a clearer understanding of the technical features, objectives and effects of the present application, the specific embodiments of the present application will be described in detail with reference to the drawings. In the following description, it should be understood that the directions or positional relationships indicated by "front", "back", "upper", "lower", "left", "right", "vertical", "horizontal", "vertical", "horizontal", "top", "bottom", "inner", "outer", "head", "tail" and the like are based on the directions or positional relationships shown in the drawings, constructed and operated in a particular direction, and are only for the convenience of describing the technical solutions, and should not be understood as indicating that the systems or elements must have a particular direction, therefore, it should not be understood as a limitation on the present application.

[0065] In recent years, marine in-situ detection technology has shown a significant trend towards miniaturization, with integrated chip applications becoming increasingly widespread. The advantage lies in achieving more diverse detections within a smaller area, and sensitive on-chip devices can further lower the detection limit, thereby improving dynamic sensitivity. In particular, the concentration of some chemical substances dissolved in unpolluted deep-sea water is extremely low; for example, the concentration of most heavy metal ions is on the order of μg / L. Miniaturization and micro-miniaturization of sensors can significantly improve the detection capability of weak signals. Therefore, chip-based technology based on microfabrication processes is an important development direction for marine ecological parameter detection, enabling in-situ detection of trace substances dissolved in seawater.

[0066] Currently, in-situ detection of deep-sea ecological parameters often employs multiple sensors for separate detection. For example, a dedicated heavy metal sensor is used to detect the concentration of heavy metal ions in the deep sea, and a dedicated temperature sensor is used to detect the temperature in the deep sea. It is difficult to detect multiple parameters using a single sensor. After multiple sensors acquire different types of detection data, clock synchronization and data fusion are required. Moreover, the different sensor locations used in in-situ deep-sea detection vary, resulting in differences in the target areas being detected.

[0067] To address the aforementioned issues, this invention provides an in-situ multi-parameter detection device for deep-sea ecosystems, enabling the detection of pH, temperature, and heavy metal ion concentrations in deep-sea ecosystems using a single sensor. This in-situ multi-parameter detection device may include a sensor, a second pressure-resistant housing 5 with a through-hole hollow chamber, a first sealing assembly 6, a second sealing assembly 7, and a data acquisition device 100.

[0068] like Figure 1 , Figure 2 , Figure 3 , Figure 4 as well as Figure 7 - Figure 10As shown, the sensor can include a first pressure-resistant shell 1 with a hollow chamber passing through, an installation groove 12 is arranged on the outer wall of the first pressure-resistant shell 1 in contact with seawater, and a first through hole 11 is formed in the installation groove 12 to communicate the installation groove 12 with the hollow chamber of the first pressure-resistant shell 1; a PCB board 2 is fixedly installed in the installation groove 12, the PCB board 2 is located above the first through hole 11, and the outer contour of the PCB board 2 is larger than the contour of the first through hole 11; a multi-parameter detection chip 3 is used for detecting deep-sea ecological multi-parameters, the multi-parameter detection chip 3 is integrated on the PCB board 2, and a sealing layer is arranged on one side of the PCB board 2 integrated with the multi-parameter detection chip 3, wherein the sensing end of the multi-parameter detection chip 3 extends out of the sealing layer in the thickness direction of the sealing layer and is in contact with seawater, and the multi-parameter detection chip 3 detects pH, temperature and heavy metal ion concentration; a first water-tight plug 4 for transmitting signals, the first water-tight plug 4 has a plurality of plug pins, one end of the first water-tight plug 4 away from the plug pins is installed in the hollow chamber and is pressed against a sealing member 41 on the first pressure-resistant shell 1, and the wiring end of the first water-tight plug 4 is connected with the multi-parameter detection chip 3 through the first through hole 11; and an insulating sealing glue is filled into the hollow chamber of the first pressure-resistant shell 1 from one end of the first pressure-resistant shell 1 away from the installation of the first water-tight plug 4, so as to form a seal at the end of the first pressure-resistant shell 1 away from the installation of the first water-tight plug 4 and the first through hole 11.

[0069] The first sealing assembly 6 includes a first sealing cover 64 for sealing one end of the second pressure-resistant shell 5 and a first water-tight connector 61 matched with the first water-tight plug 4, and the first water-tight connector is arranged on the first sealing cover 64; the second sealing assembly 7 is used for sealing the other end of the second pressure-resistant shell 5; and the data acquisition device 100 is arranged in the hollow chamber of the second pressure-resistant shell 5 and is connected with the multi-parameter detection chip 3 through the first water-tight connector 61, the first water-tight plug 4 and the multi-parameter detection chip 3.

[0070] Specifically, the first pressure-resistant shell 1 can be a cylindrical shell, and the hollow chamber in the first pressure-resistant shell 1 can be a circular ring type chamber. Wherein, when the first pressure-resistant shell 1 is made, titanium alloy can be used to make it able to withstand a deep water pressure of 4500m.

[0071] Wherein, one end of the first water-tight plug 4 connected with the first pressure-resistant shell 1 is provided with external threads, and the first pressure-resistant shell 1 is provided with internal threads matched with the external threads on the first water-tight plug 4, so that the first water-tight plug 4 is installed on the first pressure-resistant shell 1 in a threaded connection manner.

[0072] In order to ensure the sealing performance of the connection position of the first water-tight plug 4 and the first pressure-resistant shell 1, the first water-tight plug 4 is pressed against a sealing member 41 on the first pressure-resistant shell 1, so as to form a seal at the end of the first pressure-resistant shell 1 where the first water-tight plug 4 is installed.

[0073] In a specific embodiment, the sealing member 41 can be an O-ring 13, and the surface of the first watertight plug 4 that is in contact with the end surface of the first pressure-resistant shell 1 is provided with an annular groove, and the O-ring 13 is installed in the annular groove to improve the sealing performance of the connection position of the first watertight plug 4 and the first pressure-resistant shell 1. In this embodiment, the first watertight plug 4 can be an eight-pin plug.

[0074] In this embodiment, when the mounting groove 12 is provided, the mounting groove 12 can be provided on the first pressure-resistant shell 1 away from the first watertight plug 4, and the first through hole 11 is located at the end of the mounting groove 12 close to the first watertight plug 4, and the mounting groove 12 is in communication with the hollow chamber of the first pressure-resistant shell 1 through the first through hole 11.

[0075] In this embodiment, when the first pressure-resistant shell 1 is filled with the insulating sealant, the end of the first pressure-resistant shell 1 filled with the insulating sealant is upward, and due to the characteristics of the insulating sealant, the insulating sealant will automatically flow into the first through hole 11 of the mounting groove 12 when the insulating sealant is poured, thereby sealing the first through hole 11 in the mounting groove 12. Since the PCB board 2 covers the first through hole 11 in the mounting groove 12, the insulating sealant will not flow out of the first through hole 11, and the insulating sealant can further fix the PCB board 2.

[0076] Here, it should be noted that after the insulating sealant is poured, a period of time is required for standing to ensure that the insulating sealant is dry and fixed. The standing time is determined according to the standing condition, which will not be described in detail here.

[0077] Further, the second pressure-resistant shell 5 can also be a cylindrical shell, and the hollow chamber in the second pressure-resistant shell 5 can be a circular ring chamber. In this embodiment, the second pressure-resistant shell 5 can be made of titanium alloy to withstand a water pressure of 4500 m.

[0078] In this embodiment, when the first sealing cover 64 is connected to the second pressure-resistant shell 5, a threaded connection can be used for connection to facilitate disassembly. Further, the side of the first sealing cover 64 close to the second pressure-resistant shell 5 is provided with a cylindrical protrusion extending in the thickness direction of the first sealing cover 64, and a plurality of annular grooves are arranged around the cylindrical protrusion, and an O-ring 13 is installed in each annular groove to further improve the sealing performance of the first sealing cover 64 at the end of the second pressure-resistant shell 5. In this embodiment, the first watertight joint 61 can be provided on the first sealing cover 64.

[0079] In this embodiment, as Figure 12As shown, the first water-tight joint 61 is an eight-hole joint, wherein the interface 1, the interface 2 and the interface 3 of the first water-tight joint 61 are temperature detection interfaces, the interface 4 of the first water-tight joint 61 is a reference electrode interface, the interface 5 of the first water-tight joint 61 is an auxiliary electrode interface, the interface 6 of the first water-tight joint 61 is a working electrode interface, the interface 7 of the first water-tight joint 61 is a pH- interface, and the interface 8 of the first water-tight joint 61 is a pH+ interface.

[0080] In the embodiment, one end of the first pressure-resistant shell 1 is sealed by the first water-tight plug 4 and the sealing member 41, and the other end of the first pressure-resistant shell 1 is sealed by the insulating sealing glue. Since the outer contour of the PCB board 2 is larger than the outer contour of the first through hole 11, and the PCB board 2 is located above the first through hole 11, the position of the first through hole 11 is also sealed during the filling of the insulating sealing glue, so that no water flows into the first pressure-resistant shell 1. Since the surface of the PCB board 2 on which the multi-parameter detection chip 3 is integrated is provided with a sealing layer, and the sensing end of the multi-parameter detection chip 3 is in contact with seawater, the multi-parameter detection chip 3 can perform measurement and is not affected by seawater. Further, the data acquisition device 100 is connected to the multi-parameter detection chip 3 through the first water-tight joint 61 and the first water-tight plug 4, and can acquire the data detected by the multi-parameter detection chip 3. The data acquisition device 100 is arranged in the second pressure-resistant shell 5, one end of the second pressure-resistant shell 5 is sealed by the first sealing cover 64, and the other end is sealed by the second sealing assembly 7. Therefore, the data acquisition device 100 is not affected by seawater when acquiring data. It can be seen that the deep-sea ecological multi-parameter in-situ detection device realizes the detection of multiple different types of parameters in the deep-sea environment by using a single sensor.

[0081] Further, in order to solve the influence of the air in the hollow chamber of the first pressure-resistant shell 1 on the sealing during the sealing process by using the insulating sealing glue, the second through hole 21 penetrating the upper surface and the lower surface of the PCB board 2 is arranged on the PCB board 2, the second through hole 21 is located above the first through hole 11 and communicates with the first through hole 11. The first through hole 11 and the second through hole 21 are used to exhaust the air in the hollow chamber of the first pressure-resistant shell 1 when the insulating sealing glue is filled into the hollow chamber of the first pressure-resistant shell 1. That is, when the flexible sealing filler is filled into the hollow chamber of the first pressure-resistant shell 1, the air in the hollow chamber of the first pressure-resistant shell 1 is exhausted through the first through hole 11 and the second through hole 21.

[0082] In the embodiment, since the purpose of the second through hole 21 is to discharge air in the hollow chamber of the first pressure-resistant shell 1, the aperture of the second through hole 21 does not need to be too large so that too much insulating sealant flows out during the pouring process. Therefore, the specific aperture of the second through hole 21 can be determined by the person skilled in the art according to the actual situation, and is not limited here.

[0083] Further, when the mounting groove 12 is arranged, one end of the mounting groove 12 away from the first water-tight plug 4 can be arranged. Correspondingly, the distance between the second through hole 21 and the first through hole 11 away from the sealing opening is shortened. The sealing opening refers to the end of the first pressure-resistant shell 1 away from the first water-tight plug 4. In this way, when pouring the insulating sealant with the end of the first water-tight plug 4 in an upward position, the amount of insulating sealant flowing out of the second through hole 21 can be reduced, and the influence of air on the sealing process can be reduced.

[0084] In some embodiments, one side of the PCB 2 integrated with the multi-parameter detection chip 3 is coated with insulating sealant to form a sealing layer on one side of the PCB 2 integrated with the multi-parameter detection chip 3.

[0085] In some embodiments, as shown in Figure 1 The mounting groove 12 can include a first groove 121 and a second groove 122 machined at the bottom of the first groove 121. The first through hole 11 is arranged in the second groove 122, and the PCB 2 is mounted in the first groove 121.

[0086] Specifically, the PCB 2 can be a rectangular circuit board. Correspondingly, when the first groove 121 is arranged, a rectangular groove slightly larger than the outer contour of the PCB 2 is arranged. Then, a groove is further arranged in the first groove 121, that is, the first groove 121 and the second groove 122 are formed in the first groove 121. When the PCB 2 is mounted, the wires connected between the multi-parameter detection chip 3 and the wiring terminals of the first water-tight plug 4 pass into the hollow chamber of the first pressure-resistant shell 1 from the first through hole 11. One end of the wires is connected to the wiring terminals of the multi-parameter detection chip 3, and the other end of the wires is connected to the wiring terminals of the first water-tight plug 4. The groove depth of the first groove 121 is greater than the distance between the lower surface of the PCB 2 integrated with the multi-parameter detection chip 3 and the upper surface of the multi-parameter detection chip 3.

[0087] In the embodiment, since the second groove 122 is formed in the groove bottom of the first groove 121 and the PCB 2 is arranged in the first groove 121, the service life of the sensor will not be affected by the pressure of the PCB 2 on the wires of the multi-parameter detection chip 3, and since the groove depth of the first groove 121 is greater than the distance between the lower surface of the PCB 2 and the upper surface of the multi-parameter detection chip 3 after the PCB 2 is integrated with the multi-parameter detection chip 3, when the sealant is coated on the PCB 2, the coating thickness of the sealant can be less than or equal to the difference between the groove depth of the first groove 121 and the distance between the lower surface of the PCB 2 and the upper surface of the multi-parameter detection chip 3, so that the upper surface of the sealant after dry setting will not protrude from the outer wall of the first pressure-resistant shell 1, so that the sensor is neat and beautiful.

[0088] In some embodiments, as shown in Figure 6 、 Figure 9 、 Figure 10 and Figure 11 , the second sealing assembly 7 can include a bottom cover 71, a pressure-bearing gas-permeable sheet 9, a waterproof gas-permeable film 10, and a methane-hydrogen detection sensor 8; the bottom cover 71 has a third through hole 711 penetrating the upper surface and the lower surface of the bottom cover 71, a first support table 712 is arranged on the inner wall of the bottom cover 71 in the circumferential direction in the third through hole 711, a fourth through hole 714 penetrating the upper surface and the lower surface of the first support table 712 is arranged on the first support table 712, a first boss 715 is arranged on one end of the bottom cover 71 in the circumferential direction of the bottom cover 71, the first boss 715 extends out of the outer wall of the bottom cover 71, wherein the first boss 715 is pressed on the second pressure-resistant shell 5, and the end of the bottom cover 71 away from the first boss 715 is installed in the hollow chamber of the second pressure-resistant shell 5; the pressure-bearing gas-permeable sheet 9 is arranged on the first support table 712 and located in the third through hole 711; the waterproof gas-permeable film 10 is arranged on the side of the pressure-bearing gas-permeable sheet 9 away from the first support table 712; the methane-hydrogen detection sensor 8 is arranged in the hollow chamber of the second pressure-resistant shell 5, and the methane-hydrogen detection sensor 8 is connected with the data acquisition device 100; wherein the hydrogen and methane enter the hollow chamber of the second pressure-resistant shell 5 from the fourth through hole 714 through the waterproof gas-permeable film 10 and the pressure-bearing gas-permeable sheet 9.

[0089] Specifically, the bottom cover 71 can be a cylindrical structure, the through hole in the cylindrical structure is the third through hole 711, and the first support table 712 can be arranged at one end of the cylindrical structure; the first support table 712 is a circular support table, wherein the lower surface of the first support table 712 and the end face of one end of the cylindrical structure are in the same plane, and the upper surface of the first support table 712 is located in the third through hole 711.

[0090] In order to ensure that hydrogen and methane can enter the second pressure shell 5, the first supporting table 712 is provided with a fourth through hole 714 penetrating the upper surface and the lower surface of the first supporting table 712. Specifically, the fourth through hole 714 can be provided with a plurality of, for example, two fourth through holes 714; for another example, the fourth through hole 714 can be provided with three, four or other multiple fourth through holes 714, and the specific number can be determined by the person skilled in the art according to the actual situation.

[0091] Wherein, when the bottom cover 71 is installed, a plurality of threaded holes can be arranged on the first boss 715 at intervals, and a plurality of threaded holes corresponding to the threaded holes on the first boss 715 are arranged on the second pressure shell 5, and the bottom cover 71 is installed on the second pressure shell 5 in a threaded connection manner.

[0092] In this embodiment, the dissolved gas in seawater can enter the hollow chamber of the second pressure shell 5 through the water-resistant gas-permeable membrane 10 and the pressure-bearing gas-permeable sheet 9 from the fourth through hole 714, and at the same time, seawater cannot enter the hollow chamber of the second pressure shell 5, and the content of methane and hydrogen is detected by the methane-hydrogen detection sensor 8.

[0093] Therefore, it can be seen that when the deep-sea ecological multi-parameter in-situ detection device detects multiple parameters in the deep sea, the methane-hydrogen detection sensor 8 arranged in the second pressure shell 5 can also detect methane and hydrogen in the deep sea, further increasing the number of detectable parameters.

[0094] In this embodiment, the pressure-bearing gas-permeable sheet 9 can be any pressure-bearing gas-permeable sheet capable of supporting the water-resistant gas-permeable membrane 10, for example, but not limited to, a titanium filter sheet. The water-resistant gas-permeable membrane 10 can be any water-resistant and gas-permeable membrane, for example, but not limited to, a PDMS (Polydimethylsiloxane) gas-permeable membrane. The titanium filter sheet can be a filter sheet made of titanium with 50 μm micropores, which allows methane and hydrogen to pass through.

[0095] In some embodiments, as shown in Figure 10 , Figure 11 The second sealing assembly 7 further includes a reinforcing support 72 and a pressing member 73, wherein the reinforcing support 72 is used to reinforce and support the pressure-bearing gas-permeable sheet 9, and the pressing member 73 includes a pressing cylinder 731, which is pressed onto the water-resistant gas-permeable membrane 10 to fix the water-resistant gas-permeable membrane 10, the pressure-bearing gas-permeable sheet 9 and the first supporting table 712.

[0096] The reinforcing support 72 is arranged on the pressure-bearing gas-permeable sheet 9 close to one side of the first support platform 712; one end of the compression cylinder 731 is circumferentially provided with a second boss 732 extending outwardly from the outer wall of the compression cylinder 731, the second boss 732 is installed on the first boss 715, the compression cylinder 731 is located in the third through hole 711, the compression cylinder 731 is pressed onto the waterproof and air-permeable film 10, and the compression cylinder 731 is circumferentially provided with a plurality of annular grooves in which sealing rings are installed.

[0097] In the embodiment, the arrangement of the reinforcing support 72 can improve the compression strength of the pressure-bearing gas-permeable sheet 9, so that methane and hydrogen in the deep sea at a deeper position can be detected.

[0098] Specifically, the reinforcing support 72 can be a circular table, the first support platform 712 is provided with a circular groove 713 at one end close to the circular table, the diameter of the circular groove 713 is slightly larger than the diameter of the circular table, wherein the fourth through holes 714 arranged on the first support platform 712 are all located in the circular groove 713, and the circular table is installed in the circular groove 713. Further, a plurality of fifth through holes 721 penetrating the upper surface and the lower surface of the circular table are arranged on the circular table, the number of the fifth through holes 721 is equal to the number of the fourth through holes 714, and each fifth through hole 721 is in communication with a fourth through hole 714 to ensure that hydrogen and methane can enter the hollow chamber of the second pressure-resistant shell 5.

[0099] In some embodiments, as shown in Figure 7 , Figure 8 the first sealing assembly 6 further includes a second water-tight plug 62 and a third water-tight plug 63, wherein the second water-tight plug 62 is arranged on the first sealing assembly 6 and is used to connect with an external power supply, that is, the data acquisition device 100 is connected with the external power supply through the second water-tight plug 62; the third water-tight plug 63 is arranged on the first sealing assembly 6 and is used to connect with an upper computer, that is, the data acquisition device 100 realizes communication with the upper computer through the third water-tight plug 63.

[0100] Specifically, the second water-tight plug 62 is arranged on the first sealing cover 64, and the second water-tight plug 62 is an eight-pin plug, wherein, as shown in Figure 12 , the pin 1 of the second water-tight plug 62 is a first charging positive electrode pin, the pin 2 of the second water-tight plug 62 is a first charging negative electrode pin, the pin 3 of the second water-tight plug 62 is a first power supply control pin, the pin 4 of the second water-tight plug 62 is a second power supply control pin, and the pin 5 of the second water-tight plug 62 is a second charging negative electrode pin.

[0101] The third water-tight plug 63 is arranged on the first sealing cover 64, and the third water-tight plug 63 is a three-pin plug, wherein, as shown in Figure 12As shown, pin 1 of the third watertight plug 63 is an RS232 data receiving pin, pin 2 of the third watertight plug 63 is an RS232 data sending pin, and pin 3 of the third watertight plug 63 is a grounding pin.

[0102] In the present embodiment, the titanium filter has a titanium material and a filter with 50 μm micropores, and allows methane and hydrogen to pass through.

[0103] In some embodiments, the multi-parameter detection chip 3 can adopt, but is not limited to, the chip disclosed in the patent application file with publication number CN117705910A, which can simultaneously detect heavy metals, pH, and temperature parameters.

[0104] In the present embodiment, the data acquisition device 100 is a circuit capable of detecting pH, heavy metals, temperature, hydrogen, and methane, as shown in Figure 13 The circuit structure diagram adopted by the data acquisition device 100 is shown in the circuit structure diagram of the data acquisition device 100, which can be divided into a communication circuit, a microcontroller and its peripheral circuit, a storage circuit, a digital-to-analog converter and its peripheral circuit, a three-electrode circuit, an analog-to-digital converter and its peripheral circuit temperature sensing circuit, a power supply circuit, and a dissolution voltammetry detection circuit. The above-mentioned circuits are divided into three categories: digital circuits, digital-analog hybrid circuits, and analog circuits according to the signals they control, measure, and transmit.

[0105] When detecting, the multi-parameter detection chip 3 transmits heavy metal ions, pH, and temperature parameters to the data acquisition device 100 through the first watertight plug 4 and the first watertight connector 61. The data acquisition device 100 converts the measured parameters into useful electrical signals and transmits them to the upper computer through the watertight cable. By calculating, the measured parameters can be obtained, for example, by standard curve calculation.

[0106] The electrodes for detecting heavy metal ions and the electrodes for detecting pH in the multi-parameter detection chip 3 can exist independently (separately detect heavy metal ions and pH), or can be simultaneously detected. The measured parameters are transmitted to the data acquisition device 100 through the first watertight plug 4, the first watertight connector 61, and the watertight cable, and are uniformly processed, collected, and saved by the data acquisition device 100.

[0107] As shown in Figure 14 - Figure 25 The circuit diagram of the data acquisition device is shown in Figure 14 The circuit structure diagram of the central control unit and its peripheral circuit is shown in. It can adopt a central control unit built with a chip of model STM32L431RCT6. The internal memory of the chip stores an embedded control program. The external digital interface of the chip communicates with other digital parts to control these devices to play their respective roles.

[0108] In the circuit diagram of the central control unit, all VDD pins of the STM32L431RCT6 chip are connected to the +3.3V digital power supply. Each VDD pin is decoupled through a 100nF ceramic capacitor. The entire package is decoupled through a 10μF ceramic capacitor. The VBAT pin is connected to the +3.3V digital power supply and is decoupled through a 100nF ceramic capacitor. The VDDA pin is connected to the +3.3V analog power supply. This pin is decoupled through a 10nF ceramic capacitor and a 1μF ceramic capacitor.

[0109] In order to obtain high-precision system frequency, the system clock source selects to use a high-speed external clock, and the ultimate source is a passive crystal oscillator. The crystal oscillator is connected through the 5th and 6th pins of the package.

[0110] As shown in Figure 15 , it is a circuit structure diagram of the power supply unit. The power supply unit provides a positive power supply for the operation of each circuit and also provides a negative power supply required for signal acquisition, that is, it needs to provide the current required for the operation of the circuit and also needs to be able to control the power supply and enter a low-power mode, so as to achieve the purpose of long-term operation. In order to meet the power supply requirements of the analog circuit, the analog circuit which has high requirements for power supply ripple and noise quality and the digital circuit which has a great negative impact on power supply ripple and noise need to be separated.

[0111] As shown in Figure 15 , in the power supply unit, the positive and negative secondary power rails are respectively stepped down and stepped up through a Low Dropout Regulator (LDO) to generate ±5V analog power rails. The LDO has the characteristic of reducing the noise of the secondary power rail.

[0112] In the power supply unit, chips of types LT8471, AMS1117-3.3, REF3033AIDBZR, and AMS1117-ADJ are mainly used to build the power supply unit, which can generate ±5V analog power rails and +3.3V direct current. When the fourteenth resistor R14 and the fifteenth resistor R15 are connected to a low level at one end, the drain of the first MOS tube Q1 has no output, and when the fourteenth resistor R14 and the fifteenth resistor R15 are connected to a high level at one end, the drain of the first MOS tube Q1 has an output.

[0113] As shown in Figure 16As shown in the figure, it is the circuit structure diagram of the communication circuit, wherein the communication circuit is the circuit structure diagram of the communication unit built by the chip with the chip model of MAX3232. The RS232 interface is adopted as the communication interface of the data acquisition device 100 and the host computer, and the transceiver is mainly responsible for converting the UART format LVTTL level of the central control unit into the RS-232 level.

[0114] As shown in the figure, it is the circuit structure diagram of the communication circuit, wherein the communication circuit is the circuit structure diagram of the communication unit built by the chip with the chip model of MAX3232. The RS232 interface is adopted as the communication interface of the data acquisition device 100 and the host computer, and the transceiver is mainly responsible for converting the UART format LVTTL level of the central control unit into the RS-232 level. Figure 17 Figure 18 As shown in the figure, it is the circuit structure diagram of the communication circuit, wherein the communication circuit is the circuit structure diagram of the communication unit built by the chip with the chip model of MAX3232. The RS232 interface is adopted as the communication interface of the data acquisition device 100 and the host computer, and the transceiver is mainly responsible for converting the UART format LVTTL level of the central control unit into the RS-232 level. Figure 17 Figure 18 As shown in the figure, it is the circuit structure diagram of the communication circuit, wherein the communication circuit is the circuit structure diagram of the communication unit built by the chip with the chip model of MAX3232. The RS232 interface is adopted as the communication interface of the data acquisition device 100 and the host computer, and the transceiver is mainly responsible for converting the UART format LVTTL level of the central control unit into the RS-232 level.

[0115] As shown in the figure, it is the circuit structure diagram of the communication circuit, wherein the communication circuit is the circuit structure diagram of the communication unit built by the chip with the chip model of MAX3232. The RS232 interface is adopted as the communication interface of the data acquisition device 100 and the host computer, and the transceiver is mainly responsible for converting the UART format LVTTL level of the central control unit into the RS-232 level. Figure 19 As shown in the figure, it is the circuit structure diagram of the communication circuit, wherein the communication circuit is the circuit structure diagram of the communication unit built by the chip with the chip model of MAX3232. The RS232 interface is adopted as the communication interface of the data acquisition device 100 and the host computer, and the transceiver is mainly responsible for converting the UART format LVTTL level of the central control unit into the RS-232 level.

[0116] Figure 20 As shown in the figure, it is the circuit structure diagram of the communication circuit, wherein the communication circuit is the circuit structure diagram of the communication unit built by the chip with the chip model of MAX3232. The RS232 interface is adopted as the communication interface of the data acquisition device 100 and the host computer, and the transceiver is mainly responsible for converting the UART format LVTTL level of the central control unit into the RS-232 level.

[0117] As shown in the figure, it is the circuit structure diagram of the communication circuit, wherein the communication circuit is the circuit structure diagram of the communication unit built by the chip with the chip model of MAX3232. The RS232 interface is adopted as the communication interface of the data acquisition device 100 and the host computer, and the transceiver is mainly responsible for converting the UART format LVTTL level of the central control unit into the RS-232 level. Figure 21 As shown in the figure, it is the circuit structure diagram of the communication circuit, wherein the communication circuit is the circuit structure diagram of the communication unit built by the chip with the chip model of MAX3232. The RS232 interface is adopted as the communication interface of the data acquisition device 100 and the host computer, and the transceiver is mainly responsible for converting the UART format LVTTL level of the central control unit into the RS-232 level.

[0118] Figure 22 As shown in the figure, it is the circuit structure diagram of the communication circuit, wherein the communication circuit is the circuit structure diagram of the communication unit built by the chip with the chip model of MAX3232. The RS232 interface is adopted as the communication interface of the data acquisition device 100 and the host computer, and the transceiver is mainly responsible for converting the UART format LVTTL level of the central control unit into the RS-232 level.

[0119] ​​​​Methane hydrogen is a kind of gas, its detection principle is to coat semiconductor gas sensitive material on the electrode, it belongs to surface ion type N type semiconductor. When at 200-300 degrees Celsius, semiconductor gas sensitive material adsorbs oxygen in the air, forms oxygen negative ion adsorption, makes the electron density of semiconductor decrease, thereby makes its resistance value increase. When contact with gas, if the potential barrier at the grain boundary receives the regulation of different concentration of gas and changes, the surface conductivity will change. Use this point to obtain the information of the existence of the gas, the greater the concentration of the gas, the greater the conductivity, the lower the output resistance, then the greater the output analog signal. The 3, 4 pins of the binding post JP2 are used for heating power supply; The 1, 2 pins of the binding post JP2 are connected at both ends of the semiconductor gas sensitive material, which can be equivalent to a resistance, the 1 pin of the binding post JP2 is connected to the operational amplifier U11, the front end of the operational amplifier U11 adopts VCVS second order active filter circuit, so that the input voltage passes through two stage RC low pass filter circuit, the input voltage enters the same phase input end of the integrated operational amplifier U11, that is, same phase amplification, the capacitor of the first stage RC circuit is not connected to the ground, but connected to the output end, so as to introduce output feedback, so that the output voltage rapidly decreases in high frequency band, but does not decrease too much in cutoff frequency range. Thus, the effect of voltage stabilizing and filtering is achieved.

[0120] When detecting heavy metals, three electrode circuit is used for detection, such as Figure 23As shown, this is the reference electrode circuit in the three-electrode circuit. If the entire deep-sea ecological multi-parameter in-situ detection device is regarded as a constant potential meter, then the three-electrode circuit acts as its analog front end. The reference electrode circuit is a circuit built with an operational amplifier of model OPA21921DR. In a three-electrode circuit, the three electrodes are the working electrode, the reference electrode, and the auxiliary electrode. The working electrode is where the chemical reaction of interest occurs. The voltage measurement signal of the working electrode is buffered by a unity-gain amplifier before entering the measurement port of the analog-to-digital converter (ADC). The current measurement signal of the working electrode flows into the current-to-voltage conversion circuit. The reference electrode, as a reference source, does not conduct current and plays a role in measuring and controlling the potential difference of the auxiliary electrode. Because the current flowing through the reference electrode is negligible, the voltage drop between the reference electrode and the working electrode is usually very small. The voltage measurement signal of the reference electrode is buffered by a unity-gain amplifier before entering the measurement port of the ADC, and another path enters the output amplifier of the auxiliary electrode to participate in the regulation of the output voltage of the auxiliary electrode. The physical interface of the reference electrode uses a coaxial cable, and its outer casing signal is the DAC output voltage buffered by a unity-gain amplifier. The auxiliary electrode, as the other half of the electrochemical cell, plays two roles: first, it forms a complete circuit, allowing charge to flow in the electrochemical cell; second, it maintains an interfacial potential difference independent of current. Therefore, the actual voltage of the auxiliary electrode is determined by the DAC, the solution system, and the reference electrode feedback loop. Because the voltage measurement signal of the reference electrode is connected to the inverting input of the output amplifier of the auxiliary electrode, when the internal resistance of the solution system is small (not exceeding the load capacity of the output amplifier), the output voltage of the auxiliary electrode is increased or decreased (increased towards the negative voltage direction) to make the reference electrode voltage approach the DAC output value. When the internal resistance of the solution system is large, the output amplifier leaves the deep negative feedback state, and the output voltage approaches the positive and negative power rail values. However, there is still a large gap between the reference electrode voltage and the DAC (digital-to-analog converter) output value. The voltage measurement signal of the auxiliary electrode is buffered by a unity-gain amplifier before entering the measurement port of the analog-to-digital converter. The physical interface of the auxiliary electrode uses a coaxial cable, and its outer casing signal is analog ground.

[0121] like Figure 24 The diagram shows a current-to-voltage conversion circuit in a three-electrode circuit. Through a transimpedance amplifier circuit, the weak current signal flowing through the working electrode is converted into a measurable voltage signal. The entire transimpedance amplifier circuit topology includes the working electrode (abstracted as an SMA coaxial interface), operational amplifier, feedback resistor and compensation capacitor network, analog switches, and other components. The AC signal gain of the transimpedance amplifier circuit mainly depends on the capacitor and resistor in the feedback loop.

[0122] like Figure 25As shown, low-pass filter circuit and gain and compensation circuit in three-pole circuit, low-pass filter circuit is built with the chip model ADG659YRUZ-REEL7 circuit, gain and compensation circuit is built with the device model LMP7707MF circuit. Among them, in order to make the current-voltage conversion circuit output voltage more smooth, four gear multiplexing low-pass filter network filters high frequency noise, the low-pass filter circuit is composed of four groups of different configuration of first-order R-C passive filter and a 4:1 multiplexing analog electronic switch, the voltage signal is output from the low-pass filter circuit, before entering the measurement port of the analog-to-digital converter, the last stage of adjustment is carried out, including using 4 times gain of the same phase amplification topology circuit to increase the original signal, and incorporating adjustable voltage signal compensation in the opposite phase end before the system zero bias of the previous stage.

[0123] In some embodiments, as Figure 5 The application also provides a sensor preparation method, which comprises the following steps:

[0124] A first pressure-resistant shell is provided, which has a hollow chamber passing through;

[0125] A mounting groove is arranged on the side wall of the first pressure-resistant shell;

[0126] A first through hole is arranged on the side wall of the first pressure-resistant shell, wherein the first through hole passes through the side wall of the first pressure-resistant shell and is located in the mounting groove;

[0127] A multi-parameter detection chip is provided;

[0128] A PCB board is provided, the multi-parameter detection chip is integrated on the PCB board, and the PCB board is mounted in the mounting groove;

[0129] A sealing layer is arranged on one side of the PCB board on which the multi-parameter detection chip is integrated, wherein the sensing end of the multi-parameter detection chip is in contact with seawater;

[0130] A first water-tight plug is provided, wherein the first water-tight plug has a plurality of plug pins;

[0131] One end of the first water-tight plug away from the plug pins is mounted in the hollow chamber, and a sealing member is pressed onto the first pressure-resistant shell, wherein the first water-tight plug is connected with the multi-parameter detection chip through the first through hole;

[0132] Insulating sealant is filled into the hollow chamber of the first pressure-resistant shell from one end of the first pressure-resistant shell away from the first water-tight plug, so as to form a seal at the end of the first pressure-resistant shell away from the first water-tight plug and the first through hole.

[0133] Specifically, in the preparation of the sensor, a multi-parameter detection chip can be first integrated on a PCB board, after integration, the wires connected to the multi-parameter detection chip on the PCB board are passed into the hollow cavity of the first pressure-resistant shell through the first through hole in the mounting groove, and the wires are connected to the first waterproof plug, after connection, the first waterproof plug is installed on one end of the first pressure-resistant shell, and an O-shaped sealing ring is pressed on the first pressure-resistant shell during installation to ensure the sealing of the first pressure-resistant shell on the end of the first waterproof plug. Further, the PCB board is fixedly installed in the mounting groove, wherein, during installation of the PCB board, it is necessary to note that the PCB board is installed above the first through hole in the mounting groove, and the first through hole in the mounting groove is covered by the PCB board, then, the first pressure-resistant shell is filled with insulating sealant from the end away from the first waterproof plug, so that the end of the first pressure-resistant shell away from the first waterproof plug and the first through hole are sealed; finally, a sealing layer is arranged on one side of the PCB board integrated with the multi-parameter detection chip, wherein, during arrangement of the sealing layer, it is necessary to ensure that the sensing end of the parameter detection chip can be contacted with seawater, and the wiring position of the multi-parameter detection chip on the PCB board will not be short-circuited due to water.

[0134] Wherein, when filling the insulating sealant, the end of the first pressure-resistant shell filled with the insulating sealant is upward, due to the characteristics of the insulating sealant, when filling the insulating sealant, the insulating sealant will automatically flow into the first through hole of the mounting groove to seal the first through hole in the mounting groove, and because the first through hole in the mounting groove is covered by the PCB board, the insulating sealant will not flow out of the first through hole, and the insulating sealant can further fix the PCB board.

[0135] Here, it should be noted that after filling the insulating sealant, a period of time is needed for standing to ensure that the insulating sealant is dry and fixed, and during standing, the standing time is determined according to the standing condition, which will not be described in detail here.

[0136] In summary, the present application provides a deep-sea ecological multi-parameter in-situ detection device, which has the following beneficial effects:

[0137] In the embodiment, one end of the first pressure-resistant shell 1 is sealed by the first water-proof plug 4 and the sealing member 41, and the other end of the first pressure-resistant shell 1 is sealed by the insulating sealing glue. Since the outer contour of the PCB board 2 is larger than the outer contour of the first through hole 11, and the PCB board 2 is located above the first through hole 11, the first through hole 11 is also sealed during the filling of the insulating sealing glue, so that no water flows into the first pressure-resistant shell 1. Since the surface of the PCB board 2 on which the multi-parameter detection chip 3 is integrated is provided with a sealing layer, and the sensing end of the multi-parameter detection chip 3 is in contact with seawater, the multi-parameter detection chip 3 can perform measurement and is not affected by seawater. Further, the data acquisition device 100 is connected with the multi-parameter detection chip 3 through the first water-proof joint 61 and the first water-proof plug 4, so as to acquire the data detected by the multi-parameter detection chip 3. The data acquisition device 100 is arranged in the second pressure-resistant shell 5, one end of the second pressure-resistant shell 5 is sealed by the first sealing cover 64, and the other end is sealed by the second sealing assembly 7. Therefore, the data acquisition device 100 is not affected by seawater when acquiring data. It can be seen that the deep-sea ecological multi-parameter in-situ detection device realizes detection of multiple different types of parameters in a deep-sea environment by using a single sensor.

[0138] It can be understood that the above embodiments only express the preferred embodiments of the present application, and the description is more specific and detailed, but it cannot be understood as a limitation on the scope of the patent of the present application; it should be pointed out that for ordinary skilled in the art, the above technical features can be freely combined without departing from the concept of the present application, and several modifications and improvements can be made, which belong to the protection scope of the present application; therefore, any equivalent transformation and modification within the scope of the claims of the present application shall belong to the scope of the claims of the present application.

Claims

1. A deep-sea ecological multi-parameter in-situ detection device, characterized in that, The application relates to a deep-sea multi-parameter detection device. The sensor comprises: A first pressure-resistant shell with a hollow chamber, wherein an installation groove is arranged on the outer wall of the first pressure-resistant shell in contact with seawater, and a first through hole is arranged in the installation groove and communicates with the hollow chamber of the first pressure-resistant shell; A PCB board is fixedly installed in the installation groove, the PCB board is located above the first through hole, and the outer contour of the PCB board is larger than the contour of the first through hole; A multi-parameter detection chip is used for detecting deep-sea ecological multi-parameters, the multi-parameter detection chip is integrated on the PCB board, and a sealing layer is arranged on the side of the PCB board integrated with the multi-parameter detection chip; the sensing end of the multi-parameter detection chip extends out of the sealing layer along the thickness direction of the sealing layer and is in contact with seawater; the multi-parameters include pH, temperature and heavy metal ion concentration; A first water-tight plug for transmitting signals is provided with a plurality of pins, the first water-tight plug is installed in the hollow chamber away from the pins, and a sealing element is pressed on the first pressure-resistant shell, and the wiring end of the first water-tight plug is connected with the multi-parameter detection chip through the first through hole; An insulating sealing glue is filled into the hollow chamber of the first pressure-resistant shell away from the end of the first pressure-resistant shell where the first water-tight plug is installed, so that the end of the first pressure-resistant shell away from the first water-tight plug and the first through hole are sealed; A second pressure-resistant shell with a hollow chamber; A first sealing assembly comprises a first sealing cover and a first water-tight joint matched with the first water-tight plug, the first sealing cover is used for sealing one end of the second pressure-resistant shell, and the first water-tight joint is arranged on the first sealing cover; A second sealing assembly is used for sealing the other end of the second pressure-resistant shell; A data acquisition device is arranged in the hollow chamber of the second pressure-resistant shell and is connected with the multi-parameter detection chip through the first water-tight joint, the first water-tight plug and the multi-parameter detection chip.

2. The deep-sea ecological multi-parameter in-situ detection device according to claim 1, characterized in that, A second through hole is arranged on the PCB board and penetrates the upper surface and the lower surface of the PCB board, the second through hole is located above the first through hole and communicates with the first through hole; The first through hole and the second through hole are used for discharging air in the hollow chamber of the first pressure-resistant shell when the insulating sealing glue is filled into the hollow chamber of the first pressure-resistant shell.

3. The deep-sea ecological multi-parameter in-situ detection device according to claim 1 or 2, characterized in that, The insulating sealing glue comprises vulcanized glue, which is filled into the hollow chamber of the first pressure-resistant shell away from the end of the first pressure-resistant shell where the first water-tight plug is installed, so that the end of the first pressure-resistant shell away from the first water-tight plug and the first through hole are sealed.

4. The deep-sea ecological multi-parameter in-situ detection device according to claim 3, characterized in that, The side of the PCB board integrated with the multi-parameter detection chip is coated with the insulating sealing glue, so that the sealing layer is formed on the side of the PCB board integrated with the multi-parameter detection chip.

5. The deep-sea ecological multi-parameter in-situ detection device according to claim 4, characterized in that, The mounting groove comprises a first groove and a second groove processed at the groove bottom of the first groove, the first through hole is arranged in the second groove, and the PCB is mounted in the first groove.

6. The in-situ multi-parameter detection device for deep sea ecology according to claim 1, characterized in that, The second sealing assembly comprises: a bottom cover, the bottom cover has a third through hole penetrating through the upper surface and the lower surface of the bottom cover, a first support table is arranged in the third through hole, a fourth through hole penetrating through the upper surface and the lower surface of the first support table is arranged on the first support table, a first boss is arranged on one end of the bottom cover along the circumference of the bottom cover, the first boss extends out of the outer wall of the bottom cover, wherein the first boss is pressed on the second pressure-resistant shell, and one end of the bottom cover away from the first boss is mounted in the hollow chamber of the second pressure-resistant shell; a pressure-bearing gas permeable sheet arranged on the first support table; a waterproof gas permeable membrane arranged on one side of the pressure-bearing gas permeable sheet away from the first support table; a methane-hydrogen detection sensor arranged in the hollow chamber of the second pressure-resistant shell, the methane-hydrogen detection sensor is connected with the data acquisition device.

7. The deep-sea ecological multi-parameter in-situ detection device according to claim 6, characterized in that, The pressure-bearing gas permeable sheet is a titanium filter sheet.

8. The deep-sea ecological multi-parameter in-situ detection device according to claim 7, characterized in that, The waterproof gas permeable membrane is a PDMS membrane.

9. The deep-sea ecological multi-parameter in-situ detection device according to claim 6, characterized in that, The second sealing assembly further comprises: a reinforcing support for reinforcing and supporting the pressure-bearing gas permeable sheet, the reinforcing support is arranged on one side of the pressure-bearing gas permeable sheet close to the first support table, wherein one end of the first support table close to the pressure-bearing gas permeable sheet is provided with a sink, the reinforcing support is arranged in the sink and abuts to the sink bottom; a pressing member, the pressing member comprises a pressing cylinder, one end of the pressing cylinder is provided with a second boss along the circumference, the second boss extends out of the outer wall of the pressing cylinder, the second boss is mounted on the first boss, one end of the pressing cylinder is inserted into the third through hole and pressed on the waterproof gas permeable membrane, the circumference of the pressing cylinder is provided with a plurality of annular grooves, and sealing rings are mounted in the annular grooves.

10. The in-situ multi-parameter detection device for deep sea ecology according to claim 1, characterized in that, Further comprising: a second water-tight plug arranged on the first sealing cover, the second water-tight plug is used for connecting with an external power supply; a third water-tight plug arranged on the first sealing cover, the third water-tight plug is used for connecting with an upper computer.

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