Display module and display device

Abstract

The display module and the display device are provided in the present disclosure, and relate to the field of display. The display module comprises a display panel, a first circuit board and a second circuit board. The first circuit board is connected with the display panel, and the first circuit board comprises a first wire bonding area, and a plurality of first wire bonding terminals are arranged on the first wire bonding area; a first metal layer of the first circuit board is formed with the plurality of first wire bonding terminals; the second circuit board is connected with the display panel, and the second circuit board comprises a second wire bonding area, and a plurality of second wire bonding terminals are arranged on the second wire bonding area; a second metal layer of the second circuit board is formed with the plurality of second wire bonding terminals. Wherein, the first circuit board and the second circuit board have an overlapping area, the first wire bonding area and the second wire bonding area are located in the overlapping area, and the plurality of first wire bonding terminals and the plurality of second wire bonding terminals are connected one by one. The display module provided in the present disclosure optimizes the thickness of the module.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, and more specifically, to a display module and a display device. Background Technology

[0002] With the increasing popularity of wearable products, consumers are increasingly favoring thinner and lighter designs. Currently, the mainstream wearable products on the market are around 1 to 2 inches in size, requiring a lightweight and compact overall design, which in turn places higher demands on MDL screens.

[0003] It should be noted that the information disclosed in the background section above is only used to enhance the understanding of the background of this disclosure, and therefore may include information that does not constitute prior art known to those skilled in the art. Summary of the Invention

[0004] The purpose of this disclosure is to provide a display module and display device that improve the compactness of the display module.

[0005] According to one aspect of the present disclosure, a display device is provided, the display device comprising:

[0006] Display panel;

[0007] A first circuit board is connected to the display panel. The first circuit board includes a first trace overlap area, and a plurality of first trace overlap terminals are provided on the first trace overlap area. The first circuit board includes a first substrate and a first metal layer located on at least one side of the first substrate, and the plurality of first trace overlap terminals are formed on the first metal layer.

[0008] The second circuit board is connected to the display panel. The second circuit board includes a second trace overlap area, and a plurality of second trace overlap terminals are provided on the second trace overlap area. The second circuit board includes a second substrate and a second metal layer located on at least one side of the second substrate, and the plurality of second trace overlap terminals are formed on the second metal layer.

[0009] The first circuit board and the second circuit board have an overlapping area, the first trace overlap area and the second trace overlap area are located in the overlapping area, and the plurality of first trace overlap terminals are connected to the plurality of second trace overlap terminals in a one-to-one correspondence.

[0010] In one exemplary embodiment of this disclosure, the first circuit board includes a first main body and a first lead portion. One end of the first lead portion is connected to the first main body, and the other end away from the first main body is provided with a wiring pin. The first trace overlap area is located on the first lead portion.

[0011] In one exemplary embodiment of this disclosure, the first main body portion of the first circuit board and the second circuit board have no overlapping portion.

[0012] In one exemplary embodiment of this disclosure, the first circuit board further includes a first common ground overlap area, and the first common ground overlap area is provided with at least one first common ground overlap terminal;

[0013] The second circuit board also includes a second common ground overlap area, and the second common ground overlap area is provided with at least one second common ground overlap terminal;

[0014] The first common ground overlap area and the second common ground overlap area are located in the overlapping area, and the at least one first common ground overlap terminal is correspondingly connected to the at least one second common ground overlap terminal.

[0015] In one exemplary embodiment of this disclosure, the first common grounding terminal and the second common grounding terminal are connected by conductive adhesive.

[0016] In an exemplary embodiment of this disclosure, the first circuit board includes a first main body, a first lead portion, and a second lead portion. One end of the first lead portion is connected to the first main body, and the other end away from the first main body is provided with a wiring pin. The second lead portion is connected to the first main body. The first trace overlap area is located on the first lead portion, and the first ground overlap area is located on the second lead portion.

[0017] In one exemplary embodiment of this disclosure, the second lead portion is connected to the first lead portion and is connected to the first body portion through the first lead portion.

[0018] In one exemplary embodiment of this disclosure, the second circuit board includes a second body portion and a third lead portion, wherein the third lead portion extends in the same direction as the first lead portion.

[0019] In one exemplary embodiment of this disclosure, the first lead portion crosses the third lead portion, and the portion crossing the third lead portion is entirely located on the third lead portion.

[0020] In an exemplary embodiment of this disclosure, the plurality of first wiring overlap terminals and the plurality of second wiring overlap terminals are arranged at intervals along a preset direction. The first wiring overlap area and the second wiring overlap area are connected by an adhesive layer. The adhesive layer includes a plurality of conductive portions arranged along the preset direction and insulating portions that insulate the plurality of conductive portions. The corresponding first wiring overlap terminals and second wiring overlap terminals are connected by the conductive portions.

[0021] In an exemplary embodiment of this disclosure, along the preset direction, the width of the conductive portion between the first trace overlap terminal and the second trace overlap terminal is not greater than the width between the first trace overlap terminal and the second trace overlap terminal.

[0022] In an exemplary embodiment of this disclosure, along the preset direction, the spacing between adjacent first trace overlap terminals and the spacing between adjacent second trace overlap terminals are both smaller than the spacing between corresponding adjacent conductive portions.

[0023] In one exemplary embodiment of this disclosure, the first circuit board is a display flexible circuit board, and the second circuit board is a touch flexible circuit board.

[0024] According to one aspect of the present disclosure, a display device is provided, the display device including the display module described in any of the above embodiments.

[0025] The display module disclosed herein, when comprising multiple circuit boards, has an overlapping area between adjacent circuit boards. By setting an overlap area on the two circuit boards, the portions of the two circuit boards with at least an overlap area are overlapped together, thereby allowing the first trace overlap area and the second trace overlap area to overlap. This enables the first trace overlap terminal on the first trace overlap area to conduct with the second trace overlap terminal on the second trace overlap area. In other words, the two circuit boards can be led out and connected to the entire device through a single connector, avoiding the need for ZIF connectors. The structural height at the connection point between the first and second circuit boards can be reduced by 0.45mm to 0.65mm compared to the ZIF connector height. Furthermore, it avoids the need for additional tape for fixation when warping occurs due to ZIF connectors, further reducing the structural height at the connection point between the first and second circuit boards. This allows for a relatively thinner display panel, freeing up more design space for the entire display device using this module. In addition, it saves tape material, eliminates the tape application process, and reduces production costs.

[0026] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0027] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure. It is obvious that the drawings described below are merely some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort. In the drawings:

[0028] Figure 1 This is a schematic diagram showing the lead-out of the flexible circuit board and the touch flexible circuit board in the related technologies provided in this disclosure;

[0029] Figure 2 for Figure 1 A schematic diagram of the flexible touch circuit board;

[0030] Figure 3 This is a schematic diagram showing another flexible display circuit board and a flexible touch circuit board in the related technologies provided in this disclosure;

[0031] Figure 4 for Figure 3 A schematic diagram of the flexible touch circuit board;

[0032] Figure 5 This is a schematic diagram showing another display flexible circuit board and a touch flexible circuit board in the related technologies provided in this disclosure;

[0033] Figure 6 This is a schematic diagram showing the warping of the insertion lead portion of the touch flexible circuit board in the related technology provided in this disclosure;

[0034] Figure 7 A schematic diagram showing the lead-out of a first circuit board and a second circuit board provided in one embodiment of this disclosure;

[0035] Figure 8 for Figure 7 A schematic diagram of the first circuit board in the middle;

[0036] Figure 9 A schematic diagram of a first wiring overlap terminal provided in one embodiment of this disclosure;

[0037] Figure 10 for Figure 7 A schematic diagram of the second circuit board;

[0038] Figure 11 A schematic diagram of a second wiring overlap terminal provided in one embodiment of this disclosure;

[0039] Figure 12 for Figure 7 Sectional view of plane AA;

[0040] Figure 13 A schematic diagram of an adhesive layer provided in one embodiment of this disclosure;

[0041] Figure 14 for Figure 7 Sectional view of the middle BB surface;

[0042] Figure 15 A schematic diagram showing the lead-out of a first circuit board and a second circuit board provided for another embodiment of this disclosure.

[0043] Explanation of reference numerals in the attached figures:

[0044] 110. First circuit board; 111. First main body; 112. First lead portion; 1121. First trace overlap area; 113. Second lead portion; 1131. First ground overlap area; 114. First trace overlap terminal; 115. Wiring pin;

[0045] 120. Second circuit board; 121. Second main body; 1211. Second trace overlap area; 1212. Second ground overlap area; 122. Third lead part; 123. Second trace overlap terminal;

[0046] 130. Flip-chip film; 140. Device area; 150. Adhesive layer; 151. Conductive part; 152. Insulating part;

[0047] 210. Cover plate; 220. Optical adhesive layer; 230. Polarizing layer; 240. Display layer; 250. Heat dissipation layer. Detailed Implementation

[0048] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this disclosure will be more thorough and complete, and will fully convey the concept of the exemplary embodiments to those skilled in the art.

[0049] Furthermore, the described features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. Numerous specific details are provided in the following description to give a thorough understanding of embodiments of this disclosure. However, those skilled in the art will recognize that the technical solutions of this disclosure can be practiced without one or more of the specific details, or other methods, components, apparatuses, steps, etc., can be employed. In other instances, well-known methods, apparatuses, implementations, or operations are not shown or described in detail to avoid obscuring aspects of this disclosure. The block diagrams shown in the accompanying drawings are merely functional entities and do not necessarily correspond to physically independent entities. That is, these functional entities can be implemented in software, or in one or more hardware modules or integrated circuits, or in different network and / or processor devices and / or microcontroller devices.

[0050] Although relative terms such as "up" and "down" are used in this specification to describe the relative relationship of one component of an icon to another, these terms are used only for convenience, such as according to the orientation of the examples shown in the accompanying drawings. It is understood that if the device of the icon is flipped upside down, the component described as "up" will become the component described as "down." When a structure is "up" of another structure, it may mean that the structure is integrally formed on the other structure, or that the structure is "directly" mounted on the other structure, or that the structure is "indirectly" mounted on the other structure through another structure.

[0051] The terms “a,” “one,” “the,” and “at least one” are used to indicate the existence of one or more elements / components / etc.; the terms “including” and “having” are used to indicate an open-ended inclusion and to mean that there may be other elements / components / etc. in addition to the listed elements / components / etc.; the terms “first,” “second,” etc. are used only as markers and are not a limitation on the number of objects.

[0052] Currently, mainstream wearable products on the market are around one to two inches in size, requiring a lightweight and compact overall design, which in turn places increasingly higher demands on MDL (ultra-thin module) screens. Current mass-produced module designs include... Figures 1-6 As shown, it has the following four problems:

[0053] I. For example Figure 1 As shown, the TFPC (Touch Flexible Printed Circuit) 120′ and MFPC (Main Flexible Printed Circuit) 110′ have dual connectors (wiring pins) leading out and connecting to the whole machine, with the connector height ranging from 0.65mm to 0.8mm;

[0054] II. Figure 3 As shown, when TFPC 120′ and MFPC 110′ are connected to the main unit via a Connect connector, TFPC 120′ and MFPC 110′ require ZIF (Zero-Insertion Force) connection. The height of the connection structure is between 0.45mm and 0.65mm, occupying space in the main unit. Figure 5 As shown, in order to ensure the reliability of ZIF plug-in, the connection part of TFPC120′ needs to be designed with "U" and "S" shapes, which makes TFPC120′ prone to warping. Mass production projects usually fix it by applying additional tape to the warped part on the back of TFPC120′.

[0055] Third, as wearable products become increasingly feature-rich, they require higher electromagnetic shielding performance, necessitating modules with a certain level of anti-static capability. Typically, MFPC 110′ and TFPC 120′ need to share a common ground. Current grounding methods involve creating openings outside the MFPC 110′ and TFPC 120′ traces and connecting them with conductive cloth, the thickness of which is 0.05mm to 0.1mm.

[0056] Fourth, the overall design has limited space, and the screen connector is generally positioned at the "3 o'clock" and "9 o'clock" positions. If... Figure 6 The "6 o'clock" position shown indicates that there will be more limiting factors.

[0057] To address the aforementioned technical problems, embodiments of this disclosure provide a display module, such as... Figures 7-12 As shown, the display module includes a display panel, a first circuit board 110, and a second circuit board 120. The first circuit board 110 is connected to the display panel and includes a first trace overlap area 1121, on which a plurality of first trace overlap terminals 114 are provided; the second circuit board 120 is connected to the display panel and includes a second trace overlap area 1211, on which a plurality of second trace overlap terminals 123 are provided.

[0058] The first circuit board 110 includes a first substrate and a first metal layer located on at least one side of the first substrate. The first metal layer has a plurality of first trace overlap terminals 114, that is, the first trace overlap terminals 114 can be exposed copper on the first circuit board 110. The second circuit board 120 includes a second substrate and a second metal layer located on at least one side of the second substrate. The second metal layer has a plurality of second trace overlap terminals 123, that is, the second trace overlap terminals 123 can be exposed copper on the second circuit board 120.

[0059] The first circuit board 110 and the second circuit board 120 have overlapping areas, the first trace overlap area 1121 and the second trace overlap area 1211 are located in the overlapping area, and a plurality of first trace overlap terminals 114 and a plurality of second trace overlap terminals 123 are connected in a one-to-one correspondence.

[0060] The display module provided in this disclosure, when having multiple circuit boards, has an overlapping area between two adjacent circuit boards. By setting a copper-exposed overlap area on the metal layer of the two circuit boards, the portions of the two circuit boards with at least an overlap area are overlapped together, thereby making the first trace overlap area 1121 overlap with the second trace overlap area 1211. This allows the first trace overlap terminal 114 on the first trace overlap area 1121 to conduct with the second trace overlap terminal 123 on the second trace overlap area 1211. In other words, the two circuit boards can be led out and overlapped with the whole machine through a connector, and avoids the need for ZIF plugging. The structural height at the connection between the first circuit board 110 and the second circuit board 120 can be reduced by 0.45mm to 0.65mm relative to the ZIF plugging height. At the same time, it also avoids the need to attach additional tape for fixation when warping occurs due to ZIF plugging, further reducing the structural height at the connection between the first circuit board 110 and the second circuit board 120, so that the thickness of the display panel can be relatively reduced, freeing up more design space for the display device using this display module. In addition, it saves on tape material, eliminates the tape application process, and reduces production costs.

[0061] Specifically, the first circuit board 110 can be a display flexible circuit board (MPCB), and the second circuit board 120 can be a touch flexible circuit board (TFPC). Among them, Figure 7 and Figure 15 A bottom view of a display module is provided, i.e., a rear view of the display module. The flexible display circuit board and the display panel can be connected via a chip-on-film (COF) 130 on which a driver chip (IC) is disposed. Below, this disclosure provides a detailed description of the first circuit board 110 and the second circuit board 120, using the flexible display circuit board and the flexible touch circuit board as examples.

[0062] Among them, such as Figure 8 As shown, the flexible display circuit board includes a first main body 111 and a first lead portion 112. One end of the first lead portion 112 is connected to the first main body 111, and the other end away from the first main body 111 is provided with a connector 115. By placing the first trace overlap area 1121 on the first lead portion 112, the first trace overlap area 1121 can be avoided from occupying the layout space of the flexible display circuit board. By overlapping the first lead portion 112 with the touch flexible circuit board, the first trace overlap terminal 114 and the second trace overlap terminal 123 can be connected.

[0063] Among them, such as Figure 7As shown, the first main body 111 of the display flexible circuit board and the touch flexible circuit board do not overlap. By connecting the first trace overlap terminal 114 to the second trace overlap terminal 123 on the second trace overlap area 1211, the first lead portion 112 overlaps with the touch flexible circuit board, thus achieving the connection between the first trace overlap terminal 114 and the second trace overlap terminal 123, thereby ensuring that the first main body 111 of the display flexible circuit board and the touch flexible circuit board do not overlap.

[0064] The first trace overlap terminal 114 can be a copper leak on the flexible display circuit board, and the second trace overlap terminal 123 can be a copper leak on the flexible display circuit board.

[0065] Specifically, such as Figure 7 As shown, the flexible display circuit board also includes a first common ground overlap area 1131, on which at least one first common ground overlap terminal is provided; the touch flexible circuit board also includes a second common ground overlap area 1212, on which at least one second common ground overlap terminal is provided; the first common ground overlap area 1131 and the second common ground overlap area 1212 are located in an overlapping area, and at least one first common ground overlap terminal is correspondingly connected to at least one second common ground overlap terminal. The first common ground overlap terminal on the first common ground overlap area 1131 and the second common ground overlap terminal on the second common ground overlap area 1212 are connected and conductive, avoiding the need for additional conductive tape for conductivity, saving conductive tape material, eliminating the conductive tape application process, and reducing production costs.

[0066] Among them, such as Figure 14 As shown, the first common ground connection terminal and the second common ground connection terminal are connected through the conductive part 151 of the adhesive layer 150, and the conductive part 151 can be conductive adhesive. The first common ground connection terminal and the second common ground connection terminal are directly connected through conductive adhesive, which allows for tighter contact and better contact effect, thereby improving the anti-static effect of the display flexible circuit board and the touch flexible circuit board.

[0067] The first common ground connection terminal can be exposed copper on the display flexible circuit board, and the second common ground connection terminal can be exposed copper on the touch flexible circuit board.

[0068] Specifically, such as Figure 8As shown, the flexible display circuit board includes a first main body 111, a first lead portion 112, and a second lead portion 113. One end of the first lead portion 112 is connected to the first main body 111, and the other end away from the first main body 111 is provided with a wiring pin 115. The second lead portion 113 is connected to the first main body 111. A first trace overlap area 1121 is located on the first lead portion 112, and a first common ground overlap area 1131 is located on the second lead portion 113. By placing the first common ground overlap area 1131 on the second lead portion 113, the first common ground overlap area 1131 can be avoided from occupying the layout space of the flexible display circuit board. By overlapping the second lead portion 113 with the touch flexible circuit board, the first common ground overlap terminal and the second common ground overlap terminal can be made conductive.

[0069] Among them, such as Figure 8 As shown, the second lead portion 113 is connected to the first lead portion 112, and is connected to the first main body portion 111 through the first lead portion 112. That is, the second lead portion 113 can be a part extending from the first lead portion 112, which facilitates the arrangement of the first common overlap area 1131 on the lead portion. Of course, the second lead portion 113 can also be directly connected to the first main body portion 111, and this disclosure does not limit this.

[0070] Among them, such as Figure 15 As shown, the touch flexible circuit board includes a second main body 121 and a third lead portion 122. The first lead portion 112 and the third lead portion 122 extend in the same direction, for example, both extending from the "6 o'clock" position. This allows the connector position to be reasonably adjusted and optimized according to the overall device position, making the connector position more flexible. In other embodiments, such as... Figure 3 As shown, the first lead portion 112 and the third lead portion 122 extend in different directions. The first lead portion 112 extends from the "9 o'clock" position, and the second lead portion 113 extends from the "6 o'clock" position. This disclosure does not limit this.

[0071] Wherein, the first lead portion 112 and the third lead portion 122 extend in the same direction. When the first lead portion 112 crosses the third lead portion 122, and the portion that crosses the third lead portion 122 is completely located on the third lead portion 122, that is, the orthogonal projection of the first lead portion 112 on the third lead portion 122 is completely located in the third lead portion 122, it is possible to make the display flexible circuit board and the touch flexible circuit board more compactly arranged in the whole machine, saving space.

[0072] Specifically, such as Figures 9-13As shown, a plurality of first wiring overlap terminals 114 are arranged at intervals along a preset direction, and a plurality of second wiring overlap terminals 123 are arranged at intervals along a preset direction. The first wiring overlap area 1121 and the second wiring overlap area 1211 are connected by an adhesive layer 150. The adhesive layer 150 includes a plurality of conductive parts 151 arranged along the preset direction and insulating parts 152 that insulate the plurality of conductive parts 151 at intervals. The corresponding first wiring overlap terminals 114 and second wiring overlap terminals 123 are connected by conductive parts 151.

[0073] The flexible display circuit board can be equipped with ten first trace connection terminals 114, which can be GND, TP_INT, GND, SDA, SCL, GND, TP_Reset, GND, TP_AVDD, and GND respectively. The touch flexible circuit board can be equipped with ten second trace connection terminals 123, which can be GND, TP_INT, GND, SDA, SCL, GND, TP_Reset, GND, TP_AVDD, and GND respectively. GND serves to block external static electricity interference to the circuit; TP_INT is the TP function PIN; GND prevents static electricity from interfering with adjacent signals; SDA, SCL, and TP_Reset are TP function PINs (the TP function PINs can be adjusted according to the actual PC wiring); and TP_AVDD is the power supply.

[0074] Among them, such as Figures 9-13 As shown, along a preset direction, the width of the first trace overlap terminal 114 is W1, the width of the second trace overlap terminal 123 is W2, and the width of the conductive portion 151 between the relatively connected first trace overlap terminal 114 and second trace overlap terminal 123 is W3, where W3≤W1 and W3≤W2. That is, the width of the conductive portion 151 is not greater than the width of the first trace overlap terminal 114 and the second trace overlap terminal 123. The conductive portion 151 ensures normal circuit conduction, and limiting the width of the conductive portion 151 simultaneously prevents short circuits between circuits. For example, W1 = 0.25mm~0.30mm, W2 = 0.25mm~0.30mm, and W3 = 0.20mm~0.25mm. Preferably, W1 = W2, that is, the widths of the corresponding first trace overlap terminal 114 and the second trace overlap terminal 123 can be the same, so that the corresponding first trace overlap terminal 114 and the second trace overlap terminal 123 can be aligned and then connected through the conductive part 151; of course, W1 can also be larger or smaller than W2, and this disclosure does not limit it.

[0075] Among them, such as Figures 9-13As shown, along a preset direction, the spacing between adjacent first trace overlap terminals 114 is S1, the spacing between adjacent second trace overlap terminals 123 is S2, and the spacing between adjacent conductive parts 151 is S3, where S3 ≥ S1 and S3 ≥ S2. That is, the spacing between two adjacent conductive parts 151 is greater than the spacing between the two first trace overlap terminals 114 connected to those two conductive parts 151, and the spacing between the two second trace overlap terminals 123 connected to those two conductive parts 151, ensuring that no short circuit occurs between the circuits. For example, S1 = 0.20mm~0.35mm, S2 = 0.20mm~0.25mm, and S3 = 0.25mm~0.30mm.

[0076] Specifically, such as Figure 14 As shown, the display panel includes a cover plate (CG) 210, an optical adhesive layer (OCA) 220, a polarizing layer (POL) 230, a display layer (PNL) 240, and a heat dissipation layer (SCF) 250, which are stacked sequentially. The display panel can be an organic light-emitting diode (OLED) display panel, a liquid crystal display (LCD) panel, or other types of display panels; this disclosure does not limit the types.

[0077] The heat dissipation layer 250 can be bonded together with the display flexible circuit board and the touch flexible circuit board using non-conductive adhesive to fix the display flexible circuit board and the touch flexible circuit board.

[0078] Specifically, this disclosure provides, as follows Figure 10 The overlapping scheme of the display flexible circuit board and the touch flexible circuit board shown is as follows: Figure 2 and Figure 4 The mass production solutions shown all have improved layout utilization, which is expected to increase by 10% to 15%, thus greatly saving costs.

[0079] Specifically, such as Figure 15 As shown, the flexible circuit board and the touch flexible circuit board also have a device area 140 for connecting various target devices.

[0080] Embodiments of this disclosure also provide a display device including the aforementioned display module. The display device can be a wearable device, such as a watch or bracelet, or a device with a display module, such as a monitor. The beneficial effects of this display device are detailed in the description of the beneficial effects of the aforementioned display module, and will not be repeated here.

[0081] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the following claims.

[0082] It should be understood that this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims.

Claims

1. A display module, characterized in that, include: Display panel; A first circuit board is connected to the display panel. The first circuit board includes a first trace overlap area, and a plurality of first trace overlap terminals are provided on the first trace overlap area. The first circuit board includes a first substrate and a first metal layer located on at least one side of the first substrate, and the plurality of first trace overlap terminals are formed on the first metal layer. The second circuit board is connected to the display panel. The second circuit board includes a second trace overlap area, and a plurality of second trace overlap terminals are provided on the second trace overlap area. The second circuit board includes a second substrate and a second metal layer located on at least one side of the second substrate, and the plurality of second trace overlap terminals are formed on the second metal layer. Wherein, the first circuit board and the second circuit board have an overlapping area, the first trace overlap area and the second trace overlap area are located in the overlapping area, and the plurality of first trace overlap terminals are connected to the plurality of second trace overlap terminals in a one-to-one correspondence. The first circuit board further includes a first common ground overlap area, on which at least one first common ground overlap terminal is provided; the second circuit board further includes a second common ground overlap area, on which at least one second common ground overlap terminal is provided; the first common ground overlap area and the second common ground overlap area are located in the overlapping area, and the at least one first common ground overlap terminal is correspondingly connected to the at least one second common ground overlap terminal.

2. The display module according to claim 1, characterized in that, The first circuit board includes a first main body and a first lead portion. One end of the first lead portion is connected to the first main body, and the other end away from the first main body is provided with a wiring pin. The first trace overlap area is located on the first lead portion.

3. The display module according to claim 2, characterized in that, The first main body portion of the first circuit board and the second circuit board have no overlapping portion.

4. The display module according to claim 1, characterized in that, The first common ground connection terminal and the second common ground connection terminal are connected by conductive adhesive.

5. The display module according to claim 1, characterized in that, The first circuit board includes a first main body, a first lead portion, and a second lead portion. One end of the first lead portion is connected to the first main body, and the other end away from the first main body is provided with a wiring pin. The second lead portion is connected to the first main body. The first trace overlap area is located on the first lead portion, and the first ground overlap area is located on the second lead portion.

6. The display module according to claim 5, characterized in that, The second lead portion is connected to the first lead portion and is connected to the first main body portion through the first lead portion.

7. The display module according to claim 2, characterized in that, The second circuit board includes a second main body and a third lead portion, wherein the third lead portion extends in the same direction as the first lead portion.

8. The display module according to claim 7, characterized in that, The first lead portion crosses the third lead portion, and the portion that crosses the third lead portion is completely located on the third lead portion.

9. The display module according to claim 1, characterized in that, The plurality of first trace overlap terminals are arranged at intervals along a preset direction, and the plurality of second trace overlap terminals are arranged at intervals along the preset direction. The first trace overlap area and the second trace overlap area are connected by an adhesive layer. The adhesive layer includes a plurality of conductive parts arranged along the preset direction and insulating parts that insulate the plurality of conductive parts. The corresponding first trace overlap terminals and second trace overlap terminals are connected by the conductive parts.

10. The display module according to claim 9, characterized in that, Along the preset direction, the width of the conductive portion between the first trace overlap terminal and the second trace overlap terminal is not greater than the width between the first trace overlap terminal and the second trace overlap terminal.

11. The display module according to claim 9, characterized in that, Along the preset direction, the spacing between adjacent first trace overlap terminals and the spacing between adjacent second trace overlap terminals are both smaller than the spacing between corresponding adjacent conductive parts.

12. The display module according to claim 1, characterized in that, The first circuit board is a display flexible circuit board, and the second circuit board is a touch flexible circuit board.

13. A display device, characterized in that, Includes the display module as described in any one of claims 1 to 12.

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