Light-emitting substrate, backlight module, and display device

By setting up test pads in the Mini-LED backlight source and optimizing the layout of the second driving unit, the problems of signal crosstalk and poor transmission are solved, and efficient signal detection and fault identification are achieved.

CN119068775BActive Publication Date: 2025-09-26HEFEI BOE RUISHENG TECH CO LTD +1
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Patent Information

Application Number
CN202310644988.4
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2023-05-31
Publication Date
2025-09-26
Estimated Expiration
2043-05-31

AI Technical Summary

Technical Problem

In the backlight source of a Mini-LED display device, how to reasonably arrange a large number of densely packed first and second driving units to avoid signal crosstalk and poor signal transmission, and how to accurately detect the signal transmission status of the sensor to identify the fault location.

Method used

By setting a test pad in the first lead and optimizing the position of the second drive unit, the first drive unit and the second drive unit are staggered on the substrate, reducing signal interference, and detecting the signal through the test pad to ensure the accuracy and efficiency of the detection.

Benefits of technology

It improves the efficiency of signal fault processing, reduces the risk of misjudgment during signal detection, optimizes wiring space, reduces the possibility of signal crosstalk, and improves detection accuracy.

✦ Generated by Eureka AI based on patent content.

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Abstract

Provided are a light-emitting substrate, a backlight module, and a display device. The light-emitting substrate includes a base substrate, a plurality of first drive units, and a second drive unit. The plurality of first drive units are arranged in an array, the first drive unit includes a plurality of first connecting portions; the second drive unit includes a second connecting portion and a plurality of first leads electrically connected to the second connecting portions; at least a portion of the second drive unit is located between two adjacent first drive units in a first direction, and between two adjacent first drive units in a second direction, and at least one first lead includes a test pad. The disclosed embodiment can detect the signal transmission status by arranging a test pad in the first lead. At the same time, by optimizing the setting position of the second drive unit, it is beneficial to arrange the plurality of first leads in a reasonable manner, thereby reducing the risk of the test pad touching other signal lines during signal detection, thereby causing signal failure or inaccurate detection.
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Description

Technical Field

[0001] At least one embodiment of the present disclosure relates to a light-emitting substrate, a backlight module, and a display device. Background Art

[0002] In recent years, with the rapid development of the MLED industry, the application of MLED backlights has become increasingly widespread. MLED includes Mini-LED (generally sized between 50μm and 300μm) and Micro-LED (generally sized less than 50μm). In comparison, Micro-LED technology is still immature, and mass transfer technology is very difficult. Therefore, Mini-LED can serve as a transitional product for Micro-LED and has attracted widespread attention and research. Mini-LED has good display effects, is lightweight, and has advantages such as high contrast and long life. Researchers are constantly optimizing its design to design products with higher performance. Summary of the Invention

[0003] At least one embodiment of the present disclosure provides a light-emitting substrate, a backlight module, and a display device.

[0004] At least one embodiment of the present disclosure provides a light-emitting substrate, including a base substrate, a plurality of first driving units, and a second driving unit, wherein the plurality of first driving units are located on the base substrate, and the plurality of first driving units are arranged in an array along a first direction and a second direction, the first driving unit including a plurality of first connecting portions, the first direction and the second direction are both parallel to the base substrate, and the first direction intersects with the second direction; the second driving unit is located on the base substrate, and the second driving unit includes a second connecting portion and a plurality of first leads electrically connected to the second connecting portions; at least a portion of the second driving unit is located between two adjacent first driving units in the first direction, and between two adjacent first driving units in the second direction, and at least one of the first leads includes a test pad, and the test pad is configured to detect a signal in the first lead.

[0005] For example, according to at least one embodiment of the present disclosure, the light-emitting substrate further includes a plurality of first signal lines electrically connected to the second connection portion, and the orthographic projection of the test pad on the base substrate does not overlap with the orthographic projection of the first signal lines on the base substrate.

[0006] For example, according to the light-emitting substrate provided by at least one embodiment of the present disclosure, the first connection portion and the first driving unit are staggered in the first direction, and the first connection portion and the first driving unit are staggered in the second direction.

[0007] For example, according to the light-emitting substrate provided in at least one embodiment of the present disclosure, in the first direction, the ends of multiple first leads in the same second driving unit that are away from the second connecting portion are all located on the same side of the second connecting portion, and there is no overlap between the orthographic projection of the test pad in one of the first leads on the base substrate and the orthographic projection of another adjacent first lead on the base substrate.

[0008] For example, according to the light-emitting substrate provided in at least one embodiment of the present disclosure, the test pad in one of the multiple first leads and the second connecting portion do not overlap in the first direction, and / or the test pad in another one of the multiple first leads and the second connecting portion at least partially overlap in the first direction and are located in the gap between two adjacent first driving units in the second direction.

[0009] For example, according to the light-emitting substrate provided by at least one embodiment of the present disclosure, the multiple first signal lines extend along the second direction and include a first conductive line, a second conductive line, a third conductive line and a fourth conductive line; the second connection part includes a first connection end, a second connection end, a third connection end and a fourth connection end, and the multiple first leads include a first connection line, a second connection line, a third connection line and a fourth connection line, the first connection end is electrically connected to the first conductive line through the first connection line, the second connection end is electrically connected to the second conductive line through the second connection line, the third connection end is electrically connected to the third conductive line through the third connection line, and the fourth connection end is electrically connected to the fourth conductive line through the fourth connection line.

[0010] For example, according to the light-emitting substrate provided by at least one embodiment of the present disclosure, at least one of the first connecting line, the second connecting line, and the third connecting line includes the test pad.

[0011] For example, according to the light-emitting substrate provided by at least one embodiment of the present disclosure, in the second driving unit, the first connecting end and the second connecting end are adjacent to each other in the first direction, and the first connecting end is closer to the first conductive line adjacent to the second driving unit than the second connecting end, the first connecting line is located between two first driving units adjacent to each other in the second direction, the end of the first connecting line away from the second driving unit includes a first test pad, the first test pad is configured to detect an input signal, the end of the second connecting line away from the second driving unit includes a second test pad, the second test pad is configured to detect an output signal, and in the second direction, the first test pad and the second test pad are respectively located on both sides of the same first connecting portion.

[0012] For example, according to the light-emitting substrate provided by at least one embodiment of the present disclosure, in the second direction, the end of the third connecting line away from the second connecting part and the end of the fourth connecting line away from the second connecting part are both located on the side of the same first connecting part away from the first connecting line adjacent to the first connecting part.

[0013] For example, according to the light-emitting substrate provided by at least one embodiment of the present disclosure, in the second direction, the third connecting line and the fourth connecting line are both located between the first test pad and the second test pad.

[0014] For example, in the light-emitting substrate provided according to at least one embodiment of the present disclosure, the third connecting line includes a first coupling portion, and the fourth connecting line includes a second coupling portion, the first coupling portion is configured to be electrically connected to one end of the capacitor, and the second coupling portion is configured to be electrically connected to the other end of the capacitor, and in the first direction, the first coupling portion and the second coupling portion are both located between a portion of the second connecting line extending along the second direction and the second conductive line close to the second connecting line electrically connected to the second connecting line.

[0015] For example, according to the light-emitting substrate provided by at least one embodiment of the present disclosure, the second driving unit and the first driving unit are staggered in distribution in the first direction.

[0016] For example, according to the light-emitting substrate provided by at least one embodiment of the present disclosure, the center of the orthographic projection of the second connecting portion on the base substrate substantially coincides with the center of the figure enclosed by the center lines connecting the orthographic projections of four adjacent first connecting portions on the base substrate.

[0017] For example, according to the light-emitting substrate provided by at least one embodiment of the present disclosure, in the second driving unit, the first connecting end and the second connecting end are adjacent to each other in the second direction, the third connecting end and the fourth connecting end are adjacent to each other in the second direction, the end of the first connecting line away from the second driving unit includes a first test pad, and the end of the second connecting line away from the second driving unit includes a second test pad, and in the second direction, the first test pad and the second test pad are located on one side of the same first connecting portion.

[0018] For example, according to the light-emitting substrate provided by at least one embodiment of the present disclosure, the first connecting line, the second connecting line, and the third connecting line are all located between two adjacent first driving units in the second direction.

[0019] For example, according to the light-emitting substrate provided by at least one embodiment of the present disclosure, in the second direction, the third connecting line is located on the side of the second connecting line away from the first connecting line; in the first direction, at least a portion of the fourth connecting line is located on the side of the first connecting line away from the first conductive line.

[0020] For example, according to the light-emitting substrate provided by at least one embodiment of the present disclosure, the first driving unit includes a plurality of first driving parts, the first driving part includes a plurality of first connection parts connected in series in sequence, the first driving unit includes a driving connection part, the plurality of first driving parts are arranged in an array along the first direction and the second direction, and the driving connection part is located in an area surrounded by a center line connecting the plurality of first connection parts adjacent to it.

[0021] For example, according to the light-emitting substrate provided in at least one embodiment of the present disclosure, the multiple first driving parts include a first driving sub-part, a second driving sub-part, a third driving sub-part and a fourth driving sub-part arranged in two rows and two columns, and the driving connection part is located in the area surrounded by the center line connecting the four adjacent first connection parts.

[0022] For example, according to the light-emitting substrate provided in at least one embodiment of the present disclosure, the light-emitting substrate also includes: a plurality of second signal lines, the first driving unit is electrically connected to the plurality of second signal lines, and at least one second signal line is located between the first driving sub-unit and the second driving sub-unit adjacent to each other in the first direction, and between the third driving sub-unit and the fourth driving sub-unit adjacent to each other in the first direction.

[0023] For example, according to the light-emitting substrate provided by at least one embodiment of the present disclosure, in the second direction, at least two first driving parts are provided between two adjacent second connecting parts that are located in the same column.

[0024] For example, according to the light-emitting substrate provided by at least one embodiment of the present disclosure, in the second direction, one end of the second connecting line of one second driving unit away from the second connecting end is electrically connected to one end of the first connecting line of another adjacent second driving unit away from the first connecting end, and the light-emitting substrate also includes a binding area. Among the multiple second driving units in the same column, the first connecting line of the first second driving unit is electrically connected to one end of a first conductive line, and the other end of the first conductive line is connected to the binding area, and one end of the second connecting line of the last second driving unit is electrically connected to one end of a second conductive line, and the other end of the second conductive line is connected to the binding area.

[0025] At least one embodiment of the present disclosure further provides a backlight module, comprising the light-emitting substrate according to any of the above embodiments.

[0026] At least one embodiment of the present disclosure further provides a display device, comprising the backlight module according to the above embodiment. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings of the embodiments will be briefly introduced below. Obviously, the drawings in the following description only relate to some embodiments of the present disclosure, rather than limiting the present disclosure.

[0028] Figure 1 It is a schematic diagram of the partial structure of a light-emitting substrate provided by at least one embodiment of the present disclosure.

[0029] Figure 2 It is a partial cross-sectional schematic diagram of a light-emitting substrate provided by at least one embodiment of the present disclosure.

[0030] Figure 3A corresponds to Figure 1 A partially enlarged schematic diagram of the light-emitting substrate in FIG.

[0031] Figure 3B corresponds to Figure 1 An enlarged schematic diagram of the second drive unit in FIG.

[0032] Figure 4 corresponds to Figure 1 Schematic plan view of the first conductive layer in FIG.

[0033] Figure 5 corresponds to Figure 1 Schematic diagram of the local structure of the drive connection part.

[0034] Figure 6 This is a connection diagram of a second driving unit in a light-emitting substrate provided by at least one embodiment of the present disclosure.

[0035] Figure 7 It is a schematic diagram of the overall structure of a light-emitting substrate provided by at least one embodiment of the present disclosure.

[0036] Figure 8 corresponds to Figure 6 A schematic partial plan view of the first conductive layer in FIG.

[0037] Figure 9 It is a schematic diagram of the structural arrangement of a light-emitting substrate provided by at least one embodiment of the present disclosure.

[0038] Figure 10 It is a structural schematic diagram of another light-emitting substrate provided by at least one embodiment of the present disclosure.

[0039] Figure 11 This is a connection diagram of a second driving unit in another light-emitting substrate provided by at least one embodiment of the present disclosure.

[0040] Figure 12 is a schematic diagram of a display device provided by at least one embodiment of the present disclosure. DETAILED DESCRIPTION

[0041] To make the purpose, technical solutions, and advantages of the embodiments of the present disclosure more clear, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0042] Unless otherwise defined, technical or scientific terms used in this disclosure should have the ordinary meanings understood by people with ordinary skills in the field to which this disclosure belongs. The words "first", "second" and similar terms used in this disclosure do not indicate any order, quantity or importance, but are simply used to distinguish different components. The words "include" or "comprising" and similar terms mean that the elements or objects preceding the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects.

[0043] The features "perpendicular," "parallel," and "identical" used in the embodiments of the present disclosure include the features "perpendicular," "parallel," and "identical" in the strict sense, as well as "approximately perpendicular," "approximately parallel," and "approximately identical" that include certain errors, taking into account the errors associated with the measurement of specific quantities (i.e., the limitations of the measurement system), and represent within the acceptable deviation range for the specific value determined by ordinary technicians in this field. The "center" in the embodiments of the present disclosure can include a position strictly at the geometric center and a position approximately at the center of a small area around the geometric center.

[0044] Typically, a light-emitting substrate serving as a backlight source for a Mini-LED display device may include a first driving unit for driving a light-emitting element, and a second driving unit for driving a sensor. The light-emitting element may be electrically connected to the first driving unit, and the sensor may be electrically connected to the second driving unit. For example, the sensor may detect the luminous performance of the light-emitting element to facilitate monitoring of the luminous condition of the backlight source. Currently, in Mini-LED backlight design, Mini-LED is mainly composed of a light-emitting element (e.g., an LED lamp) and a driving element IC (Integrated Circuit Chip). For example, the light-emitting element may be connected to a voltage signal line, a power signal line, a common voltage signal line, and a ground signal line to achieve local dimming.

[0045] During the research, the inventors of the present application found that a large number of light-emitting elements in the backlight source of the Mini-LED display device need to be driven separately. The first drive unit and the second drive unit are both arranged on the substrate, and there are a large number of them. Therefore, how to reasonably arrange the numerous dense first drive units and the second drive units on the substrate so that the light-emitting substrate has good performance has become a current research problem. For example, in some design schemes, the first drive unit and the second drive unit can be arranged in the same row or in the same column, and the first drive unit and the second drive unit are electrically connected to different signal lines respectively. However, the problem that such a scheme may bring is that the design space of the first drive unit and the second drive unit in the same row is small, which makes the first drive unit and the second drive unit in the row closer to the signal line, which is prone to signal crosstalk or poor signal transmission. On the other hand, since Mini-LED has more light sources than traditional direct-type backlights or edge-type backlights, the heating phenomenon is very serious, especially for products with high brightness requirements. The peak brightness may reach 4000nit, so the heating phenomenon is very obvious. Therefore, it is very necessary to drive the sensor through the second driving unit to monitor the temperature of the entire light-emitting substrate. In the process of the sensor monitoring the temperature of the light-emitting substrate, when the transmission signal of the sensor is abnormal (for example, when the sensor has poor welding such as cold soldering), it is usually necessary to detect the second driving unit connected to the sensor. For example, by detecting the signal transmission status of the signal line electrically connected to the second driving unit, the location of the fault can be accurately identified. Therefore, how to accurately detect the transmission signal of the sensor has become a technical problem that needs to be overcome urgently.

[0046] At least one embodiment of the present disclosure provides a light-emitting substrate, including a base substrate, a plurality of first driving units, and a second driving unit, wherein the plurality of first driving units are located on the base substrate and are arranged in an array along a first direction and a second direction, the first driving unit including a plurality of first connecting portions, the first direction and the second direction are both parallel to the base substrate, and the first direction intersects with the second direction; the second driving unit is located on the base substrate, the second driving unit including a second connecting portion and a plurality of first leads electrically connected to the second connecting portions; at least a portion of the second driving unit is located between two adjacent first driving units in the first direction, and between two adjacent first driving units in the second direction, and at least one first lead includes a test pad, and the test pad is configured to detect a signal in the first lead.

[0047] The embodiment of the present disclosure, by setting a test pad in the first lead, can detect the signal transmission status and accurately identify the faulty sensor, which is beneficial to improving the efficiency of signal fault processing; at the same time, by optimizing the setting position of the second driving unit in the light-emitting substrate, the multiple first leads connected to the second connecting part can have sufficient wiring space and a reasonable arrangement method, thereby reducing the risk of the test pad touching other signal lines during signal detection and causing signal failure or inaccurate detection.

[0048] The display substrate and its manufacturing method, and the display device provided by the embodiments of the present disclosure are described below with reference to the accompanying drawings.

[0049] Figure 1 is a schematic diagram of a partial structure of a light-emitting substrate provided by at least one embodiment of the present disclosure; Figure 2 is a partial cross-sectional schematic diagram of a light-emitting substrate provided by at least one embodiment of the present disclosure;

[0050] Figure 3A corresponds to Figure 1 A partially enlarged schematic diagram of the light-emitting substrate; Figure 3B corresponds to Figure 1 An enlarged schematic diagram of the second drive unit in FIG.

[0051] like Figure 1 and Figure 2 As shown, the light emitting substrate 01 includes a base substrate 100, a plurality of first driving units 110 and a second driving unit 120, and the plurality of first driving units 110 and the second driving units 120 are both located on the base substrate 100. Figure 2As shown, the light-emitting substrate 01 includes a first conductive layer 210 and a second conductive layer 220 arranged in sequence along a direction perpendicular to the base substrate 100, and a first insulating layer 215 located between the first conductive layer 210 and the second conductive layer 220. For example, the first conductive layer 210 is provided with a plurality of first signal lines 140 electrically connected to the second driving unit 120, and a second signal line 150 electrically connected to the first driving unit 110.

[0052] For example, Figure 2 As shown, a buffer layer 200 is further provided between the base substrate 100 and the first conductive layer 210 in a direction perpendicular to the base substrate 100 to eliminate local stress and improve adhesion. For example, the material of the buffer layer 200 can be silicon nitride, but is not limited thereto. For example, in some embodiments, when the first signal line 140 and the second signal line 150 in the first conductive layer 210 are fabricated using an electroplating process, the buffer layer may not be provided between the base substrate 100 and the first conductive layer 210. For example, the thickness of the first signal line 140 and the second signal line 150 can be 1.5 μm to 7 μm. For example, the main material of the first signal line 140 and the second signal line 150 can be copper, but is not limited thereto. For example, the first signal line 140 and the second signal line 150 can also be a MoNb / Cu / MoNb laminated material. For example, the MoNb closer to the base substrate 100 can be used to improve adhesion, and the MoNb farther from the base substrate 100 can be used to reduce the risk of oxidation, but is not limited thereto. For example, the first signal line 140 and the second signal line 150 may also be made of different materials, which may be set according to design requirements. For example, the first signal line 140 and the second signal line 150 may be formed by electroplating, which is not limited in the embodiments of the present disclosure.

[0053] For example, Figure 2 As shown, a second insulating layer 216 is further provided between the buffer layer 200 and the first insulating layer 215, and a third insulating layer 217 is further provided on the side of the first insulating layer 215 away from the base substrate 100. For example, the second insulating layer 216 and the third insulating layer 217 can be made of the same material, such as silicon nitride, but not limited thereto. For example, the second insulating layer 216 and the third insulating layer 217 can reduce the risk of oxidation of the signal line. For example, Figure 2 As shown, the first insulating layer 215 may include a first insulating sublayer 2151 and a second insulating sublayer 2152 , and the first insulating sublayer 2151 is closer to the base substrate 100 than the second insulating sublayer 2152 .

[0054] For example, Figure 2As shown, a fourth insulating layer 218 and a fifth insulating layer 219 are provided on the side of the second conductive layer 220 away from the base substrate 100. For example, the fourth insulating layer 218 can be made of the same material as the third insulating layer 217, such as silicon nitride, but is not limited thereto. For example, the thickness of the fifth insulating layer 219 can be greater than the thickness of the first insulating layer 215. For example, the thickness of the first insulating layer 215 can be 1.5 μm to 7 μm, and the thickness of the fifth insulating layer 219 can be greater than 3 μm, but is not limited thereto. For example, the first insulating layer 215 and the fifth insulating layer 219 can be manufactured using a coating process, but is not limited thereto.

[0055] For example, Figure 1 and Figure 2 As shown, multiple first drive units 110 are arranged in an array along a first direction X and a second direction Y. The first drive units 110 include multiple first connecting portions 111, and the second drive units 120 include second connecting portions 121 and multiple first leads 122 electrically connected to the second connecting portions 121. The first connecting portions 111 in the first drive units 110 and the first leads 122 and second connecting portions 121 in the second drive units 120 are located in the second conductive layer. For example, the first connecting portions 111 can be electrically connected to a light-emitting element to transmit a signal to the light-emitting element to drive it to emit light. For example, the light-emitting element includes a light-emitting diode. As a further example, the light-emitting element includes a mini-LED or micro-LED. For example, each first drive unit 110 can include multiple first connecting portions 111 to simultaneously drive multiple light-emitting elements to emit light. For example, the multiple first drive units 110 in the light-emitting substrate 01 can include different numbers of first connecting portions 111 to accommodate different layouts and lighting requirements, but this is not limited to this. For example, the first driving unit 110 may include multiple first driving parts 1101 and driving connection parts 1102, and the first driving part 1101 includes multiple first connection parts 111 connected in series in sequence, and the driving connection part 1102 can be configured to transmit a driving signal to the first driving part 1101 so that the first driving part drives the light-emitting element to emit light.

[0056] like Figure 1 and Figure 2 As shown, at least a portion of the second driving unit 120 is located between two adjacent first driving units 110 in the first direction X, and between two adjacent first driving units 110 in the second direction Y.

[0057] like Figure 1 and Figure 2As shown, the orthographic projection of the first drive unit 110 on the base substrate 100 does not overlap with the orthographic projection of the second drive unit 120 on the base substrate 100, thereby reducing signal interference between them and facilitating signal control. This arrangement allows at least a portion of the second drive unit 120 to be staggered with the multiple first drive units 110 in the first direction X and staggered with the multiple first drive units 110 in the second direction Y. This ensures that there is sufficient space for the first drive units 110 located in the same row in the first direction X and the first drive units 110 located in the same column in the second direction Y, making their wiring more reasonable and orderly.

[0058] like Figure 3A and Figure 3B As shown, in the second driving unit 120, at least one first lead 122 includes a test pad 130, and the test pad 130 is configured to detect the signal in the first lead 122. For example, the second connecting portion 121 is electrically connected to the second signal line 150 through the first lead 122 to drive the sensor electrically connected thereto to perform temperature detection. For example, the test pad 130 located on the first lead 122 can detect the signal in the first lead 122, thereby determining whether the signal transmission status of the sensor is normal. For example, multiple first leads 122 electrically connected to the same second connecting portion 121 can be configured to transmit different signals, and thus the test pads 130 located on different first leads 122 are configured to detect different signals, but the present invention is not limited to this. For example, the first lead 122 and the test pad 130 are both made of conductive materials, such as a laminated material of MoNb / Cu / MoNb, but the present invention is not limited to this. For example, the materials of the first lead 122 and the test pad 130 may be the same or different, and the embodiments of the present disclosure are not limited thereto.

[0059] For example, Figure 1 and Figure 3A As shown, in at least one embodiment of the present disclosure, at least a portion of the above-mentioned second driving unit 120 can be the second connecting portion 121 in the second driving unit 120, that is, the second connecting portion 121 and the first driving unit 110 are staggered in the first direction X, and the second connecting portion 121 and the first driving unit 110 are staggered in the second direction Y, thereby reducing the excessive setting space occupied by the second connecting portion 121, so that the setting positions of the first driving unit 110 and the second driving unit 120 in the light-emitting substrate 01 are appropriate, and the utilization of the layout space is more reasonable.

[0060] For example, Figure 1 and Figure 3AAs shown, in some embodiments, at least a portion of the second driving unit 120 may also be a portion of the second connecting portion 121 and the first lead 122, and this portion of the second connecting portion 121 and the first lead 122 are both located between two adjacent first driving units 110 in the first direction X, and between two adjacent first driving units 110 in the second direction Y.

[0061] For example, in other embodiments, Figure 1 Different from the light-emitting substrate shown in the figure, at least part of the second driving unit 120 can also be the second connecting portion 121 and at least one first lead 122 electrically connected thereto, so that the second connecting portion 121 and the at least one first lead 122 are both located between two adjacent first driving units 110 in the first direction X, and between two adjacent first driving units 110 in the second direction Y. That is, it is equivalent to placing Figure 1 The second connection portion 121 in the second driving unit 120 of the light-emitting substrate 01 and at least one first lead 122 electrically connected thereto are located between two adjacent first driving units 110 in the first direction X and between two adjacent first driving units 110 in the second direction Y.

[0062] For example, in other embodiments, Figure 1 Different from the light-emitting substrate shown, at least part of the second driving unit 120 can also be the second connecting portion 121 and all the first leads 122 electrically connected thereto. The specific configuration can be determined according to the layout, and the embodiments of the present disclosure are not limited to this. Figure 1 The second connection portion 121 in the second driving unit 120 of the light-emitting substrate 01 shown and all the first leads 122 electrically connected thereto are located between two adjacent first driving units 110 in the first direction X and between two adjacent first driving units 110 in the second direction Y, but are not limited thereto.

[0063] For example, Figure 1 As shown, the first direction X and the second direction Y are both parallel to the base substrate 100 , and the first direction X intersects the second direction Y. For example, the first direction X may be perpendicular to the second direction Y, but is not limited thereto.

[0064] like Figure 1 and Figure 2As shown, the embodiment of the present disclosure can detect the signal transmission status by setting a test pad 130 in the first lead 122. At the same time, by optimizing the setting position of the second driving unit 120 in the light-emitting substrate 01, it is beneficial to ensure that the multiple first leads 122 connected to the second connecting portion 121 have sufficient wiring space and a reasonable arrangement method, thereby reducing the risk of signal failure or inaccurate detection caused by the test pad 130 touching other signal lines during signal detection.

[0065] For example, Figure 2 and Figure 3A As shown, the orthographic projection of the test pad 130 on the base substrate 100 does not overlap with the orthographic projection of the first signal line 140 on the base substrate 100. For example, the first signal line 140 that is not electrically connected to the test pad 130 is spaced apart from the test pad 130 in the first direction X. For example, the extension direction of the test pad 130 is the same as the extension direction of the adjacent first signal line 140, but is not limited thereto. Such an arrangement can reduce the risk of touching other signal lines, such as the first signal line 140, when testing the test pad 130, such as when electrically connecting to the test pad 130 through a "pin penetration test," thereby reducing the risk of detecting signal errors, thereby improving the accuracy of testing the test pad 130.

[0066] For example, Figure 3A As shown, in the first direction X, the ends of the multiple first leads 122 in the same second driving unit 120 away from the second connecting portion 121 are all located on the same side of the second connecting portion 121, that is, the multiple first signal lines 140 electrically connected to the second driving unit 120 are located on the same side of the second driving unit 120, which is conducive to connecting and controlling the multiple first signal lines 140, but the embodiments of the present disclosure are not limited to this.

[0067] For example, Figure 3AAs shown, the orthographic projection of the test pad 130 in one first lead 122 on the substrate 100 does not overlap with the orthographic projection of another adjacent first lead 122 on the substrate 100. For example, the plurality of first leads 122 include a first connecting line 1221, a second connecting line 1222, a third connecting line 1223, and a fourth connecting line 1224, and the plurality of first leads 122 are all electrically connected to the same second connecting portion 121. The first connecting line 1221 extends along a first direction X, and the second connecting line 1222, the third connecting line 1223, and the fourth connecting line 1224 each include a portion extending along the first direction X and another portion extending along the second direction Y. In the second direction Y, the first connecting line 1221, the second connecting line 1222, the third connecting line 1223, and the fourth connecting line 1224 are spaced apart. For example, the test pads 130 in the first connection line 1221, the second connection line 1222, the third connection line 1223, and the fourth connection line 1224 may be respectively located at their ends away from the second connection portion 121. For example, the test pad 130 may be located between two adjacent first signal lines 140 in the first direction X, so that the test pad 130 in one first lead line 122 is spaced apart from the other first signal line 140 in the second direction Y.

[0068] For example, Figure 3A As shown, the end of the first connection line 1221 away from the second connection portion 121 and the end of the second connection line 1222 away from the second connection portion 121 both include a test pad 130. The test pad 130 in the first connection line 1221 is spaced apart from any one of the second connection line 1222, the third connection line 1223, and the fourth connection line 1224 in the second direction Y, and does not overlap. The test pad 130 in the second connection line 1222 is spaced apart from any one of the first connection line 1221, the third connection line 1223, and the fourth connection line 1224 in the second direction Y, and does not overlap. By ensuring that the orthographic projection of the test pad 130 in one first lead 122 on the base substrate 100 does not overlap with the orthographic projection of another adjacent first lead 122 on the base substrate 100, the risk of touching other first leads 122 can be reduced while performing contact detection on the test pad 130, thereby improving the accuracy of signal detection.

[0069] For example, Figure 3A As shown, the test pad 130 in one of the plurality of first leads 122 does not overlap with the second connection portion 121 in the first direction X. For example, the test pad 130 in any of the second connection line 1222 , the third connection line 1223 , and the fourth connection line 1224 does not overlap with the second connection portion 121 in the first direction X.

[0070] For example, Figure 1 and Figure 3AAs shown, another test pad 130 of the plurality of first leads 122 at least partially overlaps with the second connection portion 121 in the first direction X and is located in the gap between two adjacent first driving units 110 in the second direction Y. For example, the test pad 130 in the first connection line 1221 at least partially overlaps with the second connection portion 121 in the first direction X, and the first connection line 1221 is located between two adjacent first driving units 110 in the second direction Y. This ensures that the test pad 130 in the first connection line 1221 is spaced from the two adjacent first driving units 110 in the second direction Y. This reduces the risk of simultaneously conducting signal detection through the test pad 130 and electrically connecting to the first driving unit 110, and reduces the risk of interfering with the normal driving of the first driving unit 110.

[0071] For example, Figure 3A As shown, the plurality of first signal lines 140 extend along the second direction Y and include a first conductive line 141, a second conductive line 142, a third conductive line 143, and a fourth conductive line 144. For example, the first conductive line 141, the second conductive line 142, the third conductive line 143, and the fourth conductive line 144 are spaced apart in the first direction X, but are not limited thereto. For example, the second connecting portion 121 includes a first connecting end 1211, a second connecting end 1212, a third connecting end 1213, and a fourth connecting end 1214. The first connecting end 1211 is electrically connected to the first conductive line 141 via a first connecting line 1221, the second connecting end 1212 is electrically connected to the second conductive line 142 via a second connecting line 1222, the third connecting end 1213 is electrically connected to the third conductive line 143 via a third connecting line 1223, and the fourth connecting end 1214 is electrically connected to the fourth conductive line 144 via a fourth connecting line 1224. For example, the plurality of first signal lines 140 can be configured to transmit different signals to the second connection portion 121, thereby electrically connecting to the sensor. For example, the first conductive line 141 can be configured to transmit an input signal, the second conductive line 142 can be configured to transmit an output signal, the third conductive line 143 can be configured to transmit a power signal, and the fourth conductive line 144 can be configured to transmit a common voltage signal, such as a ground signal, but is not limited thereto.

[0072] Figure 4 corresponds to Figure 1 Schematic plan view of the first conductive layer in FIG.

[0073] For example, Figure 3A and Figure 4At least a portion of the first signal lines 140 and at least a portion of the second signal lines 150 are spaced apart in the first direction X. The orthographic projection of the first driving portion 1101 in the first driving unit 110 on the substrate and the orthographic projection of the driving connection portion 1102 on the substrate do not overlap. The main extension direction of the first signal lines 140 and the second signal lines 150 is the second direction Y, but the present invention is not limited thereto.

[0074] For example, Figure 3A As shown, at least one of the first connection line 1221, the second connection line 1222, and the third connection line 1223 includes a test pad 130. For example, to detect different signals, the first connection line 1221 and the second connection line 1222 may each include a test pad 130 to facilitate separate detection of input and output signals, but the present invention is not limited thereto. For example, the third connection line 1223 may also include a test pad 130 to facilitate detection of the transmission status of a power signal, but the present invention is not limited thereto.

[0075] For example, Figure 3A As shown, in the second driving unit 120, the first connection end 1211 and the second connection end 1212 are adjacently arranged in the first direction X. For example, the first connection end 1211 and the second connection end 1212 may be located in the same row in the first direction X, and the first connection end 1211 is closer to the first conductive line 141 adjacent to the second driving unit 120 than the second connection end 1212, so that the first connection line 1221 connected to the first connection end 1211 is more easily connected to the first conductive line 141.

[0076] For example, Figure 3A and Figure 3B As shown, the first connecting line 1221 is located between two adjacent first driving units 110 in the second direction Y, and the end of the first connecting line 1221 away from the second driving unit 120 includes a first test pad 1301, and the first test pad 1301 is configured to detect the input signal. The end of the second connecting line 1222 away from the second driving unit 120 includes a second test pad 1302, and the second test pad 1302 is configured to detect the output signal. In the second direction Y, the first test pad 1301 and the second test pad 1302 are respectively located on both sides of the same first connecting portion 111 (for example, the first connecting portion 11101). Therefore, the first test pad 1301 and the second test pad 1302 are spaced apart in the second direction Y and separated by the first connecting portion 11101, which is conducive to the rational use of the layout space on both sides of the first connecting portion 11101 and reduces the risk of signal crosstalk when the input signal and the output signal are detected at the same time. As shown Figure 3AAs shown, a first connecting portion 11101 is provided between the first connecting line 1221 and the second connecting line 1222, and the first test pad 1301 and the second test pad 1302 are respectively located on both sides of the first connecting portion 11101. Figure 3A As shown, the first test pad 1301 is disposed on the upper side of the first connection portion 11101 between the first connection line 1221 and the second connection line 1222 , and the second test pad 1302 is disposed on the lower side of the first connection portion 11101 between the first connection line 1221 and the second connection line 1222 .

[0077] For example, Figure 3A As shown, in the second direction Y, the end of the third connection line 1223 away from the second connection part 121 and the end of the fourth connection line 1224 away from the second connection part 121 are both located on the side of the same first connection part 11102 away from the first connection line 1221 adjacent to the first connection part 11101. For example, they can both be located on the side of the first connection part 11101 close to the second connection line 1222 adjacent to the first connection part 11101. Thus, the layout space located on the first connection line 1221 and the second connection line 1222 in the second direction Y can be reasonably utilized.

[0078] For example, Figure 3A As shown, in some embodiments, in the second direction Y, the end of the third connecting line 1223 away from the second connecting portion 121 and the end of the fourth connecting line 1224 away from the second connecting portion 121 can be located on the same side of the same first connecting portion 11101 as the end of the second connecting line 1222 away from the second connecting portion 121, and on a different side of the same first connecting portion 11101 as the end of the first connecting line 1221 away from the second driving unit 120. The specific setting can be made according to the setting requirements to reasonably utilize the layout space, and the embodiments of the present disclosure are not limited to this.

[0079] For example, Figure 1 and Figure 3AAs shown, in the second direction Y, third connection line 1223 and fourth connection line 1224 are both located between first test pad 1301 and second test pad 1302, thereby effectively utilizing the layout space of first test pad 1301 and second test pad 1302 in the second direction Y. For example, the portion of third connection line 1223 extending along the first direction X and the portion of fourth connection line 1224 extending along the first direction X are located between the portions of first connection line 1221 and second connection line 1222 extending along the first direction X, but the present invention is not limited to this. In the second direction Y, first test pad 1301 is located on the side of fourth connection line 1224 away from third connection line 1223, and second test pad 1302 is located on the side of third connection line 1223 away from fourth connection line 1224, but the present invention is not limited to this.

[0080] For example, Figure 3A As shown, the third connection line 1223 includes a first coupling portion 1231, and the fourth connection line 1224 includes a second coupling portion 1232. The first coupling portion 1231 is configured to be electrically connected to one end of the capacitor, and the second coupling portion 1232 is configured to be electrically connected to the other end of the capacitor. This allows the capacitors to be bound together to filter signal noise through the capacitors, thereby making the electrical signal transmission between the sensor and the first signal line 140 more stable. For example, one pin of the capacitor is connected to the first coupling portion 1231, and the other pin of the capacitor is connected to the second coupling portion 1232.

[0081] For example, Figure 3A As shown, in the first direction X, the first combining portion 1231 and the second combining portion 1232 are both located between the portion of the second connecting line 1222 extending along the second direction Y and the second conductive line 142 electrically connected to the second connecting line 1222. For example, the first combining portion 1231 and the second combining portion 1232 are spaced apart and arranged side by side in the first direction X, and are located on the side of the portion of the second connecting line 1222 extending along the second direction Y close to the second signal line 150, but is not limited thereto. For example, when the layout space between the portion of the second connecting line 1222 extending along the second direction Y and the second signal line 150 is relatively loose, the first combining portion 1231 and the second combining portion 1232 may also be located in the area A1, and the first combining portion 1232 and the second combining portion 1232 are spaced apart and arranged side by side in the second direction Y. For example, the orthographic projections of the first combining portion 1232 and the second combining portion 1232 on the substrate substrate do not overlap with the orthographic projections of the sensor on the substrate substrate, and are aligned with the first driving unit 110 (such as Figure 1 The orthographic projections of the two electrodes (shown) on the substrate do not overlap to reduce the risk of signal interference.

[0082] For example, Figure 3AAs shown, the center of the orthographic projection of the second connection portion 121 on the base substrate 100 is aligned with the center of the orthographic projection of the four adjacent first connection portions 111 on the base substrate 100 (e.g. Figure 2 The centers of the figures enclosed by the center lines of the orthographic projections on the substrate 100 are substantially coincident. For example, the center of the orthographic projection may be the center of symmetry or the center of gravity of the projection. For example, the figure enclosed by the center lines of the orthographic projections of the four first connecting parts 111 adjacent to the second connecting part 121 on the substrate 100 may be a rectangle, such as a square, but is not limited thereto. The distances between the second connecting part 121 and the four adjacent first connecting parts 111 are substantially equal, so that the distances between the second connecting part 121 and the four adjacent first driving units 110 are substantially equal, thereby balancing the layout space utilization and making the distances between the sensor and the multiple adjacent light-emitting elements substantially the same, so as to facilitate temperature detection of each light-emitting element.

[0083] For example, Figure 1 and Figure 3A As shown, in some embodiments of the present disclosure, the number of the plurality of first connection portions 111 adjacent to the second connection portion 121 is not limited to four, and can be specifically set based on the number and positions of the first connection portions 111 in the first driving portion 1101. For example, the same first driving portion 1101 can include two first connection portions 111 that are approximately equidistant from the second connection portion 121, so that the number of the plurality of first connection portions 111 adjacent to the second connection portion 121 can be eight, but the present invention is not limited thereto.

[0084] For example, reference Figure 1 and Figure 3A , the distance between the first connecting line 1221 and the two adjacent first drive units 110 is not the same. For example, in other embodiments, in the second direction Y, the distance between the first connecting line 1221 and the two adjacent first drive units 110 may also be substantially the same. For example, in the second direction Y, the two first drive units 110 adjacent to the first connecting line 1221 may be located on both sides of the first connecting line 1221, and are the two first drive units 110 with the smallest distance from the first connecting line 1221. With such a configuration, the layout space of the two first drive units 110 adjacent to the first connecting line 1221 in the second direction Y can be reasonably utilized, thereby reducing the space required to pass through the first test pad 1301 (such as Figure 1 As shown in FIG, the first drive unit 110 performs signal detection while simultaneously detecting the risk of components in the first drive unit 110 (eg, the first connecting portion 111), thereby facilitating signal detection and control.

[0085] For example, Figure 1As shown, a plurality of first driving parts 1101 are arranged in an array along the first direction X and the second direction Y, and the driving connecting part 1102 is located in the area surrounded by the center line of the plurality of first connecting parts 111 adjacent to it. Figure 1 Taking the light-emitting substrate 01 shown as an example, the first driving unit 110 may include four first driving parts 1101, and the four first driving parts 1101 are arranged in two rows and two columns. Each first driving part 1101 includes four first connecting parts 111, but is not limited thereto.

[0086] For example, Figure 1 As shown, adjacent first connection portions 111 are electrically connected via second leads 133. A line connecting the center points of the orthographic projections of multiple first connection portions 111 within a single first driver portion 1101 on the substrate forms a generally rectangular shape, but the present invention is not limited thereto. For example, the driver connection portion 1102 may include a driver circuit, such as a driver chip, for driving the first driver portion 1101. In the light-emitting substrate 01, each driver connection portion 1102 may be configured to drive multiple first driver portions 1101, effectively improving driving efficiency and reducing the layout area occupied by the driver connection portion 1102.

[0087] For example, Figure 1 As shown, a single drive connection portion 1102 can simultaneously drive four adjacent first drive portions 1101 and is located within an area enclosed by a line connecting the center points of the orthographic projections of four adjacent first connection portions 111 of the four first drive portions 1101 on the substrate. For example, the drive connection portion 1102 can be located approximately in the middle of the area, with substantially equal distances from the adjacent first connection portions 111.

[0088] For example, Figure 1 As shown, the plurality of first driving parts 1101 may include a first driving sub-part 11001, a second driving sub-part 11002, a third driving sub-part 11003, and a fourth driving sub-part 11004 arranged in two rows and two columns, and the driving connection part 1102 is located within an area enclosed by a line connecting the centers of four adjacent first connection parts 111, that is, the driving connection part 1102 is located within an area enclosed by a line connecting the centers of four adjacent first connection parts 111 in the first driving sub-part 11001, the second driving sub-part 11002, the third driving sub-part 11003, and the fourth driving sub-part 11004. For example, the orthographic projection of the driving connection part 1102 on the substrate does not overlap with the orthographic projection of the first connection parts 111 in the first driving sub-part 11001, the second driving sub-part 11002, the third driving sub-part 11003, and the fourth driving sub-part 11004 on the substrate.

[0089] For example, Figure 1As shown, such an arrangement can simplify the structure of the first driving unit 110 and reduce the number of components in the first driving unit 110, so as to facilitate the driving connection part 1102 to control multiple first driving parts 1101 at the same time and save layout space.

[0090] For example, Figure 1 As shown, the embodiment of the present disclosure does not limit the number of the plurality of first driving units 1101 driven by the driving connection unit 1102, and can be determined specifically according to the number of first driving units 1101 in the first driving unit 110. For example, the driving connection unit 1102 can include a microchip, and the size (e.g., length) of the microchip can be on the order of tens or hundreds of microns, with a chip area of ​​tens of thousands of square microns or hundreds of square microns or even smaller, which has a miniaturized feature to facilitate integration into the light-emitting substrate 01, but is not limited thereto.

[0091] Figure 5 corresponds to Figure 1 Schematic diagram of the local structure of the drive connection part.

[0092] For example, Figure 1 and Figure 5 As shown, the first driving unit 1101 is electrically connected to the plurality of second signal lines 150, and at least one second signal line 150 is located between the first driving sub-unit 11001 and the second driving sub-unit 11002, which are adjacent to each other in the first direction X, and between the third driving sub-unit 11003 and the fourth driving sub-unit 11004, which are adjacent to each other in the first direction X. For example, the first driving unit 1101 can be electrically connected to the plurality of second signal lines 150 via a driving connection portion 1102. The driving connection portion 1102 can include a plurality of driving terminals, and the dimension of the driving connection portion 1102 in the first direction X is smaller than the dimension of the driving connection portion 1102 in the second direction Y. Thus, in the first direction X, the layout area occupied by the driving connection portion 1102 between the first driving sub-unit 11001 and the second driving sub-unit 11002 can be reduced, and the electrical connection of the driving connection portion 1102 to the plurality of second signal lines 150 can be facilitated.

[0093] For example, Figure 1 and Figure 5As shown, the driver connection portion 1102 may include 12 driver terminals. The first driver sub-unit 11001, the second driver sub-unit 11002, the third driver sub-unit 11003, and the fourth driver sub-unit 11004 are connected to four driver terminals in the driver connection portion 1102, namely, the driver terminal S1, the driver terminal S2, the driver terminal S3, and the driver terminal S4, via corresponding conductive lines. The remaining eight driver terminals are respectively electrically connected to corresponding second signal lines 150 to transmit different drive signals. For example, the first driver sub-unit 11001 is electrically connected to the driver terminal S1, the second driver sub-unit 11002 is electrically connected to the driver terminal S2, the third driver sub-unit 11003 is electrically connected to the driver terminal S3, and the fourth driver sub-unit 11004 is electrically connected to the driver terminal S4. For example, the remaining eight driving terminals in the driving connection portion 1102 may include, but are not limited to, a first ground terminal GND1, a second ground terminal GND2, a third ground terminal GND3, a power terminal VDD, a clock signal output terminal CO, a clock signal input terminal CI, a data signal output terminal DO, and a data signal input terminal DI. For example, the first ground terminal GND1, the second ground terminal GND2, and the third ground terminal GND3 are respectively connected to a ground line, the power terminal VDD is connected to a power signal line, the clock signal input terminal CI is connected to a clock signal input line, the clock signal output terminal CO is connected to a clock signal output line, the data signal input terminal DI is connected to a data input signal line, and the data signal output terminal DO is connected to a data output signal line.

[0094] For example, reference Figure 1 In the second direction Y, at least two first driving units 1101 may be disposed between two adjacent second connecting portions 121 in the same column. For example, first connecting portions 111 located at corners of the same first driving unit 110 may be monitored by sensors connected to the adjacent second driving units 120. For example, sensors may be disposed in areas near the four corners of the first driving unit 110, but this is not limited to this. The number of sensors may also be determined based on their monitoring performance and monitoring needs. For example, in some embodiments, two or more first driving units 110 may be disposed between two adjacent second connecting portions 121 in the same column. For example, for multiple second connecting portions 121 in the same column, the distance between a second connecting portion 121 and two adjacent second connecting portions 121 may be unequal. For example, the number of first driving units 110 between a second connecting portion 121 and a second connecting portion 121 on one side may be unequal to the number of first driving units 110 between a second connecting portion 121 and a second connecting portion 121 on the other side, but this is not limited to this and may be determined based on design requirements.

[0095] Figure 6is a connection diagram of a second driving unit in a light-emitting substrate provided by at least one embodiment of the present disclosure; Figure 7 is a schematic diagram of the overall structure of a light-emitting substrate provided by at least one embodiment of the present disclosure; Figure 8 corresponds to Figure 6 A partial plan view of the first conductive layer in FIG. Figure 9 It is a schematic diagram of the structural arrangement of a light-emitting substrate provided by at least one embodiment of the present disclosure.

[0096] For example, Figure 3A and Figure 6 As shown, in the second direction Y, the end of the second connection line 1222 of a second driving unit 120 away from the second connection end 1212 is electrically connected to the end of the first connection line 1221 of another adjacent second driving unit 120 away from the first connection end 1211, thereby allowing multiple second driving units 120 located in the same column to be connected in series. For example, the light-emitting substrate 01 further includes a binding area 160 (see Figure 7 ), among the multiple second driving units 120 in the same column, the first connecting line 1221 of the first second driving unit 120 is electrically connected to one end of a first conductive line 141, and the other end of the first conductive line 141 is connected to the binding area. That is, the first conductive line 141 is led out from the binding area 160. The second connecting line 1222 of the last second driving unit 120 is electrically connected to one end of a second conductive line 142, and the other end of the second conductive line 142 is connected to the binding area 160. That is, the second conductive line 142 is led back to the binding area 160.

[0097] For example, Figure 3A and Figure 6 As shown, the third connection terminals 1213 of the plurality of second driving units 120 in the same column are all connected to the same third conductive line 143 through the third connection line 1223, and the fourth connection terminals 1214 of the plurality of second driving units 120 in the same column can be connected to the same fourth conductive line 144 through the fourth connection terminals 1214, but the present invention is not limited thereto. For example, Figure 6 Also shown are the first and second coupling portions 1231 and 1232 (see FIG. Figure 3A ) is electrically connected to the capacitor C.

[0098] For example, Figure 7 and Figure 8As shown, the plurality of first drive units 110 in the light-emitting substrate 01 are arranged in an array on one side of the binding area 160. One end of the first signal line 140 is led out from the binding area 160 and electrically connected to the second drive unit 120. One end of the second signal line 150 is led out from the binding area 160 and electrically connected to the first drive unit 110. For example, the first signal line 140 and the second signal line 150 are both led out from the binding area 160 along the second direction Y and then extended to the first drive unit 110 or the second drive unit 120 to be electrically connected according to design requirements.

[0099] For example, Figure 1 、 Figure 3A and Figure 7 As shown, according to the design requirements of the layout, the first connecting line 1221 of at least part of the second driving unit 120 (for example, the second driving unit 1201) can also extend along the second direction Y, and then be electrically connected to the part of the first signal line 140 adjacent to it extending along the first direction Y, thereby making the structural form of the second driving unit 1201 more flexible.

[0100] For example, Figure 1 and Figure 7 As shown, according to design requirements, other structures can be designed in the light-emitting substrate 01 to better transmit signals, and the embodiments of the present disclosure are not limited to this.

[0101] For example, Figure 6 and Figure 9 As shown, the number of first conductive lines 141 in the light-emitting substrate 01 can be equal to the number of columns of the plurality of second drive units 120, so that the second drive units 120 in each column can be independently controlled. For example, when an abnormality occurs in the signal transmitted by one of the sensors, the column where the sensor is located can be located first, and by detecting the detection pad 130 in the first lead 122, the faulty sensor can be quickly identified. Compared with the method of detecting the plurality of second drive units 120 in the light-emitting substrate 01 one by one to determine whether the sensor has a poor solder joint or other poor soldering, the embodiment of the present disclosure effectively improves the ability to cope with the occurrence of faults by independently controlling the second drive units 120 in each column and providing a detection pad 130 in the corresponding first lead 122 according to design requirements (for example, for each second drive unit 120, at least one first lead 122 electrically connected thereto includes a detection pad 130), which is beneficial to the signal transmission and device protection of the light-emitting substrate 01, while improving the efficiency of sensor rework. For example, as Figure 9As shown, the multiple sensors S1 are arranged in three rows and five columns, and the multiple sensors S1 can be driven by column. The drive control between two adjacent columns of sensors can be independent of each other, but is not limited to this. For example, in some embodiments of the present disclosure, the multiple sensors S1 can also be arranged in four rows and five columns, or five rows and six columns. The embodiments of the present disclosure are not limited to this arrangement of the multiple sensors S1.

[0102] For example, Figure 6 As shown, in some embodiments of the present disclosure, the number of second drive units 120 in two adjacent columns may be the same or different, and may be set specifically according to design requirements. For example, the number of first conductive lines 141 in the light-emitting substrate 01 may be less than the number of columns of the second drive units 120. For example, according to the design requirements of the layout space, the second drive units 120 in two adjacent columns may also be connected in series with each other. For example, a plurality of second drive units 120 located in a column are connected in series with each other, and the first connection line 1221 of the first second drive unit 120 in the plurality of second drive units 120 in the column is electrically connected to one end of a first conductive line 141, and the other end of the first conductive line 141 is connected to the binding area (such as Figure 7 As shown in the figure, one end of the second connecting line 1222 of the last second driving unit 120 is electrically connected to one end of a second conductive line 142, and the other end of the second conductive line 142 is connected to the first connecting line 1221 connected to the first second driving unit 120 among the multiple second driving units 120 in another column, but is not limited thereto.

[0103] Figure 10 It is a structural schematic diagram of another light-emitting substrate provided by at least one embodiment of the present disclosure.

[0104] For example, Figure 10 As shown, in some embodiments of the present disclosure, in the light-emitting substrate 02, the second drive unit 120 and the first drive unit 110 are staggered in the first direction X. For example, the second drive unit 120 and the first drive unit 110 do not overlap in the first direction X. For example, multiple second drive units 120 and multiple first drive units 110 are alternately arranged in the second direction Y. For example, compared to Figure 1The structures of the light-emitting substrate 01 and the first driving unit 110 of the light-emitting substrate 02 remain basically unchanged, and the first leads 122 of the second driving unit 120 of the light-emitting substrate 02 are all located between two adjacent first driving units 110 in the second direction Y. For example, the first connecting wire 1221, the second connecting wire 1222, the third connecting wire 1223, and the fourth connecting wire 1224 of the plurality of first leads 122 are all located between two adjacent first driving units 110 in the second direction Y. This can reduce the extension length of each first lead 122 in the second driving unit 120 and reduce the adverse effects of the second driving unit 120 on the first driving unit 110 during the driving process.

[0105] For example, Figure 10 As shown, the specific connection structure of the first drive unit 110 and the second drive unit 120 can refer to the above embodiment. Figure 1 The relevant description is not repeated here.

[0106] Figure 11 This is a connection diagram of a second driving unit in another light-emitting substrate provided by at least one embodiment of the present disclosure.

[0107] For example, Figure 11 As shown, compared to Figure 6 The connection method of the second driving unit 120 in the light-emitting substrate 01 is shown. In the light-emitting substrate 03, the first connecting end 1211 and the second connecting end 1212 of the second driving unit 120 are adjacent to each other in the second direction Y, and the third connecting end 1213 and the fourth connecting end 1214 are adjacent to each other in the second direction Y. For example, the first connecting end 1211, the second connecting end 1212, the third connecting end 1213, and the fourth connecting end 1214 are arranged in an array of two rows and two columns in the first direction X and in the second direction Y. For example, the end of the first connecting line 1221 away from the second driving unit 120 includes a first test pad 1301, and the end of the second connecting line 1222 away from the second driving unit 120 includes a second test pad 1302. For example, the first test pad 1301 can test the input signal line in the first connecting line 1221, and the second test pad 1302 can test the output signal in the second connecting line 1222. For example, in the second direction Y, the first test pad 1301 and the second test pad 1302 can be located on the same side of the same first connecting portion 111, thereby facilitating the detection of the first test pad 1301 and the second test pad 1302 and reducing the impact on other components in the light-emitting substrate 03 (for example, the first driving unit 110).

[0108] For example, Figure 11As shown, the first connection line 1221, the second connection line 1222, and the third connection line 1223 may be located between two adjacent first driving units 110 in the second direction Y. For example, the fourth connection line 1224 is also located between the two adjacent first driving units 110 in the second direction Y, and the third connection line 1223 and the fourth connection line 1224 extend in different directions in the first direction X. For example, the third connection line 1223 and the fourth connection line 1224 do not overlap in the second direction Y to reduce signal interference between them, but the present invention is not limited thereto.

[0109] With such a configuration, the layout space between the two adjacent first driving units 110 in the second direction Y can be effectively utilized, and signal transmission between the first lead lines 122 can be facilitated.

[0110] For example, Figure 11 As shown, in the second direction Y, the third connection line 1223 is located on a side of the second connection line 1222 away from the first connection line 1221. For example, in the first direction X, at least a portion of the fourth connection line 1224 is located on a side of the first connection line 1221 away from the first conductive line 141. Thus, the third connection line 1223 and the fourth connection line 1224 can be arranged outside the first connection line 1221 and the second connection line 1222, which is beneficial for layout space arrangement and facilitates signal transmission.

[0111] For example, Figure 11 As shown, depending on different signal detection needs, detection pads can also be provided at the ends of the third and fourth connecting lines 1223 and 1224 away from the second drive unit 120. For example, the first conductive line 141 and the third conductive line 143 can have a certain overlap, but no electrical connection. In the first direction X, the second conductive line 142 is spaced between the first and third conductive lines 141, 143, and the fourth conductive line (not shown) is located on the side of the second conductive line 142 away from the third conductive line 143, but the present invention is not limited to this.

[0112] For example, Figure 11 As shown, the specific connection structure of the first drive unit 110 and the second drive unit 120 can refer to the above embodiment. Figure 1 The relevant description is not repeated here.

[0113] At least one embodiment of the present disclosure further provides a backlight module, which includes the light-emitting substrate (eg, the light-emitting base 01) described in any one of the above embodiments, a plurality of light-emitting elements, and a plurality of sensors.

[0114] For example, Figure 1As shown, the sensor can be connected to the second connection portion 121. For example, the sensor can include four different pins, which are respectively connected to the first connection end 1211, the second connection end 1212, the third connection end 1213, and the fourth connection end 1214 of the second connection portion 121. For example, the number of pins in the sensor is the same as the number of the plurality of first signal lines 140. For example, the sensor is electrically connected to the plurality of first signal lines 140 in the light-emitting substrate 01 via the second connection portion, but this is not limited thereto.

[0115] For example, Figure 1 As shown, the light-emitting element can be connected to the first connection portion 111. For example, the light-emitting element can include two pins with different polarities, such as a positive pin and a negative pin. The first connection portion 111 can include two corresponding connection terminals with opposite polarities, such as a positive connection terminal connected to the positive pin and a negative connection terminal connected to the negative pin. For example, in the first driving unit 1101, the number of light-emitting elements is the same as the number of first connection portions 111. For example, the light-emitting element is electrically connected to the plurality of second signal lines 150 in the light-emitting substrate 01 through the first connection portion 111, but is not limited thereto.

[0116] For example, the sensor can quickly and effectively monitor the luminescence of the surrounding light-emitting elements so as to timely adjust the current, voltage, brightness and other parameters of the light-emitting elements, thereby ensuring the stable performance of each light-emitting element. For example, the sensor can be of various types according to its function. For example, the sensor can be a temperature sensor to detect the temperature of the surrounding light-emitting elements so as to adjust the voltage, current and other parameters to avoid system insensitivity caused by excessive temperature, or circuit burnout caused by excessive voltage and current. For example, the sensor can also be a photosensor to detect the brightness of the surrounding light-emitting elements so as to timely adjust the brightness of each light-emitting element so that the brightness of each light-emitting element remains consistent and stably illuminated. For example, the sensor can also be an integrated sensor integrated on a chip and bound to the light-emitting substrate through the second connecting portion 121. The embodiments of the present disclosure do not limit the type of sensor.

[0117] like Figure 12 As shown, at least one embodiment of the present disclosure further provides a display device 1000, comprising a backlight module 1100 and a display module 1200. For example, the backlight module 1100 can be the backlight module provided in any of the above embodiments. For example, the backlight module 1100 is disposed on one side of the display module 1200 and can provide backlight for the display module 1200. Since the display device 1000 includes the backlight module 1100 of any of the above embodiments, it also has the technical effects brought about by the above backlight module 1100, which will not be further described here.

[0118] For example, the display device 1000 can be any product or component with a display function, such as a television, a laptop computer, a tablet computer, a wearable display device, a mobile phone, a car display, a navigation, an e-book, a digital photo frame, an advertising light box, etc., and the embodiments of the present disclosure are not limited to this.

[0119] There are a few points to note:

[0120] (1) The drawings of the embodiments of the present disclosure only involve structures related to the embodiments of the present disclosure, and other structures can refer to general designs.

[0121] (2) In the absence of conflict, features in the same embodiment and different embodiments of the present disclosure may be combined with each other.

[0122] The foregoing description is merely an exemplary embodiment of the present disclosure and is not intended to limit the scope of protection of the present disclosure, which is determined by the appended claims.

Claims

1. A light-emitting substrate, comprising: substrate; a plurality of first drive units located on the base substrate, the plurality of first drive units being arranged in an array along a first direction and a second direction, the first drive units comprising a plurality of first connecting portions, the first direction and the second direction being parallel to the base substrate, and the first direction intersecting the second direction; a second driving unit located on the base substrate, the second driving unit comprising a second connecting portion and a plurality of first leads electrically connected to the second connecting portion, the second driving unit being configured to drive the sensor; At least a portion of the second driving unit is located between two adjacent first driving units in the first direction, and between two adjacent first driving units in the second direction. At least one first lead includes a test pad, and the test pad is configured to detect a signal in the first lead to determine whether the signal transmission status of the sensor is normal.

2. The light emitting substrate according to claim 1, further comprising a plurality of first signal lines electrically connected to the second connection portion, in, An orthographic projection of the test pad on the base substrate does not overlap with an orthographic projection of the first signal line on the base substrate.

3. The light-emitting substrate according to claim 2, wherein The first connection portion and the first driving unit are staggered in the first direction, and the first connection portion and the first driving unit are staggered in the second direction.

4. The light-emitting substrate according to any one of claims 1 to 3, wherein In the first direction, ends of multiple first leads in the same second driving unit that are away from the second connecting portion are all located on the same side of the second connecting portion, and an orthographic projection of the test pad in one first lead on the substrate does not overlap with an orthographic projection of another adjacent first lead on the substrate. The light-emitting substrate according to claim 3 , wherein: The test pad in one of the plurality of first leads does not overlap with the second connection portion in the first direction, and / or The test pad of another one of the plurality of first leads at least partially overlaps with the second connection portion in the first direction and is located in a gap between two adjacent first driving units in the second direction. The light-emitting substrate according to claim 3 , wherein: The plurality of first signal lines extend along the second direction and include a first conductive line, a second conductive line, a third conductive line, and a fourth conductive line; The second connection portion includes a first connection end, a second connection end, a third connection end, and a fourth connection end, and the plurality of first leads include a first connection line, a second connection line, a third connection line, and a fourth connection line. The first connection end is electrically connected to the first conductive line through the first connection line, the second connection end is electrically connected to the second conductive line through the second connection line, the third connection end is electrically connected to the third conductive line through the third connection line, and the fourth connection end is electrically connected to the fourth conductive line through the fourth connection line.

7. The light-emitting substrate according to claim 6, wherein At least one of the first connection line, the second connection line, and the third connection line includes the test pad.

8. The light-emitting substrate according to claim 7, wherein In the second driving unit, the first connecting end and the second connecting end are adjacent to each other in the first direction, and the first connecting end is closer to the first conductive line adjacent to the second driving unit than the second connecting end, and the first connecting line is located between two adjacent first driving units in the second direction. The end of the first connecting line away from the second driving unit includes a first test pad, and the first test pad is configured to detect an input signal. The end of the second connecting line away from the second driving unit includes a second test pad, and the second test pad is configured to detect an output signal. In the second direction, the first test pad and the second test pad are respectively located on both sides of the same first connecting portion.

9. The light-emitting substrate according to claim 8, wherein In the second direction, the end of the third connecting line away from the second connecting portion and the end of the fourth connecting line away from the second connecting portion are both located on a side of the same first connecting portion away from the first connecting line adjacent to the first connecting portion.

10. The light emitting substrate according to claim 8, wherein In the second direction, the third connecting line and the fourth connecting line are both located between the first test pad and the second test pad.

11. The light-emitting substrate according to claim 9, wherein The third connecting line includes a first connecting portion, and the fourth connecting line includes a second connecting portion, wherein the first connecting portion is configured to be electrically connected to one end of the capacitor, and the second connecting portion is configured to be electrically connected to the other end of the capacitor. In the first direction, the first combining portion and the second combining portion are both located between a portion of the second connecting line extending along the second direction and the second conductive line close to and electrically connected to the second connecting line.

12. The light-emitting substrate according to any one of claims 1 to 3, wherein: The second driving unit and the first driving unit are staggered in distribution in the first direction.

13. The light-emitting substrate according to claim 3, wherein The center of the orthographic projection of the second connecting portion on the base substrate substantially coincides with the center of a figure formed by a line connecting the centers of the orthographic projections of four adjacent first connecting portions on the base substrate.

14. The light-emitting substrate according to claim 7, wherein In the second driving unit, the first connecting end and the second connecting end are adjacently arranged in the second direction, and the third connecting end and the fourth connecting end are adjacently arranged in the second direction. The end of the first connecting line away from the second driving unit includes a first test pad, and the end of the second connecting line away from the second driving unit includes a second test pad. In the second direction, the first test pad and the second test pad are located on one side of the same first connecting portion.

15. The light-emitting substrate according to claim 14, wherein The first connecting line, the second connecting line, and the third connecting line are all located between two adjacent first driving units in the second direction.

16. The light-emitting substrate according to claim 14, wherein In the second direction, the third connecting line is located on a side of the second connecting line away from the first connecting line; In the first direction, at least a portion of the fourth connecting line is located on a side of the first connecting line away from the first conductive line.

17. The light-emitting substrate according to any one of claims 8 to 11, wherein: The first driving unit includes a plurality of first driving parts, and the first driving part includes a plurality of first connecting parts connected in series. The first driving unit includes a driving connection portion. The plurality of first driving portions are arranged in an array along the first direction and the second direction. The driving connection portion is located in an area surrounded by a center line connecting the plurality of adjacent first connection portions.

18. The light-emitting substrate according to claim 17, wherein The multiple first driving parts include a first driving sub-part, a second driving sub-part, a third driving sub-part and a fourth driving sub-part arranged in two rows and two columns. The driving connecting part is located in an area surrounded by a center line connecting four adjacent first connecting parts.

19. The light-emitting substrate according to claim 18, further comprising: a plurality of second signal lines, the first driving section being electrically connected to the plurality of second signal lines, at least one of the second signal lines being located between the first driving sub-section and the second driving sub-section adjacent to each other in the first direction, and between the third driving sub-section and the fourth driving sub-section adjacent to each other in the first direction.

20. The light-emitting substrate according to claim 17, wherein In the second direction, at least two first driving parts are disposed between two adjacent second connecting parts that are located in the same column.

21. The light-emitting substrate according to any one of claims 6 to 11, wherein: In the second direction, one end of the second connecting line of one second driving unit away from the second connecting end is electrically connected to one end of the first connecting line of another adjacent second driving unit away from the first connecting end. The light-emitting substrate also includes a binding area. Among the multiple second driving units in the same column, the first connecting line of the first second driving unit is electrically connected to one end of one of the first conductive lines, and the other end of the first conductive line is connected to the binding area. The end of the second connecting line of the last second driving unit is electrically connected to one end of one of the second conductive lines, and the other end of the second conductive line is connected to the binding area.

22. A backlight module comprising the light-emitting substrate according to any one of claims 1 to 21.

23. A display device comprising the backlight module according to claim 22.

Citation Information

Patent Citations

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