Heat pump control method, heat pump device, and heat pump control apparatus

Abstract

The present application relates to the field of heat pump, and discloses a heat pump control method, a heat pump device and a heat pump control equipment.The heat pump control method comprises the following steps: obtaining a target heat output temperature and an actual heat output temperature of the heat pump device; based on the difference between the target heat output temperature and the actual heat output temperature, controlling the heat pump device to switch to a corresponding working mode, wherein the working mode comprises a first working mode and a second working mode; in the first working mode, controlling a third heat exchange module to heat together with a first heat exchange module and a second heat exchange module, so as to increase the actual heat output temperature to the target heat output temperature; in the second working mode, controlling a first adjusting module to adjust the flow and temperature of the refrigerant medium flowing through the first heat exchange module.The heat pump control method provided in the present application embodiment can control the actual heat output temperature of the heat pump to be close to the target heat output temperature.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of heat pumps, in particular to a heat pump control method, a heat pump device and a heat pump control equipment. BACKGROUND

[0002] The existing heat pump recovers waste heat during operation to improve the heating efficiency. During the operation of the heat pump, if the actual heating temperature of the heat pump is greater than the target temperature or less than the target temperature, the frequency of the compressor is generally adjusted to control the heating temperature of the heat pump, so that the heating temperature approaches and reaches the target temperature.

[0003] However, during the actual operation of the heat pump, the actual heating temperature and the target temperature may have a large temperature difference, which exceeds the adjustment capability of the compressor. At this time, the actual heating temperature of the heat pump cannot reach the target temperature, and the return air temperature is higher than the exhaust air temperature, which cannot perform waste heat recovery, affecting the heating efficiency and heat recovery function of the heat pump. SUMMARY

[0004] The embodiments of the present application provide a heat pump control method, a heat pump device and a heat pump control equipment, which can control the actual heating temperature of the heat pump near the target heating temperature.

[0005] In a first aspect, the embodiments of the present application provide a heat pump control method, which is applied to a heat pump device, the heat pump device comprising a first heat exchange module, a second heat exchange module, a third heat exchange module and a first adjusting module, and the heat pump control method comprising: obtaining a target heating temperature and an actual heating temperature of the heat pump device; based on the difference between the target heating temperature and the actual heating temperature, controlling the heat pump device to switch to a corresponding working mode, the working mode comprising a first working mode and a second working mode; in the first working mode, controlling the third heat exchange module to heat together with the first heat exchange module and the second heat exchange module to increase the actual heating temperature to the target heating temperature; in the second working mode, controlling the first adjusting module to adjust the flow and temperature of the refrigerant medium flowing through the first heat exchange module.

[0006] The heat pump control method provided by the embodiments of the present application can control the heat pump device to switch between the first working mode and the second working mode according to the difference between the target heating temperature and the actual heating temperature. In the first working mode, the third heat exchange module and the first heat exchange module and the second heat exchange module heat together to increase the actual heating temperature, and in the second working mode, the first adjusting module can be controlled to adjust the flow and temperature of the refrigerant medium flowing through the first heat exchange module to reduce the actual heating temperature to the target heating temperature, thereby increasing the temperature adjustment range of the heat pump device and improving the temperature adjustment capability of the heat pump device.

[0007] Optionally, the heat pump device further comprises a heating module, and the step of controlling the heat pump device to switch to the corresponding working mode based on the difference between the target heat output temperature and the actual heat output temperature comprises: based on the difference between the target heat output temperature and the actual heat output temperature, if the actual heat output temperature is less than the target heat output temperature, adjusting the heating frequency of the heating module until the actual heat output temperature increases to the target heat output temperature; and if the actual heat output temperature is greater than the target heat output temperature, adjusting the heating frequency of the heating module until the actual heat output temperature decreases to the target heat output temperature.

[0008] Optionally, if the actual heat output temperature is less than the target heat output temperature, the step of adjusting the heating frequency of the heating module until the actual heat output temperature increases to the target heat output temperature comprises: if the actual heat output temperature is less than the target heat output temperature, controlling the heat pump device to switch to a first working mode; in the first working mode, adjusting the heating frequency of the heating module to increase the temperature of the refrigerant medium, so that the first heat exchange module and the second heat exchange module are heated, and the third heat exchange module is controlled to start, so that the first heat exchange module, the second heat exchange module and the third heat exchange module jointly heat to increase the actual heat output temperature to the target heat output temperature.

[0009] Optionally, if the actual heat output temperature is greater than the target heat output temperature, the step of adjusting the heating frequency of the heating module until the actual heat output temperature decreases to the target heat output temperature comprises: if the actual heat output temperature is greater than the target heat output temperature, controlling the heat pump device to switch to a second working mode; in the second working mode, adjusting the heating frequency of the heating module and controlling the first adjusting module to start, to reduce the temperature of the refrigerant medium passing through the first heat exchange module and reduce the flow of the refrigerant medium passing through the first heat exchange module, so that the first heat exchange module is cooled to reduce the actual heat output temperature to the target heat output temperature.

[0010] Optionally, the heat pump control method further comprises: obtaining the enthalpy difference between the refrigerant inlet end and the refrigerant outlet end of the first heat exchange module and the second heat exchange module; and based on the enthalpy difference between the refrigerant inlet end and the refrigerant outlet end of the first heat exchange module and the second heat exchange module, obtaining the intermediate temperature between the first heat exchange module and the second heat exchange module.

[0011] Optionally, the heat pump control method further comprises: based on the intermediate temperature, obtaining the first heat input temperature and the first heat output temperature of the first heat exchange module and the second heat input temperature and the second heat output temperature of the second heat exchange module.

[0012] In a second aspect, an embodiment of the present application provides a heat pump device, comprising a first heat exchange module, a second heat exchange module, a third heat exchange module and a first adjusting module, and further comprising: an acquisition module, configured to acquire a target heat output temperature and an actual heat output temperature of the heat pump device; a control module, configured to control the heat pump device to switch to a corresponding working mode based on a difference between the target heat output temperature and the actual heat output temperature, wherein the working mode comprises a first working mode and a second working mode; and an execution module, configured to control the third heat exchange module to heat together with the first heat exchange module and the second heat exchange module to increase the actual heat output temperature to the target heat output temperature in the first working mode, and control the first adjusting module to adjust a flow rate and a temperature of a refrigerant medium flowing through the first heat exchange module in the second working mode; the second heat exchange module is in communication with the first heat exchange module, and the first heat exchange module is arranged upstream of the second heat exchange module; the third heat exchange module is electrically connected to the control module, the third heat exchange module is arranged downstream of the second heat exchange module, and an external fluid can flow through the first heat exchange module, the second heat exchange module and the third heat exchange module in sequence and absorb heat of the first heat exchange module, the second heat exchange module and the third heat exchange module; the first adjusting module is electrically connected to the control module, two ends of the first adjusting module are in communication with two ends of the first heat exchange module, and the first adjusting module is configured to adjust the flow rate and the temperature of the refrigerant medium flowing to the first heat exchange module.

[0013] The heat pump device provided by the embodiment of the present application can control the heat pump device to switch between the first working mode and the second working mode according to the difference between the target heat output temperature and the actual heat output temperature, the third heat exchange module and the first heat exchange module and the second heat exchange module heat together to increase the actual heat output temperature in the first working mode, and the first adjusting module can adjust the flow rate and the temperature of the refrigerant medium flowing through the first heat exchange module in the second working mode. When the first heat exchange module and the second heat exchange module heat together, the third heat exchange module can assist in heating the fluid flowing through the first heat exchange module and the second heat exchange module, so that the actual heat output temperature of the heat pump device is higher, the first adjusting module can control the flow rate and the temperature of the refrigerant medium flowing to the first heat exchange module, so that the actual heat output temperature of the heat pump device is lower, the temperature adjustment range of the heat pump device is increased, and the temperature adjustment capability of the heat pump device is improved.

[0014] Optionally, the heat pump device further comprises: a heating module, a refrigerant outlet end of the heating module is in communication with the second heat exchange module, and the heating module is configured to increase a pressure and a temperature of the refrigerant medium; an evaporation module, the evaporation module is in communication with a refrigerant inlet end of the heating module, and the evaporation module is arranged downstream of the third heat exchange module, and the evaporation module is configured to absorb waste heat of the external fluid flowing through the first heat exchange module, the second heat exchange module and the third heat exchange module; and a throttling module, two ends of the throttling module are respectively in communication with the first heat exchange module and the evaporation module, and the throttling module is configured to adjust a flow rate of the refrigerant medium flowing into the evaporation module.

[0015] Optionally, the heat pump device further comprises a second adjusting module, the second adjusting module is electrically connected with the control module and is arranged between the first heat exchange module and the second heat exchange module, and the second adjusting module is used for adjusting the flow of the external fluid between the first heat exchange module and the second heat exchange module.

[0016] In a third aspect, an embodiment of the present application provides a heat pump control device, comprising a processor and a memory, and the memory stores instructions; the processor invokes the instructions in the memory, so that the heat pump control device implements the heat pump control method of any one of the preceding embodiments of the first aspect of the present application.

[0017] The processor of the heat pump control device provided by the embodiment of the present application executes the heat pump control method of any one of the preceding embodiments of the first aspect of the present application by invoking the instructions in the memory, can control the heat pump device to switch between the first working mode and the second working mode according to the difference between the target heat output temperature and the actual heat output temperature, the third heat exchange module and the first heat exchange module and the second heat exchange module can jointly heat to increase the actual heat output temperature in the first working mode, and the first adjusting module can be controlled to adjust the flow and temperature of the refrigerant medium flowing through the first heat exchange module in the second working mode, thereby increasing the temperature adjustment range of the heat pump device and improving the temperature adjustment capability of the heat pump device. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiment or prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained according to the structures shown in these drawings without creative labor.

[0019] Figure 1 Flow chart of the first embodiment of the heat pump control method of the present application;

[0020] Figure 2 Flow chart of step S120 in the first embodiment of the heat pump control method of the present application;

[0021] Figure 3 Flow chart of the second embodiment of the heat pump control method of the present application;

[0022] Figure 4 Structure block diagram of an embodiment of the heat pump device of the present application;

[0023] Figure 5 Structure schematic diagram of an embodiment of the heat pump device of the present application;

[0024] Figure 6 Structure block diagram of one embodiment of the heat pump control device of the present application.

[0025] Brief description of the drawings:

[0026] 210 - acquisition module; 220 - control module; 230 - execution module;

[0027] A1 - first heat exchange module; A2 - second heat exchange module; A3 - third heat exchange module; N1 - first adjustment module; N2 - second adjustment module; M1 - throttling module; X1 - heating module; Z1 - evaporation module;

[0028] 310 - processor; 320 - memory; 330 - communication interface; 340 - bus.

[0029] The implementation, functional features and advantages of the present application will be further described with reference to the embodiments in combination with the accompanying drawings. DETAILED DESCRIPTION

[0030] The technical solutions in the embodiments of the present application will be clearly and completely described below in combination with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the present application.

[0031] It should be noted that all directional indications such as up, down, left, right, front, back, etc. in the embodiments of the present application are only used to explain the relative positional relationship, movement condition, etc. between components in a certain posture, such as shown in the accompanying drawings. If the certain posture changes, the directional indications also change accordingly.

[0032] In addition, the description of "first", "second" and the like in the present application is only for the purpose of description, and cannot be understood as indicating or implying the relative importance of the indicated technical features or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first", "second" can explicitly or implicitly include at least one of the features. In addition, the technical solutions of each embodiment can be combined with each other, but it must be based on the realization of those skilled in the art. When the combination of technical solutions appears contradictory or unachievable, it should be considered that the combination of technical solutions does not exist, and is not within the protection scope required by the present application.

[0033] Figure 1 Flow chart of the first embodiment of the heat pump control method of the present application; Figure 2 Flow chart of step S120 in the first embodiment of the heat pump control method of the present application.

[0034] For the convenience of understanding, the heat pump control method of the embodiment of the present application is described below. The heat pump control method is applied to a heat pump device, which comprises a first heat exchange module A1, a second heat exchange module A2, a third heat exchange module A3 and a first adjusting module N1. The heat pump control method of the embodiment of the present application comprises steps S110 to S120.

[0035] In step S110, the target heat output temperature and the actual heat output temperature of the heat pump device are obtained. The actual heat output temperature is the actual outflow temperature of the fluid after heat exchange of the heat pump device, and the target heat output temperature is the preset outflow temperature of the fluid after heat exchange of the heat pump device.

[0036] In step S120, based on the difference between the target heat output temperature and the actual heat output temperature, the heat pump device is controlled to switch to a corresponding working mode, which comprises a first working mode and a second working mode.

[0037] In the first working mode, the third heat exchange module A3 is controlled to heat together with the first heat exchange module A1 and the second heat exchange module A2, so as to increase the actual heat output temperature to the target heat output temperature.

[0038] In the second working mode, the first adjusting module N1 is controlled to adjust the flow rate and temperature of the refrigerant medium flowing through the first heat exchange module A1. The first adjusting module N1 can increase or decrease the flow rate of the refrigerant medium flowing through the first heat exchange module A1.

[0039] In this embodiment, when the external fluid flows into the heat pump device for heat exchange, if the third heat exchange module A3 is not started, the external fluid first flows through the first heat exchange module A1 for heating, and then flows through the second heat exchange module A2 for heating. The heated fluid finally flows out of the heat pump device. The external fluid includes air flow or water flow, and the first heat exchange module A1, the second heat exchange module A2 and the third heat exchange module A3 can heat the air flow or water flow flowing therethrough, thereby realizing the heating function of the heat pump device.

[0040] When the actual heat output temperature is lower than the target heat output temperature, the heat pump device switches to the first working mode, the third heat exchange module A3 is started, and the external fluid flows through the first heat exchange module A1 for heating, and then flows through the second heat exchange module A2 and the third heat exchange module A3, so that the first heat exchange module A1, the second heat exchange module A2 and the third heat exchange module A3 heat the fluid together, thereby increasing the actual heat output temperature to the target heat output temperature.

[0041] The refrigerant medium circulates in the heat pump device due to the intercommunication between the first heat exchange module A1 and the second heat exchange module A2. Therefore, when the actual heat output temperature is higher than the target heat output temperature, the heat pump device switches to the second working mode, the first adjusting module N1 reduces the flow of the refrigerant medium flowing into the first heat exchange module A1 and lowers the temperature of the refrigerant medium flowing into the first heat exchange module A1, reduces the heat exchange amount of the first heat exchange module A1, so that the temperature of the fluid flowing through the first heat exchange module A1 is lowered, and then the actual heat output temperature of the fluid is lowered to the target heat output temperature. When the actual heat output temperature is too low, the first adjusting module N1 can also increase the flow of the refrigerant medium flowing into the first heat exchange module A1, so that the actual heat output temperature is increased.

[0042] In some optional embodiments, the heat pump device further comprises a heating module X1, and the step of controlling the heat pump device to switch to the corresponding working mode based on the difference between the target heat output temperature and the actual heat output temperature comprises:

[0043] Based on the difference between the target heat output temperature and the actual heat output temperature, if the actual heat output temperature is less than the target heat output temperature, the heating frequency of the heating module X1 is adjusted until the actual heat output temperature is increased to the target heat output temperature; if the actual heat output temperature is greater than the target heat output temperature, the heating frequency of the heating module X1 is adjusted until the actual heat output temperature is reduced to the target heat output temperature. The heating module X1 is used to compress and heat the refrigerant medium.

[0044] In this embodiment, if the actual heat output temperature is less than the target heat output temperature, first, the heating frequency of the heating module X1 is adjusted to increase the temperature of the refrigerant medium, so as to increase the temperature of the first heat exchange module A1 and the second heat exchange module A2, and then increase the actual heat output temperature, at this time, the third heat exchange module A3 is closed and does not participate in heat exchange.

[0045] If the actual heat output temperature is greater than the target heat output temperature, first, the heating frequency of the heating module X1 is adjusted to reduce the temperature of the refrigerant medium, so as to reduce the temperature of the first heat exchange module A1 and the second heat exchange module A2, and then reduce the actual heat output temperature, at this time, the third heat exchange module A3 is closed and does not participate in heat exchange.

[0046] If the difference between the target heat output temperature and the actual heat output temperature is too large, only relying on the heating module X1 to adjust cannot adjust the actual heat output temperature to the target heat output temperature, then the heat pump device is controlled to switch to the first working mode or the second working mode, so that the actual heat output temperature can reach the target heat output temperature, and the specific adjustment mode is as follows.

[0047] Further, if the actual heat output temperature is less than the target heat output temperature, the step of adjusting the heating frequency of the heating module X1 until the actual heat output temperature is increased to the target heat output temperature comprises:

[0048] If the actual heat output temperature is less than the target heat output temperature, the heat pump device is switched to the first working mode;

[0049] In the first working mode, the heating frequency of the heating module X1 is adjusted to increase the temperature of the refrigerant medium, so that the first heat exchange module A1 and the second heat exchange module A2 are warmed up, and the third heat exchange module A3 is controlled to start, so that the first heat exchange module A1, the second heat exchange module A2 and the third heat exchange module A3 jointly heat to increase the actual heat output temperature to the target heat output temperature.

[0050] In this embodiment, if the difference between the target heat output temperature and the actual heat output temperature exceeds the adjustment capacity of the heating module X1, the heat pump device is switched to the first working mode or the second working mode to further increase the temperature adjustment range of the heat pump device, so that the actual heat output temperature can reach the target heat output temperature.

[0051] In the first working mode, the third heat exchange module A3 starts, and the external fluid flows through the first heat exchange module A1 for heating, and then flows through the second heat exchange module A2 and the third heat exchange module A3, so that the first heat exchange module A1, the second heat exchange module A2 and the third heat exchange module A3 jointly heat the fluid, further increasing the heat output temperature, so that the actual heat output temperature can be increased to the target heat output temperature.

[0052] Further, if the actual heat output temperature is greater than the target heat output temperature, the heating frequency of the heating module X1 is adjusted until the actual heat output temperature is reduced to the target heat output temperature, which includes:

[0053] If the actual heat output temperature is greater than the target heat output temperature, the heat pump device is switched to the second working mode;

[0054] In the second working mode, the heating frequency of the heating module X1 is adjusted and the first adjusting module N1 is controlled to start, so that the temperature of the refrigerant medium passing through the first heat exchange module A1 is reduced and the flow of the refrigerant medium passing through the first heat exchange module A1 is reduced, so that the first heat exchange module is cooled to reduce the actual heat output temperature to the target heat output temperature.

[0055] In this embodiment, in the second working mode, by adjusting the heating frequency of the heating module X1, the flow of the refrigerant medium flowing into the first heat exchange module A1 is reduced and the temperature of the refrigerant medium flowing into the first heat exchange module A1 is reduced by the first adjusting module N1, so that the temperature of the first heat exchange module A1 is reduced, and the temperature of the external fluid after the external fluid passes through the first heat exchange module A1 is reduced, so that the actual heat output temperature of the external fluid can be reduced to the target heat output temperature.

[0056] In some optional embodiments, the heat pump device further comprises a second regulating module N2, which is arranged between the first heat exchange module A1 and the second heat exchange module A2, and is configured to regulate the on-off of the fluid between the first heat exchange module A1 and the second heat exchange module A2.

[0057] In the embodiment, the second regulating module N2 is configured to control the on-off of the fluid between the first heat exchange module A1 and the second heat exchange module A2. When the actual heat output temperature cannot be reduced to the target heat output temperature by the heating module X1, the second regulating module N2 is controlled to be closed, and the first heat exchange module A1 and the second heat exchange module A2 are separated, so that the external fluid only exchanges heat with the first heat exchange module A1 and then flows out, thereby reducing the actual outflow temperature to the target heat output temperature.

[0058] When the second regulating module N2 is not needed to regulate the actual outflow temperature, the second regulating module N2 is controlled to be opened, and the first heat exchange module A1 and the second heat exchange module A2 are connected, so that the external fluid can flow through the first heat exchange module A1 and the second heat exchange module A2 to exchange heat.

[0059] Figure 3 The flow chart of the second embodiment of the heat pump control method. In some optional embodiments, the heat pump control method further comprises:

[0060] obtaining the enthalpy difference value of the refrigerant inlet end and the refrigerant outlet end of the first heat exchange module A1 and the second heat exchange module A2; and based on the enthalpy difference value of the refrigerant inlet end and the refrigerant outlet end of the first heat exchange module A1 and the second heat exchange module A2, obtaining the intermediate temperature between the first heat exchange module A1 and the second heat exchange module A2.

[0061] Further, the heat pump control method further comprises: based on the intermediate temperature, obtaining the first heat input temperature and the first heat output temperature of the first heat exchange module A1 and the second heat input temperature and the second heat output temperature of the second heat exchange module A2. The first heat input temperature is the temperature of the external fluid before flowing into the first heat exchange module A1, the first heat output temperature is the temperature of the external fluid after flowing out of the first heat exchange module A1, the second heat input temperature is the temperature of the external fluid before flowing into the second heat exchange module A2, and the second heat output temperature is the temperature of the external fluid after flowing out of the second heat exchange module A2.

[0062] In some optional embodiments, the heat pump device further comprises a heating module X1, an evaporation module Z1 and a throttling module M1. The refrigerant outlet end of the heating module X1 is connected with the second heat exchange module A2, and the heating module X1 is configured to increase the pressure and temperature of the refrigerant medium.

[0063] The evaporating module Z1 is in communication with the refrigerant inlet end of the heating module X1, and is arranged downstream of the third heat exchange module A3. The evaporating module Z1 is used to absorb the waste heat generated by the first heat exchange module A1 and the second heat exchange module A2, or the waste heat generated by the first heat exchange module A1, the second heat exchange module A2 and the third heat exchange module.

[0064] The throttling module M1 is in communication with the first heat exchange module A1 and the evaporating module Z1 at two ends thereof, and is used to adjust the flow of the refrigerant medium flowing into the evaporating module Z1.

[0065] In the embodiment, the first intermediate temperature is obtained by the following formula:

[0066]

[0067] Since the specific heat value of the fluid in the actual operation of the heat pump device changes little, the above formula can be further simplified as:

[0068]

[0069] Generally, the temperature of the first heat exchange module A1 of the heat pump device located upstream is lower than the temperature of the second heat exchange module A2 located downstream, and thus the first intermediate temperature of the heat pump device is less than the average of the actual inflow temperature and the actual outflow temperature.

[0070] Therefore, the heating efficiency COP of the entire unit is the ratio of the sum of the temperatures of the first heat exchange module A1 and the second heat exchange module A2 to the operating power of the entire heat pump device.

[0071]

[0072] In the above formula, the meanings of the symbols are as follows:

[0073] Q c1 : heat exchange amount of the second heat exchange module;

[0074] Q c2 : heat exchange amount of the first heat exchange module;

[0075] Q e : heat exchange amount of the evaporating module;

[0076] W: operating power of the entire heat pump device;

[0077] COP: heating efficiency of the entire heat pump device;

[0078] m f : mass flow of the refrigerant medium;

[0079] m a : mass flow of the external fluid;

[0080] The enthalpy difference value of the refrigerant medium of the second heat exchange module;

[0081] The enthalpy difference value of the refrigerant medium of the first heat exchange module;

[0082] The average specific heat value of the inlet and outlet fluids of the second heat exchange module;

[0083] The average specific heat value of the inlet and outlet fluids of the first heat exchange module;

[0084] ΔT1: The temperature difference value of the inlet and outlet fluids of the second heat exchange module;

[0085] ΔT2: The temperature difference value of the inlet and outlet fluids of the first heat exchange module;

[0086] C p11 : The specific heat value of the inlet fluid of the second heat exchange module;

[0087] C p12 : The specific heat value of the outlet fluid of the second heat exchange module;

[0088] C p21 : The specific heat value of the inlet fluid of the first heat exchange module;

[0089] C p22 : The specific heat value of the outlet fluid of the first heat exchange module;

[0090] T in : The temperature of the external fluid when flowing into the heat pump device;

[0091] T out : The temperature of the external fluid when flowing out of the heat pump device;

[0092] T mid : The intermediate temperature of the external fluid when flowing out of the first heat exchange module and flowing into the second heat exchange module.

[0093] According to the obtained intermediate temperature, the required inlet temperature and outlet temperature of the first heat exchange module A1 and the second heat exchange module A2 can be obtained, and then a suitable heat exchange module can be selected according to the obtained inlet temperature and outlet temperature of the first heat exchange module A1 and the second heat exchange module A2. The specific selection of the heat exchange module can be selected according to actual needs, which needs to meet the corresponding inlet temperature, outlet temperature and heat exchange capacity. Herein, no limitation is made.

[0094] The heat pump control method provided by the embodiment of the present application comprises: obtaining a target heat output temperature and an actual heat output temperature of a heat pump device; based on a difference between the target heat output temperature and the actual heat output temperature, controlling the heat pump device to switch to a corresponding working mode, the working mode comprising a first working mode and a second working mode; in the first working mode, controlling a third heat exchange module A3 to heat together with a first heat exchange module A1 and a second heat exchange module A2 to increase the actual heat output temperature to the target heat output temperature; in the second working mode, controlling a first adjusting module N1 to adjust the flow and temperature of the refrigerant medium flowing through the first heat exchange module A1.

[0095] The heat pump control method provided by the embodiment of the present application can control the heat pump device to switch between the first working mode and the second working mode according to the difference between the target heat output temperature and the actual heat output temperature, in the first working mode, the third heat exchange module A3 and the first heat exchange module A1 and the second heat exchange module A2 heat together to increase the actual heat output temperature, and in the second working mode, the first adjusting module N1 can be controlled to adjust the flow and temperature of the refrigerant medium flowing through the first heat exchange module A1 to reduce the actual heat output temperature to the target heat output temperature, the temperature adjustment range of the heat pump device is increased and the temperature adjustment capability of the heat pump device is improved by the heat pump control method disclosed in the present application.

[0096] For the above method embodiment, the embodiment of the present application further provides a heat pump device, Figure 4 a structural block diagram of an embodiment of the heat pump device of the present application; Figure 5 a structural schematic diagram of an embodiment of the heat pump device of the present application. The heat pump device comprises an obtaining module 210, a control module 220, an executing module 230, a first heat exchange module A1, a second heat exchange module A2, a third heat exchange module A3 and a first adjusting module N1.

[0097] The obtaining module 210 is used to obtain a target heat output temperature and an actual heat output temperature of a heat pump device, and the control module 220 is used to control the heat pump device to switch to a corresponding working mode based on the difference between the target heat output temperature and the actual heat output temperature, the working mode comprising a first working mode and a second working mode.

[0098] The executing module 230 is used to control the third heat exchange module A3 to heat together with the first heat exchange module A1 and the second heat exchange module A2 to increase the actual heat output temperature to the target heat output temperature in the first working mode, and control the first adjusting module N1 to adjust the flow and temperature of the refrigerant medium flowing through the first heat exchange module A1 in the second working mode.

[0099] The second heat exchange module A2 is in communication with the first heat exchange module A1, and the first heat exchange module A1 is arranged upstream of the second heat exchange module A2; the third heat exchange module A3 is electrically connected with the control module 220, and the third heat exchange module A3 is arranged downstream of the second heat exchange module A2; and the external fluid can flow through the first heat exchange module A1, the second heat exchange module A2 and the third heat exchange module A3 in sequence and absorb the heat of the first heat exchange module A1, the second heat exchange module A2 and the third heat exchange module A3.

[0100] The first adjusting module N1 is electrically connected with the control module 220, and the two ends of the first adjusting module N1 are in communication with the two ends of the first heat exchange module A1; and the first adjusting module N1 is used for controlling the flow and temperature of the refrigerant medium flowing to the first heat exchange module A1. The first adjusting module N1 can be a valve or other device capable of controlling the flow of the refrigerant medium flowing to the first heat exchange module A1.

[0101] In the embodiment, the first heat exchange module A1, the second heat exchange module A2 and the third heat exchange module A3 are located in the heat exchange channel of the heat pump device; the first heat exchange module A1 and the second heat exchange module A2 are condensers, and the third heat exchange module A3 is a heater; the first heat exchange module A1 is arranged at the air inlet or water inlet of the heat exchange channel; the second heat exchange module A2 is arranged downstream of the first heat exchange module A1; and the third heat exchange module A3 is arranged downstream of the second heat exchange module A2. That is, the fluid flowing into the heat pump device is first heated by the first heat exchange module A1, then heated by the second heat exchange module A2, and finally heated by the third heat exchange module A3 if the third heat exchange module A3 is started; or the fluid flows out of the second heat exchange module A2 directly after being heated by the second heat exchange module A2 if the third heat exchange module A3 is closed.

[0102] The heat pump device provided by the embodiment can control the heat pump device to switch between the first working mode and the second working mode according to the difference between the target heat output temperature and the actual heat output temperature; in the first working mode, the third heat exchange module A3 and the first heat exchange module A1 and the second heat exchange module A2 jointly heat to increase the actual heat output temperature; and in the second working mode, the first adjusting module N1 can be controlled to adjust the flow and temperature of the refrigerant medium flowing through the first heat exchange module A1, so as to reduce the actual heat output temperature to the target heat output temperature. When the first heat exchange module A1 and the second heat exchange module A2 jointly heat, the third heat exchange module A3 can assist in heating the fluid flowing through the first heat exchange module A1 and the second heat exchange module A2, so as to make the actual heat output temperature of the heat pump device higher; the first adjusting module N1 can control the flow and temperature of the refrigerant medium flowing to the first heat exchange module A1, so as to make the actual heat output temperature of the heat pump device lower; the heat pump device disclosed in the application has a larger temperature adjustment range and a better temperature adjustment capability.

[0103] In some alternative embodiments, the heat pump device further comprises a heating module X1, an evaporating module Z1 and a throttling module M1. The heating module X1 is in communication with the second heat exchange module A2, and the heating module X1 is configured to increase the pressure and temperature of the refrigerant medium.

[0104] The evaporating module Z1 is in communication with the refrigerant inlet end of the heating module X1, and the evaporating module Z1 is arranged downstream of the third heat exchange module A3. The evaporating module Z1 is configured to absorb the waste heat generated by the first heat exchange module A1, the second heat exchange module A2 and the third heat exchange module A3.

[0105] The throttling module M1 is in communication with the first heat exchange module A1 and the evaporating module Z1, respectively. The throttling module M1 is configured to regulate the flow of the refrigerant medium into the evaporating module Z1.

[0106] In the present embodiment, the heating module X1, the second heat exchange module A2, the first heat exchange module A1 and the evaporating module Z1 are in communication with each other. The heating module X1 is configured to compress and heat the refrigerant medium to a high-temperature and high-pressure state and flow to the second heat exchange module A2. The refrigerant medium is condensed to a high-pressure and low-temperature liquid state after heat exchange in the second heat exchange module A2, and further flows into the first heat exchange module A1 for further heat exchange and condenses to a low-temperature and low-pressure gas-liquid mixed state. Then the refrigerant medium stops flowing into the evaporating module Z1. The evaporating module Z1 is configured to absorb the waste heat of the fluid flowing through the first heat exchange module A1, the second heat exchange module A2 and the third heat exchange module A3, so that the refrigerant medium is heated and evaporated from a low-temperature and low-pressure gas-liquid mixed state to a high-temperature and low-pressure gas state, and then enters the heating module X1 to complete a cycle.

[0107] Similarly, the evaporating module Z1 can also absorb the waste heat of the external fluid flowing through only the first heat exchange module A1 or only the first heat exchange module A1 and the second heat exchange module A2.

[0108] When the heat pump device is neither in the first working mode nor in the second working mode, the external fluid flows into the heat pump device, first passes through the first heat exchange module A1, and the high-pressure and low-temperature liquid refrigerant medium in the first heat exchange module A1 preliminarily heats the fluid. The preliminarily heated fluid passes through the second heat exchange module A2, and the high-temperature and high-pressure refrigerant medium in the second heat exchange module A2 performs secondary heating on the fluid, so that the fluid becomes a high-temperature state. After passing through the second heat exchange module A2, the fluid flows out, and the used fluid flows to the evaporating module Z1, so that the evaporating module Z1 recovers the waste heat of the fluid.

[0109] In the first working mode, the third heating module A3 is started, and the external fluid flows through the first heat exchange module A1, the second heat exchange module A2 and the third heating module A3. In the second working mode, the external fluid flows through the first heat exchange module A1 and the second heat exchange module A2 after being cooled.

[0110] The heat pump device can fully recycle the waste heat of the hot air or hot water after heat exchange, improve the heating efficiency of the heat pump device, and reduce the heating cost of the heat pump device.

[0111] Specifically, the heating module X1 is a compressor, the evaporating module Z1 is an evaporator, the throttling module M1 is a throttle valve, and the first regulating module N1 is a bypass valve connected to both ends of the first heat exchange module A1.

[0112] In some optional embodiments, the heat pump device further comprises a second regulating module N2 electrically connected to the control module 220 and arranged between the first heat exchange module A1 and the second heat exchange module A2, and the second regulating module N2 is used to regulate the flow of the external fluid between the first heat exchange module A1 and the second heat exchange module A2.

[0113] In this embodiment, the second regulating module N2 is used to control the opening and closing of the fluid flow path between the first heat exchange module A1 and the second heat exchange module A2. When the actual heat output temperature cannot be reduced to the target heat output temperature by the heating module X1, the second regulating module N2 is controlled to be closed, and the first heat exchange module A1 and the second heat exchange module A2 are separated, so that the external fluid only passes through the first heat exchange module A1 for heat exchange, thereby reducing the actual flow-out temperature to the target heat output temperature.

[0114] When the second regulating module N2 is not needed to regulate the actual flow-out temperature, the second regulating module N2 is controlled to be opened, and the first heat exchange module A1 and the second heat exchange module A2 are connected, so that the external fluid can flow through the first heat exchange module A1 and the second heat exchange module A2 for heat exchange. The second regulating module N2 can be a valve or an electric door, which can control the opening and closing of the fluid flow path between the first heat exchange module A1 and the second heat exchange module A2.

[0115] For the above method embodiments, the present embodiment also provides a heat pump control device, Figure 6 The structure block diagram of an embodiment of the heat pump control device. The heat pump control device comprises a processor 310 and a memory 320, and the memory 320 stores instructions; the processor 310 calls the instructions in the memory 320, so that the heat pump control device realizes the heat pump control method of any one of the preceding embodiments of the present application.

[0116] The heat pump control method comprises: obtaining a target heat output temperature and an actual heat output temperature of a heat pump device; based on a difference between the target heat output temperature and the actual heat output temperature, controlling the heat pump device to switch to a corresponding working mode, the working mode comprising a first working mode and a second working mode; in the first working mode, controlling a third heat exchange module A3 to heat together with a first heat exchange module A1 and a second heat exchange module A2 to increase the actual heat output temperature to the target heat output temperature; and in the second working mode, controlling a first adjusting module N1 to adjust the flow and temperature of the refrigerant medium passing through the first heat exchange module A1.

[0117] The processor 310 of the heat pump control device provided by the embodiment of the present application can execute the heat pump control method of any one of the preceding embodiments of the first aspect of the present application by calling the instructions in the memory 320, and can control the heat pump device to switch between the first working mode and the second working mode according to the difference between the target heat output temperature and the actual heat output temperature, in the first working mode, the third heat exchange module A3 can heat together with the first heat exchange module A1 and the second heat exchange module A2 to increase the actual heat output temperature, and in the second working mode, the first adjusting module N1 can be controlled to adjust the flow and temperature of the refrigerant medium passing through the first heat exchange module A1, the heat pump control device disclosed in the present application increases the temperature adjustment range of the heat pump device and improves the temperature adjustment capability of the heat pump device.

[0118] Further, the heat pump control device provided by the embodiment of the present application can further comprise a communication interface 330 and a bus 340, and the processor 310, the memory 320 and the communication interface 330 are electrically connected through the bus 340.

[0119] The memory 320 can comprise a high-speed random access memory (RAM) and can also comprise a non-volatile memory, for example at least one disk memory. The communication between the system network element and at least one other network element is realized through at least one communication interface 330 (which can be wired or wireless), and the Internet, a wide area network, a local area network, a metropolitan area network, etc. can be used. The bus 340 can be an ISA bus, a PCI bus or an EISA bus, etc. The bus can be divided into an address bus, a data bus, a control bus, etc. For the convenience of representation, Figure 6 Only one bidirectional arrow is used in the figure to represent only one bus or one type of bus.

[0120] The processor 310 can be an integrated circuit chip with a signal processing capability. In implementation, the steps of the above method can be completed by integrated logic circuits or instructions in the form of software in the processor 310. The processor 310 described above can be a general-purpose processor, including a central processing unit (CPU), a network processor (NP), and the like; can also be a digital signal processor (DSP), an application specific integrated circuit (ASIC), a field-programmable gate array (FPGA) or other programmable logic device, a discrete gate or transistor logic device, a discrete hardware component. The disclosed methods, steps and logic block diagrams in the embodiments of the present application can be implemented or executed. The general-purpose processor can be a microprocessor or the processor can also be any conventional processor. The steps of the method disclosed in combination with the embodiments of the present application can be directly embodied as a hardware code processor for execution, or a combination of hardware and software modules in the code processor for execution. The software module can be located in a random access memory, a flash memory, a read-only memory, a programmable read-only memory or an electrically erasable programmable memory, a register, and the like storage medium mature in the art. The storage medium is located in the memory 320, and the processor 310 reads the information in the memory 320, and combines the hardware to complete the steps of the method of the above embodiment.

[0121] The embodiment of the present application also provides a computer readable storage medium, which can be a non-volatile computer readable storage medium, and can also be a volatile computer readable storage medium, and the computer readable storage medium has instructions stored therein, and the instructions make a computer execute the steps of the heat pump control method when the instructions run on the computer.

[0122] The computer readable storage medium provided by the embodiment of the present application stores the data and computer executable instructions of the heat pump control method, and the heat pump control method comprises the following steps: obtaining a target heat output temperature and an actual heat output temperature of a heat pump device; based on the difference between the target heat output temperature and the actual heat output temperature, controlling the heat pump device to switch to a corresponding working mode, and the working mode includes a first working mode and a second working mode; in the first working mode, controlling the third heat exchange module A3 to heat together with the first heat exchange module A1 and the second heat exchange module A2 to increase the actual heat output temperature to the target heat output temperature; in the second working mode, controlling the first adjusting module N1 to adjust the flow and temperature of the refrigerant medium passing through the first heat exchange module A1.

[0123] The computer readable storage medium provided by the embodiment of the present application can control the heat pump device to switch between the first working mode and the second working mode according to the difference between the target heat output temperature and the actual heat output temperature, the third heat exchange module A3 and the first heat exchange module A1 and the second heat exchange module A2 can jointly heat to increase the actual heat output temperature in the first working mode, and the first adjusting module N1 can be controlled to adjust the flow and temperature of the refrigerant medium passing through the first heat exchange module A1 in the second working mode, thereby increasing the temperature adjusting range of the heat pump device and improving the temperature adjusting capability of the heat pump device.

[0124] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working processes of the above-described system, device and unit can refer to the corresponding processes in the foregoing method embodiments, which will not be described herein.

[0125] The integrated unit, if realized in the form of a software functional unit and sold or used as an independent product, can be stored in a computer readable storage medium. Based on such understanding, the technical solutions of the present application or the whole or part of the technical solutions that make essential contributions to the prior art can be embodied in the form of a software product. The computer software product is stored in a storage medium and includes a plurality of instructions for causing a computer device (which can be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the method described in the various embodiments of the present application. The foregoing storage medium includes a U disk, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk, and various program code storage media.

[0126] The above-described embodiments are only used to illustrate the technical solutions of the present application, rather than limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacements for some technical features; and these modifications or replacements do not make the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A heat pump control method characterized by, The heat pump control method is applied to a heat pump device, the heat pump device comprising a first heat exchange module, a second heat exchange module, a third heat exchange module and a first adjusting module, the heat pump control method comprising: obtaining a target heat output temperature and an actual heat output temperature of the heat pump device; controlling the heat pump device to switch to a corresponding working mode based on a difference between the target heat output temperature and the actual heat output temperature, the working mode comprising a first working mode and a second working mode; in the first working mode, controlling the third heat exchange module to heat together with the first heat exchange module and the second heat exchange module to increase the actual heat output temperature to the target heat output temperature; in the second working mode, controlling the first adjusting module to adjust the flow and temperature of the refrigerant medium flowing through the first heat exchange module.

2. The heat pump control method according to claim 1, characterized by, The heat pump device further comprises a heating module, and the step of controlling the heat pump device to switch to a corresponding working mode based on a difference between the target heat output temperature and the actual heat output temperature comprises: based on the difference between the target heat output temperature and the actual heat output temperature, if the actual heat output temperature is less than the target heat output temperature, adjusting the heating frequency of the heating module until the actual heat output temperature increases to the target heat output temperature; if the actual heat output temperature is greater than the target heat output temperature, adjusting the heating frequency of the heating module until the actual heat output temperature decreases to the target heat output temperature.

3. The heat pump control method according to claim 2, characterized by, The step of adjusting the heating frequency of the heating module until the actual heat output temperature increases to the target heat output temperature if the actual heat output temperature is less than the target heat output temperature comprises: if the actual heat output temperature is less than the target heat output temperature, controlling the heat pump device to switch to the first working mode; in the first working mode, adjusting the heating frequency of the heating module to increase the temperature of the refrigerant medium, so that the first heat exchange module and the second heat exchange module are heated, and the third heat exchange module is started to heat together with the first heat exchange module and the second heat exchange module to increase the actual heat output temperature to the target heat output temperature.

4. The heat pump control method according to claim 2, wherein The step of adjusting the heating frequency of the heating module until the actual heat output temperature decreases to the target heat output temperature if the actual heat output temperature is greater than the target heat output temperature comprises: if the actual heat output temperature is greater than the target heat output temperature, controlling the heat pump device to switch to the second working mode; in the second working mode, adjusting the heating frequency of the heating module and controlling the first adjusting module to start to reduce the temperature of the refrigerant medium passing through the first heat exchange module and the flow of the refrigerant medium passing through the first heat exchange module, so that the first heat exchange module is cooled to reduce the actual heat output temperature to the target heat output temperature.

5. The heat pump control method according to claim 1, wherein The heat pump control method further comprises: obtaining the enthalpy difference between the refrigerant inlet end and the refrigerant outlet end of the first heat exchange module and the second heat exchange module; The intermediate temperature between the first heat exchange module and the second heat exchange module is obtained based on the enthalpy difference between the refrigerant inlet end and the refrigerant outlet end of the first heat exchange module and the second heat exchange module.

6. The heat pump control method according to claim 5, wherein The heat pump control method further comprises: The first heat-in temperature and the first heat-out temperature of the first heat exchange module and the second heat-in temperature and the second heat-out temperature of the second heat exchange module are obtained based on the intermediate temperature.

7. A heat pump apparatus, characterized by, The heat pump device comprises a first heat exchange module, a second heat exchange module, a third heat exchange module and a first adjusting module, and further comprises: An obtaining module is configured to obtain a target heat-out temperature and an actual heat-out temperature of the heat pump device; A control module is configured to control the heat pump device to switch to a corresponding working mode based on the difference between the target heat-out temperature and the actual heat-out temperature, wherein the working mode comprises a first working mode and a second working mode; An execution module is configured to control the third heat exchange module to heat together with the first heat exchange module and the second heat exchange module in the first working mode to increase the actual heat-out temperature to the target heat-out temperature, and control the first adjusting module to adjust the flow and temperature of the refrigerant medium flowing through the first heat exchange module in the second working mode; The second heat exchange module is in communication with the first heat exchange module, and the first heat exchange module is arranged upstream of the second heat exchange module; The third heat exchange module is electrically connected with the control module, the third heat exchange module is arranged downstream of the second heat exchange module, and an external fluid can flow through the first heat exchange module, the second heat exchange module and the third heat exchange module in sequence and absorb the heat of the first heat exchange module, the second heat exchange module and the third heat exchange module; The first adjusting module is electrically connected with the control module, two ends of the first adjusting module are in communication with two ends of the first heat exchange module, and the first adjusting module is configured to adjust the flow and temperature of the refrigerant medium flowing to the first heat exchange module.

8. The heat pump apparatus according to claim 7, wherein The heat pump device further comprises: A heating module, a refrigerant outlet end of the heating module is in communication with the second heat exchange module, and the heating module is configured to increase the pressure and temperature of the refrigerant medium; An evaporation module, the evaporation module is in communication with a refrigerant inlet end of the heating module, and the evaporation module is arranged downstream of the third heat exchange module, and the evaporation module is configured to absorb the waste heat of the external fluid flowing through the first heat exchange module, the second heat exchange module and the third heat exchange module; A throttling module, two ends of the throttling module are respectively in communication with the first heat exchange module and the evaporation module, and the throttling module is configured to adjust the flow of the refrigerant medium flowing into the evaporation module.

9. The heat pump apparatus according to claim 7, wherein The heat pump device further comprises a second adjusting module, the second adjusting module is electrically connected with the control module and arranged between the first heat exchange module and the second heat exchange module, and the second adjusting module is configured to adjust the flow of the external fluid between the first heat exchange module and the second heat exchange module.

10. A heat pump control device, characterized by, The heat pump control device comprises a processor and a memory, and the memory stores instructions. The processor invokes the instructions in the memory to cause the heat pump control device to implement the heat pump control method as claimed in any one of claims 1 to 6.

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