Display module and assembly method thereof

Abstract

Embodiments of the present application disclose a display module and an assembling method thereof. The display module comprises a backlight module, a display panel and a connecting part. The backlight module is used for providing backlight. The display panel is located at the light-out side of the backlight module, and a heating layer is arranged in the display panel. The connecting part is located between the display panel and the backlight module. One end of the connecting part is connected with the heating layer, and the other end is connected with a first flexible circuit board. In the present application, the connecting part is used to connect the heating layer instead of the original ITO-FPC binding mode on the display panel, so that the binding process between the ITO-FPC and the display panel can be omitted, which is conducive to reducing the binding difficulty in the module operation process and reducing the assembly difficulty of the display module.

Description

Technical Field

[0001] This invention relates to the field of display technology, and more particularly to a display module and its assembly method. Background Technology

[0002] Liquid crystal display (LCD) panels have become the dominant product in flat panel displays due to their small size and low power consumption.

[0003] To ensure that LCDs can display normally in low-temperature environments, an entire ITO heating layer is usually added inside the LCD panel. The heating layer is heated by inputting current into the panel through a flexible printed circuit (FPC).

[0004] Figure 1 This is a top view schematic diagram of a FOG structure provided in the prior art, where FOG (FPC on Glass) refers to the assembly of liquid crystal glass and flexible circuit board together. Figure 2 For the reason Figure 1 The schematic diagram shown is a cross-sectional view of the liquid crystal display module assembled by FOG. Figure 1 and Figure 2 As shown, a liquid crystal display module in the prior art includes a backlight module 40 and a display panel 10. The backlight module 40 provides backlight. The display panel 10 is located on the light-emitting side of the backlight module 40. A heating layer 101 located in the display area and a conductive part located in the non-display area are disposed within the display panel 10. The conductive part is electrically connected to the heating layer 101 and is used to provide input signals to the heating layer 101. The heating layer 101 is connected to a first flexible circuit board 20 (i.e., ITO-FPC) through the conductive part. When forming a liquid crystal display module (LCM), the addition of the ITO-FPC increases the bonding time and difficulty, thus increasing the assembly difficulty of the liquid crystal display module. Summary of the Invention

[0005] This invention provides a display module and its assembly method to reduce the binding difficulty in the module operation process and reduce the assembly difficulty of LCM.

[0006] According to one aspect of the present invention, a display module is provided, comprising:

[0007] A backlight module, the backlight module being used to provide backlight;

[0008] The display panel is located on the light-emitting side of the backlight module, and a heating layer is provided inside the display panel;

[0009] A connecting part is located between the display panel and the backlight module. One end of the connecting part is connected to the heating layer, and the other end is connected to the first flexible circuit board.

[0010] Optionally, the backlight module includes a back plate, the back plate includes a bottom plate and a side plate, the bottom plate extends along a first direction, and the side plate is disposed at the edge of the bottom plate along a second direction, wherein the first direction and the second direction are perpendicular to each other;

[0011] The base plate has a first opening that penetrates the base plate, and the connecting part is disposed in the first opening. On the back side of the base plate, at least part of the connecting part is exposed by the first opening.

[0012] The connecting part is used to connect one end of the heating layer, which is higher than the preset height of the side plate.

[0013] Optionally, the backlight module further includes a middle frame, which includes a main body and a branch, the main body and the branch being an integral structure, the main body extending along the second direction and surrounding the side panel, the branch extending along the first direction and covering the side panel;

[0014] The branch includes a second opening, and the connecting portion passes through the second opening and connects to the heating layer.

[0015] Optionally, there are two of each of the first opening and the second opening, and the first opening and the second opening are configured in a one-to-one correspondence, with one of the first openings used as a positive terminal interface and the other first opening used as a negative terminal interface;

[0016] The first flexible circuit board is disposed on the back of the base plate, and the first flexible circuit board is connected to the connecting parts in the two first openings respectively.

[0017] Optionally, the connecting portion includes a buffer layer and a conductive layer, wherein the buffer layer wraps around the conductive layer;

[0018] Wherein, the minimum distance between the conductive layers in the connecting portions of the two first openings located on the back side of the base plate is greater than or equal to 2 mm; wherein, the buffer layer is made of insulating material.

[0019] Optionally, the backlight module includes a back panel and a middle frame. The back panel includes a bottom plate and a side plate. The bottom plate extends along a first direction, and the side plate is disposed at the edge of the bottom plate along a second direction. The first direction and the second direction are perpendicular to each other. The middle frame includes a main body and a branch portion. The main body and the branch portion are integral structures. The main body extends along the second direction and is disposed around the side plate. The branch portion extends along the first direction and covers the side plate.

[0020] The connecting portion is located on the side of the branch portion away from the base plate. One end of the connecting portion is connected to the heating layer through a conductive portion, and the other end of the connecting portion is connected to the first flexible circuit board.

[0021] Optionally, the connecting portion includes a buffer layer, the buffer layer having a through third opening and a fourth opening, and the third opening and the fourth opening being filled with a conductive layer respectively;

[0022] Of the three openings, one is used as a positive terminal interface and the other is used as a negative terminal interface.

[0023] Optionally, the display module further includes a second flexible circuit board, which is used to connect at least to the array substrate within the display panel; the first flexible circuit board and the second flexible circuit board are located on the same side of the display panel, and the second flexible circuit board is connected to the surface of the display panel away from the first flexible circuit board.

[0024] According to another aspect of the present invention, a method for assembling a display module is provided, comprising:

[0025] A display panel is provided, wherein a heating layer is disposed within the display panel;

[0026] The display panel is bonded to the second flexible circuit board using conductive adhesive;

[0027] A backlight module is provided, wherein a connecting part is provided inside the backlight module, and the backlight module includes a base plate having a through first opening;

[0028] The display panel is bonded to the backlight module so that one end of the connection part is connected to the heating layer through the conductive part, and the other end is connected to the first flexible circuit board located on the back of the base plate through the first opening.

[0029] According to another aspect of the present invention, a method for assembling a display module is provided, comprising:

[0030] A display panel is provided, wherein a heating layer is disposed within the display panel;

[0031] The display panel is bonded to the second flexible circuit board using conductive adhesive;

[0032] A backlight module is provided, the backlight module including a back panel and a middle frame, the back panel including a bottom plate and a side plate, the bottom plate extending along a first direction, the side plate being disposed at the edge of the bottom plate along a second direction, the first direction and the second direction being perpendicular to each other; the middle frame including a main body and a branch, the main body and the branch being an integral structure, the main body extending along the second direction and surrounding the side plate, the branch extending along the first direction, the branch covering the side plate;

[0033] A first flexible circuit board is provided, which is fixed to the outer surface of the middle frame and the back of the bottom plate;

[0034] A connecting portion is provided, the connecting portion being disposed on the branch portion of the middle frame, and one end of the connecting portion being connected to the first flexible circuit board located on the branch portion;

[0035] The backlight module is bonded to the display panel so that the other end of the connection portion is connected to the heating layer through a conductive portion.

[0036] The technical solution provided by the embodiments of the present invention provides a connecting part between the backlight module and the display panel. By using the connecting part instead of the original method of binding ITO-FPC on the display panel to connect the heating layer, the bonding process between ITO-FPC and the display panel can be omitted, which helps to reduce the bonding difficulty in the module operation process and reduce the assembly difficulty of the liquid crystal display module (LCM).

[0037] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of the present invention, nor is it intended to limit the scope of the invention. Other features of the invention will become readily apparent from the following description. Attached Figure Description

[0038] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0039] Figure 1 This is a top view schematic diagram of a FOG structure provided in the prior art;

[0040] Figure 2 For the reason Figure 1 A schematic diagram of the cross-sectional structure of the liquid crystal display module assembled by FOG shown.

[0041] Figure 3 This is a cross-sectional structural diagram of a display module provided in an embodiment of the present invention;

[0042] Figure 4 This is a schematic diagram of the internal structure of a backlight module provided in an embodiment of the present invention;

[0043] Figure 5 This is a schematic diagram of the front top view structure of a backlight module provided in an embodiment of the present invention;

[0044] Figure 6 This is a cross-sectional structural diagram of another display module provided in an embodiment of the present invention;

[0045] Figure 7 This is a schematic diagram of the rear top view structure of a backlight module provided in an embodiment of the present invention;

[0046] Figure 8 This is a schematic diagram of the rear top view structure of another backlight module provided in an embodiment of the present invention;

[0047] Figure 9 A schematic diagram of a connecting part provided in an embodiment of the present invention;

[0048] Figure 10 This is a cross-sectional structural diagram of another display module provided in an embodiment of the present invention;

[0049] Figure 11 This is a schematic diagram of the front top view structure of another backlight module provided in an embodiment of the present invention;

[0050] Figure 12 This is a schematic diagram of another connecting part provided in an embodiment of the present invention;

[0051] Figure 13 for Figure 12 A schematic cross-sectional view of the connecting part shown.

[0052] Figure 14 A schematic diagram of the structure of a FOG provided in an embodiment of the present invention;

[0053] Figure 15 This is a cross-sectional structural diagram of another display module provided in an embodiment of the present invention;

[0054] Figure 16 A flowchart illustrating a method for assembling a display module according to an embodiment of the present invention;

[0055] Figure 17 A flowchart illustrating another method for assembling a display module according to an embodiment of the present invention;

[0056] Among them, 10-display panel; 101-heating layer; 20-first flexible circuit board; 30-second flexible circuit board; 40-backlight module; 4011-base plate; 4012-side plate; 402-middle frame; 4021-main body; 4022-branch; 403-reflective sheet; 404-light guide plate; 405-optical film; 50-connecting part; 501-buffer layer; 502-conductive layer; 51-first conductive layer; 52-second conductive layer; 53-buffer layer; 60-conductive part; 70-double-sided adhesive; 80-frame adhesive; 90-light source. Detailed Implementation

[0057] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0058] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0059] Figure 3 This is a cross-sectional structural diagram of a display module provided in an embodiment of the present invention. The display module can be a liquid crystal display module (LCM). (Refer to...) Figure 3 The display module provided in this embodiment includes:

[0060] Backlight module 40, the backlight module 40 is used to provide backlight;

[0061] Display panel 10 is located on the light-emitting side of backlight module 40, and a heating layer 101 is provided inside display panel 10;

[0062] The connecting part 50 is located between the display panel 10 and the backlight module 40. One end of the connecting part 50 is connected to the heating layer 101, and the other end is connected to the first flexible circuit board 20.

[0063] Specifically, the display panel 10 can be a liquid crystal display panel. The display panel 10 contains a heating layer 101 located in the display area and a conductive portion 60 located in the non-display area. The conductive portion 60 is electrically connected to the heating layer 101 and provides input signals to the heating layer 101. For example, the heating layer 101 and the conductive portion 60 can be disposed on the lower surface of the array substrate in the display panel 10. The heating layer 101 can be formed of an ITO (Indium Tin Oxides) semiconductor transparent conductive film. The backlight module 40 provides backlighting to the display panel 10. Here, the backlight module 40 can be an edge-lit backlight module or a direct-lit backlight module.

[0064] In this embodiment, the connecting portion 50 is disposed between the display panel 10 and the backlight module 40, and is used to connect the heating layer 101 within the display panel 10. If one end of the connecting portion 50 extends to the position of the display panel 10, it is electrically connected to the heating layer 101 through the conductive portion 60. Since the heating layer 101 is not directly connected to the first flexible circuit board 20, it is not necessary to bind the first flexible circuit board 20 on the display panel 10, thus reducing the bonding process of the flexible circuit board.

[0065] The technical solution provided by the embodiments of the present invention provides a connecting part 50 between the backlight module 40 and the display panel 10. By using the connecting part 50 to replace the original method of binding ITO-FPC on the display panel 100 to connect the heating layer 101, the bonding process between ITO-FPC and display panel 10 can be omitted, which helps to reduce the bonding difficulty in the module operation process and reduce the assembly difficulty of LCM.

[0066] Continue to refer to Figure 1 and Figure 2 The liquid crystal display module (LCM) also includes a second flexible circuit board 30 (i.e., LCD-FPC, a flexible circuit board used to connect the LCD). Since the first flexible circuit board 20 (i.e., ITO-FPC) and the second flexible circuit board 30 (i.e., ITO-FPC) coexist, in order to avoid unevenness in the display panel 10 (liquid crystal glass) during subsequent processes, the first flexible circuit board 20 (i.e., ITO-FPC) cannot be bonded to the same side as the second flexible circuit board 30 (i.e., LCD-FPC). Therefore, when the first flexible circuit board 20 (i.e., ITO-FPC) is bent to the back of the backlight module 40, the bezel of the liquid crystal display module (LCM) becomes larger (the outward expansion distance of the ITO-FPC bending is about 1mm), which is not conducive to achieving a narrow bezel.

[0067] In this embodiment, since the original ITO-FPC is eliminated and the heating layer 101 is connected by the connection part 50 built into the backlight module 40, the bezel of the LCM can be reduced, and a narrow bezel can be achieved on three sides of the LCM (except for the side that is bonded to the second flexible circuit board 30).

[0068] Continue to refer to Figure 3 The backlight module 40 includes a back plate, which includes a bottom plate 4011 and a side plate 4012. The bottom plate 4011 extends along a first direction X, and the side plate 4012 is disposed on the edge of the bottom plate 4011 along a second direction Z. The first direction X and the second direction Z are perpendicular to each other. A first opening is provided on the bottom plate 4011, and the other end of the connecting part 50 is disposed in the first opening. On the back side of the bottom plate 4011, at least part of the connecting part 50 is exposed by the first opening.

[0069] The first direction X can be a horizontal direction, and the second direction Z can be the thickness direction of the display module. The connecting part 50 is built into the first opening, so that the connecting part 50 can be led out to the back of the base plate 4011, which facilitates the connection between the connecting part 50 and the first flexible circuit board 20.

[0070] Optionally, the end of the connecting part 50 used to connect the heating layer 101 is higher than the side plate 4012 by a preset height, so that the connecting part 50 and the heating layer 101 can be on the same horizontal plane, which facilitates the connection between the two.

[0071] In this embodiment, the backlight module 40 further includes a middle frame 402, and a second opening is provided on the side of the middle frame 402 near the display panel 10. One end of the connecting part 50 passes through the second opening and is connected to the heating layer 101. In other embodiments, the middle frame 402 may not be provided, and this is not a limitation.

[0072] Figure 4 This is a schematic diagram of the internal structure of a backlight module provided in an embodiment of the present invention. Figure 5 This is a schematic diagram of the front top view structure of a backlight module provided in an embodiment of the present invention. Figure 6 This is a cross-sectional structural diagram of another display module provided in an embodiment of the present invention, wherein, Figure 6 The cross-sectional structure of the backlight module 40 shown can be obtained from... Figure 5 The backlight module 40 shown is obtained along the cutting line BB', for reference. Figures 4-6 The backlight module 40's middle frame 402 includes a main body 4021 and a branch 4022. The main body 4021 and the branch 4022 are an integral structure. The main body 4021 extends along the second direction Z and is arranged around the side plate 4012. The branch 4022 extends along the first direction X and covers the side plate 4012. The branch 4022 includes a second opening, and one end of the connecting part 50 passes through the second opening and connects to the heating layer 101.

[0073] Specifically, the middle frame 402 is an iron piece used to provide a stable frame structure for the backlight module 40, so as to better protect the internal components of the backlight module 40. The middle frame 402 includes a main body 4021 and a branch 4022, with the branch 4022 covering the upper edge of the side panel 4012.

[0074] In this embodiment, the branch portion 4022 of the mid-frame 402 has a second opening, which corresponds to the first opening. The connecting portion 50 passes through the second opening and the first opening in sequence, thereby allowing the connecting portion 50 to be built into the backlight module 40 to reduce the bezel of the LCM. Due to the limiting effect of the mid-frame 402 and the base plate 4011, the connecting portion 50 can be better fixed inside the backlight module 40.

[0075] Continue to refer to Figure 5 and Figure 6 The backlight module 40 also includes a reflective sheet 403, a light guide plate 404, and an optical film 405. The reflective sheet 403 is located on one side of the base plate 4011, the light guide plate 404 is located on the side of the reflective sheet 403 away from the base plate 4011, and the optical film 405 is located on the side of the light guide plate 404 away from the base plate 4011. The reflective sheet 403 is used to reflect unused light emitted from a light source (not shown) back into the light guide plate 404, and the light guide plate 404 is used to convert light emitted from a point light source into a surface light source. The connecting portion 50 also serves to limit the movement of the light guide plate 404.

[0076] Figure 7 This is a top view diagram of the rear structure of a backlight module provided in an embodiment of the present invention. Figure 8 This is a top view of the rear structure of another backlight module provided in an embodiment of the present invention, combined with... Figures 4-8 In this embodiment, there are two first openings and two second openings, and the first openings and second openings are configured in a one-to-one correspondence. One first opening is used as a positive electrode interface, and the other first opening is used as a negative electrode interface. For example, the first connecting part 501 in the first first opening is the positive electrode connection terminal, and the second connecting part 502 in the second first opening is the negative electrode connection terminal. The first connecting part 501 passes through the first second opening and connects to the positive electrode of the heating layer 101, and the second connecting part 502 passes through the second second opening and connects to the negative electrode of the heating layer 101.

[0077] The first flexible circuit board 20 is disposed on the back of the base plate 4011. The first flexible circuit board 20 is connected to the connecting portions 50 in the two first openings respectively, so as to provide current to the heating layer 101 through the connecting portions 50. The first flexible circuit board 20 can be bonded or soldered to the base plate 4011. In this embodiment, since the first flexible circuit board 30 does not need to be bonded to the display panel 10, the bonding process between the ITO-FPC (i.e., the first flexible circuit board 30) and the display panel 10 can be omitted, which helps to reduce the bonding difficulty in the module operation process and reduce the assembly difficulty of LCM.

[0078] Optionally, in this embodiment, the opening area of ​​the first opening is smaller than the opening area of ​​the second opening. This arrangement has the following advantages: Firstly, since the connecting portion 50 within the first opening only serves to connect the first flexible circuit board 30, a smaller first opening can reduce the degree of damage to the base plate 4011 while ensuring a good contact area, thus helping to maintain the strength of the base plate 4011. Secondly, a larger second opening allows the connecting portion 50 above the base plate 4011 to have a larger cross-sectional area, thereby reducing the impedance of the connecting portion 50, which helps to reduce the heat generated by the connecting portion 50 and prevents other components from being burned.

[0079] Figure 9 This is a schematic diagram of a connecting part provided in an embodiment of the present invention, with reference to... Figure 9 Based on the above embodiments, optionally, the connecting portion 50 includes a buffer layer 510 and a conductive layer 520, with the conductive layer 520 located inside the buffer layer 510 and the buffer layer 510 enclosing the conductive layer 520. The buffer layer 510 is made of an insulating material, and the conductive layer 520 is formed of a conductive material, such as a metal. In the fabrication process of the connecting portion 50, the buffer layer 510 can first be fabricated into a hollow structure, and then the conductive layer 520 can be formed inside the buffer layer 510 by electroplating or chemical deposition.

[0080] Optionally, combined Figure 7 and Figure 9 The minimum distance between the conductive layers 510 in the connecting portions 50 within the two first openings on the back of the base plate 4011 is greater than or equal to 2 mm. That is, the minimum distance L between the conductive layers 510 in the first connecting portion 501 within the first first opening and the conductive layers 510 in the second connecting portion 502 within the second first opening is greater than or equal to 2 mm, so that the conductive layers 510 in the two first openings meet the assembly tolerance.

[0081] In another optional embodiment provided by the present invention, the connecting part 50 may also be disposed outside the backlight module 40. Figure 10 This is a cross-sectional structural diagram of another display module provided in an embodiment of the present invention. Figure 11 This is a schematic diagram of the front top view structure of another backlight module provided in an embodiment of the present invention, wherein, Figure 10 The cross-sectional structure of the backlight module 40 in the middle is as follows Figure 11 The cross-sectional structure of the backlight module 40 shown is obtained along the cutting line CC', for reference. Figure 10 and Figure 11 In this embodiment, the backlight module 40 includes a back plate and a middle frame 402. The back plate includes a bottom plate 4011 and a side plate 4012. The bottom plate 4011 extends along a first direction X, and the side plate 4012 is disposed at the edge of the bottom plate 4011 along a second direction Z. The first direction X and the second direction Z are perpendicular to each other. The middle frame 402 includes a main body 4021 and a branch 4022. The main body 4021 and the branch 4022 are an integral structure. The main body 4021 extends along the second direction Z and is disposed around the side plate 4012. The branch 4022 extends along the first direction X and covers the side plate 4012. Side plate 4012; Connecting part 50 is located on the side of branch 4022 away from bottom plate 4011. One end of connecting part 50 is connected to heating layer 101 through conductive part 60, and the other end of connecting part 50 is connected to first flexible circuit board 20. The first flexible circuit board 20 includes a first sub-segment, a second sub-segment and a third sub-segment. The first sub-segment is located on branch 4022 and connected to connecting part 50. The second sub-segment extends along the second direction Z and is bonded to the surface of main body 4021 away from side plate 4012. The third sub-segment extends along the first direction X and is bonded to the back of bottom plate 4011.

[0082] Specifically, the first flexible circuit board 20 is fixed to the middle frame 402 and the base plate 4011 of the backlight module 40. For example, the first flexible circuit board 20 can be bonded to the backlight module 40 using double-sided adhesive tape 70. The gold finger end of the first flexible circuit board 20 is electrically connected to the connecting part 50, and the connecting part 50 is then connected to the heating layer 101 through the conductive part 60.

[0083] In this embodiment, the first flexible circuit board 20 is disposed on the outside of the backlight module 40 and bent to the back of the base plate 4011. At least the second and third sub-segments are fixed to the backlight module 40 by adhesive. The connecting part 50 is disposed above the middle frame 402 and is electrically connected to the first flexible circuit board 20. This eliminates the need for a bonding process between the first flexible circuit board 20 and the display panel 10, without damaging the backlight module 40, thus ensuring the overall strength of the backlight module 40.

[0084] Figure 12 This is a schematic diagram of another connecting part provided in an embodiment of the present invention. Figure 13 for Figure 12 The schematic diagram of the cross-sectional structure of the connecting part shown is as follows: Figure 12The cross-sectional structure of the connecting part 50 shown is obtained along the cutting line DD', combined with Figures 11-13 The connecting part 50 includes a buffer layer 53, which has a through third opening and a fourth opening. The third opening and the fourth opening are respectively filled with a conductive layer, such as a first conductive layer 51 in the third opening and a second conductive layer 52 in the fourth opening. One of the third opening and the fourth opening is used as a positive terminal interface, and the other is used as a negative terminal interface.

[0085] In this embodiment, in the fabrication process of the connecting portion 50, a third opening and a fourth opening can be first made on the buffer layer 53, and then a first conductive layer 51 can be formed in the third opening and a second conductive layer 52 can be formed in the fourth opening by electroplating or chemical deposition.

[0086] Figure 14 This is a schematic diagram of the structure of a FOG provided in an embodiment of the present invention, combined with... Figures 11-14 The display panel 10 is provided with a conductive part 60, which is used during the LCM assembly process. Figure 14 The FOG shown is obtained through colloid and Figure 11 The backlight module 40 shown is bonded together so that the first conductive layer 51 and the second conductive layer 52 are respectively connected to the corresponding conductive parts 60.

[0087] Optionally, the minimum distance between the conductive layer in the third opening and the conductive layer in the fourth opening is greater than or equal to 2 mm. That is, the minimum distance M between the first conductive layer 51 and the second conductive layer 52 is ≥ 2 mm, so that the first conductive layer 51 and the second conductive layer 52 meet the assembly tolerance.

[0088] Optionally, the FOG and the backlight module 40 can be fixedly connected using pressure-sensitive conductive adhesive.

[0089] Figure 15 This is a cross-sectional structural diagram of another display module provided in an embodiment of the present invention, combined with... Figure 14 and Figure 15 The display module also includes a second flexible circuit board 30, which is used to connect at least the array substrate within the display panel 10; the first flexible circuit board 20 and the second flexible circuit board 30 are located on the same side of the display panel 10, and the second flexible circuit board 30 is connected to the surface of the display panel 10 away from the first flexible circuit board 20.

[0090] Specifically, since the first flexible circuit board 20 is connected to the heating layer 101 via the connecting part 50, the first flexible circuit board 20 does not need to be bound to the display panel 10. Furthermore, the first flexible circuit board 20 is fixed to the backlight module 40, allowing the first flexible circuit board 20 and the second flexible circuit board 30 to be located on the same side of the display panel 10, for example, both located on the source-in side (i.e., the source signal input side) of the display panel 10. Since the first flexible circuit board 20 is no longer provided on the non-source-in side, this solution can also achieve narrow bezels on the other three sides of the LCM.

[0091] Optionally, the backlight module 40 also includes a frame adhesive 80, which can be used to bond the backlight 90 and at the same time provide a limit for the light guide plate 404.

[0092] It should be noted that when the connecting part 50 is located inside the backlight module 40, the buffer layer in the connecting part 50 can be used to replace the frame adhesive 80 to avoid increasing the internal space occupied by the backlight module 40.

[0093] Optionally, embodiments of the present invention also provide a method for assembling a display module. Figure 16 This is a flowchart illustrating a method for assembling a display module according to an embodiment of the present invention. This assembly method is applicable to... Figure 4 The display module shown is combined with Figure 4 and Figure 16 The assembly method of the display module provided in this embodiment includes:

[0094] First, a display panel 10 is provided. The display panel 10 can be a strip of bare glass. The display panel 10 has a heating layer 101 and a conductive part 60 inside. The display panel 10 is bonded to a second flexible circuit board (i.e., LCD-FPC) using a high temperature and high pressure method with conductive adhesive. The conductive adhesive can be anisotropic conductive film (ACF). After bonding, a FOG containing the heating layer 101 is formed. The heating layer 101 can be an ITO layer.

[0095] Next, a backlight module 40 is provided, which includes a metal component, optical components, and a connecting portion 50. The connecting portion 50 is disposed inside the backlight module 40 and can be a conductive buffer. The backlight module 40 includes a base plate 4011, which has a through first opening.

[0096] Finally, the backlight module 40 is bonded to the FOG so that one end of the connecting part 50 is connected to the heating layer 101 through the conductive part 60, and the other end is connected to the first flexible circuit board 20 located on the back of the base plate 4011 through the first opening, thereby forming a liquid crystal display module product.

[0097] Optionally, Figure 17 A flowchart illustrating another method for assembling a display module according to an embodiment of the present invention, which is applicable to... Figure 15 The display module shown, combined with Figure 15 and Figure 17 The assembly method of the display module provided in this embodiment includes:

[0098] First, a display panel 10 is provided. The display panel 10 can be a strip of bare glass. The display panel 10 has a heating layer 101 and a conductive part 60 inside. The display panel 10 is bonded to a second flexible circuit board (i.e., LCD-FPC) using a high temperature and high pressure method with conductive adhesive. The conductive adhesive can be anisotropic conductive film (ACF). After bonding, a FOG containing the heating layer 101 is formed. The heating layer 101 can be an ITO layer.

[0099] Next, a backlight module 40 is provided. The backlight module 40 has iron parts, optical components, frame adhesive, and connecting parts 50. The iron parts may include a back plate and a middle frame 402. The back plate includes a bottom plate 4011 and a side plate 4012. The bottom plate 4011 extends along a first direction X, and the side plate 4012 is disposed at the edge of the bottom plate 4011 along a second direction Z. The first direction X and the second direction Z are perpendicular to each other. The middle frame 402 includes a main body 4021 and a branch 4022. The main body 4021 and the branch 4022 are an integral structure. The main body 4021 extends along the second direction Z and is disposed around the side plate 4012. The branch 4022 extends along the first direction X and covers the side plate 4012.

[0100] A first flexible circuit board 20 is provided, which is fixed to the outer surface of the middle frame 402 and the back of the base plate 4011.

[0101] A connecting part 50 is provided, which is disposed on a branch 4022 of the middle frame 402, and one end of the connecting part 50 is connected to a first flexible circuit board 20 located on the branch 4022.

[0102] The backlight module 40 is bonded to the display panel 10 so that the other end of the connecting part 50 is connected to the heating layer 101 through the conductive part 60.

[0103] The assembly method of the display module provided in this embodiment of the invention connects the heating layer 101 by using the connecting part 50 instead of the original ITO-FPC, thereby omitting the bonding process between the ITO-FPC and the display panel 10, which helps to reduce the bonding difficulty in the module operation process and reduce the assembly difficulty of LCM.

[0104] It should be understood that the various forms of processes shown above can be used, with steps reordered, added, or deleted. For example, the steps described in this invention can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution of this invention can be achieved, and this is not limited herein.

[0105] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.

Claims

1. A display module, characterized in that, include: A backlight module, the backlight module being used to provide backlight; The display panel is located on the light-emitting side of the backlight module, and a heating layer is disposed within the display panel. The heating layer is located in the display area of ​​the display panel and is led out to the non-display area of ​​the display panel through a conductive part. A connecting portion is located between the display panel and the backlight module. The connecting portion includes a buffer layer and a conductive layer. The conductive layer is located inside the buffer layer and the buffer layer wraps around the conductive layer. The buffer layer is made of an insulating material, which makes the circumferential surface of the connecting portion insulated. The backlight module includes a back plate, the back plate includes a bottom plate and a side plate, the bottom plate extends along a first direction, and the side plate is disposed at the edge of the bottom plate along a second direction, the first direction and the second direction being perpendicular to each other; The base plate has a first opening that penetrates the base plate, and the connecting part is disposed in the first opening. On the back side of the base plate, at least part of the connecting part is exposed by the first opening. The backlight module is bonded to the display panel such that one end of the conductive layer of the connecting part abuts against the conductive part and is electrically connected to the conductive part, and is connected to the heating layer through the conductive part; the other end of the conductive layer abuts against the first flexible circuit board located on the back of the base plate and is electrically connected to the first flexible circuit board, so that the first flexible circuit board is not bound to the display panel. The connecting part is fixed and limited by the backlight module.

2. The display module according to claim 1, characterized in that, The connecting part is used to connect one end of the heating layer, which is higher than the preset height of the side plate.

3. The display module according to claim 2, characterized in that, The backlight module also includes a middle frame, which includes a main body and a branch. The main body and the branch are an integral structure. The main body extends along the second direction and surrounds the side plate. The branch extends along the first direction and covers the side plate. The branch includes a second opening, and the connecting portion passes through the second opening and connects to the heating layer.

4. The display module according to claim 3, characterized in that, There are two of each of the first and second openings. The first and second openings are configured in a one-to-one correspondence. One of the first openings is used as the positive terminal interface, and the other of the first openings is used as the negative terminal interface. The first flexible circuit board is disposed on the back of the base plate, and the first flexible circuit board is connected to the connecting parts in the two first openings respectively.

5. The display module according to any one of claims 2-4, characterized in that, The minimum distance between the conductive layers in the connecting portions located in the two first openings on the back of the base plate is greater than or equal to 2 mm.

6. The display module according to claim 1, characterized in that, The display module further includes a second flexible circuit board, which is used to connect at least the array substrate within the display panel; the first flexible circuit board and the second flexible circuit board are located on the same side of the display panel, and the second flexible circuit board is connected to the surface of the display panel away from the first flexible circuit board.

7. A method for assembling a display module, characterized in that, include: A display panel is provided, wherein a heating layer is disposed within the display panel; the heating layer is located in the display area of ​​the display panel, and the heating layer is led out to the non-display area of ​​the display panel through a conductive part; The display panel is bonded to the second flexible circuit board using conductive adhesive; A backlight module is provided, wherein a connecting portion is provided inside the backlight module, the connecting portion includes a buffer layer and a conductive layer, the conductive layer is located inside the buffer layer, and the buffer layer wraps the conductive layer; the buffer layer is made of an insulating material, so that the circumferential surface of the connecting portion is insulated; the backlight module includes a back plate, the back plate includes a bottom plate and a side plate, the bottom plate extends along a first direction, and the side plate is disposed at the edge of the bottom plate along a second direction, the first direction and the second direction being perpendicular to each other; a first opening penetrating the bottom plate is provided on the bottom plate, the connecting portion is disposed in the first opening, and on the back side of the bottom plate, at least a portion of the connecting portion is exposed by the first opening; The display panel is bonded to the backlight module such that one end of the conductive layer of the connection part abuts against the conductive part and is electrically connected to the conductive part, and is connected to the heating layer through the conductive part; the other end of the conductive layer abuts against the first flexible circuit board located on the back of the base plate through the first opening and is electrically connected to the first flexible circuit board, so that the first flexible circuit board is not bound to the display panel. The connecting part is fixed and limited by the backlight module.

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