Amino hyperbranched polysiloxane modified unsaturated polyimide high temperature resistant adhesive and preparation method thereof

By using an amino-hyperbranched polysiloxane-modified unsaturated polyimide preparation method, the problem of poor adhesion performance of polyimide adhesives at high temperatures was solved, achieving excellent adhesion and mechanical properties at high temperatures, making it suitable for aerospace, electronic insulation, and fiber optic communication.

CN119081644BActive Publication Date: 2026-06-09NANJING UNIV

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
NANJING UNIV
Filing Date
2024-10-11
Publication Date
2026-06-09

AI Technical Summary

Technical Problem

Existing polyimide adhesives have poor bonding performance at high temperatures, complex synthesis processes, and unstable bonding over long periods, failing to meet the high temperature resistance requirements of the aerospace industry.

Method used

An amino-hyperbranched polysiloxane-modified unsaturated polyimide preparation method is adopted. The reaction of diacid anhydride compound, diamine and unsaturated monoacid anhydride in a polar solvent is carried out, followed by the addition of amino-hyperbranched polysiloxane, and then reaction with triethylamine and acetic anhydride. Finally, the mixture is washed, filtered and dried in an alcohol solvent to form a homogeneous solution and then cured to obtain an amino-hyperbranched polysiloxane-modified unsaturated polyimide high-temperature resistant adhesive.

Benefits of technology

It is simple to prepare, has excellent bonding and mechanical properties, excellent high temperature resistance and bonding strength, and stable bonding over a long period of time, which expands the application of polyimide adhesives in aerospace, electronic insulation and optical fiber communication.

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Abstract

This invention discloses a method for preparing an amino-hyperbranched polysiloxane-modified unsaturated polyimide high-temperature resistant adhesive, comprising the following steps: mixing and reacting a dianhydride compound, a diamine, and an unsaturated monoanhydride in a polar solvent to obtain an unsaturated anhydride-terminated polyamic acid solution; adding an amino-hyperbranched polysiloxane to the solution to obtain an amino-hyperbranched polysiloxane-modified unsaturated polyamic acid solution; adding an excess of a triethylamine and acetic anhydride mixed solution to the solution to obtain an amino-hyperbranched polysiloxane-modified unsaturated polyimide solution; after cooling to room temperature, pouring the solution into an alcohol solvent, and after washing, filtering, and drying, obtaining an amino-hyperbranched polysiloxane-modified unsaturated polyimide solid powder; dissolving the amino-hyperbranched polysiloxane-modified unsaturated polyimide solid powder in an organic solvent. The adhesive obtained by this invention exhibits excellent bonding and mechanical properties, excellent high-temperature resistance, and good long-term bonding stability.
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