An AAOB antenna array based on AIP array and its preparation method

Abstract

The present invention discloses an AAOB antenna array based on an AIP array and a preparation method, which belongs to the technical field of phased array antennas. The AAOB antenna array based on the AIP array includes: an AAOB antenna circuit, wherein the AAOB antenna circuit includes multiple power division networks, attenuators, phase shifters, multi-channel amplitude and phase chips, AIP array elements, and integrated frequency converter chips; the AIP array elements are used to transmit and receive spatial electromagnetic wave signals and perform beamforming through the multi-channel amplitude and phase chips, and then form a beam in the power division network connected to the multi-channel amplitude and phase chips; the four beams are subjected to secondary amplitude and phase control to finally form a composite beam; the composite beam is subjected to spectrum shifting in the integrated frequency conversion chip to obtain an intermediate frequency shaped beam; and intermediate frequency shaped beams with different functions are obtained by adjusting the phase of the phase shifter. The phased array architecture of the AAOB array can realize the beam polarization tracking function and form different shaped beams at the same time, meeting more system requirements, adapting to more application scenarios, and saving development time and development costs.

Description

Technical Field

[0001] The present invention relates to the technical field of phased array antennas, and in particular to an AAOB antenna array based on an AIP array and a preparation method thereof. Background Art

[0002] With the rapid iteration of wireless communication technology, millimeter-wave communication is also rapidly updating and upgrading. Millimeter-wave phased array antenna technology has gradually highlighted its position in the field of millimeter-wave communication. The demand for millimeter-wave phased arrays is increasing rapidly, and the requirements for high performance, miniaturization, and ultra-low cost are becoming increasingly stringent.

[0003] AIP (Antenna in Package) technology is increasingly being used in millimeter-wave phased arrays. There are two typical AIP technologies available. The first type relies primarily on packaging processes. Using silicon-based semiconductors or glass substrates as carriers, AIP employs RDL (ReDistribution Layer) wiring fan-out and TSV (Through Silicon Via) perforation interconnection to package multi-channel amplitude-phase bare chips and antennas into one. This type of technology places very high demands on the packaging process, design, and production, making it difficult to achieve low-cost requirements in both the early development stage and the later mass production stage. The second type of AIP technology is to combine the printed circuit board with the multi-channel amplitude-phase chip. This technology is also the most widely used solution. The microstrip antenna is designed on the printed circuit board, and the multi-channel amplitude-phase chip is attached to the other side of the printed circuit board relative to the antenna. The multi-channel amplitude-phase chip is then filled with glue using the Underfill process. Compared with the first type of technology, the cost of this technology will be greatly reduced, but it also has its prominent problems. The first is the heat dissipation problem of AIP. It is necessary to open a slot on the RF motherboard at the location of the AIP, which will destroy the integrity of the motherboard and affect the RF network wiring and control power wiring; the second is the AIP The performance indicators are completely dependent on the multi-channel amplitude-phase chip. However, multi-channel amplitude-phase chips are often manufactured using CMOS, SOI, SiGe and other processes. Such processes are difficult to improve key indicators such as noise figure, output power, efficiency, and require very high costs. Due to the limitations of chip characteristics, its application range is also relatively narrow; thirdly, the AIP printed circuit board contains not only antennas, RF conversion lines, but also control power lines. The printed circuit board stacking is complex and the cost is relatively high. If other functions need to be added, the cost of the printed circuit board will continue to increase, and it may even be impossible to achieve due to the bottleneck of the printed circuit board process. This type of technology is difficult to balance indicators and costs. Summary of the Invention

[0004] The purpose of the present invention is to overcome the deficiencies of the prior art and provide an AAOB antenna array based on an AIP array and a preparation method thereof.

[0005] The objective of the present invention is achieved through the following technical solutions: The first aspect of the present invention provides: an AAOB antenna array based on an AIP array, comprising an AAOB antenna circuit, wherein the AAOB antenna circuit comprises a first power division network, wherein the first power division network is connected to a first attenuator A, a second attenuator B, a third attenuator C, a fourth attenuator D and an integrated frequency converter chip; the first attenuator A is connected to a first phase shifter A, the second attenuator B is connected to a second phase shifter B, the third attenuator C is connected to a third phase shifter C, and the fourth attenuator D is connected to a fourth phase shifter D; the first phase shifter A is connected to a second power division network, the second phase shifter B is connected to a third power division network, the third phase shifter C is connected to a fourth power division network, and the fourth phase shifter D is connected to a fifth power division network; the second power division network, the third power division network, the fourth power division network, and the fifth power division network are connected. The networks are connected to multiple multi-channel amplitude and phase chips; each multi-channel amplitude and phase chip is connected to multiple AIP array elements; the AIP array elements are used to transmit and receive spatial electromagnetic wave signals and perform beamforming through the multi-channel amplitude and phase chips, and then form a beam in the power division network connected to the multi-channel amplitude and phase chips; the second power division network, the third power division network, the fourth power division network, and the fifth power division network each form a beam, and the four beams are respectively subjected to secondary amplitude and phase control through the phase shifters and attenuators connected to the second power division network, the third power division network, the fourth power division network, and the fifth power division network, and finally form a synthetic beam in the first power division network; the synthetic beam is spectrum shifted in the integrated frequency conversion chip to obtain an intermediate frequency shaping beam; by adjusting the phases of the first phase shifter A, the second phase shifter B, the third phase shifter C, and the fourth phase shifter D, intermediate frequency shaping beams with different functions are obtained.

[0006] Preferably, when one of the two RF channels corresponding to the two antenna feed points of the AIP array element is turned on, left-hand polarization or right-hand polarization of the phased array antenna is achieved; when both RF channels corresponding to the two antenna feed points of the AIP array element are turned on, arbitrary linear polarization of the phased array antenna is achieved by adjusting the phase difference between the two RF channels.

[0007] Preferably, when the phases of the first phase shifter A, the second phase shifter B, the third phase shifter C, and the fourth phase shifter D are set to the same, the intermediate frequency shaped beam realizes the sum beam function of the phased array antenna, which is used for target detection and tracking in the airspace;

[0008] When the phases of the first phase shifter A, the third phase shifter C, the second phase shifter B, and the fourth phase shifter D are set to differ by 90 degrees, the intermediate frequency shaped beam realizes the azimuth difference beam function of the phased array antenna, which is used to locate targets in the azimuth plane in the airspace;

[0009] When the phases of the first phase shifter A, the second phase shifter B, the third phase shifter C, and the fourth phase shifter D are set to differ by 90°, the intermediate frequency shaped beam realizes the elevation difference beam function of the phased array antenna, which is used to locate elevation targets in the airspace.

[0010] Preferably, amplitude and phase control is performed through the first phase shifter A, the second phase shifter B, the third phase shifter C, the fourth phase shifter D, the first attenuator A, the second attenuator B, the third attenuator C, and the fourth attenuator D, and the phased array antenna is subjected to secondary sidelobe weighting to improve sidelobe suppression.

[0011] Preferably, the AAOB antenna circuit is arranged on the AAOB antenna structure; the AAOB antenna structure includes an integrated printed circuit board, and the front side of the integrated printed circuit board is provided with an AIP array, an integrated frequency converter chip structure, a wave control chip and a memory chip, and the AIP array is composed of multiple AIP array elements; the back side of the integrated printed circuit board is provided with a multi-channel amplitude and phase chip structure and a thermal conductive structure.

[0012] Preferably, the heat-conducting structure is a double-diameter cylinder with a hollow center, which is fixed through the integrated printed circuit board thickness surface, and the hollow center of the heat-conducting structure is filled with a heat-conducting medium; a heat dissipation structure is provided on the side of the heat-conducting structure away from the integrated printed circuit board.

[0013] Preferably, the AIP array includes a step groove printed circuit board, a microstrip antenna is provided on the front of the step groove printed circuit board; a BGA solder ball and a step groove are provided on the back of the step groove printed circuit board, a dual-channel device is embedded in the step groove, and the dual-channel device is flush with the back of the step groove printed circuit board; the microstrip antenna is a dual-feed antenna, each feeding point is interconnected with the dual-channel device; the dual-channel device is interconnected with the microstrip bridge and then fanned out through the BGA solder ball.

[0014] Preferably, the dual-channel device is a dual-channel low-noise amplifier, a dual-channel power amplifier, a dual-channel bidirectional amplifier, a filter, or a straight-through microstrip line.

[0015] Preferably, the step groove printed circuit board is square, diamond, Z-shaped, triangular or circular; the microstrip antenna is a rectangular patch, a circular patch, an E-shaped patch or a slot patch; and there are n×m AIP array elements on the AIP array.

[0016] A second aspect of the present invention provides: a method for preparing an AAOB antenna array based on an AIP array, for preparing any of the above-mentioned AAOB antenna arrays based on an AIP array, comprising the following steps:

[0017] S1: AIP array device placement stage, the dual-channel device is placed in the step groove on the back of the step groove printed circuit board;

[0018] S2: AIP array BGA ball planting stage, the power supply plate, RF plate, and ground plate fanned out of the AIP array are planted with BGA solder balls;

[0019] S3: AIP array device dispensing stage, the dual-channel device in the step groove of the AIP array is fixed by dispensing glue;

[0020] S4: AIP array assembly and placement stage on the front of the integrated printed circuit board, where the AIP array is attached to the front of the integrated printed circuit board;

[0021] S5: During the chip placement stage on the back of the integrated printed circuit board, the multi-channel amplitude and phase chip, phase shifter, attenuator, power chip, RF connector, and rectangular connector are placed on the back of the integrated printed circuit board;

[0022] S6: AIP array thermal conductive medium filling stage, fill the thermal conductive structure with thermal conductive medium, make the thermal conductive medium contact with the dual-channel devices of the AIP array to conduct heat dissipation, and then apply thermal conductive medium to the surface of the chip that needs heat dissipation to obtain the AAOB array;

[0023] S7: AAOB array installation phase, fasten the AAOB array to the planar structural member to complete the AAOB array installation.

[0024] The beneficial effects of the present invention are:

[0025] 1) The phased array architecture of the AAOB array can realize beam polarization tracking function and form different shaped beams, meeting more system requirements, adapting to more application scenarios, and saving development time and costs.

[0026] 2) AIP arrays can form AIP arrays with different functions by replacing dual-channel devices, greatly improving system indicators, increasing application flexibility, and meeting more application scenarios.

[0027] 3) The AAOB array preparation method can significantly simplify the printed circuit board production process, shorten the printed circuit board processing cycle, and reduce the printed circuit board scrap rate, thereby reducing product production costs and development cycles. It can also overcome the problem that phased array antennas are limited by the printed circuit board process and produce more advanced multifunctional phased array antennas. This array arrangement can significantly reduce product rework costs when the antenna needs to be replaced due to conditions such as antenna frequency deviation. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 This is a schematic diagram of the AIP array principle;

[0029] Figure 2 This is the front view of the AIP array;

[0030] Figure 3 This is the back view of the AIP array;

[0031] Figure 4 This is a cross-sectional view of the AIP array;

[0032] Figure 5 This is the principle block diagram of AAOB array;

[0033] Figure 6 This is the front view of the AAOB array;

[0034] Figure 7 This is the cross-sectional view of the AAOB array;

[0035] Figure 8 Flow chart of the AAOB array preparation method;

[0036] Figure 9 This is a schematic diagram of the AAOB array stack optimization;

[0037] In the figure, 101 is a dual-channel device; 102 is a step groove; 103 is a BGA solder ball; 104 is a step groove printed circuit board; 105 is a microstrip antenna; 201 is an AIP array; 202 is an integrated inverter chip structure; 203 is a wave control chip; 204 is a memory chip; 205 is a thermal conductive medium; 206 is an integrated printed circuit board; 207 is a thermal conductive structure; 208 is a multi-channel amplitude and phase chip structure; 301 is a heat dissipation structure. DETAILED DESCRIPTION

[0038] The following will clearly and completely describe the technical solutions of the present invention in conjunction with the embodiments. Obviously, the embodiments described are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work shall fall within the scope of protection of the present invention.

[0039] The novel AIP array and AAOB (AIP Array on Board) array and its preparation method proposed in this invention solve the drawbacks and problems of existing products. The AIP array can meet the high performance requirements of multi-channel amplitude and phase chips, and at the same time can flexibly switch different functions to meet more application scenarios. The AAOB array and its preparation method are more flexible to use, with low rework costs, and can better solve the chip heat dissipation problem. It can also integrate more complex functional requirements, further simplify the printed circuit board stacking process, and thus reduce the cost of phased array antennas.

[0040] See Figures 1-9The first aspect of the present invention provides: an AAOB antenna array based on an AIP array, comprising an AAOB antenna circuit, wherein the AAOB antenna circuit comprises a first power division network, wherein the first power division network is connected to a first attenuator A, a second attenuator B, a third attenuator C, a fourth attenuator D and an integrated frequency converter chip; the first attenuator A is connected to a first phase shifter A, the second attenuator B is connected to a second phase shifter B, the third attenuator C is connected to a third phase shifter C, and the fourth attenuator D is connected to a fourth phase shifter D; the first phase shifter A is connected to a second power division network, the second phase shifter B is connected to a third power division network, the third phase shifter C is connected to a fourth power division network, and the fourth phase shifter D is connected to a fifth power division network; the second power division network, the third power division network, the fourth power division network, and the fifth power division network are all connected to a plurality of multi-channel channel amplitude and phase chip; each multi-channel amplitude and phase chip is connected to multiple AIP array elements; the AIP array element is used to transmit and receive spatial electromagnetic wave signals and perform beamforming through the multi-channel amplitude and phase chip, and then form a beam in the power division network connected to the multi-channel amplitude and phase chip; the second power division network, the third power division network, the fourth power division network, and the fifth power division network each form a beam, and the four beams are respectively subjected to secondary amplitude and phase control by the phase shifters and attenuators connected to the second power division network, the third power division network, the fourth power division network, and the fifth power division network, and finally form a synthetic beam in the first power division network; the synthetic beam is spectrum shifted in the integrated frequency conversion chip to obtain an intermediate frequency shaping beam; by adjusting the phases of the first phase shifter A, the second phase shifter B, the third phase shifter C, and the fourth phase shifter D, intermediate frequency shaping beams with different functions are obtained.

[0041] In this embodiment, an AIP array composed of multiple AIP array elements is prepared into an AAOB antenna array based on the AIP array to form a larger-scale phased array antenna. The principle of the AAOB antenna array based on the AIP array is as follows: Figure 5As shown; it is mainly composed of AIP array elements, multi-channel amplitude and phase chips, power division networks, phase shifters, attenuators, integrated frequency converter chips, etc.; the AIP array elements are responsible for receiving and transmitting spatial electromagnetic wave signals, and beamforming is performed through the multi-channel amplitude and phase chips. The AIP array elements in each quadrant then form a beam through the power division network. The beam in each quadrant then passes through the phase shifter and attenuator for secondary amplitude and phase control in turn, and then passes through the first power division network to form a synthetic beam, and finally performs spectrum shifting with the integrated frequency converter chip to form an intermediate frequency shaping beam. The AIP array in the present invention integrates a microstrip bridge, and the phased array antenna formed by the AAOB antenna array based on the AIP array can realize the polarization tracking function by switching the channels of the multi-channel amplitude and phase chip. When only one of the two RF channels corresponding to each antenna dual feed point of the AIP array is turned on, the phased array antenna is polarized to left-hand or right-hand polarization; when both RF channels corresponding to each antenna dual feed point of the AIP array are turned on, the phased array antenna can be polarized to any linear polarization by adjusting the phase difference between the two RF channels.

[0042] The intermediate frequency shaped beam in the present invention has multiple switchable functions: 1. When the phases of the four phase shifters, namely the first phase shifter A, the second phase shifter B, the third phase shifter C, and the fourth phase shifter D, are all set to the same phase, the intermediate frequency shaped beam is the sum beam function of the phased array antenna, which can be used for target detection and tracking in the airspace; 2. When the phases of the first phase shifter A and the third phase shifter C differ by 90° from the phases of the second phase shifter B and the fourth phase shifter D, the intermediate frequency shaped beam is the azimuth difference beam function of the phased array antenna, which can be used for azimuth target positioning in the airspace; 3. When the phases of the first phase shifter A and the second phase shifter B and the third phase shifter C and the fourth phase shifter D differ by 90° from each other, the intermediate frequency shaped beam is the azimuth difference beam function of the phased array antenna, which can be used for azimuth target positioning in the airspace. When the phase settings differ by 90°, the IF shaped beam functions as the phased array antenna's elevation differential beam, enabling elevation target location in airspace. 4. By controlling the amplitude and phase of the four phase shifters (first phase shifter A, second phase shifter B, third phase shifter C, and fourth phase shifter D) and the four attenuators (first attenuator A, second attenuator B, third attenuator C, and fourth attenuator D), the phased array antenna can be subjected to secondary sidelobe weighting, further improving sidelobe suppression without compromising G / T or EIRP. This IF shaped beam exhibits even higher sidelobe suppression, a particularly significant improvement when using this architecture for extremely large-scale phased array configurations. This phased array architecture provides diverse shaped beams, meeting a wider range of system requirements and application scenarios, saving development time and costs. The above implementation structure is only one of many implementation schemes, and other schemes can be adjusted as follows: 1. The eight chips of the first phase shifter A, the second phase shifter B, the third phase shifter C, the fourth phase shifter D, the first attenuator A, the second attenuator B, the third attenuator C, and the fourth attenuator D mentioned above can also be replaced by multi-channel amplitude-phase chips; 2. A power divider can also be added at the beam port of each quadrant to form multiple signals, and each signal can be respectively added with a phase shifter and an attenuator to simultaneously form a sum beam, an azimuth difference beam, and an elevation difference beam; 3. The phase shifter and attenuator can be replaced by other devices such as delay devices and filters to form a phased array antenna with other functions; 4. The integrated frequency converter chip and the multi-channel amplitude-phase chip can be integrated into the same chip to form a variable frequency phased array antenna; 5. An ADC / DAC chip can be added after the integrated frequency converter chip to make an analog-to-digital hybrid phased array.

[0043] In some embodiments, when one of the two RF channels corresponding to the two antenna feed points of the AIP array element is turned on, left-hand polarization or right-hand polarization of the phased array antenna is achieved; when both RF channels corresponding to the two antenna feed points of the AIP array element are turned on, arbitrary linear polarization of the phased array antenna is achieved by adjusting the phase difference between the two RF channels.

[0044] In some embodiments, when the phases of the first phase shifter A, the second phase shifter B, the third phase shifter C, and the fourth phase shifter D are set to the same, the intermediate frequency shaped beam realizes the sum beam function of the phased array antenna, which is used for target detection and tracking in the airspace;

[0045] When the phases of the first phase shifter A, the third phase shifter C, the second phase shifter B, and the fourth phase shifter D are set to differ by 90 degrees, the intermediate frequency shaped beam realizes the azimuth difference beam function of the phased array antenna, which is used to locate targets in the azimuth plane in the airspace;

[0046] When the phases of the first phase shifter A, the second phase shifter B, the third phase shifter C, and the fourth phase shifter D are set to differ by 90°, the intermediate frequency shaped beam realizes the elevation difference beam function of the phased array antenna, which is used to locate elevation targets in the airspace.

[0047] In some embodiments, amplitude and phase control is performed through the first phase shifter A, the second phase shifter B, the third phase shifter C, the fourth phase shifter D, the first attenuator A, the second attenuator B, the third attenuator C, and the fourth attenuator D, and secondary sidelobe weighting is performed on the phased array antenna to improve sidelobe suppression.

[0048] In some embodiments, the AAOB antenna circuit is arranged on the AAOB antenna structure; the AAOB antenna structure includes an integrated printed circuit board 206, and the front side of the integrated printed circuit board 206 is provided with an AIP array 201, an integrated frequency converter chip structure 202, a wave control chip 203 and a memory chip 204, and the AIP array 201 is composed of multiple AIP array elements; the back side of the integrated printed circuit board 206 is provided with a multi-channel amplitude and phase chip structure 208 and a thermal conductive structure 207.

[0049] In this embodiment, the phased array antenna formed by the AAOB antenna array based on the AIP array is implemented as follows: Figure 6As shown, the AAOB antenna array based on the AIP array is based on an integrated printed circuit board 206, on which are provided an AIP array 201, a multi-channel amplitude and phase chip, a phase shifter, an attenuator, an integrated frequency converter chip, a power supply chip, a wave control chip 203 (an FPGA chip can be optionally used), a radio frequency connector, a rectangular connector, and the like. The integrated printed circuit board 206 is designed using a multi-layer printed circuit board process, integrating high and low frequency components and wiring such as radio frequency circuits, power supply circuits, and control circuits. The front of the printed circuit board is arranged with a multi-AIP array 201 array, an integrated frequency converter chip, and a wave control chip 203. The back of the printed circuit board is provided with a multi-channel amplitude and phase chip, a power supply chip, a radio frequency connector, a rectangular connector, a thermal conductive structure 207, and the like. The thermal conductive structure 207 is a double-diameter cylinder with a hollow center, which is fixed by surface mounting after passing through the printed circuit board. The above implementation structure is only one of many implementation schemes. Other schemes can be adjusted as follows: 1. The external dimensions of the multilayer printed circuit board are consistent with the AIP array 201 after formation, forming a two-dimensionally scalable phased array antenna; 2. The AIP array 201 is sparsely arranged on the multilayer printed circuit board at a certain distance to form a sparse phased array antenna.

[0050] In some embodiments, the heat-conducting structure 207 is a double-diameter cylinder with a hollow center, which is fixed through the thick surface of the integrated printed circuit board 206, and the hollow center of the heat-conducting structure 207 is filled with a heat-conducting medium 205; a heat dissipation structure 301 is provided on the side of the heat-conducting structure 207 away from the integrated printed circuit board 206.

[0051] In this embodiment, the heat conducting medium 205 is a highly thermally conductive adhesive.

[0052] In some embodiments, the AIP array 201 includes a step-groove printed circuit board 104, a microstrip antenna 105 is provided on the front of the step-groove printed circuit board 104; a BGA solder ball 103 and a step groove 102 are provided on the back of the step-groove printed circuit board 104, a dual-channel device 101 is embedded in the step groove 102, and the dual-channel device 101 is flush with the back of the step-groove printed circuit board 104; the microstrip antenna 105 is a dual-feed antenna, each feeding point is interconnected with the dual-channel device 101; the dual-channel device 101 is interconnected with the microstrip bridge and then fanned out through the BGA solder ball 103.

[0053] In this embodiment, the principle of the AIP array 201 is as follows Figure 1As shown, the AIP array 201 is composed of a microstrip antenna 105, a dual-channel device 101, a microstrip bridge, and a BGA solder ball 103. The microstrip antenna 105 is a dual-fed antenna. Each feeding point is interconnected with the dual-channel device 101 nearby. The dual-channel device 101 is interconnected with the microstrip bridge and then fanned out through the BGA ball. The AIP array 201 can be functionally reconfigured according to demand. Its functions and application scenarios can be reconfigured as the type of the dual-channel device 101 changes. First, when the dual-channel device 101 is a dual-channel low-noise amplifier, the AIP array 201 is an active receiving antenna array, which can reduce the noise coefficient of the entire system and improve the system receiving sensitivity; second, when the dual-channel device 101 is a dual-channel power amplifier, the AIP array 201 is an active transmitting antenna array, which can increase the transmission power of the entire system and increase the system transmission distance; third, when the dual-channel device 101 is a dual-channel power amplifier, the AIP array 201 is an active transmitting antenna array, which can increase the transmission power of the entire system and increase the system transmission distance; When the channel device 101 is a dual-channel bidirectional amplifier, the AIP array 201 is an active integrated antenna array for transmitting and receiving, which can realize half-duplex operation of signal transmission and reception; fourth, when the dual-channel device 101 is replaced by a filter, the AIP array 201 is a filtering antenna array, which can filter the signals outside the working frequency band to avoid interference of large signals outside the working frequency band to the system; fifth, when the dual-channel device 101 is replaced by a straight-through microstrip line, the AIP array 201 is a passive antenna array, which realizes signal radiation in the same way as a conventional antenna array. This type of AIP array 201 can greatly improve system indicators, and is flexible in application and can meet more application scenarios. The implementation structure of the AIP array 201 is as follows: Figure 2 Figure 3 As shown, the AIP array 201 is based on a stepped groove printed circuit board 104, on which are provided a dual-channel device 101, a BGA solder ball 103, etc., with a simple structure and low cost; a microstrip antenna 105 is provided on the front of the printed circuit board, and a BGA solder ball 103 is provided on the back of the printed circuit board. The dual-channel device 101 is embedded in the stepped groove 102. The depth of the stepped groove 102 is controlled so that the device is basically flush with the back of the printed circuit board, which facilitates the subsequent AAOB array arrangement and device heat dissipation.

[0054] In some embodiments, the dual-channel device 101 is a dual-channel low noise amplifier, a dual-channel power amplifier, a dual-channel bidirectional amplifier, a filter, or a straight-through microstrip line.

[0055] In some embodiments, the step groove printed circuit board 104 is square, diamond, Z-shaped, triangular, or circular; the microstrip antenna 105 is a rectangular patch, a circular patch, an E-shaped patch, or a slot patch; and there are n×m AIP array elements on the AIP array 201.

[0056] A second aspect of the present invention provides: a method for preparing an AAOB antenna array based on an AIP array, for preparing any of the above-mentioned AAOB antenna arrays based on an AIP array, comprising the following steps:

[0057] S1: AIP array device placement stage, the dual-channel device is placed in the step groove on the back of the step groove printed circuit board;

[0058] S2: AIP array BGA ball planting stage, the power supply plate, RF plate, and ground plate fanned out of the AIP array are planted with BGA solder balls;

[0059] S3: AIP array device dispensing stage, the dual-channel device in the step groove of the AIP array is fixed by dispensing glue;

[0060] S4: AIP array assembly and placement stage on the front of the integrated printed circuit board, where the AIP array is attached to the front of the integrated printed circuit board;

[0061] S5: During the chip placement stage on the back of the integrated printed circuit board, the multi-channel amplitude and phase chip, phase shifter, attenuator, power chip, RF connector, and rectangular connector are placed on the back of the integrated printed circuit board;

[0062] S6: AIP array thermal conductive medium filling stage, fill the thermal conductive structure with thermal conductive medium, make the thermal conductive medium contact with the dual-channel devices of the AIP array to conduct heat dissipation, and then apply thermal conductive medium to the surface of the chip that needs heat dissipation to obtain the AAOB array;

[0063] S7: AAOB array installation phase, fasten the AAOB array to the planar structural member to complete the AAOB array installation.

[0064] In this embodiment, the AAOB antenna array preparation method based on the AIP array can greatly optimize the stacking of the printed circuit board. The conventional plate-type phased array antenna has an antenna on the front and a chip on the back. The stacking of the printed circuit board of this type of array is very complicated, and it is necessary to use multiple pressing processes, back drilling processes, laser drilling processes and other complex processes. In some special cases, even super-difficult processes such as copper paste sintering are used. The cost of the printed circuit board is extremely high and the scrap rate remains high. The AAOB array arrangement method proposed in the present invention can avoid such complex processes, and the AIP array and the integrated printed circuit board are processed separately and then interconnected by the SMT method. The AIP array is combined with the multi-layer printed circuit board to form a phased array antenna of any scale required. The AIP array and the integrated printed circuit board can be processed using conventional simple printed circuit board processes. The AAOB antenna array preparation method based on the AIP array has the following effect on the stacking optimization of the printed circuit board: Figure 9As shown in the figure, this array arrangement method can significantly reduce the printed circuit board production process, shorten the printed circuit board processing cycle, and reduce the printed circuit board scrap rate, thereby reducing the production cost and development cycle of the product. It can also overcome the problem that the phased array antenna is limited by the printed circuit board process and produce a more advanced multi-functional phased array antenna. When the antenna has frequency deviation and other conditions that affect its use, the conventional plate-type phased array antenna needs to redesign and process a highly complex antenna printed circuit board and then surface-mount a new multi-channel amplitude and phase chip. The processing cycle is long and the cost is high. This array arrangement method only requires the redesign and processing of a simple antenna board and then the replacement of the antenna through SMT. The processing cycle is short, the cost is low, and the product rework cost is greatly reduced.

[0065] The foregoing description is merely a preferred embodiment of the present invention. It should be understood that the present invention is not limited to the form disclosed herein and should not be construed as excluding other embodiments. Rather, the present invention can be used in various other combinations, modifications, and environments and can be modified within the scope of the concept described herein through the above teachings or techniques or knowledge in the relevant field. Modifications and variations made by those skilled in the art that do not depart from the spirit and scope of the present invention are intended to be protected by the appended claims.

Claims

1. An AAOB antenna array based on an AIP array, characterized by: The AAOB antenna circuit includes a first power division network, wherein the first power division network is connected to a first attenuator A, a second attenuator B, a third attenuator C, a fourth attenuator D and an integrated frequency converter chip; the first attenuator A is connected to a first phase shifter A, the second attenuator B is connected to a second phase shifter B, the third attenuator C is connected to a third phase shifter C, and the fourth attenuator D is connected to a fourth phase shifter D; the first phase shifter A is connected to a second power division network, the second phase shifter B is connected to a third power division network, the third phase shifter C is connected to a fourth power division network, and the fourth phase shifter D is connected to a fifth power division network; the second power division network, the third power division network, the fourth power division network, and the fifth power division network are all connected to a plurality of multi-channel amplitude and phase chips; each multi-channel amplitude and phase chip Each of the AIP array elements is connected to multiple AIP array elements; the AIP array element is used to transmit and receive spatial electromagnetic wave signals and performs beamforming through a multi-channel amplitude and phase chip, and then forms a beam in the power division network connected to the multi-channel amplitude and phase chip; the second power division network, the third power division network, the fourth power division network, and the fifth power division network each form a beam, and the four beams are respectively subjected to secondary amplitude and phase control by phase shifters and attenuators connected to the second power division network, the third power division network, the fourth power division network, and the fifth power division network, and finally form a composite beam in the first power division network; the composite beam is spectrum shifted in the integrated frequency conversion chip to obtain an intermediate frequency forming beam; by adjusting the phase of the first phase shifter A, the second phase shifter B, the third phase shifter C, and the fourth phase shifter D, intermediate frequency forming beams with different functions are obtained; When the phases of the first phase shifter A, the second phase shifter B, the third phase shifter C, and the fourth phase shifter D are set to the same, the intermediate frequency shaped beam realizes the sum beam function of the phased array antenna, which is used for target detection and tracking in the airspace; When the phases of the first phase shifter A, the third phase shifter C, the second phase shifter B, and the fourth phase shifter D are set to differ by 90 degrees, the intermediate frequency shaped beam realizes the azimuth difference beam function of the phased array antenna, which is used to locate targets in the azimuth plane in the airspace; When the phases of the first phase shifter A, the second phase shifter B, the third phase shifter C, and the fourth phase shifter D are set to differ by 90 degrees, the intermediate frequency shaped beam realizes the elevation difference beam function of the phased array antenna, which is used to locate the elevation plane target in the airspace; Amplitude and phase control are performed through the first phase shifter A, the second phase shifter B, the third phase shifter C, the fourth phase shifter D, the first attenuator A, the second attenuator B, the third attenuator C, and the fourth attenuator D, and secondary sidelobe weighting is performed on the phased array antenna to improve sidelobe suppression.

2. The AAOB antenna array based on the AIP array according to claim 1, characterized in that: When one of the two RF channels corresponding to the two antenna feed points of the AIP array element is turned on, left-hand polarization or right-hand polarization of the phased array antenna is achieved; when both RF channels corresponding to the two antenna feed points of the AIP array element are turned on, arbitrary linear polarization of the phased array antenna is achieved by adjusting the phase difference between the two RF channels.

3. The AAOB antenna array based on the AIP array according to claim 1 or 2, characterized in that: The AAOB antenna circuit is arranged on the AAOB antenna structure; the AAOB antenna structure comprises an integrated printed circuit board (206); an AIP array (201), an integrated frequency converter chip structure (202), a wave control chip (203) and a memory chip (204) are arranged on the front side of the integrated printed circuit board (206); the AIP array (201) is composed of a plurality of AIP array elements; and a multi-channel amplitude and phase chip structure (208) and a heat conduction structure (207) are arranged on the back side of the integrated printed circuit board (206).

4. The AAOB antenna array based on the AIP array according to claim 3, characterized in that: The heat-conducting structure (207) is a double-diameter hollow-out cylinder, which is fixed to the surface after passing through the integrated printed circuit board (206), and the hollow-out portion in the middle of the heat-conducting structure (207) is filled with a heat-conducting medium (205); a heat dissipation structure (301) is provided on the side of the heat-conducting structure (207) away from the integrated printed circuit board (206).

5. The AAOB antenna array based on the AIP array according to claim 3, characterized in that: The AIP array (201) includes a step groove printed circuit board (104), wherein a microstrip antenna (105) is arranged on the front of the step groove printed circuit board (104); a BGA solder ball (103) and a step groove (102) are arranged on the back of the step groove printed circuit board (104); a dual-channel device (101) is embedded in the step groove (102), and the dual-channel device (101) is flush with the back of the step groove printed circuit board (104); the microstrip antenna (105) is a dual-feed antenna, and each feeding point is interconnected with the dual-channel device (101); the dual-channel device (101) is interconnected with a microstrip bridge and then fanned out through the BGA solder ball (103).

6. The AAOB antenna array based on the AIP array according to claim 5, characterized in that: The dual-channel device (101) is a dual-channel low-noise amplifier, a dual-channel power amplifier, a dual-channel bidirectional amplifier, a filter, or a straight-through microstrip line.

7. The AAOB antenna array based on the AIP array according to claim 5, characterized in that: The step groove printed circuit board (104) is square, rhombus, Z-shaped, triangular or circular; the microstrip antenna (105) is a rectangular patch, a circular patch, an E-shaped patch or a slot patch; and the AIP array (201) has n×m AIP array elements.

8. A method for preparing an AAOB antenna array based on an AIP array, characterized by: The method for preparing the AAOB antenna array based on the AIP array according to any one of claims 1 to 7 comprises the following steps: S1: AIP array device placement stage, the dual-channel device is placed in the step groove on the back of the step groove printed circuit board; S2: AIP array BGA ball planting stage, the power supply plate, RF plate, and ground plate fanned out of the AIP array are planted with BGA solder balls; S3: AIP array device dispensing stage, the dual-channel device in the step groove of the AIP array is fixed by dispensing glue; S4: AIP array assembly and placement stage on the front of the integrated printed circuit board, where the AIP array is attached to the front of the integrated printed circuit board; S5: During the chip placement stage on the back of the integrated printed circuit board, the multi-channel amplitude and phase chip, phase shifter, attenuator, power chip, RF connector, and rectangular connector are placed on the back of the integrated printed circuit board; S6: AIP array thermal conductive medium filling stage, fill the thermal conductive structure with thermal conductive medium, make the thermal conductive medium contact with the dual-channel devices of the AIP array to conduct heat dissipation, and then apply thermal conductive medium to the surface of the chip that needs heat dissipation to obtain the AAOB array; S7: AAOB array installation phase, fasten the AAOB array to the planar structural member to complete the AAOB array installation.

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