Camera module and electronic device
By incorporating multiple micro-holes in the base for ventilation, the issues of pressure difference and heat dissipation after the lens module is sealed are resolved, thereby improving the imaging quality and reliability of the camera module.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP LTD
- Filing Date
- 2023-05-22
- Publication Date
- 2026-05-05
AI Technical Summary
After the lens module is sealed, a pressure difference can easily occur, which can damage the components or reduce the image quality. Heat cannot be dissipated, causing water vapor to condense on the filter, which also affects the image quality.
Multiple micro-holes are set on the base to form ventilation holes, so as to realize the airflow between the chamber and the outside, avoid pressure difference, and reduce the entry of impurities through the micro-hole design, ensuring airflow exchange and heat dissipation.
It effectively avoids device damage and image quality degradation caused by pressure difference, improves imaging effect, prevents impurities from entering the photosensitive element, ensures heat dissipation, and improves the imaging quality of the camera module.
Smart Images

Figure CN119011974B_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of optical device technology, and in particular to a camera module and electronic device. Background Technology
[0002] A lens module typically includes a mount, a filter, a photosensitive chip, and a circuit board. To prevent external impurities from reaching the photosensitive chip and affecting image quality, a common practice is to provide vent holes on the mount. After the lens cover (LHA) process, the vent holes are sealed with adhesive to completely seal the space under the mount.
[0003] However, even after the vent is sealed, a pressure difference can easily exist between the lens module and the outside, which can easily cause damage to the device or affect the image quality. Summary of the Invention
[0004] This application provides a camera module and electronic device to solve the problem in related technologies where, after the vent is sealed, a pressure difference easily exists between the lens module and the outside, which can easily cause damage to the device or affect the image quality. For example, during external pressurization or baking and heating, the pressure difference between the lens module and the outside can easily cause the filter to break. Another example is that the heat generated by the lens module during operation cannot be dissipated in time, which can easily create a temperature difference between the inner and outer surfaces of the filter, and then condense water mist or small water droplets on the inner surface of the filter, affecting the image quality of the lens module.
[0005] In a first aspect, embodiments of this application provide a camera module, including:
[0006] Circuit board;
[0007] A base connected to the circuit board, the base being provided with vent holes, the vent holes including multiple micro-holes;
[0008] A filter element is connected to the base, and a cavity is formed between the filter element, the base, and the circuit board, with multiple micro-holes communicating with the cavity;
[0009] A photosensitive element is located in the cavity, the photosensitive element is connected to and electrically connected to the circuit board, and along the optical path transmission direction, the photosensitive element is located downstream of the filter element;
[0010] The lens is located upstream of the filter element along the optical path transmission direction;
[0011] A motor, which is connected to the base and the lens.
[0012] Secondly, embodiments of this application provide an electronic device including any of the aforementioned camera modules.
[0013] The camera module and electronic device of this application embodiment have a vent hole formed on the base that communicates with the cavity. Compared with a closed cavity, airflow can be achieved through the vent hole, avoiding the formation of a pressure difference between the cavity and the outside. This prevents the filter element from breaking due to the pressure difference during external pressurization or baking and heating, or prevents the condensation of water mist or small water droplets in the cavity due to the inability of heat to dissipate inside the camera module, which affects the image quality.
[0014] The vent includes multiple micro-holes, all of which are connected to the chamber. Compared to larger apertures, these micro-holes can increase the difficulty for dust and other impurities to enter the chamber while improving the pressure difference between the chamber and the outside. Therefore, the multiple micro-holes are not sealed, which can also effectively prevent impurities from reaching the imaging area of the photosensitive element and improve the imaging effect of the camera module.
[0015] Compared to a motor connection circuit board, a motor connection base can shorten the connection path between the motor and the base, resulting in a more reliable connection. Attached Figure Description
[0016] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0017] Figure 1 This is a schematic diagram of the camera module provided in the first embodiment of this application;
[0018] Figure 2 yes Figure 1 The diagram shown is a top view of the camera module.
[0019] Figure 3 yes Figure 2 Schematic diagram of the cross-sectional structure along the AA direction;
[0020] Figure 4 yes Figure 1 The diagram shows a top view of the base in the camera module.
[0021] Figure 5 yes Figure 4 Enlarged schematic diagram of the structure at the central vent;
[0022] Figure 6 yes Figure 4 Schematic diagram of the cross-sectional structure in the middle BB direction;
[0023] Figure 7 yes Figure 4 A cross-sectional structural diagram of an alternative scheme in the BB direction;
[0024] Figure 8 This is a schematic diagram of the base in the camera module provided in the second embodiment of this application;
[0025] Figure 9 This is a schematic diagram of the base in the camera module provided in the third embodiment of this application;
[0026] Figure 10 This is a schematic diagram of the camera module provided in the fourth embodiment of this application;
[0027] Figure 11 yes Figure 10 The diagram shown is an exploded view of the camera module.
[0028] Figure 12 This is a structural block diagram of the electronic device provided in the embodiments of this application.
[0029] Explanation of reference numerals in the attached figures:
[0030] 1. Electronic equipment;
[0031] 10. Camera module;
[0032] 11. Circuit board; 111. First side;
[0033] 12. Base; 121. Vent hole; 1211. Micro-hole; 122. Inner wall surface; 1221. First inner wall surface; 1222. Second inner wall surface; 123. Outer wall surface; 1231. First outer wall surface; 1232. Second outer wall surface; 124. Base plate; 125. Peripheral side plate; 126. Second protrusion; 127. Through hole; 128. Slot; 129. Mesh plate;
[0034] 13. Filter element;
[0035] 14. Photosensitive element;
[0036] 15. Lens;
[0037] 16. Motor;
[0038] 17. Chamber; 171. First chamber; 172. Second chamber;
[0039] 18. Partition; 181. Partition plate;
[0040] 19. Electrical connectors. Detailed Implementation
[0041] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.
[0042] In the following description, when referring to the accompanying drawings, the same numbers in different drawings denote the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.
[0043] Please see Figures 1 to 4 This application provides a camera module 10, which includes a circuit board 11, a base 12, a filter element 13, a photosensitive element 14, a lens 15, and a motor 16.
[0044] The filter element 13 and the circuit board 11 are both connected to the base 12. The filter element 13, the circuit board 11 and the base 12 enclose a cavity 17. The photosensitive element 14 is located in the cavity 17. The photosensitive element 14 is connected to the circuit board 11 and is electrically connected to the circuit board 11. Along the light path transmission direction, the photosensitive element 14 is located downstream of the filter element 13.
[0045] It is understandable that, along the optical path transmission direction, X is located downstream of Y, so the light passes through Y first and then X during transmission. In this embodiment, along the optical path transmission direction, the photosensitive element 14 is located downstream of the filter element 13, so the light can first be filtered by the filter element 13 to remove light outside the working wavelength band before being transmitted to the photosensitive element 14.
[0046] In this embodiment, the base 12 has a vent 121 communicating with the chamber 17. The vent 121 on the base 12, communicating with the chamber 17, allows airflow, unlike a sealed chamber 17, preventing a pressure difference between the chamber 17 and the outside. This avoids the filter element 13 from breaking due to pressure difference during external pressurization or heating, or prevents condensation of water vapor or droplets inside the chamber 17 due to heat buildup within the camera module 10, which could affect image quality.
[0047] The vent 121 is used to connect the chamber 17 to the outside. Here, the outside is the part outside the camera module 10. The vent 121 can be directly connected to the outside or indirectly connected to the outside. More details will be provided below.
[0048] See Figure 4 and Figure 5The vent 121 includes multiple micro-holes 1211, all of which are connected to the chamber 17. Compared to larger apertures, the micro-holes 1211 can increase the difficulty for dust and other impurities to enter the chamber 17 while improving the pressure difference between the chamber 17 and the outside. Therefore, the multiple micro-holes 1211 do not need to be sealed, which can also effectively prevent impurities from reaching the imaging area of the photosensitive element 14 and improve the imaging effect of the camera module 10.
[0049] The pore size of the micropore 1211 can be in the micrometer, submicrometer, or nanometer range, and can be flexibly designed according to actual needs. Specifically, the micrometer range can be greater than or equal to 0.1 μm and less than or equal to 100 μm, the submicrometer range can be greater than or equal to 0.1 μm and less than or equal to 1 μm, and the nanometer range can be greater than or equal to 0.1 nm and less than or equal to 100 nm.
[0050] In this embodiment, the pore size of the micro-hole 1211 is in the micrometer range. Since the particle size of dust and other impurities is usually much larger than the micrometer range, designing the pore size of the micro-hole 1211 to be in the micrometer range can effectively prevent impurities from entering the chamber 17, ensure and improve the pressure difference between the chamber 17 and the outside, and facilitate the processing and shaping of the micro-hole 1211. For example, the micro-hole 1211 can be processed and shaped by laser penetration and other processes, and there is no limitation on this.
[0051] Furthermore, the pore diameter h1 of the micropore 1211 can be greater than or equal to 0.6 μm and less than or equal to 30 μm. By reasonably limiting the pore diameter of the micropore 1211, it can be ensured that the micropore 1211 can improve the pressure difference between the chamber 17 and the outside, and that most or all impurities can be prevented from entering the chamber 17. Specifically, the pore diameter h1 of the micropore 1211 can be 0.6 μm, 1 μm, 1.8 μm, 2 μm, 5 μm, 10 μm, 15 μm, 30 μm, etc., and there is no limitation on this. Among multiple micropores 1211, the pore diameter h1 of each micropore 1211 can be equal or unequal.
[0052] The distance h2 between two adjacent micro-holes 1211 is greater than or equal to 0.1 μm and less than or equal to 50 μm. By reasonably limiting the distance between two adjacent micro-holes 1211, the distances between multiple micro-holes 1211 are made closer, which is beneficial for forming multiple micro-holes 1211 in the same part of the base 12 and reduces the difficulty of forming the micro-holes 1211. Specifically, the distance h2 between two adjacent micro-holes 1211 can be 0.1 μm, 0.7 μm, 1.5 μm, 3 μm, 8 μm, 20 μm, 35 μm, 50 μm, etc., and is not limited thereto. Among multiple micro-holes 1211, the distance h2 between two adjacent micro-holes 1211 can be equal or unequal.
[0053] The number of micro-holes 1211 is greater than or equal to 2 and less than or equal to 25. By reasonably limiting the number of micro-holes 1211, sufficient micro-holes 1211 are provided on the base 12, thereby ensuring that the micro-holes 1211 have sufficient airflow exchange capacity, and can promptly improve the pressure difference between the chamber 17 and the outside during external pressurization, baking, heating, etc. Specifically, the number of micro-holes 1211 can be 2, 4, 7, 8, 10, 15, 20, 25, etc., and is not limited thereto.
[0054] The cross-section of the micro-hole 1211 can be circular, square, polygonal, or a combination thereof, etc., and is not limited thereto. When the cross-section of the micro-hole 1211 is square, polygonal, or a combination thereof, the aperture h1 of the micro-hole 1211 can be: the length of any one of the line segments passing through the center of the cross-section of the micro-hole 1211 and intersecting the cross-section at both ends; for example, the length of the largest line segment. When the cross-section of the micro-hole 1211 is square, polygonal, or a combination thereof, the distance h2 between two adjacent micro-holes 1211 can be: the length of a line segment connecting the centers of the two cross-sections in the same plane, with reference to the cross-sections of the two adjacent micro-holes 1211 in the same plane, whose two ends intersect the two cross-sections respectively.
[0055] Please see Figure 6 At least some of the micro-holes 1211 can extend directly through the base 12, see [reference]. Figure 7 At least some of the micro-holes 1211 can also be mesh holes of the mesh plate 129 provided at the vent hole 121.
[0056] Combination Figure 6 When the micro-hole 1211 extends directly to penetrate the base 12, the base 12 may have an inner wall surface 122 forming a cavity 17 and an outer wall surface 123 opposite to the inner wall surface 122. One end of the micro-hole 1211 extends to penetrate the inner wall surface 122 and the other end extends to penetrate the outer wall surface 123.
[0057] Combination Figure 7 When the micro-hole 1211 is a mesh hole of the mesh plate 129 located at the vent hole 121, the mesh plate 129 is connected to the base 12, and the extension length of the micro-hole 1211 is less than the extension length of the vent hole 121. The mesh plate 129 may have the end, middle, etc. of the vent hole 121, and there is no limitation on this.
[0058] The projection of one end of the vent 121 connecting to the chamber 17 onto the circuit board 11 is offset from the projection of the photosensitive element 14 onto the circuit board 11. This offset arrangement means that the two projections have no overlapping area. In this embodiment, by offsetting the projection of one end of the vent 121 connecting to the chamber 17 onto the circuit board 11 with the projection of the photosensitive element 14 onto the circuit board 11, even if some impurities pass through the vent 121, they are less likely to fall onto the photosensitive element 14, thus not affecting the imaging effect of the camera module 10. Furthermore, the offset arrangement also avoids contamination of the photosensitive element 14 during adhesive application.
[0059] It should be noted that, since the imaging area of the photosensitive element 14 is used to receive light, and the photosensitive element 14 usually also includes an edge area located outside the imaging area, etc., the projection of one end of the vent 121 connecting the chamber 17 onto the circuit board 11 and the projection of the photosensitive element 14 onto the circuit board 11 are misaligned. This can also achieve the separation of the projection of one end of the vent 121 connecting the chamber 17 onto the circuit board 11 and the projection of the imaging area onto the circuit board 11, further preventing impurities passing through the vent 121 from falling into the imaging area and preventing contamination during dispensing.
[0060] Of course, it is also possible to directly set the projection of one end of the vent 121 connecting the chamber 17 onto the circuit board 11 to be misaligned with the projection of the edge area of the photosensitive element 14 onto the circuit board 11, etc., without limitation.
[0061] The vent 121, with one end of the chamber 17 connected to it, is misaligned with the electronic components on the circuit board 11. This prevents impurities that pass through the vent 121 into the chamber 17 from falling onto the electronic components on the circuit board 11, or from contaminating the electronic components during adhesive dispensing. The electronic components can be resistors, capacitors, chips, etc., and are not limited thereto.
[0062] The base 12 includes a base plate 124 and a peripheral side plate 125. The base plate 124 is spaced apart from the circuit board 11. The base plate 124 is connected to the filter element 13. The peripheral side plate 125 is located between the base plate 124 and the circuit board 11, and connects the base 12 and the circuit board 11. The cross-section of the peripheral side plate 125 can be circular, square, polygonal, or a combination thereof, etc., and is not limited thereto.
[0063] The peripheral side plate 125 and the base plate 124 can be integrally formed or connected by adhesives or other means; the peripheral side plate 125 and the circuit board 11 can be connected by adhesives or other means; the base plate 124 and the filter element 13 can be integrally formed or connected by adhesives or other means, and there is no limitation on this.
[0064] In one exemplary embodiment, at least some of the micro-holes 1211 are disposed on the base plate 124, such as some micro-holes 1211 being disposed on the base plate 124, or all micro-holes 1211 being disposed on the base plate 124. When some micro-holes 1211 are disposed on the base plate 124, the remaining micro-holes 1211 can be disposed on other parts of the base 12 besides the base plate 124, such as the peripheral side plate 125, etc. Specifically, when the micro-holes 1211 are disposed on the base plate 124, the base plate 124 has a first inner wall surface 1221 forming the chamber 17 and a first outer wall surface 1231 opposite to the first inner wall surface 1221. One end of the vent 121 extends through the first inner wall surface 1221, and the other end extends through the first outer wall surface 1231.
[0065] In another exemplary embodiment, at least some of the micro-holes 1211 are disposed on the peripheral side plate 125, such as some micro-holes 1211 being disposed on the peripheral side plate 125, or all micro-holes 1211 being disposed on the peripheral side plate 125. When some micro-holes 1211 are disposed on the peripheral side plate 125, the remaining micro-holes 1211 can be disposed on other parts of the base 12 besides the peripheral side plate 125, such as the base plate 124, etc. Specifically, when the micro-holes 1211 are disposed on the peripheral side plate 125, the peripheral side plate 125 has a second inner wall surface 1222 forming the chamber 17 and a second outer wall surface 1232 opposite to the second inner wall surface 1222. One end of the vent 121 extends through the second inner wall surface 1222, and the other end extends through the second outer wall surface 1232.
[0066] The extension direction of the vent 121 can be a straight line, a curve, a spiral, or a combination thereof, and there is no limitation thereto. It is understood that when the extension direction of the vent 121 is a straight line, it is beneficial to the processing and shaping of the vent 121; when the extension direction of the vent 121 includes a curve or a spiral, the curve or spiral has a curved corner compared to a straight line, and the curved corner is more likely to trap impurities, increasing the difficulty for impurities to pass through the vent 121 and reach the chamber 17, which can further improve the imaging quality of the camera module 10.
[0067] It should be noted that the extension length of the vent 121 can be increased, thereby increasing the difficulty for impurities to pass through the vent 121 and reach the chamber 17. Specifically, the inner wall surface 122 of the base 12 can be formed with a first protrusion (not shown in the figure), the first protrusion is connected to the inner wall surface 122 and protrudes from the inner wall surface 122, at least a portion of the vent 121 extends through the first protrusion, and / or, the outer wall surface 123 of the base 12 can be formed with a second protrusion 126, the second protrusion 126 is connected to the outer wall surface 123 and protrudes from the outer wall surface 123, at least a portion of the vent 121 extends through the second protrusion 126.
[0068] Wherein, when the base 12 includes a base plate 124 and a peripheral side plate 125, the inner wall surface 122 includes a first inner wall surface 1221 of the base plate 124 and a second inner wall surface 1222 of the peripheral side plate 125, and the outer wall surface 123 includes a first outer wall surface 1231 of the base plate 124 and a second outer wall surface 1232 of the peripheral side plate 125. The first protrusion on the inner wall surface 122 can be provided on either the first inner wall surface 1221 or the second inner wall surface 1222. Similarly, the second protrusion 126 on the outer wall surface 123 can be provided on either the first outer wall surface 1231 or the second outer wall surface 1232.
[0069] In this embodiment of the application, a second protrusion 126 is provided on the first outer wall surface 1231 of the base plate 124. The second protrusion 126 can be spaced apart from the outer edge of the first outer wall surface 1231, so that the wall surface between the second protrusion 126 and the outer edge of the first outer wall surface 1231 can be in a relatively low position, which can be used for positioning and supporting the motor 16, etc.
[0070] See again Figure 3 and Figure 4 The base 12 (such as the base plate 124) has a through hole 127 communicating with the chamber 17. A recess 128 is formed around the through hole 127 on the base 12, communicating with the through hole 127. The filter element 13 is located in the recess 128. The recess 128 allows for positioning of the filter element 13 on the base 12, improving the assembly speed and alignment accuracy between the filter element 13 and the base 12. Furthermore, separating the base 12 and the filter element 13 reduces the molding difficulty of the filter element 13.
[0071] The recess 128 can be located on the side of the through hole 127 away from the chamber 17, so that the assembly sequence of the filter element 13 and the base 12 is more flexible. Specifically, the assembly sequence of the filter element 13 and the base 12 can be before the assembly sequence of the base 12 and the circuit board 11, or it can be after the assembly sequence of the base 12 and the circuit board 11.
[0072] The base 12 can be sealed to the circuit board 11 and the filter element 13, so that the chamber 17 is connected to the outside only at the vent 121. This facilitates the design of parameters such as the aperture of the vent 121 and the design of the position where impurities enter the chamber 17. Of course, the base 12 and the circuit board 11, and the base 12 and the filter element 13 can also be non-sealed, and there is no limitation on this.
[0073] Along the optical path transmission direction, the lens 15 is located upstream of the filter element 13, so the light is transmitted to the filter element 13 and the photosensitive element 14 after being converged by the lens 15. The lens 15 may include at least one lens and a lens barrel, with the lens mounted on the lens barrel.
[0074] Motor 16 connects base 12 and lens 15. Motor 16 drives relative movement between base 12 and lens 15, solving the problem of unclear images caused by camera shake during shooting. Connecting motor 16 to base 12, compared to connecting motor 16 to circuit board 11, shortens the connection path between motor 16 and base 12, resulting in a more reliable connection.
[0075] The motor 16 includes a fixed part (not shown) and a movable part (not shown). The fixed part is connected to the base 12, and the movable part is connected to the lens 15. The movable part can move relative to the fixed part, and there is a gap between the movable part and the fixed part. At least part of the micro-hole 1211 communicates with the gap. The micro-hole 1211 communicates with the outside through the gap between the fixed part and the movable part. Compared with the micro-hole 1211 communicating directly with the outside, the communication path between the micro-hole 1211 and the outside is lengthened. The lengthened communication path between the micro-hole 1211 and the outside makes it more difficult for impurities to enter the micro-hole 1211, which is more conducive to preventing impurities from entering the chamber 17.
[0076] It should be noted that the fixing component may include a first mounting base and a stator connected to the first mounting base. The first mounting base may be connected to the base 12. The movable component may include a second mounting base and a mover connected to the second mounting base. The second mounting base may be connected to the lens 15, and the mover may move relative to the stator. The second mounting base may be connected to the lens barrel of the lens 15, or the second mounting base may be integrally formed with the lens barrel of the lens 15.
[0077] The first mounting base can be disposed on the periphery of the second mounting base, and the stator and the mover can be disposed between the first mounting base and the second mounting base. Since the mover needs to move relative to the stator to prevent shaking, a gap is usually reserved between the first mounting base and the second mounting base so that the second mounting base has a range of motion relative to the first mounting base. In this embodiment, at least part of the micro-hole 1211 is configured to communicate with the gap, and the existing gap in the camera module 10 can be used to lengthen the communication path between the micro-hole 1211 and the outside.
[0078] It is understood that the motor 16 in this application embodiment can be directly selected from the motor in the related technology. This application embodiment only needs to adjust the setting position of the micro hole 1211, and the structure of the motor 16 does not need to be improved.
[0079] The connection between the motor 16 and the base 12 can be either sealed or unsealed; there is no limitation on this.
[0080] Please see Figures 6 to 9 The camera module 10 also includes a partition 18, which is located in the chamber 17 and divides the chamber 17 into a first chamber 171 and a second chamber 172 that are connected. At least a portion of the micro-hole 1211 is disposed corresponding to and connected to the first chamber 171, and the photosensitive element 14 is disposed corresponding to the second chamber 172. By distributing the micro-hole 1211 and the photosensitive element 14 to the first chamber 171 and the second chamber 172 respectively, compared to distributing the micro-hole 1211 and the photosensitive element 14 in the same chamber, the partition 18 between the first chamber 171 and the second chamber 172 increases the difficulty for impurities to enter the second chamber 172, thereby preventing impurities from reaching the photosensitive element 14 in the second chamber 172.
[0081] The partition 18 includes at least one partition plate 181, see reference. Figure 8 The baffle 181 can form a first chamber 171 between itself and the inner wall 122 of the base 12; or, there can be multiple baffles 181, and multiple baffles 181 can form a first chamber 171 between them.
[0082] Furthermore, if a first chamber 171 is formed between the partition plate 181 and the inner wall surface 122 of the base 12, the partition plate 181 and the inner wall surface 122 of the base 12 may not be connected and closed, leaving a gap, through which the first chamber 171 and the second chamber 172 can communicate. Similarly, if a first chamber 171 is formed between multiple partition plates 181, the multiple partition plates 181 may not be connected and closed, leaving a gap, through which the first chamber 171 and the second chamber 172 can communicate.
[0083] Of course, if a first chamber 171 is formed between the partition plate 181 and the inner wall surface 122 of the base 12, the partition plate 181 and the inner wall surface 122 of the base 12 can also be connected and closed without leaving a gap. In this case, the height of the partition plate 181 in the direction perpendicular to the circuit board 11 can be designed to be less than the height of the peripheral side plate 125 in the direction perpendicular to the circuit board 11, so that the first chamber 171 is not completely sealed and can communicate with the second chamber 172. Similarly, if a first chamber 171 is formed between multiple partition plates 181, the multiple partition plates 181 can also be connected and closed without leaving a gap. In this case, the height of at least one partition plate 181 forming the first chamber 171 in the direction perpendicular to the circuit board 11 can be designed to be less than the height of the peripheral side plate 125 in the direction perpendicular to the circuit board 11, so that the first chamber 171 is not completely sealed and can communicate with the second chamber 172.
[0084] Alternatively, the partition 181 and the inner wall 122 can be designed to be unconnected and closed, and the height of the partition 181 in the direction perpendicular to the circuit board 11 can be less than the height of the peripheral side plate 125 in the direction perpendicular to the circuit board 11, thereby achieving communication between the first chamber 171 and the second chamber 172; or, the multiple partitions 181 that participate in forming the first chamber 171 can be designed to be unconnected and closed, and at least one of the multiple partitions 181 that participate in forming the first chamber 171 can be designed to have a height of less than the height of the peripheral side plate 125 in the direction perpendicular to the circuit board 11, thereby achieving communication between the first chamber 171 and the second chamber 172.
[0085] It should be noted that the baffle 181 can avoid the photosensitive element 14, electronic components and other settings on the circuit board 11, so as to prevent the baffle 181 from interfering with the settings of the photosensitive element 14 and electronic components on the circuit board 11.
[0086] The partition 18 and partition plate 181 can connect the base 12 and / or the circuit board 11, and can be flexibly designed according to actual needs. In this embodiment, the partition 18 connects to the base 12, which can strengthen the structural strength of the base 12. Furthermore, the partition plate 181 can connect the bottom plate 124 and the peripheral side plate 125 of the base 12 to strengthen the structural strength at the connection between the bottom plate 124 and the peripheral side plate 125.
[0087] Please see Figure 10 and Figure 11 The camera module 10 also includes an electrical connector 19. The circuit board 11 has a first side 111. The electrical connector 19 is connected to the first side 111 and electrically connected to the circuit board 11. At least some of the micro-holes 1211 may be located in the part of the base 12 near the first side 111, the part of the base 12 away from the first side 111, etc., without limitation.
[0088] In this embodiment of the application, at least some of the micro-holes 1211 are provided on the base 12 near the first side 111.
[0089] Secondly, please refer to Figure 12 This application provides an electronic device 1, which includes the aforementioned camera module 10. The electronic device 1 can be any device including the camera module 10, such as a mobile phone, computer, etc., and is not limited thereto.
[0090] The specific structure of electronic device 1 is as described in the above embodiments. Since electronic device 1 adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be repeated here.
[0091] In the description of this application, it should be understood that the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances. Furthermore, in the description of this application, unless otherwise stated, "multiple" means at least two, for example, two, three, four, etc. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship.
[0092] The above-disclosed embodiments are merely preferred embodiments of this application and should not be construed as limiting the scope of this application. Therefore, any equivalent variations made in accordance with the claims of this application shall still fall within the scope of this application.
Claims
1. A camera module, characterized in that, include: Circuit board; A base connected to the circuit board, the base being provided with vent holes, the vent holes including multiple micro-holes; A filter element is connected to the base, and a cavity is formed between the filter element, the base, and the circuit board, with multiple micro-holes communicating with the cavity; A photosensitive element is located in the cavity, the photosensitive element is connected to and electrically connected to the circuit board, and along the optical path transmission direction, the photosensitive element is located downstream of the filter element; The lens is located upstream of the filter element along the optical path transmission direction; A motor, which is connected to the base and the lens; The base includes a base plate, which is spaced apart from the circuit board. The outer wall of the base includes a first outer wall of the base plate, and the first outer wall has a second protrusion. At least a portion of the vent extends through the second protrusion. The second protrusion is spaced apart from the outer edge of the first outer wall, such that the wall between the second protrusion and the outer edge of the first outer wall is in a lower position to position and support the motor. The motor includes a fixed component and a movable component. The fixed component is connected to the base, and the movable component is connected to the lens. The movable component is movable relative to the fixed component, and there is a gap between the movable component and the fixed component. At least a portion of the micro-hole communicates with the gap.
2. The camera module according to claim 1, characterized in that, The pore size of the micropore is on the micrometer scale.
3. The camera module according to claim 1, characterized in that, The pore diameter of the micropore is greater than or equal to 0.6 μm and less than or equal to 30 μm; And / or, the spacing between two adjacent micropores is greater than or equal to 0.1 μm and less than or equal to 50 μm; And / or, the number of the micropores is greater than or equal to 2 and less than or equal to 25.
4. The camera module according to claim 1, characterized in that, The base plate is connected to the filter element, and the base also includes: A peripheral side plate is located between the base plate and the circuit board, and the peripheral side plate connects the base plate and the circuit board; At least some of the microholes are provided in the base plate.
5. The camera module according to claim 1, characterized in that, The base has an inner wall surface forming the cavity and an outer wall surface opposite to the inner wall surface. The inner wall surface is provided with a first protrusion, the first protrusion is connected to the inner wall surface and protrudes from the inner wall surface, and at least a portion of the vent extends through the first protrusion. The outer wall surface is provided with a second protrusion, the second protrusion is connected to the outer wall surface and protrudes from the outer wall surface, and at least a portion of the vent extends through the second protrusion.
6. The camera module according to claim 1, characterized in that, Also includes: A partition is located in the chamber and divides the chamber into a first chamber and a second chamber that are in communication. At least a portion of the micro-holes are disposed corresponding to and in communication with the first chamber. The photosensitive element is disposed corresponding to the second chamber. The partition is connected to the base and / or the circuit board.
7. The camera module according to claim 6, characterized in that, The partition includes: At least one baffle plate, the baffle plate being connected to the base and / or the circuit board. The first chamber is formed between the partition plate and the inner wall of the base forming the cavity, or the number of partition plates is multiple, and the first chamber is formed between multiple partition plates.
8. The camera module according to claim 7, characterized in that, The base plate is connected to the filter element, and the base also includes: A peripheral side plate is located between the base plate and the circuit board, and the peripheral side plate connects the base plate and the circuit board. A baffle plate connects the base plate and the peripheral side plate.
9. The camera module according to claim 1, characterized in that, The projection of the vent hole at one end of the chamber onto the circuit board is offset from the projection of the photosensitive element onto the circuit board. And / or, the projection of the vent hole at one end of the chamber onto the circuit board is misaligned with the electronic components on the circuit board.
10. The camera module according to claim 1, characterized in that, The base has a through hole communicating with the chamber, and a groove is formed around the through hole on the base. The groove communicates with the through hole, and the filter element is located in the groove.
11. The camera module according to claim 1, characterized in that, The base has an inner wall surface forming the cavity and an outer wall surface opposite to the inner wall surface, and at least one end of the micro-hole extends through the inner wall surface and the other end extends through the outer wall surface; And / or, the camera module further includes a mesh plate, the mesh plate being disposed corresponding to the vent and connected to the base, and at least a portion of the micro-holes being mesh openings of the mesh plate; And / or, the base is sealed to the circuit board; And / or, the base is sealed to the filter element; And / or, the base is sealed to the motor.
12. An electronic device, characterized in that, Includes the camera module according to any one of claims 1 to 11.
Citation Information
Patent Citations
Optical filter structure, camera module and electronic equipment
CN218332110U