A miniaturized transceiver integrated antenna and its application

Abstract

The present invention discloses a miniaturized transceiver integrated antenna in the field of antennas and its application. The antenna includes three layers of printed circuit boards. A hollow structure is provided in the middle of the first layer of printed circuit boards. Transmitting radiation patches and receiving radiation patches are provided at opposite ends of the hollow structure, respectively. A number of metallized vias and blind holes are provided around the radiation patches. The lower surfaces of the second layer of printed circuit boards and the third layer of printed circuit boards are provided with metal grounds, and the metal grounds on the lower surface of the second layer of printed circuit boards serve as the grounding surface of the antenna, and a cavity-like body is formed between the two metal grounds. The antenna adopts a structure combining metallized vias and blind holes, which helps to miniaturize the antenna. The hollow structure of the printed circuit board, the special distribution of metallized vias and blind holes, and the principle of energy cancellation between metal ground layers help to improve the isolation of the antenna. The above design can achieve antenna miniaturization, high isolation, transceiver integration and other performances, so that the antenna can be applied to miniaturized transceiver integrated microsystems.

Description

Technical Field

[0001] The present invention relates to the field of antenna technology, and in particular to a miniaturized transceiver integrated antenna and applications thereof. Background Art

[0002] With the development of wireless technology, the integration level of modern communication systems is constantly improving. Various miniaturized antennas are increasingly used in devices with limited space. Antennas are required to have simple structures, integrated transceivers, and high isolation to support more functions and application scenarios and reduce system complexity and design costs. However, current antenna designs are difficult to achieve high isolation and simple structure while being miniaturized and integrated. Summary of the invention

[0003] The purpose of the present invention is to provide a miniaturized transceiver integrated antenna and its application, which adopts a printed circuit board hollow structure, a special distribution method of metallized vias and blind holes, and the principle of energy coupling cancellation between metal strata, thereby solving the problem that the existing antenna design is difficult to achieve high isolation and simple structural design while having miniaturization and transceiver integration.

[0004] The present invention achieves the above-mentioned purpose through the following technical solutions:

[0005] A miniaturized transceiver integrated antenna comprises three layers of printed boards arranged in sequence from top to bottom, wherein: a first layer of printed boards is provided with a hollow structure in the middle, a transmitting radiation patch and a receiving radiation patch are respectively provided on the upper surfaces of opposite ends of the hollow structure, both radiation patches are connected with a coaxial feeding structure, and a number of metallized vias and blind holes are provided around the radiation patches; a metal ground is provided on the lower surfaces of the second layer of printed boards and the third layer of printed boards, and the metal ground on the lower surface of the second layer of printed boards serves as the grounding surface of the antenna, and a cavity-like body is formed between the two metal grounds.

[0006] A further improvement is that the printed circuit boards of the antennas are all rectangular, and the two radiation patches are rectangles of the same size.

[0007] A further improvement is that the hollow structure is rectangular and is formed by truncated cutting at the middle of the first layer of printed circuit board.

[0008] A further improvement is that the two radiating patches are located at non-central positions of the first layer of printed circuit board, the coaxial feeding structures of the two radiating patches are located at non-central positions of the corresponding radiating patches, and the radiating patches and the coaxial feeding structures deviate in the same direction.

[0009] A further improvement is that the diameters and spacings of the metallized vias and blind holes around the radiation patch are consistent and together form a rectangular fully enclosing fence, while the metallized vias and blind holes in the fence are asymmetrically distributed, wherein the metallized vias surround the side edges corresponding to the deviation direction of the radiation patch, most of the outer edge, and a small part of the inner edge, and the blind holes surround the remaining side edges.

[0010] A further improvement is that the overall height of the metallized via is from the radiation patch on the upper surface of the first layer of printed circuit board to the metal ground on the lower surface of the second layer of printed circuit board, and the overall height of the blind hole is from the radiation patch on the upper surface of the first layer of printed circuit board to the lower surface of the first layer of printed circuit board.

[0011] A further improvement is that the metal grounds on the lower surfaces of the second layer of printed boards and the third layer of printed boards are provided with circular windows around the coaxial feeding structure.

[0012] A further improvement is that the printed board is composed of a double-layer dielectric substrate, a double-layer prepreg sandwiched between the double-layer dielectric substrate, and copper layers etched on the front and back surfaces of the dielectric substrate.

[0013] The present invention also provides an application of a miniaturized transceiver integrated antenna, wherein the application is to deploy the miniaturized transceiver integrated antenna as a terminal antenna of a microsystem, thereby miniaturizing the overall device and achieving high integration and multi-functional communication.

[0014] The beneficial effects of the present invention are as follows: the miniaturized transceiver integrated antenna adopts a simple three-layer printed circuit board to realize the integrated design of the transceiver antenna; the introduction of blind holes and metallized vias helps to realize the miniaturization of the antenna; the use of a printed circuit board hollow structure, a special distribution method of metallized vias and blind holes, and the principle of energy cancellation between metal strata helps to improve the antenna isolation; the lower part of the antenna can be integrated with a multi-layer dielectric board to facilitate integration with the circuit; the above advantages combined make the antenna particularly suitable for the deployment of miniaturized transceiver microsystems. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A three-dimensional diagram of the unit structure of a miniaturized transceiver integrated antenna;

[0016] Figure 2 A front view of the unit structure of a miniaturized transceiver integrated antenna;

[0017] Figure 3 A top view of the unit structure of a miniaturized transceiver integrated antenna;

[0018] Figure 4 A radiating patch structure for a miniaturized transceiver integrated antenna;

[0019] Figure 5 A metal ground structure provided on the lower surface of the second printed circuit board of a miniaturized transceiver integrated antenna;

[0020] Figure 6 A metal ground structure provided on the lower surface of the third printed circuit board of the miniaturized transceiver integrated antenna;

[0021] Figure 7 Simulation results of return loss and isolation between the miniaturized transceiver integrated antenna and the transceiver antenna;

[0022] Figure 8 The radiation pattern of the miniaturized integrated transceiver antenna at 10.625 GHz.

[0023] Fig. 9 Radiation pattern of the miniaturized integrated transceiver antenna at 10.625 GHz in the yz plane;

[0024] In the figure: 1. Radiating patch; 2. Blind hole; 3. Metallized via; 4. Hollow structure; 5. Cavity-like structure; 6. Coaxial feeding structure; 7. Fence; 8. Round window. DETAILED DESCRIPTION

[0025] The present application is further described in detail below in conjunction with the accompanying drawings. It is necessary to point out here that the following specific implementation methods are only used to further illustrate the present application and cannot be understood as limiting the scope of protection of the present application. Technical personnel in this field can make some non-essential improvements and adjustments to the present application based on the above application content.

[0026] Example 1

[0027] like Figure 1-6 As shown, a miniaturized transceiver integrated antenna includes three layers of printed boards arranged in sequence from top to bottom, wherein: a hollow structure 4 is provided in the middle of the first layer of printed boards, and a transmitting radiation patch 1 and a receiving radiation patch 1 are provided on the upper surfaces of the opposite ends of the hollow structure 4, respectively. The two radiation patches 1 are connected to a coaxial feeding structure 6 for antenna excitation, and the transceiver antennas are respectively arranged at both ends of the printed boards, symmetrically distributed. The introduction of the hollow structure 4 further divides the transceiver antennas, and enhances the isolation of the antenna to a certain extent. A number of metalized vias 3 and blind holes 2 are provided around the radiation patch 1; a metal ground is provided on the lower surface of the second layer of printed boards and the third layer of printed boards, and the metal ground on the lower surface of the second layer of printed boards is used as the grounding surface of the antenna, and a cavity-like body 5 is formed between the two metal grounds, which functions to make the bottom traveling wave energy cancel each other in a limited space. The structure used is very simple, and only a layer of metal ground is added below the antenna grounding surface, and the mutual cancellation of the traveling wave energy of the lower layer is used to weaken the mutual coupling of the transceiver integrated antenna, thereby achieving the purpose of high isolation.

[0028] In the present invention, the printed circuit boards of the antennas are all rectangular, and the two radiation patches 1 are rectangles of the same size, which may be squares in certain cases, and are distributed on both sides of the hollow structure 4. The lower surface of the antenna can be used for antenna integration design.

[0029] In the present invention, the hollow structure 4 is rectangular, and the hollow structure 4 is formed by truncated cutting in the middle of the first layer of printed circuit board. For example, if the size of the entire antenna is 6mm×10mm, the size of the transmitting radiation patch 1 and the receiving radiation patch 1 are 6mm×3.5mm respectively, then the size of the hollow structure 4 is 6mm×3mm. The hollow structure 4 is only provided on the first layer of printed circuit board, and the other two layers of printed circuit boards have no special design.

[0030] In the present invention, the diameters and intervals of the metallized vias 3 and the blind holes 2 around the radiation patch 1 are consistent and together form a rectangular fully enclosing fence 7, while the numbers of the metallized vias 3 and the blind holes 2 in the fence 7 are different and are asymmetrically distributed, and their number and arrangement are designed in a special way. Observing from the top of the left antenna in the figure, the upper and lower horizontal rows are respectively provided with metallized vias 3 and blind holes 2, the number of metallized vias 3 in the left vertical row is greater than the number of blind holes 2, and the number of metallized vias 3 in the right vertical row is less than the number of blind holes 2, and the left and right antennas are symmetrically distributed about the central axis.

[0031] In the present invention, two radiation patches 1 are located at non-central positions of the first layer of printed circuit boards, and the coaxial feeding structures 6 of the two radiation patches 1 are located at non-central positions of the corresponding radiation patches 1, and the radiation patches and the coaxial feeding structures deviate in the same direction. The reason for the deviation design is mainly due to the asymmetric structure caused by the special design of the metallized vias 3 and the blind holes 2, wherein the metallized vias 3 surround the side edges corresponding to the deviation direction of the radiation patches 1, the majority of the outer edges, and the small portion of the inner edges, and the blind holes 2 surround the remaining side edges. In addition, the coaxial feeding probe of the coaxial feeding structure 6 is a metal cylindrical probe or a metallized via 3 that passes through the first layer to the third layer of printed circuit boards.

[0032] In the present invention, the height of the metallized via 3 is different from the height of the blind hole 2, wherein the overall height of the metallized via 3 is from the radiation patch 1 on the upper surface of the first layer of printed circuit board to the metal ground on the lower surface of the second layer of printed circuit board, and the overall height of the blind hole 2 is from the radiation patch 1 on the upper surface of the first layer of printed circuit board to the lower surface of the first layer of printed circuit board.

[0033] In the present invention, there are differences in distribution and quantity between the blind holes 2 and the metallized vias 3. First, the introduction of the metallized vias 3 and the blind holes 2 directly leads to the ultra-miniaturization of the antenna, and the size of the radiation patch 1 is only one-tenth of the free space wavelength corresponding to the center frequency; secondly, there is a height difference between the blind holes 2 and the metallized vias 3, which makes the antenna resonant frequency flexible and adjustable; thirdly, the special arrangement of the blind holes 2 and the metallized vias 3 greatly enhances the isolation between the transmitting and receiving antennas, and greatly reduces the interference between the transmitting and receiving antennas.

[0034] In the present invention, the metal grounds on the lower surfaces of the second layer of printed boards and the third layer of printed boards are provided with round windows 8 around the coaxial feeding structure 6 to ensure smooth energy transmission.

[0035] In the present invention, the printed board is composed of a double-layer dielectric substrate, a double-layer prepreg sandwiched between the double-layer dielectric substrate, and copper layers etched on the front and back surfaces of the dielectric substrate.

[0036] The present invention can adopt the following implementation scheme in terms of specific dimensions:

[0037] like Figure 1 As shown, the dielectric substrates are all rectangular substrates with a side length of 6mm×10mm. From top to bottom, their thicknesses are 0.76mm, 0.2mm, and 0.2mm, respectively. The thickness of the semi-cured sheet is 0.08mm, and a double-layer cured sheet structure is adopted, i.e. 0.16mm. The metal coating including the radiation patch 1 is 0.035mm thick from top to bottom.

[0038] like Figure 1 As shown, the diameters of the three metal holes, the metallized via hole 3 and the blind hole 2 are all 0.2 mm, and the inner core diameter of the coaxial feeding structure 6 is 0.3 mm.

[0039] like Figure 5 , 6 As described above, the circular windows 8 on the two layers of metal ground have a diameter of 0.5 mm.

[0040] like Figure 7 As described above, the interval between the metallized via 3 and the blind via 2, the interval between the blind via 2 and the blind via 2, and the interval between the metallized via 3 and the metallized via 3 are all 0.4 mm.

[0041] like Figure 2 As described above, the height of the metallized via hole 3 is 1.19 mm, the height of the blind hole 2 is 0.795 mm, and the size of the hollow structure 4 is 3 mm×6 mm×0.92 mm.

[0042] like Figure 1 As shown, the overall size of the antenna is 6mm×10mm×1.585mm.

[0043] like Figure 7 As shown in the figure, it is the simulation result of the return loss of the miniaturized transceiver integrated antenna. It can be seen from the figure that the antenna unit has good return loss performance. In the 10.5-10.75GHz signal frequency band, S11 is less than -10dB, and in this signal frequency band, S12 is less than -20dB. The surface receiving and transmitting antennas have good isolation, which can effectively prevent crosstalk between the transmitting and receiving signals.

[0044] like Figure 8 and 9 As shown in the figure, it is the radiation pattern of the xz plane and the radiation pattern of the yz plane of the miniaturized transceiver integrated antenna at the frequency of 10.625 GHz. It can be seen from the figure that the radiation pattern of the antenna is somewhat deviated from the center position. This is due to the structure of the antenna itself. The reason for the relatively low gain is the energy cancellation in the cavity-like structure 5 in the lower part of the antenna, that is, the antenna sacrifices part of the gain while obtaining high isolation, but the advantage is greater than the disadvantage, which solves the problem that the existing antenna design is difficult to achieve high isolation and simple structural design while having miniaturization and transceiver integration.

[0045] Example 2

[0046] The present invention also provides an application of a miniaturized transceiver integrated antenna in a miniaturized transceiver integrated microsystem, wherein the application is to directly deploy the miniaturized transceiver integrated antenna as a terminal antenna of the microsystem to achieve high system integration and multifunctional applications. The antenna has a greatly reduced antenna size and miniaturized antenna due to the introduction of metallized vias 3 and blind holes 2; the introduction of a special arrangement of metallized vias 3 and blind holes 2 enables the antenna to have a high isolation characteristic; the designed cavity-like structure 5 also improves the antenna isolation, so the antenna unit has application value in the field of microsystem communications.

[0047] The above-mentioned embodiments only express several implementation methods of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the present invention. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention.

Claims

1. A miniaturized transceiver integrated antenna, characterized in that: The invention comprises three layers of printed boards arranged in sequence from top to bottom, wherein: a first layer of printed boards is provided with a hollow structure in the middle, a transmitting radiation patch and a receiving radiation patch are respectively provided on the upper surfaces of opposite ends of the hollow structure, both radiation patches are connected with a coaxial feeding structure, and a number of metallized vias and blind holes are provided around the radiation patches; a metal ground is provided on the lower surfaces of the second layer of printed boards and the third layer of printed boards, and the metal ground on the lower surface of the second layer of printed boards is used as the grounding surface of the antenna, and a cavity-like body is formed between the two metal grounds; The two radiation patches are located at non-central positions of the first layer of printed circuit board, the coaxial feeding structures of the two radiation patches are both located at non-central positions of the corresponding radiation patches, and the radiation patches and the coaxial feeding structures deviate in the same direction; The metallized vias and blind holes around the radiation patch form a rectangular fully enclosing fence, and the metallized vias and blind holes in the fence are asymmetrically distributed, wherein the metallized vias surround the side corresponding to the deviation direction of the radiation patch, most of the outer side and a small part of the inner side, and the blind holes surround the remaining side.

2. A miniaturized transceiver integrated antenna according to claim 1, characterized in that: The printed circuit boards of the antennas are all rectangular, and the two radiation patches are rectangles with the same size.

3. The miniaturized transceiver integrated antenna according to claim 2, characterized in that: The hollow structure is rectangular, and is formed by truncated cutting at the middle of the first layer of printed circuit board.

4. The miniaturized transceiver integrated antenna according to claim 1, characterized in that: The overall height of the metallized via is from the radiation patch on the upper surface of the first printed board to the metal ground on the lower surface of the second printed board, and the overall height of the blind hole is from the radiation patch on the upper surface of the first printed board to the lower surface of the first printed board.

5. The miniaturized transceiver integrated antenna according to claim 1, characterized in that: The metal grounds on the lower surfaces of the second layer of printed boards and the third layer of printed boards are both provided with round windows around the coaxial feeding structure.

6. The miniaturized transceiver integrated antenna according to claim 1, characterized in that: The printed board consists of a double-layer dielectric substrate, a double-layer prepreg sandwiched between the double-layer dielectric substrate, and copper layers etched on the front and back surfaces of the dielectric substrate.

7. An application of the miniaturized transceiver integrated antenna according to any one of claims 1 to 6, characterized in that: The application is to deploy a miniaturized transceiver integrated antenna as a terminal antenna for a microsystem.

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