A diamond composite sheet sintering process

Abstract

The invention provides a diamond composite sheet sintering process, and the sintering process comprises the following steps: primary sintering: placing diamond powder sprayed with a binder and a first group of cemented carbide substrates in a shielding tank of a placement component to form an assembly, sending the placement component into a high-pressure sintering synthesis chamber, sintering for 4-6 minutes in the high-pressure sintering synthesis chamber at a temperature of 1400-1450°C and a pressure of 5.0GPa, and then pushing the sintered placement component out of the high-pressure sintering synthesis chamber to dock with a rotating component; processing: opening the shielding tank of the placement component through the rotation of the rotating component and sending it into a wire cutting device. Compared with the prior art, the same step of processing can be performed on multiple groups at the same time through the cooperation of the rotating component and the placement component, and during the cutting, drying and grinding process, wheel-type processing can be performed, thereby improving the overall processing efficiency and reducing the time of intermediate transportation.

Description

Technical Field

[0001] The invention relates to the technical field of diamond composite sheet sintering, in particular to a diamond composite sheet sintering process. Background Art

[0002] Diamond composite sheet is made of diamond powder and cemented carbide substrate sintered under ultra-high pressure and high temperature conditions. It has the high hardness, high wear resistance and thermal conductivity of diamond, and the strength and impact toughness of cemented carbide. It is an ideal material for manufacturing cutting tools, drilling bits and other wear-resistant tools. Diamond composite sheet, also known as diamond and cemented carbide composite material, is made of 0.5-1.0mm thick diamond and several millimeters thick WC / Co (tungsten carbide / cobalt) cemented carbide substrate sintered under high temperature and high pressure. This material has the hardness and wear resistance of diamond, and has superior impact resistance due to the presence of cemented carbide substrate. It is an excellent composite material. It is widely used in the manufacture of oil drill bits, geological drill bits and cutting tools.

[0003] The prior art uses a double sintering process to prepare diamond composite sheets. During the preparation process, high-temperature calcination, cutting, pickling, drying and grinding are required, so the processing position needs to be frequently transferred, which has a great impact on the overall processing efficiency. Summary of the invention

[0004] In view of the shortcomings of the prior art, the purpose of the present invention is to provide a diamond composite sheet sintering process to solve the problems raised in the above-mentioned background technology. Through the cooperation of the rotating component and the placing component, multiple groups can be processed in the same step at the same time, and during the cutting, drying and grinding processes, wheel-type processing can be performed to improve the overall processing efficiency and reduce the time of intermediate transportation.

[0005] In order to achieve the above object, the present invention is implemented by the following technical scheme: a diamond composite sheet sintering process, the sintering process has the following steps:

[0006] (1) Primary sintering: The diamond powder sprayed with a binder and the first group of cemented carbide substrates are placed in a shielding tank of a placement component to form an assembly, and the placement component is sent into a high-pressure sintering synthesis chamber, where it is sintered for 4-6 minutes at a temperature of 1400-1450°C and a pressure of 5.0 GPa. The sintered placement component is then pushed out of the high-pressure sintering synthesis chamber and docked with the rotating component;

[0007] (2) Processing: By rotating the assembly, the shielding tank where the assembly is placed is opened and sent into the wire cutting equipment to cut off the first group of carbide substrates on the upper layer of the diamond composite sheet, and the diamond layer left on the lower layer is clamped and fixed. The rough diamond composite sheet is soaked in strong acid to remove the binder, washed with water 2-3 times, and then dried at high temperature by a drying fan;

[0008] (3) Rough finished product processing: The rough finished diamond composite sheet is sent to the grinding equipment station by the rotating component 2, and is roughly ground by a ceramic grinding wheel, and then finely ground by a resin grinding wheel to make its thickness the same as the finished product requirement, and the outer diameter is 0.2-0.3mm larger than the finished product requirement;

[0009] (4) Secondary sintering: The second group of cemented carbide substrates are placed in a shielding cup for placing components to form an assembly and sent into a high-pressure sintering synthesis chamber. Sintering is carried out for 6-8 minutes at a temperature of 1400-1450°C and a pressure of 5.6GPa in the high-pressure sintering synthesis chamber. The diamond composite sheet is sintered for the second time to obtain the finished product and then processed again to the required size of the finished product.

[0010] Furthermore, in step (1), a sliding door is slidably installed at the front end of the high-pressure sintering synthesis chamber using a transverse slide rail, and a sixth electric push rod is fixed to the top of the high-pressure sintering synthesis chamber, and the extended end of the sixth electric push rod is fixedly connected to the sliding door, and slots are provided on the inner walls on both sides of the high-pressure sintering synthesis chamber, and the upper plate and the lower plate are slid into the slots, and a seventh electric push rod is fixed to the back of the high-pressure sintering synthesis chamber, and the extended end of the seventh electric push rod can be in extrusion contact with the upper plate and the lower plate.

[0011] Furthermore, in step (1), the placement assembly includes an upper plate, a lower plate of the same specification is provided at the bottom of the upper plate, and a plurality of shielding tanks are arranged in a ring between the lower plate and the upper plate, and a top block is rotatably mounted on the top of the upper plate through a bearing.

[0012] Furthermore, in step (1), the rotating assembly includes a fixed frame, the fixed frame is fixed on the base, and an axle is rotatably installed at the axis of the fixed frame, a first motor is fixed on the top of the fixed frame, and the output end of the first motor is fixedly connected to the axle, three groups of vertical frames are fixed on the outer surface of the axle, and a top plate is slidably installed on the top of the vertical frame, and a card frame is provided at the bottom of the front end of the top plate.

[0013] Furthermore, when the placement assembly is docked with the rotating assembly, the extended end of the fourth electric push rod is inserted into the socket of the top ring and fixed by bolts. The fourth electric push rod drives the top ring to move upward, and the cover plate and the shielding tank will move upward synchronously to expose the sintered diamond layer and the first group of cemented carbide substrates.

[0014] Furthermore, in step (2), the top block enters the interior of the card frame, the third electric push rod is turned on, the extended end is inserted into the socket, the top block is connected with the card frame, and the placement component is driven to rotate by the second motor, and the diamond layer and the first group of cemented carbide substrates that have been sintered once are corresponding to the wire cutting equipment, and the cemented carbide substrate is cut off. After the diamond layer is pickled, it corresponds to the position of the drying fan, cooperates with the rotation of the placement component itself, and performs rotary blowing, and then the diamond layer is transferred to the grinding equipment position and ground to the required size, always keeping the outermost diamond layer corresponding to the processing equipment, and rotating to process the diamond layers on the placement component one by one.

[0015] Furthermore, in step (2), when moving to the pickling position, the top plate is squeezed by the first electric push rod on the fixed frame to slide downward along the vertical frame, and the push plate also moves downward under the drive of the connecting rod, so that the placement component is immersed in the pickling box to remove the binder on the diamond layer.

[0016] Furthermore, after the diamond layer and the first group of cemented carbide substrates are exposed, the third electric push rod drives the pressure ring to descend and squeeze the insertion rod, so that the pressure plate covers the top of the diamond layer and the cemented carbide substrate. During pickling, it only covers the top of the diamond layer and cooperates with the lower plate to clamp and fix the material.

[0017] Furthermore, in step (1), the spraying thickness of the binder is 0.01-0.02 mm, the cobalt content in the binder is 20-30%, and the first group of cemented carbide substrates and the second group of cemented carbide substrates are both tungsten carbide / cobalt cemented carbide substrates.

[0018] Furthermore, in step (2), the strong acid in the pickling box is aqua regia, the drying temperature of the drying fan is 150° C., and the drying time is more than 3 hours.

[0019] Beneficial effects of the present invention:

[0020] 1. The present invention uses the sixth electric push rod to drive the push-pull plate to open or close, which is convenient for the delivery of the placement component. The placement component is pushed out from the slot on the inner wall of the high-pressure sintering synthesis chamber through the seventh electric push rod to connect with the rotating component. The slot limits the upper plate and the lower plate of the placement component to maintain stability during the sintering process and ensure accurate docking between the placement component and the rotating component when it is pushed out.

[0021] 2. After sintering is completed, the present invention places the assembly and connects the rotating assembly, and then the extended end of the fourth electric push rod is inserted into the socket of the top ring and fixed by bolts. The fourth electric push rod drives the top ring to move upward, and the cover plate and the shielding tank will move upward synchronously to expose the sintered diamond layer and cemented carbide substrate for easy cutting. At the same time, the third electric push rod drives the pressure ring to descend and squeeze the insertion rod, so that the pressure plate covers the top of the diamond layer and the cemented carbide substrate. During pickling, it only covers the top of the diamond layer, and cooperates with the lower plate to clamp and fix the material to maintain stability during cutting, pickling and grinding.

[0022] 3. The present invention squeezes the top plate to slide downward along the vertical frame through the first electric push rod on the fixed frame, and the push plate also moves downward under the drive of the connecting rod, and the placement component is immersed in the pickling box to remove the binder on the diamond layer. After the top block of the placement frame is inserted into the card frame, the placement component is rotated by the second electric drive, and the diamond layer and the cemented carbide substrate that have been sintered once correspond to the wire cutting equipment, and the cemented carbide substrate is cut off. After the diamond layer is pickled, it corresponds to the position of the drying fan and cooperates with the rotation of the placement component itself to perform rotary blowing, and then the diamond layer is transferred to the grinding equipment position and ground to the required size, and the outermost diamond layer is always kept corresponding to the processing equipment, and the diamond layers on the placement component are rotated to process one by one, thereby improving the overall efficiency of cutting, drying and grinding.

[0023] 4. The present invention enters the interior of the card frame through the top block, and at this time, the third electric push rod is turned on, and the extended end is inserted into the inside of the jack to complete the card connection between the top block and the card frame. Then, the placement component can be driven to rotate by the second motor, thereby facilitating subsequent wire cutting, drying and grinding. After the secondary filling returns to the high-pressure sintering synthesis chamber, the top block is pushed out by the second electric push rod and returns to the interior of the high-pressure sintering synthesis chamber.

[0024] 5. Compared with the prior art, the present invention can simultaneously process multiple groups in the same step through the cooperation of the rotating component and the placing component, and can perform wheel-type processing during the cutting, drying and grinding processes, thereby improving the overall processing efficiency and reducing the time of intermediate transportation. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 A schematic diagram of a process flow of a diamond composite sheet sintering process of the present invention;

[0026] Figure 2 A schematic diagram of the structure of a device for sintering a diamond composite sheet according to the present invention;

[0027] Figure 3 It is a schematic diagram corresponding to a rotating assembly and a pickling box of a diamond composite sheet sintering process of the present invention;

[0028] Figure 4It is a schematic diagram corresponding to a rotating assembly and a high pressure sintering synthesis chamber of a diamond composite sheet sintering process of the present invention;

[0029] Figure 5 It is a schematic diagram of the clamping installation of a rotating component and a placing component in a diamond composite sheet sintering process of the present invention;

[0030] Figure 6 It is a schematic diagram of the separation of the rotating component and the placing component in a diamond composite sheet sintering process of the present invention;

[0031] Figure 7 The present invention is a schematic diagram of the structure of a placement component for a diamond composite sheet sintering process.

[0032] In the figure: 1, base; 2, rotating assembly; 21, fixed frame; 22, first motor; 23, shaft; 24, first electric push rod; 25, vertical frame; 26, top plate; 27, connecting rod; 28, first spring; 29, support plate; 210, second motor; 211, clamping frame; 212, second electric push rod; 213, third electric push rod; 214, pressure ring; 215, fourth electric push rod; 216, fifth electric push rod; 3, Place components; 31. Upper plate; 32. Lower plate; 33. Shielding tank; 34. Top block; 35. Socket; 36. Cover plate; 37. Top ring; 38. Socket; 39. Rod; 310. Second spring; 311. Press plate; 4. High-pressure sintering synthesis chamber; 41. Sixth electric push rod; 42. Sliding door; 43. Seventh electric push rod; 44. Slot; 5. Wire cutting equipment; 6. Pickling box; 7. Drying fan; 8. Grinding equipment. DETAILED DESCRIPTION

[0033] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further explained below in conjunction with specific implementation methods.

[0034] See also Figures 1 to 7 The present invention provides a technical solution: a diamond composite sheet sintering process, the sintering process comprises the following steps:

[0035] (1) Primary sintering: The diamond powder sprayed with the binder and the first group of cemented carbide substrates are placed in the shielding tank 33 of the placement component 3 to form an assembly, and the placement component 3 is sent into the high-pressure sintering synthesis chamber 4, and sintered for 4-6 minutes in the high-pressure sintering synthesis chamber 4 at a temperature of 1400-1450°C and a pressure of 5.0 GPa. Subsequently, the sintered placement component 3 is pushed out of the high-pressure sintering synthesis chamber 4 and docked with the rotating component 2. The spraying thickness of the binder is 0.01-0.02 mm, and the cobalt content in the binder is 20-30%. The first group of cemented carbide substrates and the second group of cemented carbide substrates are both tungsten carbide / cobalt cemented carbide substrates;

[0036] (2) Processing: By rotating the rotating assembly 2, the shielding tank 33 in which the assembly 3 is placed is opened and sent into the wire cutting device 5 to cut off the first group of cemented carbide substrates on the upper layer of the diamond composite sheet, and the diamond layer remaining on the lower layer is clamped and fixed. The rough diamond composite sheet is soaked in a strong acid to remove the binder, washed with water 2-3 times, and then dried at high temperature by a drying fan 7. The strong acid in the pickling box 6 is aqua regia, the drying temperature of the drying fan 7 is 150°C, and the drying time is more than 3 hours;

[0037] (3) Rough finished product processing: The rough finished diamond composite sheet is sent from the rotating assembly to the 8th station of the grinding equipment, roughly ground by a ceramic grinding wheel, and then finely ground by a resin grinding wheel to make its thickness the same as the finished product requirements, and the outer diameter is 0.2-0.3mm larger than the finished product requirements;

[0038] (4) Secondary sintering: The second group of cemented carbide substrates are placed in the shielding cup of the component 3 to form an assembly and sent into the high-pressure sintering synthesis chamber 4. The assembly is sintered for 6-8 minutes at a temperature of 1400-1450°C and a pressure of 5.6 GPa in the high-pressure sintering synthesis chamber 4. The diamond composite sheet is sintered for the second time to obtain the finished product, and then processed again to the required size of the finished product.

[0039] A diamond composite sheet sintering process, comprising a base 1, a rotating assembly 2 is installed at the center of the base 1, and three sets of placement assemblies 3 are installed on the rotating assembly 2, the base 1 is located on the periphery of the rotating assembly 2 and is counterclockwise arranged with a high-pressure sintering synthesis chamber 4, a wire cutting device 5, a pickling box 6, a drying fan 7 and a grinding device 8, the rotating assembly 2 comprises a fixed frame 21, the fixed frame 21 is fixed on the base 1, and a shaft 23 is rotatably installed at the axis of the fixed frame 21, a first motor 22 is fixed on the top of the fixed frame 21, and the first motor 2 The output end is fixedly connected to the shaft 23, three groups of vertical frames 25 are fixed on the outer surface of the shaft 23, and a top plate 26 is slidably installed on the top of the vertical frame 25, and a card frame 211 is provided at the bottom of the front end of the top plate 26, and the placement component 3 includes an upper plate 31, a lower plate 32 of the same specification is provided at the bottom of the upper plate 31, and a plurality of shielding tanks 33 are annularly arranged between the lower plate 32 and the upper plate 31, a top block 34 is rotatably installed on the top of the upper plate 31 through a bearing, and the top block 34 can be slidably inserted in the card frame 211, and a support plate 29 is provided at the bottom of the lower plate 32 , and one side of the support plate 29 is fixedly connected to the top plate 26. In the process, the wire cutting device 5 and the grinding device 8 are both existing technology equipment, which cut and grind the diamond layer. When using the device, the diamond powder sprayed with a binder and the first group of cemented carbide substrates are installed in the shielding tank 33 of the placement component 3 to form an assembly, and the placement component 3 is sent into the high-pressure sintering synthesis chamber 4. Then, the sintered placement component 3 is pushed out of the high-pressure sintering synthesis chamber 4 and docked with the rotating component 2. By rotating the rotating component 2, the shielding tank 33 of the placement component 3 is opened and sent into Inside the wire cutting equipment 5, the first group of cemented carbide substrates on the upper layer of the diamond composite sheet are cut off, and the remaining diamond layer on the lower layer is clamped and fixed. The rough diamond composite sheet is soaked in strong acid to remove the binder, washed with water 2-3 times, and then dried at high temperature by the drying fan 7. The rough diamond composite sheet is sent from the rotating component 2 to the grinding equipment 8 station, roughly ground by a ceramic grinding wheel, and then finely ground by a resin grinding wheel to make its thickness the same as the finished product requirement. It is then installed in the shielding cup of the placement component 3 with the second group of cemented carbide substrates to form an assembly and sent to the high-pressure sintering synthesis chamber 4.

[0040] In this embodiment, a sliding door 42 is slidably installed at the front end of the high-pressure sintering synthesis chamber 4 using a transverse slide rail, and a sixth electric push rod 41 is fixed to the top of the high-pressure sintering synthesis chamber 4, and the extended end of the sixth electric push rod 41 is fixedly connected to the sliding door 42. Slots 44 are provided on the inner walls on both sides of the high-pressure sintering synthesis chamber 4, and the upper plate 31 and the lower plate 32 are slid into the slots 44. A seventh electric push rod 43 is fixed to the back of the high-pressure sintering synthesis chamber 4, and the extended end of the seventh electric push rod 43 can be squeezed and contacted with the upper plate 31 and the lower plate 32. The push-pull plate is opened or closed by the sixth electric push rod 41, which facilitates the delivery of the placement component 3. The placement component 3 is pushed out of the slot 44 on the inner wall of the high-pressure sintering synthesis chamber 4 by the seventh electric push rod 43 and connected to the rotating component 2. The slot 44 limits the upper plate 31 and the lower plate 32 of the placement component 3 to maintain stability during the sintering process and ensure accurate docking of the placement component 3 with the rotating component 2 when it is pushed out.

[0041] In this embodiment, the placement component 3 also includes a cover plate 36, the top of the upper plate 31 is fixed with a cover plate 36 at a position corresponding to the shielding tank 33, and the cover plate 36 is fixedly connected to the top of the shielding tank 33, the upper end of the cover plate 36 is fixed with a top ring 37, and a socket 38 is slidably buckled on one side of the top ring 37, a fifth electric push rod 216 is fixed at a position corresponding to the socket 38 on the top of the top plate 26, and the extended end of the fifth electric push rod 216 can be inserted into the socket 38 and fixed by bolts, a pressure plate 311 is provided inside the shielding tank 33, and a plug 39 is fixed on the top of the pressure plate 311, and a second spring 310 is sleeved on the surface of the plug 39 that slides through the top ring 37, a pressure ring 214 is provided at the lower end of the top plate 26, and a fourth electric push rod 215 is fixed to the top of the top plate 26 on one side corresponding to the pressure ring 214, and the extended end of the fourth electric push rod 215 is fixedly connected to the pressure ring 214, and the diamond layer and the cemented carbide substrate are initially placed in a stacked manner and passed through After being wrapped by the shielding tank 33, it is sintered once and sent out after sintering. Here, the upper plate 31, the lower plate 32, the shielding tank 33 and the second spring 310 and other structures are all made of high temperature resistant materials, or the high temperature calcination area is only set in the area between the upper plate 31 and the lower plate 32. After sintering is completed, the placement component 3 is connected to the rotating component 2, and then the extended end of the fourth electric push rod 215 is inserted into the socket 38 of the top ring 37 and fixed by bolts. The top ring 37 is driven by the fourth electric push rod 215 to move upward, and the cover plate 36 and the shielding tank 33 will move upward synchronously to expose the sintered diamond layer and cemented carbide substrate for easy cutting. At the same time, the third electric push rod 213 drives the pressure ring 214 to descend and squeeze the insertion rod 39, so that the pressure plate 311 covers the top of the diamond layer and the cemented carbide substrate. During pickling, it only covers the top of the diamond layer, and cooperates with the lower plate 32 to clamp and fix the material to maintain stability during cutting, pickling and grinding.

[0042] In this embodiment, the rotating assembly 2 also includes a connecting rod 27, the top plate 26 is located at the bottom of one end of the vertical frame 25 and is fixed with the connecting rod 27, and the connecting rod 27 slides out from the bottom of the vertical frame 25 and is fixedly connected to the supporting plate 29, and the first spring 28 is sleeved on the surface of the connecting rod 27 passing through the vertical frame 25, the top plate 26 is located at the position of the card frame 211 and is fixed with the second motor 210, and the output end of the second motor 210 is fixedly connected to the top of the card frame 211, the fixed frame 21 is located at the top of one side of the pickling box 6 and is fixed with the first electric push rod 24, and the extended end of the first electric push rod 24 is in compression contact with the top plate 26, under normal conditions, the bottom of the placing assembly 3 is supported by the supporting plate 29, and the positions of the supporting plate 29 and the top plate 26 are maintained by the elastic force of the first spring 28, and when it moves to the pickling position, the fixed frame 21 The first electric push rod 24 on the top squeezes the top plate 26 to slide downward along the vertical frame 25, and the push plate also moves downward under the drive of the connecting rod 27, and the placement component 3 is immersed in the pickling box 6 to remove the binder on the diamond layer. After the top block 34 of the placement frame is inserted into the card frame 211, the placement component 3 is driven by the second electric drive to rotate, and the diamond layer and the cemented carbide substrate that have been sintered once correspond to the wire cutting equipment 5, and the cemented carbide substrate is cut off. After the diamond layer is pickled, it corresponds to the position of the drying fan 7, cooperates with the rotation of the placement component 3 itself, and performs rotary blowing, and then the diamond layer is transferred to the grinding equipment 8 position to be polished to the required size, and the outermost diamond layer is always kept corresponding to the processing equipment, and the diamond layers on the placement component 3 are rotated to process one by one, so as to improve the overall efficiency of cutting, drying and polishing.

[0043] In this embodiment, a third electric push rod 213 is fixed to one side of the card frame 211, and a socket 35 is provided on one side of the top block 34 corresponding to the third electric push rod 213, and the extended end of the third electric push rod 213 can be inserted into the inside of the socket 35, and a second electric push rod 212 is fixed to the back of the card frame 211, and the extended end of the second electric push rod 212 is squeezed and contacted with the top block 34. After the placement component 3 is pushed out of the high-pressure sintering synthesis chamber 4 by the seventh electric push rod 43, the top block 34 enters the inside of the card frame 211. At this time, the third electric push rod 213 is opened, and the extended end is inserted into the inside of the socket 35 to complete the clamping of the top block 34 and the card frame 211. Subsequently, the placement component 3 can be driven to rotate by the second motor 210, thereby facilitating subsequent wire cutting, drying and grinding. After the secondary filling returns to the high-pressure sintering synthesis chamber 4, the top block 34 is pushed out by the second electric push rod 212 and returns to the inside of the high-pressure sintering synthesis chamber 4.

[0044] When using the device, the diamond powder sprayed with the binder and the first group of cemented carbide substrates are placed in the shielding tank 33 of the placement component 3 to form an assembly, the placement component 3 is sent into the high-pressure sintering synthesis chamber 4, and the push-pull plate is driven by the sixth electric push rod 41 to facilitate the sending in and out of the placement component 3. The placement component 3 is pushed out from the slot 44 on the inner wall of the high-pressure sintering synthesis chamber 4 through the seventh electric push rod 43 to connect with the rotating component 2. The slot 44 limits the upper plate 31 and the lower plate 32 of the placement component 3 to maintain stability during the sintering process and accurate docking with the rotating component 2 when the placement component 3 is pushed out. Through the rotation of the rotating component 2, the shielding tank 33 of the placement component 3 is opened and sent into the wire cutting device 5, the first group of cemented carbide substrates on the upper layer of the diamond composite sheet are cut off, and the diamond layer remaining in the lower layer is clamped and fixed. The rough diamond composite sheet is soaked in a strong acid to remove the binder, and after washing with clean water 2-3 times, it is passed through The drying fan 7 is dried at high temperature, and the rough finished diamond composite sheet is sent from the rotating component 2 to the grinding equipment 8 station, and is roughly ground by a ceramic grinding wheel and then finely ground by a resin grinding wheel to make its thickness the same as the finished product requirement. The extended end of the fourth electric push rod 215 is inserted into the socket 38 of the top ring 37 and fixed by bolts. The fourth electric push rod 215 drives the top ring 37 to move upward, and the cover plate 36 and the shielding tank 33 will move upward synchronously to expose the sintered diamond layer and cemented carbide substrate for easy cutting. At the same time, the third electric push rod 213 drives the pressure ring 214 to descend and squeeze the insertion rod 39, so that the pressure plate 311 covers the top of the diamond layer and the cemented carbide substrate. During pickling, it only covers the top of the diamond layer, and cooperates with the lower plate 32 to clamp and fix the material to maintain stability during cutting, pickling and grinding. Then, it is installed in the shielding cup of the placement component 3 with the second group of cemented carbide substrates to form an assembly and sent to the high-pressure sintering synthesis chamber 4.

[0045] The above shows and describes the basic principles and main features of the present invention and the advantages of the present invention. It is obvious to those skilled in the art that the present invention is not limited to the details of the above exemplary embodiments, and the present invention can be implemented in other specific forms without departing from the spirit or basic features of the present invention. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the present invention is defined by the attached claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims are included in the present invention. Any figure mark in the claims should not be regarded as limiting the claims involved.

[0046] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A diamond composite sheet sintering process, characterized in that: The sintering process comprises the following steps: (1) Primary sintering: The diamond powder sprayed with a binder and the first group of cemented carbide substrates are placed in a shielding tank of a placement component to form an assembly, and the placement component is sent into a high-pressure sintering synthesis chamber, where it is sintered for 4-6 minutes at a temperature of 1400-1450°C and a pressure of 5.0GPa. The sintered placement component is then pushed out of the high-pressure sintering synthesis chamber and docked with the rotating component. (2) Processing: By rotating the assembly, the shielding tank where the assembly is placed is opened and sent into the wire cutting equipment to cut off the first group of carbide substrates on the upper layer of the diamond composite sheet, and the remaining diamond layer on the lower layer is clamped and fixed. The rough diamond composite sheet is soaked in strong acid to remove the binder, washed with water 2-3 times, and then dried at high temperature by a drying fan; (3) Rough finished product processing: The rough finished product of the diamond composite sheet is sent to the grinding equipment station by the rotating assembly, roughly ground by a ceramic grinding wheel, and then finely ground by a resin grinding wheel to make its thickness the same as the finished product requirements, and the outer diameter is 0.2-0.3mm larger than the finished product requirements; (4) Secondary sintering: The second group of cemented carbide substrates are placed in the shielding cup for placing components to form an assembly and sent to the high-pressure sintering synthesis chamber. The assembly is sintered for 6-8 minutes at a temperature of 1400-1450°C and a pressure of 5.6GPa. The diamond composite sheet is sintered for the second time to obtain the finished product and then processed again to the required size of the finished product; In step (1), a sliding door is slidably mounted on the front end of the high-pressure sintering synthesis chamber by means of a transverse slide rail, and a sixth electric push rod is fixed to the top of the high-pressure sintering synthesis chamber, and the extended end of the sixth electric push rod is fixedly connected to the sliding door, and a card slot is provided on the inner walls of both sides of the high-pressure sintering synthesis chamber, and the upper plate and the lower plate are slid into the card slot, and a seventh electric push rod is fixed to the back of the high-pressure sintering synthesis chamber, and the extended end of the seventh electric push rod can be pressed and contacted with the upper plate and the lower plate, and in step (1), the placement assembly includes an upper plate, and the bottom of the upper plate is provided with the same A lower plate of a certain specification is provided, and a plurality of shielding tanks are arranged in an annular manner between the lower plate and the upper plate. A top block is rotatably mounted on the top of the upper plate through a bearing. In step (1), the rotating assembly includes a fixed frame, the fixed frame is fixed on the bottom platform, and a shaft is rotatably mounted at the axis center of the fixed frame. A first motor is fixed on the top of the fixed frame, and the output end of the first motor is fixedly connected to the shaft. Three groups of vertical frames are fixed on the outer surface of the shaft, and a top plate is slidably mounted on the top of the vertical frame. A card frame is provided at the bottom front end of the top plate. When the placement assembly is docked with the rotating assembly, the fourth The extended end of the electric push rod is inserted into the socket of the top ring and fixed by bolts. The top ring is driven upward by the fourth electric push rod, and the cover plate and the shielding tank are moved upward synchronously to expose the sintered diamond layer and the first group of cemented carbide substrates. In step (2), the top block enters the card frame, the third electric push rod is opened, and the extended end is inserted into the jack. The top block is connected with the card frame, and the placement component is driven to rotate by the second motor. The diamond layer and the first group of cemented carbide substrates that have been sintered once are placed on the corresponding wire cutting equipment to cut off the cemented carbide substrate. After the layer is pickled, it corresponds to the position of the drying fan and cooperates with the rotation of the placement component itself to perform rotary blowing, and then the diamond layer is transferred to the grinding equipment position and polished to the required size, always keeping the outermost diamond layer corresponding to the processing equipment, and rotating to process the diamond layers on the placement component one by one. In step (2), when moving to the pickling position, the first electric push rod on the fixed frame squeezes the top plate to slide downward along the vertical frame, and the push plate also moves downward under the drive of the connecting rod, and the placement component is immersed in the pickling box to remove the binder on the diamond layer.

2. A diamond composite sheet sintering process according to claim 1, characterized in that: After the diamond layer and the first group of cemented carbide substrates are exposed, the third electric push rod drives the pressure ring to descend and squeeze the insertion rod, so that the pressure plate covers the top of the diamond layer and the cemented carbide substrate. During pickling, it only covers the top of the diamond layer and cooperates with the lower plate to clamp and fix the material.

3. The diamond composite sheet sintering process according to claim 1, characterized in that: In step (1), the spraying thickness of the binder is 0.01-0.02 mm, the cobalt content in the binder is 20-30%, and the first group of cemented carbide substrates and the second group of cemented carbide substrates are both tungsten carbide / cobalt cemented carbide substrates.

4. The diamond composite sheet sintering process according to claim 1, characterized in that: In step (2), the strong acid in the pickling box is aqua regia, the drying temperature of the drying fan is 150°C, and the drying time is more than 3 hours.

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