A temperature control method and a temperature control device for a high-integration focal plane detector assembly

Abstract

The present invention belongs to the technical field of precise temperature control of aerospace payloads, and specifically relates to a temperature control method and a temperature control device for a highly integrated focal plane detector assembly. The temperature control device includes a low thermal resistance heat transfer channel and a compensating heating circuit; the low thermal resistance heat transfer channel includes a graphite thermal cable and a heat sink connected in sequence, and the end of the graphite thermal cable not connected to the heat sink is used to connect the highly integrated focal plane detector assembly, and the graphite thermal cable includes a displaceable middle flexible section of the graphite thermal cable; the compensating heating circuit includes a temperature controller and a heater, the heater is connected to the graphite thermal cable, and the temperature controller is connected to the heater. The temperature control method includes temperature control under extremely high temperature conditions and temperature control under extremely low temperature conditions. The temperature control device of the present invention has high heat transfer efficiency, large heat transfer flux, small size, light weight, and flexible movement function.

Description

Technical Field

[0001] The present invention belongs to the technical field of precise temperature control of aerospace payloads, and in particular relates to a temperature control method and a temperature control device for a highly integrated focal plane detector assembly. Background Art

[0002] As one of the most critical components in aerospace payloads, the focal plane detector assembly has very strict requirements on the working temperature environment. Too high or too low temperature will reduce its performance and affect the imaging quality. However, during the operation of aerospace payloads in orbit, they will be affected by the alternating heating and cooling of the cold and dark space in space, and the thermal environment is very harsh. At the same time, the focal plane detector assembly of aerospace payloads will generate a lot of heat during operation. If an effective thermal control method is not adopted, its temperature fluctuation will far exceed the allowable range, reducing the imaging quality. The focal plane detector assembly of aerospace payloads usually has the characteristics of small size, small heat capacity, and high power consumption, and needs to be moved and focused during operation. With the development of high integration, miniaturization, and diversified tasks of aerospace payloads, the number of components and heat sources of the focal plane detector assembly continues to increase, the installation structure of the high-integration focal plane detector assembly is more complicated, and the available heat dissipation space is smaller. Therefore, it is necessary to comprehensively control the temperature of the high-integration focal plane detector assembly according to its temperature control requirements, structural characteristics, and the cold and dark space environment of space to ensure its temperature index.

[0003] The traditional heat dissipation method of aerospace payload focal plane detector components generally adopts a combination of thermoelectric cooler / metal alloy plate + heat pipe + heat sink.

[0004] For example, in the prior art "Chen Liheng, Li Yanchun, Luo Zhitao, et al. Thermal design and thermal test of high-power CCD devices for space cameras [J]. Optical Precision Engineering, 2011, 19(9): 2117-2122", the heat dissipation measures of the focal plane detector assembly are as follows: the heat generated by the focal plane detector assembly is sequentially dissipated through the heat-conducting aluminum block, heat pipe, heat-conducting aluminum plate, heat pipe, and then to the cold plate. This thermal control measure is a fixed mechanical structure and cannot meet the requirements of adjustment and movement; the thermal conductivity of the aluminum block is much lower than that of the graphite film. Under the condition of the same heat dissipation, the volume space occupied by the aluminum block is more than 4 times that of the graphite film, which is not suitable for heat dissipation of the focal plane detector assembly with high integration.

[0005] Another example is the prior art "Zhao Zhenming, Lu Pan, Song Xinyang. Design and verification of the thermal control system of the "GF-2" satellite camera [J]. Space Return and Remote Sensing, 2015, 36(4): 34-40". The heat dissipation measures of the focal plane detector assembly are as follows: the heat generated by the focal plane detector assembly passes through the single-hole micro-slot heat pipe, the transfer heat collection aluminum plate, the double-hole aluminum slot heat pipe, and then to the heat dissipation surface. The thermal control measure is also a fixed mechanical structure and cannot meet the adjustment and movement requirements. In addition, the prior art only describes the heat dissipation measures of the focal plane detector assembly, and does not describe the insulation measures under low temperature conditions. However, the focal plane detector assembly not only needs to dissipate heat under high temperature conditions, but also needs to maintain a safe and stable level range under low temperature conditions.

[0006] In summary, due to the small available space inside the highly integrated focal plane detector assembly, the existing temperature control device has the following problems: it is impossible to achieve adjustment and movement, and it is also impossible to control the temperature. Summary of the invention

[0007] In order to solve the above technical problems, the present invention provides a temperature control method and a temperature control device for a highly integrated focal plane detector assembly, which can realize both adjustment movement and temperature control.

[0008] The object of the present invention is to provide a temperature control device for a highly integrated focal plane detector assembly, comprising a low thermal resistance heat transfer channel and a compensating heating circuit;

[0009] The low thermal resistance heat transfer channel includes a graphite heat conducting cable and a heat sink connected in sequence, one end of the graphite heat conducting cable not connected to the heat sink is used to connect a high-integration focal plane detector assembly, and the graphite heat conducting cable includes a displaceable graphite heat conducting cable middle flexible section;

[0010] The compensating heating loop is composed of a temperature controller and a heater, the heater is connected to the graphite heat conducting wire, and the temperature controller is connected to the heater.

[0011] Preferably, in the temperature control device of the above-mentioned high-integration focal plane detector assembly, the graphite thermal cable comprises a graphite thermal cable cold end, a graphite thermal cable middle flexible section and a graphite thermal cable hot end connected in sequence along the length direction, and the graphite thermal cable hot end is used to connect the high-integration focal plane detector assembly;

[0012] The cold end of the graphite heat conducting cable is connected to the heat sink, and the connection is coated with thermal grease to form a low thermal resistance heat transfer channel;

[0013] The heater is installed at the cold end of the graphite heat conducting cable, and the heater and the heat dissipation plate are respectively located at two sides of the cold end of the graphite heat conducting cable.

[0014] Preferably, in the temperature control device of the above-mentioned highly integrated focal plane detector assembly, the thermal conductivity of the graphite thermal conductive wire is ≥1000 W / (m•K).

[0015] Preferably, in the temperature control device of the above-mentioned highly integrated focal plane detector assembly, the number of the cold end of the graphite thermal cable is one, the number of the intermediate flexible section of the graphite thermal cable and the hot end of the graphite thermal cable are two each, one end of the cold end of the graphite thermal cable is sequentially connected to an intermediate flexible section of the graphite thermal cable and a hot end of the graphite thermal cable, and the other end of the cold end of the graphite thermal cable is sequentially connected to another intermediate flexible section of the graphite thermal cable and another hot end of the graphite thermal cable.

[0016] Preferably, the temperature control device of the above-mentioned highly integrated focal plane detector assembly comprises an imaging board, a circuit board, an interface board and a focusing bracket, the imaging board, the circuit board and the interface board are all mounted on the focusing bracket through an insulating pad, and the hot end of the graphite heat conductor is connected to the gap between the imaging board, the circuit board and the interface board.

[0017] Preferably, in the temperature control device of the above-mentioned highly integrated focal plane detector assembly, a plurality of thermal conductive bosses are fixedly provided on the hot end of the graphite heat conductor, and heating components are distributed on the surfaces of the imaging board, the circuit board and the interface board. After the hot end of the graphite heat conductor is inserted into the gap between the imaging board, the circuit board and the interface board, the thermal conductive boss is connected to the adjacent heating component.

[0018] Preferably, in the temperature control device of the above-mentioned highly integrated focal plane detector assembly, the number of thermal conductive bosses is the same as the number of heat-generating components, and the positions correspond one to one, and the cross-sectional area of ​​the thermal conductive bosses is consistent with the cross-sectional area of ​​the heat-generating components connected thereto.

[0019] Preferably, the temperature control device of the highly integrated focal plane detector assembly further comprises a heat pipe, wherein the heat pipe comprises a heat pipe cold end and a heat pipe hot end;

[0020] The cold end of the graphite heat conducting cable is connected to the hot end of the heat pipe, and the connection is the first connection surface. The cold end of the heat pipe is connected to the heat dissipation plate, and the connection is the second connection surface. The first connection surface and the second connection surface are both coated with thermal grease to form a low thermal resistance heat transfer channel.

[0021] The heater and the hot end of the heat pipe are respectively located on both sides of the cold end of the graphite heat conducting cable.

[0022] Preferably, in the temperature control device of the above-mentioned highly integrated focal plane detector assembly, the heater is a thin film electric heater.

[0023] A temperature control method for a highly integrated focal plane detector assembly, using a temperature control device, including temperature control under extremely high temperature conditions and temperature control under extremely low temperature conditions;

[0024] The method of temperature control under extremely high temperature conditions is as follows: Under extremely high temperature conditions, the low thermal resistance heat transfer channel dissipates the heat generated by the highly integrated focal plane detector assembly through the heat sink to the cold black space of space to avoid burning;

[0025] The method of temperature control under extremely low temperature conditions is as follows: Under extremely low temperature conditions, the highly integrated focal plane detector assembly is not in operation, and the compensation heating circuit keeps it warm to avoid failure.

[0026] Preferably, the temperature control device and temperature control method of the present invention can be applied not only to the temperature control of aerospace payload high-integration focal plane detector components, but also to the temperature control of other electronic equipment in aviation and on the ground.

[0027] Preferably, according to the inventive concept of the present invention, changing the shape and material of the graphite heat conducting wire, changing the shape and structure of the high-integration focal plane detector assembly, and replacing the temperature controller with other controllers all fall within the protection scope of the present invention.

[0028] Compared with the prior art, the present invention has the following beneficial effects:

[0029] When the high-integration focal plane detector assembly is working under high-temperature conditions, the temperature control device of the present invention forms a low-resistance heat transfer channel in the form of a graphite heat conducting cable + heat sink, or forms a low-resistance heat transfer channel in the form of a graphite heat conducting cable + heat pipe + heat sink, so as to quickly discharge the heat generated by the high-integration focal plane detector assembly into the cold black space of space, so that the temperature is not too high and burns. When the high-integration focal plane detector assembly is not working under low-temperature conditions, the temperature of the graphite heat conducting cable is controlled by connecting the temperature controller to the control heater, so as to control the temperature of the high-integration focal plane detector assembly to prevent it from being too low and failing during non-working periods.

[0030] Since the thermal conductivity of graphite thermal cable is ≥1000W / (m•K) and the thermal conductivity of aluminum block is ≤237W / (m•K), the thermal conductivity of graphite thermal cable is much higher than the thermal conductivity of commonly used metal materials such as aluminum alloy and copper. Therefore, the heat transfer efficiency of graphite thermal cable is high, the heat transfer flux is large, and it can achieve high heat transfer in a small volume. The space occupancy rate is low. Under the same heat dissipation, the volume occupied by aluminum block is more than 4 times that of graphite thermal cable. The density of graphite material of graphite thermal cable is 1800kg / m 3 ~2100kg / m 3 The overall density of graphite heat conducting wire is lower than that of commonly used metal materials such as aluminum alloy and copper, and its weight is relatively light. In addition, graphite heat conducting wire has good flexibility and can move in three dimensions, which can meet the adjustment and movement requirements of focal plane electronic equipment and take into account vibration isolation.

[0031] In summary, the temperature control method of the present invention ensures the temperature stability of the highly integrated focal plane detector assembly in the complex thermal environment of the air-cooled black space, taking into account the effects of heat dissipation and heat preservation. The temperature control device of the present invention has high heat transfer efficiency, large heat transfer flux, small size, light weight, and flexible movement function, which is suitable for the temperature control needs of future aerospace payload high-integration focal plane detector assembly heating electronic equipment under the development trend of miniaturization and high heat flux. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 It is a schematic structural diagram of a temperature control device of a highly integrated focal plane detector assembly of the present invention.

[0033] Figure 2 for Figure 1 Structural diagram of the temperature control device of the highly integrated focal plane detector assembly after the angle is rotated.

[0034] Figure 3 It is a schematic diagram of the structure of the graphite heat conducting cable of the present invention.

[0035] Figure 4 for Figure 2 Enlarged view of part A.

[0036] Figure 5 Temperature cloud diagram for simulation analysis of a highly integrated focal plane detector assembly without a temperature control device.

[0037] Figure 6 Temperature cloud diagram for simulation analysis of the temperature control device.

[0038] Figure 7 Simulate and analyze temperature profiles for highly integrated focal plane detector assemblies.

[0039] Figure 8 The temperature curve results of the high-integration focal plane detector assembly during the thermal balance test. DETAILED DESCRIPTION

[0040] In order to enable those skilled in the art to better understand and implement the technical solution of the present invention, the present invention is further described below in conjunction with specific embodiments and drawings.

[0041] In the description of the present invention, unless otherwise specified, all reagents used are commercially available and all methods used are conventional techniques in the art.

[0042] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0043] The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features; in the description of the present invention, unless otherwise specified, "plurality" means two or more.

[0044] Example 1

[0045] A temperature control device for a highly integrated focal plane detector assembly, the structure of which is shown in Figure 1 , Figure 2 and Figure 3 , including a graphite heat conducting cable 1, a heater, a temperature controller 3, a heat pipe 4, and a heat sink 5, which are used to control the temperature of a high-integration focal plane detector assembly 6.

[0046] The structure of graphite heat conducting wire 1 is shown in Figure 3 The shape of the graphite thermal cable 1 is U-shaped or approximately U-shaped. The graphite thermal cable 1 includes a graphite thermal cable cold end 11, a graphite thermal cable middle flexible section 12 and a graphite thermal cable hot end 13 which are connected in sequence along the length direction.

[0047] In order to achieve good thermal conductivity, the number of the graphite thermal cable cold end 11 is one, the number of the graphite thermal cable middle flexible section 12 and the number of the graphite thermal cable hot end 13 are both two, one end of the graphite thermal cable cold end 11 is sequentially connected to one graphite thermal cable middle flexible section 12 and one graphite thermal cable hot end 13, and the other end of the graphite thermal cable cold end 11 is sequentially connected to another graphite thermal cable middle flexible section 12 and another graphite thermal cable hot end 13. The graphite thermal cable cold end 11 is plate-shaped or block-shaped, and the graphite thermal cable cold end 11 and the graphite thermal cable hot end 13 are both composites of graphite film and metal, and the metal is a metal with high thermal conductivity, high specific heat capacity and low density, such as aluminum, aluminum alloy or copper; the graphite film is embedded between two layers of metal by brazing or mechanical fixing after gluing to form a sandwich structure, and the overall thermal conductivity of the graphite thermal cable 1 is ≥1000W / (m•K). The material of the middle flexible section 12 of the graphite heat conducting cable is a flexible graphite film, which can produce a certain displacement in the three-dimensional direction to meet the focus movement requirements of the highly integrated focal plane detector assembly 6 when it is working, and has the function of vibration isolation. Since the graphite film material is similar to a pencil lead, in order to prevent the graphite film from falling powder or residue, the outer surface of the flexible graphite film is wrapped with copper foil or polyimide film.

[0048] The graphite heat conducting cable intermediate flexible section 12 and the graphite heat conducting cable hot end 13 on both sides of the graphite heat conducting cable cold end 11 can be arranged symmetrically or asymmetrically, aiming at adapting to the structure of the highly integrated focal plane detector assembly 6. Figure 1 and Figure 2 , the high-integration focal plane detector assembly 6 is integrated with the hot end 13 of the graphite heat conducting cable as a whole, the heat pipe 4 includes a heat pipe cold end and a heat pipe hot end, the graphite heat conducting cable cold end 11 is connected to the hot end of the heat pipe, and the connection is called the first connection surface, and the heat pipe cold end is fixedly connected to the heat sink 5, and the connection is called the second connection surface. The first connection surface and the second connection surface are both coated with thermal grease to form a low thermal resistance heat transfer channel, which is used to quickly discharge the excess heat generated by the high-integration focal plane detector assembly 6 during operation to the cold black space in space through the heat sink 5 in a radiation heat dissipation manner, so that its temperature is not too high to avoid being burned. Exemplarily, the thermal grease is thermal silicone grease, which must meet the requirements of no volatiles and pollutants in a vacuum state, such as 230 thermal silicone grease. The heat sink 5 is made of a material with light weight and high thermal conductivity, such as aluminum alloy or aluminum alloy graphite composite plate. The side of the heat sink 5 facing the cold black space of space is sprayed with a low absorption-high emission ratio heat dissipation coating, for example, the low absorption-high emission ratio heat dissipation coating is the thermal control coating of CN117568736A, KS-ZA inorganic white paint or S781 white paint.

[0049] Reference Figure 2The heater is a thin film electric heater 2, which is pasted and installed on the cold end 11 of the graphite thermal cable, and the thin film electric heater 2 and the hot end of the heat pipe are respectively located on both sides of the cold end 11 of the graphite thermal cable. The temperature controller 3 is connected to and controls the thin film electric heater 2, so as to achieve the effect of real-time temperature feedback and closed-loop control of the graphite thermal cable 1. The present invention realizes the temperature control of the graphite thermal cable 1 through the strategy of connecting and controlling the thin film electric heater 2 by the temperature controller 3, and then controls the temperature of the high-integration focal plane detector assembly 6 so as not to be too low and fail during non-working period.

[0050] The film electric heater 2 has a heating function. The film electric heater 2 can also be a film electric heater model with both heating and temperature measurement functions, so it can be used as a heater element and a temperature measurement element.

[0051] The temperature controller 3 has the functions of temperature acquisition, temperature open-closed loop control and communication. For example, the temperature controller 3 adopts the Chinese satellite-borne CCD camera temperature controller.

[0052] Reference Figure 4 The highly integrated focal plane detector assembly 6 includes an imaging board 61, a circuit board 62, an interface board 63 and a focusing bracket 64. The imaging board 61, the circuit board 62 and the interface board 63 are all mounted on the focusing bracket 64 through a thermal insulation pad. The circuit board 62 is an FPGA circuit board. There are more than three heating components distributed on the surface of the imaging board 61, the surface of the circuit board 62 and the surface of the interface board 63. The heat consumption of the heating components is ≥200mW. For example, the heating components are heating wires, thermistors or heating films. During operation, the highly integrated focal plane detector assembly 6 will produce a certain amount of displacement in the three-dimensional direction due to focusing. The heating components will generate heat during operation but still need to be maintained within a stable temperature level range.

[0053] The two graphite heat conducting wire hot ends 13 are matched and connected with the high-integration focal plane detector assembly 6. Figure 4 A plurality of heat-conducting bosses 131 are fixedly provided on the hot end 13 of the graphite heat-conducting cable. The hot end 13 of the graphite heat-conducting cable is inserted into the gap between the imaging plate 61, the circuit board 62, and the interface board 63. The heat-conducting bosses 131 are heat-conductingly connected to the heat-generating components on the surface of the imaging plate 61, the surface of the circuit board 62, or the surface of the interface board 63, and the heat-conducting connection surface is coated with thermal grease or a heat-conducting insulating pad. More specifically, the heat-generating components are connected to a heat-conducting boss 131 one by one. The heat-conducting bosses 131 are made of heat-conducting materials and have a rapid heat transfer effect. Therefore, the heat-generating components can be heat-conductingly connected to the graphite heat-conducting cable 1 to form a heat-conducting channel.

[0054] In order to better achieve the heat conduction effect, the total number of heat-generating components on the imaging board 61, the circuit board 62, and the interface board 63 is greater than 10, the cross-sectional area of ​​the heat-conducting boss 131 is consistent with the cross-sectional area of ​​the heat-generating components, and the height of the heat-conducting boss 131 is the distance between the hot end 13 of the graphite heat-conducting cable connected thereto and the heat-generating components.

[0055] In order to simplify the structure, when the spatial size of the high-integration focal plane detector assembly 6 is not constrained, the heat pipe 4 is removed, and the cold end 11 of the graphite thermal cable is directly connected to the heat sink 5, and the heat sink 5 and the thin film electric heater 2 are located on both sides of the cold end 11 of the graphite thermal cable.

[0056] Example 2

[0057] A temperature control method for a highly integrated focal plane detector assembly includes temperature control under extremely high temperature conditions and temperature control under extremely low temperature conditions. The temperature control method for a highly integrated focal plane detector assembly of this embodiment uses the temperature control device of embodiment 1 for temperature control, including a heat pipe 4, which can ensure the temperature stability of the highly integrated focal plane detector assembly 6 in the complex thermal environment of a cold black space in space, taking into account the effects of heat dissipation and heat preservation.

[0058] Extreme high temperature conditions refer to the situation when the space payload encounters the maximum external heat flux during operation in the cold and dark space orbit in space, such as maximum sunlight / earth reflection light, and the heat dissipation of the heat-generating components of the highly integrated focal plane detector assembly inside the space payload is the maximum.

[0059] Extreme low temperature conditions refer to the situation when a space payload encounters minimum external heat flux, such as minimum sunlight / earth reflection light, while operating in a cold and dark space orbit in space, and the heat-generating components of the highly integrated focal plane detector assembly inside the space payload do not generate heat.

[0060] The method of temperature control under extremely high temperature conditions is as follows: Under extremely high temperature conditions, the graphite heat conducting cable 1, heat pipe 4 and heat sink 5 of the temperature control device are combined to form a low thermal resistance heat transfer channel, and the heat generated by the high-integration focal plane detector assembly 6 is quickly dissipated to the cold black space in space through the heat sink 5, so that its temperature will not be too high and burnt, for example, the temperature is prevented from exceeding 50°C.

[0061] Among them, the heat dissipation area of ​​the heat sink 5 is calculated according to the heat flow environment outside the cold black space of space and the average heat consumption of the highly integrated focal plane detector assembly 6. When the heat dissipation area is determined, under extremely high temperature conditions, the temperature control device can quickly dissipate the heat to the cold black space of space through the heat sink 5, so that its temperature will not be too high and burnt.

[0062] The calculation formula for the heat dissipation area is as follows:

[0063] ;

[0064] In the above formula, represents the average heat consumption of the high-integration focal plane detector assembly 6, in W; Indicates the heat flux outside the cold black space absorbed by the surface of the heat sink 5, the unit is W / m 2 ; ε Indicates the infrared emissivity of the surface of the heat sink 5; σ represents the Stefan-Boltzmann constant, σ =5.67×10 -8 W / (m 2 •K 4 ); A 1 represents the area of ​​the heat sink 5, in m 2 ; T 2 represents the surface temperature of the heat sink 5, in °C; T 1 represents the background temperature of the cold black space, T 1=4K.

[0065] The calculation formula of the surface temperature of the heat sink 5 is as follows:

[0066] ;

[0067] Where: T 3 represents the optimal operating temperature of the high-integration focal plane detector assembly 6, in °C; R It represents the thermal resistance between the high-integration focal plane detector assembly 6 and the heat sink 5, that is, the total thermal resistance of the graphite thermal cable 1 itself, the thermal resistance of the heat pipe 4 itself, the contact thermal resistance between the graphite thermal cable 1 and the heat pipe 4, the contact thermal resistance between the hot end 13 of the graphite thermal cable and the high-integration focal plane detector assembly 6, and the contact thermal resistance between the heat pipe 4 and the heat sink 5, and the unit is K / W. It should be noted that the total thermal resistance is divided into thermal conductivity resistance and contact resistance. The thermal conductivity resistance is the thermal resistance value of the material used in the temperature control device itself, which is similar to a resistor. The contact thermal resistance refers to the thermal resistance between the contact surfaces when two objects are in contact.

[0068] The temperature control method under extreme low temperature conditions is as follows: under extreme low temperature conditions, the highly integrated focal plane detector assembly 6 is in a non-working period, and the compensation heating circuit is used to ensure that its temperature is not too low and fails. The compensation heating circuit is realized by connecting the temperature controller 3 to the thin film electric heater 2. The temperature control strategy of the temperature controller 3 is proportional + integral / PID mode, and the compensation power of the corresponding compensation heating circuit is obtained according to simulation analysis or theoretical calculation.

[0069] The compensation power is calculated under extremely low temperature conditions when the highly integrated focal plane detector assembly 6 does not generate heat. The specific calculation process is as follows:

[0070] ;

[0071] In the formula, Indicates the heat flux outside the cold black space absorbed by the surface of the heat sink 5, the unit is W / m 2 ; ε Indicates the infrared emissivity of the surface of the heat sink 5; A 1 represents the area of ​​the heat sink 5, in m 2 ; T 2 represents the surface temperature of the heat sink 5, in °C; T 1 represents the background temperature of the cold black space, T 1=4K.

[0072] The compensation power Q is obtained by the following formula:

[0073] ;

[0074] Where: Q represents the compensation power, the unit is W; T 4 represents the lowest operating temperature of the high-integration focal plane detector assembly 6, in degrees Celsius, not less than -30 degrees Celsius; R It represents the thermal resistance between the high-integration focal plane detector assembly 6 and the heat sink 5, namely the total thermal resistance of the graphite thermal cable 1 itself, the thermal resistance of the heat pipe 4 itself, the contact thermal resistance between the graphite thermal cable 1 and the heat pipe 4, the contact thermal resistance between the hot end of the graphite thermal cable 13 and the high-integration focal plane detector assembly 6, and the contact thermal resistance between the heat pipe 4 and the heat sink 5, and the unit is K / W.

[0075] In order to verify the effect of the present invention, we conducted the following simulation analysis.

[0076] Thermal analysis software is used in simulation analysis to establish thermal analysis models of relevant components of the temperature control device such as the high-integration focal plane detector assembly 6, graphite thermal cable 1, and heat pipe 4. The thermophysical properties and surface radiation characteristic parameters of each component of the temperature control device are input, and the average heat consumption, working time, orbit parameters, and cold black space background radiation temperature of the high-integration focal plane detector assembly 6 are input, as well as the contact thermal resistance at the connection between the high-integration focal plane detector assembly 6, graphite thermal cable 1, heat pipe 4, and heat sink 5. The real thermal environment and working conditions during on-orbit operation are simulated and analyzed, and the temperature distribution, temperature curve, and compensation power of the high-integration focal plane detector assembly 6 are obtained.

[0077] Figure 5 This is a simulation analysis temperature cloud diagram of a high-integration focal plane detector assembly 6 without a temperature control device. Figure 6 This is a temperature cloud diagram of a simulation analysis of a temperature control device containing a heat pipe 4 according to Example 1. Figure 7 It is a simulation analysis of the temperature curve of the high-integration focal plane detector assembly 6. By comparison Figure 5 , Figure 6 and Figure 7It is found that without designing any temperature control device, the temperature of the high-integration focal plane detector assembly 6 reaches a maximum of 145.78°C, and the temperature fluctuation is 140°C. With the temperature control device of the present invention, the maximum temperature of the high-integration focal plane detector assembly 6 is 35°C, and the temperature fluctuation is 40°C, which meets the design requirements. It shows that the temperature control device and the corresponding temperature control method of the present invention can effectively control the temperature level and temperature stability of the high-integration focal plane detector assembly 6.

[0078] In order to further verify the effect of the present invention, we also conducted an actual space camera test. The high-integration focal plane detector assembly 6 and the temperature control device were assembled and installed inside the space camera system. The space camera system was subjected to a thermal balance test. The test environment simulated the cold black space environment of space. The specific conditions of the cold black space of space are vacuum and low temperature environment, that is, the vacuum degree is ≤1.3×10 -3 Pa, temperature ≥ 100K. Since the actual average heat loss of the high-integration focal plane detector assembly 6 is less than the input value during thermal design, and there is a simulation calculation error, during the test, the temperature of the high-integration focal plane detector assembly 6 is 3.8℃~14.5℃, and the temperature fluctuates by 10.7℃. Figure 8 The temperature level and fluctuation are better than the simulation analysis results and meet the index requirements, which proves the effectiveness and rationality of the temperature control method of the present invention.

[0079] In summary, the temperature control method of the present invention integrates the high thermal conductivity, low density, flexible graphite heat conducting cable 1 with the highly integrated focal plane detector assembly 6. Since the graphite heat conducting cable 1 has the functions of large heat transfer, small size, light weight and mobility, the overall structure after the integration of the graphite heat conducting cable 1 and the highly integrated focal plane detector assembly 6 has the characteristics of small size, light weight and mobility in three dimensions, and the temperature control device takes into account the heat dissipation requirements under extremely high temperature conditions and the heat preservation function under extremely low temperature conditions. The present invention solves the problem of focusing movement of the lightweight, high power consumption aerospace payload camera highly integrated focal plane detector assembly 6 during operation, and solves the temperature control problem.

[0080] It should be noted that the embodiments of the present invention exemplarily introduce temperature control methods under extremely high temperature conditions and extremely low temperature conditions. In actual application, heat dissipation can also be performed under high temperature conditions, and heat preservation can also be performed under low temperature conditions. It is not necessary to wait until "extreme high temperature" or "extreme low temperature" to control the temperature.

[0081] It should be noted that the component connection relationships not specifically mentioned in the present invention are assumed to adopt the existing technology. Since they do not involve the invention point and are widely used in the existing technology, the structural connection relationships are not described in detail.

[0082] It should be noted that when the present invention involves a numerical range, it should be understood that the two endpoints of each numerical range and any value between the two endpoints can be selected. Since the steps and methods used are the same as those in the embodiments, in order to avoid redundancy, the present invention describes a preferred embodiment. Although the preferred embodiments of the present invention have been described, once those skilled in the art know the basic inventive concept, they can make other changes and modifications to these embodiments, and these changes and modifications all fall within the scope of the present invention.

[0083] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. If these modifications and variations of the present invention fall within the scope of the equivalent technology of the present invention, the present invention is also intended to include these modifications and variations.

Claims

1. A temperature control device for a highly integrated focal plane detector assembly, characterized in that: It includes a low thermal resistance heat transfer channel and a compensating heating circuit; The low thermal resistance heat transfer channel comprises a graphite heat conducting cable (1) and a heat sink (5) connected in sequence, the end of the graphite heat conducting cable (1) not connected to the heat sink (5) being used to connect to a high-integration focal plane detector assembly (6), and the graphite heat conducting cable (1) comprising a displaceable graphite heat conducting cable intermediate flexible section (12); The compensating heating circuit is composed of a temperature controller (3) and a heater, the heater is connected to the graphite heat conducting cable (1), and the temperature controller (3) is connected to the heater; The graphite heat conducting cable (1) comprises a graphite heat conducting cable cold end (11), a graphite heat conducting cable middle flexible section (12) and a graphite heat conducting cable hot end (13) which are connected in sequence along the length direction, and the graphite heat conducting cable hot end (13) is used to connect to a high-integration focal plane detector assembly (6); The cold end (11) of the graphite heat conducting cable is connected to the heat dissipation plate (5), and the connection is coated with thermal grease to form a low thermal resistance heat transfer channel; The heater is installed at the cold end (11) of the graphite heat conducting cable, and the heater and the heat dissipation plate (5) are respectively located on two sides of the cold end (11) of the graphite heat conducting cable; The number of the graphite thermal cable cold end (11) is one, the number of the graphite thermal cable intermediate flexible section (12) and the number of the graphite thermal cable hot end (13) are both two, one end of the graphite thermal cable cold end (11) is sequentially connected to one graphite thermal cable intermediate flexible section (12) and one graphite thermal cable hot end (13), and the other end of the graphite thermal cable cold end (11) is sequentially connected to another graphite thermal cable intermediate flexible section (12) and another graphite thermal cable hot end (13).

2. The temperature control device of the highly integrated focal plane detector assembly according to claim 1, characterized in that: The thermal conductivity of the graphite thermal cable (1) is ≥1000 W / (m•K).

3. The temperature control device of the highly integrated focal plane detector assembly according to claim 1, characterized in that: The highly integrated focal plane detector assembly (6) comprises an imaging plate (61), a circuit board (62), an interface board (63) and a focusing bracket (64); the imaging plate (61), the circuit board (62) and the interface board (63) are all mounted on the focusing bracket (64) via a thermal insulation pad; the hot end (13) of the graphite heat conducting cable is connected to a gap between the imaging plate (61), the circuit board (62) and the interface board (63).

4. The temperature control device of the highly integrated focal plane detector assembly according to claim 3, characterized in that: A plurality of heat-conducting bosses (131) are provided on the hot end (13) of the graphite heat-conducting cable, and heat-generating components are distributed on the surface of the imaging plate (61), the surface of the circuit board (62), and the surface of the interface plate (63). After the hot end (13) of the graphite heat-conducting cable is inserted into the gap between the imaging plate (61), the circuit board (62), and the interface plate (63), the heat-conducting bosses (131) are connected to the heat-generating components adjacent thereto.

5. The temperature control device of the highly integrated focal plane detector assembly according to claim 4, characterized in that: The number of the heat-conducting bosses (131) is the same as the number of the heat-generating components, and the positions correspond one to one, and the cross-sectional area of ​​the heat-conducting bosses (131) is consistent with the cross-sectional area of ​​the heat-generating components connected thereto.

6. The temperature control device of the highly integrated focal plane detector assembly according to any one of claims 1 to 5, characterized in that: Also included is a heat pipe (4), wherein the heat pipe (4) comprises a heat pipe cold end and a heat pipe hot end; The cold end (11) of the graphite heat conducting cable is connected to the hot end of the heat pipe, and the connection is a first connection surface. The cold end of the heat pipe is connected to the heat dissipation plate (5), and the connection is a second connection surface. Both the first connection surface and the second connection surface are coated with thermal grease to form a low thermal resistance heat transfer channel. The heater and the hot end of the heat pipe are respectively located on two sides of the cold end (11) of the graphite heat conducting cable.

7. The temperature control device of the highly integrated focal plane detector assembly according to claim 6, characterized in that: The heater is a thin film electric heater (2).

8. A temperature control method for a highly integrated focal plane detector assembly, characterized in that: Using the temperature control device of claim 7, including temperature control under extremely high temperature conditions and temperature control under extremely low temperature conditions; The method for controlling temperature under extreme high temperature conditions is as follows: under extreme high temperature conditions, the heat generated by the high-integration focal plane detector assembly (6) is dissipated through the heat sink (5) by the low thermal resistance heat transfer channel to the cold black space in space to avoid burning; The method for controlling temperature under extreme low temperature conditions is as follows: under extreme low temperature conditions, when the highly integrated focal plane detector assembly (6) is not in operation, a compensation heating circuit keeps it warm to avoid failure.

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