Mini LED chip detection method and device based on multi-channel probe group

Abstract

The invention discloses a Mini LED chip detection method and device based on a multi-channel probe group, and the method comprises the steps: carrying out the loading scanning of a to-be-detected LED chip, and carrying out the recognition of the scanned to-be-detected LED chip through an image recognition technology, and determining the position information of the to-be-detected LED chip; controlling a multi-channel probe group to move to the LED chip to be detected according to the position information, and controlling the multi-channel probe group to be erected above a crystal grain in a preset area of the LED chip to be detected by taking a probe aligning frame as a standard; and when the appearance of the crystal grain is detected to be normal, controlling the multi-channel probe group to drop the probe, then sequentially performing power transmission test on each channel probe group, and after the multi-channel probe group passes the test, detecting the LED chip to be detected by using the multi-channel probe group. According to the invention, the problem of low test accuracy caused by the fact that channel wiring errors of the multi-channel probe group and probe deviation cannot be found in time during test in the prior art is solved.

Description

Technical Field

[0001] The present invention relates to the field of chip testing technology, and in particular to a Mini LED chip detection method and device based on a multi-channel probe group. Background Art

[0002] With the development of the LED wafer industry, product sizes are getting smaller and smaller, and the technical difficulties in Mini LED testing are increasing. In actual production, wafer testing is abnormal due to testing machines and external factors. In order to improve production capacity, LED chip point testing has used 8 or more pins in an interlaced and parallel testing method. The number of probes is large and they are densely placed, and the circuits are complex, which requires higher accuracy in needle adjustment by personnel and wiring by machines.

[0003] In the existing technology, operators adjust the needles manually. However, due to the large number of probe groups and the small grain size, overall offset is prone to occur. Channel offset and other problems often occur. In addition, the wiring of each channel of the machine depends on personnel to check the wiring. If the personnel are careless, a channel will be connected incorrectly, and the abnormality is difficult to detect, resulting in confusion in product test data and affecting product quality. Summary of the invention

[0004] In view of this, the purpose of the present invention is to provide a Mini LED chip detection method and device based on a multi-channel probe group, aiming to solve the problem in the prior art that during testing, the channel wiring errors of the multi-channel probe group and the probe offset lead to low test accuracy.

[0005] On the one hand, the present invention provides a Mini LED chip detection method based on a multi-channel probe group, the method comprising: Scan the LED chip to be tested, and use image recognition technology to identify the scanned LED chip to be tested to determine the position information of the LED chip to be tested; Control the multi-channel probe set to move to the LED chip to be tested according to the position information, and control the multi-channel probe set to be placed above the grain of the LED chip to be tested in a preset area according to the needle frame; When it is detected that the appearance of the grain is normal, the multi-channel probe group is controlled to drop the needle and then power on each channel probe group for testing in turn, and after the multi-channel probe groups have passed the test, the multi-channel probe group is used to test the LED chip to be tested.

[0006] Furthermore, in the above-mentioned Mini LED chip detection method based on a multi-channel probe group, the step of performing on-chip scanning on the LED chip to be detected and using image recognition technology to identify the scanned LED chip to be detected to determine the position information of the LED chip to be detected includes: Traversing all LED chips to be tested on the wafer, and obtaining the initial position information of each LED chip to be tested relative to a preset target position; According to the layout and quantity of all LED chips to be detected on the wafer, a corresponding scanning path is planned, and then the LED chips to be detected are scanned according to the scanning path to determine the position information of each LED chip to be detected.

[0007] Furthermore, in the above-mentioned Mini LED chip detection method based on a multi-channel probe group, before the step of detecting that the appearance of the die is normal, the method further includes: Acquire a grain image of the grain, and preprocess the grain image, wherein the preprocessing includes denoising and contrast enhancement; Extracting key feature information of the grain from the preprocessed grain image, and comparing the key feature information with a preset defect template; When the key feature information fails to pass the comparison with the preset defect template, it is determined that the appearance of the grain is normal.

[0008] Furthermore, in the above-mentioned Mini LED chip detection method based on the multi-channel probe group, the steps of controlling the multi-channel probe group to power on each channel probe group in turn for testing after the needle is dropped, and using the multi-channel probe group to detect the LED chip to be detected after the multi-channel probe groups have passed the test include: After each channel probe group is powered on for testing, a test image of the needle frame position after the power-on test is collected; Identify the test image to determine whether the corresponding die is lit; If yes, it is determined that the channel of the current channel probe group is normal, and the power supply test of the next channel probe group is performed; If not, a prompt message is issued to indicate that a channel abnormality exists in the current channel probe group.

[0009] Furthermore, in the above-mentioned Mini LED chip detection method based on a multi-channel probe group, the step of collecting a test image of the needle frame position after the power-on test includes: The light is captured by a CCD sensor and converted into an electrical signal to generate a corresponding digital image to obtain a test image.

[0010] Furthermore, in the above-mentioned Mini LED chip detection method based on a multi-channel probe group, the step of identifying the test image and determining whether the corresponding die is lit includes: Performing preliminary processing on the test image, wherein the preliminary processing includes noise reduction, filtering, graying, and binarization; Extracting key features from the preliminarily processed test image, wherein the key features include shape, color, and texture; The key features are identified using a preset identification algorithm to determine whether the corresponding die is lit.

[0011] Furthermore, in the above-mentioned Mini LED chip detection method based on a multi-channel probe group, before the step of traversing all LED chips to be detected on the wafer and obtaining the initial position information of each LED chip to be detected relative to a preset target position, the step further includes: The internal and external parameters of the image acquisition device that traverses all LED chips to be detected on the wafer are calibrated, and the lens distortion is corrected.

[0012] Another object of the present invention is to provide a Mini LED chip detection device based on a multi-channel probe group, the device comprising: The scanning module is used to scan the LED chip to be detected, and use the image recognition technology to identify the scanned LED chip to be detected to determine the position information of the LED chip to be detected; A moving module, used for controlling the multi-channel probe group to move to the LED chip to be detected according to the position information, and controlling the multi-channel probe group to be placed above the grain of the LED chip to be detected in a preset area based on the needle frame; The detection module is used to control the multi-channel probe group to power on each channel probe group in turn for testing after the multi-channel probe group is detected to have a normal appearance, and to use the multi-channel probe group to detect the LED chip to be detected after all the multi-channel probe groups have passed the test.

[0013] Another object of the present invention is to provide a readable storage medium having a computer program stored thereon, wherein the program implements the steps of the above-described method when executed by a processor.

[0014] Another object of the present invention is to provide an electronic device, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements the steps of the above method when executing the program.

[0015] The present invention scans the LED chip to be tested, identifies the scanned LED chip to be tested using image recognition technology to determine the position information of the LED chip to be tested; controls the multi-channel probe group to move to the LED chip to be tested according to the position information, and controls the multi-channel probe group to be placed above the grains in the preset area of ​​the LED chip to be tested based on the needle frame; when it is detected that the appearance of the grain is normal, controls the multi-channel probe group to drop the needle and then energizes each channel probe group in turn for testing, and uses the multi-channel probe group to test the LED chip to be tested after the multi-channel probe groups have passed the test. Automatically control the alignment of the probes with the grains on the chip, and use part of the grains to calibrate the multi-channel probe group before chip testing to ensure that the probe group wiring is normal before chip testing. This solves the problem in the prior art that the multi-channel probe group channel wiring errors and probe offsets cannot be discovered in time during testing, resulting in low test accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a flow chart of a Mini LED chip detection method based on a multi-channel probe group in the first embodiment of the present invention; Figure 2 Schematic diagram of a power transmission test performed by a probe group in a Mini LED chip detection method based on a multi-channel probe group in one embodiment of the present invention; Figure 3 This is a structural block diagram of a Mini LED chip detection device based on a multi-channel probe group in the third embodiment of the present invention.

[0017] The following specific implementation manner will further illustrate the present invention in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0018] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. Several embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0019] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0020] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which the present invention belongs. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0021] The following will describe in detail how to improve the accuracy of chip testing in conjunction with specific embodiments and drawings.

[0022] Embodiment 1 See also Figure 1 , shown is a Mini LED chip detection method based on a multi-channel probe group in a first embodiment of the present invention, and the method includes steps S10~S12.

[0023] Step S10 , scanning the LED chip to be detected, and using image recognition technology to identify the scanned LED chip to be detected to determine the position information of the LED chip to be detected.

[0024] Among them, before the point test operation begins, the LED chip to be tested must first be loaded into the test equipment, which is called "loading". At this time, the scanning system will perform preliminary detection and recording of each chip to ensure that the position information and characteristic data of each chip are accurately stored in the storage medium of the device. These data will then be used for subsequent test positioning and analysis. The role of automatic scanning is to ensure that each Mini LED chip meets the predetermined performance standards during testing. By fully automated scanning of the chip, the system can accurately locate each Mini LED chip and use the image recognition system to determine the exact position of the chip. Ensure the accuracy of the test.

[0025] Specifically, the image acquisition device in the scanning system, such as a camera, can be calibrated to ensure that it can accurately capture and identify the chips on the wafer. Among them, the calibration includes the steps of internal and external parameter calibration of the camera, lens distortion correction, etc. The camera can traverse all the chips on the wafer to collect images, and then use image recognition technology, including edge detection, feature extraction, image segmentation, etc., to accurately extract the position and shape information of the chip from the complex background, obtain the initial position information of each chip relative to the preset target position (such as the center of the wafer or a specific reference point), and record these positions. In addition, according to the layout and number of chips on the wafer, the optimal scanning path can be planned to reduce the scanning time and improve the scanning efficiency, and the chip can be scanned according to the scanning path to obtain the relevant parameter information of the chip, such as the position information of the chip, the distribution of grains on the chip, and the corresponding grain image.

[0026] Step S11 , controlling the multi-channel probe set to move to the LED chip to be inspected according to the position information, and controlling the multi-channel probe set to be placed above the die in the preset area of ​​the LED chip to be inspected based on the needle alignment frame.

[0027] Among them, after the scanning is completed, preparation work before the probe test is carried out. Specifically, the multi-channel probe group is moved to the LED chip to be tested, and a preset area is selected on the LED chip to be tested, and the grains on the preset area are used as self-inspection grains for pre-testing by the probe group. Among them, based on the needle frame as the standard, the multi-channel probe group is placed above the grain to ensure the precise alignment between the probe group and the grain. The needle frame provides a reference coordinate system for the probe group, so that the test equipment can accurately align the probe with the key contact point of each grain to avoid probe offset or miscontact, resulting in inaccurate measurement.

[0028] Step S12, when it is detected that the appearance of the die is normal, the multi-channel probe group is controlled to power on each channel probe group in turn for testing after the probe is dropped, and after the multi-channel probe groups have passed the test, the LED chip to be tested is tested using the multi-channel probe group.

[0029] Among them, after determining that the appearance of the selected grain is normal, the multi-channel probe group is controlled to drop the needle and start the power supply test, so as to detect whether the wiring of the channel probe group is normal according to the test results. Specifically, the multi-channel probe groups are tested respectively in turn, and after the multi-channel probe groups are tested to determine that the wiring of the current multi-channel probe group is normal, the self-inspection of the multi-channel probe group is completed, and then the LED chip detection is started to ensure the accuracy of the chip detection.

[0030] In addition, in some optional embodiments of the present invention, image processing technology can be used to determine whether the appearance of the current grain is normal. Specifically, the collected grain image is preprocessed, including denoising, contrast enhancement, etc., to improve the image quality. Key feature information, such as edges, corners, etc., is extracted from the preprocessed image. The extracted feature information is compared with a preset defect template to detect whether there are defects on the grain of the chip.

[0031] Furthermore, for the convenience of analysis, during the on-chip scanning test, the defects detected during the scanning process can be counted and analyzed, including defect type, quantity, distribution, etc. A detailed test report is generated based on the statistical results, including defect images, location information, test results, etc., for subsequent analysis and processing.

[0032] In summary, the Mini LED chip detection method based on the multi-channel probe group in the above embodiment of the present invention scans the LED chip to be detected, and uses image recognition technology to identify the scanned LED chip to be detected to determine the position information of the LED chip to be detected; according to the position information, the multi-channel probe group is controlled to move to the LED chip to be detected, and the multi-channel probe group is controlled to be placed above the grain in the preset area of ​​the LED chip to be detected based on the needle frame; when the appearance of the grain is detected to be normal, the multi-channel probe group is controlled to power on each channel probe group in turn after the needle is dropped, and the multi-channel probe group is used to detect the LED chip to be detected after the multi-channel probe group has passed the test. The probe is automatically controlled to align with the grain on the chip, and the multi-channel probe group is verified with part of the grains before chip detection to ensure that the chip is detected only after the probe group wiring is normal. The problem of low test accuracy caused by the failure to timely discover the multi-channel probe group channel wiring errors and probe offset in the prior art during testing is solved.

[0033] Embodiment 2 This embodiment also proposes a Mini LED chip detection method based on a multi-channel probe group. The difference between the Mini LED chip detection method based on a multi-channel probe group in this embodiment and the Mini LED chip detection method based on a multi-channel probe group in the first embodiment is that: The steps of controlling the multi-channel probe group to drop the needle and then powering each channel probe group for testing in turn, and using the multi-channel probe group to test the LED chip to be tested after all the multi-channel probe groups have passed the test include: After each channel probe group is powered on for testing, a test image of the needle frame position after the power-on test is collected; Identify the test image to determine whether the corresponding die is lit; If yes, it is determined that the channel of the current channel probe group is normal, and the power supply test of the next channel probe group is performed; If not, a prompt message is issued to indicate that a channel abnormality exists in the current channel probe group.

[0034] Among them, the power supply test is performed on each probe in sequence, for example, Figure 2 As shown, there are 8 channel probes for power supply test. First, one of the channel probes is tested for power supply, and CCD is used to take pictures for evidence to determine whether the light of the grain at the needle frame position is on; if it is on, the system automatically determines that the corresponding position of the probe of this channel group is accurate and the wiring is normal, and then executes the next channel probe test; if it is not lit, the system issues a prompt message to indicate that there is a channel abnormality in the current channel probe group.

[0035] Specifically, when taking photos for evidence, light is captured by a CCD sensor, and the light is converted into an electrical signal to generate a corresponding digital image to obtain a test image. The collected image is preliminarily processed, including noise reduction, filtering, graying, binarization and other steps to remove noise and unnecessary details in the image, improve the image quality, and make it easier for subsequent processing and analysis. In the pre-processed image, key features in the image, such as shape, color, texture, etc., are extracted. These features will be used for subsequent image recognition and analysis.

[0036] According to the extracted features, the target object in the image is judged and identified using classification and recognition algorithms. The recognition result is given. The recognition result is output in an appropriate form, such as displayed on a screen, stored in a file, or sent to other devices as a control signal. It should be noted that the recognition and classification algorithm can be selected according to the actual situation, which is understandable to those skilled in the art and will not be described in detail here.

[0037] In summary, the Mini LED chip detection method based on the multi-channel probe group in the above embodiment of the present invention scans the LED chip to be detected, and uses image recognition technology to identify the scanned LED chip to be detected to determine the position information of the LED chip to be detected; according to the position information, the multi-channel probe group is controlled to move to the LED chip to be detected, and the multi-channel probe group is controlled to be placed above the grain in the preset area of ​​the LED chip to be detected based on the needle frame; when the appearance of the grain is detected to be normal, the multi-channel probe group is controlled to power on each channel probe group in turn after the needle is dropped, and the multi-channel probe group is used to detect the LED chip to be detected after the multi-channel probe group has passed the test. The probe is automatically controlled to align with the grain on the chip, and the multi-channel probe group is verified with part of the grains before chip detection to ensure that the chip is detected only after the probe group wiring is normal. The problem of low test accuracy caused by the failure to timely discover the multi-channel probe group channel wiring errors and probe offset in the prior art during testing is solved.

[0038] Embodiment 3 See also Figure 3 , shown is a Mini LED chip detection device based on a multi-channel probe group proposed in the third embodiment of the present invention, the device comprising: The scanning module 100 is used to scan the LED chip to be detected, and identify the scanned LED chip to be detected by using image recognition technology to determine the position information of the LED chip to be detected; The moving module 200 is used to control the multi-channel probe group to move to the LED chip to be detected according to the position information, and control the multi-channel probe group to be placed above the grain of the LED chip to be detected in a preset area based on the needle frame; The detection module 300 is used to control the multi-channel probe group to power on each channel probe group in turn for testing after the multi-channel probe group is detected to have a normal appearance, and to use the multi-channel probe group to detect the LED chip to be detected after all the multi-channel probe groups have passed the test.

[0039] Furthermore, in some optional embodiments of the present invention, the scanning module includes: A traversal unit, used for traversing all LED chips to be detected on the wafer, and obtaining initial position information of each LED chip to be detected relative to a preset target position; According to the layout and quantity of all LED chips to be detected on the wafer, a corresponding scanning path is planned, and then the LED chips to be detected are scanned according to the scanning path to determine the position information of each LED chip to be detected.

[0040] Furthermore, in some optional embodiments of the present invention, the device further comprises: A comparison unit, used for acquiring a grain image of a grain and preprocessing the grain image, wherein the preprocessing includes denoising and contrast enhancement; Extracting key feature information of the grain from the preprocessed grain image, and comparing the key feature information with a preset defect template; When the key feature information fails to pass the comparison with the preset defect template, it is determined that the appearance of the grain is normal.

[0041] Furthermore, in some optional embodiments of the present invention, the detection module includes: A test unit, used for collecting a test image of the position of the needle frame after the power supply test of each channel probe group; Identify the test image to determine whether the corresponding die is lit; If yes, it is determined that the channel of the current channel probe group is normal, and the power supply test of the next channel probe group is performed; If not, a prompt message is issued to indicate that a channel abnormality exists in the current channel probe group.

[0042] Further, in some optional embodiments of the present invention, the step of acquiring a test image of the needle frame position after the power transmission test includes: The light is captured by a CCD sensor and converted into an electrical signal to generate a corresponding digital image to obtain a test image.

[0043] Further, in some optional embodiments of the present invention, the step of identifying the test image to determine whether the corresponding die is lit includes: Performing preliminary processing on the test image, wherein the preliminary processing includes noise reduction, filtering, graying, and binarization; Extracting key features from the preliminarily processed test image, wherein the key features include shape, color, and texture; The key features are identified using a preset identification algorithm to determine whether the corresponding die is lit.

[0044] Furthermore, in some optional embodiments of the present invention, the device further comprises: The correction module is used to calibrate the internal and external parameters of the image acquisition device of all LED chips to be detected on the wafer and correct the lens distortion.

[0045] The functions or operation steps implemented when the above modules are executed are substantially the same as those in the above method embodiments, and will not be repeated here.

[0046] Embodiment 4 Another aspect of the present invention further provides a readable storage medium having a computer program stored thereon, and when the program is executed by a processor, the steps of the method described in any one of the above embodiments 1 to 2 are implemented.

[0047] Embodiment 5 Another aspect of the present invention provides an electronic device, which includes a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements the steps of the method described in any one of the above-mentioned embodiments one to two when executing the program.

[0048] The technical features of the above embodiments can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0049] Those skilled in the art will appreciate that the logic and / or steps represented in the flowchart or otherwise described herein, for example, may be considered as an ordered list of executable instructions for implementing logical functions, and may be specifically implemented in any computer-readable storage medium for use by an instruction execution system, device or apparatus (such as a computer-based system, a system including a processor, or other system that can fetch instructions from an instruction execution system, device or apparatus and execute instructions), or in conjunction with such instruction execution systems, devices or apparatuses. For purposes of this specification, a "computer-readable storage medium" may be any device that can contain, store, communicate, propagate or transmit a program for use by an instruction execution system, device or apparatus, or in conjunction with such instruction execution systems, devices or apparatuses.

[0050] More specific examples (a non-exhaustive list) of computer-readable storage media include the following: an electrical connection with one or more wires (electronic device), a portable computer disk case (magnetic device), a random access memory (RAM), a read-only memory (ROM), an erasable and programmable read-only memory (EPROM or flash memory), an optical fiber device, and a portable compact disk read-only memory (CDROM). In addition, the computer-readable storage medium may even be a paper or other suitable medium on which the program is printed, since the program may be obtained electronically, for example, by optically scanning the paper or other medium, followed by editing, deciphering or, if necessary, processing in another suitable manner, and then stored in a computer memory.

[0051] It should be understood that the various parts of the present invention can be implemented by hardware, software, firmware or a combination thereof. In the above-mentioned embodiments, multiple steps or methods can be implemented by software or firmware stored in a memory and executed by a suitable instruction execution system. For example, if implemented by hardware, as in another embodiment, it can be implemented by any one of the following technologies known in the art or a combination thereof: a discrete logic circuit having a logic gate circuit for implementing a logic function for a data signal, a dedicated integrated circuit having a suitable combination of logic gate circuits, a programmable gate array (PGA), a field programmable gate array (FPGA), etc.

[0052] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0053] The above-mentioned embodiments only express several implementation methods of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the patent of the present invention. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A Mini LED chip detection method based on a multi-channel probe group, characterized in that: The method comprises: Scan the LED chip to be tested, and use image recognition technology to identify the scanned LED chip to be tested to determine the position information of the LED chip to be tested; Control the multi-channel probe set to move to the LED chip to be tested according to the position information, and control the multi-channel probe set to be placed above the grain of the LED chip to be tested in a preset area according to the needle frame; When it is detected that the appearance of the grain is normal, the multi-channel probe group is controlled to drop the needle and then power on each channel probe group for testing in turn, and after the multi-channel probe groups have passed the test, the multi-channel probe group is used to test the LED chip to be tested.

2. The Mini LED chip detection method based on a multi-channel probe group according to claim 1, characterized in that: The steps of scanning the LED chip to be detected and identifying the scanned LED chip to be detected by using image recognition technology to determine the position information of the LED chip to be detected include: Traversing all LED chips to be tested on the wafer, and obtaining the initial position information of each LED chip to be tested relative to a preset target position; According to the layout and quantity of all LED chips to be detected on the wafer, a corresponding scanning path is planned, and then the LED chips to be detected are scanned according to the scanning path to determine the position information of each LED chip to be detected.

3. The Mini LED chip detection method based on a multi-channel probe group according to claim 1, characterized in that: Before the step of detecting that the appearance of the grain is normal, the step further includes: Acquire a grain image of the grain, and preprocess the grain image, wherein the preprocessing includes denoising and contrast enhancement; Extracting key feature information of the grain from the preprocessed grain image, and comparing the key feature information with a preset defect template; When the key feature information fails to pass the comparison with the preset defect template, it is determined that the appearance of the grain is normal.

4. The Mini LED chip detection method based on a multi-channel probe group according to claim 1, characterized in that: The steps of controlling the multi-channel probe group to drop the needle and then powering each channel probe group for testing in turn, and using the multi-channel probe group to test the LED chip to be tested after all the multi-channel probe groups have passed the test include: After each channel probe group is powered on for testing, a test image of the needle frame position after the power-on test is collected; Identify the test image to determine whether the corresponding die is lit; If yes, it is determined that the channel of the current channel probe group is normal, and the power supply test of the next channel probe group is performed; If not, a prompt message is issued to indicate that a channel abnormality exists in the current channel probe group.

5. The Mini LED chip detection method based on a multi-channel probe group according to claim 4, characterized in that: The step of collecting a test image of the needle frame position after the power transmission test comprises: The light is captured by a CCD sensor and converted into an electrical signal to generate a corresponding digital image to obtain a test image.

6. The Mini LED chip detection method based on a multi-channel probe set according to claim 5, characterized in that: The step of identifying the test image and determining whether the corresponding die is lit includes: Performing preliminary processing on the test image, wherein the preliminary processing includes noise reduction, filtering, graying, and binarization; Extracting key features from the preliminarily processed test image, wherein the key features include shape, color, and texture; The key features are identified using a preset identification algorithm to determine whether the corresponding die is lit.

7. The Mini LED chip detection method based on a multi-channel probe group according to claim 1, characterized in that: Before the step of traversing all the LED chips to be detected on the wafer and obtaining the initial position information of each LED chip to be detected relative to the preset target position, the method further includes: The internal and external parameters of the image acquisition device that traverses all LED chips to be detected on the wafer are calibrated, and the lens distortion is corrected.

8. A Mini LED chip detection device based on a multi-channel probe group, characterized in that: The device comprises: The scanning module is used to scan the LED chip to be detected, and use the image recognition technology to identify the scanned LED chip to be detected to determine the position information of the LED chip to be detected; A moving module, used for controlling the multi-channel probe group to move to the LED chip to be detected according to the position information, and controlling the multi-channel probe group to be placed above the grain of the LED chip to be detected in a preset area based on the needle frame; The detection module is used to control the multi-channel probe group to power on each channel probe group in turn for testing after the multi-channel probe group is detected to have a normal appearance, and to use the multi-channel probe group to detect the LED chip to be detected after all the multi-channel probe groups have passed the test.

9. A readable storage medium having a computer program stored thereon, characterized in that: When the program is executed by a processor, the steps of the method according to any one of claims 1 to 7 are implemented.

10. An electronic device, characterized in that: The method comprises a memory, a processor and a computer program stored in the memory and executable on the processor, wherein the processor implements the steps of the method according to any one of claims 1 to 7 when executing the program.

Images