Display module and assembling method thereof

Abstract

The embodiment of the invention discloses a display module and an assembling method thereof, the display module comprises a backlight module, a display panel and a connecting part, and the backlight module is used for providing backlight; the display panel is located on the light emitting side of the backlight module, and a heating layer is arranged in the display panel; the connecting part is located between the display panel and the backlight module, one end of the connecting part is connected with the heating layer, and the other end of the connecting part is connected with the first flexible circuit board. According to the scheme, the heating layer is connected by adopting the connecting part instead of an original mode of binding an ITO-FPC on the display panel, so that the binding process between the ITO-FPC and the display panel can be omitted, the binding difficulty in the module operation process is reduced, and the assembling difficulty of the display module is reduced.

Description

Technical Field

[0001] The embodiments of the present invention relate to the field of display technology, and in particular to a display module and an assembly method thereof. Background Art

[0002] Liquid Crystal Display (LCD) panels have become the leading product in the current flat panel display industry due to their small size and low power consumption.

[0003] In order to ensure that the LCD can display normally in a low temperature environment, a whole-surface ITO heating layer is usually added inside the LCD panel, and the heating layer is heated by inputting current into the surface through binding a flexible printed circuit (FPC).

[0004] Figure 1 The schematic diagram of the top view structure of a FOG provided in the prior art, wherein FOG (FPC on Glass) refers to liquid crystal glass and a flexible circuit board connected together. Figure 2 Reason Figure 1 The cross-sectional structure diagram of the liquid crystal display module assembled by FOG is shown in FIG. Figure 1 and Figure 2 As shown, in the prior art, the liquid crystal display module includes: a backlight module 40 and a display panel 10, the backlight module 40 is used to provide backlight; the display panel 10 is located on the light-emitting side of the backlight module 40, and a heating layer 101 located in the display area and a conductive part located in the non-display area are provided in the display panel 10, the conductive part is electrically connected to the heating layer 101, and is used to provide an input signal to the heating layer 101; the heating layer 101 is connected to the first flexible circuit board 20 (i.e., ITO-FPC) through the conductive part. When forming the liquid crystal display module LCM (LCD Module), due to the newly added ITO-FPC, the binding time and difficulty are increased, and the difficulty of assembling the liquid crystal display module is increased. Summary of the invention

[0005] The embodiment of the present invention provides a display module and an assembly method thereof, so as to reduce the difficulty of binding in the module operation process and reduce the difficulty of LCM assembly.

[0006] According to one aspect of the present invention, there is provided a display module, comprising:

[0007] A backlight module, wherein the backlight module is used to provide backlight;

[0008] A display panel, the display panel is located at the light-emitting side of the backlight module, and a heating layer is arranged inside the display panel;

[0009] A connecting portion, wherein the connecting portion is located between the display panel and the backlight module, one end of the connecting portion is connected to the heating layer, and the other end is connected to the first flexible circuit board.

[0010] Optionally, the backlight module includes a back plate, the back plate includes a bottom plate and a side plate, the bottom plate extends along a first direction, the side plate is arranged at an edge of the bottom plate along a second direction, and the first direction and the second direction are perpendicular to each other;

[0011] The bottom plate is provided with a first opening penetrating the bottom plate, the connecting portion is provided in the first opening, and on the back side of the bottom plate, the first opening at least partially exposes the connecting portion;

[0012] Wherein, one end of the connecting portion used for connecting the heating layer is higher than a preset height of the side plate.

[0013] Optionally, the backlight module further includes a middle frame, the middle frame includes a main body and a branch portion, the main body and the branch portion are an integrated structure, the main body extends along the second direction and is arranged around the side plate, the branch portion extends along the first direction, and the branch portion covers the side plate;

[0014] The branch portion includes a second opening, and the connecting portion passes through the second opening and is connected to the heating layer.

[0015] Optionally, the number of the first openings and the number of the second openings are both two, and the first openings and the second openings are arranged in a one-to-one correspondence, wherein one of the first openings is used as a positive electrode interface, and the other first opening is used as a negative electrode interface;

[0016] The first flexible circuit board is arranged on the back side of the bottom plate, and the first flexible circuit board is respectively connected to the connection parts in the two first openings.

[0017] Optionally, the connecting portion includes a buffer layer and a conductive layer, and the buffer layer wraps the conductive layer;

[0018] Wherein, the minimum distance between the conductive layers in the connecting parts in the two first openings on the back side of the bottom plate is greater than or equal to 2 mm; wherein, the buffer layer is made of insulating material.

[0019] Optionally, the backlight module includes a back plate and a middle frame, the back plate includes a bottom plate and a side plate, the bottom plate extends along a first direction, the side plate is arranged at an edge of the bottom plate along a second direction, and the first direction and the second direction are perpendicular to each other; the middle frame includes a main body and a branch portion, the main body and the branch portion are an integral structure, the main body extends along the second direction and is arranged around the side plate, the branch portion extends along the first direction, and the branch portion covers the side plate;

[0020] The connecting portion is located on a side of the branch portion away from the bottom plate, one end of the connecting portion is connected to the heating layer through a conductive portion, and the other end of the connecting portion is connected to the first flexible circuit board.

[0021] Optionally, the connecting portion includes a buffer material, the buffer material is provided with a third opening and a fourth opening that penetrate through the buffer material, and the third opening and the fourth opening are respectively filled with a conductive layer;

[0022] Among them, one of the third opening and the fourth opening is used as a positive electrode interface, and the other is used as a negative electrode interface.

[0023] Optionally, the display module also includes a second flexible circuit board, which is used to connect at least the array substrate in the display panel; the first flexible circuit board and the second flexible circuit board are located on the same side of the display panel, and the second flexible circuit board is connected to the surface of the display panel away from the first flexible circuit board.

[0024] According to another aspect of the present invention, there is provided a method for assembling a display module, comprising:

[0025] Providing a display panel, wherein a heating layer is disposed in the display panel;

[0026] Binding the display panel to the second flexible circuit board by means of conductive adhesive;

[0027] A backlight module is provided, wherein a connecting portion is arranged inside the backlight module, and the backlight module comprises a bottom plate, and the bottom plate has a first opening extending therethrough;

[0028] The display panel is bonded to the backlight module so that one end of the connecting portion is connected to the heating layer through the conductive portion, and the other end is connected to the first flexible circuit board located on the back of the bottom plate through the first opening.

[0029] According to another aspect of the present invention, there is provided a method for assembling a display module, comprising:

[0030] Providing a display panel, wherein a heating layer is disposed in the display panel;

[0031] Binding the display panel to the second flexible circuit board by means of conductive adhesive;

[0032] A backlight module is provided, wherein the backlight module comprises a back plate and a middle frame, wherein the back plate comprises a bottom plate and a side plate, wherein the bottom plate extends along a first direction, wherein the side plate is arranged at an edge of the bottom plate along a second direction, wherein the first direction and the second direction are perpendicular to each other; wherein the middle frame comprises a main body and a branch portion, wherein the main body and the branch portion are an integral structure, wherein the main body extends along the second direction and is arranged around the side plate, wherein the branch portion extends along the first direction, and wherein the branch portion covers the side plate;

[0033] Providing a first flexible circuit board, wherein the first flexible circuit board is fixed to the outer surface of the middle frame and the back surface of the bottom plate;

[0034] Providing a connecting portion, wherein the connecting portion is disposed on the branch portion of the middle frame, and one end of the connecting portion is connected to the first flexible circuit board located on the branch portion;

[0035] The backlight module is bonded to the display panel so that the other end of the connecting portion is connected to the heating layer through the conductive portion.

[0036] The technical solution provided by the embodiment of the present invention sets a connecting part between the backlight module and the display panel. The heating layer is connected by adopting the connecting part instead of the original method of binding ITO-FPC on the display panel, thereby omitting the binding process between the ITO-FPC and the display panel, which is beneficial to reducing the binding difficulty in the module operation process and reducing the difficulty of assembling the liquid crystal display module LCM.

[0037] It should be understood that the contents described in this section are not intended to identify the key or important features of the embodiments of the present invention, nor are they intended to limit the scope of the present invention. Other features of the present invention will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0039] Figure 1 A schematic diagram of a top view structure of a FOG provided in the prior art;

[0040] Figure 2 Reason Figure 1 The cross-sectional structure diagram of the liquid crystal display module assembled by FOG is shown;

[0041] Figure 3 A schematic cross-sectional structure diagram of a display module provided by an embodiment of the present invention;

[0042] Figure 4 A schematic diagram of the internal structure of a backlight module provided by an embodiment of the present invention;

[0043] Figure 5 A schematic diagram of a front plan view of a backlight module provided by an embodiment of the present invention;

[0044] Figure 6 A schematic cross-sectional structure diagram of another display module provided by an embodiment of the present invention;

[0045] Figure 7 A schematic diagram of a backside top view of a backlight module provided by an embodiment of the present invention;

[0046] Figure 8 A schematic diagram of a backside top view of another backlight module provided by an embodiment of the present invention;

[0047] Fig. 9 A schematic structural diagram of a connecting portion provided by an embodiment of the present invention;

[0048] Fig.10 A schematic cross-sectional structure diagram of another display module provided by an embodiment of the present invention;

[0049] Fig.11 A schematic diagram of the front plan view of another backlight module provided by an embodiment of the present invention;

[0050] Fig.12 A schematic structural diagram of another connecting portion provided by an embodiment of the present invention;

[0051] Fig.13 for Fig.12 A schematic diagram of the cross-sectional structure of the connecting portion shown;

[0052] Fig.14 A schematic diagram of the structure of a FOG provided by an embodiment of the present invention;

[0053] Fig.15 A schematic cross-sectional structure diagram of another display module provided by an embodiment of the present invention;

[0054] Fig.16 A flow chart of a method for assembling a display module provided by an embodiment of the present invention;

[0055] Fig.17 A flowchart of another method for assembling a display module provided by an embodiment of the present invention;

[0056] Among them, 10-display panel; 101-heating layer; 20-first flexible circuit board; 30-second flexible circuit board; 40-backlight module; 4011-bottom plate; 4012-side plate; 402-middle frame; 4021-main body; 4022-branch part; 403-reflective sheet; 404-light guide plate; 405-optical film; 50-connecting part; 501-buffer layer; 502-conductive layer; 51-first conductive layer; 52-second conductive layer; 53-buffer material; 60-conductive part; 70-double-sided tape; 80; frame glue; 90-light source. DETAILED DESCRIPTION

[0057] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0058] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0059] Figure 3 FIG. 1 is a schematic cross-sectional structure diagram of a display module provided in an embodiment of the present invention. The display module may be a liquid crystal display module LCM. Figure 3 , the display module provided in this embodiment includes:

[0060] A backlight module 40, the backlight module 40 is used to provide backlight;

[0061] A display panel 10, the display panel 10 is located at the light emitting side of the backlight module 40, and a heating layer 101 is disposed in the display panel 10;

[0062] The connecting portion 50 is located between the display panel 10 and the backlight module 40 . One end of the connecting portion 50 is connected to the heating layer 101 , and the other end is connected to the first flexible circuit board 20 .

[0063] Specifically, the display panel 10 may be a liquid crystal display panel, and a heating layer 101 located in the display area and a conductive portion 60 located in the non-display area are provided inside the display panel 10; the conductive portion 60 is electrically connected to the heating layer 101, and is used to provide an input signal to the heating layer 101. For example, the heating layer 101 and the conductive portion 60 may be provided on the lower surface of the array substrate in the display panel 10. The heating layer 101 may be formed of an ITO (Indium Tin Oxides) semiconductor transparent conductive film. The backlight module 40 is used to provide backlight for the display panel 10, and the backlight module 40 here may be an edge-entry backlight module or a direct-type backlight module.

[0064] In this embodiment, the connection portion 50 is disposed between the display panel 10 and the backlight module 40, and is used to connect the heating layer 101 in the display panel 10. For example, one end of the connection portion 50 extends to the display panel 10, and is electrically connected to the heating layer 101 through the conductive portion 60. Since the heating layer 101 is not directly connected to the first flexible circuit board 20, it is not necessary to bind the first flexible circuit board 20 to the display panel 10, thereby reducing the binding process of the flexible circuit board.

[0065] The technical solution provided by the embodiment of the present invention is to set a connecting part 50 between the backlight module 40 and the display panel 10. By adopting the connecting part 50 instead of the original method of binding ITO-FPC on the display panel 100 to connect the heating layer 101, the binding process between the ITO-FPC and the display panel 10 can be omitted, which is beneficial to reducing the binding difficulty in the module operation process and reducing the difficulty of LCM assembly.

[0066] Continue to refer Figure 1 and Figure 2 The liquid crystal display module LCM also includes a second flexible circuit board 30 (i.e., LCD-FPC, a flexible circuit board for connecting LCD). Since the first flexible circuit board 20 (i.e., ITO-FPC) and the second flexible circuit board 30 (i.e., ITO-FPC) exist at the same time, in order to avoid unevenness of the display panel 10 (liquid crystal glass) in the subsequent process, the first flexible circuit board 20 (i.e., ITO-FPC) cannot be bound to the second flexible circuit board 30 (i.e., LCD-FPC) on the same side. Therefore, when the first flexible circuit board 20 (i.e., ITO-FPC) is bent to the back of the backlight module 40, the frame of the liquid crystal display module LCM becomes larger (the bending outward expansion distance of the ITO-FPC is about 1 mm), which is not conducive to achieving a narrow frame.

[0067] In this embodiment, since the original ITO-FPC is eliminated and the heating layer 101 is connected by the built-in connection part 50 of the backlight module 40, the frame of the LCM can be reduced, and the three sides of the LCM (except the side bound to the second flexible circuit board 30) can be narrowed.

[0068] Continue to refer Figure 3 The backlight module 40 includes a back plate, which includes a bottom plate 4011 and a side plate 4012. The bottom plate 4011 extends along a first direction X, and the side plate 4012 is arranged at the edge of the bottom plate 4011 along a second direction Z. The first direction X and the second direction Z are perpendicular to each other. A first opening is arranged on the bottom plate 4011, and the other end of the connecting portion 50 is arranged in the first opening. On the back side of the bottom plate 4011, the first opening at least exposes a portion of the connecting portion 50.

[0069] The first direction X may be a horizontal direction, and the second direction Z may be a thickness direction of the display module. The connection portion 50 is built into the first opening so that the connection portion 50 can be led out to the back of the bottom plate 4011 to facilitate the connection between the connection portion 50 and the first flexible circuit board 20 .

[0070] Optionally, one end of the connecting portion 50 used to connect to the heating layer 101 is higher than a preset height of the side plate 4012, so that the connecting portion 50 can be on the same horizontal plane as the heating layer 101, thereby facilitating the connection between the two.

[0071] In this embodiment, the backlight module 40 further includes a middle frame 402, a second opening is provided on one side of the middle frame 402 close to the display panel 10, and one end of the connecting portion 50 passes through the second opening and is connected to the heating layer 101. In other embodiments, the middle frame 402 may not be provided, which is not limited here.

[0072] Figure 4 A schematic diagram of the internal structure of a backlight module provided by an embodiment of the present invention, Figure 5 A schematic diagram of a front plan view of a backlight module provided by an embodiment of the present invention. Figure 6 A schematic cross-sectional structure diagram of another display module provided by an embodiment of the present invention, wherein: Figure 6 The cross-sectional structure of the backlight module 40 shown in FIG. Figure 5 The backlight module 40 shown is obtained along the cutting line BB'. Figure 4-Figure 6 The middle frame 402 of the backlight module 40 includes a main body 4021 and a branch portion 4022. The main body 4021 and the branch portion 4022 are an integrated structure. The main body 4021 extends along the second direction Z and is arranged around the side plate 4012. The branch portion 4022 extends along the first direction X, and the branch portion 4022 covers the side plate 4012; the branch portion 4022 includes a second opening, and one end of the connecting portion 50 passes through the second opening and is connected to the heating layer 101.

[0073] Specifically, the middle frame 402 is an iron piece, which is used to provide a stable frame structure for the backlight module 40, so as to better protect the components inside the backlight module 40. The middle frame 402 includes a main body 4021 and a branch part 4022, and the branch part 4022 covers the upper edge of the side plate 4012.

[0074] In this embodiment, the branch portion 4022 of the middle frame 402 has a second opening, which is arranged corresponding to the first opening, and the connecting portion 50 passes through the second opening and the first opening in sequence, so that the connecting portion 50 is built into the backlight module 40 to reduce the frame of the LCM. Due to the limiting effect of the middle frame 402 and the bottom plate 4011, the connecting portion 50 can be better fixed inside the backlight module 40.

[0075] Continue to refer Figure 5 and Figure 6 The backlight module 40 further includes a reflective sheet 403, a light guide plate 404 and an optical film 405. The reflective sheet 403 is located on one side of the bottom plate 4011, the light guide plate 404 is located on the side of the reflective sheet 403 away from the bottom plate 4011, and the optical film 405 is located on the side of the light guide plate 404 away from the bottom plate 4011. The reflective sheet 403 is used to reflect the light emitted from the light source (not shown in the figure) that is not effectively used back to the light guide plate 404, and the light guide plate 404 is used to convert the light emitted by the point light source into a surface light source. The connecting portion 50 can also limit the light guide plate 404.

[0076] Figure 7 A schematic diagram of a backside top view of a backlight module provided by an embodiment of the present invention is shown in FIG. Figure 8 A schematic diagram of a backside top view of another backlight module provided in an embodiment of the present invention, combined with Figure 4-Figure 8 In this embodiment, the number of the first opening and the second opening are both two, and the first opening and the second opening are arranged one by one, wherein one of the first openings is used as a positive electrode interface, and the other first opening is used as a negative electrode interface. For example, the first connection portion 501 in the first first opening is a positive electrode connection terminal, and the second connection portion 502 in the second first opening is a negative electrode connection terminal. The first connection portion 501 passes through the first second opening to connect to the positive electrode of the heat generating layer 101, and the second connection portion 502 passes through the second second opening to connect to the negative electrode of the heat generating layer 101.

[0077] The first flexible circuit board 20 is disposed on the back of the bottom plate 4011, and the first flexible circuit board 20 is respectively connected to the connection parts 50 in the two first openings to provide current to the heating layer 101 through the connection parts 50. The first flexible circuit board 20 can be connected to the bottom plate 4011 by binding or welding. In this embodiment, since the first flexible circuit board 30 does not need to be bound to the display panel 10, the binding process between the ITO-FPC (i.e., the first flexible circuit board 30) and the display panel 10 can be omitted, which is conducive to reducing the binding difficulty in the module operation process and reducing the difficulty of LCM assembly.

[0078] Optionally, in this embodiment, the opening area of ​​the first opening is smaller than the opening area of ​​the second opening. The advantage of such a setting is that, on the one hand, since the connection portion 50 in the first opening only serves to connect the first flexible circuit board 30, while ensuring that it has a good contact area, the smaller first opening can reduce the degree of damage to the bottom plate 4011, which is beneficial to ensuring the strength of the bottom plate 4011; on the other hand, the larger second opening can make the connection portion 50 above the bottom plate 4011 have a larger cross-sectional area, thereby reducing the impedance of the connection portion 50, which is beneficial to reducing the heat generated by the connection portion 50 and preventing other components from being burned.

[0079] Fig. 9 A schematic diagram of a connection portion provided by an embodiment of the present invention, referring to Fig. 9 On the basis of the above embodiments, optionally, the connection part 50 includes a buffer layer 510 and a conductive layer 520, the conductive layer 520 is located inside the buffer layer 510, and the buffer layer 510 wraps the conductive layer 520. The buffer layer 510 is made of an insulating material, and the conductive layer 530 is formed of a conductive material, such as a metal. In the preparation process of the connection part 50, the buffer layer 510 can be first made into a hollow structure, and then the conductive layer 520 can be made inside the buffer layer 510 by electroplating or chemical deposition.

[0080] Optionally, combined Figure 7 and Fig. 9 , the minimum distance between the conductive layers 510 in the connection parts 50 in the two first openings on the back of the bottom plate 4011 is greater than or equal to 2 mm. That is, the minimum distance L between the conductive layer 510 in the first connection part 501 in the first first opening and the conductive layer 510 in the second connection part 502 in the second first opening is greater than or equal to 2 mm, so that the conductive layers 510 in the two first openings meet the assembly tolerance.

[0081] In another optional implementation provided by the embodiment of the present invention, the connecting portion 50 may also be disposed outside the backlight module 40 . Fig.10 A schematic cross-sectional structure diagram of another display module provided by an embodiment of the present invention, Fig.11 A schematic diagram of a front plan view of another backlight module provided by an embodiment of the present invention, wherein: Fig.10 The cross-sectional structure of the backlight module 40 is Fig.11 The cross-sectional structure of the backlight module 40 shown in FIG. 4 is obtained along the cutting line CC′. Fig.10 and Fig.11 In this embodiment, the backlight module 40 includes a back plate and a middle frame 402, the back plate includes a bottom plate 4011 and a side plate 4012, the bottom plate 4011 extends along a first direction X, the side plate 4012 is arranged at the edge of the bottom plate 4011 along a second direction Z, and the first direction X and the second direction Z are perpendicular to each other; the middle frame 402 includes a main body 4021 and a branch portion 4022, the main body 4021 and the branch portion 4022 are an integral structure, the main body 4021 extends along the second direction Z and is arranged around the side plate 4012, the branch portion 4022 extends along the first direction X, and the branch portion 4021 covers The side panel 4012; the connecting portion 50 is located on the side of the branch portion 4022 away from the bottom panel 4011, one end of the connecting portion 50 is connected to the heating layer 101 through the conductive portion 60, and the other end of the connecting portion 50 is connected to the first flexible circuit board 20; wherein the first flexible circuit board 20 includes a first sub-segment, a second sub-segment and a third sub-segment, the first sub-segment is located on the branch portion 4022 and connected to the connecting portion 50, the second sub-segment extends along the second direction Z and is bonded to the surface of the main body 4021 away from the side panel 4012, and the third sub-segment extends along the first direction X and is bonded to the back surface of the bottom panel 4011.

[0082] Specifically, the first flexible circuit board 20 is fixed on the middle frame 402 and the bottom plate 4011 of the backlight module 40. For example, the first flexible circuit board 20 and the backlight module 40 can be bonded by double-sided adhesive 70. The gold finger end of the first flexible circuit board 20 is electrically connected to the connecting part 50, and the connecting part 50 is connected to the heating layer 101 through the conductive part 60.

[0083] In this embodiment, the first flexible circuit board 20 is arranged outside the backlight module 40, bent to the back side of the bottom plate 4011, and at least the second sub-segment and the third sub-segment of the three sub-segments are fixed to the backlight module 40 by gluing. The connecting portion 50 is arranged above the middle frame 402, and is electrically connected to the first flexible circuit board 20. While omitting the binding process of the first flexible circuit board 20 and the display panel 10, the backlight module 40 will not be damaged, which is conducive to ensuring the overall strength of the backlight module 40.

[0084] Fig.12 A schematic diagram of the structure of another connecting portion provided by an embodiment of the present invention, Fig.13 for Fig.12 The cross-sectional structure diagram of the connecting portion shown is specifically Fig.12The cross-sectional structure of the connecting portion 50 along the cutting line DD' is shown in FIG. Figure 11-13 The connecting portion 50 includes a buffer material 53, and the buffer material 53 is provided with a third opening and a fourth opening that penetrate therethrough. The third opening and the fourth opening are respectively filled with a conductive layer, for example, the conductive layer in the third opening is the first conductive layer 51, and the conductive layer in the fourth opening is the second conductive layer 52. One of the third opening and the fourth opening is used as a positive electrode interface, and the other is used as a negative electrode interface.

[0085] In this embodiment, in the preparation process of the connecting portion 50, a third opening and a fourth opening may be first made on the buffer material 53, and then a first conductive layer 51 may be formed in the third opening by electroplating or chemical deposition, and a second conductive layer 52 may be formed in the fourth opening.

[0086] Fig.14 A schematic diagram of a FOG structure provided by an embodiment of the present invention, combined with Figure 11-Figure 14 , the display panel 10 is provided with a conductive portion 60, during the LCM assembly process, Fig.14 The FOG shown is a colloid with Fig.11 The backlight module 40 shown is bonded so that the first conductive layer 51 and the second conductive layer 52 are connected to the corresponding conductive parts 60 respectively.

[0087] Optionally, the minimum distance between the conductive layer in the third opening and the conductive layer in the fourth opening is greater than or equal to 2 mm. That is, the minimum distance M between the first conductive layer 51 and the second conductive layer 52 is ≥ 2 mm, so that the first conductive layer 51 and the second conductive layer 52 meet the assembly tolerance.

[0088] Optionally, the FOG and the backlight module 40 may be fixedly connected by a pressure-sensitive conductive adhesive.

[0089] Fig.15 A schematic cross-sectional structure diagram of another display module provided by an embodiment of the present invention, combined with Fig.14 and Fig.15 The display module also includes a second flexible circuit board 30, which is used to connect at least the array substrate in the display panel 10; the first flexible circuit board 20 and the second flexible circuit board 30 are located on the same side of the display panel 10, and the second flexible circuit board 30 is connected to the surface of the display panel 10 away from the first flexible circuit board 20.

[0090] Specifically, since the first flexible circuit board 20 is connected to the heating layer 101 through the connecting portion 50, the first flexible circuit board 20 does not need to be bound to the display panel 10, and the first flexible circuit board 20 is fixed on the backlight module 40, so that the first flexible circuit board 20 and the second flexible circuit board 30 can be located on the same side of the display panel 10, such as both are located on the source in side (i.e., the source signal input side) of the display panel 10. Since the first flexible circuit board 20 is no longer provided on the non-source in side, the present solution can also achieve narrow borders on the other three sides of the LCM.

[0091] Optionally, the backlight module 40 further includes a sealant 80 , which can be used to adhere the backlight source 90 and provide a limit for the light guide plate 404 .

[0092] It should be noted that when the connection portion 50 is disposed inside the backlight module 40 , the buffer layer in the connection portion 50 can be used to replace the frame glue 80 to avoid increasing the internal occupied space of the backlight module 40 .

[0093] Optionally, an embodiment of the present invention further provides a method for assembling a display module. Fig.16 A flowchart of a display module assembly method provided by an embodiment of the present invention, the assembly method can be applied to Figure 4 The display module shown, combined with Figure 4 and Fig.16 The display module assembly method provided in this embodiment includes:

[0094] First, a display panel 10 is provided, where the display panel 10 may be a strip-shaped glass bare chip, and a heating layer 101 and a conductive part 60 are arranged inside the display panel 10. The display panel 10 and the second flexible circuit board (i.e., LCD-FPC) are bonded by conductive adhesive in a high temperature and high pressure manner, wherein the conductive adhesive may be anisotropic conductive film (ACF), and after bonding, a FOG containing a heating layer 101 is formed, and the heating layer 101 may be an ITO layer.

[0095] Afterwards, a backlight module 40 is provided, which includes an iron piece, an optical component and a connecting portion 50, wherein the connecting portion 50 is disposed inside the backlight module 40 and can be a conductive buffer. The backlight module 40 includes a bottom plate 4011 having a first opening therethrough.

[0096] Finally, the backlight module 40 is bonded to the FOG so that one end of the connecting portion 50 is connected to the heating layer 101 through the conductive portion 60, and the other end is connected to the first flexible circuit board 20 located on the back of the base plate 4011 through the first opening, thereby forming a liquid crystal display module product.

[0097] Optionally, Fig.17 A flowchart of another display module assembly method provided by an embodiment of the present invention, the assembly method can be applied to Fig.15 The display module shown, combined with Fig.15 and Fig.17 The display module assembly method provided in this embodiment includes:

[0098] First, a display panel 10 is provided, where the display panel 10 may be a strip-shaped glass bare chip, and a heating layer 101 and a conductive part 60 are arranged inside the display panel 10. The display panel 10 and the second flexible circuit board (i.e., LCD-FPC) are bonded by conductive adhesive in a high temperature and high pressure manner, wherein the conductive adhesive may be anisotropic conductive film (ACF), and after bonding, a FOG containing a heating layer 101 is formed, and the heating layer 101 may be an ITO layer.

[0099] Afterwards, a backlight module 40 is provided, which has iron parts, optical components, frame glue and connecting parts 50, wherein the iron parts may include a back plate and a middle frame 402, the back plate includes a bottom plate 4011 and a side plate 4012, the bottom plate 4011 extends along a first direction X, and the side plate 4012 is arranged at the edge of the bottom plate 4011 along a second direction Z, and the first direction X and the second direction Z are perpendicular to each other; the middle frame 402 includes a main body 4021 and a branch part 4022, the main body 4021 and the branch part 4022 are an integral structure, the main body 4021 extends along the second direction Z and is arranged around the side plate 4012, the branch part 4022 extends along the first direction X, and the branch part 4022 covers the side plate 4012.

[0100] A first flexible circuit board 20 is provided and fixed to the outer surface of the middle frame 402 and the back surface of the bottom plate 4011 .

[0101] A connecting portion 50 is provided. The connecting portion 50 is disposed on the branch portion 4022 of the middle frame 402 . One end of the connecting portion 50 is connected to the first flexible circuit board 20 located on the branch portion 4022 .

[0102] The backlight module 40 is bonded to the display panel 10 , so that the other end of the connecting portion 50 is connected to the heating layer 101 through the conductive portion 60 .

[0103] The display module assembly method provided in the embodiment of the present invention connects the heating layer 101 by using the connecting part 50 instead of the original ITO-FPC, thereby omitting the binding process between the ITO-FPC and the display panel 10, which is beneficial to reducing the binding difficulty in the module operation process and reducing the difficulty of LCM assembly.

[0104] It should be understood that the various forms of processes shown above can be used to reorder, add or delete steps. For example, the steps described in the present invention can be executed in parallel, sequentially or in different orders, as long as the desired results of the technical solution of the present invention can be achieved, and this document does not limit this.

[0105] The above specific implementations do not constitute a limitation on the protection scope of the present invention. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A display module, characterized in that: include: A backlight module, wherein the backlight module is used to provide backlight; A display panel, the display panel is located at the light-emitting side of the backlight module, and a heating layer is arranged inside the display panel; A connecting portion, wherein the connecting portion is located between the display panel and the backlight module, one end of the connecting portion is connected to the heating layer, and the other end is connected to the first flexible circuit board.

2. The display module according to claim 1, characterized in that: The backlight module comprises a back plate, the back plate comprises a bottom plate and a side plate, the bottom plate extends along a first direction, the side plate is arranged at an edge of the bottom plate along a second direction, and the first direction and the second direction are perpendicular to each other; The bottom plate is provided with a first opening penetrating the bottom plate, the connecting portion is provided in the first opening, and on the back side of the bottom plate, the first opening at least partially exposes the connecting portion; Wherein, one end of the connecting portion used for connecting the heating layer is higher than a preset height of the side plate.

3. The display module according to claim 2, characterized in that: The backlight module further includes a middle frame, the middle frame includes a main body and a branch portion, the main body and the branch portion are an integrated structure, the main body extends along the second direction and is arranged around the side plate, the branch portion extends along the first direction, and the branch portion covers the side plate; The branch portion includes a second opening, and the connecting portion passes through the second opening and is connected to the heating layer.

4. The display module according to claim 3, characterized in that: The number of the first openings and the number of the second openings are both two, and the first openings and the second openings are arranged in a one-to-one correspondence, wherein one of the first openings is used as a positive electrode interface, and the other first opening is used as a negative electrode interface; The first flexible circuit board is arranged on the back side of the bottom plate, and the first flexible circuit board is respectively connected to the connection parts in the two first openings.

5. The display module according to any one of claims 2 to 4, characterized in that: The connecting portion includes a buffer layer and a conductive layer, and the buffer layer wraps the conductive layer; Wherein, the minimum distance between the conductive layers in the connecting portion in the two first openings on the back side of the bottom plate is greater than or equal to 2 mm; Wherein, the buffer layer is made of insulating material.

6. The display module according to claim 1, characterized in that: The backlight module comprises a back plate and a middle frame, the back plate comprises a bottom plate and a side plate, the bottom plate extends along a first direction, the side plate is arranged at the edge of the bottom plate along a second direction, and the first direction and the second direction are perpendicular to each other; the middle frame comprises a main body and a branch portion, the main body and the branch portion are an integral structure, the main body extends along the second direction and is arranged around the side plate, the branch portion extends along the first direction, and the branch portion covers the side plate; The connecting portion is located on a side of the branch portion away from the bottom plate, one end of the connecting portion is connected to the heating layer through a conductive portion, and the other end of the connecting portion is connected to the first flexible circuit board.

7. The display module according to claim 6, characterized in that: The connecting portion includes a buffer material, the buffer material is provided with a third opening and a fourth opening which are connected therethrough, and the third opening and the fourth opening are respectively filled with a conductive layer; Among them, one of the third opening and the fourth opening is used as a positive electrode interface, and the other is used as a negative electrode interface.

8. The display module according to claim 6, characterized in that: The display module also includes a second flexible circuit board, which is used to connect at least the array substrate in the display panel; the first flexible circuit board and the second flexible circuit board are located on the same side of the display panel, and the second flexible circuit board is connected to the surface of the display panel away from the first flexible circuit board.

9. A method for assembling a display module, characterized in that: include: Providing a display panel, wherein a heating layer is disposed in the display panel; Binding the display panel to the second flexible circuit board by means of conductive adhesive; A backlight module is provided, wherein a connecting portion is arranged inside the backlight module, and the backlight module comprises a bottom plate, and the bottom plate has a first opening extending therethrough; The display panel is bonded to the backlight module so that one end of the connecting portion is connected to the heating layer through the conductive portion, and the other end is connected to the first flexible circuit board located on the back of the bottom plate through the first opening.

10. A method for assembling a display module, characterized in that: include: Providing a display panel, wherein a heating layer is disposed in the display panel; Binding the display panel to the second flexible circuit board by means of conductive adhesive; A backlight module is provided, wherein the backlight module comprises a back plate and a middle frame, wherein the back plate comprises a bottom plate and a side plate, wherein the bottom plate extends along a first direction, wherein the side plate is arranged at an edge of the bottom plate along a second direction, wherein the first direction and the second direction are perpendicular to each other; wherein the middle frame comprises a main body and a branch portion, wherein the main body and the branch portion are an integral structure, wherein the main body extends along the second direction and is arranged around the side plate, wherein the branch portion extends along the first direction, and wherein the branch portion covers the side plate; Providing a first flexible circuit board, wherein the first flexible circuit board is fixed to the outer surface of the middle frame and the back surface of the bottom plate; Providing a connecting portion, wherein the connecting portion is disposed on the branch portion of the middle frame, and one end of the connecting portion is connected to the first flexible circuit board located on the branch portion; The backlight module is bonded to the display panel so that the other end of the connecting portion is connected to the heating layer through the conductive portion.

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